EP2111652A1 - Procédé d'application d'informations de structure et dispositif à cet effet - Google Patents

Procédé d'application d'informations de structure et dispositif à cet effet

Info

Publication number
EP2111652A1
EP2111652A1 EP08707976A EP08707976A EP2111652A1 EP 2111652 A1 EP2111652 A1 EP 2111652A1 EP 08707976 A EP08707976 A EP 08707976A EP 08707976 A EP08707976 A EP 08707976A EP 2111652 A1 EP2111652 A1 EP 2111652A1
Authority
EP
European Patent Office
Prior art keywords
layer
functional layer
absorption
energy
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08707976A
Other languages
German (de)
English (en)
Inventor
Peter Eckerle
Florian DÖTZ
Udo Lehmann
Hans-Georg Fercher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to EP08707976A priority Critical patent/EP2111652A1/fr
Publication of EP2111652A1 publication Critical patent/EP2111652A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Definitions

  • the present invention relates to a method for transferring structure information into a functional layer and a device therefor. Such a method is used, for example, in semiconductor technology.
  • WO 03/080285 discloses an apparatus and a method for laser structuring of functional polymers.
  • Functional polymers are understood to mean an organic material which, in a semiconductor component, has a function, such as, for example. For example, conducting or not conducting is accomplished.
  • For structuring pulsed laser light is directed to a photomask, wherein the mask image is reduced with a suitable optics and imaged onto the functional layer to be structured. The pulsed laser light leads to laser ablation, so that a corresponding structure is inscribed in the functional layer.
  • the known laser ablation method has the disadvantage that the removed from the functional layers Abtrag is thrown into the laser light and therefore hinders a continuous further removal. Continuous use of the laser light is therefore not possible.
  • care must be taken that the layer to be removed can absorb the laser light as completely as possible or is almost transparent to the laser, so that an underlying absorption layer can provide the energy transfer.
  • the choice of materials for the layer to be removed is thus very limited.
  • the layer to be removed is reflective, which is often necessary in particular in semiconductor technology, the laser lithography is disturbed, so that the structures do not have the often necessary accuracy.
  • the laser power must be increased very much, which increases the cost of the laser ablation process.
  • a pulsed laser beam is used. Before the laser beam reaches an area on the sub- Strat is focused, this is passed through an optical imaging unit with mask. In this case, the mask represents the motif to be ablated in an enlarged form. The imaging optics then carry out a projection of this mask image on a reduced scale on the substrate. With such techniques, a small area of, for example, about 20 ⁇ 20 mm 2 can then be removed in one or more pulses. However, larger structures can not be produced in this way.
  • this object is achieved in that, in a first step, the functional layer is provided on a carrier layer and in a second step energy is transferred in sections through the carrier layer into the functional layer, thereby resulting in a change in the physical and / or chemical properties of the Functional layer in the range of this section comes.
  • the method according to the invention is used, for example, for the production of conductive structures, for example printed conductors on printed circuit boards or electrodes. It is also possible with the method according to the invention to structure other functional materials, for example semiconductors or dielectrics. In addition to the manufacture of electronic components, however, it is also possible to use the method for graphic applications in which an image is to be generated.
  • electrically conductive materials are preferably used for the functional layer.
  • Such materials are, for example, conductive polymers, preferably polythiophenes or polyanilines.
  • conductive polymers preferably polythiophenes or polyanilines.
  • further electrically conductive substances to the conductive polymers. These are, for example, metal powders, carbon nanotubes, zinc oxide, etc.
  • additives which specifically influence the work function of charge carriers, so that they can easily pass into the energy bands of an adjacent semiconductor. This can be achieved, for example, by coating a conductor track serving as an electrode.
  • the functional layer for example, an organic semiconductor material or a dielectric.
  • the conductive polymers used for the functional layer are generally available commercially.
  • the carrier layer to which the functional layer is applied is preferably made of a material which is permeable to the laser light used. Suitable carriers are in particular plastic films, for example PET films or polyimide films. For adhesion promotion and smoothing of the surface, the carrier film can be provided with a coating.
  • the rigid support may be, for example, a rigid plate made of a transparent plastic or of glass.
  • the functional layer Before the structure can be prepared by energy input from the functional layer, it is necessary to apply the functional layer on the carrier.
  • the application of the functional layer to the support can be carried out using any coating method known to those skilled in the art.
  • the material for the functional layer is applied in solution to the carrier. Any application known to a person skilled in the art is suitable for application.
  • Such coating methods are, for example, common printing methods.
  • the curing of the functional layer is preferably carried out thermally or by UV radiation, wherein the preferred method depends on the sensitivity of the materials of the functional layer and the speed requirements in which the functional layer is to cure. It should be noted that curing by UV radiation is faster, but can lead to the destruction of sensitive materials.
  • the application of the functional layer and, if appropriate, drying and curing of the functional layer is preferably carried out in a process passage with the subsequent structuring.
  • the thickness of the functional layer is dependent on the nature of the material of the functional layer. When conductive polymers are used, thicknesses of 200 nm to 1000 nm are preferred. For use as semiconductors, thicknesses of about 100 to 300 nm and for dielectrics at 100 nm to 10,000 nm are preferred.
  • the removal of the functional layer takes place on the opposite side, so that there is no impairment of the beam path. It is therefore possible to operate the laser beam continuously.
  • a change in the physical and / or chemical properties of the functional layer is understood to mean not only the partial removal of the functional layer. It is rather z. B. also possible, with the help of the by the carrier
  • the energy transmitted through it will induce a phase transition or a chemical reaction in the functional layer. All that is essential is that the treatment layer, which is generally smooth and homogeneous before treatment, is structured after the treatment in some form, ie that some sections in chemical or physical form differ from other sections.
  • the energy is transmitted through the carrier layer in an absorption layer, which is located between the carrier layer and functional layer, and is transferred from the absorption layer into the functional layer.
  • the laser only has to be adapted to the absorption layer.
  • the transmission and absorption properties of the functional layer are of subordinate importance, since the laser beam is already completely absorbed in the absorption layer and from there transfers the energy into the functional layer (essentially via heat conduction).
  • the absorption layer contains an absorbent for the laser employed and a binder by which a uniform film is formed on the support surface.
  • additives for adhesion promotion to the support and / or with respect to the functional layer, viscosity adjustment, as crosslinker for the binder or also for coloring may be contained in the absorption layer. It is also possible for additives to be present in the absorption layer which influence the dielectric or conductive properties of the absorption layer.
  • the absorbent used must be matched to the laser used. This applies in particular to the use of organic or inorganic compounds which absorb specifically in the wavelength range of the laser radiation. Another suitable absorbent is carbon black, which absorbs nonspecifically over a wide range of wavelengths.
  • the binder for the absorption layer must be selected so that the absorbent used remains bound in the binder. Since the absorption layer is also usually removed during structuring with the laser, it is not necessary for the binder to be stable with respect to the laser radiation. However, neighboring areas must not be damaged.
  • a further alternative embodiment provides that the energy transfer is selected such that the absorption layer and thus also the functional layer are completely removed in sections.
  • the energy transfer takes place with the aid of a laser beam, which preferably has a wavelength between 150 and 3000 nm.
  • a laser beam which preferably has a wavelength between 150 and 3000 nm.
  • any laser source is suitable for the method according to the invention. This also does not play Whether a pulsed or continuously operated laser is used.
  • the power of the laser is selected to be less than 20 ⁇ J per laser spot. This makes it possible to use an inexpensive system, which allows faster work than at a higher power. Due to the low power per laser point, an operating frequency up to the 100 MHz range is possible.
  • the energy transfer can also take place with the aid of an electron beam.
  • the structural information which is transferred into a functional layer is, in a particularly preferred application of the method according to the invention, an electronic circuit diagram or part of an electronic circuit diagram.
  • each functional layer can also be assigned its own absorption layer, the absorption layers then advantageously having mutually different absorption spectra and the energy transfer taking place with the aid of light beams of different wavelengths.
  • a structure can be introduced into the first functional layer, while in another simultaneous or separate operation with a light beam of a wavelength deviating therefrom, a structure is introduced into the second functional layer.
  • the energy transfer takes place without a mask, namely using a continuous laser beam, which is imaged by means of suitable optics on the desired surface.
  • the whole process according to the invention can be implemented continuously as a roll-to-roll process.
  • a transparent to the laser beam band is used as a substrate, which is coated in a continuous process, first with the absorption layer and then with the functional layer.
  • the band can be structured during its movement through the coating mechanism following the coating by means of a laser beam.
  • the coated, wound tape may optionally be stored temporarily.
  • the coated strip is fed to a functional unit in which structuring takes place in a second working step.
  • the laser ablation takes place in a continuous step.
  • the carrier layer formed as a transparent band with an absorption layer applied thereto, which has been coated with the functional layer, is penetrated by a laser beam which is focused on the absorption layer.
  • the absorption layer is preferably optimized for the laser used. After passing through the transparent carrier tape, the energy of the laser beam is converted directly into heat in the absorption layer optimized for the laser without the laser beam having to penetrate the functional layer beforehand.
  • This type of laser structuring has the advantage that the functional layer does not have to be adapted to the laser beam used. Almost any materials can be used for the functional layer. Basically, the laser does not have to be adapted to the functional layer, so that less expensive laser units can be used.
  • the exposure is from behind, i. through the carrier layer, to increase the process speed, since the laser ablation is transported away from the laser and thus leads to no optical interference, as is the case in the known lithographic processes.
  • a suction device or a blowing device is provided with the aid of which the laser removal can be removed.
  • the laser ablation can also be removed in other ways. For example, it is possible to use a solvent for cleaning.
  • the laser ablation can be made more effective in some applications, if the functional layer and / or the absorption layer contains solvents.
  • the proportion of the solvent in the functional layer and / or the absorption layer is preferably in the range between 1 and 70% by weight.
  • the sudden evaporation of the solvent by the energy transfer supports laser ablation.
  • the solvent can be supplied, for example, before the energy transfer of the relevant layer.
  • the energy transfer step can also be done before the solvent has evaporated completely out of the composite layer.
  • FIG. 1 shows the schematic layer structure
  • Figure 2 is a schematic representation of the method according to the invention.
  • Figure 3 is a schematic representation of a preferred embodiment of the method according to the invention.
  • FIG. 1 shows a schematic representation of the layer structure before structuring.
  • An absorption layer 2 is applied to a carrier layer 1, which may for example be formed as a transparent strip, which can be unwound from a roll.
  • the absorption layer 2 contains at least one substance which absorbs incident laser light and converts it into heat.
  • a functional layer 3 is applied on the absorption layer 2.
  • the functional layer 3 preferably contains electrically conductive materials, such as conductive polymers.
  • the absorption layer 2 and the functional layer 3 are applied to the carrier layer 1 in a first step. The application of the absorption layer and the carrier layer takes place, for example, by a printing process known to those skilled in the art.
  • FIG. 2 shows a schematic representation of the ablation process.
  • the absorption layer 2 absorbs the laser light of the laser beam 5 and converts its energy into heat.
  • the absorption layer 2 is heated so that it evaporates.
  • the applied on the absorption layer 2 functional layer 3 is removed.
  • the removed as laser ablation 4 of the support layer 1 parts of the absorption layer 2 and the functional layer 3 move away from the carrier layer 1. Since the laser beam 5 is focused on the absorption layer 2 by the carrier layer 1, the laser ablation 4, which is located in the Substantially moved in the same direction, in which also the laser beam 5 shows, the optical path of the laser beam 5 is not.
  • FIG. 3 schematically shows a preferred embodiment of the method according to the invention.
  • the inventive method is preferably carried out in a device that combines several process steps.
  • the carrier layer 1, which is designed as a transparent band is moved continuously by a roller 10 through the device.
  • the carrier layer 1 formed as a transparent band is guided through a first coating unit which comprises a pressure roller 6 and a pressure roller 13.
  • a first coating unit which comprises a pressure roller 6 and a pressure roller 13.
  • the material for the absorption layer is applied. This is transferred to the carrier layer 1 as soon as the carrier layer 1 is passed between the pressure roller 6 and the pressure roller 13.
  • the carrier layer 1 is pressed against the pressure roller 6.
  • a first drying unit 1 which adjoins the first coating unit, the absorption layer 2 is dried.
  • a second coating unit comprising a second pressure roller 7 and a second pressure roller 14, the functional layer 3 is applied to the absorption layer 2.
  • the mode of operation of the second coating unit corresponds to the mode of operation of the first coating unit.
  • any other, known to the expert printing device for applying the absorption layer 2 and the functional layer 3 may be provided.
  • the application of the absorption layer 2 and the functional layer 3 can also take place by means of screen printing, indirect or direct gravure printing, flexographic printing, letterpress printing, pad printing, ink jet printing or any other printing process known to those skilled in the art.
  • the second coating unit may be followed by another drying unit, which is not shown here. In this second drying unit, the functional layer is dried.
  • the carrier layer 1 coated with the absorption layer 2 and the functional layer 3 is now fed to the actual laser ablation.
  • the laser ablation comprises a laser source, not shown here, from which the laser beam 5 is emitted.
  • the laser source further comprises a laser switching and deflection unit (ROS).
  • ROS laser switching and deflection unit
  • a suction device 12 is provided, with which the laser ablation 4 can be sucked off.
  • the regions of the functional layer which are to be recessed are selectively removed together with the absorption layer 2, as shown in FIG. 2, from the carrier layer 1.
  • the thus structured layer structure comprising the carrier layer 1, the absorption layer 2 and the functional layer 3, can then be re-printed or provided with further layers, for example with the aid of further coating units, each comprising a pressure roller 8, 9 with corresponding pressure roller 15, 16 ,
  • a further drying unit 11 can be connected to the coating units.
  • the coating units each comprising a pressure roller 8, 9 and a pressure roller 15, 16 it is also possible to use any other, known in the art coating device.
  • the layer composite After the structure has been worked out of the functional layer 3 with the aid of the laser beam 5 and the layer composite is optionally provided with further layers in the further coating units, it is wound up on a roll 17. In the form of this role, the layer composite can be transported to other processing stations.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé permettant d'appliquer des informations de structure à une couche fonctionnelle, une première étape dudit procédé consistant à placer la couche fonctionnelle sur une couche support. Une seconde étape dudit procédé consiste à appliquer une énergie à certains endroits de la couche fonctionnelle à travers la couche support, de façon à entraîner à ces endroits une modification des propriétés physiques et/ou chimiques de la couche fonctionnelle. L'invention concerne également un dispositif permettant la mise en oeuvre dudit procédé.
EP08707976A 2007-01-19 2008-01-18 Procédé d'application d'informations de structure et dispositif à cet effet Withdrawn EP2111652A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08707976A EP2111652A1 (fr) 2007-01-19 2008-01-18 Procédé d'application d'informations de structure et dispositif à cet effet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07100822 2007-01-19
PCT/EP2008/050531 WO2008087196A1 (fr) 2007-01-19 2008-01-18 Procédé d'application d'informations de structure et dispositif à cet effet
EP08707976A EP2111652A1 (fr) 2007-01-19 2008-01-18 Procédé d'application d'informations de structure et dispositif à cet effet

Publications (1)

Publication Number Publication Date
EP2111652A1 true EP2111652A1 (fr) 2009-10-28

Family

ID=39400479

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08707976A Withdrawn EP2111652A1 (fr) 2007-01-19 2008-01-18 Procédé d'application d'informations de structure et dispositif à cet effet

Country Status (3)

Country Link
US (1) US20100201038A1 (fr)
EP (1) EP2111652A1 (fr)
WO (1) WO2008087196A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008038118A1 (de) * 2008-08-17 2010-02-18 Du, Keming, Dr. Verfahren und Anlagen zum Entschichten mit Laserstrahlen
CN106797015A (zh) * 2014-09-12 2017-05-31 东莞新能源科技有限公司 极片涂层的移除方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003080285A1 (fr) * 2002-03-21 2003-10-02 Louis Pöhlau Lohrentz Dispositif et procede pour la structuration par laser de polymeres fonctionnels et utilisations associees
DE102004041497A1 (de) * 2004-08-27 2006-03-02 Polyic Gmbh & Co. Kg Organisches Elektronik-Bauteil sowie Verfahren zur Herstellung eines solchen

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
DE10033112C2 (de) * 2000-07-07 2002-11-14 Siemens Ag Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung
DE10321152A1 (de) * 2003-05-12 2004-12-23 Schreiner Group Gmbh & Co. Kg Verfahren zum Bearbeiten eines elektrolumineszierenden Elements und nach diesem Verfahren bearbeitetes elektrolumineszierendes Element
EP2166543B1 (fr) * 2003-09-02 2011-03-23 Plastic Logic Limited Production de dispositifs électroniques
JP2006005041A (ja) * 2004-06-16 2006-01-05 Toshiba Corp 有機半導体素子とその製造方法
US7341886B2 (en) * 2005-03-03 2008-03-11 Eastman Kodak Company Apparatus and method for forming vias

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
WO2003080285A1 (fr) * 2002-03-21 2003-10-02 Louis Pöhlau Lohrentz Dispositif et procede pour la structuration par laser de polymeres fonctionnels et utilisations associees
DE102004041497A1 (de) * 2004-08-27 2006-03-02 Polyic Gmbh & Co. Kg Organisches Elektronik-Bauteil sowie Verfahren zur Herstellung eines solchen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008087196A1 *

Also Published As

Publication number Publication date
WO2008087196A1 (fr) 2008-07-24
US20100201038A1 (en) 2010-08-12

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