EP1933419A1 - Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten - Google Patents

Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten Download PDF

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Publication number
EP1933419A1
EP1933419A1 EP06077257A EP06077257A EP1933419A1 EP 1933419 A1 EP1933419 A1 EP 1933419A1 EP 06077257 A EP06077257 A EP 06077257A EP 06077257 A EP06077257 A EP 06077257A EP 1933419 A1 EP1933419 A1 EP 1933419A1
Authority
EP
European Patent Office
Prior art keywords
current
injection means
antenna
layer
injecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06077257A
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English (en)
French (fr)
Inventor
J. I. Epson Europe Electronics GmbH Cairo Molins
Lluis Universitat Polit. de Catalunya Jofre Roca
Raquel Univers. Polit. de Catalunya Serrano Calvo
Sebastian Univ. Polit. de Catal. Blanch Borios
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to EP06077257A priority Critical patent/EP1933419A1/de
Publication of EP1933419A1 publication Critical patent/EP1933419A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0428—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave
    • H01Q9/0435—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave using two feed points

Definitions

  • the invention relates to high frequency electromagnetic circuits (transmission lines, filters, antennas), and more particularly to multi-layer planar antennas.
  • the general application fields of the invention are radio communications, particularly wireless/mobile digital communications, the mentioned multi-layer antennas being ultra-thin or IC compatible, that is, having a thickness of about 1 mm.
  • IC integrated technologies are able to deal with transversal dimensions (W) below the centimetre, and thickness below the millimetre.
  • current solutions tend to combine the antenna and the associated electronics into a back to back architecture, which normally prevents the antenna to be fully integrated into the IC package.
  • transversal dimensions 2 cm and thickness of 4 mm for single layer antennas are needed.
  • multilayer solutions are used for frequency bandwidth increase or multifrequency operation, several times the current thickness are additionally needed, which is totally incompatible with the IC dimensions.
  • the solution proposed in the present invention provides a new IC compatible technique to connect printed circuit based multilayer antennas to multi-feed systems in such a way that small, efficient integrated antenna systems may be designed for applications as multi-antenna systems (MAE) or Multiple Input Multiple Output systems (MIMO).
  • MAE multi-antenna systems
  • MIMO Multiple Input Multiple Output systems
  • printed circuits are formed by two parallel plates: a lower plate, usually working as the ground plane, and an upper plate, in which the different radiofrequency passive elements (filters, transmission lines, printed antennas, etc.) and active electronic devices are configured.
  • the feeding point is applied in the top plane of the antenna.
  • the injected current generates a field distribution inside the antenna, which in the case of an efficient and well matched antenna radiates to the surrounding air.
  • the radiated energy is maximum at the operating frequency-band of the antenna which depends on the antenna dimensions and the position of the feeding point.
  • a thin stacked shorted patch antenna for the 1800 MHz frequency band is presented in " Thin dual-resonant stacked shorted patch antenna for mobile communications" Ollikainen J et al., Electronic Letters, 18 March 1999, Vol. 35, No. 6 .
  • Said antenna is dual-resonant and small in size, having a very low profile and a bandwidth of almost 10%. It thus discloses a stacked configuration for a patch antenna, each of the patches (lower and upper) working at a different resonant frequency.
  • the present invention is related to a new technique of feeding energy into an IC compatible multi-layer planar antenna and to the IC compatible multi-layer planar antenna resulting thereof.
  • the invention refers to a multiple feeding method for an IC compatible multi-layer planar antenna according to claim 1 and to an IC compatible multi-layer planar antenna according to claim 6. Preferred embodiments of the method and antenna are defined in the dependent claims.
  • a multi-layer antenna there are a number N of layers, N ⁇ 2.
  • N there are a number N of layers, N ⁇ 2.
  • N there are a number N of layers, N ⁇ 2.
  • N there are a number N of layers, N ⁇ 2.
  • N there is a change in the resonant frequency of the antenna.
  • the present invention is related to the multi-layer transformation technique applied in planar antennas such as patch antennas, where the antenna is formed by superposing different parallel planes one on top another. They are used as impedance transformers, so the feeding point can be impedance adapted to the free air impedance.
  • planar antennas such as patch antennas
  • the antenna is formed by superposing different parallel planes one on top another. They are used as impedance transformers, so the feeding point can be impedance adapted to the free air impedance.
  • impedance transformation technique Using the multi-layer configuration applied in previous antennas as impedance transformation technique, one or more feeding points can be applied in one or different layers to obtain multi-resonant characteristics.
  • Said first operating frequency-band f 1 and said second operating frequency-band f 2 may have different values.
  • this invention permits a specific multi-layer planar antenna to operate in different frequency-bands; so that said antenna can be applied to different frequency working bands: a multi-band antenna is obtained. That is, the same antenna can be used to fit the requirements of multi-standard applications.
  • further injection means are provided in the first plate and current is simultaneously injected both to said first current injection means and to said further current injection means.
  • the first injection means can be arranged perpendicularly to the second current injection means. Also, if current is simultaneously injected both to said first current injection means and to the further current injection means in the same first layer, the first injection means can be arranged perpendicularly to the further current injection means.
  • the present invention also permits achieving a polarisation control of the radiated power from the antenna.
  • the method may further comprise providing i-th current injection means in a i-th plate Li, for injecting a current to a i-th layer.
  • Said first and second current injection means may comprise a microstrip feed, a coaxial cable, a coplanar line or any other transmission line geometry.
  • the antenna further comprises:
  • Said first resonant frequency f 1 and said second resonant frequency f 2 may have different value.
  • the antenna may include further injections means in the first plate for injecting further current to said first layer.
  • Current may be simultaneously injected in different layers both to said first current injection means and to second current injection means; or it may be simultaneously injected in a single layer to said first current injection means and said further injection means.
  • the first injection means can be arranged perpendicularly to the second current injection means or to the further injection means; this way, polarisation of the antenna is achieved.
  • Said first and second current injection means may comprise a microstrip feed, a coaxial cable, a coplanar line or any other transmission line geometry.
  • the different layers in the multi-layer antenna have substantially the same overall dimensions.
  • the resulting architecture is suitable for monolithic integration.
  • the overall planar dimensions of the multi-layer antenna are in the order of a tenth of the wavelength ⁇ /10 ; and the thickness of the multi-layer planar antenna is in the order of a hundredth of the wavelength ⁇ /100 or below. It is important to underline this latter fact: the solution proposed here provides an antenna geometry which is fully compatible with the multilayer IC technology, meaning that the antenna is designed using the multilayer IC frame itself in such a way that small, efficient integrated antennas may be designed.
  • transversal and thickness dimensions are simultaneously reduced due to the particular matching effect between the highly unequal input port impedance and the antenna radiation impedance produced by the compacted multilayer structure where the thickness of the layers is in the order of tenths of millimetres (1/10's mm) very differently from the tens of millimetres (10's mm) used on the conventional multilayer antenna geometries.
  • the tuning method of the present invention is preferably applicable to antennas as defined in EP application No. 05078048.5 , and so are the antennas themselves.
  • FIGS 1A and 1B show a diagrammatic representation of the feeding method of the present invention in a multi-layer antenna, where feeding is done by means of a coaxial cable.
  • Figures 2B and 2B show another possibility of feeding a multi-layer antenna, where feeding is done by means of a microstrip feed.
  • Figure 3 shows a multi-layer antenna where polarisation is achieved by means of using the feeding method of the present invention.
  • the feeding point 20 is connected to the first plate/layer above the ground plate 11; in this case the antenna has a first operating frequency-band f 1 .
  • the feeding point 20' is connected to the second plate/layer above the ground plate 11; in this case the antenna has a second operating frequency-band f 2 .
  • the latter operates at a third frequency-band.
  • the position of the feeding point can be applied in different ways.
  • a transmission line such as coaxial cable, which passes through the ground plate to the top plate of the patch and it connects to it.
  • FIGS 2A and 2B and 3 show that other types of current injection means can be used, such as the planar feed transmission line (microstrip, striplines, coplanar, etc.).
  • planar feed transmission line microwave, striplines, coplanar, etc.
  • the similar concept is applied, since using this feeding connection it is also possible to connect to different planes of the multi-layer antenna.
  • microstrip feed 21 is carried out in the first layer above the ground plate 11; in this case the antenna has a first operating frequency-band f 1 .
  • microstrip feed 21' is carried out in the second layer above the ground plate 11, whereby the antenna operates at a second operating frequency-band f 2 .
  • Figure 3 shows a multi-layer planar antenna 10' where current is simultaneously injected to a first plate/layer and to a second plate/layer by means of respective planar (differential CPW) feeds 21, 21'.
  • said planar feeds 21, 21' of the first and second plates/layers have been arranged perpendicularly, such that the current injected to the first plate/layer is perpendicular to the current injected to the second plate/layer, thereby achieving the polarisation of the antenna.
EP06077257A 2006-12-15 2006-12-15 Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten Withdrawn EP1933419A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06077257A EP1933419A1 (de) 2006-12-15 2006-12-15 Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06077257A EP1933419A1 (de) 2006-12-15 2006-12-15 Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten

Publications (1)

Publication Number Publication Date
EP1933419A1 true EP1933419A1 (de) 2008-06-18

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EP06077257A Withdrawn EP1933419A1 (de) 2006-12-15 2006-12-15 Mehrfachspeisungsverfahren für IC-kompatible mehrschichtige Planarantennen und IC-kompatible mehrschichtige Planarantenne mit mehreren Einspeisungspunkten

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EP (1) EP1933419A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023024023A1 (zh) * 2021-08-26 2023-03-02 京东方科技集团股份有限公司 天线结构及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3921177A (en) * 1973-04-17 1975-11-18 Ball Brothers Res Corp Microstrip antenna structures and arrays
US4070676A (en) * 1975-10-06 1978-01-24 Ball Corporation Multiple resonance radio frequency microstrip antenna structure
US5270722A (en) * 1990-12-27 1993-12-14 Thomson-Csf Patch-type microwave antenna
WO1999034477A1 (en) * 1997-12-29 1999-07-08 Hsin Hsien Chung Low cost high performance portable phased array antenna system for satellite communication
WO2006071139A1 (en) * 2004-12-27 2006-07-06 Telefonaktiebolaget Lm Ericsson (Publ) A triple polarized patch antenna

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3921177A (en) * 1973-04-17 1975-11-18 Ball Brothers Res Corp Microstrip antenna structures and arrays
US4070676A (en) * 1975-10-06 1978-01-24 Ball Corporation Multiple resonance radio frequency microstrip antenna structure
US5270722A (en) * 1990-12-27 1993-12-14 Thomson-Csf Patch-type microwave antenna
WO1999034477A1 (en) * 1997-12-29 1999-07-08 Hsin Hsien Chung Low cost high performance portable phased array antenna system for satellite communication
WO2006071139A1 (en) * 2004-12-27 2006-07-06 Telefonaktiebolaget Lm Ericsson (Publ) A triple polarized patch antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023024023A1 (zh) * 2021-08-26 2023-03-02 京东方科技集团股份有限公司 天线结构及电子设备

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