EP1873266A4 - Copper alloy - Google Patents
Copper alloyInfo
- Publication number
- EP1873266A4 EP1873266A4 EP06728554A EP06728554A EP1873266A4 EP 1873266 A4 EP1873266 A4 EP 1873266A4 EP 06728554 A EP06728554 A EP 06728554A EP 06728554 A EP06728554 A EP 06728554A EP 1873266 A4 EP1873266 A4 EP 1873266A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- alloy
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005055147 | 2005-02-28 | ||
JP2005055144 | 2005-02-28 | ||
PCT/JP2006/303738 WO2006093140A1 (en) | 2005-02-28 | 2006-02-28 | Copper alloy |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1873266A1 EP1873266A1 (en) | 2008-01-02 |
EP1873266A4 true EP1873266A4 (en) | 2010-07-28 |
EP1873266B1 EP1873266B1 (en) | 2012-04-25 |
Family
ID=36941169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06728554A Expired - Fee Related EP1873266B1 (en) | 2005-02-28 | 2006-02-28 | Copper alloy |
Country Status (4)
Country | Link |
---|---|
US (2) | US20080047634A1 (en) |
EP (1) | EP1873266B1 (en) |
CN (1) | CN101166840B (en) |
WO (1) | WO2006093140A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4357536B2 (en) * | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent strength and formability |
JP4418028B2 (en) * | 2007-03-30 | 2010-02-17 | 日鉱金属株式会社 | Cu-Ni-Si alloy for electronic materials |
US8287669B2 (en) | 2007-05-31 | 2012-10-16 | The Furukawa Electric Co., Ltd. | Copper alloy for electric and electronic equipments |
JP4785092B2 (en) * | 2007-11-05 | 2011-10-05 | 古河電気工業株式会社 | Copper alloy sheet |
CN101946014A (en) * | 2008-02-18 | 2011-01-12 | 古河电气工业株式会社 | Copper alloy material |
EP2330231B1 (en) * | 2008-09-30 | 2017-02-22 | JX Nippon Mining & Metals Corporation | Process for manufacturing a high-purity copper- or a high-purity copper alloy sputtering target |
WO2010038641A1 (en) | 2008-09-30 | 2010-04-08 | 日鉱金属株式会社 | High-purity copper and process for electrolytically producing high-purity copper |
JP5261161B2 (en) * | 2008-12-12 | 2013-08-14 | Jx日鉱日石金属株式会社 | Ni-Si-Co-based copper alloy and method for producing the same |
JP4672804B1 (en) | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
JP4834781B1 (en) | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy for electronic materials |
US9476474B2 (en) * | 2010-12-13 | 2016-10-25 | Nippon Seisen Co., Ltd. | Copper alloy wire and copper alloy spring |
EP2653574B1 (en) * | 2010-12-13 | 2017-05-31 | Nippon Seisen Co., Ltd. | Copper alloy and method for producing copper alloy |
CN102140594B (en) * | 2011-03-11 | 2012-10-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
CN102560192B (en) * | 2011-12-31 | 2016-11-23 | 无锡日月合金材料有限公司 | A kind of High-strength high-plasticity copper alloy and preparation method thereof |
JP5802150B2 (en) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | Copper alloy |
KR101472348B1 (en) * | 2012-11-09 | 2014-12-15 | 주식회사 풍산 | Copper alloy material for electrical and electronic components and process for producing same |
CN104561645B (en) * | 2014-11-10 | 2017-01-18 | 华玉叶 | Preparation method of tin-copper alloy bar |
RU2566097C1 (en) * | 2014-12-22 | 2015-10-20 | Юлия Алексеевна Щепочкина | Copper-based alloy |
CN104911390A (en) * | 2015-06-13 | 2015-09-16 | 陈新棠 | Antimicrobial corrosion-resistant heat exchanger copper tube |
CN105568047B (en) * | 2015-12-29 | 2017-10-10 | 宁波博威合金材料股份有限公司 | High strength and high flexibility high-conductivity copper alloy |
DE102017001846A1 (en) * | 2017-02-25 | 2018-08-30 | Wieland-Werke Ag | Sliding element made of a copper alloy |
RU2677902C1 (en) * | 2017-12-27 | 2019-01-22 | Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") | Highly strong copper alloy |
CN109355529A (en) * | 2018-12-08 | 2019-02-19 | 雷纳德流体智能科技江苏股份有限公司 | One Albatra metal |
CN115198135B (en) * | 2022-07-07 | 2023-06-16 | 浙江鸿越铜业有限公司 | Alloy copper bar and processing technology thereof |
CN116732384B (en) * | 2023-08-08 | 2023-11-21 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04180531A (en) * | 1990-11-14 | 1992-06-26 | Nikko Kyodo Co Ltd | Electrically conductive material |
US5846346A (en) * | 1995-12-08 | 1998-12-08 | Poongsan Corporation | High strength high conductivity Cu-alloy of precipitate growth suppression type and production process |
EP0949343A1 (en) * | 1998-03-26 | 1999-10-13 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Copper alloy sheet for electronic parts |
US20040079456A1 (en) * | 2002-07-02 | 2004-04-29 | Onlin Corporation | Copper alloy containing cobalt, nickel and silicon |
JP2004307905A (en) * | 2003-04-03 | 2004-11-04 | Sumitomo Metal Ind Ltd | Cu ALLOY, AND ITS PRODUCTION METHOD |
US20050028907A1 (en) * | 2002-03-12 | 2005-02-10 | The Furukawa Electric Co., Ltd. | High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation |
JP2005048262A (en) * | 2003-07-31 | 2005-02-24 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si BASED ALLOY HAVING EXCELLENT FATIGUE PROPERTY |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6376839A (en) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment and its production |
EP0271991B1 (en) * | 1986-11-13 | 1991-10-02 | Ngk Insulators, Ltd. | Production of copper-beryllium alloys |
JPH0830234B2 (en) * | 1987-07-24 | 1996-03-27 | 古河電気工業株式会社 | High strength and high conductivity copper alloy |
JP3520046B2 (en) * | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | High strength copper alloy |
KR100861152B1 (en) * | 2004-02-27 | 2008-09-30 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy |
JP4646192B2 (en) * | 2004-06-02 | 2011-03-09 | 古河電気工業株式会社 | Copper alloy material for electrical and electronic equipment and method for producing the same |
-
2006
- 2006-02-28 WO PCT/JP2006/303738 patent/WO2006093140A1/en active Application Filing
- 2006-02-28 CN CN200680006379.0A patent/CN101166840B/en not_active Expired - Fee Related
- 2006-02-28 EP EP06728554A patent/EP1873266B1/en not_active Expired - Fee Related
-
2007
- 2007-08-28 US US11/846,074 patent/US20080047634A1/en not_active Abandoned
-
2011
- 2011-04-11 US US13/083,874 patent/US20110186187A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04180531A (en) * | 1990-11-14 | 1992-06-26 | Nikko Kyodo Co Ltd | Electrically conductive material |
US5846346A (en) * | 1995-12-08 | 1998-12-08 | Poongsan Corporation | High strength high conductivity Cu-alloy of precipitate growth suppression type and production process |
EP0949343A1 (en) * | 1998-03-26 | 1999-10-13 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Copper alloy sheet for electronic parts |
US20050028907A1 (en) * | 2002-03-12 | 2005-02-10 | The Furukawa Electric Co., Ltd. | High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation |
US20040079456A1 (en) * | 2002-07-02 | 2004-04-29 | Onlin Corporation | Copper alloy containing cobalt, nickel and silicon |
JP2004307905A (en) * | 2003-04-03 | 2004-11-04 | Sumitomo Metal Ind Ltd | Cu ALLOY, AND ITS PRODUCTION METHOD |
JP2005048262A (en) * | 2003-07-31 | 2005-02-24 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si BASED ALLOY HAVING EXCELLENT FATIGUE PROPERTY |
Non-Patent Citations (1)
Title |
---|
See also references of WO2006093140A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20110186187A1 (en) | 2011-08-04 |
CN101166840B (en) | 2012-07-18 |
CN101166840A (en) | 2008-04-23 |
WO2006093140A1 (en) | 2006-09-08 |
EP1873266B1 (en) | 2012-04-25 |
EP1873266A1 (en) | 2008-01-02 |
US20080047634A1 (en) | 2008-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1873266A4 (en) | Copper alloy | |
TWI371499B (en) | Copper alloy | |
GB2421030B (en) | Solder alloy | |
IL188837A0 (en) | Magnesium alloy | |
GB2433944B (en) | Solder alloy | |
EP1873267A4 (en) | Copper alloy for electronic material | |
EP1889684A4 (en) | Lead-free solder alloy | |
EP1866452A4 (en) | Magnesium alloy | |
EP1873270A4 (en) | Low alloy steel | |
GB0510243D0 (en) | Metal Alloy Manufacturing | |
GB0519254D0 (en) | Silver alloy | |
EP2048253A4 (en) | Lead-free copper alloy sliding material | |
EP1871555A4 (en) | Aluminum alloy | |
EP1813689A4 (en) | Magnesium alloy | |
EP1930460A4 (en) | Low alloy steel | |
TWI366497B (en) | Pb-free solder alloy | |
GB2431412B (en) | Lead-free solder alloy | |
EP1921173A4 (en) | Bronze low-lead alloy | |
GB2429115B (en) | Metal complex | |
GB0513860D0 (en) | Silver alloy | |
NO20054557D0 (en) | copper Alloy | |
GB2433536B (en) | Metal Section | |
GB0407531D0 (en) | An alloy | |
GB0509688D0 (en) | Alloy | |
GB0525959D0 (en) | Alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070921 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20100628 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602006029068 Country of ref document: DE Effective date: 20120621 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20130128 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602006029068 Country of ref document: DE Effective date: 20130128 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20131031 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130228 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20160223 Year of fee payment: 11 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 602006029068 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170901 |