EP1843864B1 - Component with a coating for reducing the wettability of the surfaces and method for production thereof - Google Patents
Component with a coating for reducing the wettability of the surfaces and method for production thereof Download PDFInfo
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- EP1843864B1 EP1843864B1 EP06707915A EP06707915A EP1843864B1 EP 1843864 B1 EP1843864 B1 EP 1843864B1 EP 06707915 A EP06707915 A EP 06707915A EP 06707915 A EP06707915 A EP 06707915A EP 1843864 B1 EP1843864 B1 EP 1843864B1
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- Prior art keywords
- coating
- component
- metal
- microstructure
- nanostructure
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/06—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/06—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement
- B08B17/065—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement the surface having a microscopic surface pattern to achieve the same effect as a lotus flower
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/2438—Coated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/24413—Metal or metal compound
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
- Y10T428/315—Surface modified glass [e.g., tempered, strengthened, etc.]
Definitions
- the invention relates to a component according to claim 1 and a method for producing a coating on a component according to claim 7.
- the object of the invention is to provide a component with a coating for reducing the wettability of the surface of the component, which, in addition to a low wettability of the surface, also ensures a comparatively good resistance to contamination by microorganisms.
- the invention makes use of the finding that the antimicrobial properties, ie the properties which prevent proliferation or the colonization of microorganisms or viruses on the surface of the component, also come into play when the metal is not a closed surface of the component but partially covered by the coating to reduce wettability.
- a component having such a layer structure can therefore advantageously simultaneously ensure a low wettability of the surface and become effective antimicrobially. In particular, this guarantees the properties of the low wettability of the surface over an extended period of time, since soil contamination by microorganisms and the like is prevented.
- the antimicrobial effect of the surface of the component is required. Namely, microorganisms can form a film-like layer on components which is very stable and would reduce or even abolish the surface properties of a wetting-reducing coating.
- the metal forms an intermediate layer between the substrate and the coating.
- the metal can thus be applied as a thin coating, so that it is not necessary for the antimicrobial effect that the entire component consists of the metal. Rather, the choice of material of the metal is arbitrary, wherein the coating is applied, for example, electrochemically or by vapor deposition on the substrate of the component. As a result, the material consumption of the metal in the production of the antimicrobial properties of the component is advantageously low, which leads to economic solutions.
- the metal with the antimicrobial effect consists of a biaxially textured, epitaxial layer.
- These layers can preferably be formed by coating on a likewise biaxially textured substrate, wherein this structural texture is transferred to the layer of the metal during the coating (for example, for this purpose JC Moore et al., Fabrication of cube-textured Ag-buffered Ni substrates by electroepitaxial deposition, Supercond. Sci. Technol. 14, 124-129, (2001 )).
- the properties of the metal layer can be advantageously influenced.
- the biaxially textured epitaxial metal layer offers greater resistance to corrosive attack.
- Such a layer of, for example, silver therefore, in the series of voltages of the metals has a higher standard potential compared to hydrogen than the literature values of silver (in the following abbreviated to standard potential).
- the antimicrobial property of the metal layer can be influenced, since this antimicrobial effect is caused by not yet completely clarified electrochemical processes on the layer.
- a further embodiment of the invention provides that the coating on the metal is metallic and forms a biaxially textured, epitaxial layer on the layer of antimicrobial metal.
- the coating is preferably made of copper. However, other metals such as iron can be used.
- the biaxially textured, epitaxial production of the coating can also be advantageously used selectively in order to change the electrochemical properties of the coating.
- the coating is metallic, the area of application in which the component is to be used must be taken into account in the production of the component. Namely, the antimicrobial, partially exposed metal layer and the metallic coating form local elements, which can promote a corrosive attack of the component. To prevent this, the standard potentials of the coating and the underlying metal layer must not be too far apart.
- the electrochemical processes occurring between the coating of the antimicrobial metal layer are a factor to be considered for the antimicrobial effect of the metal layer.
- the choice of the metals for the coating and the underlying antimicrobial metal layer thus depends on the application and must, for. B. be determined by appropriate tests. In this case, the choice of suitable metals as well as the option of epitaxially biaxially texturizing the coating or the underlying layer are available to the person skilled in the art as influencing parameters.
- the effect which reduces the wettability of the surface of the component can advantageously be improved if the surface the coating has a lotus effect favorable microstructure.
- the microstructure with its elevations and depressions, as already mentioned is designed such that the effect of leaves of the lotus flower is imitated. Production methods for such a microstructure on the surface are mentioned in the introduction DE 100 15 855 A1 described.
- the microstructure can be produced by pulse plating.
- a component is obtained in which the microstructure is superimposed on a nanostructure produced by pulse plating.
- This nanostructure advantageously also forms finer elevations and depressions (for example nanotubes), which further reduce the wettability of the surface of the component.
- a further improvement for the component arises when the structural elements of the nanostructure (for example, the nanotubes) consist of a metal oxide.
- the structural elements of the nanostructure consist of a metal oxide.
- the metal oxides for example copper oxide
- the metal oxides generally have a higher standard potential.
- a coating of copper may be substantially converted to copper oxide, whereby the standard electrode potential approaches that of the antimicrobial, partially exposed layer.
- the invention relates to a method for producing a coating on a component, which has a surface with a low wettability compared to the uncoated substrate.
- the coating can be made by a layer deposition of solutions.
- the coating is produced on a metal with antimicrobial properties, in particular on silver, such that the metal is not completely covered by the coating, the surface being wetted by electrochemical pulse plating reducing microstructure of the surface is produced. It has been shown that the pulse plating an irregular layer growth is supported, so that can form a microstructure, which reduces the wettability by forming elevations and depressions in the micrometer range.
- the method according to the invention is therefore advantageously suitable for creating a difficultly wettable surface on a component solely by means of electrochemical methods and at the same time providing a surface on which a settlement of microorganisms or viruses occurs, for example by incomplete coating of the metal having antimicrobial properties is difficult.
- the pulse plating is carried out as reverse pulse plating in such a way that the microstructure produces a nanostructure which superimposes this and further reduces the wettability.
- the pulse length in the method step for producing the nanostructure is advantageously less than 500 ms.
- favorable deposition parameters can be set on the surface to be produced, so that the nanostructure produced differs sufficiently in its dimensions from the microstructure produced.
- the interaction between the microstructure and the nanostructure superimposed on the microstructure leads to a considerable reduction in the wettability of the surface of the electrochemically produced coating.
- the current pulses are generated by respectively reversing the polarity of the deposition current, so that advantageously a large temporal gradient can be achieved in the charge shifts at the surface.
- the individual current pulses are in the range between 10 and 250 ms in terms of their length. It has been shown that the nanostructure of the surface is advantageously particularly pronounced in the case of the parameters mentioned.
- the cathodic pulses may have at least three times the length of the anodic pulses. Cathodic pulses are understood to be those pulses in which deposition occurs on the surface, while the anodic pulses cause a dissolution of the surface.
- the needle-like basic elements of the nanostructure are advantageously produced with a high density on the microstructure, which favors the lotus effect to be achieved.
- the deposition rate of the cathodic pulses is increased compared to the removal rate of the anodic pulses.
- the pulse length for generating a microstructure in an upstream process step may be at least one second. With the pulse lengths in the second range, the required microstructure of the surface can be produced in a time-saving manner by electrochemical means.
- a microstructure forms simultaneously with the nanostructure of the surface when the mentioned process parameters are adjusted to produce the nanostructure of the surface.
- a further reverse pulse plating is carried out, such that the nanostructure elements are oxidized.
- the reverse pulse plating for the oxidation of the nanostructure elements can preferably be carried out at the following process parameters:
- the said pulse sequence for the growth of the layer with cathodic and anodic pulse is supplemented by a third potential-controlled pulse, whereby the oxidation process of the nanostructure elements is required.
- the oxidation process of the nanostructure elements is counteracted by the fact that the nanostructure elements consist of elevations with a preferably needle-like structure whose tips are more exposed to an electrochemical attack than the areas around the nanostructure elements. Therefore, an oxidation reaction will preferably take place on the nanostructure elements.
- unoxidized parts of the coating can then be dissolved electrochemically exposing the metal.
- This is for example by applying a DC potential to the coating, since the oxidized nanostructure elements have a higher standard potential than the non-oxidizing parts of the coating.
- the coating has been made of copper, this copper will dissolve faster than the copper oxide nanostructure elements.
- this also has a higher standard potential than copper, so that this is largely retained.
- the exposure of the silver can be controlled advantageously, wherein the thereby running electrochemical process is stable. Post-processing of the surface with reduced wetting and at the same time antimicrobial properties is not necessary.
- the coating may also be applied using, for example, a mask which covers portions of the layer of antimicrobial metal underlying the coating.
- This mask which may for example consist of photoresist, can be dissolved by means of a suitable solvent once the coating has been completed. In this way, a portion of the antimicrobial material layer can be re-exposed to produce an antimicrobial and wettability-reducing surface of the present invention.
- FIG. 1 a component 11 is shown with a surface whose wettability is reduced.
- the surface 12 can be described schematically by a superimposition of a macrostructure 12 (which can also be predetermined, for example, by the component geometry) with a microstructure 13 and a nanostructure 14.
- the microstructure produces a waviness of the surface.
- the microstructure is indicated by hemispherical elevations on the wavy macrostructure 12.
- the nanostructure 14 is in FIG. 1 by nubs, which are located on the hemispherical elevations (microstructure) and partly in the inter-elevational parts of the macrostructure 12 which form the depressions of the microstructure 13.
- the adhesion-reducing properties of the surface formed by the superimposition of the macrostructure 12, the microstructure 13 and the nanostructure 14 become apparent from a water drop 15 which forms a water pearl on the surface. Due to the low wettability of the surface on the one hand and the surface tension of the water droplet on the other between the water droplet 15 and the surface forms a relatively large contact angle ⁇ , which is defined by an angle leg 16a, which runs parallel to the surface, and an angle leg 16b, which forms a tangent to the skin of the water droplet, passing through the edge of the Contact surface of the water droplet 15 with the surface (or more precisely the angle leg 16a) runs.
- ⁇ A contact angle ⁇ of more than 140 ° is shown, so that the surface shown schematically is a so-called superhydrophobic surface.
- the component 11 according to FIG. 1 is made of silver, wherein the macrostructure 12 forms part of the overall surface of the component 11.
- This part of the surface is characterized in that the silver can come into direct contact with the environment, taking advantage of the antimicrobial properties of the silver.
- z. B. causes microorganisms that would cause a reduction in the contact angle ⁇ can not settle on the surface, whereby the low wettability of the surface can be obtained even over a prolonged period of use of the component 11.
- the electrochemically generated surface can be examined below by means of an SPM (Scanning Probe Microscope - also called AFM or Atomic Force Microscope). With an SPM, surface structures down to the nanometer range can be determined and displayed. A section of the surface which can be generated by means of the abovementioned test parameters is shown in FIG FIG. 2 Shown schematically on average, wherein the profile is excessive (schematic drawing after the model of SPM investigations).
- SPM Scnning Probe Microscope - also called AFM or Atomic Force Microscope
- a waveform 18 in FIG. 2 entered which illustrates the macro structure that is superimposed on the surface structure.
- the microstructure 13 is due to the elevation as a succession of needle-like elevations 19 and recesses 20 shown.
- the nanostructure 14 has been indicated, which results from a narrow sequence of elevations and depressions, which in accordance with FIG. 2 scale shown are no longer dissolve and therefore can only be seen as a thickening of the profile line of the surface profile.
- FIG. 3 is a perspective view of the copper surface.
- a square area of 100 ⁇ 100 ⁇ m has been selected as a cutout, the needle-like elevations 19 determining the microstructure 13 being clearly recognizable.
- the resulting image reminds the viewer of a "coniferous forest” with the interstices between the "conifers” (elevations 19) forming the depressions 20.
- the surface according to FIG. 3 is shown exaggerated to illustrate the ridges 19 and the recesses 20 of the microstructure 13.
- the coating consisting of the elevations 19 and depressions 20 does not cover the entire surface of the substrate, ie in some places the silver is exposed as the surface of the component 11.
- These areas 21 are in the FIG. 3 to recognize by more or less “smooth” Ariale, which form at the "coniferous forest”"glades". In these regions 21, the surface of the component formed by the silver can develop the silver-typical antimicrobial properties.
- FIG. 4 shows an enlarged detail of the illustration according to FIG. 3 shows, the microstructure 13 is further superimposed on a nanostructure 14.
- the ridges 19 and depressions 20 appear more like waviness of the surface (which, however, due to the other scale, does not appear with the waviness in FIG. 2 may be confused).
- Superimposed on this waviness are furthermore smallest elevations 19n and depressions 20n, which characterize the nanostructure of the surface.
- FIG. 3 explained expression of a "coniferous forest" whose geometric dimensions are smaller by about two orders of magnitude, ie in the FIG. 3 chosen scale is not recognizable.
- the microstructure 13 and the nanostructure 14 are each marked with a bracket.
- the bracket always comprises only a section of the respective structure, which contains an elevation and a depression, so that the brackets allow one another in each case within a figure a comparison of the magnitudes of the structures in relation to each other.
- the illustrated embodiment can be achieved for a drop of water contact angle of 150 ° and more.
- the superhydrophobic properties of the copper layer shown, which cause a lotus effect, is achieved by an interaction of at least the microstructure 13 and the nanostructure 14, wherein the superimposition of a macrostructure 12 can still improve the observed effects. By selecting suitable process parameters, such lotus effect surfaces can be produced for different layer materials and for liquids with different wetting behavior.
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Abstract
Description
Die Erfindung betrifft ein Bauteil gemäß Anspruch 1 und ein Verfahren zum Erzeugeneiner Beschichtung auf einem Bauteil gemäß Anspruch 7.The invention relates to a component according to claim 1 and a method for producing a coating on a component according to claim 7.
Oberflächen mit einer geringen Benetzbarkeit, wie eingangs angegeben, kommen z. B. als sogenannte Lotus-Effekt-Oberflächen zum Einsatz und sind beispielsweise in der
Aus der
Die Aufgabe der Erfindung besteht darin, ein Bauteil mit einer Beschichtung zur Verringerung der Benetzbarkeit der Oberfläche des Bauteils zur Verfügung zu stellen, welches neben einer geringen Benetzbarkeit der Oberfläche auch einen vergleichsweise guten Widerstand gegen eine Verschmutzung durch Mikroorganismen gewährleistet.The object of the invention is to provide a component with a coating for reducing the wettability of the surface of the component, which, in addition to a low wettability of the surface, also ensures a comparatively good resistance to contamination by microorganisms.
Diese Aufgabe wird mit dem eingangs angegebenen Bauteil erfindungsgemäß gelöst durch ein Bauteil gemäß Anspruch 1 und ein Verfahren zum Erzeugeneiner Beschichtung auf einem Bauteil gemäß Anspruch 7.This object is achieved with the component specified in the introduction by a component according to claim 1 and a method for producing a coating on a component according to claim 7.
Die Erfindung macht sich die Erkenntnis zunutze, dass die antimikrobiellen Eigenschaften, also die Eigenschaften, die eine Vermehrung bzw. die Ansiedlung von Mikroorganismen oder Viren an der Oberfläche des Bauteils zu verhindern, auch dann zum Tragen kommen, wenn das Metall keine geschlossene Oberfläche des Bauteils bildet, sondern teilweise durch die Beschichtung zur Verringerung der Benetzbarkeit abgedeckt ist. Ein Bauteil mit einem solchen Schichtaufbau kann also vorteilhaft gleichzeitig eine geringe Benetzbarkeit der Oberfläche gewährleisten und antimikrobiell wirksam werden. Insbesondere werden hierdurch die Eigenschaften der geringen Benetzbarkeit der Oberfläche auch über einen längeren Zeitraum garantiert, da eine Verschmutzung der Oberfläche durch Mikroorganismen und dergleichen verhindert wird. Hierzu ist die antimikrobielle Wirkung der Oberfläche des Bauteils Voraussetzung. Mikroorganismen können nämlich eine filmartige Schicht auf Bauteilen bilden, die sehr stabil ist und die Oberflächeneigenschaften einer die Benetzung verringernde Beschichtung herabsetzen oder auch aufheben würden.The invention makes use of the finding that the antimicrobial properties, ie the properties which prevent proliferation or the colonization of microorganisms or viruses on the surface of the component, also come into play when the metal is not a closed surface of the component but partially covered by the coating to reduce wettability. A component having such a layer structure can therefore advantageously simultaneously ensure a low wettability of the surface and become effective antimicrobially. In particular, this guarantees the properties of the low wettability of the surface over an extended period of time, since soil contamination by microorganisms and the like is prevented. For this purpose, the antimicrobial effect of the surface of the component is required. Namely, microorganisms can form a film-like layer on components which is very stable and would reduce or even abolish the surface properties of a wetting-reducing coating.
Gemäß der Erfindung ist vorgesehen, dass das Metall eine Zwischenschicht zwischen dem Substrat und der Beschichtung ausbildet. Das Metall kann somit als dünne Beschichtung aufgebracht werden, so dass es für die antimikrobielle Wirkung nicht notwendig ist, dass das gesamte Bauteil aus dem Metall besteht. Vielmehr ist die Werkstoffwahl des Metalls beliebig, wobei die Beschichtung beispielsweise elektrochemisch oder durch Bedampfen auf dem Substrat des Bauteils aufgebracht wird. Hierdurch ist der Materialverbrauch an dem Metall bei der Herstellung der antimikrobiellen Eigenschaften des Bauteils vorteilhaft gering, was zu wirtschaftlichen Lösungen führt.According to the invention it is provided that the metal forms an intermediate layer between the substrate and the coating. The metal can thus be applied as a thin coating, so that it is not necessary for the antimicrobial effect that the entire component consists of the metal. Rather, the choice of material of the metal is arbitrary, wherein the coating is applied, for example, electrochemically or by vapor deposition on the substrate of the component. As a result, the material consumption of the metal in the production of the antimicrobial properties of the component is advantageously low, which leads to economic solutions.
Gemäß einer weiteren Ausgestaltung der Erfindung besteht das Metall mit der antimikrobiellen Wirkung aus einer biaxial texturierten, epitaktischen Schicht. Diese Schichten können bevorzugt durch Beschichten auf einem ebenfalls biaxial texturierten Substrat gebildet werden, wobei sich diese Gefügetextur während der Beschichtung auf die Schicht aus dem Metall überträgt (hierzu beispielsweise
Eine weiterführende Ausgestaltung der Erfindung sieht vor, dass auch die Beschichtung auf dem Metall metallisch ist und eine biaxial texturierte, epitaktische Schicht auf der Schicht des antimikrobiell wirkenden Metalls bildet. Die Beschichtung ist vorzugsweise aus Kupfer. Allerdings können auch andere Metalle wie beispielsweise Eisen verwendet werden. Auch die biaxial texturierte, epitaktische Herstellung der Beschichtung kann vorteilhaft gezielt zum Einsatz kommen, um die elektrochemischen Eigenschaften der Beschichtung zu verändern. Für den Fall, dass die Beschichtung metallisch ist, ist bei der Herstellung des Bauteils das Einsatzgebiet zu berücksichtigen, in dem das Bauteil verwendet werden soll. Die antimikrobielle, teilweise freigelegte Metallschicht und die metallische Beschichtung bilden nämlich Lokalelemente aus, welche einen korrosiven Angriff des Bauteils begünstigen können. Um diesen zu verhindern, dürfen die Standardpotentiale der Beschichtung und der darunter liegenden Metallschicht nicht zu weit auseinander liegen. Gleichzeitig sind die zwischen der Beschichtung der antimikrobiellen Metallschicht auftretenden elektrochemischen Prozesse ein zu berücksichtigender Einflussfaktor für die antimikrobielle Wirkung der Metallschicht.A further embodiment of the invention provides that the coating on the metal is metallic and forms a biaxially textured, epitaxial layer on the layer of antimicrobial metal. The coating is preferably made of copper. However, other metals such as iron can be used. The biaxially textured, epitaxial production of the coating can also be advantageously used selectively in order to change the electrochemical properties of the coating. In the event that the coating is metallic, the area of application in which the component is to be used must be taken into account in the production of the component. Namely, the antimicrobial, partially exposed metal layer and the metallic coating form local elements, which can promote a corrosive attack of the component. To prevent this, the standard potentials of the coating and the underlying metal layer must not be too far apart. At the same time, the electrochemical processes occurring between the coating of the antimicrobial metal layer are a factor to be considered for the antimicrobial effect of the metal layer.
Die Auswahl der Metalle für die Beschichtung und die darunter liegende antimikrobielle Metallschicht hängt also vom Einsatzfall ab und muss z. B. durch entsprechende Versuche ermittelt werden. Hierbei stehen dem Fachmann als Einflussparameter die Auswahl geeigneter Metalle sowie die Möglichkeit zur Verfügung, die Beschichtung bzw. die darunter liegende Schicht biaxial texturiert, epitaktisch auszubilden.The choice of the metals for the coating and the underlying antimicrobial metal layer thus depends on the application and must, for. B. be determined by appropriate tests. In this case, the choice of suitable metals as well as the option of epitaxially biaxially texturizing the coating or the underlying layer are available to the person skilled in the art as influencing parameters.
Der die Benetzbarkeit der Oberfläche des Bauteils verringernde Effekt kann vorteilhaft verbessert werden, wenn die Oberfläche der Beschichtung eine den Lotuseffekt begünstigende Mikrostruktur aufweist. Dabei wird die Mikrostruktur mit ihren Erhebungen und Vertiefungen, wie eingangs bereits erwähnt, derart ausgebildet, dass die Wirkung von Blättern der Lotusblume nachgeahmt wird. Herstellungsverfahren für eine solche Mikrostruktur auf der Oberfläche sind in der eingangs erwähnten
Nach einem besonders vorteilhaften Verfahren kann die Mikrostruktur durch Pulse Plating hergestellt werden. Hierbei erhält man gemäß einer besonderen Ausgestaltung der Erfindung ein Bauteil, bei dem der Mikrostruktur eine durch Pulse Plating erzeugte Nanostruktur überlagert ist. Diese Nanostruktur bildet vorteilhaft auch feinere Erhebungen und Vertiefungen (beispielsweise Nanonadeln) aus, die eine Benetzbarkeit der Oberfläche des Bauteils weiter verringern.According to a particularly advantageous method, the microstructure can be produced by pulse plating. In this case, according to a particular embodiment of the invention, a component is obtained in which the microstructure is superimposed on a nanostructure produced by pulse plating. This nanostructure advantageously also forms finer elevations and depressions (for example nanotubes), which further reduce the wettability of the surface of the component.
Eine weitere Verbesserung für das Bauteil ergibt sich, wenn die Strukturelemente der Nanostruktur (beispielsweise die Nanonadeln) aus einem Metalloxid bestehen. Hierdurch ergibt sich eine weitere Möglichkeit, die elektrochemischen Eigenschaften der Strukturelemente der Nanostruktur zu beeinflussen, da die Metalloxide (beispielsweise Kupferoxid) im Allgemeinen ein höheres Standardpotential aufweisen. Hierbei kann beispielsweise eine Beschichtung aus Kupfer im Wesentlichen in Kupferoxid umgewandelt werden, wodurch sich das Standardelektrodenpotential an das der antimikrobiellen, teilweise freigelegten Schicht annähert.A further improvement for the component arises when the structural elements of the nanostructure (for example, the nanotubes) consist of a metal oxide. This results in a further possibility of influencing the electrochemical properties of the structural elements of the nanostructure, since the metal oxides (for example copper oxide) generally have a higher standard potential. Here, for example, a coating of copper may be substantially converted to copper oxide, whereby the standard electrode potential approaches that of the antimicrobial, partially exposed layer.
Weiterhin bezieht sich die Erfindung auf ein Verfahren zum Erzeugen einer Beschichtung auf einem Bauteil, welche im Vergleich zum unbeschichteten Substrat eine Oberfläche mit einer geringen Benetzbarkeit aufweist.Furthermore, the invention relates to a method for producing a coating on a component, which has a surface with a low wettability compared to the uncoated substrate.
Ein derartiges Verfahren ist in der eingangs bereits erwähnten
Eine weitere Aufgabe der Erfindung besteht demnach in der Angabe eines Verfahrens zum Erzeugen einer Beschichtung auf einem Bauteil mit einer die Benetzbarkeit verringernden Oberfläche, welche eine vergleichsweise lang anhaltende Wirkung hinsichtlich der verringerten Benetzbarkeit gewährleistet.It is therefore another object of the invention to provide a method for forming a coating on a wettability-reducing surface member which ensures a comparatively long-lasting effect of reduced wettability.
Diese Aufgabe wird erfindungsgemäß mit dem genannten Verfahren dadurch gelöst, dass die Beschichtung auf einem Metall mit antimikrobiellen Eigenschaften, insbesondere auf Silber derart hergestellt wird, dass das Metall durch die Beschichtung nicht vollständig bedeckt ist, wobei die Oberfläche durch elektrochemisches Pulse Plating mit einer die Benetzbarkeit verringernden Mikrostruktur der Oberfläche hergestellt wird. Es hat sich nämlich gezeigt, dass durch das Pulse Plating ein unregelmäßiges Schichtwachstum unterstützt wird, so dass sich eine Mikrostruktur ausbilden kann, die die Benetzbarkeit durch Ausbildung von Erhöhungen und Vertiefungen im Mikrometerbereich verringert. Das erfindungsgemäße Verfahren ist daher vorteilhaft dazu geeignet, allein mittels elektrochemischer Verfahren eine schwer benetzbare Oberfläche auf einem Bauteil zu schaffen und gleichzeitig beispielsweise durch ein nicht vollständiges Beschichten des Metalls mit antimikrobiellen Eigenschaften eine Oberfläche zur Verfügung zu stellen, auf der eine Ansiedlung von Mikroorganismen oder Viren erschwert wird.This object is achieved according to the invention with the stated method in that the coating is produced on a metal with antimicrobial properties, in particular on silver, such that the metal is not completely covered by the coating, the surface being wetted by electrochemical pulse plating reducing microstructure of the surface is produced. It has been shown that the pulse plating an irregular layer growth is supported, so that can form a microstructure, which reduces the wettability by forming elevations and depressions in the micrometer range. The method according to the invention is therefore advantageously suitable for creating a difficultly wettable surface on a component solely by means of electrochemical methods and at the same time providing a surface on which a settlement of microorganisms or viruses occurs, for example by incomplete coating of the metal having antimicrobial properties is difficult.
Gemäß einer besonderen Ausgestaltung der Erfindung ist vorgesehen, dass das Pulse Plating als Reverse Pulse Plating derart durchgeführt wird, dass mit der Mikrostruktur eine diese überlagernde, die Benetzbarkeit weiter verringernden Nanostruktur erzeugt wird. Die Pulslänge beim Verfahrensschritt zum Herstellen der Nanostruktur liegt vorteilhaft bei weniger als 500 ms. Damit können bei diesem Verfahrensschritt günstige Abscheidungsparameter an der zu erzeugenden Oberfläche eingestellt werden, damit sich die erzeugte Nanostruktur in ihren Abmessungen genügend von der erzeugten Mikrostruktur unterscheidet. Das Zusammenspiel zwischen Mikrostruktur und der der Mikrostruktur überlagerten Nanostruktur führt zu einer starken Verringerung der Benetzbarkeit der Oberfläche der elektrochemisch erzeugten Beschichtung.According to a particular embodiment of the invention, it is provided that the pulse plating is carried out as reverse pulse plating in such a way that the microstructure produces a nanostructure which superimposes this and further reduces the wettability. The pulse length in the method step for producing the nanostructure is advantageously less than 500 ms. Thus, in this process step, favorable deposition parameters can be set on the surface to be produced, so that the nanostructure produced differs sufficiently in its dimensions from the microstructure produced. The interaction between the microstructure and the nanostructure superimposed on the microstructure leads to a considerable reduction in the wettability of the surface of the electrochemically produced coating.
Beim Reverse Pulse Plating werden die Strompulse durch jeweilige Umkehrung der Polarität des Abscheidestroms erzeugt, so dass vorteilhaft ein starkes zeitliches Gefälle bei den Ladungsverschiebungen an der Oberfläche erreicht werden kann. Vorteilhaft liegen die einzelnen Strompulse hinsichtlich ihrer Länge im Bereich zwischen 10 und 250 ms. Es hat sich gezeigt, dass sich bei den genannten Parametern die Nanostruktur der Oberfläche vorteilhaft besonders stark ausprägt. Dabei können die kathodischen Pulse mindestens die dreifache Länge der anodischen Pulse haben. Als kathodische Pulse werden diejenigen Pulse aufgefasst, bei der es zu einer Abscheidung auf der Oberfläche kommt, während die anodischen Pulse eine Auflösung der Oberfläche hervorrufen. Für das angegebene Verhältnis zwischen kathodischen und anodischen Pulsen hat es sich gezeigt, dass die nadelartigen Grundelemente der Nanostruktur vorteilhaft mit einer hohen Dichte auf der Mikrostruktur erzeugt werden, was den zu erzielenden Lotuseffekt begünstigt. Es besteht auch die Möglichkeit, beim Reverse Pulse Plating die katodischen Pulse mit einer höheren Stromdichte durchzuführen, als die anodischen Pulse. Auch durch diese Maßnahme wird die Abscheiderate der kathodischen Pulse im Vergleich zur Abtragungsrate der anodischen Pulse erhöht. Die Pulslänge zum Erzeugen einer Mikrostruktur in einem vorgelagerten Verfahrensschritt kann mindestens eine Sekunde betragen. Mit den Pulslängen im Sekundenbereich kann die geforderte Mikrostruktur der Oberfläche zeitgünstig auf elektrochemischem Wege hergestellt werden. Eine Mikrostruktur bildet sich gleichzeitig mit der Nanostruktur der Oberfläche aus, wenn die genannten Verfahrensparameter zur Erzeugung der Nanostruktur der Oberfläche eingestellt werden.In reverse pulse plating, the current pulses are generated by respectively reversing the polarity of the deposition current, so that advantageously a large temporal gradient can be achieved in the charge shifts at the surface. Advantageously, the individual current pulses are in the range between 10 and 250 ms in terms of their length. It has been shown that the nanostructure of the surface is advantageously particularly pronounced in the case of the parameters mentioned. The cathodic pulses may have at least three times the length of the anodic pulses. Cathodic pulses are understood to be those pulses in which deposition occurs on the surface, while the anodic pulses cause a dissolution of the surface. For the indicated ratio between cathodic and anodic pulses, it has been shown that the needle-like basic elements of the nanostructure are advantageously produced with a high density on the microstructure, which favors the lotus effect to be achieved. There is also the possibility of reverse Pulse plating to perform the cathodic pulses with a higher current density, than the anodic pulses. Also by this measure, the deposition rate of the cathodic pulses is increased compared to the removal rate of the anodic pulses. The pulse length for generating a microstructure in an upstream process step may be at least one second. With the pulse lengths in the second range, the required microstructure of the surface can be produced in a time-saving manner by electrochemical means. A microstructure forms simultaneously with the nanostructure of the surface when the mentioned process parameters are adjusted to produce the nanostructure of the surface.
Nach einer besonders vorteilhaften Ausführung der Erfindung ist vorgesehen, dass nach der Erzeugung der Nanostruktur ein weiteres Reverse Pulse Plating durchgeführt wird, derart, dass die Nanostrukturelemente oxidiert werden. Das Reverse Pulse Plating zur Oxidation der Nanostrukturelemente kann bevorzugt bei folgenden Verfahrenparametern durchgeführt werden: Die genannte Pulsfolge für das Wachstum der Schicht mit kathodischem und anodischem Puls wird durch einen dritten potentialgesteuerten Puls ergänzt, wodurch der Oxidationsprozess der Nanostrukturelemente befordert wird. Dem Oxidationsprozess der Nanostrukturelemente kommt es entgegen, dass die Nanostrukturelemente aus Erhebungen mit bevorzugt nadelartiger Struktur bestehen, deren Spitzen einem elektrochemischen Angriff stärker ausgesetzt sind, als die Bereiche um die Nanostrukturelemente herum. Daher wird eine Oxidationreaktion - bevorzugt an den Nanostrukturelementen erfolgen.According to a particularly advantageous embodiment of the invention, it is provided that, after the generation of the nanostructure, a further reverse pulse plating is carried out, such that the nanostructure elements are oxidized. The reverse pulse plating for the oxidation of the nanostructure elements can preferably be carried out at the following process parameters: The said pulse sequence for the growth of the layer with cathodic and anodic pulse is supplemented by a third potential-controlled pulse, whereby the oxidation process of the nanostructure elements is required. The oxidation process of the nanostructure elements is counteracted by the fact that the nanostructure elements consist of elevations with a preferably needle-like structure whose tips are more exposed to an electrochemical attack than the areas around the nanostructure elements. Therefore, an oxidation reaction will preferably take place on the nanostructure elements.
In einem weiteren Verfahrensschritt können nicht oxidierte Teile der Beschichtung dann unter Freilegung des Metalls elektrochemisch aufgelöst werden. Dies ist beispielsweise durch Anlegen eines Gleichspannungspotentials an die Beschichtung möglich, da die oxidierten Nanostrukturelemente ein höheres Standardpotential aufweisen als die nicht oxidierenden Teile der Beschichtung. Ist die Beschichtung beispielsweise aus Kupfer erzeugt worden, so wird sich dieses Kupfer schneller auflösen als die Nanostrukturelemente aus Kupferoxid. Sobald beispielsweise eine Silberschicht unter der Beschichtung freigelegt wird, so weist diese ebenfalls ein höheres Standardpotential auf, als Kupfer, so dass diese weitgehend erhalten bleibt. Hierdurch lässt sich vorteilhaft die Freilegung des Silbers steuern, wobei der dabei ablaufende elektrochemische Prozess stabil verläuft. Eine Nachbearbeitung der Oberfläche mit verringerter Benetzung und gleichzeitig antimikrobiellen Eigenschaften ist nicht notwendig.In a further process step, unoxidized parts of the coating can then be dissolved electrochemically exposing the metal. This is for example by applying a DC potential to the coating, since the oxidized nanostructure elements have a higher standard potential than the non-oxidizing parts of the coating. For example, if the coating has been made of copper, this copper will dissolve faster than the copper oxide nanostructure elements. For example, as soon as a silver layer is exposed under the coating, so this also has a higher standard potential than copper, so that this is largely retained. As a result, the exposure of the silver can be controlled advantageously, wherein the thereby running electrochemical process is stable. Post-processing of the surface with reduced wetting and at the same time antimicrobial properties is not necessary.
Anstelle eines elektrochemischen Auflösens nicht oxidierter Teile der Beschichtung kann die Beschichtung alternativ auch beispielsweise unter Einsatz einer Maske aufgebracht werden, die Teile der unter der Beschichtung liegenden Schicht aus antimikrobiellen Metall abdeckt. Diese Maske, die beispielsweise aus Fotolack bestehen kann, kann mittels eines geeigneten Lösungsmittels aufgelöst werden, sobald die Beschichtung fertig gestellt worden ist. Auf diese Weise lässt sich ein Teil der Schicht aus dem antimikrobiellen Material wieder freilegen, um eine erfindungsgemäß antimikrobielle und gleichzeitig die Benetzbarkeit verringernde Oberfläche zu erzeugen.Alternatively, instead of electrochemically dissolving unoxidized portions of the coating, the coating may also be applied using, for example, a mask which covers portions of the layer of antimicrobial metal underlying the coating. This mask, which may for example consist of photoresist, can be dissolved by means of a suitable solvent once the coating has been completed. In this way, a portion of the antimicrobial material layer can be re-exposed to produce an antimicrobial and wettability-reducing surface of the present invention.
Weitere Einzelheiten der Erfindung werden nachfolgend anhand der Zeichnung beschrieben. In den einzelnen Figuren sind gleiche oder sich entsprechende Zeichnungselemente mit jeweils den gleichen Bezugszeichen versehen, wobei diese nur insoweit mehrfach erläutert werden, wie sich Unterschiede zwischen den Figuren ergeben. Es zeigen
- Figur 1
- den schematischen Aufbau eines Ausführungsbeispiels der erfindungsgemäßen Oberfläche im schematischen Schnitt,
- Figur 2
- das Oberflächenprofil einer Lotus-Effekt-Oberfläche mit antimikrobiellen Eigenschaften als Ausführungsbeispiel der erfindungsgemäßen Oberfläche im Schnitt und
- Figur 3 und 4
- perspektivische Darstellungen der Lotus-Effekt-Oberfläche mit antimikrobiellen Eigenschaften gemäß
Figur 2 .
- FIG. 1
- the schematic structure of an embodiment of the surface according to the invention in a schematic section,
- FIG. 2
- the surface profile of a lotus effect surface with antimicrobial properties as an embodiment of the surface according to the invention in section and
- FIGS. 3 and 4
- perspective views of the lotus effect surface with antimicrobial properties according to
FIG. 2 ,
In
Die haftungsvermindernden Eigenschaften der durch die Überlagerung der Makrostruktur 12, der Mikrostruktur 13 und der Nanostruktur 14 gebildeten Oberfläche werden anhand eines Wassertropfens 15 deutlich, der auf der Oberfläche eine Wasserperle bildet. Durch die geringe Benetzbarkeit der Oberfläche einerseits und die Oberflächenspannung des Wassertropfens andererseits bildet sich zwischen dem Wassertropfen 15 und der Oberfläche ein verhältnismäßig großer Kontaktwinkel γ aus, der definiert ist durch einen Winkelschenkel 16a, der parallel zur Oberfläche verläuft, und einen Winkelschenkel 16b, der eine Tangente an der Haut des Wassertropfens bildet, die durch den Rand der Kontaktfläche des Wassertropfens 15 mit der Oberfläche (bzw. genauer dem Winkelschenkel 16a) läuft. In
Das Bauteil 11 gemäß
Im Rahmen von Versuchen kann mittels Reverse Pulse Plating eine Lotus-Effekt-Oberfläche durch Abscheidung von Kupfer auf einer durch Elektropolieren geglätteten Oberfläche aus Silber erzeugt werden. Hierbei können folgende Verfahrensparameter gewählt werden.
- 1. Erzeugung der Beschichtung mit der Mikrostruktur und der Nanostruktur in einem Verfahrensschritt durch Reverse Pulse Plating:
- Pulslänge (Reverse Pulse): 240 ms bei 10 A/dm2 kathodisch, 40 ms bei 8 A/dm2 anodisch
- Elektrolyt enthielt 50 g/l Cu, 20 g/l freies Cyanid, 5 g/l KOH (alternativ folgende Zusammensetzung: 72g/l CuCN, 125g/l KCN, 5g/l KOH)
- 2. Oxitation der überwiegend nadelförmigen Nanostrukturelemente in einem nachfolgenden Verfahrensschritt:
- Pulslänge (erweiterter Reverse Pulse): 240 ms bei 10 A/dm2 kathodisch, 40 ms bei 8 A/dm2 anodisch und 50 bis 100 ms potentialgesteuert mit u=+1,2V anodisch.
- Elektrolyt wie bei Schritt 1
- 3. Auflösen der Beschichtung in den nicht oxidierten Bereichen unter Freilegen des Silbers mit folgenden Parametern:
- Der Puls ist ein unipolarer - potentialgesteuerter Puls in anodischer Richtung: i(kath.) = 0 A/dm2; u(anod.) = +0,5V; t(kath.) = 200 - 250ms; t(anod.) = 50 - 100ms.
- 1. Generation of the coating with the microstructure and the nanostructure in one process step by reverse pulse plating:
- Pulse length (reverse pulse): 240 ms at 10 A / dm 2 cathodic, 40 ms at 8 A / dm 2 anodic
- Electrolyte contained 50 g / l Cu, 20 g / l free cyanide, 5 g / l KOH (alternatively following composition: 72 g / l CuCN, 125 g / l KCN, 5 g / l KOH)
- 2. Oxitation of the predominantly needle-shaped nanostructure elements in a subsequent process step:
- Pulse length (extended reverse pulse): 240 ms at 10 A / dm 2 cathodic, 40 ms at 8 A / dm 2 anodic and 50 to 100 ms potential controlled with u = + 1.2V anodic.
- Electrolyte as in step 1
- 3. Dissolve the coating in the unoxidized areas exposing the silver with the following parameters:
- The pulse is a unipolar - potential-controlled pulse in anodic direction: i (cath.) = 0 A / dm 2 ; u (anod.) = + 0.5V; t (cath.) = 200-250 ms; t (anod.) = 50 - 100ms.
Die elektrochemisch erzeugte Oberfläche kann im Folgenden mittels eines SPM (Scanning Probe Microscope - auch AFM oder Atomic Force Microscope genannt) untersucht werden. Mit einem SPM lassen sich Oberflächenstrukturen bis in den Nanometerbereich hin bestimmen und darstellen. Ein Ausschnitt der mitells der oben genannten Versuchparameter erzeugbaren Oberfläche ist in
Im Bezug auf eine Nulllinie 17 ist ein Wellenverlauf 18 in
Nähere Details lassen sich der
Wie der
Wie aus der perspektivischen Ansicht der Oberfläche gemäß Figur 4, die eine Ausschnittsvergrößerung der Darstellung gemäß
Um die Größenverhältnisse zu verdeutlichen, sind in den
Claims (10)
- Component, having a substrate (11) with a coating (19, 20) which, compared to the uncoated substrate, has a surface with a low wettability, wherein
a metal with anti-microbial properties, in particular silver, is located under the coating, wherein said metal is only partially covered by the coating,
characterized
in that the metal forms an intermediate layer between the substrate (11) and the coating. - Component according to Claim 1,
characterized
in that the metal consists of a biaxially textured epitaxial layer. - Component according to either of the preceding claims,
characterized
in that the coating (19, 20) is also metallic, in particular consists of copper, and forms a biaxially textured epitaxial layer. - Component according to one of the preceding claims,
characterized
in that the surface of the coating (19, 20) has a microstructure (13) which promotes the lotus effect. - Component according to Claim 4,
characterized
in that a nanostructure (14) produced by pulse plating is overlaid on the microstructure (13). - Component according to Claim 5,
characterized
in that the structural elements of the nanostructure (14) consist of a metal oxide. - Method for producing a coating (19, 20) on a component (11), which coating, compared to the uncoated substrate, has a surface with a low wettability, wherein
an intermediate layer made of a metal with anti-microbial properties, in particular silver, is produced on the component, and the coating (19, 20) is produced on the intermediate layer in such a manner that the metal is only partially covered by the coating (19, 20), wherein the surface is produced by electrochemical pulse plating with a microstructure (13) of the surface which reduces the wettability. - Method according to Claim 7,
characterized
in that the pulse plating is carried out as reverse pulse plating, in such a manner that a nanostructure (14) overlaid on the microstructure (13) and further reducing the wettability is produced with said microstructure. - Method according to Claim 8,
characterized
in that, after the production of the nanostructure (14), further reverse pulse plating is carried out, in such a manner that the nanostructural elements (19n) are oxidized. - Method according to Claim 9,
characterized
in that non-oxidized parts of the coating are removed electrochemically to expose (21) the metal.
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PCT/EP2006/050543 WO2006082180A1 (en) | 2005-02-04 | 2006-01-31 | Component with a coating for reducing the wettability of the surfaces and method for production thereof |
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DE102007030586A1 (en) | 2007-06-27 | 2009-01-08 | Siemens Ag | Substrate with a catalytically active surface and process for its preparation |
AU2009330594B2 (en) * | 2008-12-16 | 2014-09-11 | Dow Global Technologies Llc | A coating composition comprising polymer encapsulated metal oxide opacifying pigments and a process of producing the same |
US9546280B2 (en) * | 2012-12-07 | 2017-01-17 | Hrl Laboratories, Llc | Structural coatings with dewetting and anti-icing properties, and coating precursors for fabricating same |
US20170183101A1 (en) * | 2014-03-20 | 2017-06-29 | Arizona Board Of Regents On Behalf Of Arizona State University | Pagophobic coating compositions, method of manufacture and methods of use |
DE102014006739B3 (en) * | 2014-05-12 | 2015-06-25 | Albert-Ludwigs-Universität Freiburg | Process for coating surfaces with nanostructures, component produced by the process and use of the component |
US20170014111A1 (en) * | 2015-07-17 | 2017-01-19 | Hoowaki, Llc | Microstructured Surface |
US10064273B2 (en) | 2015-10-20 | 2018-08-28 | MR Label Company | Antimicrobial copper sheet overlays and related methods for making and using |
US11207478B2 (en) | 2016-03-25 | 2021-12-28 | Rai Strategic Holdings, Inc. | Aerosol production assembly including surface with micro-pattern |
US10501640B2 (en) | 2017-01-31 | 2019-12-10 | Arizona Board Of Regents On Behalf Of Arizona State University | Nanoporous materials, method of manufacture and methods of use |
US11297876B2 (en) * | 2017-05-17 | 2022-04-12 | Rai Strategic Holdings, Inc. | Aerosol delivery device |
US11078589B2 (en) * | 2019-08-28 | 2021-08-03 | Saudi Arabian Oil Company | Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same |
US20220240588A1 (en) * | 2021-01-29 | 2022-08-04 | 2792684 Ontario Inc. | Nanotextured Airflow Passage |
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US5326454A (en) * | 1987-08-26 | 1994-07-05 | Martin Marietta Corporation | Method of forming electrodeposited anti-reflective surface coatings |
US5320908A (en) * | 1989-05-04 | 1994-06-14 | Ad Tech Holdings Limited | Deposition of an extremely thin silver layer on a nonconducting substrate |
CA2033107C (en) * | 1990-12-24 | 2001-06-12 | Robert Edward Burrell | Actively sterile surfaces |
EP2128214B1 (en) * | 1996-05-31 | 2013-03-20 | Toto Ltd. | Antifouling member and antifouling coating composition |
US6071398A (en) | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
US7074498B2 (en) * | 2002-03-22 | 2006-07-11 | Borealis Technical Limited | Influence of surface geometry on metal properties |
DE10015855A1 (en) * | 2000-03-30 | 2001-10-11 | Basf Ag | Application of the lotus effect in process engineering |
DE10139572A1 (en) | 2001-08-10 | 2003-03-13 | Creavis Tech & Innovation Gmbh | Maintaining the lotus effect by preventing microbial growth after damage to the self-cleaning surface |
ATE386502T1 (en) * | 2002-11-19 | 2008-03-15 | Univ Danmarks Tekniske | USE OF BIOLOGICAL INHIBITING MATERIAL TO INHIBIT LIVING CELLS |
US7527832B2 (en) * | 2005-04-27 | 2009-05-05 | Ferro Corporation | Process for structuring self-cleaning glass surfaces |
DK2012839T3 (en) * | 2006-04-07 | 2012-04-10 | Bactiguard Ab | HIS UNKNOWN ANTIMICROBIAL SUBSTRATES AND APPLICATIONS THEREOF |
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US20080118772A1 (en) | 2008-05-22 |
WO2006082180A1 (en) | 2006-08-10 |
MX2007009397A (en) | 2007-09-21 |
EP1843864A1 (en) | 2007-10-17 |
CN101119811A (en) | 2008-02-06 |
US7935428B2 (en) | 2011-05-03 |
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