EP1885553A2 - Structure balistique stratifiee - Google Patents
Structure balistique stratifieeInfo
- Publication number
- EP1885553A2 EP1885553A2 EP06760019A EP06760019A EP1885553A2 EP 1885553 A2 EP1885553 A2 EP 1885553A2 EP 06760019 A EP06760019 A EP 06760019A EP 06760019 A EP06760019 A EP 06760019A EP 1885553 A2 EP1885553 A2 EP 1885553A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- adhesive
- laminate sheet
- fiber bundles
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 239000000853 adhesive Substances 0.000 claims description 95
- 230000001070 adhesive effect Effects 0.000 claims description 95
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- 239000002131 composite material Substances 0.000 claims description 12
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- 239000011888 foil Substances 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
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- 229910001369 Brass Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
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- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 14
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 14
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- 238000000034 method Methods 0.000 description 8
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 3
- 244000043261 Hevea brasiliensis Species 0.000 description 3
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
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- WPBZMCGPFHZRHJ-UHFFFAOYSA-N 4-aminobenzohydrazide Chemical compound NNC(=O)C1=CC=C(N)C=C1 WPBZMCGPFHZRHJ-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 241000531908 Aramides Species 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920000784 Nomex Polymers 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical compound OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 239000004763 nomex Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 2
- 229920002432 poly(vinyl methyl ether) polymer Polymers 0.000 description 2
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- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
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- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 2
- MABVABFBWKQILU-ZPUQHVIOSA-N (2e,4e)-hexa-2,4-dienediamide Chemical compound NC(=O)\C=C\C=C\C(N)=O MABVABFBWKQILU-ZPUQHVIOSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- TURGQPDWYFJEDY-UHFFFAOYSA-N 1-hydroperoxypropane Chemical compound CCCOO TURGQPDWYFJEDY-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- LMXZDVUCXQJEHS-UHFFFAOYSA-N 2-(1-phenylethyl)benzene-1,4-diol Chemical compound C=1C(O)=CC=C(O)C=1C(C)C1=CC=CC=C1 LMXZDVUCXQJEHS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
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- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VSZJLXSVGVDPMJ-UHFFFAOYSA-N 2-phenylterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C=2C=CC=CC=2)=C1 VSZJLXSVGVDPMJ-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- BYQDGAVOOHIJQS-UHFFFAOYSA-N 3-(3-benzoyloxypropoxy)propyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCCOCCCOC(=O)C1=CC=CC=C1 BYQDGAVOOHIJQS-UHFFFAOYSA-N 0.000 description 1
- TYEPNYPBRWVOSH-UHFFFAOYSA-N 3-chloro-4-(hydrazinecarbonyl)benzoic acid Chemical compound NNC(=O)C1=CC=C(C(O)=O)C=C1Cl TYEPNYPBRWVOSH-UHFFFAOYSA-N 0.000 description 1
- DCWQZPJHHVLHSV-UHFFFAOYSA-N 3-ethoxypropanenitrile Chemical compound CCOCCC#N DCWQZPJHHVLHSV-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- VVYWUQOTMZEJRJ-UHFFFAOYSA-N 4-n-methylbenzene-1,4-diamine Chemical compound CNC1=CC=C(N)C=C1 VVYWUQOTMZEJRJ-UHFFFAOYSA-N 0.000 description 1
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- HNSSZVCYAYHUIH-UHFFFAOYSA-N 6-(hydrazinecarbonyl)pyridine-3-carboxylic acid Chemical compound NNC(=O)C1=CC=C(C(O)=O)C=N1 HNSSZVCYAYHUIH-UHFFFAOYSA-N 0.000 description 1
- FITNAOAKVDEJHB-UHFFFAOYSA-N 6-azaniumylhexylazanium;benzene-1,3-dicarboxylate Chemical compound NCCCCCCN.OC(=O)C1=CC=CC(C(O)=O)=C1 FITNAOAKVDEJHB-UHFFFAOYSA-N 0.000 description 1
- UFFRSDWQMJYQNE-UHFFFAOYSA-N 6-azaniumylhexylazanium;hexanedioate Chemical compound [NH3+]CCCCCC[NH3+].[O-]C(=O)CCCCC([O-])=O UFFRSDWQMJYQNE-UHFFFAOYSA-N 0.000 description 1
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- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229920000561 Twaron Polymers 0.000 description 1
- VJHCJDRQFCCTHL-UHFFFAOYSA-N acetic acid 2,3,4,5,6-pentahydroxyhexanal Chemical compound CC(O)=O.OCC(O)C(O)C(O)C(O)C=O VJHCJDRQFCCTHL-UHFFFAOYSA-N 0.000 description 1
- UGZICOVULPINFH-UHFFFAOYSA-N acetic acid;butanoic acid Chemical compound CC(O)=O.CCCC(O)=O UGZICOVULPINFH-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
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- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
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- 125000004448 alkyl carbonyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- ALHNLFMSAXZKRC-UHFFFAOYSA-N benzene-1,4-dicarbohydrazide Chemical compound NNC(=O)C1=CC=C(C(=O)NN)C=C1 ALHNLFMSAXZKRC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
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Definitions
- the present invention relates to a ballistic structure, and, more particularly, to a laminate sheet having a plurality of fiber bundles and other ballistic structures incorporating such a laminate sheet.
- Fiber bundles arranged as a laminate sheet are often used with ballistic structures. Generally, fiber bundles are arrayed and laminated to form the laminate sheet. A laminate sheet may also include several arrays arranged as layers in the laminate sheet. The laminate sheet may be used in soft body armor, as backing for a ceramic or other facing in hard armor, or in other ballistic applications.
- the fiber bundles in an array are adhered with a polymeric resin or other adhesive.
- the resin or adhesive penetrates the bundles and forms a matrix around individual fibers in the bundles as well as adhering adjoining bundles. Two or more layers of these arrays are then laminated together.
- Some conventional laminate sheets are formed without the use of a resin or adhesive matrix encapsulating the fibers. These sheets are formed with no adhesive or resin adhering the fibers or the fiber bundles together, but with a thin polymeric film that is placed on the surface of the fiber bundles in the layers or arrays to be laminated and subjected to high temperature and/or pressure. The high temperature/pressure forces the polymeric film into surface interstices in the arrays and, when cooled, adheres the adjacent arrays as a laminate sheet. There is no separate adhesive or resin applied to the fiber bundles to adhere the arrays, and the polymeric film does not penetrate into the fiber bundles.
- One embodiment of the present invention includes a laminate sheet with at least one layer of unidirectionally-oriented fiber bundles bound together with a discontinuous array of adhesive or resin.
- This resin or adhesive does not substantially penetrate the fiber bundle to encapsulate or form a matrix around a substantial number of individual fibers in the bundle.
- the resin makes up no more than about 20% by weight of the total laminate.
- One embodiment of the present invention provides a laminate sheet having at least two layers of unidirectionally-oriented fiber bundles with a release layer provided between the fiber bundle layers.
- the fiber bundle layers are also provided with an adhesive on their surface, between the fiber bundle and the release layer. The adhesive adheres the fiber bundles as a sheet and provides some bonding to the release layer.
- Neither the adhesive nor the release layer substantially penetrates the fiber bundle and no resin or adhesive matrix is formed encapsulating a substantial number of fibers.
- the film layer does not act as the sole adhesion layer for the fiber bundle layers.
- This release layer exhibits poor bonding qualities to the adhesives on the surface of the fiber bundle layers and helps minimize inter-laminar shear during ballistic impact.
- Figure 1 is a representational view of a layer of fiber bundles with adhesive on one side
- Figure 2 is a representational view of a layer of fiber bundles adhesive on both sides;
- Figure 3 is a representational view of two layers of fiber bundles
- Figure 4 is a representational view of a layer of fiber bundles and a release layer
- Figure 5 is a representational view of two layers of fiber bundles and release layers
- Figure 6 is a representational view of two layers of fiber bundles and release layers.
- Figure 7 is a representational view of another embodiment of two layers of fiber bundles and release layers.
- the present invention relates to a ballistic material suitable for use in armor applications, particularly lightweight armor applications.
- the material is suitable for use in, among other uses, hard armor panels, for use behind ceramic or other materials as a backing, and as a soft armor material for body armor.
- a basic laminate of unidirectionally-oriented fiber bundles is formed in which an adhesive is applied to the surface of the fiber bundles.
- the adhesive may be in the form of a discontinuous array of resin.
- the adhesive adheres the fiber bundles into an array or layer.
- the adhesive does not substantially penetrate into the fiber bundles and no resin or adhesive matrix is formed encapsulating a substantial number of fibers.
- the adhesive forms a discontinuous array and is no more than about 20% by weight of the total laminate.
- the adhesive is less than about 12% by weight of the total laminate, for example, less than 10% by weight, and, more preferably, less than about 5% by weight of the total laminate.
- the discontinuous array of adhesive may be applied in any manner, such as application in powder form with subsequent fusing to the fiber array, randomly dispersed continuous or chopped filaments head fused to the fiber array, or application of a non-woven array of thermoplastic adhesive, such as a hot-melt adhesive web, for example, that sold under the trademark Spunfab ® , sold by Spunfab Corporation, Cuyahoga Falls, Ohio.
- Another example of a suitable adhesive is powdered resin, such as sold under the trademark Saran 506 by Dow Chemical Company.
- More than one layer of this basic laminate may be combined to provide more complex laminates having at least two layers, and preferably fewer than ten layers, of the basic laminate. Such combination may be effected, for example, by a combination of heat and pressure applied to two or more basic laminates.
- the complex laminate is preferably a combination of basic laminates stacked and laminated in such a way as to retain flexibility. These complex laminates may also then be stacked, layered, or combined to provide, for example, a thick, rigid armor product.
- Control of the inter-laminar shear properties between the layers of the basic laminate, or between layers of the more complex laminates, can improve the effectiveness of the material as a ballistic material.
- a release layer is provided between adjacent layers of fiber bundles, or basic laminates, to control inter-laminar shear.
- the release layer is a poor adhesion layer applied to the adhesive layer, but does provide some bonding to the adhesive layers.
- the release layer provides a low inter-laminar shear strength between the fiber bundle layers to facilitate inter-laminar debonding at the point of impact of a ballistic event.
- the release layer reduces bonding strength between the layers by at least about 15% compared to a laminate without a release layer, as defined by a climbing drum peel test in accordance with ASTM D1781-98 (2004).
- the release layer applied to the structure may be in the form of:
- a suitable release layer is polyethylene terephthalate film, such as made by Mitsubishi Polyester Film Group, having a minimum thickness of about 0.00005 inch thick.
- Polyethylene film is also suitable for the release layer, such as polyethylene film with a thickness of about 0.0035 inch.
- Polyethylene film having thickness of about 0.002 inch (2 mil), 0.001 inch (1 mil) , or 0.0005 inch (0.5 mil) or less is also suitable.
- Other materials are also suitable and may be selected without undue experimentation and without departing from the spirit and scope of the invention. Selection of different combinations of materials for the release layer and the adhesives may result in different inter-laminar shear characteristics to accommodate different ballistic needs.
- the release layer is a layer of continuous or perforated material that is the connecting link between the layers.
- the adhesive layer sticks to the fibers and filaments, and also sticks to the release layer.
- the release layer need not stick to the fibers or filaments to make a laminate structure, it just needs to stick to the adhesive layer, which is stuck to the fibers. This is particularly suitable when the laminates are molded at low pressures (e.g., vacuum bag process (14psi)), where there is not enough pressure to force the film past the adhesive layer and into the fiber or where the release layer melts at a higher temperature than the adhesive layer.
- this release layer reduces the inter-laminar shear strength between layers compared to the shear strength between the layers if the release layer is not present. If it did't present, the adhesive layers would stick to each other and provide a higher inter-laminar shear and a lower ballistic result.
- the laminate may be structured with release layers to reduce inter-laminar shear strength between individual basic laminate layers, between complex laminate layers, or a combination thereof.
- Figure 1 illustrates a first fiber bundle layer 10 with a plurality of fiber bundles 12 arranged unidirectionally.
- An adhesive layer 14 is applied to a top surface 16 of the fiber bundle layer 10.
- Figure 2 illustrates a single fiber bundle layer 10 having an adhesive layer 14 applied to both the top surface 16 and a bottom surface 18 thereof.
- the adhesive in the adhesive layer 14 may be a first adhesive or a second adhesive.
- Figure 3 illustrates a structure with the first fiber bundle layer 10 and a second fiber bundle layer 20 arranged perpendicularly to the first fiber bundle layer 10.
- the adhesive present on the top surface 16 of the first fiber bundle layer 10 is a different adhesive than is present on the bottom surface 18 of the second fiber bundle layer 20.
- the first adhesive and the second adhesive both bond to the fiber substrates, and may have poor bonding properties relative to the other adhesive, such that localized de-bonding between the first layer and the second layer occurs at the point of ballistic impact. This serves to reduce the inter-laminar shear strength between the layers.
- Figure 4 illustrates the first fiber bundle layer 10 with adhesive layers 14 on both the top surface 16 and the bottom surface 18.
- a release layer 22 is applied to the adhesive layer 14 on the top surface 16.
- the release layer 22 has poor adhesion to the adhesive layer 14, but does have limited adhesion to the adhesive layer 14.
- Figure 5 illustrates a structure with first fiber bundle layer 10 and second fiber bundle layer 20. Both fiber bundle layers 10, 20 have an adhesive layer 14 applied to the top surface 16 and the bottom surface 18. A release layer 22 is applied to the adhesive layer 14 on the top surface 16 of the first fiber bundle layer 10. The release layer 22 is between the first fiber bundle layer 10 and the second fiber bundle layer 20. Optionally, a release layer 22 is applied to the adhesive layer 14 on the top surface of the second fiber bundle layer 20.
- Figure 6 illustrates a structure with first fiber bundle layer 10 and second fiber bundle layer 20.
- Both fiber bundle layers 10, 20 have an adhesive layer 14 applied to the top surface 16 and the bottom surface 18.
- a release layer 22 is applied to the adhesive layer 14 on the bottom surface 18 of the first fiber bundle layer 10 and a release layer applied to the top surface 16 of the second fiber bundle layer 20.
- the adhesive on the top surface 16 of the first fiber bundle layer 10 and the bottom surface 18 of the second fiber bundle layer 20 are different adhesives that both bond to the fiber substrates, but have poor bonding properties relative to the other adhesive.
- Figure 7 illustrates a structure with first fiber bundle layer 10 and second fiber bundle layer 20. Both fiber bundle layers 10, 20 have an adhesive layer 14 applied to the top surface 16 and the bottom surface 18. A release layer 22 is applied to the adhesive layer 14 on the top surface 16 of the second fiber bundle layer 20. As above, the adhesive on the top surface 16 of the first fiber bundle layer 10 and the bottom surface 18 of the second fiber bundle layer 20 may be different adhesives that both bond to the fiber substrates, and may have poor bonding properties relative to the other adhesive. [0034] While the Figures illustrate structures having only two fiber bundle layers, it is within the spirit and scope of the invention for more than two fiber bundle layers to be provided in a single structure.
- a complex laminate has a plurality of basic laminates, preferably fewer than ten basic laminates. Such a complex laminate may be used individually or stacked or layered with other complex or basic laminates to accommodate the particular ballistic need.
- the inter-laminar shear strength between basic laminates within a complex laminate and/or between complex laminates may be controlled to accommodate the particular ballistic need. This control of the inter-laminar shear strength between complex laminates may be accomplished by use of selected adhesives and/or selected release layers, as described herein relative to control of inter-laminar shear strength between fiber bundle layers.
- the placement of the release layer and the adhesive layer may be varied depending on the particular ballistic application encountered.
- another layer added on top of second fiber bundle layer 20 in Figure 7 could be provided with any suitable adhesive on its bottom surface 18, and the release layer 22 on the top surface 16 of the second fiber bundle layer would be disposed between the added fiber bundle layer and the second fiber bundle layer 20.
- Another fiber bundle layer added below the first fiber bundle layer 10 in Figure 7 could have either an adhesive layer 14 on its top surface 16 with an adhesive different from the adhesive in the adhesive layer 14 on the bottom surface 18 of the first fiber bundle 10 or a release layer 22 disposed on the adhesive layer 14 on its top surface 16.
- the arrangements and configurations of the adhesives and the release layers in adjacent fiber bundle layers are chosen to have poor adhesion with the surface of the immediately adjacent fiber bundle layer.
- Complex laminates having more than one basic laminate, and preferably fewer than ten basic laminates may be formed with selective release layers and selected adhesives between predetermined layers to accomplish the desired ballistic effectiveness.
- a complex laminate of four basic laminates there may be a release layer between the first and second basic laminate and between the third and fourth basic laminate, with no release layer between the second and third basic laminate.
- complex laminates having at least two basic laminates may be combined in which the inter-laminar layer between the complex laminates is the point at which the shear properties are controlled, such as by use of a release layer or by use of adhesives in the complex laminates that have poor adhesion to the adjacent complex laminate. Control of the shear properties by use of a release layer or adhesives between complex laminates may be accomplished in a similar manner to that discussed above for the combination of two basic laminate layers.
- the basic or complex laminates may also be provided with a protective layer on the outside of the outer fiber bundles to enhance durability, such as to resist moisture, wear, etc.
- This material is preferably a thin thermoplastic film or fabric, with, for example, a minimal thickness. Fabrics such as low denier (200 or less) nylon are preferred, and material such as polyethylene or urethane films with a thickness of less than 0.0005 mil are most preferred.
- first and second fiber bundle layers 10, 20 are disposed relative to each other may be varied without departing from the spirit and scope of the invention.
- first and second fiber bundle layers may be disposed at 45 degree angles relative to each other as opposed to the 90 degree angles illustrated in the Figures.
- a complex laminate may be made up of four layers with the second layer disposed at a 90 degree angle to the bottom layer, the third layer disposed at a +45 degree angle relative to the bottom layer and the top layer disposed at a -45 degree angle relative to the bottom layer. And one or more complex laminates may be disposed in a single article.
- a single ply or set of two layers disposed at 90 degree angles relative to each other — (0, 90) — is preferred.
- more than one ply or layer is preferable.
- Other variations include (0, 90, +45, -45)N — four layers disposed at the specified angles; N being a positive integer representing the number of plies or layer sets — or (0, -45, +45, 9O)N, etc.
- the manner in which the fiber bundles are dispersed may vary widely.
- the fiber bundles may be aligned in a substantially parallel, unidirectional fashion, or fiber bundles may by aligned in a multidirectional fashion with fiber bundles at varying angles with each other.
- fiber bundles in each layer are aligned in a substantially parallel, unidirectional fashion such as in a prepreg, pultruded sheet and the like.
- One such suitable arrangement is a complex laminate that includes a plurality of layers or laminates in which the fiber bundles are arranged in a sheet-like array and aligned parallel to one another along a common filament direction. Successive layers of such coated, unidirectional fiber bundles can be rotated with respect to the previous layer to form a relatively flexible composite.
- An example of such laminate structures are composites with the second, third, fourth and fifth layers rotated +45 degree, -45 degree, 90 degree and 0 degree, with respect to the first layer, but not necessarily in that order.
- Other examples include composites with 0 degree/90 degree layout of yarn or fiber bundles. Techniques and materials for fabricating these laminated structures are known.
- an adhesive is applied to at least one side of a network or layer of fiber bundles.
- the fibers in the fiber bundle layer may be arranged in networks having various configurations. For example, a plurality of filaments can be grouped together to form twisted or untwisted yarn bundles in various alignments.
- the filaments or yarn may be formed as a felt, knitted or woven (plain, basket, satin and crow feet weaves, etc.) into a network, fabricated into non-woven fabric, arranged in parallel array, layered, or formed into a woven fabric by any of a variety of conventional techniques.
- the adhesive layers may be applied in line with the use of a continuing laminating press and can be applied at the same time as the release layer.
- the present invention allows for lamination at relatively low pressures and still produce a durable laminate.
- a preferred pressure for lamination of the layers uses vacuum pressure of 14 psi to bond the layers of the laminate Higher processing pressures may be employed as long as the adhesive layer and/or release layer do not flow into and wet out the fiber.
- the fibers believed to be suitable in the fabrication of the fiber bundles 12 vary widely and are, preferably, organic or inorganic fibers having a tensile strength of at least about 5 grams/denier, a tensile modulus of at least about 30 grams/denier and an energy-to- break of at least about 20 joules/gram.
- the tensile properties may be measured by an Instron Tensile Testing Machine by pulling a 10 in. (25.4 cm) length of fiber clamped in barrel clamps at a rate of 10 in./min. (25.4 cm/min).
- Preferred fibers are those having a tenacity equal to or greater than about 10 g/d, a tensile modulus equal to or greater than about 150 g/d, and an energy-to-break equal to or greater than about 8 joules/gram.
- Particularly preferred fibers are those having a tenacity equal to or greater than about 20 g/d, a tensile modulus equal to or greater than about 500 g/d and energy-to-break equal to or greater than about 30 joules/grams.
- the invention includes embodiments in which the tenacity of the fibers is equal to or greater than about 25 g/d, the tensile modulus is equal to or greater than about 1000 g/d, and the energy-to-break is equal to or greater than about 35 joules/grams, and embodiments with a tenacity equal to or greater than about 30 g/d, the tensile modulus equal to or greater than about 1300 g/d and the energy-to-break equal to or greater than about 40 joules/grams.
- the denier of the fiber may vary widely. In general, suitable fiber denier is believed to be equal to or less than about 4000. In some embodiments, fiber denier is from about 10 to about 4000, such as between about 10 to about 3000, for example, between about 10 and 1500 or between about 10 and 1000.
- Useful inorganic fibers are believed to include S-glass fibers, E-glass fibers, carbon fibers, boron fibers, alumina fibers, zirconia-silica fibers, alumina-silica fibers and the like.
- organic fibers believed to be suitable are those composed of thermosetting resins, thermoplastics polymers and mixture thereof such as polyesters, polyolefms, polyetheramides, fluoropolymers, polyethers, celluloses, phenolics, polyesteramides, polyurethanes, epoxies, aminoplastics, polysulfones, polyetherketones, polyetheretherketones, polyesterimides, polyphenylene sulfides, polyether acryl ketones, poly(amideimides), and polyimides.
- thermosetting resins such as polyesters, polyolefms, polyetheramides, fluoropolymers, polyethers, celluloses, phenolics, polyesteramides, polyurethanes, epoxies, aminoplastics, polysulfones, polyetherketones, polyetheretherketones, polyesterimides, polyphenylene sulfides, polyether acryl ketones, poly(amideimides), and polyimides.
- Illustrative of other useful organic fibers are those composed of aramids (aromatic polyamides), such as poly ⁇ n-xylylene adipamide), poly(p- xylylene sebacamide), poly 2,2,2-trimethylhexamethylene terephthalamide), ⁇ oly(piperazine sebacamide), poly(metaphenylene isophthalamide) (Nomex®) and poly(p-phenylene terephthalamide) (Kevlar®); aliphatic and cyclo aliphatic polyamides, such as the copolyamide of 30% hexamethylene diammonium isophthalate and 70% hexamethylene diammonium adipate, the copolyamide of up to 30% bis-(-amidocyclohexyl)methylene, terephthalic acid and caprolactam, polyhexamethylene adipamide (nylon 66), poly(butyrolactam) (nylon 4), poly (9-aminonoanoic acid)
- poly(l,4-cyclohexlidene dimethyl eneterephathalate) cis and trans poly(ethylene-l,5- naphthalate), poly(ethylene-2,6-naphthalate), poly(l,4-cyclohexane dimethylene terephthalate) (trans), poly(decamethylene terephthalate), poly(ethylene terephthalate), poly(ethylene isophthalate), poly(ethylene oxybenozoate), poly(para-hydroxy benzoate), poly(dimethylpropio lactone), poly(decamethylene adipate), poly(ethylene succinate), poly(ethylene azelate), poly(decamethylene sebacate), poly(.beta.,.beta.-dimethyl- propiolactone), and the like.
- organic fibers believed useful are those of liquid crystalline polymers such as lyotropic liquid crystalline polymers which include polypeptides such as poly ⁇ -benzyl L-glutamate and the like; aromatic polyamides such as ⁇ oly(l,4-benzamide), poly(chloro-l,4-phenylene terephthalamide), poly(l,4-phenylene fumaramide), poly(chloro- 1,4-phenylene fumaramide), poly(4,4'-benzanilide trans, trans-muconamide), poly(l,4- phenylene mesaconamide), poly(l,4-phenylene) (trans- 1,4-cyclohexylene amide), poly(chloro-l,4-phenylene) (trans- 1,4-cyclohexylene amide), poly(l,4-phenylene 1,4- dimethyl-trans- 1,4-cyclohexylene amide), poly(l,4-ph.enylene
- organic fibers believed to be useful in the fabrication of fiber bundles 12 are those composed of extended chain polymers formed by polymerization of ⁇ , ⁇ -unsaturated monomers of the formula 1 .
- Ri and R 2 are the same or different and are hydrogen, hydroxy, halogen, alkylcarbonyl, carboxy, alkoxycarbonyl, heterocycle or alkyl or aryl either unsubstituted or substituted with one or more substituents selected from the group consisting of alkoxy, cyano, hydroxy, alkyl and aryl.
- polymers of a, ⁇ -unsaturated monomers are polymers including polystyrene, polyethylene, polypropylene, poly(l-octadence), polyisobutylene, poly(l- pentene), poly(2-methylstyrene), poly(4-methylstyrene), poly(l-hexene), ⁇ oly(l-pentene), poly(4-methoxystrene), poly(5-methyl-l-hexene), poly(4-methylpentene), poly(l-butene), polyvinyl chloride, polybutylene, polyacrylonitrile, poly(methyl pantene-1), poly(vinyl alcohol), poly(vinyl-acetate), polyvinyl butyral), poly(vinyl chloride), poly(vinylidene chloride), vinyl chloride-vinyl acetate chloride copolymer, poly(vinylidene fluoride), poly(methyl acrylate, poly(methyl acrylate, poly
- composite articles include a fiber network, which may include a high molecular weight polyethylene fiber, a high molecular weight polypropylene fiber, an aramide fiber, a high molecular weight polyvinyl alcohol fiber, a high molecular weight polyacrylonitrile fiber or mixtures thereof.
- suitable fibers are believed to be those of molecular weight of at least 150,000, preferably at least one million and more preferably between two million and five million.
- ECPE extended chain polyethylene
- polyethylene shall mean a predominantly linear polyethylene material that may contain minor amounts of chain branching or comonomers not exceeding 5 modifying units per 100 main chain carbon atoms, and that may also contain admixed therewith not more than about 50 wt % of one or more polymeric additives such as alkene-1 -polymers, in particular low density polyethylene, polypropylene or polybutylene, copolymers containing mono-olefins as primary monomers, oxidized poryolef ⁇ ns, graft polyolefm copolymers and polyoxymetliylenes, or low molecular weight additives such as anti-oxidants, lubricants, ultra-violet screening agents, colorants and the like which are commonly incorporated by reference.
- polymeric additives such as alkene-1 -polymers, in particular low density polyethylene, polypropylene or polybutylene, copolymers containing mono-olefins as primary monomers, oxidized poryolef
- polypropylene fibers of molecular weight at least 200,000, preferably at least one million and more preferably at least two million may be used.
- Such high molecular weight polypropylene may be formed into reasonably well oriented fibers by the techniques known. Since polypropylene is a much less crystalline material than polyethylene and contains pendant methyl groups, tenacity values achievable with polypropylene are generally substantially lower than the corresponding values for polyethylene. Accordingly, a suitable tenacity is at least S grams/denier, with a preferred tenacity being at least 11 grams/denier.
- the tensile modulus (as measured by an Instron Tensile Testing Machine) for polypropylene is at least 160 grams/denier, preferably at least 200 grams/denier.
- the particularly preferred ranges for the above-described parameters can advantageously provide improved performance in the final article.
- PV-OH fibers having high tensile modulus are believed suitable for the present invention.
- PV-OH fiber of molecular weight of at least about 200,000 may be particularly suitable.
- Particularly useful PV-OH fiber preferably has a tensile modulus (as measured by an Instron Tensile Testing Machine) of at least about 300 g/d, a tenacity of at least 7 g/d (preferably at least about 10 g/d, more preferably at about 14 g/d, and most preferably at least about 17 g/d), and an energy-to-break of at least about 8 joules/gram.
- PV-OH filaments having a weight average molecular weight of at least about 200,000, a tenacity of at least about 10 g/d, a tensile modulus (as measured by an Instron Tensile Testing Machine) of at least about 300 g/d, and an energy-to-break of about 8 joules/gram may be more useful in producing a ballistic resistant article.
- PV-OH fiber having such properties can be produced by known methods.
- Polyacrylonitrile (PAN) fiber of molecular weight of at least about 400,000 is believed to be suitable.
- Particularly useful PAN filament should have a tenacity of at least about 10 g/d (as measured by an Instron Tensile Testing Machine) and an energy-to-break of at least about 8 joules/gram.
- PAN fiber having a molecular weight of at least about 400,000, a tenacity of at least about 15 to about 20 g/d and an energy-to-break of at least 8 joules/gram is most useful in producing ballistic resistant articles.
- aramid fibers suitable aramid fibers formed principally from aromatic polyamide are known.
- Preferred aramid fiber will have a tenacity of at least about 20 g/d (as measured by an Instron Tensile Testing Machine), a tensile modulus of at least about 400 g/d (as measured by an Instron Tensile Testing Machine) and an energy-to-break at least about 8 joules/gram
- particularly preferred aramid fibers will have a tenacity of at least about 20 g/d, a modulus of at least about 4SO g/d and an energy-to-break of at least about 20 joules/gram.
- aramid fibers will have a tenacity of at least about 20 g/denier, a modulus of at least about 900 g/denier and an energy-to-break of at least about 30 joules/gram.
- poly(phenylene terephthalamide) fibers produced commercially by Dupont Corporation under the trade name of Kevlar® 29, 49, 129 and 149 having moderately high modulus and tenacity values are believed particularly useful in forming ballistic resistant composites.
- poly(metaphenylene isophthalamide) fibers produced commercially by Dupont under the tradename Nomex®.
- suitable fibers are known. Tenacities of about 15 to about 30 g/d (as measured by an histron Tensile Testing Machine) and preferably about 20 to about 25 g/d, and tensile modulus of about 500 to 1500 g/d (as measured by an histron Tensile Testing Machine) and preferably about 1000 to about 1200 g/d are particularly desirable. Fibers made under the trade name Vectran®, by Celanese corporation are believed very suitable. Preferred fibers for use in the fiber network are Vectran LCP, and PBO fibers. More preferred are aramid fibers sold under the trade name Kevlar® and Twaron®, and most preferred fibers are high performance polyethylene sold under the trade names Spectra® (Honeywell) and Dyneema® (DSM Corporation).
- the adhesive layer can be made of any number of suitable polymeric adhesives.
- the adhesive can be of a thermosetting or thermoplastic type.
- Preferred adhesives believed suitable include polydienes such as polybutadiene, polychloroprene and polysioprene; olefinic and copolymers such as ethylene-propylene, ethylene-chloropylene-diene copolymers, isobutylene-soprene copolymer, and chlorosulfonated polyethylene; natural rubber, polyfulfides, polyurethane elastomers; polyacrylates; polyethers; fluoroelastomer; unsaturated polyesters; vinyl esters; alkyds; flexible epoxy, flexible polyamides; epichlorophydrin; polyvinyls; flexible phenolics; silcon eleastomers; thermoplastic elastomers; copolymers of ethylene, polyvinyl formal, polyvinyl butyal; and poly(bis- maleimi
- Most preferred adhesives are polybutadiene, polyisoprene, natural rubber, ethylene- propylene copolymers, ethylene-propylene-diene terpolymers, polysulfides, polyurethane elastomers, chlorosulfonated polyethylene, polychloroprene, poly(isobutyleneco-iso ⁇ rene), polyacrylates, polyesters, vinyl esters, flexible epoxy, flexible nylon, silicone elastomers, copolymers of ethylene, polyvinyl formal, polyvinyl butyral, and blends of and combinations of two or more of the above-mentioned adhesive materials.
- the adhesive material is, for example, a low modulus, elastomeric material which has a tensile modulus, measured at about 23° C, of less than about 80,000 psi, for example, less than about 50,000 psi.
- the tensile modulus is between about 7,000 psi and about 80,000 psi.
- the elastomeric material preferably has an elongation to break of at least about 5%.
- the elongation to break of the elastomeric material is at least about 30%, more preferably is at least about 50%, and most preferably is at least about 100%.
- Suitable for use as a flexible adhesive are block copolymers of conjugated dienes such as butadiene and isoprene, and vinyl aromatic monomers such as styrene, vinyl toluene and t-butyl styrene; polydienes such as polybutadiene and polychloroprene, polyisoprene; natural rubber; copolymers and polymers of olefins and dienes such as ethylene-propylene copolymers, ethylene-propylene-diene terpolymers and poly(isobutylene-co-isoprene), polyfulfide polymers, polyurethane elastomers, and chlorosulfonated polyethylene; pasticized polyvinylchloride using dioctyl phthate or other plasticizers well known in the art; butadiene acrylonitrile elastomers; polyacrylates such as ⁇ oly(acrylic acid), poly(methylcyan
- One form for the adhesive is a non-woven spun thermoplastic adhesive.
- these polymeric materials are sold under the trade name SpunFab®, by Spunfab Corporation, Cuyahoga Falls, Ohio, and under the trade name Sharenet®, by Bostik Corporation, Middleton, MA.
- the preferred adhesives are Spunfab® Ternary Resins, more preferred are polyamides and polyesters, and most preferred are EAV and polyolefins.
- the release layer can be any suitable material that provides at least about 15% reduction in the interlaminar shear strength between the layers, as defined by the clinging drum peel test in ASTM D1781-98 (2004), compared to a laminate without such a release layer.
- Suitable materials include paper, metal foil, or plastic film. More preferable are plastic films such as polyester, polypropylene or urethane. Even more preferable are polyethylene films with an areal weight less than 50 grams per sq meter, and most preferable are polyethylene films with an areal weight less than 8 grams per sq meter.
- Lower inter- laminar shear can also be obtained with the application of a release agent such as silicone to the release film or the adhesive layer prior to bonding. This approach allows tailoring the inter-laminar shear to meet a specific ballistic requirement.
- the articles of this invention can be fabricated using a number of procedures.
- layers are formed by molding the combination of the fiber bundles in the desired configurations and amounts by subjecting the combination to heat and pressure during a mold cycle time.
- the molding temperature is usually selected such that it is less than the melting or softening point of the polymer from which the fibers of the fiber bundle layer are formed or the temperature at which fiber damage occurs, but is greater than the melting point or softening point of the polymer or polymers forming release or adhesive layer(s).
- molding temperatures range from about 20° to about 150° C, preferably from about 80° to about 145° C, and more preferably from about 100° to about 135° C.
- the molding pressure may vary widely and preferably may range from about 10 psi (69 IcPa) to about 30,000 psi (207,000 IcPa).
- a combination of pressure and temperature that would result in the adhesive layer and/or release layer impregnating into the fibers to form a resin matrix is preferably avoided.
- molding temperatures can approach 250° C, and the limiting factor is the temperature capability of the adhesive and the release layer, which will vary greatly depending on the particular material.
- SAPI small arms protective insert
- This invention can be incorporated as a backing to a ceramic facing and. is very suitable for this application.
- Another useful embodiment of the invention is as a soft armor material in ballistic vests. Because the material of the present invention is bonded with an adhesive layer as opposed to a non-adhesive film layer, the structural integrity of the flexible product is greatly enhanced. The benefit is more durability during long term use.
- Figure 6 illustrates a preferred embodiment for soft armor.
- the preferred unidirectional fiber bundles are coated with adhesive on both outer surfaces of the fiber bundles, and the release layer is laminated to one of the adhesive layers.
- the material is then cross plied (0/90) at a 90 degree orientation with a similar layer.
- the two layers are laminated under heat and pressure.
- the number of [0,90] layers is generally less than 5 and more preferably less than three.
- the orientation between layers can vary, with each layer at some angle to the other, for example, [0,90], [0,90,-45,45], [-45,45,-45,45], etc., as discussed above. There are endless combinations that are within the scope of the invention.
- the rigid layers preferably include an impact resistant material, such as solid or perforated steel plate or other metallic material, composite a ⁇ nor plate, ceramic material, ceramic reinforced metallic composite, and high strength fiber composites (for example, an aramid fiber and a high modulus, resin matrix such as epoxy or phenolic resin vinyl ester, unsaturated polyester, thermoplastics, nylon 6, nylon 6, 6 and polyvinylidine halides.)
- the ceramic is, for example, a carbide, such as boron carbide or silicon carbide, an oxide, such as aluminum oxide, or a nitride, such as silicon nitride. Other ceramic materials are also suitable for use.
- the rigid impact resistant layer is one that is ballistically effective.
- the improved adhesion between the fiber bundles achieved by use of the adhesive that does not substantially penetrate into the fiber bundle allows for better energy distribution within the layer in the laminate upon ballistic impact, resulting in better ballistic performance.
- the release or film layer of the present invention is not the sole adhesion layer among fibers of the fiber bundles, but helps minimize inter-laminar shear strength during ballistic impact. Reducing inter-laminar shear strength is believed to help the panels or layers delaminate and absorb energy during the ballistic event.
- Utilizing an adhesive layer that is optimized for adhesion also improves the durability of the overall laminate structure, especially when used a dual layer soft armor product.
- laminates were made with Spunfab ® adhesive POX 80579G (0.25 oz/ square yard) as the adhesive layer and 0.0035 inch thick polyethylene film as the release layer.
- Laminates were made with 80% fiber content with the resin being made of (A) a release layer next to an adhesive layer next to the fiber layer, and (B) an adhesive layer next to the fiber layer, with no release layer. They were tested to the NIJ (National Institute of Justice) .08 standard against an M-80 ball round and a V50 penetration velocity was determined. The material with the release layer out-performed the material with adhesive alone, as shown in Table 1.
- Test plates were made using aluminum oxide ceramic (0.195 inch thick) and a backing of Kevlar ® aramid fibers using Spunfab ® 80410 adhesive (0.25 oz/sq yard) on each side of a uni-directional Kevlar ® fibers, with a release layer of polyethylene. Samples were made to meet the specified weight of a heavyweight SAPI plate specification, and subjected to the first article ballistic testing as required by the U.S Army. The material passed all tests, demonstrating its suitability for use as a backing to ceramic.
- Test panels were made to demonstrate the materials suitability against 9mm handgun threats.
- a 15"xl5" panel, 28 plies of uni-directional Kevlar ® fibers with Spunfab ® 80410 adhesive (0.25 oz/sq yard) on each side of the fibers, and a release layer of polyethylene were fabricated using a vacuum bag process (14psi) and subsequently tested against 9mm rounds.
- the resulting V50 of 1750 ft/sec was well in excess of NIJ requirement demonstrating suitability for use as armor for defeating handgun threats.
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Multi-Layer Textile Fabrics (AREA)
- Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
Abstract
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US13199205A | 2005-05-18 | 2005-05-18 | |
PCT/US2006/019075 WO2006124995A2 (fr) | 2005-05-18 | 2006-05-17 | Structure balistique stratifiee |
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EP (1) | EP1885553A2 (fr) |
WO (1) | WO2006124995A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US9857148B2 (en) * | 2010-12-15 | 2018-01-02 | The Boeing Company | Controlled fiber-matrix adhesion in polymer fiber composites |
US20140206248A1 (en) * | 2011-12-20 | 2014-07-24 | Matscitechno Licensing Company | Impact dissipating fabric |
CZ305248B6 (cs) * | 2013-09-30 | 2015-07-01 | Vysoké Učení Technické V Brně | Materiál pro balistickou ochranu, způsob jeho přípravy a jeho použití |
JP5994060B2 (ja) * | 2013-11-15 | 2016-09-21 | 八田経編株式会社 | 熱可塑性樹脂補強シート材及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4623574A (en) * | 1985-01-14 | 1986-11-18 | Allied Corporation | Ballistic-resistant composite article |
US5190802A (en) * | 1989-01-06 | 1993-03-02 | Pilato Louis A | Ballistic resistant laminate |
GB2308094B (en) * | 1995-12-16 | 1999-07-28 | T & N Technology Ltd | Anti-ballistic garment |
NL1003405C2 (nl) * | 1996-06-24 | 1998-01-07 | Dsm Nv | Antiballistisch vormdeel. |
US20040221712A1 (en) * | 1999-03-20 | 2004-11-11 | Stewart Ricky William | Ballistic-resistant laminate assemblies and panels |
DE10011701A1 (de) * | 2000-03-10 | 2001-09-27 | Verseidag Indutex Gmbh | Flexibles Laminat |
US20040166755A1 (en) * | 2001-06-12 | 2004-08-26 | Bergmans Johannes Maria | Laminated ballistic structure comprising alternating undirectional and thermoplastic layers |
NO316296B1 (no) * | 2002-04-05 | 2004-01-05 | Hiform As | Lettvekts ballistisk beskyttelse og metode for å fremstille sådan |
DE10232269A1 (de) * | 2002-07-16 | 2004-02-05 | Hänsel Textil GmbH | Flexibler textiler Verstärkungsverbundstoff |
AU2003304692B2 (en) * | 2004-01-01 | 2010-05-27 | Dsm Ip Assets B.V. | Ballistic-resistant article |
US7148162B2 (en) * | 2004-03-08 | 2006-12-12 | Park Andrew D | Ballistic laminate structure in sheet form |
-
2006
- 2006-05-17 EP EP06760019A patent/EP1885553A2/fr not_active Withdrawn
- 2006-05-17 WO PCT/US2006/019075 patent/WO2006124995A2/fr active Application Filing
Non-Patent Citations (1)
Title |
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See references of WO2006124995A3 * |
Also Published As
Publication number | Publication date |
---|---|
WO2006124995A2 (fr) | 2006-11-23 |
WO2006124995B1 (fr) | 2007-11-22 |
WO2006124995A3 (fr) | 2007-07-12 |
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