EP1758214A1 - Assembly with a power semiconductor module and a connector - Google Patents

Assembly with a power semiconductor module and a connector Download PDF

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Publication number
EP1758214A1
EP1758214A1 EP06017500A EP06017500A EP1758214A1 EP 1758214 A1 EP1758214 A1 EP 1758214A1 EP 06017500 A EP06017500 A EP 06017500A EP 06017500 A EP06017500 A EP 06017500A EP 1758214 A1 EP1758214 A1 EP 1758214A1
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EP
European Patent Office
Prior art keywords
power semiconductor
connection
semiconductor module
housing
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06017500A
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German (de)
French (fr)
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EP1758214B1 (en
Inventor
Frank Ebersberger
Jürgen Steger
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Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Publication of EP1758214A1 publication Critical patent/EP1758214A1/en
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Publication of EP1758214B1 publication Critical patent/EP1758214B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Definitions

  • the invention describes an arrangement having a power semiconductor module with spring elements designed as contact elements and at least one connection connector for these contact elements.
  • the DE 10 2004 025 609 A1 discloses a power semiconductor module for mounting on a cooling device, with a housing and connection elements for load and auxiliary connections.
  • the load connection elements are in this case formed as metal moldings with a recess for a screw connection.
  • the auxiliary terminals are designed as spring contact elements for pressure contact with a printed circuit board arranged above the power semiconductor module. This printed circuit board preferably forms the entire external supply line, both the load and the auxiliary terminals.
  • Such a configuration is particularly suitable for a large number of auxiliary contacts, for example for the control terminals of the power semiconductor modules arranged in the power semiconductor components, their auxiliary emitter terminals and additional sensor connections.
  • auxiliary contacts for example for the control terminals of the power semiconductor modules arranged in the power semiconductor components, their auxiliary emitter terminals and additional sensor connections.
  • the connection proves to be too expensive by means of circuit board, especially if the external load leads are not formed by the same circuit board.
  • the present invention is based on the object to present an arrangement with a power semiconductor module, wherein external leads can be connected in a simple manner with trained as a spring contact elements connecting elements, preferably auxiliary connection elements.
  • the basic idea of the invention is based on a power semiconductor module having an insulating housing and a cover advantageously integrally connected thereto.
  • the power semiconductor module has power terminals and auxiliary terminals to its external terminal. According to the invention, these are at least partially designed as spring contact elements leading out of the housing.
  • the assembly further includes a terminal connector connected to the housing of the power semiconductor module.
  • the housing has first connection devices and the connection connector has second connection devices.
  • the connection connector is preferably formed as an insulating molded body with at least one at least partially embedded therein metal moldings. This metal molding has at least one contact surface for contacting with the spring contact element of the power semiconductor module and at least one contact element for external connection contacting.
  • connection connector 1 shows a connection connector for the arrangement with a power semiconductor module.
  • FIG. 2 shows an embodiment of a power semiconductor module.
  • FIG 3 shows the arrangement according to the invention with a power semiconductor module and a connection connector.
  • FIG. 1 shows a connection connector (6) for the arrangement with a power semiconductor module (1), wherein FIG. 1a shows the connection connector (6) in a three-dimensional view obliquely from above and FIG. 1b shows the connection connector (6) from below.
  • Shown here is in each case an insulating molded body (60), preferably made of plastic, with a recess (62) for carrying out a fastening screw.
  • the Isolierstoffformmaschine (60) has three as locking lugs (64) formed extensions. These detents (64) are arranged on the side facing the power semiconductor module (1) side of the connection connector (6).
  • connection connector (6) In the Isolierstoffform Sciences (60) injected here are two metal moldings (7), which protrude on the top of the connection connector (6) from the Isolierstoffform Sciences (60) and each form a plug (70). Alternatively, receptacles, solder tails or solder pins are preferred embodiments of these contact elements. It is further preferred if in the arrangement of a plurality of contact elements (70) of a connection connector (6), these contact elements are formed differently. For example, this can be realized by different width plug. Thus, the contact element are designed confusion.
  • the metal moldings (7) each form a contact surface (72) for contacting with a spring contact element (50).
  • the Isolierstoffform manipulate (60) is formed on the underside of the connection connector (6) such that these contact surfaces (72) do not protrude beyond the lower boundary of the connection connector (6), but are preferably set back relative to this limit.
  • the metal moldings (7) are for insulation to each other in Isolierstoffform moments (6) and also far enough away from each other sufficiently.
  • FIG. 2 shows an embodiment of a further developed power semiconductor module (1) according to the invention with a base plate (2) and a plastic housing (3) which encloses power semiconductor components arranged therein.
  • the power semiconductor module has load (4) and auxiliary terminals (5).
  • the load connection elements (4) are designed as metal moldings with a recess for screw connections, while auxiliary connections (5) arranged on the upper side of the power semiconductor module (1) are designed as contact springs (50), in this case as barrel springs.
  • These barrel springs (50) extend through domed recesses (30) for positioning the barrel springs (50) out of the housing (3) to permit external contacting.
  • the housing has four further recesses (36) which serve to secure a printed circuit board arranged above the power semiconductor module (1).
  • the housing (3) has connecting devices for arranging at least one connection connector (6). These connecting devices are arranged adjacent to the auxiliary contact terminals (30) and formed here as further recesses (32, 34). Shown are two variants of the recesses.
  • the first embodiment has a recess (32) with an extension designed as a dome, in which a screw is arranged and fixed therein.
  • the second embodiment is a plurality of recesses (34) which serve as passages for latching lugs (64) and wherein the recesses surrounding areas of the housing (3) act on the inside as a counter to these latching lugs (64).
  • FIG. 3 shows the arrangement according to the invention with a power semiconductor module (1) according to FIG. 2 and a connection connector (6) according to FIG. 1.
  • the latching lugs (64) of the connection connector (6) are in the associated recesses (32) of the housing (3) of the power semiconductor module (1).
  • the secure electrical connection between the barrel springs (50) and the contact surfaces (72) of the connection connector (6) is produced.
  • a plug contact (70) on the power semiconductor module (1) is available through the arrangement according to the invention for the external supply line.
  • connection connector (6) can be connected to the power semiconductor module (1) by means of a screw, not shown. This presented an alternative to the snap-lock connection (34, 64), but can also be combined with this. If a screw connection is the only force-fitting line via the connection connector (6) to the spring contact element (50), the connection connector (6) preferably has at least one pin-like projection, similar to the latching lugs, for the rotationally secure arrangement of the connection connector (6) on the housing (3 ) of the power semiconductor module (1). Also suitable is a pin-like extension of the housing with an associated recess of the connection connector.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

The arrangement includes a power semiconductor module that has a housing (3), and connectors (6) for load connection and auxiliary connections. Spring contact components are arranged projecting from the housing. The housing is also provided with first connecting units for coupling with the connectors, and second connecting units (62,64) and metal molded portion (7) with contact areas for coming in contact with the spring contact components. The metal molded portion also has contact sections (70) for external connection of the power semiconductor module.

Description

Die Erfindung beschreibt eine Anordnung mit einem Leistungshalbleitermodul mit als Federn ausgebildeten Kontaktelementen und mindestens einem Anschlussverbinder für diese Kontaktelemente. Moderne Ausgestaltungen von Leistungshalbleitermodulen mit hoher Leistung bezogen auf ihre Baugröße, wie sie beispielhaft aus der Druckschrift DE 10 2004 025 609 A1 bekannt sind, sind der Ausgangspunkt dieser Erfindung.The invention describes an arrangement having a power semiconductor module with spring elements designed as contact elements and at least one connection connector for these contact elements. Modern embodiments of power semiconductor modules with high performance based on their size, as exemplified in the document DE 10 2004 025 609 A1 are known, are the starting point of this invention.

Die DE 10 2004 025 609 A1 offenbart ein Leistungshalbleitermodul, zur Montage auf einer Kühleinrichtung, mit einem Gehäuse und Verbindungselementen für Last- und Hilfsanschlüsse. Die Lastanschlusselemente sind hierbei ausgebildet als Metallformkörper mit einer Ausnehmung für eine Schraubverbindung. Die Hilfsanschlüsse sind ausgebildet als Federkontaktelemente zur Druckkontaktierung mit einer oberhalb des Leistungshalbleitermoduls angeordneten Leiterplatte. Diese Leiterplatte bildet vorzugsweise die gesamte externe Zuleitung, sowohl der Last- als auch der Hilfsanschlüsse aus.The DE 10 2004 025 609 A1 discloses a power semiconductor module for mounting on a cooling device, with a housing and connection elements for load and auxiliary connections. The load connection elements are in this case formed as metal moldings with a recess for a screw connection. The auxiliary terminals are designed as spring contact elements for pressure contact with a printed circuit board arranged above the power semiconductor module. This printed circuit board preferably forms the entire external supply line, both the load and the auxiliary terminals.

Eine derartige Ausgestaltung ist besonders geeignet für eine Vielzahl von Hilfskontakten, beispielhaft für die Steueranschlüsse der im Leistungshalbleitermodul angeordneten Leistungshalbleiterbauelemente, deren Hilfsemitteranschlüsse und zusätzliche Sensoranschlüsse. Bei einer geringen Anzahl von Hilfskontakten wie beispielhaft bei einem halbgesteuerten Gleichrichtermodul bestehend aus einer Reihenschaltung einer Diode und einem Thyristor erweist sich die Verbindung mittels Leiterplatte als zu aufwendig, speziell, wenn die externen Lastzuleitungen nicht mittels der gleichen Leiterplatte ausgebildet sind.Such a configuration is particularly suitable for a large number of auxiliary contacts, for example for the control terminals of the power semiconductor modules arranged in the power semiconductor components, their auxiliary emitter terminals and additional sensor connections. With a small number of auxiliary contacts as an example in a semi-controlled rectifier module consisting of a series connection of a diode and a thyristor, the connection proves to be too expensive by means of circuit board, especially if the external load leads are not formed by the same circuit board.

Weiterhin sind beispielhaft aus der DE 101 00 460 Leistungshalbleitermodule bekannt, die eine geringe Anzahl von Hilfskontaktelementen aufweisen und wobei diese als Steckverbinder ausgebildet. Nachteilig an dieser seit langem bekannten Ausbildung eines Leistungshalbleitermoduls ist, dass dieses keine flexible Ausgestaltung der externen Zuleitungen gestattet. Die Flexibilität der oben genannten Ausgestaltung eines Leistungshalbleitermoduls ist hier nicht gegeben.Furthermore, by way of example from the DE 101 00 460 Power semiconductor modules are known which have a small number of auxiliary contact elements and wherein these are designed as plug connectors. A disadvantage of this long-known design of a power semiconductor module is that this does not allow flexible design of the external leads. The flexibility of the above-mentioned embodiment of a power semiconductor module is not given here.

Der vorliegenden Erfindung liegt die Aufgabe zu Grunde eine Anordnung mit einem Leistungshalbleitermodul vorzustellen, wobei externe Zuleitungen in einfacher weise mit als Federkontaktelemente ausgebildeten Anschlusselementen, vorzugsweise Hilfsanschlusselementen, verbunden werden können.The present invention is based on the object to present an arrangement with a power semiconductor module, wherein external leads can be connected in a simple manner with trained as a spring contact elements connecting elements, preferably auxiliary connection elements.

Diese Aufgabe wird gelöst durch eine Anordnung nach dem Anspruch 1, spezielle Ausgestaltungen finden sich in den Unteransprüchen. Der Grundgedanke der Erfindung geht aus von einem Leistungshalbleitermodul mit einem isolierenden Gehäuse und einem vorteilhafterweise einstückig damit verbundenen Deckel. Das Leistungshalbleitermodul weist zu seinem externen Anschluss Leistungsanschlüsse und Hilfsanschlüsse auf. Erfindungsgemäß sind diese zumindest teilweise als aus dem Gehäuse herausführende Federkontaktelemente ausgebildet. Die Anordnung weist weiterhin einen Anschlussverbinder, der mit dem Gehäuse des Leistungshalbleitermoduls verbunden ist, auf. Hierzu weist das Gehäuse erste Verbindungseinrichtungen und der Anschlussverbinder zweite Verbindungseinrichtungen auf.
Der Anschlussverbinder ist vorzugsweise ausgebildet als ein Isolierstoffformkörper mit mindestens einen zumindest teilweise darin eingebetteten Metallformkörper. Dieser Metallformkörper weist mindestens eine Kontaktfläche zur Kontaktierung mit dem Federkontaktelement des Leistungshalbleitermoduls und mindestens einem Kontaktelement zur externen Anschlusskontaktierung auf.This object is achieved by an arrangement according to claim 1, special embodiments can be found in the subclaims. The basic idea of the invention is based on a power semiconductor module having an insulating housing and a cover advantageously integrally connected thereto. The power semiconductor module has power terminals and auxiliary terminals to its external terminal. According to the invention, these are at least partially designed as spring contact elements leading out of the housing. The assembly further includes a terminal connector connected to the housing of the power semiconductor module. For this purpose, the housing has first connection devices and the connection connector has second connection devices.
The connection connector is preferably formed as an insulating molded body with at least one at least partially embedded therein metal moldings. This metal molding has at least one contact surface for contacting with the spring contact element of the power semiconductor module and at least one contact element for external connection contacting.

Die Erfindung wird anhand von Ausführungsbeispielen in Verbindung mit den Fig. 1 bis 3 näher erläutert.The invention will be explained in more detail with reference to embodiments in conjunction with FIGS. 1 to 3.

Fig. 1 zeigt einen Anschlussverbinder für die Anordnung mit einem Leistungshalbleitermodul.1 shows a connection connector for the arrangement with a power semiconductor module.

Fig. 2 zeigt eine Ausgestaltung eines Leistungshalbleitermoduls.2 shows an embodiment of a power semiconductor module.

Fig. 3 zeigt die erfindungsgemäße Anordnung mit einem Leistungshalbleitermodul und einem Anschlussverbinder.3 shows the arrangement according to the invention with a power semiconductor module and a connection connector.

Fig. 1 zeigt einen Anschlussverbinder (6) für die Anordnung mit einem Leistungshalbleitermodul (1), wobei Fig. 1a den Anschlussverbinder (6) in einer dreidimensionalen Darstellung von schräg oben und Fig. 1b den Anschlussverbinder (6) von untern zeigt. Dargestellt ist hier jeweils ein Isolierstoffformkörper (60), vorzugsweise aus Kunststoff, mit einer Ausnehmung (62) zur Durchführung einer Befestigungsschraube. Weiterhin weist der Isolierstoffformkörper (60) drei als Rastnasen (64) ausgebildete Fortsätze auf. Diese Rastnasen (64) sind auf der dem Leistungshalbleitermodul (1) zugewandten Seite des Anschlussverbinders (6) angeordnet.1 shows a connection connector (6) for the arrangement with a power semiconductor module (1), wherein FIG. 1a shows the connection connector (6) in a three-dimensional view obliquely from above and FIG. 1b shows the connection connector (6) from below. Shown here is in each case an insulating molded body (60), preferably made of plastic, with a recess (62) for carrying out a fastening screw. Furthermore, the Isolierstoffformkörper (60) has three as locking lugs (64) formed extensions. These detents (64) are arranged on the side facing the power semiconductor module (1) side of the connection connector (6).

In den Isolierstoffformkörper (60) eingespritzt sind hier zwei Metallformkörper (7), die auf der Oberseite des Anschlussverbinders (6) aus dem Isolierstoffformkörper (60) herausragen und jeweils einen Stecker (70) bilden. Alternativ sind auch Steckhülsen, Lötfahnen oder Lötstifte bevorzugte Ausführungsformen dieser Kontaktelemente. Es ist weiterhin bevorzugt, wenn bei der Anordnung einer Mehrzahl von Kontaktelementen (70) eines Anschlussverbinders (6) diese Kontaktelemente unterschiedlich ausgebildet sind. Beispielhaft kann dies durch verschieden breite Stecker realisiert werden. Somit sind die Kontaktelement verwechslungssicher ausgebildet.In the Isolierstoffformkörper (60) injected here are two metal moldings (7), which protrude on the top of the connection connector (6) from the Isolierstoffformkörper (60) and each form a plug (70). Alternatively, receptacles, solder tails or solder pins are preferred embodiments of these contact elements. It is further preferred if in the arrangement of a plurality of contact elements (70) of a connection connector (6), these contact elements are formed differently. For example, this can be realized by different width plug. Thus, the contact element are designed confusion.

Auf der Unterseite des Anschlussverbinders (6) bilden die Metallformkörper (7) je eine Kontaktfläche (72) zur Kontaktierung mit einem Federkontaktelement (50) aus. Der Isolierstoffformkörper (60) ist auf der Unterseite des Anschlussverbinders (6) derart ausgebildete, dass diese Kontaktflächen (72) nicht über die untere Begrenzung des Anschlussverbinder (6) herausragen, sondern vorzugsweise gegenüber dieser Begrenzung zurückversetzt sind. Die Metallformkörper (7) sind zur Isolation zueinander im Isolierstoffformkörper (6) und auch darüber hinausreichend ausreichend voneinander beabstandet.On the underside of the connection connector (6), the metal moldings (7) each form a contact surface (72) for contacting with a spring contact element (50). The Isolierstoffformkörper (60) is formed on the underside of the connection connector (6) such that these contact surfaces (72) do not protrude beyond the lower boundary of the connection connector (6), but are preferably set back relative to this limit. The metal moldings (7) are for insulation to each other in Isolierstoffformkörper (6) and also far enough away from each other sufficiently.

Fig. 2 zeigt eine Ausgestaltung eines erfindungsgemäß weitergebildeten Leistungshalbleitermoduls (1) mit einer Grundplatte (2) und einem Kunststoffgehäuse (3) welches darin angeordnete Leistungshalbleiterbauelemente umschließt. Zur externen elektrischen Verbindung weist das Leistungshalbleitermodul Last- (4) und Hilfsanschlüsse (5) auf. Die Lastanschlusselemente (4) sind als Metallformkörper mit einer Ausnehmung für Schraubanschlüsse ausgebildet, während auf der Oberseite des Leistungshalbleitermoduls (1) angeordneten Hilfsanschlüsse (5) als Kontaktfedern (50), hier als Tonnenfedern, ausgebildet sind. Diese Tonnenfedern (50) reichen durch mit Domen versehenen Ausnehmungen (30) zur Positionierung der Tonnenfedern (50) aus dem Gehäuse (3) heraus um eine externe Kontaktierung zu erlauben. Dem Stand der Technik entsprechend weist das Gehäuse vier weitere Ausnehmungen (36) auf, die der Befestigung einer oberhalb des Leistungshalbleitermoduls (1) angeordneten Leiterplatte dienen.FIG. 2 shows an embodiment of a further developed power semiconductor module (1) according to the invention with a base plate (2) and a plastic housing (3) which encloses power semiconductor components arranged therein. For external electrical connection, the power semiconductor module has load (4) and auxiliary terminals (5). The load connection elements (4) are designed as metal moldings with a recess for screw connections, while auxiliary connections (5) arranged on the upper side of the power semiconductor module (1) are designed as contact springs (50), in this case as barrel springs. These barrel springs (50) extend through domed recesses (30) for positioning the barrel springs (50) out of the housing (3) to permit external contacting. According to the state of the art, the housing has four further recesses (36) which serve to secure a printed circuit board arranged above the power semiconductor module (1).

Erfindungsgemäß weist das Gehäuse (3) Verbindungseinrichtungen zur Anordnung mindestens eines Anschlussverbinders (6) auf. Diese Verbindungseinrichtungen sind benachbart zu den Hilfskontaktanschlüssen (30) angeordnet und hier als weitere Ausnehmungen (32, 34) ausgebildet. Dargestellt sind zwei Varianten der Ausnehmungen. Die erste Ausgestaltung weist eine Ausnehmung (32) mit einem als Dome gestalteten Fortsatz auf, in den eine Schraube angeordnet und darin fixiert wird. Die zweite Ausgestaltung ist eine Mehrzahl von Ausnehmungen (34) die als Durchführungen für Rastnasen (64) dienen und wobei der die Ausnehmungen umgebende Bereiche des Gehäuses (3) auf dessen Innenseite als Widerlage für diese Rastnasen (64) wirken.According to the invention, the housing (3) has connecting devices for arranging at least one connection connector (6). These connecting devices are arranged adjacent to the auxiliary contact terminals (30) and formed here as further recesses (32, 34). Shown are two variants of the recesses. The first embodiment has a recess (32) with an extension designed as a dome, in which a screw is arranged and fixed therein. The second embodiment is a plurality of recesses (34) which serve as passages for latching lugs (64) and wherein the recesses surrounding areas of the housing (3) act on the inside as a counter to these latching lugs (64).

Fig. 3 zeigt die erfindungsgemäße Anordnung mit einem Leistungshalbleitermodul (1) gemäß Fig. 2 und einem Anschlussverbinder (6) gemäß Fig. 1 dar. Hierbei sind die Rastnasen (64) des Anschlussverbinders (6) in den zugeordneten Ausnehmungen (32) des Gehäuses (3) des Leistungshalbleitermoduls (1) angeordnet. Hierdurch wird die sichere elektrische Verbindung zwischen den Tonnenfedern (50) und den Kontaktflächen (72) des Anschlussverbinders (6) hergestellt. Nun steht durch die erfindungsgemäße Anordnung für die externe Zuleitung ein Steckkontakt (70) am Leistungshalbleitermodul (1) zur Verfügung.FIG. 3 shows the arrangement according to the invention with a power semiconductor module (1) according to FIG. 2 and a connection connector (6) according to FIG. 1. Here, the latching lugs (64) of the connection connector (6) are in the associated recesses (32) of the housing (3) of the power semiconductor module (1). As a result, the secure electrical connection between the barrel springs (50) and the contact surfaces (72) of the connection connector (6) is produced. Now, a plug contact (70) on the power semiconductor module (1) is available through the arrangement according to the invention for the external supply line.

Weiterhin kann mittels einer nicht dargestellten Schraube der Anschlussverbinder (6) mit dem Leistungshalbleitermodul (1) verbunden werden. Dies stellte eine Alternative zur Schnapp- Rast- Verbindung (34, 64) dar, kann allerdings auch mit dieser kombiniert werden. Falls eine Schraubverbindung die einzige Kraftreinleitung über den Anschlussverbinder (6) auf das Federkontaktelement (50) ist, weist der Anschlussverbinder (6) vorzugsweise mindestens einen stiftartigen Fortsatz, ähnlich den Rastnasen, auf zur verdrehsicheren Anordnung des Anschlussverbinders (6) auf dem Gehäuse (3) des Leistungshalbleitermodul (1). Ebenso geeignet ist ein stiftartiger Fortsatz des Gehäuses mit einer zugeordneten Ausnehmung des Anschlussverbinders.Furthermore, the connection connector (6) can be connected to the power semiconductor module (1) by means of a screw, not shown. This presented an alternative to the snap-lock connection (34, 64), but can also be combined with this. If a screw connection is the only force-fitting line via the connection connector (6) to the spring contact element (50), the connection connector (6) preferably has at least one pin-like projection, similar to the latching lugs, for the rotationally secure arrangement of the connection connector (6) on the housing (3 ) of the power semiconductor module (1). Also suitable is a pin-like extension of the housing with an associated recess of the connection connector.

Claims (7)

Anordnung mit einem Federkontaktelemente aufweisenden Leistungshalbleitermodul (1) und mit einem Anschlussverbinder (6), wobei das Leistungshalbleitermodul (1) ein Gehäuse (3) sowie Anschlusselemente für Last- (4) und Hilfsanschlüsse (5) aufweist, wobei diese zumindest teilweise als aus dem Gehäuse (3) herausführende Federkontaktelemente (5) ausgebildet sind, und das Gehäuse (3) erste Verbindungseinrichtungen (32, 34) zur Verbindung mit dem Anschlussverbinder (6) aufweist, wobei dieser zweite Verbindungseinrichtungen (62, 64) zur Verbindung mit dem Gehäuse (3) des Leistungshalbleitermoduls (1) aufweist, sowie mindestens einen Metallformkörper (7) mit mindestens einer Kontaktflächen (72) zur Kontaktierung mit einem Federkontaktelement (5) des Leistungshalbleitermodul (1) und mit mindestens einem Kontaktelement (70) zur externen Anschlusskontaktierung.Arrangement with a spring contact element having power semiconductor module (1) and with a connection connector (6), wherein the power semiconductor module (1) has a housing (3) and connection elements for load (4) and auxiliary terminals (5), which at least partially as from the Housing (3) leading out spring contact elements (5) are formed, and the housing (3) first connecting means (32, 34) for connection to the connection connector (6), said second connecting means (62, 64) for connection to the housing ( 3) of the power semiconductor module (1), and at least one metal molded body (7) having at least one contact surfaces (72) for contacting with a spring contact element (5) of the power semiconductor module (1) and at least one contact element (70) for external connection contact. Anordnung nach Anspruch 1,
wobei die Verbindungseinrichtungen (34, 64) des Leistungshalbleitermoduls (1) und des Anschlussverbinders (6) gemeinsam mindestens eine Schnapp- RastVerbindung bilden, wobei Ausnehmungen (34) im Gehäuse (3) des Leistungshalbleitermoduls (1), die Widerlager der Rastnasen (64) des Anschlussverbinders (6) bilden.Arrangement according to claim 1,
wherein the connecting means (34, 64) of the power semiconductor module (1) and the connection connector (6) together form at least one snap-locking connection, wherein recesses (34) in the housing (3) of the power semiconductor module (1), the abutment of the latching noses (64) form the connection connector (6). Anordnung nach Anspruch 1,
wobei die Verbindungseinrichtung (32, 62) zwischen dem Leistungshalbleitermodul (1) und dem Anschlussverbinder (6) mindestens eine Schraubverbindung ist, wobei das Gehäuse (3) des Leistungshalbleitermoduls (1) wie auch der Anschlussverbinder (6) je eine Ausnehmung (32, 62) aufweisen und eine Schraube durch die Ausnehmung (62) des Anschlussverbinders (6) hindurchreicht und diese Schraube in der Ausnehmung (32) des Gehäuses (3) fixiert ist.Arrangement according to claim 1,
wherein the connection device (32, 62) between the power semiconductor module (1) and the connection connector (6) is at least one screw connection, the housing (3) of the power semiconductor module (1) as well as the connection connector (6) each having a recess (32, 62 ) and a screw extends through the recess (62) of the connection connector (6) and this screw is fixed in the recess (32) of the housing (3). Anordnung nach Anspruch 1,
wobei der Anschlussverbinder (6) ausgebildet ist als ein Isolierstoffformkörper (60) mit mindestens einem eingespritzten Metallformkörper (7).Arrangement according to claim 1,
wherein the terminal connector (6) is formed as an insulating molded body (60) with at least one injected metal shaped body (7). Anordnung nach Anspruch 1,
wobei das mindestens eine Kontaktelement (70) zur externen Anschlusskontaktierung als Stecker oder Steckhülse ausgebildet ist.Arrangement according to claim 1,
wherein the at least one contact element (70) is designed for external connection contact as a plug or socket. Anordnung nach Anspruch 5,
wobei bei einer Mehrzahl von Kontaktelementen (70) diese verwechslungssicher ausgebildet sind.Arrangement according to claim 5,
wherein in a plurality of contact elements (70), these are designed to be confused. Anordnung nach Anspruch 1,
wobei das mindestens eine Kontaktelement (70) zur externen Anschlusskontaktierung als Lötfahnen oder Lötstifte ausgebildet ist.Arrangement according to claim 1,
wherein the at least one contact element (70) is designed for external connection contacting as Lötfahnen or solder pins.
EP06017500A 2005-08-24 2006-08-23 Assembly with a power semiconductor module and a connector Not-in-force EP1758214B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005039946A DE102005039946A1 (en) 2005-08-24 2005-08-24 Arrangement with power semiconductor module and with connection connector

Publications (2)

Publication Number Publication Date
EP1758214A1 true EP1758214A1 (en) 2007-02-28
EP1758214B1 EP1758214B1 (en) 2007-12-19

Family

ID=37517179

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06017500A Not-in-force EP1758214B1 (en) 2005-08-24 2006-08-23 Assembly with a power semiconductor module and a connector

Country Status (7)

Country Link
EP (1) EP1758214B1 (en)
JP (1) JP4834486B2 (en)
CN (1) CN1921110B (en)
AT (1) ATE381798T1 (en)
DE (2) DE102005039946A1 (en)
DK (1) DK1758214T3 (en)
ES (1) ES2299127T3 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058694B4 (en) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with contact springs
DE102008012570B4 (en) * 2008-03-04 2014-02-13 Infineon Technologies Ag Power semiconductor module system, power semiconductor module assembly, and method of making a power semiconductor module assembly
DE102008034467B4 (en) * 2008-07-24 2014-04-03 Semikron Elektronik Gmbh & Co. Kg Arrangement with a power semiconductor module and with a connection device
DE102013113143B4 (en) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Power semiconductor device

Citations (4)

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FR2763182A3 (en) * 1997-05-09 1998-11-13 Formosa Electronic Ind Inc Power supply for portable electrical and electronic equipment
US20020055288A1 (en) * 2000-11-06 2002-05-09 Philips Robert P. Universal adapter with interchangeable plugs
DE10100460A1 (en) 2001-01-08 2002-07-18 Semikron Elektronik Gmbh Power semiconductor module with housing and connections aligns connecting elements parallel to base plate
DE102004025609A1 (en) 2004-05-25 2005-12-22 Semikron Elektronik Gmbh & Co. Kg Arrangement in screw-type pressure contact with a power semiconductor module

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JPH02150771A (en) * 1988-12-01 1990-06-11 Nec Corp Speed measuring instrument
JP3201187B2 (en) * 1994-12-08 2001-08-20 富士電機株式会社 Semiconductor device
JPH08255643A (en) * 1995-01-18 1996-10-01 Furukawa Electric Co Ltd:The Connector for printed board
CN2315700Y (en) * 1997-06-04 1999-04-21 吴祖榆 AC/DC two purpose power supply device capable of changing power plug
JP3644406B2 (en) * 2001-05-08 2005-04-27 株式会社デンソー Pointer instrument and its rotating inner unit
EP1291914A1 (en) * 2001-09-10 2003-03-12 ABB Schweiz AG Pressure-contactable power semiconductor module

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Publication number Priority date Publication date Assignee Title
FR2763182A3 (en) * 1997-05-09 1998-11-13 Formosa Electronic Ind Inc Power supply for portable electrical and electronic equipment
US20020055288A1 (en) * 2000-11-06 2002-05-09 Philips Robert P. Universal adapter with interchangeable plugs
DE10100460A1 (en) 2001-01-08 2002-07-18 Semikron Elektronik Gmbh Power semiconductor module with housing and connections aligns connecting elements parallel to base plate
DE102004025609A1 (en) 2004-05-25 2005-12-22 Semikron Elektronik Gmbh & Co. Kg Arrangement in screw-type pressure contact with a power semiconductor module

Also Published As

Publication number Publication date
DE502006000232D1 (en) 2008-01-31
JP4834486B2 (en) 2011-12-14
ATE381798T1 (en) 2008-01-15
DE102005039946A1 (en) 2007-03-01
CN1921110A (en) 2007-02-28
DK1758214T3 (en) 2008-04-07
EP1758214B1 (en) 2007-12-19
CN1921110B (en) 2010-12-01
JP2007059393A (en) 2007-03-08
ES2299127T3 (en) 2008-05-16

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