EP1903607B1 - Module à DELs avec puces à DELs RGB - Google Patents

Module à DELs avec puces à DELs RGB Download PDF

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Publication number
EP1903607B1
EP1903607B1 EP07115131.0A EP07115131A EP1903607B1 EP 1903607 B1 EP1903607 B1 EP 1903607B1 EP 07115131 A EP07115131 A EP 07115131A EP 1903607 B1 EP1903607 B1 EP 1903607B1
Authority
EP
European Patent Office
Prior art keywords
led
clusters
individual
led module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP07115131.0A
Other languages
German (de)
English (en)
Other versions
EP1903607A2 (fr
EP1903607A3 (fr
Inventor
Christian Dr. Hochfilzer
Thomas Pieber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic Jennersdorf GmbH
Original Assignee
Tridonic Jennersdorf GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Jennersdorf GmbH filed Critical Tridonic Jennersdorf GmbH
Priority to PL07115131T priority Critical patent/PL1903607T3/pl
Publication of EP1903607A2 publication Critical patent/EP1903607A2/fr
Publication of EP1903607A3 publication Critical patent/EP1903607A3/fr
Application granted granted Critical
Publication of EP1903607B1 publication Critical patent/EP1903607B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a LED chips with different colored LEDs in a certain arrangement arrangement populated LED module.
  • Red, yellow, green and blue light emitting diodes have been in use since the late sixties, e.g. in vehicle fittings, displays or as indicator lights of electrical appliances.
  • the LED modules commercially available today typically consist of a number of single LEDs with narrow band, approximately monochromatic emission spectra, made in the form of packaged semiconductor crystals, grouped into triads in the primary colors red, green and blue of the additive color system and in a particular Arrangement manner (eg in linearly arranged or grouped into a cluster shape) applied to a circuit board and combined with each other.
  • the printed circuit board not only fulfills the function of a carrier, but also allows a simple control of the individual light-emitting diodes and other optical, electronic and / or mechanical system components required for the use of the LED module in the context of a lighting system.
  • the electrical layout of the printed circuit board can be adapted to the respective application:
  • colored LEDs can be controlled separately with the appropriate layout, so that individual color mixtures and color sequences are possible with one and the same LED module.
  • colors can be produced by additive color mixing of the light emitted by differently colored LEDs with different emission spectra.
  • the LED module in each case three LEDs in the three primary colors red, green and blue of the additive color system, which together add up to the color white, combined into a triad, resulting in a suitable additive color mixing secondary colors of any hue in a relatively high color saturation ,
  • LED modules are available in different shapes and sizes on the market today. One differentiates u.a. between LED modules with wired through-hole mounted LEDs, SMD technology (Surface Mounted Device Technology) LED modules, which allow a higher degree of miniaturization than LED modules with leaded LEDs, and based on innovative chip On-board (CoB) technology equipped LED modules, in which the semiconductor crystals are placed directly on a circuit board and contacted. The latter allows for high population densities, a high degree of miniaturization, and relatively good thermal management for a long life.
  • SMD technology Surface Mounted Device Technology
  • CoB chip On-board
  • JP 11-003051 is an LED display of a display device equipped with LED clusters of four light in the spectral colors red, green and blue emitting LEDs described, in which each LED cluster has two emitting in the red spectral light emitting diodes.
  • the present invention is therefore dedicated to improving the homogeneity of the light and color distribution of conventional LED modules.
  • FIG. 4 illustrated embodiment of the present invention, starting from the with reference to Fig. 1 to Fig. 3 described prior art, described in detail.
  • LED module 100 are three LED cluster 102a-c, consisting of the LED chips 104a-c of each three light in the spectral colors red, green and blue emitting LEDs, together with the required for a constant current operation of the LED module 100 electronic components of an LED driver circuit required for driving the individual LED clusters 102a-c, the connection contacts 105 serving for the power supply of the individual light-emitting diodes of these LED clusters 102a-c and the wiring layout 106 of these components in a surface-mounted device (SMD) - or chip-on-board (CoB) technique applied to a circuit board 101.
  • SMD surface-mounted device
  • CoB chip-on-board
  • a mounting hole in the board is designated, which can be fastened by a screw or the like. serves.
  • the LED module For cooling the LED module, it can for example be mounted / glued on a heat sink by means of a preassembled heat-conducting adhesive tape on the rear side of the LED module. This heat sink can also be the reflector or the light at the same time.
  • a temperature sensor At the "tc point" 103b can be measured by means of a temperature sensor, the surface temperature of the LED module to determine the optimal operation or sufficient cooling of the LED module. For this purpose, this temperature detection can be returned to the control electronics of the LEDs, which controls the LED power by means of a PWM modulation of the operating voltage.
  • the LED chips 104a, 104 and 104c which are denoted by the same reference symbols, are light-emitting diodes of different LED clusters 102a, 102b and 102c of the same spectral color (eg red, green and blue) in the same vertices, respectively oriented, mutually congruent equilateral triangles arranged.
  • spectral color eg red, green and blue
  • equidirectional orientation it is meant that the identically named corners of the equilateral triangles, which describe the triangular arrangements of the individual LED clusters 102a-c, respectively point in the same directions.
  • the positions of the three LED clusters 102a-c on the circuit board 101 of the respective LED module 100 are defined by the locations of the inscribed on a parallel line to a longitudinal side of the LED module 100 incircle centers of these equilateral triangles, wherein the inscribed circle -Means of all neighboring triangles to each other have the same distance.
  • the arrangement and orientation (alignment) of the individual LED chips 104a-c is thus the same for all LED clusters 102a-c of the LED module 100, which means that light emitting diodes of different LED clusters which emit light of the same spectral color are always in the same corners of the same direction oriented equilateral triangles are arranged.
  • the hue of the light emitted by the 15 LED modules of the strip-shaped module chain in a specific spatial direction is a result of additive color mixing Color that arises from a superimposition of the light radiation emitted by the LEDs of the individual LED clusters 102a-c in this spatial direction and depends on the same-sense orientation of the individual LED clusters 102a-c on the printed circuit boards 101 of the individual LED modules 100.
  • the same orientation of the LED clusters 102a-c leads to the disturbing one Effect that the emission spectrum of the light emitted by the RGB LEDs of the individual LED clusters 102a-c viewed from a spatial direction in which the LED chips 104a-c of the individual LED clusters 102a-c are farthest from a viewer, appears much redder than from the diametrically opposite spatial direction (see Fig. 3 ).
  • the light-scattering layer 109 appears redder in a near-observer area than in the rest Range, where the reddish decreases with distance from the viewer.
  • This color change is caused by the Rayleigh scattering of the light emitted by the light emitting diodes of the individual LED clusters 102a-c.
  • the air located between the LED modules 100 and the viewer acts, as well as the individual Vergussmasse füren 108a-c, as a diffusely scattering medium, with blue and green light through the silicone molecules of the potting compound and the molecules of the air, which compared to The wavelengths of the scattered light waves have small diameter, is always more scattered than the much longer-wave red light, so that the remaining, long-wave light components in relation to daylight, so the viewer reaches more red than blue and green light and the color impression in Direction of the spectral color red shifts.
  • LED module 100 which comprises three LED clusters 102a'-c' consisting of three light-emitting LED chips 104a-c, each of which has three bonded and with an at least partially translucent, light-bundling Vergussmasse für 108a-c of three light in the Spectral colors of red, green and blue emitting LEDs, respectively.
  • the individual LED chips 104a-c are in Surface Mounted Device (SMD) - or chip-on-board (CoB) technology mounted directly on one of three on one surface of the circuit board 101 of this LED module 100 'applied contact surfaces 107a-c.
  • SMD Surface Mounted Device
  • CoB chip-on-board
  • the LED chips 104a, 104 and 104c of light of the same spectral color (eg red, green and blue) emitting light emitting diodes of different LED clusters 102a ', 102b' and 102c ', respectively, designated by like reference numerals are in different corner points according to the invention arranged in the same direction oriented, mutually congruent equilateral triangles whose inscribed centers are arranged equidistantly on a straight line, in such a way that the LED chips 104a-c of the same color LEDs of different LED clusters 102a'-c 'in the placement layout of this different LED Cluster 102a'-c 'below the respective Vergussmassemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschinemaschine
  • the LED module 100 'described above is arranged behind a frosted plastic or glass layer 109, which breaks the light emitted by the light-emitting diodes of the LED clusters 102a'-c', scatters in all spatial directions of a half space located in front of this layer 109 and thus contributing to the additive color mixing of the differently colored light emitted by the light emitting diodes of the individual LED clusters 102a'-c '.
  • the Vergussmasse füren 108a-c of the individual LED cluster 102a'-c ' are made of a transparent or partially transparent (diffuse) material, which is preferably made of silicone and enriched with color conversion pigments, which at least a spectral component of the overlapping different colored light in absorb light rays emitted by the light-emitting diodes of the individual LED clusters 102a'-c ', which are present in the spectral colors red, green and blue.
  • a transparent or partially transparent (diffuse) material which is preferably made of silicone and enriched with color conversion pigments, which at least a spectral component of the overlapping different colored light in absorb light rays emitted by the light-emitting diodes of the individual LED clusters 102a'-c ', which are present in the spectral colors red, green and blue.
  • the LED module according to the invention is equipped with at least two LED clusters applied on a printed circuit board, each having at least two LEDs of different color coated with a preferably common, at least partially transparent potting compound layer. Those locations of the circuit board on which the LEDs of the individual LED clusters are placed are arranged in a regular arrangement pattern of a placement layout.
  • the potted LEDs of the same color of different LED clusters in the placement layout of these LED clusters occupy different places according to the invention.
  • the space occupancy of the LED chips of the same color LEDs in the placement layout of various LED clusters according to the invention is determined by a Permutationsvorschrift, which may be, for example, a cyclic permutation of the LED chip allocation to the individual places of the placement layouts of adjacent LED cluster ,
  • the locations of the PCB on which the LED chips of the individual LED clusters are to be placed can be given, for example, by the vertices of regular polygons.
  • the regular polygons by whose vertices the arrangement possibilities of the individual LED chips of all LED clusters are defined on the circuit board, oriented in the same direction. This means that the LED chips of the different LED clusters, with respect to the inscribed centers of the abovementioned regular polygons, are arranged offset by different rotational angles ⁇ n with respect to a normal position ⁇ 0 .
  • the regular polygons by means of whose corner points the arrangement possibilities of the individual LED chips of all LED clusters on the printed circuit board are defined, can be converted into one another by a similarity or congruence mapping.
  • the LED chips of the individual LED clusters can be arranged on the vertices of the same direction oriented equilateral triangles.
  • the incircle centers can be the same for each pair of adjacent LED clusters Have distance to each other.
  • the equilateral triangles oriented in the same direction, whose vertices describe the possible arrangements of the LED chips in the individual LED clusters have the same edge length.
  • the LED chips of the individual LED clusters can be, for example, LED semiconductor chips of approximately monochromatic light in the primary colors red (R), green (G) or blue (B) of the additive color system emitting light-emitting diodes.
  • the above-described LED module e.g. is arranged behind an at least partially translucent (diffuse) layer which breaks the light emitted by the light emitting diodes of each LED cluster scatters in all directions of a space located in front of this half-space and thus the additive color mixing of the light-emitting diodes of each LED cluster contributes emitted different colored light.
  • This layer may be, for example, a frosted plastic or glass layer.
  • the potting compound layers of the individual LED clusters may consist of a transparent or diffuse material hardened into a lump-shaped lump, preferably of silicone.
  • a transparent or diffuse material hardened into a lump-shaped lump, preferably of silicone.
  • the potting compound layers of the individual LED clusters are enriched with color conversion pigments which absorb at least one spectral component of the light of different colors in the red, green and blue spectral colors emitted by the light emitting diodes of the individual LED clusters.
  • the present invention relates to an LED module chain consisting of a number of LED modules connected in series.
  • the latter can e.g. arranged in strip form behind one another or in the form of a two-dimensional cluster in each case in front or side by side on a support.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Claims (20)

  1. Module DEL, ayant au moins deux clusters de DEL (102a'-c'), fixé à un circuit imprimé (101), avec, respectivement, au moins deux puces de DEL (104a-c) revêtues d'un revêtement de composé d'étanchéité mutuel (108a-c) de couleur différente, dans lequel les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont montées par le biais d'un procédé de composant pour montage en surface ou d'un procédé de montage direct des puces sur des zones de contact (107a-c) qui sont appliquées directement sur une surface du circuit imprimé (101), dans lequel les plaquettes du circuit imprimé (101) sur lesquelles les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont placées sont disposées dans un modèle de disposition d'un agencement de positions, dans lequel les puces de DEL encapsulées (104a-c) de diodes électroluminescentes de même couleur de clusters de DEL différents (102a'-c') sont situées dans l'agencement de positions de ces clusters de DEL différents (102a'-c') en différents emplacements en dessous des revêtements de composé d'étanchéité respectifs (108a-c), dans lequel les revêtements de composé d'étanchéité (108a-c) des clusters individuels de DEL (102a'-c') sont composés d'un matériau transparent ou partiellement perméable à la lumière, caractérisé en ce que les revêtements de composé d'étanchéité (108a-c) des clusters individuels de DEL (102a'-c') sont enrichis par des pigments de conversion de couleur absorbant au moins une composante spectrale des rayons lumineux émis par des diodes électroluminescentes des clusters individuels de DEL (102a'-c') et en ce que le module DEL possède, de plus, un revêtement au moins partiellement perméable à la lumière (109) qui réfracte la lumière émise par les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') et la répand dans toutes les directions spatiales d'un demi-espace situé en face de ce revêtement.
  2. Module DEL selon la revendication 1, caractérisé en ce que la position des puces de DEL (104a-c) des diodes électroluminescentes de même couleur dans l'agencement de positions de clusters de DEL différents (102a'-c') est définie par une prescription de permutation.
  3. Module DEL selon la revendication 2, caractérisé en ce que cette prescription de permutation est une permutation cyclique de l'attribution de la puce de DEL aux emplacements individuels de l'agencement de positions des clusters de DEL adjacents (102a'-c').
  4. Module DEL selon l'une des revendications de 1 à 3, caractérisé en ce que les plaquettes du circuit imprimé sur lesquelles doivent être placées les puces de DEL (104a-c) des clusters de DEL respectifs (102a'-c') sont fournies par les points d'angle de polygones réguliers.
  5. Module DEL selon la revendication 4, caractérisé en ce que les points centraux en cercle des polygones adjacents sont disposés sur une ligne rectiligne.
  6. Module DEL selon l'une des revendications 4 ou 5, caractérisé en ce que les points centraux en cercle des polygones adjacents sont équidistants les uns des autres.
  7. Module DEL selon l'une des revendications de 4 à 6, caractérisé en ce que les polygones réguliers, dont les points d'angle déterminent les options de disposition des puces de DEL individuelles (104a-c) de tous les clusters de DEL (102a'-c') sur le circuit imprimé (101), sont orientés dans la même direction.
  8. Module DEL selon l'une des revendications de 4 à 7, caractérisé en ce que les polygones réguliers, dont les points d'angle déterminent les options de disposition des puces de DEL individuelles (104a-c) de tous les clusters de DEL (102a'-c') sur le circuit imprimé (101), sont transférables mutuellement par un mappage de similarité ou coïncidence.
  9. Module DEL selon l'une des revendications de 4 à 8, caractérisé en ce que les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont, en ce qui concerne les points centraux en cercle des polygones réguliers, décalées selon différents angles de rotation (ϕk ) comparés à une position normale (ϕ o).
  10. Module DEL selon la revendication 9, caractérisé en ce que les dimensions de ces angles de rotation (ϕn ) sont fournies par des multiples entiers (n) de l'angle plein, divisés par le nombre (N) de clusters de DEL (102a'-c') par module DEL (100') de 360° entre zéro et le nombre (N), moins un, de clusters de DEL (102a'-c') par module DEL (100').
  11. Module DEL selon l'une des revendications précédentes, caractérisé en ce que les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont disposées sur les points d'angle de triangles équilatéraux orientés dans la même direction.
  12. Module DEL selon la revendication 11, caractérisé en ce que les points centraux en cercle des triangles équilatéraux orientés dans la même direction, sur les points d'angle desquels les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont disposées, sont équidistants les uns des autres pour les clusters de DEL adjacents (102a'-c').
  13. Module DEL selon l'une des revendications 11 ou 12, caractérisé en ce que les triangles équilatéraux orientés dans la même direction, dont les points d'angle spécifient les options de disposition des puces de DEL (104a-c) dans les clusters individuels de DEL (102a'-c'), possèdent une longueur de bord identique.
  14. Module DEL selon l'une des revendications de 11 à 13, caractérisé en ce que les puces de DEL (104a-c) des clusters individuels de DEL (102a'-c') sont des plaques de DEL semi-conductrices de diodes électroluminescentes émettant approximativement une lumière monochromatique dans les couleurs primaires rouge (R), vert (G) ou bleu (B) du système additif des couleurs.
  15. Module DEL selon la revendication 1, caractérisé en ce que le revêtement au moins partiellement perméable à la lumière (109) est un revêtement mat en plastique ou vitreux.
  16. Module DEL selon l'une des revendications de 1 à 15, caractérisé en ce que le revêtement de composé d'étanchéité (108a-c) des clusters individuels de DEL (102a'-c') consiste en un matériau transparent durci formant un agrégat en forme de lentille.
  17. Module DEL selon l'une des revendications de 1 à 15, caractérisé en ce que le revêtement de composé d'étanchéité (108a-c) des clusters individuels de DEL (102a'-c') consiste en un matériau diffus durci formant un agrégat en forme de lentille.
  18. Chaîne modulaire à DEL, composée d'un nombre de modules DEL (100') reliés en série les uns aux autres selon l'une des revendications précédentes.
  19. Chaîne modulaire à DEL selon la revendication 18, caractérisée en ce que les modules individuels de DEL (100') sont disposés dans une rangée à motif à bandes sur un support.
  20. Chaîne modulaire à DEL selon la revendication 18, caractérisée en ce que les modules individuels de DEL (100') sont disposés sous la forme d'un cluster bidimensionnel respectivement les uns devant les autres ou côte à côte sur un support.
EP07115131.0A 2006-09-19 2007-08-28 Module à DELs avec puces à DELs RGB Not-in-force EP1903607B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL07115131T PL1903607T3 (pl) 2006-09-19 2007-08-28 Moduł led z chipami rgb led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202006014351U DE202006014351U1 (de) 2006-09-19 2006-09-19 LED-Modul mit RGB LED-Chips

Publications (3)

Publication Number Publication Date
EP1903607A2 EP1903607A2 (fr) 2008-03-26
EP1903607A3 EP1903607A3 (fr) 2012-05-23
EP1903607B1 true EP1903607B1 (fr) 2015-11-04

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EP07115131.0A Not-in-force EP1903607B1 (fr) 2006-09-19 2007-08-28 Module à DELs avec puces à DELs RGB

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DE (1) DE202006014351U1 (fr)
PL (1) PL1903607T3 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1971191B1 (fr) 2007-03-13 2013-04-10 Insta Elektro GmbH Dispositif électrique/électronique destiné à la production de représentations colorées
DE202007011973U1 (de) 2007-08-27 2009-01-02 Ruppel, Stefan LED-Clusteranordnung mit Konstantstromschalter
JP6666925B2 (ja) * 2015-03-09 2020-03-18 ルミレッズ ホールディング ベーフェー 色点可変発光装置
EP3572334B1 (fr) * 2018-05-22 2021-09-15 Goodrich Lighting Systems GmbH Lumière de navigation d'aéronef multimode et aéronef la comprenant

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0326536Y2 (fr) * 1986-10-01 1991-06-07
JPH0830213A (ja) * 1994-07-18 1996-02-02 Rohm Co Ltd 発光ダイオード表示装置
DE102006002275A1 (de) * 2005-01-19 2006-07-20 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung
KR101189085B1 (ko) * 2005-07-14 2012-11-09 삼성디스플레이 주식회사 백라이트 유닛과 이를 포함하는 액정표시장치
EP1948994B1 (fr) * 2005-11-18 2012-09-19 Cree, Inc. Carreau pour panneau lumineux a semi-conducteur

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PL1903607T3 (pl) 2016-05-31
EP1903607A2 (fr) 2008-03-26
DE202006014351U1 (de) 2007-01-04
EP1903607A3 (fr) 2012-05-23

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