EP1986950A4 - Mems components and method for manufacturing same - Google Patents
Mems components and method for manufacturing sameInfo
- Publication number
- EP1986950A4 EP1986950A4 EP07709443.1A EP07709443A EP1986950A4 EP 1986950 A4 EP1986950 A4 EP 1986950A4 EP 07709443 A EP07709443 A EP 07709443A EP 1986950 A4 EP1986950 A4 EP 1986950A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- manufacturing same
- mems components
- mems
- components
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/00714—Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0278—Temperature sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0600210 | 2006-01-31 | ||
PCT/SE2007/050050 WO2007089204A1 (en) | 2006-01-31 | 2007-01-31 | Mems components and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1986950A1 EP1986950A1 (en) | 2008-11-05 |
EP1986950A4 true EP1986950A4 (en) | 2014-06-04 |
Family
ID=38327687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07709443.1A Withdrawn EP1986950A4 (en) | 2006-01-31 | 2007-01-31 | Mems components and method for manufacturing same |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1986950A4 (en) |
WO (1) | WO2007089204A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2230497A1 (en) * | 2008-06-09 | 2010-09-22 | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. | Diode bolometer and a method for producing a diode bolometer |
US8587083B2 (en) | 2009-06-17 | 2013-11-19 | Gunnar Malm | Microbolometer semiconductor material |
DE102013107947A1 (en) | 2013-07-25 | 2015-02-19 | Acquandas GmbH | A method of manufacturing a medical device, a method of modifying the surface of a medical device, a medical device, and a laminate with a substrate |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5627106A (en) * | 1994-05-06 | 1997-05-06 | United Microelectronics Corporation | Trench method for three dimensional chip connecting during IC fabrication |
US6287940B1 (en) * | 1999-08-02 | 2001-09-11 | Honeywell International Inc. | Dual wafer attachment process |
US7054052B2 (en) * | 2003-09-04 | 2006-05-30 | Frank Niklaus | Adhesive sacrificial bonding of spatial light modulators |
-
2007
- 2007-01-31 EP EP07709443.1A patent/EP1986950A4/en not_active Withdrawn
- 2007-01-31 WO PCT/SE2007/050050 patent/WO2007089204A1/en active Application Filing
Non-Patent Citations (2)
Title |
---|
No further relevant documents disclosed * |
See also references of WO2007089204A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1986950A1 (en) | 2008-11-05 |
WO2007089204A1 (en) | 2007-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080828 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140502 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B81C 1/00 20060101AFI20140425BHEP Ipc: H01L 21/98 20060101ALI20140425BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20141202 |