EP1942534A3 - Method of forming a phase change layer by electro-chemical deposition and manufacturing of a storage node and a phase change memory device using the method - Google Patents

Method of forming a phase change layer by electro-chemical deposition and manufacturing of a storage node and a phase change memory device using the method Download PDF

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Publication number
EP1942534A3
EP1942534A3 EP07150397A EP07150397A EP1942534A3 EP 1942534 A3 EP1942534 A3 EP 1942534A3 EP 07150397 A EP07150397 A EP 07150397A EP 07150397 A EP07150397 A EP 07150397A EP 1942534 A3 EP1942534 A3 EP 1942534A3
Authority
EP
European Patent Office
Prior art keywords
phase change
change layer
forming
electro
memory device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07150397A
Other languages
German (de)
French (fr)
Other versions
EP1942534A2 (en
Inventor
Youn-Seon Kang
Seung-Jin Oh
Woong-Chul Shin
Kae-Dong Back
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP1942534A2 publication Critical patent/EP1942534A2/en
Publication of EP1942534A3 publication Critical patent/EP1942534A3/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/021—Formation of the switching material, e.g. layer deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/041—Modification of the switching material, e.g. post-treatment, doping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/061—Patterning of the switching material
    • H10N70/066—Patterning of the switching material by filling of openings, e.g. damascene method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe

Abstract

Provided are a method of forming a phase change layer, and methods of manufacturing a storage node, and a phase change memory device using the method. The method of forming a phase change layer uses an electro-chemical deposition (ECD) method, in particular it includes forming an electrolyte (12) by mixing a solvent and precursors, each precursor containing an element of the phase change layer, dipping an anode plate (14) and a cathode plate (16) in the electrolyte to be spaced apart from each other, wherein the cathode plate is a substrate on which the phase change layer is to be deposited, setting deposition conditions of the phase change layer, and supplying a voltage between the anode plate and the cathode plate.
EP07150397A 2007-01-02 2007-12-21 Method of forming a phase change layer by electro-chemical deposition and manufacturing of a storage node and a phase change memory device using the method Withdrawn EP1942534A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070000308A KR20080063652A (en) 2007-01-02 2007-01-02 Methods of forming phase change material layer and manufacturing phase change memory device using the same

Publications (2)

Publication Number Publication Date
EP1942534A2 EP1942534A2 (en) 2008-07-09
EP1942534A3 true EP1942534A3 (en) 2010-05-05

Family

ID=39229601

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07150397A Withdrawn EP1942534A3 (en) 2007-01-02 2007-12-21 Method of forming a phase change layer by electro-chemical deposition and manufacturing of a storage node and a phase change memory device using the method

Country Status (5)

Country Link
US (1) US20080156651A1 (en)
EP (1) EP1942534A3 (en)
JP (1) JP2008166758A (en)
KR (1) KR20080063652A (en)
CN (1) CN101222020A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8377341B2 (en) * 2007-04-24 2013-02-19 Air Products And Chemicals, Inc. Tellurium (Te) precursors for making phase change memory materials
US8372483B2 (en) * 2008-06-27 2013-02-12 Asm International N.V. Methods for forming thin films comprising tellurium
JP5466838B2 (en) * 2008-07-09 2014-04-09 ピーエスフォー ルクスコ エスエイアールエル Phase change solid-state memory recording material and phase change solid-state memory
US8697486B2 (en) 2009-04-15 2014-04-15 Micro Technology, Inc. Methods of forming phase change materials and methods of forming phase change memory circuitry
US8148580B2 (en) 2009-04-15 2012-04-03 Micron Technology, Inc. Methods of forming a tellurium alkoxide and methods of forming a mixed halide-alkoxide of tellurium
KR101134282B1 (en) * 2009-11-13 2012-04-13 연세대학교 산학협력단 Method for manufacturing non-volatile resistance switching memory
CN102560589B (en) * 2012-03-08 2015-05-13 厦门大学 Method for preparing Ge-Sb-Te ternary phase-change material film
CN102637822B (en) * 2012-03-14 2014-03-26 宁波大学 High-purity chalcogenide phase change alloy target and preparation method for same
WO2015174240A1 (en) * 2014-05-12 2015-11-19 国立研究開発法人産業技術総合研究所 Crystalline alignment layer laminate structure, electronic memory, and method for manufacturing crystalline alignment layer laminate structure
CN107740150B (en) * 2017-08-25 2019-11-08 洛阳师范学院 A kind of germanium-selenide film and preparation method thereof
CN107620103B (en) * 2017-09-11 2019-12-24 洛阳师范学院 Preparation method of germanium sulfide film
CN108389960B (en) * 2018-01-24 2019-01-01 北京航空航天大学 A kind of preparation method of doped yttrium antimony telluride phase-change material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1523003A1 (en) * 2003-09-26 2005-04-13 Hewlett-Packard Development Company, L.P. Ultra-high density data storage device using phase change diode memory cells and methods of fabrication thereof
EP1667244A2 (en) * 2004-12-02 2006-06-07 Samsung Electronics Co., Ltd. Phase change memory device having phase change material layer containing phase change nano particles and method of fabricating the same
US20060204794A1 (en) * 2004-09-09 2006-09-14 Fujitsu Limited Laminate structure, magnetic recording medium and method for producing the same, magnetic recording device, magnetic recording method, and element with the laminate structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050184282A1 (en) * 2004-02-20 2005-08-25 Li-Shyue Lai Phase change memory cell and method of its manufacture
TWI261356B (en) * 2005-01-03 2006-09-01 Macronix Int Co Ltd Phase-change multi-level cell and operating method thereof
KR100695168B1 (en) * 2006-01-10 2007-03-14 삼성전자주식회사 Method of forming phase change material thin film, and method of manufacturing phase change memory device using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1523003A1 (en) * 2003-09-26 2005-04-13 Hewlett-Packard Development Company, L.P. Ultra-high density data storage device using phase change diode memory cells and methods of fabrication thereof
US20060204794A1 (en) * 2004-09-09 2006-09-14 Fujitsu Limited Laminate structure, magnetic recording medium and method for producing the same, magnetic recording device, magnetic recording method, and element with the laminate structure
EP1667244A2 (en) * 2004-12-02 2006-06-07 Samsung Electronics Co., Ltd. Phase change memory device having phase change material layer containing phase change nano particles and method of fabricating the same

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
ABKEN A E: "Electrodeposition of SbxTey layers and chemical stability of Mo/Sb2Te3 systems", JOURNAL OF MATERIALS SCIENCE LETTERS, vol. 21, no. 11, 1 June 2002 (2002-06-01), pages 845 - 847, XP001168018, ISSN: 0261-8028 *
HUANG Q ET AL: "Electrodeposition of SbTe phase-change alloys", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 155, no. 2, 3 December 2007 (2007-12-03), pages D104 - D109, XP002574559, ISSN: 0013-4651 *
LEIMKÜHLER G ET AL: "Electrodeposition of antimony telluride", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 149, no. 10, October 2002 (2002-10-01), pages C474 - C478, XP002574558, ISSN: 0013-4651 *
WANG C ET AL: "Electrodeposition of Sb2Te3 films on Si(100) and Ag substrates", ELECTROCHEMICAL AND SOLID-STATE LETTERS, vol. 9, no. 9, September 2006 (2006-09-01), pages C147 - C149, XP002574557, ISSN: 1099-0062 *

Also Published As

Publication number Publication date
CN101222020A (en) 2008-07-16
EP1942534A2 (en) 2008-07-09
US20080156651A1 (en) 2008-07-03
JP2008166758A (en) 2008-07-17
KR20080063652A (en) 2008-07-07

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