Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
  • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49016—Antenna or wave energy "plumbing" making

Definitions

• the invention relates to a method for producing a contactless transponder comprising an antenna and an electronic module disposed on a substrate, said module comprising contact pads connected to one antenna.
• the invention relates more particularly to a method of connecting a radioelectric antenna to a non-contact electronic module having radiofrequency communication functions.
• the invention relates to a use of the above method in the production of contactless smart card and / or travel document such as electronic passport, electronic visa, electronic tag, any electronic communication product having a connection of a module to an antenna.
• a wire antenna arranged in a plastic card body by a wire technology inlaid with ultra-light probes is known. sounds.
• the module is then connected by thermo-compression with the same antenna wire.
• Such conductive wires generally copper, very thin, less than 300 microns, and spaced apart on the order of a few hundred microns to form antenna turns, allow to obtain a high quality factor, for example greater than 40 unlike antennas obtained by depositing conductive material, in particular by serigraphy of conductive ink.
• JP 2001-344580 describes a method of making an antenna by sewing a conductive wire that extends on a substrate plane and alternately on its opposite plane.
• the antenna is connected directly to the pads of an integrated circuit chip by conductive material.
• connection method is likely implemented by hand, does not seem to be effective at the connection of the chip and does not seem to allow industrialization.
• the invention aims to allow a durable connection of a contactless module to an antenna with a good mechanical attachment of the module on a substrate and an industrialization of this connection.
• the invention also aims to achieve in a minimum of steps the antenna and a crossing of turns forming the antenna without short circuit.
• the subject of the invention is a method for producing a contactless transponder comprising an antenna and an electronic module disposed on a substrate and connected to the antenna by a conducting wire passing through the contact pads in the form of a at least one stitch;
• the method is distinguished in that it comprises the following steps: realization of a module in a single block, said module comprising at least one integrated circuit having connection pads and contact pads connected to the pads,
• the module can be realized practically according to the smart card technology and electrically tested before report.
• the antenna is deposited on the substrate also by a stitch
• a contact pad is first connected, then the antenna is made and the second contact pad is connected all by continuous sewing in a single operation with the same needle;
• the method comprises a step of crossing antenna turns SP1 by a conducting wire passing over loop-shaped antenna portions embedded in the substrate;
• At least one perforation is made on the contact pads prior to connection.
• the invention also relates to a contactless transponder comprising an antenna and an electronic module disposed on a substrate and connected to the antenna by a conductive wire passing through the contact pads in the form of at least one stitching point;
• the module comprises at least one integrated circuit and contact pads forming a single block on the substrate.
• FIG. 1 illustrates a schematic view of a transponder according to a preferred embodiment of the method of the invention
• FIG. 2 illustrates in detail the electronic circuit module of FIG. 1 with its connections
• Figure 3 illustrates a sectional view of Figure 2 along BB
• FIG. 4 illustrates an example of crossover CR of conducting wires as shown in FIG. 1
• FIG. 5 is a view from above of FIG. 4.
• a contactless transponder 1 comprises an antenna 2 and an electronic module 3 disposed on a substrate 4.
• the module comprises on a support contact pads 5, 6 connected to the antenna.
• the antenna is made on the substrate 2 using a conductive wire having two ends 7, 8.
• the module in the example is an electronic module of the contactless type comprising a support 9, printed circuit type, with an integrated circuit chip 10 fixed on the support and connected by soldered wire or in a flip-chip technique ( chip returned and connected with a conductive adhesive), to the contact pads 5, 6 extending on either side of the support.
• the module can be made without dielectric support, the ranges can be directly in contact with the substrate.
• a coating with a protective resin can come to cover the chip and its contacts.
• a conducting wire passes through the contact pads and connects them.
• the connection is substantially in the vicinity upstream of the ends 7, 8 of the antenna. Just upstream of these ends, the wire is fixed in the substrate after the electrical connection by forming a point of attachment 11, 12 to the substrate.
• a contact pad 5 has two points 5a, 5b of connection while the contact pad 6 has a connection 6a.
• Several stitches for example three, four, crossing the beaches can improve the connection if space allows.
• the conductive wire is the wire constituting each turn of the coil 2.
• the wire forming the turns and connecting the ranges is continuous from one contact area to another.
• the antenna comprises sewing stitches 22 distributed along the turns and in particular at the angles and change of direction 32.
• An insulating substrate 4 is provided which may be for example a film or sheet of polymeric material, PVC, PET (polyethylene), polycarbonate, paper, printed circuit board material or chip card module such as ribbon polyimide or particular roller or any other material commonly used to make transponders.
• the substrate may have different thicknesses, generally less than or equal to that of a chip card 0.76 mm so as to serve as an insert between two films or sheets or to support a cover sheet and / or printing. Typically the substrate may have a thickness of 0.1 mm.
• the module is deposited, for example using a glue point. An adhesive is not essential if the module is carried over and positioned on the substrate at a connection station of the module by sewing. At this post, a reporting tool can keep the module in place the time of its connection.
• the method may then comprise the following steps, of forming the antenna on the substrate, said antenna comprising two terminal parts 7, 8 of connection, then of connection of these parts. end of the antenna to the contact pads by a wire.
• the contact pads are sewn at least by a stitch (5a, 5b, 6b) passing through the contact pads by means of a conductive wire.
• the sewing stitch defines a loop 12 and includes an insulating bobbin thread 13 threading the loop to hold the conductive wire against the substrate.
• the loop and / or the bobbin thread may be more or less sunken into the substrate depending on the tension of their respective yarn and setting of a sewing machine used in the process.
• the antenna can be made in various ways, in particular by etching, ultrasound deposition, the antenna ends being disposed near the module and then connected according to the method of the invention.
• the stitches also sew the ends or their vicinity to connect them.
• the antenna is deposited in the substrate also by stitching points comprising a top wire and an insulating bobbin wire.
• a contact pad 5 is first connected by sewing, in particular with a starting point 7 beforehand on the substrate, then the antenna 2 is always made by sewing at following and connecting the second contact pad 6 also by sewing.
• the contact pads comprise at least one perforation 14.
• perforations are recommended to make it possible to better electrically connect the module and to fix it mechanically to the substrate.
• the perforations or perforations 14 in the contact pads may preferably be carried out beforehand, in particular by punching, in particular to reduce the wear of the needle of a sewing machine.
• a system for locating the module and prior perforations of the VAO (Computer Aided Vision) type preferably equips a station for connecting the antenna to the module to control the positioning, displacement, and stitching of the needle.
• VAO Computer Aided Vision
• the fixing of the module is similar to an automatic fastening of a shirt button in particular. If necessary, using a thinner wire or a wider hole, it is possible to perform several stitches in the two perforations 5a, 5b. Point 11 is not essential, the thread can be cut at point 5a.
• the conducting wire of the antenna 2 or of the connection 2C comprises loops 15 which pass through the tracks and the substrate. These loops are held by a lower wire 13 or insulating bobbin wire.
• Figures 4 and 5 illustrate a cross CR of son son.
• the invention allows the return of the inner coil 2C of the conductive coil 2 to the contactless chip to be connected (fig.l).
• the conductive wire SP1 is buried in the form of a loop 16 in the substrate in a relatively wide perforation 17 so as to separate the portions of wire going up on each side of the perforation. Between these two portions, a conductive wire SP2 can extend to cross the loop without short-circuit with it.
• the margin available between the crossed threads is for example one to three times the diameter of the thread.
• copper conductor wires may have a diameter of 0.03 mm to 1 mm.
• the insulating wire 13 in which the insulating wire is wound up in the hole 17 by a greater tension of the conductive wire SPl, to the contact of the upper cross conductor wire SP2.
• the insulating wire 13 then constitutes a bridge or an insulating support for the crossing conductor wire which can thus cross the antenna coil SP1 disposed under the insulating wire 13.
• the insulating wire 13 holds a portion of the turn SP1 at least partially buried under the upper surface S carrying the antenna.
• Any perforation can be carried out beforehand, in particular by punching or by a needle during sewing.
• a needle deforms the substrate material and produces slight beads around the perforation.
• An advantage of the invention is to allow a use of bare conductive wire for connecting and / or producing the conductive coil. Thanks to this, it is possible to use a wire of very small diameter up to, for example, 30 ⁇ m not available in an isolated wire version
• the substrate may be provided with multiple perforations, regularly distributed at least over the course of the antenna turns or over the entire surface such as a matrix, a perforated card.
• the perforations can be filled by creep of the material during a lamination of leaves thermo plastics.
• the method is suitable for forming a contactless insert for any product, including smart cards.
• the invention covers any electronic radiofrequency communication product, such as a contactless smart card, comprising the transponder produced according to the method.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Computer Hardware Design (AREA)
• Textile Engineering (AREA)
• Credit Cards Or The Like (AREA)
• Details Of Aerials (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=36950274

Family Applications (1)

Country Status (6)

Families Citing this family (5)

Family Cites Families (3)

• 2005
  • 2005-11-21 FR FR0553526A patent/FR2893735A1/fr active Pending
• 2006
  • 2006-11-20 CN CNA2006800432475A patent/CN101313318A/zh active Pending
  • 2006-11-20 EP EP06819631A patent/EP1955258A1/de not_active Withdrawn
  • 2006-11-20 BR BRPI0618914-8A patent/BRPI0618914A2/pt not_active IP Right Cessation
  • 2006-11-20 WO PCT/EP2006/068681 patent/WO2007057467A1/fr active Application Filing
  • 2006-11-20 US US12/085,217 patent/US20090271972A1/en not_active Abandoned

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events