EP1756881A4 - Thermoelektrische dünnfilmbauelemente für die stromwandlung und kühlung - Google Patents

Thermoelektrische dünnfilmbauelemente für die stromwandlung und kühlung

Info

Publication number
EP1756881A4
EP1756881A4 EP04821305A EP04821305A EP1756881A4 EP 1756881 A4 EP1756881 A4 EP 1756881A4 EP 04821305 A EP04821305 A EP 04821305A EP 04821305 A EP04821305 A EP 04821305A EP 1756881 A4 EP1756881 A4 EP 1756881A4
Authority
EP
European Patent Office
Prior art keywords
cooling
thin film
power conversion
thermoelectric devices
film thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04821305A
Other languages
English (en)
French (fr)
Other versions
EP1756881A2 (de
Inventor
Rama Venkatasubramanian
Brooks O'quinn
Edward Siivola
Kip Coonley
Pratima Addepalli
Randy Alley
John Posthill
Thomas Colpitts
Anil Reddy
Chris Caylor
Peter Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Nextreme Thermal Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextreme Thermal Solutions Inc filed Critical Nextreme Thermal Solutions Inc
Publication of EP1756881A2 publication Critical patent/EP1756881A2/de
Publication of EP1756881A4 publication Critical patent/EP1756881A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP04821305A 2003-12-11 2004-12-13 Thermoelektrische dünnfilmbauelemente für die stromwandlung und kühlung Withdrawn EP1756881A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52847903P 2003-12-11 2003-12-11
PCT/US2004/041431 WO2005074463A2 (en) 2003-12-11 2004-12-13 Thin film thermoelectric devices for power conversion and cooling

Publications (2)

Publication Number Publication Date
EP1756881A2 EP1756881A2 (de) 2007-02-28
EP1756881A4 true EP1756881A4 (de) 2011-03-09

Family

ID=34837339

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04821305A Withdrawn EP1756881A4 (de) 2003-12-11 2004-12-13 Thermoelektrische dünnfilmbauelemente für die stromwandlung und kühlung

Country Status (3)

Country Link
EP (1) EP1756881A4 (de)
JP (1) JP2007535803A (de)
WO (1) WO2005074463A2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1579512A4 (de) 2002-11-25 2008-11-19 Nextreme Thermal Solutions Transthermoelektrisches bauelement
US8455751B2 (en) 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7851691B2 (en) 2003-12-02 2010-12-14 Battelle Memorial Institute Thermoelectric devices and applications for the same
US9281461B2 (en) 2003-12-02 2016-03-08 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7834263B2 (en) 2003-12-02 2010-11-16 Battelle Memorial Institute Thermoelectric power source utilizing ambient energy harvesting for remote sensing and transmitting
US7523617B2 (en) * 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
WO2006113607A2 (en) * 2005-04-18 2006-10-26 Nextreme Thermal Solutions Thermoelectric generators for solar conversion and related systems and methods
US8039727B2 (en) * 2006-04-26 2011-10-18 Cardiac Pacemakers, Inc. Method and apparatus for shunt for in vivo thermoelectric power system
US8003879B2 (en) 2006-04-26 2011-08-23 Cardiac Pacemakers, Inc. Method and apparatus for in vivo thermoelectric power system
US8538529B2 (en) 2006-04-26 2013-09-17 Cardiac Pacemakers, Inc. Power converter for use with implantable thermoelectric generator
WO2008063474A2 (en) * 2006-11-13 2008-05-29 Massachusetts Institute Of Technology Solar thermoelectric conversion
CN100427631C (zh) * 2006-11-24 2008-10-22 清华大学 纳米SiC颗粒复合CoSb3基热电材料及其制备方法
US8267984B2 (en) 2007-08-03 2012-09-18 Scion Neurostim, Llc. Neurophysiological activation by vestibular or cranial nerve stimulation
US8696724B2 (en) 2007-01-11 2014-04-15 Scion Neurostim, Llc. Devices for vestibular or cranial nerve stimulation
US8267983B2 (en) 2007-01-11 2012-09-18 Scion Neurostim, Llc. Medical devices incorporating thermoelectric transducer and controller
US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
US8603152B2 (en) 2009-12-18 2013-12-10 Scion Neurostim, Llc Devices and methods for vestibular and/or cranial nerve stimulation
DE102010004200A1 (de) * 2010-01-08 2011-07-14 Emitec Gesellschaft für Emissionstechnologie mbH, 53797 Vorrichtung zur Erzeugung elektrischer Energie aus einem wärmeleitenden Material
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
AU2011343564B2 (en) 2010-12-16 2016-09-29 Scion NeuroStim, Inc. Systems, devices and methods for bilateral caloric vestibular stimulation
US10512564B2 (en) 2010-12-16 2019-12-24 Scion Neurostim, Llc Combination treatments
US9744074B2 (en) 2010-12-16 2017-08-29 Scion Neurostim, Llc Combination treatments
US10537467B2 (en) 2010-12-16 2020-01-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
CN104576913A (zh) * 2014-12-29 2015-04-29 华中科技大学 一种半导体温差发电片
JP7438685B2 (ja) 2019-07-30 2024-02-27 株式会社Kelk 熱電モジュール及び熱電モジュールの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB989370A (en) * 1961-07-11 1965-04-14 Philips Electronic Associated Improvements in or relating to semiconductor devices
US4640977A (en) * 1984-04-23 1987-02-03 Omnimax Energy Corporation Thermoelectric generator using variable geometry with support pedestals of dissimilar materials than the basic thermoelectric semi-conductor elements
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
US5237821A (en) * 1987-08-20 1993-08-24 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
JPH08316532A (ja) * 1995-05-19 1996-11-29 Hitachi Chem Co Ltd 冷却ユニット構造
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
US20020062648A1 (en) * 2000-11-30 2002-05-30 Ghoshal Uttam Shyamalindu Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119463A (en) * 1998-05-12 2000-09-19 Amerigon Thermoelectric heat exchanger
US7342169B2 (en) * 2001-10-05 2008-03-11 Nextreme Thermal Solutions Phonon-blocking, electron-transmitting low-dimensional structures
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB989370A (en) * 1961-07-11 1965-04-14 Philips Electronic Associated Improvements in or relating to semiconductor devices
US4640977A (en) * 1984-04-23 1987-02-03 Omnimax Energy Corporation Thermoelectric generator using variable geometry with support pedestals of dissimilar materials than the basic thermoelectric semi-conductor elements
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
US5237821A (en) * 1987-08-20 1993-08-24 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
JPH08316532A (ja) * 1995-05-19 1996-11-29 Hitachi Chem Co Ltd 冷却ユニット構造
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
US20020062648A1 (en) * 2000-11-30 2002-05-30 Ghoshal Uttam Shyamalindu Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

Also Published As

Publication number Publication date
WO2005074463A3 (en) 2009-04-02
JP2007535803A (ja) 2007-12-06
WO2005074463A2 (en) 2005-08-18
EP1756881A2 (de) 2007-02-28

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