EP1803338A1 - Flex-rigid printed circuit by bonding - Google Patents

Flex-rigid printed circuit by bonding

Info

Publication number
EP1803338A1
EP1803338A1 EP05775280A EP05775280A EP1803338A1 EP 1803338 A1 EP1803338 A1 EP 1803338A1 EP 05775280 A EP05775280 A EP 05775280A EP 05775280 A EP05775280 A EP 05775280A EP 1803338 A1 EP1803338 A1 EP 1803338A1
Authority
EP
European Patent Office
Prior art keywords
circuit
rigid
printed circuit
flexible
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05775280A
Other languages
German (de)
French (fr)
Inventor
Jean-Marc Degottex
Carol Ouchakoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bree Industrie
Original Assignee
Bree Industrie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bree Industrie filed Critical Bree Industrie
Publication of EP1803338A1 publication Critical patent/EP1803338A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Definitions

  • the present invention relates to the field of printed circuits.
  • the present invention relates more particularly to the connection between two printed circuits to form a hybrid printed circuit flex-rigid type.
  • the two connected circuits are one rigid type and the other flexible or flexible type.
  • Said flexible circuit consists of an electrically conductive layer deposited on a flexible insulating material such as polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the flexible circuit is then bonded by means of a heat-reactive insulating adhesive containing electrically conductive particles.
  • Another flexible insulating layer is deposited, by screen printing, on the conductive portion of the flexible circuit.
  • the prior art also discloses, by Japanese Patent Application JP 07 105 785 (Matsushita Electronic), a similar method of connecting a rigid circuit with a flexible printed circuit.
  • the rigid circuit is glued to one end of a printed face of a flexible circuit.
  • Said flexible circuit is constituted by the printing of a predefined circuit pattern on a synthetic resin using a conductive ink and by adding an insulating paste on the assembly except the ends, points of contact .
  • a protective tab is added between the flexible circuit and the rigid circuit to prevent any circuit disconnection.
  • Scientific publication XP000004823 also discloses a flex-rigid circuit produced by the standard laminating methods of the various layers of the circuit concerning both the rigid part and the flexible part; US Pat. No. 5,100,492, a flex-rigid circuit realized by standard technology in which a trimming of the rigid substrate is performed to provide a flexible area to the circuit; by patent application JP 07 170029, a flex-rigid obtained by standard technology; and European Patent Application EP 0 197 595, a method of metallizing the holes by suction using a vacuum chamber. All of these solutions do not relate to the field of the present invention in that the flex-rigid circuit obtained is not derived from the connection of a flexible printed circuit with a rigid circuit.
  • a rigid printed circuit connection body consisting of conductive metal deposited in a hole through the circuits to be electrically connected. It is clear from FIGS. 2 and 3 that the method used does not implement a screen printing deposit of this conductive metal. Indeed, this metal is inserted into cavities present in the intermediate layers, which can not be achieved by a screen printing process.
  • the present invention intends to present a very low cost method for connecting a rigid circuit with a flexible printed circuit (or flex).
  • the bond is made for example by gluing or by adhesive attached to the rigid printed circuit.
  • a conductive ink provides the electrical connection between the two circuits.
  • the invention relates in its most general acceptance a method for connecting a rigid printed circuit with a flexible printed circuit, comprising a step of bonding the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure the back-to-back superposition of electrical contact pads of the two circuits, a step of drilling this assembly at the level of said electric contact pads, and a step of electrically connecting said holes produced by screen printing a conductive paste.
  • the two circuits are assembled by bonding the insulating surface of the end of the flexible printed circuit to the insulating surface of the end of the rigid circuit.
  • said conductive ink is a polymeric ink.
  • said conductive ink is a conductive adhesive.
  • said gluing step implements means ensuring the superposition of the flexible circuit on the rigid circuit.
  • said means ensuring the superposition of the two circuits comprise holes on the rigid circuit and corresponding holes on the flexible circuit, and positioning pins passing through the two circuits in said holes which correspond in pairs.
  • said means ensuring the superposition of the two circuits implement a marking on the rigid circuit, said marking corresponding to the home position of the flexible circuit.
  • said rigid circuit is a rigid printed circuit.
  • said rigid printed circuit is a single-sided circuit.
  • said rigid printed circuit is a double-sided circuit.
  • said rigid printed circuit is a multilayer circuit.
  • the invention also relates to a hybrid circuit comprising at least one rigid component and a flexible printed circuit bonded to said rigid component, the rigid component having superposed electrical contact pads with homologous contact pads provided for the flexible printed circuit, the stacking glued being pierced at said contact pads so as to "bare" the various layers and said contact pads of the flexible printed circuit being electrically connected to said contact pads of the rigid component by a conductive ink.
  • the rigid component is constituted by a rigid printed circuit.
  • the rigid component is constituted by a liquid crystal screen.
  • the rigid component is constituted by a keyboard.
  • said hybrid circuit comprises at least two rigid components connected by a flexible printed circuit.
  • FIG. 1 represents a side view of a flex printed circuit board and a rigid printed circuit board
  • FIG. 2 represents a side view of the bonding of a printed circuit flex with a rigid printed circuit
  • FIG. 3 represents a cross section of the piercing of the circuit constituted by the bonding of a printed circuit flex with a rigid printed circuit
  • FIG. 4 shows a cross section of a connection between a flex printed circuit and a rigid circuit.
  • the present invention implements a method of connecting a rigid circuit with a flex printed circuit.
  • the advantage of the method of the present invention is to provide a flex-rigid circuit from two independent circuits and available at low costs.
  • the rigid circuit (1) may be a single-sided rigid printed circuit with or without copper, silver or carbon straps, double-sided, multilayer, rigid-flex.
  • it is manufactured using base materials such as FR1, FR2, FR3, FR4, FR5 or CEM1, CEM3.
  • It comprises a rigid insulating substrate (11) on which is engraved a copper track (12).
  • the thickness of the substrate may vary from a few tenths of a millimeter to several millimeters and that of the copper track from a few microns to a few hundred microns.
  • the substrate is 1.6 mm thick and the copper track about 35 microns.
  • the end of the copper track is in the form of a chip (13) and acts as a reception area for the electrical connection between the two circuits according to the method of the present invention.
  • the flex or flexible printed circuit (2) is common to what is done in the flexible printed circuit industry. It is composed of a flexible substrate (21) of a few microns to a few hundred microns thick, ideally 100 microns, on which are engraved conductive tracks (22). It may be manufactured using, for example, polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET) or polyester, and may be of flex or flex-rigid type.
  • the copper tracks also end with pellets (23).
  • the process of the present invention comprises three steps.
  • an adhesive (3) or substance allowing the gluing of two circuits is deposited, by transfer, by screen printing or by spraying, indifferently on one end of the substrate face of the flexible circuit. corresponding to the pellets (23) or on the end of the rigid circuit, on the back of the location of the pellets (13).
  • the adhesive substance (3) used is not electrically conductive.
  • an epoxy glue can be used.
  • the pellets (13) and (23) correspond to the zones of each of the circuits through which the electrical connection of the different conductive layers of the circuits will be achieved.
  • the end of the flexible circuit is then positioned on the rigid circuit so that the pellets of said flexible circuit superimpose those of the rigid circuit, the two circuits being placed back-to-back without direct contact of the pellets.
  • the positioning of the flexible printed circuit on the rigid circuit can be realized manually by the presence of holes on said rigid circuit and corresponding holes on said flexible circuit and by the use of ancillary tools.
  • This auxiliary tooling has positioning pins. These are positioned so as to successively cross the rigid circuit by a given hole and the flexible circuit through the hole corresponding to the through hole of the rigid circuit (or vice versa), so as to make the two circuits coincide and ensure the superimposition tablets.
  • the positioning can be done by marking in marking on the rigid circuit of the position of the flexible circuit host. Bonding is then ensured by pressing, rolling, or simple contact and by the polymerization of the glue if the latter is polymer.
  • the second step of the method of the present invention is to pierce the stack thus produced to accommodate the conductive ink to achieve the electrical connection between the circuits.
  • the circuits are back-to-back, insulating layer against insulating layer, with an insulating adhesive layer between the two circuits, therefore without electrical connection.
  • a drilling (4) of the hybrid circuit obtained by gluing the flexible printed circuit on a rigid circuit as described in the previous step.
  • This piercing (4) is made at the level of the pellets (13) and (23).
  • An order of magnitude of the diameter of the bore (4) is 0.55 mm.
  • One way to accomplish this task is to drill the hybrid circuit by tools commonly used in the printed circuit industry (drill, laser, punching).
  • the hybrid circuit thus obtained now has "holes” (4) at the pellets superimposed during the bonding of the two circuits. These holes “expose” the different layers of each of the two circuits.
  • the third step allows the electrical connection of the two circuits by metallization or conductive ink supply (5) in the holes and on the surface of the pellets, as shown in FIG. 4.
  • Said pellets correspond to the conductive zones of the contact pads. circuits, in the vicinity of the drilling (4) previously performed.
  • this step therefore consists in depositing a conductive ink (5) on the surface of the pellets (13) and (23) and in the "holes" (4) made during the second step of the process.
  • the ink thus deposited provides the electrical connection between the pads (13) and (23) and therefore the electrical connection between the flex circuit (2) and the rigid circuit (1).
  • the deposition of the conductive ink (5) is produced by screen printing.
  • the conductive ink (5) is deposited by suction.
  • the conductive ink (5) used is preferably of the polymer type. It can be, for example, based on silver, copper or carbon. Alternatively, a conductive adhesive is used as an ink.
  • connection is made by metallization of the bore (4).
  • a conductive material for example copper, is deposited in the bore (4) and on the pellets (13) and (23) providing the electrical connection between the two circuits (1) and (2).
  • the unconnected flexible end of the hybrid circuit obtained by the method of the present invention may be interchangeably coupled with a connector to a liquid crystal display or to a keyboard, or with any other type of rigid circuit.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention concerns the field of printed circuits. The invention concerns a method for connecting a rigid circuit to a flexible printed circuit, characterized in that it consists, successively, in bonding the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure that the electric contact pads of both circuits are superimposed back-to-back, piercing said assembly at said electric contact pads, and electrically connecting said punch-throughs by silk-screening deposition of a conductive paste.

Description

CIRCUIT IMPRIME FLEX-RIGIDE PAR COLLAGE FLEX-RIGID PRINTED CIRCUIT BY COLLAGE
La présente invention se rapporte au domaine des circuits imprimés.The present invention relates to the field of printed circuits.
La présente invention se rapporte plus particulièrement à la liaison entre deux circuits imprimés pour constituer un circuit imprimé hybride de type flex- rigide. Les deux circuits reliés sont, l'un, de type rigide et, l'autre, de type flexible ou souple.The present invention relates more particularly to the connection between two printed circuits to form a hybrid printed circuit flex-rigid type. The two connected circuits are one rigid type and the other flexible or flexible type.
L'art antérieur connaît déjà, par la demande de brevet japonais JP 08 335 472 (Shin Etsu Polymer), un procédé de liaison d'un circuit rigide avec un circuit souple. Ledit circuit souple est constitué d'une couche électriquement conductrice déposée sur un matériau isolant flexible tel que le polyéthylène téréphtalate (PET). Le circuit souple est ensuite collé au moyen d'un adhésif isolant réactif à la chaleur contenant des particules électriquement conductrices. Une autre couche isolante flexible est déposée, par sérigraphie, sur la partie conductrice du circuit souple.The prior art already knows, by the Japanese patent application JP 08 335 472 (Shin Etsu Polymer), a method of connecting a rigid circuit with a flexible circuit. Said flexible circuit consists of an electrically conductive layer deposited on a flexible insulating material such as polyethylene terephthalate (PET). The flexible circuit is then bonded by means of a heat-reactive insulating adhesive containing electrically conductive particles. Another flexible insulating layer is deposited, by screen printing, on the conductive portion of the flexible circuit.
L'art antérieur connaît également, par la demande de brevet japonais JP 07 105 785 (Matsushita Electronic), un procédé semblable de liaison d'un circuit rigide avec un circuit imprimé souple. Le circuit rigide est collé à une extrémité d'une face imprimée d'un circuit souple. Ledit circuit souple est constitué par l'impression d'un motif de circuit prédéfini sur une résine synthétique à l'aide d'une encre conductrice et par l'ajout d'une pâte isolante sur l'ensemble excepté les extrémités, points de contact. Une patte protectrice est ajoutée entre le circuit souple et le circuit rigide pour prévenir de toute déconnection de circuit.The prior art also discloses, by Japanese Patent Application JP 07 105 785 (Matsushita Electronic), a similar method of connecting a rigid circuit with a flexible printed circuit. The rigid circuit is glued to one end of a printed face of a flexible circuit. Said flexible circuit is constituted by the printing of a predefined circuit pattern on a synthetic resin using a conductive ink and by adding an insulating paste on the assembly except the ends, points of contact . A protective tab is added between the flexible circuit and the rigid circuit to prevent any circuit disconnection.
On connaît également, par la publication scientifique XP000004823, un circuit flex-rigide produit par les procédés standards de stratification des différentes couches du circuit concernant à la fois la partie rigide et la partie souple ; par le brevet américain US 5 100 492, un circuit flex-rigide réalisé par une technologie standard dans laquelle un détourage du substrat rigide est effectué pour fournir une zone souple au circuit ; par la demande de brevet JP 07 170029, un flex-rigide obtenu par technologie standard ; et par la demande de brevet européen EP 0 197 595, un procédé de métallisation des trous par aspiration à l'aide d'une chambre en dépression. L'ensemble de ces solutions ne concernent pas le domaine de la présente invention en ce que le circuit flex-rigide obtenu n'est pas issu de la liaison d'un circuit imprimé souple avec un circuit rigide.Scientific publication XP000004823 also discloses a flex-rigid circuit produced by the standard laminating methods of the various layers of the circuit concerning both the rigid part and the flexible part; US Pat. No. 5,100,492, a flex-rigid circuit realized by standard technology in which a trimming of the rigid substrate is performed to provide a flexible area to the circuit; by patent application JP 07 170029, a flex-rigid obtained by standard technology; and European Patent Application EP 0 197 595, a method of metallizing the holes by suction using a vacuum chamber. All of these solutions do not relate to the field of the present invention in that the flex-rigid circuit obtained is not derived from the connection of a flexible printed circuit with a rigid circuit.
On connaît également, par le brevet américain US 4 538 143, la liaison d'un circuit imprimé souple avec un afficheur numérique. Cette liaison concerne la mise en correspondance des deux éléments selon des trous préformés, puis le remplissage des trous par une pâte d'argent afin de réaliser la liaison électrique des deux éléments. L'inconvénient de cette solution est que le perçage est réalisé après le collage de l'empilement ce qui empêche toute régularité du trou. Il en résulte alors un décalage possible des deux éléments au niveau des trous, le remplissage par la pâte d'argent étant alors plus compliqué. Tout défaut à ce niveau-là génère des problèmes d'intégrité de l'empilement (par exemple lors de la dilatation des éléments). On connaît également, dans l'état de la technique, des procédés de fabrication de circuits flex-rigides réalisés par stratification des différentes couches du circuit. Les étapes successives de la stratification concernent à la fois la partie rigide et la partie souple du circuit de telle sorte que le circuit final ait les parties rigide et souple déjà reliées. Cette technologie est fort coûteuse d'autant plus que les moyens utilisés pour réaliser le système de liaison des contacts électriques entre les deux parties du circuit ont un coût élevé.Also known from US Pat. No. 4,538,143 is the connection of a flexible printed circuit board to a digital display. This connection concerns the matching of the two elements according to preformed holes, then the filling of the holes with a silver paste in order to achieve the electrical connection of the two elements. The disadvantage of this solution is that the drilling is performed after the bonding of the stack which prevents any regularity of the hole. This then results in a possible offset of the two elements at the holes, the filling by the silver paste is then more complicated. Any defect at this level generates problems of integrity of the stack (for example during the expansion of the elements). Also known in the state of the art, methods of manufacturing flex-rigid circuits made by laminating the various layers of the circuit. The successive stages of the stratification concern both the rigid part and the flexible part of the circuit so that the final circuit has the rigid and flexible parts already connected. This technology is very expensive especially since the means used to make the system for connecting the electrical contacts between the two parts of the circuit have a high cost.
On connaît également, par la demande de brevet japonais JP 61 127195, un corps de connexion pour circuit imprimé rigide, consistant en du métal conducteur déposé dans un trou traversant les circuits à mettre en liaison électrique. Il apparaît clairement sur les figures 2 et 3 que le procédé utilisé ne met pas en œuvre un dépôt par sérigraphie de ce métal conducteur. En effet, ce métal est inséré dans des cavités présentes dans les couches intermédiaires, ce qui ne peut être réalisé par un procédé par sérigraphie.Also known from Japanese Patent Application JP 61 127195, a rigid printed circuit connection body consisting of conductive metal deposited in a hole through the circuits to be electrically connected. It is clear from FIGS. 2 and 3 that the method used does not implement a screen printing deposit of this conductive metal. Indeed, this metal is inserted into cavities present in the intermediate layers, which can not be achieved by a screen printing process.
La présente invention entend présenter un procédé à très bas coûts permettant la liaison d'un circuit rigide avec un circuit imprimé souple (ou flex) . La liaison est réalisée par exemple par collage ou par adhésif rapporté sur le circuit imprimé rigide. Puis une encre conductrice assure la connexion électrique entre les deux circuits.The present invention intends to present a very low cost method for connecting a rigid circuit with a flexible printed circuit (or flex). The bond is made for example by gluing or by adhesive attached to the rigid printed circuit. Then a conductive ink provides the electrical connection between the two circuits.
A cet effet, l'invention concerne dans son acceptation la plus générale un procédé pour la liaison d'un circuit imprimé rigide avec un circuit imprimé souple, comportant une étape de collage de l'extrémité du circuit imprimé souple sur l'extrémité du circuit rigide, de manière à assurer la superposition dos-à-dos de pastilles de contact électrique des deux circuits, une étape de perçage de cet assemblage au niveau desdites pastilles de contact électrique, et une étape de liaison électrique desdits perçages réalisée par dépôt par sérigraphie d'une pâte conductrice.For this purpose, the invention relates in its most general acceptance a method for connecting a rigid printed circuit with a flexible printed circuit, comprising a step of bonding the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure the back-to-back superposition of electrical contact pads of the two circuits, a step of drilling this assembly at the level of said electric contact pads, and a step of electrically connecting said holes produced by screen printing a conductive paste.
Dans un mode de réalisation, les deux circuits sont assemblés par collage de la surface isolante de l'extrémité du circuit imprimé souple sur la surface isolante de l'extrémité du circuit rigide. Dans un mode de réalisation particulier, ladite encre conductrice est une encre polymère. Selon une variante, ladite encre conductrice est une colle conductrice. Dans un autre mode de réalisation, ladite étape de collage met en œuvre des moyens assurant la superposition du circuit souple sur le circuit rigide. Particulièrement, lesdits moyens assurant la superposition des deux circuits comprennent des trous sur le circuit rigide et des trous correspondants sur le circuit souple, et des ergots de positionnement traversant les deux circuits dans lesdits trous qui correspondent deux à deux. Selon un autre mode de mise œuvre, lesdits moyens assurant la superposition des deux circuits mettent en oeuvre un marquage sur le circuit rigide, ledit marquage correspondant à la position d'accueil du circuit souple. Dans un mode de réalisation, ledit circuit rigide est un circuit imprimé rigide. Eventuellement, ledit circuit imprimé rigide est un circuit simple face. Particulièrement, ledit circuit imprimé rigide est un circuit double face. Selon une autre variante, ledit circuit imprimé rigide est un circuit multicouches.In one embodiment, the two circuits are assembled by bonding the insulating surface of the end of the flexible printed circuit to the insulating surface of the end of the rigid circuit. In a particular embodiment, said conductive ink is a polymeric ink. According to a variant, said conductive ink is a conductive adhesive. In another embodiment, said gluing step implements means ensuring the superposition of the flexible circuit on the rigid circuit. In particular, said means ensuring the superposition of the two circuits comprise holes on the rigid circuit and corresponding holes on the flexible circuit, and positioning pins passing through the two circuits in said holes which correspond in pairs. According to another mode of implementation, said means ensuring the superposition of the two circuits implement a marking on the rigid circuit, said marking corresponding to the home position of the flexible circuit. In one embodiment, said rigid circuit is a rigid printed circuit. Optionally, said rigid printed circuit is a single-sided circuit. In particular, said rigid printed circuit is a double-sided circuit. According to another variant, said rigid printed circuit is a multilayer circuit.
L'invention concerne également un circuit hybride comprenant au moins un composant rigide et un circuit imprimé souple collé sur ledit composant rigide, le composant rigide présentant des pastilles de contact électrique superposées avec des pastilles de contact homologues prévues du circuit imprimé souple, l'empilage collé étant percé au niveau desdites pastilles de contact de sorte à mettre à « nu » les différentes couches et lesdites pastilles de contact du circuit imprimé souple étant reliées électriquement aux dites pastilles de contact du composant rigide par une encre conductrice. Dans un mode de réalisation, le composant rigide est constitué par un circuit imprimé rigide. Dans un autre mode de réalisation, le composant rigide est constitué par un écran à cristaux liquide. Dans un mode de réalisation particulier, le composant rigide est constitué par un clavier. Particulièrement, ledit circuit hybride comporte au moins deux composants rigides reliés par un circuit imprimé souple.The invention also relates to a hybrid circuit comprising at least one rigid component and a flexible printed circuit bonded to said rigid component, the rigid component having superposed electrical contact pads with homologous contact pads provided for the flexible printed circuit, the stacking glued being pierced at said contact pads so as to "bare" the various layers and said contact pads of the flexible printed circuit being electrically connected to said contact pads of the rigid component by a conductive ink. In one embodiment, the rigid component is constituted by a rigid printed circuit. In another embodiment, the rigid component is constituted by a liquid crystal screen. In a particular embodiment, the rigid component is constituted by a keyboard. In particular, said hybrid circuit comprises at least two rigid components connected by a flexible printed circuit.
On comprendra mieux l'invention à l'aide de la description, faite ci-après à titre purement explicatif, d'un mode de réalisation de l'invention, en référence aux figures annexées : la figure 1 représente une vue latérale d'un circuit imprimé flex et d'un circuit imprimé rigide, la figure 2 représente une vue latérale du collage d'un circuit imprimé flex avec un circuit imprimé rigide, la figure 3 représente une coupe transversale du perçage du circuit constitué par le collage d'un circuit imprimé flex avec un circuit imprimé rigide, la figure 4 représente une coupe transversale d'une liaison entre un circuit imprimé flex et un circuit rigide.The invention will be better understood by means of the following description, given purely for explanatory purposes, of one embodiment of the invention, with reference to the appended figures: FIG. 1 represents a side view of a flex printed circuit board and a rigid printed circuit board, FIG. 2 represents a side view of the bonding of a printed circuit flex with a rigid printed circuit, FIG. 3 represents a cross section of the piercing of the circuit constituted by the bonding of a printed circuit flex with a rigid printed circuit, FIG. 4 shows a cross section of a connection between a flex printed circuit and a rigid circuit.
La présente invention met en œuvre un procédé de liaison d'un circuit rigide avec un circuit imprimé flex. L'intérêt du procédé de la présente invention est de réaliser un circuit flex-rigide à partir de deux circuits indépendants et disponibles à bas coûts.The present invention implements a method of connecting a rigid circuit with a flex printed circuit. The advantage of the method of the present invention is to provide a flex-rigid circuit from two independent circuits and available at low costs.
En référence à la figure 1, le circuit rigide (1) peut être un circuit imprimé rigide simple face avec ou sans straps cuivre, argent ou carbone, double face, multicouches, flex-rigide. De préférence, il est fabriqué en utilisant des matières de base telles que le FRl, FR2, FR3, FR4 , FR5 ou encore CEMl, CEM3. Il comporte un substrat isolant rigide (11) sur lequel est gravée une piste de cuivre (12). Dans la pratique, l'épaisseur du substrat peut varier de quelques dixièmes de millimètre à plusieurs millimètres et celle de la piste de cuivre de quelques microns à quelques centaines de microns. Selon un mode de mise en œuvre particulier, le substrat fait 1,6 mm d'épaisseur et la piste de cuivre environ 35 μm. L'extrémité de la piste de cuivre est en forme de pastille (13) et fait office de plage d'accueil pour la liaison électrique entre les deux circuits selon le procédé de la présente invention. Le circuit imprimé flex ou souple (2) est commun à ce qui se fait dans l'industrie du circuit imprimé souple. Il est composé d'un substrat souple (21) de quelques microns à quelques centaines de microns d'épaisseur, idéalement 100 μm, sur lequel sont gravées des pistes conductrices (22). Il peut être fabriqué en utilisant, par exemple, du Polyimide, du polyéthylène naphthalate (PEN), du polyéthylène téréphtalate (PET) ou encore du Polyester, et peut être de type flex ou flex-rigide. Les pistes de cuivre se terminent également par des pastilles (23).With reference to FIG. 1, the rigid circuit (1) may be a single-sided rigid printed circuit with or without copper, silver or carbon straps, double-sided, multilayer, rigid-flex. Preferably, it is manufactured using base materials such as FR1, FR2, FR3, FR4, FR5 or CEM1, CEM3. It comprises a rigid insulating substrate (11) on which is engraved a copper track (12). In practice, the thickness of the substrate may vary from a few tenths of a millimeter to several millimeters and that of the copper track from a few microns to a few hundred microns. According to a particular mode of implementation, the substrate is 1.6 mm thick and the copper track about 35 microns. The end of the copper track is in the form of a chip (13) and acts as a reception area for the electrical connection between the two circuits according to the method of the present invention. The flex or flexible printed circuit (2) is common to what is done in the flexible printed circuit industry. It is composed of a flexible substrate (21) of a few microns to a few hundred microns thick, ideally 100 microns, on which are engraved conductive tracks (22). It may be manufactured using, for example, polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET) or polyester, and may be of flex or flex-rigid type. The copper tracks also end with pellets (23).
Le procédé de la présente invention comprend trois étapes.The process of the present invention comprises three steps.
Comme illustré sur la figure 2, lors de la première étape, un adhésif (3) ou substance permettant le collage de deux circuits, est déposé, par report, par sérigraphie ou par pulvérisation, indifféremment sur une extrémité de la face substrat du circuit souple correspondant aux pastilles (23) ou sur l'extrémité du circuit rigide, au verso de l'emplacement des pastilles (13). Selon un mode de réalisation, la substance adhésive (3) utilisée n'est pas électriquement conductrice. On peut, par exemple, utiliser une colle époxy. Les pastilles (13) et (23) correspondent aux zones de chacun des circuits par lesquelles sera réalisée la mise en liaison électrique des différentes couches conductrices des circuits.As illustrated in FIG. 2, during the first step, an adhesive (3) or substance allowing the gluing of two circuits is deposited, by transfer, by screen printing or by spraying, indifferently on one end of the substrate face of the flexible circuit. corresponding to the pellets (23) or on the end of the rigid circuit, on the back of the location of the pellets (13). According to one embodiment, the adhesive substance (3) used is not electrically conductive. For example, an epoxy glue can be used. The pellets (13) and (23) correspond to the zones of each of the circuits through which the electrical connection of the different conductive layers of the circuits will be achieved.
L'extrémité du circuit souple est ensuite positionnée sur le circuit rigide de sorte que les pastilles dudit circuit souple superposent celles du circuit rigide, les deux circuits étant mis dos-à-dos sans contact direct des pastilles. Le positionnement du circuit imprimé souple sur le circuit rigide peut être réalisé de façon manuelle par la présence de trous sur ledit circuit rigide et de trous correspondants sur ledit circuit souple et par l'utilisation d'un outillage annexe. Cet outillage annexe présente des ergots de positionnement. Ces derniers sont positionnés de façon à traverser successivement le circuit rigide par un trou donné et le circuit souple par le trou correspondant au trou traversé du circuit rigide (ou l'inverse), de sorte à faire coïncider les deux circuits et à assurer la superposition des pastilles. Selon une variante, le positionnement peut se faire par repérage en marquage sur le circuit rigide de la position de l'accueil de circuit souple. Le collage est ensuite assuré par pressage, laminage, ou simple contact et par la polymérisation de la colle si cette dernière est polymère.The end of the flexible circuit is then positioned on the rigid circuit so that the pellets of said flexible circuit superimpose those of the rigid circuit, the two circuits being placed back-to-back without direct contact of the pellets. The positioning of the flexible printed circuit on the rigid circuit can be realized manually by the presence of holes on said rigid circuit and corresponding holes on said flexible circuit and by the use of ancillary tools. This auxiliary tooling has positioning pins. These are positioned so as to successively cross the rigid circuit by a given hole and the flexible circuit through the hole corresponding to the through hole of the rigid circuit (or vice versa), so as to make the two circuits coincide and ensure the superimposition tablets. According to one variant, the positioning can be done by marking in marking on the rigid circuit of the position of the flexible circuit host. Bonding is then ensured by pressing, rolling, or simple contact and by the polymerization of the glue if the latter is polymer.
En référence à la figure 3, la deuxième étape du procédé de la présente invention consiste à percer l'empilage ainsi réalisé pour accueillir l'encre conductrice en vue de réaliser la liaison électrique entre les circuits. En effet, les circuits sont dos-à-dos, couche isolante contre couche isolante, avec une couche adhésive isolante entre les deux circuits, donc sans liaison électrique. Pour cela, est effectué un perçage (4) du circuit hybride obtenu par le collage du circuit imprimé souple sur un circuit rigide comme décrit dans l'étape précédente. Ce perçage (4) est réalisé au niveau des pastilles (13) et (23). Un ordre de grandeur du diamètre du perçage (4) est 0,55 mm. Un moyen pour la réalisation de cette tâche consiste à percer le circuit hybride par des outils communément utilisés dans l'industrie des circuits imprimés (foret, laser, poinçonnage).Referring to Figure 3, the second step of the method of the present invention is to pierce the stack thus produced to accommodate the conductive ink to achieve the electrical connection between the circuits. Indeed, the circuits are back-to-back, insulating layer against insulating layer, with an insulating adhesive layer between the two circuits, therefore without electrical connection. For this, is performed a drilling (4) of the hybrid circuit obtained by gluing the flexible printed circuit on a rigid circuit as described in the previous step. This piercing (4) is made at the level of the pellets (13) and (23). An order of magnitude of the diameter of the bore (4) is 0.55 mm. One way to accomplish this task is to drill the hybrid circuit by tools commonly used in the printed circuit industry (drill, laser, punching).
Le circuit hybride ainsi obtenu possède maintenant des « trous » (4) au niveau des pastilles mises en superposition lors du collage des deux circuits. Ces trous « mettent à nu » les différentes couches de chacun des deux circuits.The hybrid circuit thus obtained now has "holes" (4) at the pellets superimposed during the bonding of the two circuits. These holes "expose" the different layers of each of the two circuits.
La troisième étape permet la mise en liaison électrique des deux circuits par métallisation ou apport d'encre conductrice (5) dans les perçages et à la surface des pastilles, comme illustré par la figure 4. Lesdites pastilles correspondent aux zones conductrices des plages de contact des circuits, aux abords du perçage (4) précédemment effectué.The third step allows the electrical connection of the two circuits by metallization or conductive ink supply (5) in the holes and on the surface of the pellets, as shown in FIG. 4. Said pellets correspond to the conductive zones of the contact pads. circuits, in the vicinity of the drilling (4) previously performed.
Dans un mode de réalisation préféré, cette étape consiste donc à déposer une encre conductrice (5) à la surface des pastilles (13) et (23) et dans les « trous » (4) réalisés lors de la deuxième étape du procédé. L'encre ainsi déposée assure la connexion électrique entre les pastilles (13) et (23) et donc la liaison électrique entre le circuit flex (2) et le circuit rigide (1). De préférence, le dépôt de l'encre conductrice (5) est réalisé par sérigraphie. Dans une variante, l'encre conductrice (5) est déposée par aspiration. L'encre conductrice (5) utilisée est, de préférence, de type polymère. Elle peut être, par exemple, à base d'argent, de cuivre ou encore de carbone. Selon une variante, une colle conductrice est utilisée en guise d'encre. Dans un autre mode de réalisation, la liaison est effectuée par métallisation du perçage (4). Par un procédé électrochimique, un matériau conducteur, par exemple du cuivre, est déposé dans le perçage (4) et sur les pastilles (13) et (23) assurant la liaison électrique entre les deux circuits (1) et (2).In a preferred embodiment, this step therefore consists in depositing a conductive ink (5) on the surface of the pellets (13) and (23) and in the "holes" (4) made during the second step of the process. The ink thus deposited provides the electrical connection between the pads (13) and (23) and therefore the electrical connection between the flex circuit (2) and the rigid circuit (1). Preferably, the deposition of the conductive ink (5) is produced by screen printing. In a variant, the conductive ink (5) is deposited by suction. The conductive ink (5) used is preferably of the polymer type. It can be, for example, based on silver, copper or carbon. Alternatively, a conductive adhesive is used as an ink. In another embodiment, the connection is made by metallization of the bore (4). By an electrochemical process, a conductive material, for example copper, is deposited in the bore (4) and on the pellets (13) and (23) providing the electrical connection between the two circuits (1) and (2).
L'extrémité souple non reliée du circuit hybride obtenu par le procédé de la présente invention, peut être indifféremment accouplée avec un connecteur vers un écran à cristaux liquides ou vers un clavier, ou avec tout autre type de circuit rigide. The unconnected flexible end of the hybrid circuit obtained by the method of the present invention may be interchangeably coupled with a connector to a liquid crystal display or to a keyboard, or with any other type of rigid circuit.

Claims

REVENDICATIONS
1. Procédé pour la liaison d'un circuit rigide avec un circuit imprimé souple, caractérisé en ce qu'il comporte, dans l'ordre, une étape de collage de l'extrémité du circuit imprimé souple sur l'extrémité du circuit rigide, de manière à assurer la superposition dos-à-dos de pastilles de contact électrique des deux circuits, une étape de perçage de cet assemblage au niveau desdites pastilles de contact électrique, et une étape de liaison électrique desdits perçages réalisée par dépôt par sérigraphie d'une pâte conductrice.1. A method for connecting a rigid circuit with a flexible printed circuit, characterized in that it comprises, in order, a bonding step of the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure the back-to-back superposition of electrical contact pads of the two circuits, a step of drilling this assembly at said electrical contact pads, and a step of electrical connection of said holes produced by screen printing deposition of a conductive paste.
2. Procédé pour la liaison selon la revendication précédente, caractérisé en ce que les deux circuits sont assemblés par collage de la surface isolante de l'extrémité du circuit imprimé souple sur la surface isolante de l'extrémité du circuit rigide.2. Method for the connection according to the preceding claim, characterized in that the two circuits are assembled by bonding the insulating surface of the end of the flexible printed circuit on the insulating surface of the end of the rigid circuit.
3. Procédé pour la liaison selon la revendication 1, caractérisé en ce que ladite pâte conductrice est une encre.3. Method for the connection according to claim 1, characterized in that said conductive paste is an ink.
4. Procédé pour la liaison selon la revendication 1, caractérisé en ce que ladite pâte conductrice est une colle.4. Method for the connection according to claim 1, characterized in that said conductive paste is an adhesive.
5. Procédé pour la liaison selon l'une quelconque des revendications précédentes, caractérisé en ce que ladite étape de collage met en œuvre des moyens assurant la superposition du circuit souple sur le circuit rigide.5. Method for the connection according to any one of the preceding claims, characterized in that said bonding step implements means ensuring the superposition of the flexible circuit on the rigid circuit.
6. Procédé pour la liaison selon la revendication précédente, caractérisé en ce que lesdits moyens assurant la superposition des deux circuits comprennent des trous sur le circuit rigide et des trous correspondants sur le circuit souple, et des ergots de positionnement traversant les deux circuits dans lesdits trous qui correspondent deux à deux.6. Method for the connection according to the preceding claim, characterized in that said means ensuring the superposition of the two circuits comprise holes on the rigid circuit and corresponding holes on the flexible circuit, and positioning pins passing through the two circuits in said holes which correspond in pairs.
7. Procédé pour la liaison selon la revendication 5, caractérisé en ce que lesdits moyens assurant la superposition des deux circuits mettent en oeuvre un marquage sur le circuit rigide, ledit marquage correspondant à la position d'accueil du circuit souple.7. Method for the connection according to claim 5, characterized in that said means ensuring the superposition of the two circuits implement a marking on the rigid circuit, said marking corresponding to the home position of the flexible circuit.
8. Procédé pour la liaison selon l'une quelconque des revendications précédentes, caractérisé en ce que ledit circuit rigide est un circuit imprimé rigide.8. Method for the connection according to any one of the preceding claims, characterized in that said rigid circuit is a rigid printed circuit.
9. Procédé pour la liaison selon la revendication 8, caractérisé en ce que ledit circuit imprimé rigide est un circuit simple face.9. Method for the connection according to claim 8, characterized in that said rigid printed circuit is a single-sided circuit.
10. Procédé pour la liaison selon la revendication 8, caractérisé en ce que ledit circuit imprimé rigide est un circuit double face.10. Method for the connection according to claim 8, characterized in that said rigid printed circuit is a double-sided circuit.
11. Procédé pour la liaison selon la revendication 8, caractérisé en ce que ledit circuit imprimé rigide est un circuit multicouches.11. Method for the connection according to claim 8, characterized in that said rigid printed circuit is a multilayer circuit.
12. Circuit hybride comprenant au moins un composant rigide et un circuit imprimé souple collé sur ledit composant rigide, le composant rigide présentant des pastilles de contact électrique superposées avec des pastilles de contact homologues prévues du circuit imprimé souple, l'empilage collé étant percé au niveau desdites pastilles de contact de sorte à mettre à « nu » les différentes couches et lesdites pastilles de contact du circuit imprimé souple étant reliées électriquement aux dites pastilles de contact du composant rigide par une encre conductrice.A hybrid circuit comprising at least one rigid component and a flexible printed circuit bonded to said rigid component, the rigid component having superposed electrical contact pads with counterpart contact pads provided for the flexible printed circuit, the bonded stack being pierced at level of said contact pads so as to "bare" the different layers and said contact pads of the flexible printed circuit being electrically connected to said contact pads of the rigid component by a conductive ink.
13. Circuit hybride selon la revendication précédente, caractérisé en ce que le composant rigide est constitué par un circuit imprimé rigide.13. Hybrid circuit according to the preceding claim, characterized in that the rigid component is constituted by a rigid printed circuit.
14. Circuit hybride selon la revendication 12, caractérisé en ce que le composant rigide est constitué par un écran à cristaux liquide.14. Hybrid circuit according to claim 12, characterized in that the rigid component is constituted by a liquid crystal screen.
15. Circuit hybride selon la revendication 12, caractérisé en ce que le composant rigide est constitué par un clavier.15. Hybrid circuit according to claim 12, characterized in that the rigid component is constituted by a keyboard.
16. Circuit hybride selon l'une quelconque des revendications 12 à 15, caractérisé en ce qu'il comporte au moins deux composants rigides reliés par un circuit imprimé souple. 16. Hybrid circuit according to any one of claims 12 to 15, characterized in that it comprises at least two rigid components connected by a flexible printed circuit.
EP05775280A 2004-06-02 2005-06-02 Flex-rigid printed circuit by bonding Withdrawn EP1803338A1 (en)

Applications Claiming Priority (2)

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FR0451084A FR2871336B1 (en) 2004-06-02 2004-06-02 FLEX-RIGID PRINTED CIRCUIT BY COLLAGE
PCT/FR2005/001357 WO2006000694A1 (en) 2004-06-02 2005-06-02 Flex-rigid printed circuit by bonding

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