EP2130991A2 - Composite wood board, especially for floor panels - Google Patents

Composite wood board, especially for floor panels Download PDF

Info

Publication number
EP2130991A2
EP2130991A2 EP09161950A EP09161950A EP2130991A2 EP 2130991 A2 EP2130991 A2 EP 2130991A2 EP 09161950 A EP09161950 A EP 09161950A EP 09161950 A EP09161950 A EP 09161950A EP 2130991 A2 EP2130991 A2 EP 2130991A2
Authority
EP
European Patent Office
Prior art keywords
characterized
layer
film package
wood
method according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09161950A
Other languages
German (de)
French (fr)
Other versions
EP2130991B1 (en
EP2130991A3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flooring Technologies Ltd
Original Assignee
Flooring Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102008027631A priority Critical patent/DE102008027631A1/en
Application filed by Flooring Technologies Ltd filed Critical Flooring Technologies Ltd
Publication of EP2130991A2 publication Critical patent/EP2130991A2/en
Publication of EP2130991A3 publication Critical patent/EP2130991A3/en
Application granted granted Critical
Publication of EP2130991B1 publication Critical patent/EP2130991B1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/181Insulating layers integrally formed with the flooring or the flooring elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/04Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
    • E04F2290/041Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise
    • E04F2290/042Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise with a facing or top layer for sound insulation
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/04Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
    • E04F2290/041Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise
    • E04F2290/043Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise with a bottom layer for sound insulation

Abstract

The composite wood board comprises a chipboard, plywood, oriented strand board (OSB) composite wood, medium-density fiberboard (MDF) composite wood or high density fiberboard (HDF) composite wood with a lower and an upper side. The lower side is made of a sound-proof layer which acts as a balancing layer. A plastic layer is assembled from an elastic thermoplastic deformed plastic layer removing the thermoplastic polyurethane. An independent claim is included for a method for producing a composite wood board, particularly for floor panels.

Description

  • The invention relates to a wood-based panel, in particular for floor panels, consisting of a support plate of a wood material, such as chip, plywood, OSB, HDF or MDF, with a top and a bottom and a method for producing such a plate.
  • Floor panels as floor coverings have on the top surface in the laid state a decor and optionally a pattern embossed on the structure imprinting a natural material such as wood or stone imitate.
  • The base plate material used are HDF, MDF or OSB plates whose thicknesses are in a range of 2 to 20 mm, preferably 5 to 12 mm and have densities of about 880 kg / m 3 +/- 10%. Even plates with different parameters, in particular lower densities are suitable for use.
  • The decors for the upper surfaces of the carrier plates can be printed on a paper layer or directly on the plate-shaped base. Such decors are for example wood or stone imitations. Fantasy decors are also possible. These can result, for example, from modifications of natural materials.
  • In the production of laminate flooring structures are increasingly embossed into the surface to increase the authenticity in addition to visually appealing decors. These can be simple pores in wood decors, but also more elaborate scraped structures, which also run decorsynchronously. Increasingly, stone or marble tiles are being simulated, in which not only the actual surface structure but also the decor-synchronous embossing of the joint filling lines is of importance.
  • Floor coverings are usually laid floating, with a connection of the panels with each other in the laying level, but not with the underlying bottom layer. By walking there is a stimulation of the floor. Audible sound waves are generated. The sound waves are audible in the room in which the floor is located, the so-called room or beech sound. On the other hand, the sound in adjacent, for example, underlying rooms as a so-called impact sound audible.
  • In order to reduce the sound load, sound-insulating and / or sound-damping layers are provided between the carrier plate and the bottom layer. As such layers crosslinked PE mats with thicknesses of 1.0 mm or 0.3 to 3 mm thick filled heavy foils, but also foamed PE or PU films are used.
  • A disadvantage of these layers is that such mats have little change in the perception of sound. PE mats with thicknesses of 1 mm as well as foamed PE or PU films on hard floor coverings hardly reduce the room sound volume, but rather only change the sound. The dominant frequency range of such mats and foils shifts to higher frequencies and makes the ground sound brighter. Hard floor coverings with heavy foils in the Thickness range of 0.3 to 3 mm are also not quieter. However, the dominant frequency range is more in the lower frequency range.
  • The invention has for its object to develop a floor covering which has a high degree of authenticity of a natural material, has an improved room and / or impact noise property and also has a warm feel. The floor covering should feel warm when walking "barefoot".
  • According to the invention the object is achieved by the features of claim 1 and claim 8.
  • According to the invention, the floor covering seen from bottom to top, the following layer structure. As a lowermost layer, a sound-absorbing layer, acting in a particular embodiment of the invention as a balance layer, applied to the support plate, which prevents warping of the panels, the so-called bowls and at the same time allows the reduction of the impact and / or room sound effect , There are used for such materials, which are known for soundproofing.
  • The following carrier plate made of a wood material, such as chip, plywood, OSB, HDF or MDF, carries on the top of a decor consisting of at least one plastic layer and a decorative paper. In a particular embodiment, the decorative paper on a pattern embossing. On the decor is a sealing lacquer layer, which may contain surface near abrasion resistant particles, such as corundum, and in turn has another structure embossing in another particular embodiment applied.
  • The decor to be applied to the surface of the carrier plate consists of a foil packet of at least one elastic and thermoplastically deformable plastic layer and a decorative paper. The film package is made by surface application of a liquid plastic to a layer having a thickness of 0.2 to 2.5 mm at a surface temperature of 130 to 200 ° C and simultaneously applying a decor paper on the plastic layer and connecting both taking advantage of in the plastic layer obtained existing thermal energy. Suitable plastics are EVA, PP, PE, PET, PVC, acrylates, polyolefins, polyesters and waxes. However, thermoplastic polyurethanes (TPU) are not used. But other plastics with comparable properties can be used. Likewise, combinations of the aforementioned plastics can be used. The plastic used depends on the desired properties of the finished panel. So PVC plastics are cheap. EVA plastics are inexpensive, elastic and plastic, while PP plastics are elastic, hard and tough. Acrylic plastics are UV curing and PET plastics are inexpensive to produce. Waxes have plastic properties.
  • The plastic layer may also be composed of several layers, wherein only one plastic but also different plastics can be sequentially superimposed over a large area.
  • In a particular embodiment of the invention, the film package is provided with a structure embossing, preferably before application to the wood fiber board. This is achieved by a structured embossing roller. Alternatively, it is possible to use a textured paper which is carried between the film pack and a smooth embossing roll and is reusable. Again, the plastic ones Properties of the still under heat plastic used and added the structuring in the continuous process flow. The structure embossing can have a depth greater than 100, preferably 200 to 400, ym. In a particular embodiment, the structure embossing can be executed running synchronously to the decor.
  • As a carrier plate for the foil package plates with a length of 2,800 to 5,600 mm and a width of 1000 to 2200 mm are ideally suited.
  • The film package is applied to the carrier plate, for example using a water-soluble PU adhesive. After application of the film package, a decor-sealing lacquer layer is applied, for which, for example, radiation-curable acrylate lacquers can be used. The acrylate coatings can be replaced by other coatings with comparable properties.
  • In order to achieve a high abrasion resistance with values of AC1 to AC5 based on the standards EN 13329, EN 15468, EN 14978 and to prevent excessive wear, abrasion-resistant particles, for example corundum grains are embedded at least in near-surface areas of the paint layer.
  • A method for producing the wood fiber board according to the invention provides that on the underside of the support plate, a sound-absorbing layer, which can act as a balance layer, applied and then adhered to the top of a film package consisting of a plastic layer and a decorative paper. In a particular embodiment, the film package can be provided with a structuring during its production but also after application to the carrier plate. On the foil package Then a paint layer is applied as a wear protection layer.
  • The application of the lacquer layer can be done after sticking the foil package on the wood fiber board, but preferably in the production of the foil package.
  • To improve the abrasion resistance, corundum particles or particles with comparable properties can preferably be incorporated into this wear protection layer near the surface.
  • If boards produced in this way are sawed into floor panels in the format suitable for the decoration, they are provided with profile cutouts for click connections. The applied film package on the carrier plate makes it possible to form deeply textured decors. At the same time a warmer, softer Begehgefühl is generated by the plastic used. In connection with the material for the balance layer, a lower tendency for the generation of a room and / or impact sound is achieved.
  • When producing the film package, ie the direct printing of the plastic layer with a decor or the laying of a printed paper and coating with a lacquer which otherwise build up when applying the individual layers on the wood fiber board tensions are largely degraded.
  • The film package thus hardly larger voltages are introduced into the carrier plate and thus a bowl largely avoided. A balance layer is not necessary. Likewise, the thicknesses of the carrier plates used can be minimized.
  • When separating into panels, a good edge sealing against water is achieved, since elastic joining edges result from the film package used.
  • Another advantage arises when using the film package in that you can provide the plastic used with additives that the decor coating special properties, eg. B. lend the current.

Claims (15)

  1. Wood-based panel, in particular for floor panels, consisting of a chip, plywood, OSB, MDF or HDF wood material with a bottom and top, with a bottom of a sound-absorbing layer, which acts in a preferred embodiment as a balance layer, and the Top consists of a film package composed of a plastic layer with a decor paper or a print and wherein the decor is covered with a wear protection layer,
    characterized,
    that the plastic layer is composed of at least one elastic thermoplastic deformable plastic layer, wherein thermoplastic polyurethanes are excluded.
  2. Wood material board according to claim 1, characterized in that the film package consists of a 0.2 to 2.5 mm thick plastic layer with a side facing away from the carrier plate at surface temperatures of 130 to 200 ° C applied decorative paper.
  3. Wood material board according to claim 1 or 2, characterized in that the film package is provided with a structuring.
  4. Wood-based panel according to at least one of claims 1 to 3, characterized in that the wear-resistant layer consists of a curable lacquer, preferably a radiation-curable acrylate lacquer.
  5. Wood-based panel according to at least one of claims 1 to 5, characterized in that the wear-resistant layer contains means near the surface, which prevent wear.
  6. Wood material board according to claim 5, characterized in that the wear protection layer contains corundum grains.
  7. A process for producing a wood-based panel, in particular for floor panels, according to one of the preceding claims, characterized in that on a support plate made of chipboard, plywood, OSB, HDF or MDF wood materials on the lower side a sound-absorbing layer, preferably one with Balance layer effect and on the upper side of a film package, which consists of at least one elastic and thermoplastically deformable plastic layer, wherein thermoplastic polyurethanes are excluded, and applied to one side of the plastic layer decorative paper or imprint, is applied and covered the film package with a wear protection layer becomes.
  8. A method according to claim 7, characterized in that the film package contains a plurality of elastically and thermoplastically deformable plastic layers of the same or different plastics.
  9. A method according to claim 7 and 8, characterized in that the plastic layer (s) have a thickness of 0.2 to 2.5 mm.
  10. Method according to at least one of claims 7 to 10, characterized in that the decorative film is placed and bonded at temperatures of 130 to 200 ° C on the plastic layer.
  11. Method according to at least one of claims 7 to 10, characterized in that the bonding of the plastic layer with the decorative paper takes place with simultaneous structuring of the film package.
  12. Method according to at least one of claims 7 to 11, characterized in that the wear protection layer consists of a lacquer, preferably a radiation-curable acrylate lacquer.
  13. Method according to at least one of claims 7 to 12, characterized in that abrasion-resistant particles are embedded in the wear-resistant layer near the surface.
  14. A method according to claim 13, characterized in that corundum grains are embedded as abrasion-resistant particles.
  15. Method according to at least one of claims 7 to 14, characterized in that the wear protection layer is applied to the film package before applying the film package to the wood fiber board.
EP09161950.2A 2008-06-05 2009-06-04 Composite wood board, especially for floor panels Active EP2130991B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102008027631A DE102008027631A1 (en) 2008-06-05 2008-06-05 Wood fiber board, in particular for floor panels

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL09161950T PL2130991T3 (en) 2008-06-05 2009-06-04 Composite wood board, especially for floor panels

Publications (3)

Publication Number Publication Date
EP2130991A2 true EP2130991A2 (en) 2009-12-09
EP2130991A3 EP2130991A3 (en) 2011-06-29
EP2130991B1 EP2130991B1 (en) 2015-09-30

Family

ID=41050288

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09161950.2A Active EP2130991B1 (en) 2008-06-05 2009-06-04 Composite wood board, especially for floor panels

Country Status (4)

Country Link
EP (1) EP2130991B1 (en)
DE (1) DE102008027631A1 (en)
ES (1) ES2558678T3 (en)
PL (1) PL2130991T3 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011141850A3 (en) * 2010-05-10 2012-03-29 Flooring Industries Limited, Sarl Panel and methods for manufacturing panels
BE1019659A5 (en) * 2010-05-10 2012-09-04 Flooring Ind Ltd S A R L Floor panel and method for manufacturing floor panels.
CN103753653A (en) * 2014-02-18 2014-04-30 苏州科技学院 Reed rod aluminum plate composite board and manufacture method thereof
US8925275B2 (en) 2010-05-10 2015-01-06 Flooring Industries Limited, Sarl Floor panel
US9163414B2 (en) 2010-05-10 2015-10-20 Flooring Industries Limited, Sarl Floor panel
US9528278B2 (en) 2009-12-22 2016-12-27 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels
IT201600114240A1 (en) * 2016-11-11 2018-05-11 Maurizio Nasatti A process for the manufacture of decorative panels, in particular for the coating of furniture, walls, etc.
US10550582B2 (en) 2009-12-22 2020-02-04 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011002131A1 (en) 2011-04-18 2012-10-18 Guido Schulte floor element
DE102013007236B4 (en) 2012-12-07 2018-03-01 Mondi Gronau Gmbh Top layer with outside film layer of an elastic plastic and plate with a plate body, which is connected to the cover layer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1264946A1 (en) * 2001-06-05 2002-12-11 Berry Finance Nv Flooring panel
WO2003087498A1 (en) * 2002-04-08 2003-10-23 Välinge Innovation AB Floorboards for floorings
WO2005018833A1 (en) * 2003-08-20 2005-03-03 Kronotec Ag Wooden material panel comprising a soft plastic layer
WO2006084513A1 (en) * 2005-02-11 2006-08-17 Kaindl Flooring Gmbh Panel comprising a decorative layer

Family Cites Families (6)

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DE50103759D1 (en) * 2001-05-25 2004-10-28 Windmoeller Consulting Gmbh Ulrich Process for the production of a floor slab
DE20311569U1 (en) * 2003-07-25 2003-10-09 Andy Holzprodukte Gmbh laminate flooring
DE202004014160U1 (en) * 2004-09-09 2004-11-18 Mohr, Wolfgang Flooring element
DE102005023661A1 (en) * 2005-05-23 2006-11-30 Pergo (Europe) Ab Decorative laminate
DE102005042657B4 (en) * 2005-09-08 2010-12-30 Kronotec Ag Building board and method of manufacture
DE102006039251B4 (en) * 2006-08-22 2015-09-10 Guido Schulte Floor panels

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1264946A1 (en) * 2001-06-05 2002-12-11 Berry Finance Nv Flooring panel
WO2003087498A1 (en) * 2002-04-08 2003-10-23 Välinge Innovation AB Floorboards for floorings
WO2005018833A1 (en) * 2003-08-20 2005-03-03 Kronotec Ag Wooden material panel comprising a soft plastic layer
WO2006084513A1 (en) * 2005-02-11 2006-08-17 Kaindl Flooring Gmbh Panel comprising a decorative layer

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9528278B2 (en) 2009-12-22 2016-12-27 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels
US10428534B2 (en) 2009-12-22 2019-10-01 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels
US9670682B2 (en) 2009-12-22 2017-06-06 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels
US9670683B2 (en) 2009-12-22 2017-06-06 Flooring Industries Limited,Sarl Panel, covering and method for installing such panels
US10550582B2 (en) 2009-12-22 2020-02-04 Flooring Industries Limited, Sarl Panel, covering and method for installing such panels
WO2011141850A3 (en) * 2010-05-10 2012-03-29 Flooring Industries Limited, Sarl Panel and methods for manufacturing panels
US9080330B2 (en) 2010-05-10 2015-07-14 Flooring Industries Limited, Sarl Floor panel
CN102933386B (en) * 2010-05-10 2015-07-29 板材有限责任公司 The method of panel and manufacture panel
US9163414B2 (en) 2010-05-10 2015-10-20 Flooring Industries Limited, Sarl Floor panel
WO2011141851A3 (en) * 2010-05-10 2012-04-19 Flooring Industries Limited, Sarl Floor panel
US9366035B2 (en) 2010-05-10 2016-06-14 Flooring Industries Limited, Sarl Floor panel
US9453348B1 (en) 2010-05-10 2016-09-27 Flooring Industries Limited, Sarl Floor panel
US10301831B2 (en) 2010-05-10 2019-05-28 Flooring Industries Limited, Sarl Floor panel
CN102933386A (en) * 2010-05-10 2013-02-13 板材有限责任公司 Panel and methods for manufacturing panels
BE1019659A5 (en) * 2010-05-10 2012-09-04 Flooring Ind Ltd S A R L Floor panel and method for manufacturing floor panels.
US9783995B2 (en) 2010-05-10 2017-10-10 Flooring Industries Limited, Sarl Floor panel
US9809984B2 (en) 2010-05-10 2017-11-07 Flooring Industries Limited, Sarl Floor panel
US8925275B2 (en) 2010-05-10 2015-01-06 Flooring Industries Limited, Sarl Floor panel
US10041259B2 (en) 2010-05-10 2018-08-07 Flooring Industries Limited, Sarl Floor panel
US10094123B2 (en) 2010-05-10 2018-10-09 Flooring Industries Limited, Sarl Floor panel
US10100533B2 (en) 2010-05-10 2018-10-16 Flooring Industries Limited, Sarl Floor panel
US10190323B2 (en) 2010-05-10 2019-01-29 Flooring Industries Limited, Sarl Floor panel
US10208490B2 (en) 2010-05-10 2019-02-19 Flooring Industries Limited, Sarl Floor panel
US10214921B2 (en) 2010-05-10 2019-02-26 Flooring Industries Limited, Sarl Floor panel
US10233655B2 (en) 2010-05-10 2019-03-19 Flooring Industries Limited, Sarl Floor panel
US10267048B2 (en) 2010-05-10 2019-04-23 Flooring Industries Limited, Sarl Floor panel
CN103753653A (en) * 2014-02-18 2014-04-30 苏州科技学院 Reed rod aluminum plate composite board and manufacture method thereof
CN103753653B (en) * 2014-02-18 2015-11-18 苏州科技学院 A kind of reed rod aluminium sheet composite board and preparation method thereof
IT201600114240A1 (en) * 2016-11-11 2018-05-11 Maurizio Nasatti A process for the manufacture of decorative panels, in particular for the coating of furniture, walls, etc.

Also Published As

Publication number Publication date
DE102008027631A1 (en) 2009-12-10
PL2130991T3 (en) 2016-05-31
EP2130991B1 (en) 2015-09-30
EP2130991A3 (en) 2011-06-29
ES2558678T3 (en) 2016-02-08

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