EP1897069A1 - Apparatus for checking banknotes - Google Patents

Apparatus for checking banknotes

Info

Publication number
EP1897069A1
EP1897069A1 EP06754514A EP06754514A EP1897069A1 EP 1897069 A1 EP1897069 A1 EP 1897069A1 EP 06754514 A EP06754514 A EP 06754514A EP 06754514 A EP06754514 A EP 06754514A EP 1897069 A1 EP1897069 A1 EP 1897069A1
Authority
EP
European Patent Office
Prior art keywords
banknotes
processing machine
sensor
banknote processing
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06754514A
Other languages
German (de)
French (fr)
Other versions
EP1897069B1 (en
Inventor
Michael Bloss
Wolfgang Deckenbach
Georg Vetter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP1897069A1 publication Critical patent/EP1897069A1/en
Application granted granted Critical
Publication of EP1897069B1 publication Critical patent/EP1897069B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/02—Testing electrical properties of the materials thereof
    • G07D7/023—Measuring conductivity by direct contact
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D2207/00—Paper-money testing devices

Definitions

  • Banknote processing machines are used for sorting, destroying, paying out, depositing, etc. banknotes.
  • the banknotes to be processed are in the form of stacks which are separated in the banknote processing machines.
  • the individual banknotes are detected by a transport system and transported for processing by the banknote processing machine.
  • An apparatus for checking banknotes formed by one or more acoustic, electrical, optical, magnetic, mechanical, etc. sensors can obtain information about the banknotes, statements about the type, condition, authenticity, etc. of the banknotes allow. This information of the sensors are evaluated by a control unit. Depending on the evaluation of the information, the further processing of the banknotes takes place in the banknote processing machine.
  • the senor is connected via a first adhesive layer with a rigid carrier, the rigid carrier is a second, permanently elastic Adhesive layer with a component of the device for the examination of banknotes and / or directly connected to the banknote processing machine.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
  • Controlling Sheets Or Webs (AREA)

Abstract

The invention relates to an apparatus for checking banknotes in a banknote processing machine. In the case of the inventive apparatus for checking banknotes in a banknote processing machine, said apparatus having at least one sensor for detecting information that characterizes the banknotes to be checked, the sensor is connected to a flexurally rigid carrier via a first adhesive layer, the flexurally rigid carrier is connected to part of the apparatus for checking banknotes via a second, permanently elastic adhesive layer and/or is directly connected to the banknote processing machine.

Description

Vorrichtung für die Prüfung von Banknoten Device for checking banknotes
Die Erfindung betrifft eine Vorrichtung für die Prüfung von Banknoten in einer Banknotenbearbeitungsmaschine.The invention relates to a device for checking banknotes in a banknote processing machine.
Banknotenbearbeitungsmaschinen werden zum Sortieren, Vernichten, Aus- zahlen, Einzahlen usw. von Banknoten verwendet. In der Regel liegen die zu bearbeitenden Banknoten in Form von Stapeln vor, die in den Banknotenbearbeitungsmaschinen vereinzelt werden. Die einzelnen Banknoten werden von einem Transportsystem erfaßt und zur Bearbeitung durch die Banknotenbearbeitungsmaschine transportiert. Eine Vorrichtung für die Prüfung von Banknoten, die von einem oder mehreren akustischen, elektrischen, optischen, magnetischen, mechanischen usw. Sensoren gebildet wird, kann Informationen über die Banknoten ermitteln, die Aussagen über die Art, den Zustand, die Echtheit usw. der Banknoten erlauben. Diese Informationen der Sensoren werden von einer Steuereinheit ausgewertet. Abhängig von der Auswertung der Informationen erfolgt die weitere Bearbeitung der Banknoten in der Banknotenbearbeitungsmaschine.Banknote processing machines are used for sorting, destroying, paying out, depositing, etc. banknotes. As a rule, the banknotes to be processed are in the form of stacks which are separated in the banknote processing machines. The individual banknotes are detected by a transport system and transported for processing by the banknote processing machine. An apparatus for checking banknotes formed by one or more acoustic, electrical, optical, magnetic, mechanical, etc. sensors can obtain information about the banknotes, statements about the type, condition, authenticity, etc. of the banknotes allow. This information of the sensors are evaluated by a control unit. Depending on the evaluation of the information, the further processing of the banknotes takes place in the banknote processing machine.
Die mechanischen Komponenten der Banknotenbearbeitungsmaschine, beispielsweise der Antrieb des Transportsystems, verursachen teilweise starke Vibrationen, Schall usw., die sich auch auf die Vorrichtung für die Prüfung von Banknoten auswirken, da diese mit der Banknotenbearbeitungsmaschine verbunden sind. Dadurch verursachen die Vibrationen, der Schall usw. eine Beschleunigung der Vorrichtung für die Prüfung von Banknoten bzw. der darin enthaltenen Sensoren. Dies hat wiederum zur Folge, daß die Mes- sungen von hochempfindlichen Sensoren gestört werden können, wodurch sich folglich das Signal-Störverhältnis der Meßsignale verschlechtert. Aufgabe der vorliegenden Erfindung ist es deshalb, eine Vorrichtung für die Prüfung von Banknoten in einer Banknotenbearbeitungsmaschine anzugeben, die hinsichtlich auftretender Störungen, wie Vibrationen, Schall usw., unempfindlicher ist.The mechanical components of the bank-note processing machine, for example the drive of the transport system, sometimes cause strong vibrations, sound, etc., which also affect the device for checking banknotes, since these are connected to the bank-note processing machine. As a result, the vibrations, the sound, etc., cause an acceleration of the banknote inspection apparatus or the sensors contained therein. This in turn means that the measurements of highly sensitive sensors can be disturbed, as a result of which the signal-interference ratio of the measuring signals is worsened. The object of the present invention is therefore to specify a device for checking banknotes in a bank-note processing machine, which is less sensitive to occurring disturbances, such as vibrations, sound, etc.
Diese Aufgabe wird erfindungsgemäß durch eine Vorrichtung mit den Merkmalen des Anspruchs 1 gelöst.This object is achieved by a device having the features of claim 1.
Bei der erfindungsgemäßen Vorrichtung für die Prüfung von Banknoten in einer Banknotenbearbeitungsmaschine, mit mindestens einem Sensor für die Erfassung von die zu prüfenden Banknoten kennzeichnenden Informationen, ist der Sensor über eine erste Kleberschicht mit einem biegesteifen Träger verbunden, der biegesteife Träger ist über eine zweite, dauerelastische Kleberschicht mit einem Bestandteil der Vorrichtung für die Prüfung von Banknoten und/ oder direkt mit der Banknotenbearbeitungsmaschine verbunden.In the apparatus according to the invention for checking banknotes in a bank-note processing machine, with at least one sensor for the detection of the information to be tested banknotes, the sensor is connected via a first adhesive layer with a rigid carrier, the rigid carrier is a second, permanently elastic Adhesive layer with a component of the device for the examination of banknotes and / or directly connected to the banknote processing machine.
Die erfindungsgemäße Vorrichtung für die Prüfung von Banknoten weist den Vorteil auf, daß auftretende mechanische Störungen, z. B. Vibrationen, Schall usw., nicht oder nur in sehr stark reduziertem Maße zu einer Verschlechterung der Prüfung von Banknoten führen.The inventive device for the examination of banknotes has the advantage that occurring mechanical disturbances, eg. As vibration, sound, etc., not or only to a very greatly reduced extent lead to a deterioration of the examination of banknotes.
Weitere Vorteile der vorliegenden Erfindung ergeben sich aus den abhängigen Ansprüchen sowie der nachfolgenden Beschreibung einer Ausführungs- form anhand einer schematischen Darstellung. Zur Vereinfachung sind in der Figur nur die im Zusammenhang mit der vorliegenden Erfindung wichtige Bestandteile einer Vorrichtung für die Prüfung von Banknoten sowie einer sie enthaltenden Banknotenbearbeitungsmaschine dargestellt. Die einzige Figur zeigt eine Banknotenbearbeitungsmaschine 1, die mechanische Komponenten enthält, z. B. ein Transportsystem, einen Vereinzeier usw. Die mechanischen Komponenten werden von einem Antrieb 2 angetrieben, beispielsweise von einem oder mehreren Motoren. Durch mechanische Ver- bindungen 3 des Antriebs 2 und der weiteren mechanischen Komponenten sowie durch die Unterbringung in einem die Banknotenbearbeitungsmaschine 1 bildenden Gehäuse, werden von den mechanischen Komponenten und dem Antrieb 2 erzeugte Vibrationen, Schall usw. auf sämtliche Bestandteile der Banknotenbearbeitungsmaschine 1 übertragen.Further advantages of the present invention will become apparent from the dependent claims and the following description of an embodiment with reference to a schematic representation. For the sake of simplicity, the figure shows only those components of a device for checking banknotes which are important in connection with the present invention and a bank-note processing machine containing them. The sole figure shows a banknote processing machine 1 containing mechanical components, e.g. As a transport system, a Vereinzeier etc. The mechanical components are driven by a drive 2, for example, one or more engines. By mechanical connections 3 of the drive 2 and the other mechanical components as well as by the housing in a banknote processing machine 1 forming housing, generated by the mechanical components and the drive 2 vibrations, sound, etc. are transmitted to all components of the banknote processing machine 1.
Derartige mechanische Störungen, wie Vibrationen, Schall usw., werden im Gehäuse oder über mechanische Verbindungen auch auf eine Vorrichtung für die Prüfung von Banknoten übertragen. Können die mechanischen Störungen direkt auf in der Vorrichtung für die Prüfung von Banknoten enthal- tene Sensoren einwirken, werden die Sensoren durch die mechanischen Störungen beschleunigt, verformt, z. B. durchgebogen, usw. Von Sensoren aus Halbleitermaterialien, z. B. III-IV-Halbleiter wie GaAs, InGaAs usw., ist bekannt, daß dadurch Störsignale erzeugt werden, die die Messungen beeinflussen, da die Störsignale das Signal-Störverhältnis verschlechtern. Derarti- ger Störungen sind auch als Mikrophonieeffekt bekannt.Such mechanical disturbances, such as vibrations, sound, etc., are also transmitted in the housing or via mechanical connections to a device for checking banknotes. If the mechanical disturbances can act directly on sensors contained in the apparatus for checking banknotes, the sensors are accelerated, deformed, e.g. B. bent, etc. From sensors made of semiconductor materials, eg. As III-IV semiconductors such as GaAs, InGaAs, etc., it is known that this generates interference signals that affect the measurements, since the interference signals deteriorate the signal-to-noise ratio. Such disorders are also known as microphonic effects.
Um derartige negative Einflüsse der mechanischen Störungen auf Vorrichtungen für die Prüfung von Banknoten zu verhindern oder um diese erheblich zu reduzieren, ist es bei einer Vorrichtung 5 für die Prüfung von Bank- noten vorgesehen, einen Sensor 10, der aus einem Halbleitermaterial, besteht, mit einem biegesteifen Träger 30 zu verbinden. Der biegesteife Träger 30 kann aus einem Keramikmaterial hergestellt werden oder aus ähnlichen Materialien mit hohem Elastizitätsmodul. Die Biegesteifigkeit des Trägers wird auch maßgeblich durch das Verhältnis von Länge bzw. Breite zu Dicke beeinflusst, wobei sich eine Verhältnis von ca. 10 als vorteilhaft erwiesen hat. Eine Verbindung 20 kann z. B. durch Verkleben von Sensor 10 und biegesteifem Träger 30 erfolgen. Ein dazu verwendeter erster Kleber 20 soll ein hochfester, ein- oder mehrkomponentiger Strukturklebstoff sein, der bevorzugt leitfähig eingestellt ist. Beispielsweise kann für den Kleber 20 ein Epoxyd- Kleber verwendet werden. Zur Erzeugung eines biegesteifen, hochfesten Klebeverbundes ist der Klebespalt möglichst gering zu halten, bevorzugt kleiner 100 μm, und die Größe des Trägers 30 an die Größe des Sensors 10 zzgl. der für den elektrischen Anschluß benötigten Kontaktzonen mit gerin- gern Übermaß anzupassen.In order to prevent or substantially reduce such negative influences of the mechanical disturbances on devices for checking banknotes, it is provided in a device 5 for checking banknotes, a sensor 10, which consists of a semiconductor material, with To connect a rigid support 30. The rigid support 30 may be made of a ceramic material or of similar high modulus materials. The bending stiffness of the carrier is also determined by the ratio of length or width to thickness influenced, with a ratio of about 10 has proved to be advantageous. A compound 20 may, for. B. by gluing of sensor 10 and rigid carrier 30 done. A first adhesive 20 used for this purpose should be a high-strength, single-component or multi-component structural adhesive which is preferably made conductive. For example, an epoxy adhesive may be used for the adhesive 20. In order to produce a rigid, high-strength adhesive bond, the bond gap must be kept as small as possible, preferably less than 100 .mu.m, and the size of the mount 30 must be adapted to the size of the sensor 10 plus the contact zones required for the electrical connection with slight excess.
Der Verbund aus Sensor 10, erster Kleber Schicht 20 und biegesteifem Träger 30, wird schließlich mit einer die Vorrichtung 5 für die Prüfung von Banknoten bildenden Leiterplatte, einem Gehäuse oder ähnlichem 50 mechanisch und elektrisch verbunden. Da die Leiterplatte, das Gehäuse oder ähnliches 50, direkt über mechanische Verbindungen 4 mit der Banknotenbearbeitungsmaschine 1 verbunden ist, erfolgt die Montage des Verbunds aus Sensor 10, erster Kleberschicht 20 und biegesteifem Träger 30 mit der Leiterplatte, dem Gehäuse oder ähnlichem 50 über eine dauerelastische Verbindung. Dazu wird eine zweite Kleberschicht 40 verwendet, die mittels eines dauerelastischen Klebers, z. B. ein- oder mehrkomponentiges Silikon, oder eines dauerelastischen Doppelklebebands gebildet wird. Die Dicke der dauer elastischen Klebeverbindung 40 soll so gewählt werden, daß die störungsanregenden, mechanischen Schwingungen der Leiterplatte, dem Gehäuse oder ähnlichem 50 optimal gedämpft werden, ohne die Positionsstabiltät des Sensors 10 zu beeinträchtigen.The composite of sensor 10, first adhesive layer 20, and rigid support 30 is finally mechanically and electrically connected to a printed circuit board forming apparatus 5, housing, or the like 50. Since the printed circuit board, the housing or the like 50 is connected directly to the banknote processing machine 1 via mechanical connections 4, the assembly of the sensor 10, first adhesive layer 20 and rigid support 30 with the printed circuit board, housing or the like 50 is permanently elastic Connection. For this purpose, a second adhesive layer 40 is used, which by means of a permanently elastic adhesive, for. B. single or multi-component silicone, or a permanently elastic double adhesive tape is formed. The thickness of the permanently elastic adhesive joint 40 should be chosen so that the störungsanregenden, mechanical vibrations of the circuit board, the housing or the like 50 are optimally damped without affecting the positional stability of the sensor 10.
Durch die Verwendung der zweiten, dauerelastischen Kleberschicht 40 wird die Übertragung mechanischer Störungen auf den Sensor 10 verhindert, wie z. B. Vibrationen. Der biegesteife Träger 30 verhindert Verformungen des Sensors 10, wie z. B. Durchbiegungen. Dadurch werden die eingangs geschilderten Probleme bei der Prüfung von Banknoten in Banknotenbearbeitungsmaschinen verhindert bzw. weitgehend reduziert.By using the second, permanently elastic adhesive layer 40, the transmission of mechanical disturbances to the sensor 10 is prevented, such as z. B. vibrations. The rigid support 30 prevents deformation of the sensor 10, such. B. deflections. As a result, the problems described in the examination of banknotes in banknote processing machines are prevented or largely reduced.
Der Verbunds aus Sensor 10, erster Kleberschicht 20 und biegesteifem Träger 30 kann mittels der zweiten, flexiblen Kleberschicht 40 auch direkt mit der Banknotenbearbeitungsmaschine bzw. deren Gehäuse 1 verbunden sein.The composite of sensor 10, first adhesive layer 20 and rigid support 30 can also be connected directly to the banknote processing machine or its housing 1 by means of the second, flexible adhesive layer 40.
Vorstehend wurde beschrieben, daß die Vorrichtung für die Prüfung von Banknoten in einer Banknotenbearbeitungsmaschine enthalten ist, welche einen Antrieb, ein Transportsystem usw. enthält, die Störungen in Form von Vibrationen, Erschütterungen usw. erzeugen. Es ist aber offensichtlich, daß die Vorrichtung für die Prüfung von Banknoten auch in Banknotenbearbei- tungsmaschinen eingesetzt werden kann, die eine abweichende Bauform aufweisen. Beispielsweise kann es sich dabei um ein Handprüfgerät handeln, das die Vorrichtung für die Prüfung von Banknoten enthält und von Hand über zu prüfende Banknoten geführt wird, wobei ebenfalls Störungen wie Vibrationen, Erschütterungen usw. entstehen. It has been described above that the bank note validator is included in a bill handling machine which includes a drive, a transport system, etc., which generate disturbances in the form of vibrations, shocks, etc. However, it is obvious that the apparatus for checking banknotes can also be used in banknote processing machines which have a different design. For example, it may be a hand-held tester containing the apparatus for checking banknotes and being manually guided over banknotes to be tested, also causing disturbances such as vibrations, shocks, etc.

Claims

P a t e n t a n s p r li e h e Patent Pending
1. Vorrichtung für die Prüfung von Banknoten in einer Banknotenbearbeitungsmaschine, mit mindestens einem Sensor (10) für die Erfassung von die zu prüfenden Banknoten kennzeichnenden Informationen, dadurch gekennzeichnet, daß der Sensor (10) über eine erste Kleberschicht (20) mit einem biegesteifen Träger (30) verbunden ist, und daß der biegesteife Träger (30) über eine zweite, dauerelastische Kleberschicht (40) mit einem Bestandteil (50) der Vorrichtung für die Prüfung von Banknoten (5) und/ oder direkt mit der Banknotenbearbeitungsmaschine (1) verbunden ist.Anspruch [en] A device for checking banknotes in a banknote processing machine, comprising at least one sensor (10) for detecting information identifying the banknotes to be checked, characterized in that the sensor (10) comprises a first adhesive layer (20) with a rigid carrier (30), and in that the rigid support (30) is connected via a second, permanently elastic adhesive layer (40) to a component (50) of the banknote validator (5) and / or directly to the banknote processing machine (1) is.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die erste Kleberschicht (20) von einem hochfesten Strukturkleber gebildet wird.2. Apparatus according to claim 1, characterized in that the first adhesive layer (20) is formed by a high-strength structural adhesive.
3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die zweite Kleberschicht (40) von einem dauerelastischen Reaktionsklebstoff o- der einem dauerelastischem Klebeband mit Mehrschichtaufbau gebildet wird.3. Apparatus according to claim 1 or 2, characterized in that the second adhesive layer (40) of a permanently elastic reaction adhesive o- is formed of a permanently elastic adhesive tape with multi-layer structure.
4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der biegesteife Träger (30) von einem Material mit hohem Elastizitäts- modul gebildet wird.4. Device according to one of claims 1 to 3, characterized in that the rigid support (30) is formed of a material with a high modulus of elasticity.
5. Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Bestandteil (50) der Vorrichtung für die Prüfung von Banknoten (5) eine Leiterplatte oder ein Gehäuse ist. 5. Device according to one of claims 1 to 4, characterized in that the component (50) of the device for the examination of banknotes (5) is a printed circuit board or a housing.
6. Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß der mindestens eine Sensor (10) aus einem Halbleitermaterial besteht, insbesondere aus GaAs oder InGaAs.6. Device according to one of claims 1 to 5, characterized in that the at least one sensor (10) consists of a semiconductor material, in particular of GaAs or InGaAs.
7. Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die Banknotenbearbeitungsmaschine ein Handgerät ist. 7. Device according to one of claims 1 to 6, characterized in that the banknote processing machine is a hand-held device.
EP06754514.5A 2005-06-22 2006-06-22 Apparatus for checking banknotes Not-in-force EP1897069B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005028906A DE102005028906A1 (en) 2005-06-22 2005-06-22 Banknotes checking apparatus for use in banknote processing machine, has sensor connected to flexural resistant carrier via adhesive layer, where carrier is connected to component of apparatus via another elastic adhesive layer
PCT/EP2006/006022 WO2006136417A1 (en) 2005-06-22 2006-06-22 Apparatus for checking banknotes

Publications (2)

Publication Number Publication Date
EP1897069A1 true EP1897069A1 (en) 2008-03-12
EP1897069B1 EP1897069B1 (en) 2013-05-01

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EP06754514.5A Not-in-force EP1897069B1 (en) 2005-06-22 2006-06-22 Apparatus for checking banknotes

Country Status (5)

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US (1) US9177432B2 (en)
EP (1) EP1897069B1 (en)
DE (1) DE102005028906A1 (en)
RU (1) RU2397545C2 (en)
WO (1) WO2006136417A1 (en)

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Also Published As

Publication number Publication date
EP1897069B1 (en) 2013-05-01
US9177432B2 (en) 2015-11-03
RU2397545C2 (en) 2010-08-20
WO2006136417A1 (en) 2006-12-28
US20080271973A1 (en) 2008-11-06
RU2008101368A (en) 2009-07-27
DE102005028906A1 (en) 2006-12-28

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