EP1905127A1 - Insulation displacement plug-in connector and device for telecommunications and data technology - Google Patents

Insulation displacement plug-in connector and device for telecommunications and data technology

Info

Publication number
EP1905127A1
EP1905127A1 EP06762657A EP06762657A EP1905127A1 EP 1905127 A1 EP1905127 A1 EP 1905127A1 EP 06762657 A EP06762657 A EP 06762657A EP 06762657 A EP06762657 A EP 06762657A EP 1905127 A1 EP1905127 A1 EP 1905127A1
Authority
EP
European Patent Office
Prior art keywords
insulation displacement
contact
circuit board
displacement connector
dsx
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06762657A
Other languages
German (de)
French (fr)
Other versions
EP1905127B1 (en
Inventor
Harald Klein
Dominic Joseph Louwagie
Manfred Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Germany GmbH
Original Assignee
ADC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADC GmbH filed Critical ADC GmbH
Priority to PL06762657T priority Critical patent/PL1905127T3/en
Priority to SI200631030T priority patent/SI1905127T1/en
Publication of EP1905127A1 publication Critical patent/EP1905127A1/en
Application granted granted Critical
Publication of EP1905127B1 publication Critical patent/EP1905127B1/en
Priority to CY20111100649T priority patent/CY1111947T1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
    • H01R4/2425—Flat plates, e.g. multi-layered flat plates

Definitions

  • the invention relates to a insulation displacement connector and a device for telecommunications and data technology.
  • the insulation displacement connector comprises a housing, in which contact elements are arranged, wherein the contact elements have a first contact region, which is formed as insulation displacement contact, and a second contact region, which is formed as a solderable contact pin (pin contact).
  • the housing is formed in one piece and is soldered via the contact pins with the circuit board.
  • the contact elements are inserted from the top of the housing and held by stops, wherein in the inserted state, the contact pins protrude from the bottom of the housing.
  • Schirmungsbleche are provided which are inserted from the underside of the housing and are each arranged between two pairs of contact elements.
  • the shield plates are also formed with contact pins, so that they can also be soldered to the circuit board and placed on a common ground line.
  • Such modules are also referred to as PCB print modules. Via the trained as insulation displacement contacts contact areas wires can then be electrically connected to the circuit board.
  • a digital signal distributor DSX Digital Cross-Connect System
  • the DSX device is usually located in racks, which are usually located in the switching center of a telephone service provider.
  • the DSX device also provides jack access to the transmission paths.
  • DSX jacks are well known and typically include a plurality of holes sized to receive plugs. Within the holes a plurality of switches for contacting the plug is provided.
  • the jacks are electrically connected to digital transmission lines and are also electrically connected to a plurality of terminal members which are used to maneuver the jacks. By inserting plugs into the holes in the sockets, signals transmitted via the sockets can be interrupted or monitored.
  • FIG. 1 schematically illustrates a DSX system previously known from US Pat. No. 6,840,815, which illustrates an example of a system to be found in a digital exchange of a telephone service provider.
  • the DSX system is illustrated with three DSX sockets 10a, 10b and 10c.
  • Each DSX socket 10a, 10b and 10c is connected to a specific part of the digital device.
  • the DSX socket 10a is connected to the digital switch 12
  • the DSX socket 10b is connected to the office amplifier 14a
  • the DSX socket 10c is connected to the office amplifier 14b.
  • Each digital device has an input at which a digital signal can enter, as well as an output at which the digital signal can exit.
  • the DSX sockets 10a, 10b, and 10c each include OUT pins 16 and IN pins 18.
  • the DSX sockets 10a, 10b, and 10c are connected to their respective digital devices by connecting the OUT pins 16 to the device (FIG. that is, going to the DSX system) and by connecting the IN pins 18 to the signals entering the device (ie, going out of the DSX system).
  • the DSX sockets 10a and 10b are "cross-linked" to one another by semi-permanent connections
  • the semi-permanent connections extend between patch panels
  • the semi-permanent connection between the digital switch 12 and the public office amplifier 14a may be interrupted for diagnostic purposes by plugging plugs into the IN or OUT terminals of the DSX jacks 10a and 10b.
  • patch cords may be used to break the semi-permanent connection between the DSX jacks 10a and 10b to provide connections to other digital devices.
  • the digital switch 12 may be disconnected from the trunk repeater 14a by use of the patch cords 23 and connected to the trunk repeater 14b.
  • the patch cords 23 include plugs plugged into the IN and OUT ports of the DSX jack 10a and the IN and OUT ports of the DSX jack 10c. Plugging the plugs into the IN and OUT terminals of the DSX jack 10a will open the normally closed switches or contacts, breaking the electrical connection to the trunk repeater 14a and establishing an electrical connection with the trunk repeater 14b.
  • a digital signal distributor is known in each case, which is modular.
  • the modules each include a socket receptacle for receiving four DSX sockets and a printed circuit board.
  • the female receptacle is connected via first contact elements with the circuit board, wherein parts of the contact elements protrude through openings of the female receptacle and contact them when inserting the DSX sockets.
  • the printed circuit board is longer than the socket receptacle so that patching and device connection fields can be arranged underneath the socket receptacle.
  • a cover part is applied to the circuit board at least from the side of the female receptacle.
  • the cover part has openings into which Kotnaktmaschineneau can be inserted.
  • the contact elements have a pin Contact for contacting the PCB and a wire-wrap contact for connecting wires. Furthermore, both documents disclose to use insulation displacement contacts instead of the wire-wrap contacts.
  • insulation displacement contacts as a replacement for the wire-wrap contacts are that they require more space.
  • the reason for this is that the insulation displacement contacts must be connected with a special tool, for which a free accessibility is necessary.
  • the invention is therefore based on the technical problem of providing an insulation displacement connector and a device equipped therewith for the telecommunication and data technology, by means of which a compact construction is made possible.
  • insulation displacement contact is arranged between the insulation displacement contact and the pin contact.
  • This ensures that the insulation displacement contacts are guided away from the circuit board.
  • this dimension is usually uncritical for the packing density.
  • the extension is chosen such that the insulation displacement application tool is not hindered by surrounding edges during BeSlten.
  • insulation displacement contacts, extensions and pin contacts are preferably integrally formed.
  • a guide element is arranged on the underside of the insulation displacement contact, which is further preferably formed wider than the insulation displacement contact.
  • One possible training is the shape of a rectangle.
  • the guide element By the guide element, the introduction of the insulation displacement contacts in the housing is substantially improved, since the extension increases the elasticity of the contact element.
  • two arcuate elements are arranged at the end of the extension associated with the pin contact. These are preferably arranged symmetrically about the extension, wherein more preferably, the two arcs are opposite to each other.
  • the arcuate elements serve on the one hand to support the contact element in order to absorb the occurring Anschaltment. Due to the arcuate design of the structure can also be chosen very compact beyond.
  • the inner sides of the housing are formed with grooves for the guide elements, which extend from the underside of the housing to the upper side. Up to the top in this context is to be understood that the groove extends so far that parts of the insulation displacement contact are still in the groove.
  • slots are made in the groove walls of the guide elements, wherein the length of the slots corresponds to the length of the elements of the arcuate elements.
  • a further extension is arranged between the arcuate elements and the pin contact. This extension corresponds to the thickness of a cover piece arranged on the printed circuit board.
  • locking lugs are arranged on the outer sides of the housing.
  • the cover piece on a receptacle for the insulation displacement connector.
  • the receptacle preferably has walls which define an open cuboid, wherein the walls have latching openings for the latching noses.
  • the housing of the insulation displacement connector has slots for receiving the leads to be connected, wherein the insulation displacement contact is aligned at 45 ° to the slot. This will secure the vein contacted, wherein the diameter of the wire is reduced only slightly by the clamping.
  • a preferred application of the insulation displacement connector according to the invention is the use in a digital signal distributor.
  • Fig. 1 is a circuit diagram of a DSX system of
  • FIG. 2 is an exploded front perspective view of a DSX module in a first embodiment
  • Fig. 2a is a perspective enlarged view of a contact element of a insulation displacement connector of the DSX module of Fig. 2;
  • 2b is a partial plan view of two insulation displacement
  • FIG. 4 is a rear view of the DSX module of FIG. 2;
  • Fig. 5 is a side view of the DSX module of Fig. 2 with DSX sockets removed;
  • Fig. 6 is a front view of the DSX module of Fig. 2 with DSX sockets removed and with insulation displacement connectors removed;
  • 9A and 9B are schematic diagrams of odd and even DSX jack inserts of the DSX module of Fig. 2; 10 is a front perspective view of a DSX module in a second embodiment;
  • FIG. 11 is a rear perspective view of the DSX module of FIG. 10 with DSX sockets removed;
  • Fig. 12 is a rear view of the DSX module of Fig. 10;
  • Fig. 13 is a side view of the DSX module of Fig. 10 with DSX sockets removed;
  • FIG. 14 is a front view of the DSX module of FIG. 10 with DSX sockets removed; FIG. and
  • FIGS. 15A and 15B are schematic diagrams of odd-numbered and even-numbered DSX female inserts of the DSX module of FIG. 10.
  • a first embodiment of a DSX module 34 is shown in perspective.
  • the DSX module 34 includes a jack receptacle 35 for receiving a plurality of jacks 36, 38 (e.g., two odd-numbered jacks 36 and two even-numbered jacks 38).
  • the DSX module 34 has a front-accessible patch panel 40 and a front-panel device port 42 (i.e., IN / OUT).
  • the pads 40, 42 are each formed by two insulation displacement connectors 41 and each contain arrays (eg, arrays, rows, columns or other groups) of contact elements 43 for connecting wires to the DSX module 34.
  • the contact elements 43 are housed in housings 45 the connection pads 40, 42 worn.
  • the housings 45 are mounted on a front cover 49 fixed to the front of the DSX module 34.
  • the front cover piece 49 covers a front side of a circuit board 124 that provides electrical connections between the sockets 36 and 38 and the insulation displacement connectors 41 of the pads 40, 42.
  • a dielectric rear cover piece 126 By a dielectric rear cover piece 126, a rear side of the printed circuit board 124 is covered.
  • retainers 127 are used to secure the female receptacle 35 and the front cover 49 to the coupling rear deck 126 together.
  • the printed circuit board 124 is positioned between the front structure formed by the female receptacle 35 and the front cover piece 49 and the rear structure formed by the rear cover piece 126.
  • the holders 127 ' may also be used to further secure the printed circuit board 124 to the rear decking 126.
  • the DSX module 34 may preferably be received in a chassis (a chassis 32 is shown schematically in Figures 9A and 9B.)
  • the chassis may be approximately 48 cm in length.
  • this embodiment may accommodate 16 DSX modules, or alternatively, the chassis could be constructed in accordance with US standard specifications approximately 58.5 cm in length
  • This embodiment may, for example, house 21 DSX modules, of course other chassis sizes and other numbers
  • An exemplary chassis is disclosed in U.S. Patent No. 6,840,815, which is hereby incorporated by reference in its entirety.
  • each DSX module 34 may preferably removably receive the odd and even DSX sockets 36 and 38.
  • bushings 36 and 38 may be retained in bushing receptacle 35 by resilient latches 37. By bending the latch 37, the sockets 36 and 38 can be manually removed from the socket receptacle 35. When the sockets 36 and 38 are removed from the socket receptacle 35, the sockets 36 and 38 are electrically disconnected from the circuit board 124.
  • the DSX module 34 is shown as a "quad package" (i.e., a four socket module), it will be understood that alternative modules may include socket receptacles sized to accommodate more or fewer than four jacks.
  • each DSX module 34 includes a plurality from further sockets 136 (shown in FIG. 2) for providing electrical interfaces to the sockets 36, 38 when the sockets 36, 38 are mounted in the socket receivers 35.
  • the jacks 136 hold electrical contacts 137 with pins that are electrically connected directly to the printed circuit board 124.
  • the jacks 36, 38 each include a front surface defining an OUT port 128, a MONITOR OUT port 129, an IN port 130, and a MONITOR IN port 131. Terminals 128-131 are sized to accept A / B plugs.
  • the sockets 36, 38 also define LED ports 132 for receiving signal tracking lamps.
  • the sockets 36, 38 further include electrical contacts 133 (see FIGS. 9A and 9B) associated with the terminals 128-132, respectively.
  • the contacts 133 include end pieces 134 that protrude rearward from each of the sockets 36, 38.
  • the sockets 36, 38 When the sockets 36, 38 are inserted into the socket receptacle 35, the end pieces 134 of the contacts 133 slide into the sockets 136 of the DSX module 34 to make electrical connections between the circuit board 124 and the sockets 36, 38. When the sockets 36, 38 are removed from the socket receptacle 35, the sockets 36, 38 are electrically disconnected from the circuit board 124.
  • the electrical contacts of the sockets 36, 38 include voltage contacts -48V, signal trace lamp contacts TL and return contacts RET associated with the LED circuits. Also, the electrical contacts include a-springs T and b-springs R corresponding to the MONITOR-IN and MONITOR-OUT terminals. The electrical contacts further include a input contacts Tl, b input contacts Rl, jumpering a input contacts XT1, and jumper connection b input contacts XRI corresponding to the IN terminals. The electrical contacts further include a output contacts TO, b output contacts RO, cross connection a output contacts XTO and cross connection b output contacts XRO corresponding to the OUT terminals.
  • the Contacts function in the same manner as described in US Pat. No. 6,116,961, which is incorporated herein by reference.
  • the contacts Tl 1 Rl, XTI and XRI and the contacts TO, RO, XTO and XRO cooperate to define opening switches.
  • the printed circuit board 124 is positioned directly behind the female receptacle 35, the patch panel 40 and the device connector panel 42.
  • the printed circuit board 124 includes a first portion 124a associated with the rear of the female receptacle 35.
  • the first portion 124a includes a plurality of plated-through holes 139 that receive the pins of the electrical contacts 137 to establish a direct electrical connection between the printed circuit board 124 and the electrical contacts 137.
  • the circuit board 124 includes a second portion 124b positioned behind the patch panel 40 and coextensive therewith.
  • the second part 124b includes a plurality of through holes 146 that receive pin contacts 53 of the contact elements 43 of the insulation displacement connector 41 mounted on the patch panel 40. As a result, an electrical connection is made between the printed circuit board 124 and the insulation displacement connector 41 of the patch panel 40.
  • the printed circuit board 124 includes a third portion 124c which is positioned behind the device connector panel 42 and equidistant therewith.
  • the third part 124c includes a plurality of through holes 148 which receive pin contacts 53 of the contact elements 43 of the insulation displacement connector 41 mounted on the device connector panel 42 to establish electrical connection between the circuit board 124 and the insulation displacement connector 41.
  • the back cover 126 of the DSX module 34 is preferably made of a dielectric material and sized to cover the back of the circuit board 124.
  • the cover piece 126 defines a plug 82 for electrically connecting to a receptacle 83 (see schematic diagram in FIGS. 9A and 9B) of the chassis 32 when the DSX module 34 is mounted in the chassis 32.
  • the plugs 82 include b grounding pins 88, power / voltage pins 90, and power return pins 92 connected to the chassis b ground, the chassis power, and the chassis power return, respectively (see FIGS. 9A and 9B).
  • the pins 88, 90 and 92 are directly connected to the printed circuit board 124 (eg, the pins extend into the through holes 93 defined by the printed circuit board 124).
  • the printed circuit board 124 includes traces 290 that electrically connect the contact elements 43 of the insulation displacement connector 41 of the device connector panel 42 to receptacles associated with the contacts Tl, Rl, T0 and R0 of the sockets 36,38. Also, the circuit board 124 includes traces 292 that provide electrical connections between the contact elements 43 of the insulation displacement connectors 41 of the patch panel 40 and receptacles associated with the contacts XTI, RTI, XTO, and XRO of the sockets 36, 38. In addition, the circuit board 124 includes traces 294 for electrically connecting traces 290 to the receptacle portions associated with the contacts of the MONITOR terminals of the sockets 36,38.
  • the circuit board 124 includes traces 296 for connecting the b grounding pins 88 to receptacles associated with the b ground contacts SG of the sockets 36, 38; Paths 298 for connecting the signal-tracking lamp IDC of the jumper terminal 40 to female parts associated with the signal-tracking lamp contacts TL of the jacks 36, 38; Webs 100 for connecting power / voltage pins 90 to receptacles associated with the voltage contacts -48V of the sockets 36, 38; and tracks 102 for connecting current return pins 92 to female parts associated with the return contacts RET of the sockets 36,38.
  • the contact element 43 is made of a conductive material, such as a metal material.
  • the contact elements 43 may be stamped from sheet metal.
  • each contact element 43 includes a pair of cutting blades 51 which form the actual insulation displacement contact 54. Between the cutting blade diameter 51, a contact slot 52 is formed.
  • the cutting edge knives 51 are configured so that when an insulated cable core is inserted into the contact slot 52 between the cutting blade 51, the cutting edge blades 51 cut through the insulation of the cable core and into the conductive core of the wire to provide an electrical connection between the conductive core of the core Cable core and the contact element 43 produce.
  • a pin contact 53 is arranged, which serves for connecting the contact element 43 to the printed circuit board 124.
  • a guide member 56 is arranged, which has a rectangular shape, wherein the guide member 56 is wider than the insulation displacement contact 54.
  • the contact member 43 has a first extension 55 and a second extension 58 which electrically connect the insulation displacement contact 54 to the pin contact 53.
  • the extensions 55, 58 have offset lengths OL (ie, the lengths corresponding to the distance that the IDC contacts 54 will be offset from the PCB) of at least 1 cm or lengths in the range of 1-3 centimeters .
  • the second extension 58 serves to guide the pin contact 53 through the cover piece 49, 49 '.
  • Arranged laterally between the first extension 55 and the second extension 58 are two arcuate elements 57 which, on the one hand, support the contact element 43 on the cover piece 49, 49 ', the arcuate elements 57 themselves being supported in the housing 45, so that the position of the contact element 43 is fixed.
  • the two arcuate elements 57 are bent in opposite directions to each other.
  • the housings 45 generally rectangular shapes and include bottom surfaces 61 and wire terminal ends or tops 63.
  • the top surface 63 defines slots 65 (see Fig. 7) for receiving wires to be connected.
  • the slots are aligned along parallel lines L so that the wires extend across the width of the housing 45 when connected.
  • Fig. 7 the top 63 of the insulation displacement connector 41 is shown.
  • the housing 45 comprises clamping webs 64, between which slots 65 are formed for the wires to be connected. At an angle of 45 ° to the slots 65, the cutting knives 51 of the insulation displacement contacts 54 are arranged.
  • the contact elements 43 are inserted from the bottom 61 in the housing 45, wherein in Fig. 7 and 8, the state with inserted contact elements 43 is shown.
  • the guide elements 56 and the arcuate element 57 lie in a groove 70, wherein in each case one outer edge of the guide element lies in a different groove 70.
  • the groove 70 extends from the bottom of the housing 45 to the area where the insulation displacement contact 54 is located.
  • slots 71 are introduced, in which the arcuate elements 57 lie.
  • the length of the slots corresponds to the length of the arcuate elements 57, so that they abut against an edge 72 in the housing 45.
  • locking lugs 69 can be recognized by means of which the insulation displacement connectors can be latched to the receptacles.
  • the insulation displacement connectors 41 on the patch panel 40 are the same as those on the device connector panel 42, but each housing 45 on the device connector panel 42 has two fewer contact elements 43. At the jumper panel 40, more contact elements 43 are provided to receive lead wires for connecting signal tracking light circuits used to track the jumper connections.
  • the front cover piece 49 have a one-piece construction of a dielectric material such as plastic.
  • the cover piece 49 includes a platform 220 and four support structures 222 that project forward from the platform 220.
  • Each of the support structures 222 includes two side walls 224, upper and lower walls 225, 226, and a rear wall 227.
  • the walls 224-227 define rectangular receptacles 230 sized to receive the underside 61 of the housings 45.
  • the side walls 224 define openings 232 for receiving the detents 69 of the housings 45 to provide snap-fit connections that retain the housings 45 in the receptacles.
  • the back walls 227 define openings 234 for receiving the pin contacts 53 of the contact elements 43 when the housings 45 are secured in the receptacles 230.
  • the apertures 234 defined by the rear walls 227 of the receptacles located on the patch panel 40 are preferably aligned with the plated-through holes 146 located on the second portion 124b of the printed circuit board 124.
  • the openings 234 defined by the rear walls 227 of the mating connection field 40 are preferably aligned with the plated-through holes 148 located on the second part 124 b of the printed circuit board 124.
  • the DSX system 30 functions in the same manner as a conventional DSX system.
  • the jacks 36, 38 can be connected to digital devices.
  • the jumper connection field 40 allows the sockets 36, 38 to be connected to each other by semi-permanent cable bridges.
  • the sockets 36, 38 provide opening connections between the digital devices connected to the device connector panel 42 and the jumper interface 40.
  • the jacks 36, 38 can be monitored for continuous signals without interrupting the signals. With the signal tracking lamp circuits, the monitored routed connections can be tracked as described in U.S. Patent No. 6,116,961 become. Plugs may be plugged into the IN or OUT terminals of the jacks 36, 38 for testing or diagnostic purposes or to redirect signals to other digital devices.
  • Characters. 10-15B show another DSX module 34 'having features that are examples of aspects of the invention in accordance with the principles of the present disclosure. Many of the components of the DSX module 34 'are identical to components of the DSX module 34. Identical reference numbers have been assigned to these identical components.
  • the DSX module 34 ' has the same basic components as the DSX module 34, only the device connector panel 42 has been routed to the back of the module. To accommodate this change, the DSX module 34 'includes a shortened printed circuit board 124' having a greater density of plated-through holes for connecting the insulation displacement connectors 41 of the pads 40, 42 of the printed circuit board 124 '. Also, the DSX module 34 'includes a back cover 126' that has been shortened and modified to include receptacles 230 that receive the insulation displacement connectors 41 that define the device interface 42 located at the back of the module 34 '. In addition, the DSX module 34 'includes a front cover piece 49' which has been shortened and modified to eliminate the lower set of receptacles 230.
  • insulation displacement mounting structure has been illustrated as being used in combination with a DSX module, it will be understood that the structure can be applied to any type of DSX system (modular or non-modular). Moreover, the insulation displacement mounting structure is also applicable to any type of board-mounted insulation displacement application.
  • connection pads 40, 42 have each been shown as insulation displacement connectors 41. Regardless of whether the connector panels 40, 42 are both from the front or the device connector panel 42 of the Reverse accessible, mixed structures can also be applied.
  • a terminal box as insulation displacement connector 41 and the other terminal box as a coaxial connector such as Balun, M4, 1.0 / 2.3, 1.6 / 5-6, SMB or Type 43 coaxial connector or as RJ plug connectors, in particular RJ 45 plug connectors (shielded or unshielded), may be formed.
  • the patch panel 40 is preferably designed as insulation displacement connector 41 and the device connection field 42 is formed as a coaxial or RJ connector.
  • other connector types such as D-Sub are possible.
  • the patch panel 40 at the front and the device patch panel 42 at the back of the insulation displacement connector 41 can also be replaced by a wire-wrap connector, which is then preferably used on the patch panel 40, whereas the device connector panel 42, for example is formed with a coaxial or RJ connector, wherein otherwise reference is made to the preceding versions of the DSX module with insulation displacement connector.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Small-Scale Networks (AREA)
  • Communication Cables (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

The invention relates to an insulation displacement plug-in connector for telecommunications and data technology, comprising a housing (45) and a number of contact elements (43), wherein the contact elements (43) each comprise an insulation displacement contact (54) for connecting cores and a pin contact (53) for making contact with a printed circuit board, wherein at least one extension (55) is arranged between the insulation displacement contact (54) and the pin contact (53).

Description

Schneidklemm-Steckverbinder und Einrichtung für die Telekommunikations- und DatentechnikInsulation displacement connector and device for telecommunications and data technology
Die Erfindung betrifft einen Schneidklemm-Steckverbinder sowie eine Einrichtung für die Telekommunikations- und Datentechnik.The invention relates to a insulation displacement connector and a device for telecommunications and data technology.
Ein solcher Schneidklemm-Steckverbinder ist beispielsweise aus der EP 0 766 352 B1 bekannt. Der Schneidklemm-Steckverbinder umfasst ein Gehäuse, in dem Kontaktelemente angeordnet sind, wobei die Kontaktelemente einen ersten Kontaktbereich aufweisen, der als Schneid- Klemm-Kontakt ausgebildet ist, sowie einen zweiten Kontaktbereich, der als lötbarer Kontaktpin (Stift-Kontakt) ausgebildet ist. Das Gehäuse ist einteilig ausgebildet und wird über die Kontaktpins mit der Leiterplatte verlötet. Die Kontaktelemente werden von der Oberseite des Gehäuses eingeschoben und durch Anschläge gehalten, wobei im eingeschobenen Zustand die Kontaktpins aus der Unterseite des Gehäuses herausragen. Zur Schirmung sind Schirmungsbleche vorgesehen, die von der Unterseite des Gehäuses eingeschoben werden und jeweils zwischen zwei Paaren von Kontaktelementen angeordnet sind. Die Schirmbleche sind ebenfalls mit Kontaktpins ausgebildet, so dass diese ebenfalls mit der Leiterplatte verlötet und auf eine gemeinsame Masseleitung gelegt werden können. Derartige Module werden auch als PCB-Printmodule bezeichnet. Über die als Schneid-Klemm-Kontakte ausgebildeten Kontaktbereiche können dann Adern elektrisch mit der Leiterplatte verbunden werden.Such an insulation displacement connector is known for example from EP 0 766 352 B1. The insulation displacement connector comprises a housing, in which contact elements are arranged, wherein the contact elements have a first contact region, which is formed as insulation displacement contact, and a second contact region, which is formed as a solderable contact pin (pin contact). The housing is formed in one piece and is soldered via the contact pins with the circuit board. The contact elements are inserted from the top of the housing and held by stops, wherein in the inserted state, the contact pins protrude from the bottom of the housing. For shielding Schirmungsbleche are provided which are inserted from the underside of the housing and are each arranged between two pairs of contact elements. The shield plates are also formed with contact pins, so that they can also be soldered to the circuit board and placed on a common ground line. Such modules are also referred to as PCB print modules. Via the trained as insulation displacement contacts contact areas wires can then be electrically connected to the circuit board.
Ein Digitalsignalverteiler DSX (Digital Cross-Connect System) stellt eine Rangierverbindung zwischen zwei digitalen Übertragungswegen bereit. Die DSX-Vorrichtung befindet sich üblicherweise in Gestellen, die gewöhnlich in der Vermittlungsstelle eines Telefondienstanbieters angeordnet sind. Die DSX-Vorrichtung stellt auch einen Buchsen-Zugang zu den Übertragungswegen bereit. DSX-Buchsen sind wohlbekannt und enthalten typischerweise eine Mehrzahl von Bohrungen, die zur Aufnahme von Steckern dimensioniert sind. Innerhalb der Bohrungen ist eine Mehrzahl von Schaltern zum Kontaktieren der Stecker vorgesehen. Die Buchsen sind elektrisch mit digitalen Übertragungsleitungen verbunden und sind auch elektrisch mit einer Mehrzahl von Anschlussgliedern verbunden, die zum Rangieren der Buchsen benutzt werden. Durch Einstecken von Steckern in die Bohrungen der Buchsen können über die Buchsen übertragene Signale unterbrochen oder überwacht werden.A digital signal distributor DSX (Digital Cross-Connect System) provides a jumper connection between two digital transmission paths. The DSX device is usually located in racks, which are usually located in the switching center of a telephone service provider. The DSX device also provides jack access to the transmission paths. DSX jacks are well known and typically include a plurality of holes sized to receive plugs. Within the holes a plurality of switches for contacting the plug is provided. The jacks are electrically connected to digital transmission lines and are also electrically connected to a plurality of terminal members which are used to maneuver the jacks. By inserting plugs into the holes in the sockets, signals transmitted via the sockets can be interrupted or monitored.
In der Fig.1 ist ein aus der US 6,840,815 vorbekanntes DSX-System schematisch dargestellt, das ein Beispiel eines in einer digitalen Vermittlungsstelle eines Telefondiensteanbieters vorzufindenden Systems darstellt. Das DSX-System ist mit drei DSX-Buchsen 10a, 10b und 10c dargestellt. Jede DSX- Buchse 10a, 10b und 10c ist mit einem bestimmten Teil der Digitaleinrichtung verbunden. Beispielsweise ist die DSX- Buchse 10a mit der Digitalvermittlung 12 verbunden, die DSX- Buchse 10b mit dem Amtsverstärker 14a und die DSX- Buchse 10c mit dem Amtsverstärker 14 b verbunden. Jede Digitaleinrichtung weist einen Eingang auf, an dem ein Digitalsignal eintreten kann, wie auch einen Ausgang, an dem das Digitalsignal austreten kann. Die DSX-Buchsen 10a, 10b und 10c enthalten hierzu jeweils OUT-Anschlussstifte 16 und IN- Anschlussstifte 18. Die DSX-Buchsen 10a, 10b und 10c werden mit ihren entsprechenden Digitaleinrichtungen durch Verbinden der OUT-Anschlussstifte 16 mit den aus der Einrichtung austretenden (d.h. zum DSX-System gehenden) Signalen und durch Verbinden der IN-Anschlussstifte 18 mit den in die Einrichtung eintretenden (d.h. vom DSX-System abgehenden) Signalen verbunden.FIG. 1 schematically illustrates a DSX system previously known from US Pat. No. 6,840,815, which illustrates an example of a system to be found in a digital exchange of a telephone service provider. The DSX system is illustrated with three DSX sockets 10a, 10b and 10c. Each DSX socket 10a, 10b and 10c is connected to a specific part of the digital device. For example, the DSX socket 10a is connected to the digital switch 12, the DSX socket 10b is connected to the office amplifier 14a, and the DSX socket 10c is connected to the office amplifier 14b. Each digital device has an input at which a digital signal can enter, as well as an output at which the digital signal can exit. The DSX sockets 10a, 10b, and 10c each include OUT pins 16 and IN pins 18. The DSX sockets 10a, 10b, and 10c are connected to their respective digital devices by connecting the OUT pins 16 to the device (FIG. that is, going to the DSX system) and by connecting the IN pins 18 to the signals entering the device (ie, going out of the DSX system).
Noch auf Fig. 1 bezugnehmend werden die DSX-Buchsen 10a und 10b durch semipermanente Verbindungen miteinander „querverbunden". Die semipermanenten Verbindungen erstrecken sich zwischen RangierfeldernStill referring to Fig. 1, the DSX sockets 10a and 10b are "cross-linked" to one another by semi-permanent connections The semi-permanent connections extend between patch panels
19 der DSX-Buchsen 10a und 10b. Beispielsweise verbinden Steckkabel19 of the DSX jacks 10a and 10b. For example, connect power cords
20 OUT-Rangierverbindungsstifte der DSX-Buchse 10a mit IN- Rangierverbindungsstiften der DSX- Buchse 10b. Auf ähnliche Weise verbinden Steckkabel 21 IN-Rangierverbindungsstifte der DSX-Buchse 10a mit OUT-Rangierverbindungsstiften der DSX- Buchse 10b. Die Schalter der DSX-Buchsen 10a und 10b sind vorzugsweise geschlossen. So wird, wenn kein Stecker in einer der DSX-Buchsen 10a und 10b eingesteckt ist, eine Verbindung zwischen den DSX-Buchsen 10a und 10b und daher zwischen der Digitalvermittlung 12 und dem Amtsverstärker 14a bereitgestellt.20 OUT jumper connection pins of the DSX socket 10a with IN Rangierverbindungsstiften the DSX socket 10b. Similarly, patch cords 21 connect IN jumper pins of DSX jack 10a to OUT jumper pins of DSX jack 10b. The switches of the DSX sockets 10a and 10b are preferably closed. Thus, if no plug is plugged into one of the DSX jacks 10a and 10b, a connection is provided between the DSX jacks 10a and 10b and therefore between the digital switch 12 and the office amplifier 14a.
Die semipermanente Verbindung zwischen der Digitalvermittlung 12 und dem Amtverstärker 14a kann für Diagnosezwecke durch Einstecken von Steckern in die IN- oder OUT-Anschlüsse der DSX-Buchsen 10a und 10b unterbrochen werden. Auf ähnliche Weise können Steckkabel zum Unterbrechen der semipermanenten Verbindung zwischen den DSX- Buchsen 10a und 10b benutzt werden, um Verbindungen mit anderen Digitaleinrichtungen bereitzustellen. Beispielsweise kann die Digitalvermittlung 12 durch Verwendung der Steckkabel 23 vom Amtsverstärker 14a abgetrennt und mit dem Amtsverstärker 14b verbunden werden. Die Steckkabel 23 enthalten Stecker, die in die IN- und OUT-Anschlüsse der DSX- Buchse 10a und die IN- und OUT-Anschlüsse der DSX- Buchse 10c eingesteckt werden. Durch Einstecken der Stecker in die IN- und OUT-Anschlüsse der DSX- Buchse 10a werden die normalerweise geschlossenen Schalter bzw. Kontakte geöffnet, wodurch die elektrische Verbindung mit dem Amtsverstärker 14a unterbrochen und eine elektrische Verbindung mit dem Amtsverstärker 14b hergestellt wird.The semi-permanent connection between the digital switch 12 and the public office amplifier 14a may be interrupted for diagnostic purposes by plugging plugs into the IN or OUT terminals of the DSX jacks 10a and 10b. Similarly, patch cords may be used to break the semi-permanent connection between the DSX jacks 10a and 10b to provide connections to other digital devices. For example, the digital switch 12 may be disconnected from the trunk repeater 14a by use of the patch cords 23 and connected to the trunk repeater 14b. The patch cords 23 include plugs plugged into the IN and OUT ports of the DSX jack 10a and the IN and OUT ports of the DSX jack 10c. Plugging the plugs into the IN and OUT terminals of the DSX jack 10a will open the normally closed switches or contacts, breaking the electrical connection to the trunk repeater 14a and establishing an electrical connection with the trunk repeater 14b.
Aus der US-6, 116,961 bzw. US-6,840,815 B2 ist jeweils ein Digitalsignalverteiler bekannt, der modular aufgebaut ist. Die Module umfassen jeweils eine Buchsen-Aufnahme zur Aufnahme von vier DSX- Buchsen sowie eine Leiterplatte. Die Buchsen-Aufnahme wird über erste Kontaktelemente mit der Leiterplatte verbunden, wobei Teile der Kontaktelemente durch Öffnungen der Buchsen-Aufnahme ragen und bei Einsetzen der DSX-Buchsen diese kontaktieren. Die Leiterplatte ist länger als die Buchsen-Aufnahme, so dass unterhalb der Buchsen-Aufnahme Rangier- und Geräteanschlussfelder angeordnet werden können. Hierzu wird auf die Leiterplatte mindestens von der Seite der Buchsen-Aufnahme ein Deckteil aufgebracht. Das Deckteil weist Öffnungen auf, in die Kotnaktelemente einsteckbar sind. Die Kontaktelemente weisen einen Stift- Kontakt zum Kontaktieren der Leiterplatte und einen Wire-Wrap-Kontakt zum Anschließen von Adern auf. Des Weiteren offenbaren beide Druckschriften, anstelle der Wire-Wrap-Kontakte Schneidklemm-Kontakte zu verwenden.From US-6, 116,961 and US-6,840,815 B2 a digital signal distributor is known in each case, which is modular. The modules each include a socket receptacle for receiving four DSX sockets and a printed circuit board. The female receptacle is connected via first contact elements with the circuit board, wherein parts of the contact elements protrude through openings of the female receptacle and contact them when inserting the DSX sockets. The printed circuit board is longer than the socket receptacle so that patching and device connection fields can be arranged underneath the socket receptacle. For this purpose, a cover part is applied to the circuit board at least from the side of the female receptacle. The cover part has openings into which Kotnaktelemente can be inserted. The contact elements have a pin Contact for contacting the PCB and a wire-wrap contact for connecting wires. Furthermore, both documents disclose to use insulation displacement contacts instead of the wire-wrap contacts.
Ein Problem beim Einsatz von Schneidklemm-Kontakten als Ersatz für die Wire-Wrap-Kontakte ist, dass diese mehr Platz benötigen. Der Grund hierfür liegt darin, dass die Schneidklemm-Kontakte mit einem SpezialWerkzeug beschaltet werden müssen, wofür eine freie Zugänglichkeit notwendig ist.A problem with the use of insulation displacement contacts as a replacement for the wire-wrap contacts is that they require more space. The reason for this is that the insulation displacement contacts must be connected with a special tool, for which a free accessibility is necessary.
Der Erfindung liegt daher das technische Problem zugrunde, einen Schneidklemm-Steckverbinder sowie eine hiermit ausgerüstete Einrichtung für die Telekommunikations- und Datentechnik zu schaffen, mittels derer ein kompakter Aufbau ermöglicht wird.The invention is therefore based on the technical problem of providing an insulation displacement connector and a device equipped therewith for the telecommunication and data technology, by means of which a compact construction is made possible.
Die Lösung des technischen Problems ergibt sich durch die Gegenstände mit den Merkmalen der Ansprüche 1 und 10. Weitere vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen.The solution of the technical problem results from the objects with the features of claims 1 and 10. Further advantageous embodiments of the invention will become apparent from the dependent claims.
Hierzu ist zwischen dem Schneidklemm-Kontakt und dem Stift-Kontakt eine Verlängerung angeordnet. Hierdurch wird erreicht, dass die Schneidklemm- Kontakte von der Leiterplatte weg geführt werden. Diese Dimension ist jedoch üblicherweise für die Packungsdichte unkritisch. Die Verlängerung wird dabei derart gewählt, dass das Schneidklemm-Anlegewerkzeug beim Beschälten nicht durch umliegende Kanten behindert wird. Somit wird eine hohe Kontaktdichte beibehalten und die bekannten Vorteile der Schneidklemm-Technik ausgenutzt. Dabei sind Schneidklemm-Kontakte, Verlängerungen und Stift-Kontakte vorzugsweise einstückig ausgebildet.For this purpose, an extension is arranged between the insulation displacement contact and the pin contact. This ensures that the insulation displacement contacts are guided away from the circuit board. However, this dimension is usually uncritical for the packing density. The extension is chosen such that the insulation displacement application tool is not hindered by surrounding edges during Beschälten. Thus, a high contact density is maintained and exploited the known advantages of insulation displacement technology. In this case, insulation displacement contacts, extensions and pin contacts are preferably integrally formed.
In einer bevorzugten Ausführungsform ist an der Unterseite des Schneidklemm-Kontaktes ein Führungselement angeordnet, das weiter vorzugsweise breiter als der Schneidklemm-Kontakt ausgebildet ist. Eine mögliche Ausbildung ist die Form eines Rechtecks. Durch das Führungselement wird die Einführung der Schneidklemm-Kontakte in das Gehäuse wesentlich verbessert, da durch die Verlängerung die Elastizität des Kontaktelementes zunimmt. In einer weiteren bevorzugten Ausführungsform sind an dem dem Stift- Kontakt zugeordneten Ende der Verlängerung zwei bogenförmige Elemente angeordnet. Diese sind vorzugsweise symmetrisch um die Verlängerung angeordnet, wobei weiter vorzugsweise die beiden Bögen zueinander gegensinnig sind. Die bogenförmigen Elemente dienen zum einen zum Abstützen des Kontaktelementes, um die auftretenden Anschaltkräfte aufzunehmen. Durch die bogenförmige Ausbildung kann darüber hinaus der Aufbau sehr kompakt gewählt werden.In a preferred embodiment, a guide element is arranged on the underside of the insulation displacement contact, which is further preferably formed wider than the insulation displacement contact. One possible training is the shape of a rectangle. By the guide element, the introduction of the insulation displacement contacts in the housing is substantially improved, since the extension increases the elasticity of the contact element. In a further preferred embodiment, two arcuate elements are arranged at the end of the extension associated with the pin contact. These are preferably arranged symmetrically about the extension, wherein more preferably, the two arcs are opposite to each other. The arcuate elements serve on the one hand to support the contact element in order to absorb the occurring Anschaltkräfte. Due to the arcuate design of the structure can also be chosen very compact beyond.
In einer weiteren bevorzugten Ausführungsform sind die Innenseiten des Gehäuses mit Nuten für die Führungselemente ausgebildet, die sich von der Unterseite des Gehäuses zur Oberseite erstrecken. Bis zur Oberseite ist in diesem Zusammenhang so zu verstehen, dass die Nut sich soweit erstreckt, dass Teile des Schneidklemm-Kontaktes noch in der Nut liegen.In a further preferred embodiment, the inner sides of the housing are formed with grooves for the guide elements, which extend from the underside of the housing to the upper side. Up to the top in this context is to be understood that the groove extends so far that parts of the insulation displacement contact are still in the groove.
In einer weiteren bevorzugten Ausführungsform sind in die Nutwände der Führungselemente Schlitze eingebracht, wobei die Länge der Schlitze der Länge der Elemente der bogenförmigen Elemente entspricht.In a further preferred embodiment, slots are made in the groove walls of the guide elements, wherein the length of the slots corresponds to the length of the elements of the arcuate elements.
In einer weiteren bevorzugten Ausführungsform ist zwischen den bogenförmigen Elementen und dem Stift-Kontakt eine weitere Verlängerung angeordnet. Diese Verlängerung entspricht dabei der Dicke eines auf der Leiterplatte angeordneten Deckstücks.In a further preferred embodiment, a further extension is arranged between the arcuate elements and the pin contact. This extension corresponds to the thickness of a cover piece arranged on the printed circuit board.
In einer weiteren bevorzugten Ausführungsform sind an den Außenseiten des Gehäuses Rastnasen angeordnet. Mittels dieser Rastnasen kann der Schneidklemm-Steckverbinder an dem Deckstück verrastet werden, was eine erhöhte Stabilität bewirkt. Hierzu weist das Deckstück eine Aufnahme für den Schneidklemm-Steckverbinder auf. Die Aufnahme weist vorzugsweise Wände auf, die einen offenen Quader definieren, wobei die Wände Rastöffnungen für die Rastnasen aufweisen.In a further preferred embodiment locking lugs are arranged on the outer sides of the housing. By means of these locking lugs of the insulation displacement connector can be latched to the cover piece, which causes increased stability. For this purpose, the cover piece on a receptacle for the insulation displacement connector. The receptacle preferably has walls which define an open cuboid, wherein the walls have latching openings for the latching noses.
In einer weiteren bevorzugten Ausführungsform weist das Gehäuse des Schneidklemm-Steckverbinders Schlitze zur Aufnahme der anzuschließenden Adern auf, wobei der Schneidklemm-Kontakt im 45°- Winkel zum Schlitz ausgerichtet ist. Hierdurch wird die Ader sicher kontaktiert, wobei der Durchmesser der Ader durch die Klemmung nur geringfügig reduziert wird.In a further preferred embodiment, the housing of the insulation displacement connector has slots for receiving the leads to be connected, wherein the insulation displacement contact is aligned at 45 ° to the slot. This will secure the vein contacted, wherein the diameter of the wire is reduced only slightly by the clamping.
Ein bevorzugtes Anwendungsgebiet des erfindungsgemäßen Schneidklemm-Steckverbinders ist der Einsatz in einem Digitalsignalverteiler.A preferred application of the insulation displacement connector according to the invention is the use in a digital signal distributor.
Die Erfindung wird nachfolgend anhand eines bevorzugten Ausführungsbeispieles näher erläutert. Die Figuren zeigen:The invention will be explained in more detail with reference to a preferred embodiment. The figures show:
Fig. 1 ein Schaltschema eines DSX-System desFig. 1 is a circuit diagram of a DSX system of
Standes der Technik;Prior art;
Fig. 2 eine aufgelöste perspektivische Vorderansicht eines DSX-Moduls in einer ersten Ausführungsform;FIG. 2 is an exploded front perspective view of a DSX module in a first embodiment; FIG.
Fig. 2a eine perspektivische vergrösserte Ansicht eines Kontaktelementes eines Schneidklemm- Steckverbinders des DSX-Moduls der Fig. 2;Fig. 2a is a perspective enlarged view of a contact element of a insulation displacement connector of the DSX module of Fig. 2;
Fig. 2b eine Teildraufsicht auf zwei Schneidklemm-2b is a partial plan view of two insulation displacement
Steckverbinder,Connectors,
Fig. 2c einen Querschnitt entlang der Schnittlinie B-B,2c shows a cross section along the section line B-B,
Fig. 2d einen Querschnitt entlang der Schnittlinie C-C,2d shows a cross section along the section line C-C,
Fig. 3 eine perspektivische Rückansicht des DSX-3 is a perspective rear view of the DSX
Moduls der Fig. 2 mit entfernten DSX-Buchsen;Module of Figure 2 with DSX sockets removed;
Fig. 4 eine Rückansicht des DSX-Moduls der FIG. 2;4 is a rear view of the DSX module of FIG. 2;
Fig. 5 eine Seitenansicht des DSX-Moduls der Fig. 2 mit entfernten DSX-Buchsen;Fig. 5 is a side view of the DSX module of Fig. 2 with DSX sockets removed;
Fig. 6 eine Vorderansicht des DSX-Moduls der Fig. 2 mit entfernten DSX-Buchsen und mit entfernten Schneidklemm-Steckverbindern;Fig. 6 is a front view of the DSX module of Fig. 2 with DSX sockets removed and with insulation displacement connectors removed;
Fig. 7 eine Vorderansicht eines Schneidklemm-7 is a front view of an insulation displacement
Steckverbinders des DSX-Moduls der Fig. 2;Connector of the DSX module of Fig. 2;
Fig. 8 eine Rückansicht des Schneidklemm-8 is a rear view of the insulation displacement
Steckverbinders der Fig. 7;Connector of Fig. 7;
Fig. 9A und 9B Schaltschemas ungeradzahliger und geradzahliger DSX-Buchseneinsätze des DSX- Moduls der Fig. 2; Fig. 10 eine perspektivische Vorderansicht eines DSX-Moduls in einer zweiten Ausführungsform;9A and 9B are schematic diagrams of odd and even DSX jack inserts of the DSX module of Fig. 2; 10 is a front perspective view of a DSX module in a second embodiment;
Fig. 11 eine perspektivische Rückansicht des DSX- Moduls der Fig. 10 mit entfernten DSX- Buchsen;11 is a rear perspective view of the DSX module of FIG. 10 with DSX sockets removed;
Fig. 12 eine Rückansicht des DSX-Moduls der Fig. 10;Fig. 12 is a rear view of the DSX module of Fig. 10;
Fig. 13 eine Seitenansicht des DSX-Moduls der Fig. 10 mit entfernten DSX-Buchsen;Fig. 13 is a side view of the DSX module of Fig. 10 with DSX sockets removed;
Fig. 14 eine Vorderansicht des DSX-Moduls der Fig. 10 mit entfernten DSX-Buchsen; undFIG. 14 is a front view of the DSX module of FIG. 10 with DSX sockets removed; FIG. and
Fig. 15A und 15B Schaltschemas ungeradzahliger und geradzahliger DSX-Buchseneinsätze des DSX- Moduls der Fig. 10.FIGS. 15A and 15B are schematic diagrams of odd-numbered and even-numbered DSX female inserts of the DSX module of FIG. 10.
In der Fig. 2 ist ein erste Ausführungsform eines DSX-Moduls 34 perspektivisch dargestellt.2, a first embodiment of a DSX module 34 is shown in perspective.
Das DSX-Modul 34 enthält eine Buchsen-Aufnahme 35 zur Aufnahme von mehreren Buchsen 36, 38 (z.B. zwei ungeradzahligen Buchsen 36 und zwei geradzahligen Buchsen 38). Das DSX-Modul 34 besitzt ein von vorne zugängliches Rangierfeld 40 und ein von vorne zugängliches Geräteanschlussfeld 42 (d.h. IN-/OUT-). Die Anschlussfelder 40, 42 werden jeweils durch zwei Schneidklemm-Steckverbinder 41 gebildet und enthalten jeweils Felder (z.B. Matrizen, Reihen, Spalten oder andere Gruppen) von Kontaktelementen 43 zum Anschließen von Drähten am DSX-Modul 34. Die Kontaktelemente 43 werden in Gehäusen 45 an den Anschlussfeldern 40, 42 getragen. Die Gehäuse 45 sind an einem an der Vorderseite des DSX-Moduls 34 befestigten vorderen Deckstück 49 anmontiert. Das vordere Deckstück 49 bedeckt eine Vorderseite einer Leiterplatte 124, die elektrische Verbindungen zwischen den Buchsen 36 und 38 und den Schneidklemm-Steckverbindern 41 der Anschlussfelder 40, 42 bereitstellt. Durch ein dielektrisches rückwärtiges Deckstück 126 wird eine Hinterseite der Leiterplatte 124 bedeckt.The DSX module 34 includes a jack receptacle 35 for receiving a plurality of jacks 36, 38 (e.g., two odd-numbered jacks 36 and two even-numbered jacks 38). The DSX module 34 has a front-accessible patch panel 40 and a front-panel device port 42 (i.e., IN / OUT). The pads 40, 42 are each formed by two insulation displacement connectors 41 and each contain arrays (eg, arrays, rows, columns or other groups) of contact elements 43 for connecting wires to the DSX module 34. The contact elements 43 are housed in housings 45 the connection pads 40, 42 worn. The housings 45 are mounted on a front cover 49 fixed to the front of the DSX module 34. The front cover piece 49 covers a front side of a circuit board 124 that provides electrical connections between the sockets 36 and 38 and the insulation displacement connectors 41 of the pads 40, 42. By a dielectric rear cover piece 126, a rear side of the printed circuit board 124 is covered.
Wenn das DSX-Modul 34 zusammengebaut ist, werden Halter 127 dazu benutzt, die Buchsen-Aufnahme 35 und das vordere Deckstück 49 mit dem hinteren Deckstück 126 zusammenzukuppeln. Im zusammengebauten Zustand ist die Leiterplatte 124 zwischen der durch die Buchsen-Aufnahme 35 und das vordere Deckstück 49 gebildeten Vorderstruktur und der durch das hintere Deckstück 126 gebildeten hinteren Struktur positioniert. Die Halter 127' können auch zur weiteren Sicherung der Leiterplatte 124 an dem hinteren Deckstück 126 benutzt werden.When the DSX module 34 is assembled, retainers 127 are used to secure the female receptacle 35 and the front cover 49 to the coupling rear deck 126 together. In the assembled state, the printed circuit board 124 is positioned between the front structure formed by the female receptacle 35 and the front cover piece 49 and the rear structure formed by the rear cover piece 126. The holders 127 ' may also be used to further secure the printed circuit board 124 to the rear decking 126.
Es versteht sich, dass das DSX-Modul 34 vorzugsweise in einem Chassis aufgenommen werden kann (ein Chassis 32 ist schematisch in den FIG. 9A und 9B dargestellt. Um herkömmlichen internationalen Standards zu entsprechen, kann das Chassis eine Länge von circa 48 cm aufweisen. Diese Ausführungsform kann beispielsweise 16 DSX-Module unterbringen. Als Alternative könnte das Chassis entsprechend standardmässigen US- Spezifikationen mit einer Länge von circa 58,5 cm aufgebaut sein. Diese Ausführungsform kann beispielsweise 21 DSX-Module unterbringen. Natürlich könnten auch andere Chassisgrössen und andere Anzahlen von DSX-Modulen benutzt werden. Ein beispielhaftes Chassis ist in US-Patent Nr. 6,840,815 offenbart, das hierdurch in seiner Gesamtheit durch Bezugnahme aufgenommen wird.It will be appreciated that the DSX module 34 may preferably be received in a chassis (a chassis 32 is shown schematically in Figures 9A and 9B.) To conform to conventional international standards, the chassis may be approximately 48 cm in length. For example, this embodiment may accommodate 16 DSX modules, or alternatively, the chassis could be constructed in accordance with US standard specifications approximately 58.5 cm in length This embodiment may, for example, house 21 DSX modules, of course other chassis sizes and other numbers An exemplary chassis is disclosed in U.S. Patent No. 6,840,815, which is hereby incorporated by reference in its entirety.
a. Buchsen-Aufnahmea. Socket receptacle
Die Buchsen-Aufnahme 35 jedes DSX-Moduls 34 kann vorzugsweise die ungeradzahligen und geradzahligen DSX-Buchsen 36 und 38 abnehmbar aufnehmen. Beispielsweise können die Buchsen 36 und 38 wie in US- Patent Nr. 6,116,961 beschrieben durch federnde Riegel 37 in der Buchsen-Aufnahme 35 festgehalten werden. Durch Aufbiegen der Riegel 37 können die Buchsen 36 und 38 von Hand aus der Buchsen-Aufnahme 35 entfernt werden. Wenn die Buchsen 36 und 38 aus der Buchsen- Aufnahme 35 entfernt werden, werden die Buchsen 36 und 38 elektrisch von der Leiterplatte 124 abgetrennt. Obwohl das DSX-Modul 34 als „Viererpaket" (d.h. ein Modul mit vier Buchsen) dargestellt ist, versteht es sich, dass alternative Module Buchsen-Aufnahmen enthalten können, die für die Aufnahme von mehr oder weniger als vier Buchsen bemessen sind.The female receptacle 35 of each DSX module 34 may preferably removably receive the odd and even DSX sockets 36 and 38. For example, as described in U.S. Patent No. 6,116,961, bushings 36 and 38 may be retained in bushing receptacle 35 by resilient latches 37. By bending the latch 37, the sockets 36 and 38 can be manually removed from the socket receptacle 35. When the sockets 36 and 38 are removed from the socket receptacle 35, the sockets 36 and 38 are electrically disconnected from the circuit board 124. Although the DSX module 34 is shown as a "quad package" (i.e., a four socket module), it will be understood that alternative modules may include socket receptacles sized to accommodate more or fewer than four jacks.
Die Buchsen-Aufnahme 35 jedes DSX-Moduls 34 enthält eine Mehrzahl von (in Fig. 2 gezeigten) weiteren Buchsen 136 zur Bereitstellung von elektrischen Schnittstellen zu den Buchsen 36, 38 wenn die Buchsen 36, 38 in den Buchsen-Aufnahmen 35 montiert sind. Die Buchsen 136 halten elektrische Kontakte 137 mit Stiften, die elektrisch direkt mit der Leiterplatte 124 verbunden sind.The female receptacle 35 of each DSX module 34 includes a plurality from further sockets 136 (shown in FIG. 2) for providing electrical interfaces to the sockets 36, 38 when the sockets 36, 38 are mounted in the socket receivers 35. The jacks 136 hold electrical contacts 137 with pins that are electrically connected directly to the printed circuit board 124.
b. DSX-Buchsenb. DSX sockets
Bezugnehmend auf Fig. 2 enthalten die Buchsen 36, 38 jeweils eine Frontfläche, die einen OUT-Anschluss 128, einen MONITOR-OUT- Anschluss 129, einen IN-Anschluss 130 und einen MONITOR-IN- Anschluss 131 definieren. Die Anschlüsse 128-131 sind zur Aufnahme von A/B-Steckern bemessen. Die Buchsen 36, 38 definieren auch LED- Anschlüsse 132 zur Aufnahme von Signalverfolgungslampen. Die Buchsen 36, 38 enthalten weiterhin elektrische Kontakte 133 (siehe Figuren 9A und 9B), die jeweils den Anschlüssen 128-132 zugeordnet sind. Die Kontakte 133 enthalten Endstücke 134, die nach hinten aus jedem der Buchsen 36, 38 hervorstehen. Wenn die Buchsen 36, 38 in die Buchsen-Aufnahme 35 eingesteckt werden, gleiten die Endstücke 134 der Kontakte 133 in die Buchsen 136 des DSX-Moduls 34, um elektrische Verbindungen zwischen der Leiterplatte 124 und den Buchsen 36, 38 herzustellen. Wenn die Buchsen 36, 38 aus der Buchsen-Aufnahme 35 entfernt werden, werden die Buchsen 36, 38 elektrisch von der Leiterplatte 124 abgetrennt.Referring to FIG. 2, the jacks 36, 38 each include a front surface defining an OUT port 128, a MONITOR OUT port 129, an IN port 130, and a MONITOR IN port 131. Terminals 128-131 are sized to accept A / B plugs. The sockets 36, 38 also define LED ports 132 for receiving signal tracking lamps. The sockets 36, 38 further include electrical contacts 133 (see FIGS. 9A and 9B) associated with the terminals 128-132, respectively. The contacts 133 include end pieces 134 that protrude rearward from each of the sockets 36, 38. When the sockets 36, 38 are inserted into the socket receptacle 35, the end pieces 134 of the contacts 133 slide into the sockets 136 of the DSX module 34 to make electrical connections between the circuit board 124 and the sockets 36, 38. When the sockets 36, 38 are removed from the socket receptacle 35, the sockets 36, 38 are electrically disconnected from the circuit board 124.
Bezugnehmend auf die Figuren 9A und 9B umfassen die elektrischen Kontakte der Buchsen 36, 38 Spannungskontakte -48V, Signalverfolgungslampenkontakte TL und Rückführungskontakte RET, die den LED-Schaltungen zugeordnet sind. Auch enthalten die elektrischen Kontakte a-Federn T und b-Federn R entsprechend den Anschlüssen MONITOR-IN und MONITOR-OUT. Die elektrischen Kontakte enthalten weiterhin a-Eingangskontakte Tl, b-Eingangskontakte Rl, Rangierver- bindungs-a-Eingangskontakte XT1 und Rangierverbindungs-b- Eingangskontakte XRI entsprechend den IN-Anschlüssen. Die elektrischen Kontakte enthalten weiterhin a-Ausgangskontakte TO, b-Ausgangskontakte RO, Querverbindungs-a-Ausgangskontakte XTO und Querverbindungs-b- Ausgangskontakte XRO entsprechend den OUT-Anschlüssen. Die Kontakte funktionieren auf die gleiche Weise wie im US-Patent Nr. 6,116,961 beschrieben, das oben durch Bezugnahme aufgenommen wurde. Die Kontakte Tl1 Rl, XTI und XRI und die Kontakte TO, RO, XTO und XRO wirken zusammen, um Öffnungsschalter zu definieren.Referring to Figs. 9A and 9B, the electrical contacts of the sockets 36, 38 include voltage contacts -48V, signal trace lamp contacts TL and return contacts RET associated with the LED circuits. Also, the electrical contacts include a-springs T and b-springs R corresponding to the MONITOR-IN and MONITOR-OUT terminals. The electrical contacts further include a input contacts Tl, b input contacts Rl, jumpering a input contacts XT1, and jumper connection b input contacts XRI corresponding to the IN terminals. The electrical contacts further include a output contacts TO, b output contacts RO, cross connection a output contacts XTO and cross connection b output contacts XRO corresponding to the OUT terminals. The Contacts function in the same manner as described in US Pat. No. 6,116,961, which is incorporated herein by reference. The contacts Tl 1 Rl, XTI and XRI and the contacts TO, RO, XTO and XRO cooperate to define opening switches.
c. Leiterplatte und Hinterstückc. PCB and back piece
Nach der Darstellung in Fig. 2 ist die Leiterplatte 124 direkt hinter der Buchsen-Aufnahme 35, dem Rangieranschlussfeld 40 und dem Geräteanschlussfeld 42 positioniert. Die Leiterplatte 124 enthält einen ersten Teil 124a, der der Rückseite der Buchsen-Aufnahme 35 zugeordnet ist. Der erste Teil 124a enthält eine Mehrzahl von durchkontaktierten Löchern 139, die die Stifte der elektrische Kontakte 137 aufnehmen, um eine direkte elektrische Verbindung zwischen der Leiterplatte 124 und den elektrische Kontakten 137 herzustellen.As shown in FIG. 2, the printed circuit board 124 is positioned directly behind the female receptacle 35, the patch panel 40 and the device connector panel 42. The printed circuit board 124 includes a first portion 124a associated with the rear of the female receptacle 35. The first portion 124a includes a plurality of plated-through holes 139 that receive the pins of the electrical contacts 137 to establish a direct electrical connection between the printed circuit board 124 and the electrical contacts 137.
Auch enthält die Leiterplatte 124 einen zweiten Teil 124b, der hinter dem Rangieranschlussfeld 40 und erstreckungsgleich damit positioniert ist. Der zweite Teil 124b enthält eine Mehrzahl von durchkontaktierten Löchern 146, die Stift-Kontakte 53 der Kontaktelemente 43 der am Rangieranschlussfeld 40 montierten Schneidklemm-Steckverbinder 41 aufnehmen. Dadurch wird eine elektrische Verbindung zwischen der Leiterplatte 124 und den Schneidklemm-Steckverbinder 41 des Rangieranschlussfelds 40 hergestellt.Also, the circuit board 124 includes a second portion 124b positioned behind the patch panel 40 and coextensive therewith. The second part 124b includes a plurality of through holes 146 that receive pin contacts 53 of the contact elements 43 of the insulation displacement connector 41 mounted on the patch panel 40. As a result, an electrical connection is made between the printed circuit board 124 and the insulation displacement connector 41 of the patch panel 40.
Weiterhin enthält die Leiterplatte 124 einen dritten Teil 124c, der hinter dem Geräteanschlussfeld 42 und erstreckungsgleich damit positioniert ist. Der dritte Teil 124c enthält eine Mehrzahl von durchkontaktierten Löchern 148, die Stift-Kontakte 53 der Kontaktelemente 43 der am Geräteanschlussfeld 42 montierten Schneidklemm-Steckverbinder 41 aufnehmen, um eine elektrische Verbindung zwischen der Leiterplatte 124 und den Schneidklemm-Steckverbinder 41 herzustellen.Furthermore, the printed circuit board 124 includes a third portion 124c which is positioned behind the device connector panel 42 and equidistant therewith. The third part 124c includes a plurality of through holes 148 which receive pin contacts 53 of the contact elements 43 of the insulation displacement connector 41 mounted on the device connector panel 42 to establish electrical connection between the circuit board 124 and the insulation displacement connector 41.
Das hintere Deckstück 126 des DSX-Moduls 34 ist vorzugsweise aus einem dielektrischen Werkstoff hergestellt und zum Bedecken der Rückseite der Leiterplatte 124 bemessen. Das Deckstück 126 definiert einen Stecker 82 zum elektrischen Verbinden mit einer Aufnahme 83 (siehe Schaltschema in den Figuren 9A und 9B) des Chassis 32, wenn das DSX-Modul 34 im Chassis 32 montiert ist. Die Stecker 82 enthalten b- Erdstifte 88, Strom-/Spannungsstifte 90 und Stromrückführungsstifte 92, die mit der Chassis-b-Erde, dem Chassis-Strom bzw. der Chassis- Stromrückleitung verbunden sind (siehe Figuren 9A und 9B). Die Stifte 88, 90 und 92 sind direkt mit der Leiterplatte 124 verbunden (z.B. erstrecken die Stifte sich in den durch die Leiterplatte 124 definierten durchkontaktierten Löchern 93).The back cover 126 of the DSX module 34 is preferably made of a dielectric material and sized to cover the back of the circuit board 124. The cover piece 126 defines a plug 82 for electrically connecting to a receptacle 83 (see schematic diagram in FIGS. 9A and 9B) of the chassis 32 when the DSX module 34 is mounted in the chassis 32. The plugs 82 include b grounding pins 88, power / voltage pins 90, and power return pins 92 connected to the chassis b ground, the chassis power, and the chassis power return, respectively (see FIGS. 9A and 9B). The pins 88, 90 and 92 are directly connected to the printed circuit board 124 (eg, the pins extend into the through holes 93 defined by the printed circuit board 124).
Noch auf Figuren 9A und 9B bezugnehmend enthält die Leiterplatte 124 Bahnen 290, die die Kontaktelemente 43 des Schneidklemm- Steckverbinders 41 des Geräteanschlussfelds 42 elektrisch mit Buchsenteilen verbinden, die den Kontakten Tl, Rl, TO und RO der Buchsen 36, 38 zugeordnet sind. Auch enthält die Leiterplatte 124 Bahnen 292, die elektrische Verbindungen zwischen den Kontaktelementen 43 der Schneidklemm-Steckverbinder 41 des Rangieranschlussfelds 40 und Buchsenteilen bereitstellen, die den Kontakten XTI, RTI, XTO und XRO der Buchsen 36, 38 zugeordnet sind. Zusätzlich enthält die Leiterplatte 124 Bahnen 294 zum elektrischen Verbinden von Bahnen 290 mit den Buchsenteilen, die den Kontakten der MONITOR-Anschlüsse der Buchsen 36, 38 zugeordnet sind. Weiterhin enthält die Leiterplatte 124 Bahnen 296 zum Verbinden der b-Erdstifte 88 mit Buchsenteilen, die den b-Erdkontakten SG der Buchsen 36,38 zugeordnet sind; Bahnen 298 zum Verbinden der Signalverfolgungslampen-IDC des Rangieranschlusses 40 mit Buchsenteilen, die den Signalverfolgungslampenkontakten TL der Buchsen 36, 38 zugeordnet sind; Bahnen 100 zum Verbinden von Strom-/ Spannungsstifte 90 mit Buchsenteilen, die den Spannungskontakten -48V der Buchsen 36, 38 zugeordnet sind; und Bahnen 102 zum Verbinden von Stromrückführungsstiften 92 mit Buchsenteilen, die den Rückführungskontakten RET der Buchsen 36, 38 zugeordnet sind.Still referring to FIGS. 9A and 9B, the printed circuit board 124 includes traces 290 that electrically connect the contact elements 43 of the insulation displacement connector 41 of the device connector panel 42 to receptacles associated with the contacts Tl, Rl, T0 and R0 of the sockets 36,38. Also, the circuit board 124 includes traces 292 that provide electrical connections between the contact elements 43 of the insulation displacement connectors 41 of the patch panel 40 and receptacles associated with the contacts XTI, RTI, XTO, and XRO of the sockets 36, 38. In addition, the circuit board 124 includes traces 294 for electrically connecting traces 290 to the receptacle portions associated with the contacts of the MONITOR terminals of the sockets 36,38. Further, the circuit board 124 includes traces 296 for connecting the b grounding pins 88 to receptacles associated with the b ground contacts SG of the sockets 36, 38; Paths 298 for connecting the signal-tracking lamp IDC of the jumper terminal 40 to female parts associated with the signal-tracking lamp contacts TL of the jacks 36, 38; Webs 100 for connecting power / voltage pins 90 to receptacles associated with the voltage contacts -48V of the sockets 36, 38; and tracks 102 for connecting current return pins 92 to female parts associated with the return contacts RET of the sockets 36,38.
d. Kontaktelemented. contact elements
Das Kontaktelement 43 ist aus einem leitfähigen Werkstoff, wie beispielsweise einem Metallwerkstoff hergestellt. Bei gewissen Ausführungsformen können die Kontaktelemente 43 aus Blech gestanzt sein. Wie in der Fig. 2A dargestellt enthält jedes Kontaktelement 43 ein Paar Schneidklemmesser 51 , die den eigentlichen Schneidklemm-Kontakt 54 bilden. Zwischen den Schneidklemmessern 51 wird ein Kontaktschlitz 52 gebildet. Die Schneidklemmesser 51 sind so konfiguriert, dass wenn eine isolierte Kabelader in den Kontaktschlitz 52 zwischen die Schneidklemmesser 51 eingeschoben wird, die Schneidklemmesser 51 durch die Isolierung der Kabelader hindurch und in den leitenden Kern der Ader einschneiden, um eine elektrische Verbindung zwischen dem leitenden Kern der Kabelader und dem Kontaktelement 43 herzustellen. Am gegenüberliegenden Ende des Schneidklemm-Kontaktes 54 ist ein Stift-Kontakt 53 angeordnet, der zum Verbinden des Kontaktelementes 43 mit der Leiterplatte 124 dient. Unterhalb des Schneidklemm-Kontaktes 54 ist ein Führungselement 56 angeordnet, das eine rechteckige Form aufweist, wobei das Führungselement 56 breiter als der Schneidklemm- Kontakt 54 ist. Ferner besitzt der Kontaktelement 43 eine erste Verlängerung 55 und eine zweite Verlängerung 58, die den Schneidklemm- Kontakt 54 elektrisch mit dem Stift-Kontakt 53 verbinden. Durch die Verlängerungen 55, 58 werden die Schneidklemm-Kontakte 54 von der Leiterplatte 124 versetzt, um ein Zugreifen auf die Schneidklemm- Steckverbinder 41 mit einem nicht dargestellten Anschlusswerkzeug zu erleichtern. Bei gewissen beispielhaften Ausführungsformen weisen die Verlängerungen 55, 58 Versatzlängen OL (d.h. die Längen, die dem Abstand entsprechen, um den die Schneidklemm-Kontakte 54 von der Leiterplatte versetzt sein werden) von mindestens 1 cm oder Längen im Bereich von 1-3 Zentimeter auf. Die zweite Verlängerung 58 dient dazu, den Stift-Kontakt 53 durch das Deckstück 49, 49' zu führen. Zwischen der ersten Verlängerung 55 und der zweiten Verlängerung 58 sind seitlich zwei bogenförmige Elemente 57 angeordnet, die einerseits das Kontaktelement 43 auf dem Deckstück 49, 49' abstützen, wobei die bogenförmigen Elemente 57 selbst im Gehäuse 45 abgestützt sind, so dass die Lage des Kontaktelementes 43 fixiert ist. Die beiden bogenförmigen Elemente 57 sind dabei zueinander gegensinnig gebogen.The contact element 43 is made of a conductive material, such as a metal material. For certain Embodiments, the contact elements 43 may be stamped from sheet metal. As shown in FIG. 2A, each contact element 43 includes a pair of cutting blades 51 which form the actual insulation displacement contact 54. Between the cutting blade diameter 51, a contact slot 52 is formed. The cutting edge knives 51 are configured so that when an insulated cable core is inserted into the contact slot 52 between the cutting blade 51, the cutting edge blades 51 cut through the insulation of the cable core and into the conductive core of the wire to provide an electrical connection between the conductive core of the core Cable core and the contact element 43 produce. At the opposite end of the insulation displacement contact 54, a pin contact 53 is arranged, which serves for connecting the contact element 43 to the printed circuit board 124. Below the insulation displacement contact 54, a guide member 56 is arranged, which has a rectangular shape, wherein the guide member 56 is wider than the insulation displacement contact 54. Further, the contact member 43 has a first extension 55 and a second extension 58 which electrically connect the insulation displacement contact 54 to the pin contact 53. By the extensions 55, 58, the insulation displacement contacts 54 are offset from the circuit board 124 to facilitate accessing the insulation displacement connector 41 with a connection tool, not shown. In certain exemplary embodiments, the extensions 55, 58 have offset lengths OL (ie, the lengths corresponding to the distance that the IDC contacts 54 will be offset from the PCB) of at least 1 cm or lengths in the range of 1-3 centimeters , The second extension 58 serves to guide the pin contact 53 through the cover piece 49, 49 '. Arranged laterally between the first extension 55 and the second extension 58 are two arcuate elements 57 which, on the one hand, support the contact element 43 on the cover piece 49, 49 ', the arcuate elements 57 themselves being supported in the housing 45, so that the position of the contact element 43 is fixed. The two arcuate elements 57 are bent in opposite directions to each other.
e. IDC-Gehäusee. IDC housing
Bezugnehmend auf die Figuren 2, 2b-d, 5, 7 und 8 weisen die Gehäuse 45 allgemein rechteckige Formen auf und enthalten Fußenden bzw. Unterseiten 61 und Drahtanschlussenden bzw. Oberseiten 63. Die Oberseite 63 definiert Schlitze 65 (siehe Fig. 7) zur Aufnahme von anzuschließenden Drähten. Die Schlitze sind entlang paralleler Linien L ausgerichtet, so dass sich die Drähte wenn angeschlossen über die Breite des Gehäuses 45 erstrecken. In der Fig. 7 ist die Oberseite 63 des Schneidklemm-Steckverbinders 41 dargestellt. Das Gehäuse 45 umfasst Klemmstege 64, zwischen denen sich Schlitze 65 für die anzuschließenden Adern bilden. Im Winkel von 45° zu den Schlitzen 65 sind die Schneidklemmmesser 51 der Schneidklemm-Kontakte 54 angeordnet. Die Kontaktelemente 43 werden von der Unterseite 61 in das Gehäuse 45 eingeschoben, wobei in Fig. 7 und 8 der Zustand mit eingesteckten Kontaktelementen 43 dargestellt ist. Dabei erkennt man die Führungselemente 56 und das bogenförmige Element 57. Die Führungselemente 56 liegen dabei in einer Nut 70, wobei jeweils eine Außenkante des Führungselementes in einer anderen Nut 70 liegt. Wie besonders gut in Fig. 2c zu erkennen ist, erstreckt sich die Nut 70 von der Unterseite des Gehäuses 45 bis in den Bereich, wo der Schneidklemm- Kontakt 54 liegt. In die Wände, die die Nut 70 begrenzen, sind Schlitze 71 eingebracht, in denen die bogenförmigen Elemente 57 liegen. Die Länge der Schlitze entspricht der Länge der bogenförmigen Elemente 57, so dass diese an eine Kante 72 im Gehäuse 45 anschlagen. Des Weiteren sind Rastnasen 69 (siehe Fig. 8) zu erkennen, mittels derer die Schneidklemm- Steckverbinder mit den Aufnahmen verrastbar sind.Referring to Figures 2, 2b-d, 5, 7 and 8, the housings 45 generally rectangular shapes and include bottom surfaces 61 and wire terminal ends or tops 63. The top surface 63 defines slots 65 (see Fig. 7) for receiving wires to be connected. The slots are aligned along parallel lines L so that the wires extend across the width of the housing 45 when connected. In Fig. 7, the top 63 of the insulation displacement connector 41 is shown. The housing 45 comprises clamping webs 64, between which slots 65 are formed for the wires to be connected. At an angle of 45 ° to the slots 65, the cutting knives 51 of the insulation displacement contacts 54 are arranged. The contact elements 43 are inserted from the bottom 61 in the housing 45, wherein in Fig. 7 and 8, the state with inserted contact elements 43 is shown. In this case, one recognizes the guide elements 56 and the arcuate element 57. The guide elements 56 lie in a groove 70, wherein in each case one outer edge of the guide element lies in a different groove 70. As can be seen particularly well in Fig. 2c, the groove 70 extends from the bottom of the housing 45 to the area where the insulation displacement contact 54 is located. In the walls that define the groove 70, slots 71 are introduced, in which the arcuate elements 57 lie. The length of the slots corresponds to the length of the arcuate elements 57, so that they abut against an edge 72 in the housing 45. Furthermore, locking lugs 69 (see FIG. 8) can be recognized by means of which the insulation displacement connectors can be latched to the receptacles.
Die Schneidklemm-Steckverbinder 41 am Rangieranschlussfeld 40 sind die gleichen wie die am Geräteanschlussfeld 42, nur weist jedes Gehäuse 45 am Geräteanschlussfeld 42 zwei Kontaktelemente 43 weniger auf. Am Rangieranschlussfeld 40 sind mehr Kontaktelemente 43 vorgesehen, um Anschlussdrähte zum Verbinden von Signalverfolgungslichtschaltungen aufzunehmen, die zur Verfolgung der Rangierverbindungen benutzt werden.The insulation displacement connectors 41 on the patch panel 40 are the same as those on the device connector panel 42, but each housing 45 on the device connector panel 42 has two fewer contact elements 43. At the jumper panel 40, more contact elements 43 are provided to receive lead wires for connecting signal tracking light circuits used to track the jumper connections.
f. Vorderes Deckstückf. Front cover piece
Bezugnehmend auf Figuren 2, 5 und 6 kann das vordere Deckstück 49 eine einstückige Bauweise aus einem dielektrischen Werkstoff wie beispielsweise Kunststoff aufweisen. Bei der dargestellten Ausführungsform enthält das Deckstück 49 eine Plattform 220 und vier Tragstrukturen 222, die von der Plattform 220 aus nach vorne vorstehen. Jede der Tragstrukturen 222 enthält zwei Seitenwände 224, obere und untere Wände 225, 226 und eine Rückwand 227. Die Wände 224-227 definieren rechteckige Aufnahmen 230, die zur Aufnahme der Unterseite 61 der Gehäuse 45 bemessen sind. Die Seitenwände 224 definieren Öffnungen 232 zur Aufnahme der Rastnasen 69 der Gehäuse 45, um Einschnappverbindungen bereitzustellen, die die Gehäuse 45 in den Aufnahmen festhalten. Die Rückwände 227 definieren Öffnungen 234 zur Aufnahme der Stift-Kontakte 53 der Kontaktelemente 43, wenn die Gehäuse 45 in den Aufnahmen 230 gesichert sind. Die durch die Rückwände 227 der am Rangieranschlussfeld 40 befindlichen Aufnahmen definierten Öffnungen 234 sind vorzugsweise zur den am zweiten Teil 124b der Leiterplatte 124 befindlichen durchkontaktierten Löchern 146 ausgerichtet. Die durch die Rückwände 227 der am Rangieranschlussfeld 40 befindlichen Aufnahmen definierten Öffnungen 234 sind vorzugsweise zu den am zweiten Teil 124b der Leiterplatte 124 befindlichen durchkontaktierten Löchern 148 ausgerichtet.Referring to Figures 2, 5 and 6, the front cover piece 49 have a one-piece construction of a dielectric material such as plastic. In the illustrated embodiment, the cover piece 49 includes a platform 220 and four support structures 222 that project forward from the platform 220. Each of the support structures 222 includes two side walls 224, upper and lower walls 225, 226, and a rear wall 227. The walls 224-227 define rectangular receptacles 230 sized to receive the underside 61 of the housings 45. The side walls 224 define openings 232 for receiving the detents 69 of the housings 45 to provide snap-fit connections that retain the housings 45 in the receptacles. The back walls 227 define openings 234 for receiving the pin contacts 53 of the contact elements 43 when the housings 45 are secured in the receptacles 230. The apertures 234 defined by the rear walls 227 of the receptacles located on the patch panel 40 are preferably aligned with the plated-through holes 146 located on the second portion 124b of the printed circuit board 124. The openings 234 defined by the rear walls 227 of the mating connection field 40 are preferably aligned with the plated-through holes 148 located on the second part 124 b of the printed circuit board 124.
II. Benutzung des DSX-SystemsII. Using the DSX system
Es versteht sich, dass das DSX-System 30 auf die gleiche Weise wie ein herkömmliches DSX-System funktioniert. Durch die (IN-/OUT-Blöcke) Geräteanschlussfeld 42 können die Buchsen 36, 38 mit Digitaleinrichtungen verbunden werden. Durch das Rangieranschlussfeld 40 können die Buchsen 36, 38 durch semipermanente Leitungsbrücken miteinander verbunden werden. Die Buchsen 36, 38 stellen Öffnungsverbindungen zwischen den mit dem Geräteanschlussfeld 42 verbundenen digitalen Einrichtungen und dem Rangieranschlussfeld 40 bereit. Durch Einfügen von Steckern in die MONITOR-Anschlüsse der Buchsen 36, 38 können die Buchsen 36, 38 durchlaufende Signale ohne Unterbrechung der Signale überwacht werden. Mit den Signalverfolgungslampenschaltungen können die überwachten rangierten Verbindungen wie im US-Patent Nr. 6,116,961 beschrieben verfolgt werden. In die IN- oder OUT-Anschlüsse der Buchsen 36, 38 können Stecker für Prüf- oder Diagnosezwecke oder zum Umleiten von Signalen zu anderen Digitaleinrichtungen eingesteckt werden.It should be understood that the DSX system 30 functions in the same manner as a conventional DSX system. Through the (IN / OUT blocks) device connector panel 42, the jacks 36, 38 can be connected to digital devices. The jumper connection field 40 allows the sockets 36, 38 to be connected to each other by semi-permanent cable bridges. The sockets 36, 38 provide opening connections between the digital devices connected to the device connector panel 42 and the jumper interface 40. By inserting plugs into the MONITOR terminals of the jacks 36, 38, the jacks 36, 38 can be monitored for continuous signals without interrupting the signals. With the signal tracking lamp circuits, the monitored routed connections can be tracked as described in U.S. Patent No. 6,116,961 become. Plugs may be plugged into the IN or OUT terminals of the jacks 36, 38 for testing or diagnostic purposes or to redirect signals to other digital devices.
III. Alternative AusführungsformIII. Alternative embodiment
Figuren. 10-15B zeigen ein weiteres DSX-Modul 34' mit Merkmalen, die Beispiele von erfindungsgemässen Aspekten gemäss den Grundsätzen der vorliegenden Offenbarung sind. Viele der Bestandteile des DSX-Moduls 34' sind mit Bestandteilen des DSX-Moduls 34 identisch. Diesen identischen Bestandteilen sind identische Bezugsziffern zugewiesen worden.Characters. 10-15B show another DSX module 34 'having features that are examples of aspects of the invention in accordance with the principles of the present disclosure. Many of the components of the DSX module 34 'are identical to components of the DSX module 34. Identical reference numbers have been assigned to these identical components.
Das DSX-Modul 34' besitzt dieselben Grundbestandteile wie das DSX- Modul 34, nur ist das Geräteanschlussfeld 42 zur Rückseite des Moduls verlegt worden. Um dieser Änderung Rechnung zu tragen, enthält das DSX-Modul 34' eine verkürzte Leiterplatte 124' mit einer größeren Dichte von durchkontaktierten Löchern zum Verbinden der Schneidklemm- Steckverbinder 41 der Anschlussfelder 40, 42 der Leiterplatte 124'. Auch enthält das DSX-Modul 34' ein rückwärtiges Deckstück 126', das verkürzt und abgeändert worden ist, um Aufnahmen 230 einzuschließen, die die Schneidklemm-Steckverbinder 41 aufnehmen, die das an der Rückseite des Moduls 34' befindliche Geräteanschlussfeld 42 definieren. Darüber hinaus enthält das DSX-Modul 34' ein vorderes Deckstück 49', das verkürzt und abgeändert worden ist, um den unteren Satz Aufnahmen 230 zu eliminieren.The DSX module 34 'has the same basic components as the DSX module 34, only the device connector panel 42 has been routed to the back of the module. To accommodate this change, the DSX module 34 'includes a shortened printed circuit board 124' having a greater density of plated-through holes for connecting the insulation displacement connectors 41 of the pads 40, 42 of the printed circuit board 124 '. Also, the DSX module 34 'includes a back cover 126' that has been shortened and modified to include receptacles 230 that receive the insulation displacement connectors 41 that define the device interface 42 located at the back of the module 34 '. In addition, the DSX module 34 'includes a front cover piece 49' which has been shortened and modified to eliminate the lower set of receptacles 230.
Obgleich der offenbarte Schneidklemm-Montageaufbau als in Kombination mit einem DSX-Modul benutzt dargestellt worden ist, versteht es sich, dass der Aufbau an jeder Art DSX-System (modular oder nichtmodular) angewandt werden kann. Darüberhinaus ist der Schneidklemm- Montageaufbau auch auf jeder Art von auf Leiterplatte befestigter Schneidklemm-Anwendung anwendbar.Although the disclosed insulation displacement mounting structure has been illustrated as being used in combination with a DSX module, it will be understood that the structure can be applied to any type of DSX system (modular or non-modular). Moreover, the insulation displacement mounting structure is also applicable to any type of board-mounted insulation displacement application.
Die Anschlussfelder 40, 42 sind jeweils als Schneidklemm-Steckverbinder 41 dargestellt worden. Unabhängig davon, ob die Anschlussfelder 40, 42 beide von der Vorderseite oder das Geräteanschlussfeld 42 von der Rückseite her zugänglich ist, können auch gemischte Aufbauten Anwendung finden. So kann beispielsweise ein Anschlussfeld als Schneidklemm-Steckverbinder 41 und das andere Anschlussfeld als Koaxial-Steckverbinder, beispielsweise als Balun-, M4-, 1.0/2.3-, 1.6/5-6-, SMB-oder Type 43-Koaxial-Steckverbinder oder als RJ-Steckverbinder, insbesondere RJ 45-Steckverbinder (geschirmt oder ungeschirmt), ausgebildet sein. Dabei ist vorzugsweise das Rangierfeld 40 als Schneidklemm-Steckverbinder 41 ausgebildet und das Geräteanschlussfeld 42 als Koaxial- oder RJ-Steckverbinder ausgebildet. Daneben sind noch andere Steckverbinder-Typen wie beispielsweise D-Sub möglich.The connection pads 40, 42 have each been shown as insulation displacement connectors 41. Regardless of whether the connector panels 40, 42 are both from the front or the device connector panel 42 of the Reverse accessible, mixed structures can also be applied. Thus, for example, a terminal box as insulation displacement connector 41 and the other terminal box as a coaxial connector, such as Balun, M4, 1.0 / 2.3, 1.6 / 5-6, SMB or Type 43 coaxial connector or as RJ plug connectors, in particular RJ 45 plug connectors (shielded or unshielded), may be formed. In this case, the patch panel 40 is preferably designed as insulation displacement connector 41 and the device connection field 42 is formed as a coaxial or RJ connector. In addition, other connector types such as D-Sub are possible.
Insbesondere bei der Ausführungsform mit dem Rangierfeld 40 an der Vorderseite und dem Geräteanschlussfeld 42 an der Rückseite kann der Schneidklemm-Steckverbinder 41 auch durch einen Wire-Wrap-Verbinder ersetzt werden, der dann vorzugsweise am Rangierfeld 40 zur Anwendung kommt, wohingegen das Geräteanschlussfeld 42 beispielsweise mit einem Koaxial- oder RJ-Steckverbinder ausgebildet ist, wobei im Übrigen auf die vorangegangenen Ausführungen zum DSX-Modul mit Schneidklemm- Steckverbinder Bezug genommen wird. In particular, in the embodiment with the patch panel 40 at the front and the device patch panel 42 at the back of the insulation displacement connector 41 can also be replaced by a wire-wrap connector, which is then preferably used on the patch panel 40, whereas the device connector panel 42, for example is formed with a coaxial or RJ connector, wherein otherwise reference is made to the preceding versions of the DSX module with insulation displacement connector.
Bezugszeichenliste:LIST OF REFERENCE NUMBERS
10a, 10b, 10c DSX-Buchsen10a, 10b, 10c DSX jacks
12 Digitalvermittlung12 Digital Mediation
14a, 14b Amtsverstärker14a, 14b Amtsverstärker
16 Out-Anschlussstifte16 out pins
18 In-Anschlussstifte18 in-pins
19 Rangierfeld19 patch panel
20, 21 , 23 Steckkabel20, 21, 23 plug-in cable
30 DSX-System30 DSX system
32 Chasis32 chasis
34, 34' DSX-Modul34, 34 ' DSX module
35 Buchsen-Aufnahme35 socket recording
36, 38 Buchsen36, 38 sockets
37 Riegel37 bars
40 Rangieranschlussfeld40 shunting connection field
41 Schneidklemm-Steckverbinder41 insulation displacement connector
42 Geräteanschlussfeld42 Device connection field
43 Kontaktelement 45 Gehäuse43 contact element 45 housing
49, 49' Deckstück49, 49 ' cover piece
51 Schneidklemmesser51 cutting blade
53 Stift-Kontakt53 pin contact
52 Kontaktschlitz52 contact slot
54 Schneidklemm-Kontakt54 insulation displacement contact
55 erste Verlängerungen55 first extensions
56 Führungselement56 guide element
57 bogenförmige Elemente57 arched elements
58 zweite Verlängerungen58 second extensions
61 Unterseite61 bottom
62 Oberseite62 top
64 Klemmstege64 clamping bars
65 Schlitze Rastnasen65 slots locking lugs
Nutgroove
Schlitzeslots
Kanteedge
Steckerplug
Aufnahme b-ErdstiftePick up b earth pegs
Strom-/SpannungsstifteCurrent / voltage pins
StromrückführungsstifteCurrent feedback pins
Löcherholes
Bahn , 124' Leiterplatte a erster Teil b zweiter Teil c dritter Teil , 126' rückwärtiges Drehstück/Hinterstück , 127' HalterWeb, 124 ' printed circuit board a first part b second part c third part, 126 ' rear turn piece / tail piece, 127 ' holder
Out-AnschlussOut port
Monitor-Out-AnschlussMonitor Out port
IN-AnschlussIn connection
Monitor-In-AnschlussMonitor-in port
LED-Anschlüsse elektrische KontakteLED connectors electrical contacts
EndstückeTails
Buchsen elektrische KontakteSockets electrical contacts
Löcher , 148 LöcherHoles, 148 holes
Plattformplatform
Tragstrukturensupport structures
Seitenwände , 226 WändeSide walls, 226 walls
Rückwände 230 rechteckige Aufnahmenbacks 230 rectangular pictures
232, 234 Öffnungen232, 234 openings
100, 290, 292, 294, 296, 298 Bahnen100, 290, 292, 294, 296, 298 tracks
Tl1 Rl1 TO, RO Kontakte Tl 1 Rl 1 TO, RO Contacts

Claims

PATENTANSPRÜCHE
1. Schneidklemm-Steckverbinder für die Telekommunikations- und Datentechnik, umfassend ein Gehäuse und eine Anzahl von Kontaktelementen, wobei die Kontaktelemente jeweils einen Schneidklemm-Kontakt zum Anschließen von Adern und einen Stift- Kontakt zum Kontaktieren einer Leiterplatte umfassen, dadurch gekennzeichnet, dass zwischen dem Schneidklemm-Kontakt (54) und dem Stift-Kontakt (53) mindestens eine Verlängerung (55) angeordnet ist.A insulation displacement connector for telecommunications and data technology, comprising a housing and a number of contact elements, wherein the contact elements each comprise a insulation displacement contact for connecting wires and a pin contact for contacting a printed circuit board, characterized in that between the Insulation displacement contact (54) and the pin contact (53) at least one extension (55) is arranged.
2. Schneidklemm-Steckverbinder nach Anspruch 1 , dadurch gekennzeichnet, dass an der Unterseite des Schneidklemm- Kontaktes (54) ein Führungselement (56) angeordnet ist.2. insulation displacement connector according to claim 1, characterized in that on the underside of the insulation displacement contact (54), a guide element (56) is arranged.
3. Schneidklemm-Steckverbinder nach Anspruch 2, dadurch gekennzeichnet, dass das Führungselement (56) breiter als der Schneidklemm-Kontakt (54) ausgebildet ist.3. insulation displacement connector according to claim 2, characterized in that the guide element (56) is formed wider than the insulation displacement contact (54).
4. Schneidklemm-Steckverbinder nach einem der vorangegangenen Ansprüche, dadurch gekennzeichnet, dass an dem dem Stift- Kontakt (53) zugeordneten Ende der Verlängerung (55) zwei bogenförmige Elemente (57) angeordnet sind.4. insulation displacement connector according to one of the preceding claims, characterized in that at the pin contact (53) associated with the end of the extension (55) has two arcuate elements (57) are arranged.
5. Schneidklemm-Steckverbinder nach einem der Ansrüche 2 bis 4, dadurch gekennzeichnet, dass die Innenseiten des Gehäuses mit Nuten für die Führungselemente (56) ausgebildet sind, die sich von der Unterseite des Gehäuses zur Oberseite erstrecken.5. insulation displacement connector according to one of the Ansrüche 2 to 4, characterized in that the inner sides of the housing with grooves for the guide elements (56) are formed extending from the underside of the housing to the top.
6. Schneidklemm-Steckverbinder nach Anspruch 5, dadurch gekennzeichnet, dass in die Nutwände Schlitze eingebracht sind, wobei die Länge der Schlitze der Länge der bogenförmigen Elemente (57) entspricht. 6. insulation displacement connector according to claim 5, characterized in that in the groove walls slots are introduced, wherein the length of the slots corresponds to the length of the arcuate elements (57).
7. Schneidklemm-Steckverbinder nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, dass zwischen den bogenförmigen Elementen (57) und dem Stift-Kontakt (53) eine weitere Verlängerung (58) angeordnet ist.7. insulation displacement connector according to one of claims 4 to 6, characterized in that between the arcuate elements (57) and the pin contact (53), a further extension (58) is arranged.
8. Schneidklemm-Steckverbinder nach einem der vorangegangenen Ansprüche, dadurch gekennzeichnet, dass an den Außenseiten des Gehäuses (45) Rastnasen angeordnet sind.8. insulation displacement connector according to one of the preceding claims, characterized in that on the outer sides of the housing (45) locking lugs are arranged.
9. Schneidklemm-Steckverbinder nach einem der vorangegangenen Ansprüche, dadurch gekennzeichnet, dass das Gehäuse (45) Schlitze zur Aufnahme der anzuschließenden Adern aufweist, wobei der Schneidklemm-Kontakt (54) im 45°-Winkel zum Schlitz ausgerichtet ist.9. insulation displacement connector according to one of the preceding claims, characterized in that the housing (45) has slots for receiving the leads to be connected, wherein the insulation displacement contact (54) is aligned at 45 ° to the slot.
10. Einrichtung für die Telekommunikations- und Datentechnik, umfassend mindestens eine Leiterplatte und mindestens ein auf einer Seite der Leiterplatte angeordnetes Deckstück, wobei das Deckstück Öffnungen zur Aufnahme von Kontaktelementen aufweist, wobei die Kontaktelemente jeweils einen Stift-Kontakt und einen Schneidklemm-Kontakt aufweisen, wobei der Stift-Kontakt durch die Öffnungen des Deckstücks die Leiterplatte kontaktiert, gekennzeichnet durch einen Schneidklemm-Steckverbinder (41) nach einem der Ansprüche 1 bis 9.10. A device for telecommunications and data technology, comprising at least one printed circuit board and at least one arranged on one side of the circuit board cover piece, wherein the cover piece has openings for receiving contact elements, wherein the contact elements each have a pin contact and an insulation displacement contact, wherein the pin contact through the openings of the cover piece contacts the printed circuit board, characterized by an insulation displacement connector (41) according to one of claims 1 to 9.
11. Einrichtung nach Anspruch 10, dadurch gekennzeichnet, dass das Deckstück (49, 49') mindestens eine Aufnahme (230) aufweist, die einstückig mit dem Deckstück (49, 49') verbunden ist, wobei der Schneidklemm-Steckverbinder (41) mit der Aufnahme (230) verrastet ist.11. The device according to claim 10, characterized in that the cover piece (49, 49 ') at least one receptacle (230) which is integrally connected to the cover piece (49, 49'), wherein the insulation displacement connector (41) the receptacle (230) is locked.
12. Einrichtung nach Anspruch 11 , dadurch gekennzeichnet, dass die Aufnahme (230) Wände (224-227) aufweist, die einen nach oben offenen Quader definieren. 12. Device according to claim 11, characterized in that the receptacle (230) has walls (224-227) which define an upwardly open cuboid.
13. Einrichtung nach einem der Ansprüche 10 bis 12, dadurch gekennzeichnet, dass die Einrichtung als Digitalsignalverteiler ausgebildet ist.13. Device according to one of claims 10 to 12, characterized in that the device is designed as a digital signal distributor.
14. Einrichtung nach einem der Ansprüche 10 bis 13, dadurch gekennzeichnet, dass die Einrichtung eine Vielzahl von Buchsen (36, 38), die jeweils eine Vielzahl von normalerweise geschlossenen Kontakten umfassen, ein Rangieranschlussfeld (40) und ein Geräteanschlussfeld (42) umfassen, wobei die Leiterplatte elektrische Verbindungen zwischen den normalerweise geschlossenen Kontakten und dem Rangieranschlussfeld (40) und dem Geräteanschlussfeld (42) herstellt, wobei das Rangieranschlussfeld (40) und/oder das Geräteanschlussfeld (42) einen Schneidklemm-Steckverbinder (41) nach einem der Ansprüche 1 bis 9 umfasst.14. Device according to one of claims 10 to 13, characterized in that the device comprises a plurality of sockets (36, 38), each comprising a plurality of normally closed contacts, a jumper connection field (40) and a device connection field (42), wherein the printed circuit board establishes electrical connections between the normally closed contacts and the patch panel (40) and the device patch panel (42), the patch panel (40) and / or the patch panel (42) comprising an insulation displacement connector (41) according to any one of claims 1 to 9 includes.
15. Digitalsignalverteiler, umfassend eine Vielzahl von Buchsen (36, 38), die jeweils eine Vielzahl von normalerweise geschlossenen Kontakten umfassen, ein Rangieranschlussfeld (40), ein Geräteanschlussfeld (42) und eine Leiterplatte (124) zur elektrischen Verbindung zwischen den normalerweise geschlossenen Kontakten und dem Rangieranschlussfeld (40) und dem Geräteanschlussfeld (42), wobei mindestens das Rangieranschlussfeld (40) und/oder das Geräteanschlussfeld (42) einen Schneidklemm-Steckverbinder (41) nach einem der Ansprüche 1 bis 9 umfasst, und die Stift-Kontakte (53) des Schneidklemm-Steckverbinders (41) mit der elektrischen Leiterplatte (124) verbunden sind. A digital signal distributor comprising a plurality of sockets (36, 38) each including a plurality of normally closed contacts, a jumper pad (40), a device pad (42), and a printed circuit board (124) for electrically connecting the normally closed contacts and the patch panel (40) and the device patch panel (42), wherein at least the patch panel (40) and / or the patch panel (42) includes an insulation displacement connector (41) according to any one of claims 1 to 9, and the pin contacts (16). 53) of the insulation displacement connector (41) are connected to the electrical circuit board (124).
EP06762657A 2005-07-21 2006-07-17 Insulation displacement plug-in connector and device for telecommunications and data technology Active EP1905127B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PL06762657T PL1905127T3 (en) 2005-07-21 2006-07-17 Insulation displacement plug-in connector and device for telecommunications and data technology
SI200631030T SI1905127T1 (en) 2005-07-21 2006-07-17 Insulation displacement plug-in connector and device for telecommunications and data technology
CY20111100649T CY1111947T1 (en) 2005-07-21 2011-07-05 EXTERNAL INSULATION CONNECTION CONNECTOR AND EQUIPMENT FOR TELECOMMUNICATION AND DATA TECHNOLOGY

Applications Claiming Priority (2)

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DE102005033998A DE102005033998A1 (en) 2005-07-21 2005-07-21 Insulation displacement connector and device for telecommunications and data technology
PCT/EP2006/007020 WO2007009729A1 (en) 2005-07-21 2006-07-17 Insulation displacement plug-in connector and device for telecommunications and data technology

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EP1905127B1 EP1905127B1 (en) 2011-04-06

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KR (1) KR101191683B1 (en)
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KR101191683B1 (en) 2013-01-09
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RU2008106609A (en) 2009-08-27
ATE504959T1 (en) 2011-04-15
DK1905127T3 (en) 2011-06-27
MY146726A (en) 2012-09-14
US7815439B2 (en) 2010-10-19
WO2007009729A1 (en) 2007-01-25
HRP20110407T1 (en) 2011-06-30
CN101228666A (en) 2008-07-23
RU2391752C2 (en) 2010-06-10
CN101228666B (en) 2010-08-04
DE102005033998A1 (en) 2007-02-01
BRPI0613620A2 (en) 2011-01-18
US20080227329A1 (en) 2008-09-18
TWI325664B (en) 2010-06-01
DE502006009263D1 (en) 2011-05-19
KR20080040721A (en) 2008-05-08
PL1905127T3 (en) 2011-10-31
EP1905127B1 (en) 2011-04-06
ES2362921T3 (en) 2011-07-15
HK1120662A1 (en) 2009-04-03
PT1905127E (en) 2011-06-07
CY1111947T1 (en) 2015-11-04
RS51802B (en) 2011-12-31

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