EP1903602A3 - Transistor de mémoire non-volatile - Google Patents

Transistor de mémoire non-volatile Download PDF

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Publication number
EP1903602A3
EP1903602A3 EP07121233A EP07121233A EP1903602A3 EP 1903602 A3 EP1903602 A3 EP 1903602A3 EP 07121233 A EP07121233 A EP 07121233A EP 07121233 A EP07121233 A EP 07121233A EP 1903602 A3 EP1903602 A3 EP 1903602A3
Authority
EP
European Patent Office
Prior art keywords
storage medium
insulating barrier
charge storage
charge
supply region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07121233A
Other languages
German (de)
English (en)
Other versions
EP1903602A2 (fr
Inventor
Bogdan Govoreanu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Priority claimed from EP05112170A external-priority patent/EP1748472A1/fr
Publication of EP1903602A2 publication Critical patent/EP1903602A2/fr
Publication of EP1903602A3 publication Critical patent/EP1903602A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/792Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401Multistep manufacturing processes
    • H01L29/4011Multistep manufacturing processes for data storage electrodes
    • H01L29/40114Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401Multistep manufacturing processes
    • H01L29/4011Multistep manufacturing processes for data storage electrodes
    • H01L29/40117Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42324Gate electrodes for transistors with a floating gate
    • H01L29/42332Gate electrodes for transistors with a floating gate with the floating gate formed by two or more non connected parts, e.g. multi-particles flating gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7883Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0416Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2216/00Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
    • G11C2216/02Structural aspects of erasable programmable read-only memories
    • G11C2216/06Floating gate cells in which the floating gate consists of multiple isolated silicon islands, e.g. nanocrystals
EP07121233A 2005-07-28 2005-12-14 Transistor de mémoire non-volatile Withdrawn EP1903602A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70363905P 2005-07-28 2005-07-28
EP05112170A EP1748472A1 (fr) 2005-07-28 2005-12-14 Transistor de mémoire non-volatile

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP05112170A Division EP1748472A1 (fr) 2005-07-28 2005-12-14 Transistor de mémoire non-volatile

Publications (2)

Publication Number Publication Date
EP1903602A2 EP1903602A2 (fr) 2008-03-26
EP1903602A3 true EP1903602A3 (fr) 2009-04-01

Family

ID=39103468

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07121233A Withdrawn EP1903602A3 (fr) 2005-07-28 2005-12-14 Transistor de mémoire non-volatile

Country Status (1)

Country Link
EP (1) EP1903602A3 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2284870B1 (fr) 2009-08-12 2012-02-22 Imec Procédé de formation de cellule de mémoire non volatile à grille flottante
EP2806452B1 (fr) 2013-05-24 2018-12-26 IMEC vzw Dispositifs de semi-conducteur à mémoire non volatile et leur procédé de fabrication

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617639B1 (en) * 2002-06-21 2003-09-09 Advanced Micro Devices, Inc. Use of high-K dielectric material for ONO and tunnel oxide to improve floating gate flash memory coupling
EP1411555A2 (fr) * 2002-10-14 2004-04-21 Samsung Electronics Co., Ltd. Mémoire non-volatile de type silicium/oxyde/nitrure/silicium/nitrure/oxyde/silicium
EP1487013A2 (fr) * 2003-06-10 2004-12-15 Samsung Electronics Co., Ltd. Cellule mémoire de type SONOS et son procédé de fabrication

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1605517B1 (fr) 2001-04-27 2011-09-14 Imec Barrière isolante

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617639B1 (en) * 2002-06-21 2003-09-09 Advanced Micro Devices, Inc. Use of high-K dielectric material for ONO and tunnel oxide to improve floating gate flash memory coupling
EP1411555A2 (fr) * 2002-10-14 2004-04-21 Samsung Electronics Co., Ltd. Mémoire non-volatile de type silicium/oxyde/nitrure/silicium/nitrure/oxyde/silicium
EP1487013A2 (fr) * 2003-06-10 2004-12-15 Samsung Electronics Co., Ltd. Cellule mémoire de type SONOS et son procédé de fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BLOMME P ET AL: "Multilayer tunneling barriers for nonvolatile memory applications", DEVICE RESEARCH CONFERENCE, 2002. 60TH DRC. CONFERENCE DIGEST JUN 24-26, 2002, PISCATAWAY, NJ, USA,IEEE, 24 June 2002 (2002-06-24), pages 153 - 154, XP010600864, ISBN: 978-0-7803-7317-4 *
BLORNME P ET AL: "Improvement of write/erase cycling of memory cells with SiO2/HfO2 tunnel dielectric", INTEGRATED RELIABILITY WORKSHOP FINAL REPORT, 2003 IEEE INTERNATIONAL LAKE TAHOE, CA, USA OCT. 20-23, 2003, PISCATAWAY, NJ, USA,IEEE, 20 October 2003 (2003-10-20), pages 95 - 98, XP010695143, ISBN: 978-0-7803-8157-5 *

Also Published As

Publication number Publication date
EP1903602A2 (fr) 2008-03-26

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