EP1885024A1 - Antenne - Google Patents

Antenne Download PDF

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Publication number
EP1885024A1
EP1885024A1 EP06270074A EP06270074A EP1885024A1 EP 1885024 A1 EP1885024 A1 EP 1885024A1 EP 06270074 A EP06270074 A EP 06270074A EP 06270074 A EP06270074 A EP 06270074A EP 1885024 A1 EP1885024 A1 EP 1885024A1
Authority
EP
European Patent Office
Prior art keywords
transmit
array
antenna
receive modules
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06270074A
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English (en)
French (fr)
Inventor
designation of the inventor has not yet been filed The
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leonardo MW Ltd
Original Assignee
Selex Sensors and Airborne Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selex Sensors and Airborne Systems Ltd filed Critical Selex Sensors and Airborne Systems Ltd
Priority to EP06270074A priority Critical patent/EP1885024A1/de
Publication of EP1885024A1 publication Critical patent/EP1885024A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays

Definitions

  • This invention is concerned with alleviating the need for high power transmit/receive modules in phased array antennas and therefore reducing the cost of such array antennas.
  • phased array antennas The general trend in the art, when constructing phased array antennas, is to determine the highest operating frequency of an antenna to be constructed and, based on the requirements for spacing the radiating elements that result from this selected operating frequency, placing radiating elements coupled to transmit/receive modules at exactly this spacing to minimise the number of transmit/receive modules used.
  • the skilled person is inclined to utilise the highest powered transmit/receive modules available.
  • this is not a very cost-effective method of constructing a phased array antenna, as high power transmit/receive modules are usually very expensive.
  • the present invention provides a phased array antenna comprising: a plurality of communication modules; wherein a power density of said phased array antenna is equivalent to a power density of a second antenna that has fewer, higher power communication modules than the said phased array antenna.
  • each antenna element is connected to a communication module implemented as a highly integrated unit using a very small number, ideally one or two, integrated circuits.
  • the communication module is preferably a transmit and/or receive module.
  • the advantage of the present invention is that, by increasing the number of transmit/receive modules at the same time as increasing their density over the array face, less powerful modules can be used, which significantly reduces the cost of the array in total as each module becomes significantly simpler and cheaper, and the same or comparable power can be maintained per unit area of the array face.
  • FIG 1 is a schematic diagram of an antenna apparatus according to the specific embodiment of the present invention.
  • the antenna apparatus 100 has a processing portion 200 in communication (as shown by arrow 20) with an array portion 300.
  • Processing portion 200 is, in turn, in communication (as shown by arrow 10) with an external system (not shown).
  • the array portion 300 has an array face 400 that is shown in Figures 2 and 3 and described in more detail below with reference to these figures.
  • FIG. 2 shows the array face 400 of the specific embodiment of the invention.
  • the array face 400 is made up of a grid of radiating elements 410, spaced equally with a width D 1 between each radiating element 410 in the horizontal direction and a width D 2 between each radiating element 410 in the vertical direction. This arrangement is facilitated by providing each row of the radiating elements 410 along linear structures 420a to 420f.
  • the linear structures 420a to 420f are stacked so that each row of radiating elements 410 are in parallel with one another.
  • Width D 1 may be equal to, or different from, width D 2 .
  • FIG 3 shows an array face 400' according to an alternative embodiment of the invention.
  • the array face 400 is made up of an offset grid of radiating elements 410.
  • the radiating elements 410 are spaced equally with a width D 1 between each radiating element 410 in the horizontal direction.
  • the difference from the specific embodiment shown in Figure 2 is that, while there is a width D 2 between each row of radiating elements 410 in the vertical direction, adjacent rows of radiating elements are not aligned in the vertical direction.
  • each row of the radiating elements 410 along linear structures 420a' and 420f' which are stacked in parallel to one another but offset in the horizontal direction by half of width D 1 such that every other linear structure 420a', 420c', 420e', and 420b', 420d' of radiating elements 410 are aligned in the vertical direction.
  • the width D 1 may be equal to, or different from, width D 2 .
  • each radiating element 410, 410', 410" is in communication with a transmit/receive module 500, 500', 500" (as shown by arrows 34, 34', 34") which is in turn in communication with combining element 450 (as shown by arrows 32, 32', 32").
  • Each combining element 450 is in turn in communication (as shown by arrow 36) with the main array portion 300.
  • a plurality of transmit/receive modules 500 may be in communication with one combining element 450. Alternatively more than one combining element is then combined.
  • the transmit/receive module 500 takes the form of a two-chip solution.
  • the transmit/receive module 500 comprises a Radio Frequency (RF) chip 510, preferably implemented in Gallium Arsenide or Gallium Nitride, connected by wire bonds 540 to Silicon chip 520.
  • the chips 510, 520 are separated from each other by a ceramic shelf 530.
  • the Gallium-Arsenide chip 510 is responsible for the radio frequency amplification, power generation and phase control while the Silicon chip 520 is responsible for any necessary digital control and housekeeping functions.
  • the RF chip 510 is mounted on a base plate (not shown) to dissipate any heat generated.
  • the method of configuring the layout of radiating elements on 410 on the array face 400 is determined by, firstly, the required power from the array antenna, and secondly, the required power per unit area that is required to accomplish this.
  • the required spacing D of the radiating elements 410 can therefore be determined from this calculation, in order to give the appropriate power per unit area needed by the antenna.
  • a suitable density of transmit/receive modules can be determined.
  • the skilled person will appreciate that, by not using a low density of very high power transmit/receive modules, which are each very expensive, and instead using a higher density of low to medium power transmit/receive modules, which are comparably much cheaper, the overall cost of the antenna can be reduced without compromising the power rating of the antenna as a whole.
  • the array may be configured such that the radiating elements 410 are based on linear structures that are aligned vertically or in any other suitable arrangement.
  • spacing D between each radiating element are not necessarily the same in both the vertical and horizontal dimensions.
  • An important aspect of the present invention is that the cost reductions achievable by the use of highly integrated, low power transmit/receive modules (even in the larger numbers required) are significant compared to conventional techniques based on smaller numbers of high power modules, due principally to the disproportionately high cost of high power modules.
EP06270074A 2006-08-03 2006-08-03 Antenne Withdrawn EP1885024A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06270074A EP1885024A1 (de) 2006-08-03 2006-08-03 Antenne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06270074A EP1885024A1 (de) 2006-08-03 2006-08-03 Antenne

Publications (1)

Publication Number Publication Date
EP1885024A1 true EP1885024A1 (de) 2008-02-06

Family

ID=37517031

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06270074A Withdrawn EP1885024A1 (de) 2006-08-03 2006-08-03 Antenne

Country Status (1)

Country Link
EP (1) EP1885024A1 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5276455A (en) * 1991-05-24 1994-01-04 The Boeing Company Packaging architecture for phased arrays
US5412414A (en) * 1988-04-08 1995-05-02 Martin Marietta Corporation Self monitoring/calibrating phased array radar and an interchangeable, adjustable transmit/receive sub-assembly
WO1998011626A1 (en) * 1996-09-16 1998-03-19 Raytheon Company Antenna system for enhancing the coverage area, range and reliability of wireless base stations
US6263193B1 (en) * 1997-03-28 2001-07-17 Kabushiki Kaisha Toshiba Microwave transmitter/receiver module
GB2393580A (en) * 2002-09-30 2004-03-31 Andrew Corp Active antenna array with multicarrier linear power amplifiers coupled proximate the antenna elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412414A (en) * 1988-04-08 1995-05-02 Martin Marietta Corporation Self monitoring/calibrating phased array radar and an interchangeable, adjustable transmit/receive sub-assembly
US5276455A (en) * 1991-05-24 1994-01-04 The Boeing Company Packaging architecture for phased arrays
WO1998011626A1 (en) * 1996-09-16 1998-03-19 Raytheon Company Antenna system for enhancing the coverage area, range and reliability of wireless base stations
US6263193B1 (en) * 1997-03-28 2001-07-17 Kabushiki Kaisha Toshiba Microwave transmitter/receiver module
GB2393580A (en) * 2002-09-30 2004-03-31 Andrew Corp Active antenna array with multicarrier linear power amplifiers coupled proximate the antenna elements

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