EP1731008B1 - Method and revolver-like equipping head for equipping substrates with electrical components - Google Patents
Method and revolver-like equipping head for equipping substrates with electrical components Download PDFInfo
- Publication number
- EP1731008B1 EP1731008B1 EP05716850A EP05716850A EP1731008B1 EP 1731008 B1 EP1731008 B1 EP 1731008B1 EP 05716850 A EP05716850 A EP 05716850A EP 05716850 A EP05716850 A EP 05716850A EP 1731008 B1 EP1731008 B1 EP 1731008B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- components
- substrate
- equipping
- head
- rotor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 11
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
Definitions
- the invention relates to a method and a placement head for equipping substrates with electrical components by means of a placement device comprising a chassis and a parallel to the substrate movable turret-like placement head with a stepwise rotatable rotor with rotatably arranged gripper units with rotatable spindles for holding the Components is provided, wherein the placement head has at least one rotary drive for the spindles and wherein the peripherally provided components are each sucked in a lifting position to the spindles and placed on the substrate.
- Such a method is for example by the WO 2001047334 A become known, after which the components of feeders fetched components approximately pre-rotated in its touchdown position, optically measured at a scanning station and rotated at an in the direction of rotation of the rotor subsequently arranged turning station in their exact placement.
- By measuring the components is also possible to compensate for the orthogonal positional deviations by correcting the corresponding placement coordinates.
- the moving with the placement scanning station has space and weight reasons, a limited field of view, so that large components can not be detected.
- the contact surface of very thick components outside the scanning plane so that even such components can not be equipped. Bulky components do not fit into the component orbit of the placement anyway.
- Such components are typically handled, for example, by a placement head with a fixed gripper unit and a stationary scanning device anchored to the chassis measured, which is arranged between the feeders and the substrate.
- the duration of a placement cycle is correspondingly large.
- the stationary scanner is not subject to weight and space limitations. It is therefore also suitable for components that require increased positioning accuracy.
- the invention has for its object to increase the spectrum of equippable with the turret-type placement head components to make a second placement unnecessary.
- one of the components can optically measured on the scanning and without further rotor rotation are placed on the substrate.
- the placement head is equipped with a rotary drive for the spindle located in the placement position.
- a higher positioning accuracy can be achieved, which may be required for some types of components.
- This approach is also indicated for oversized components that are too bulky for the orbit in the placement head. It is understood that in this case the last free gripper unit picks up such a component from the corresponding feeder, measures over the scanning device and without any rotor rotation touches the substrate, whereupon the smaller components can be placed on the substrate.
- a plurality of the sucked components are measured in immediate succession to the scanning device and placed on the substrate.
- the components that can be passed through the orbit in the placement, but which are too large for the head-own scanning station can be added in groups of adjacent gripper units. This makes it possible to measure these components in an uninterrupted sequence and set up on the substrate. The remaining smaller components are then also meaningfully added in a contiguous sequence of adjacent gripper units, measured in the placement head according to claim 4 and placed in an uninterrupted sequence on the substrate.
- a device for positioning a component receiving unit of a placement machine for printed circuit boards, wherein an incremental encoder arrangement is provided for individual rotational positioning of a suction pipette about its own axis, is off DE 101 00 619 A known.
- the placement head 1 has a stator 2 and a rotor 3, which is rotatable by means of a motor 4 in fixed angular increments.
- the rotor is provided with star-shaped around its axis of rotation circumferentially arranged gripper units 5, which can be gradually rotated to a lower lifting station 6 or to a diametrically opposite, attached to the stator 2 upper optical scanning 7, wherein the lifting station 6 a lifting position of the radially oriented gripper units 5 defined.
- the placement head 1 is located here above a feeding device 8 for electrical components 9 in a peripheral region of the placement device.
- the lower gripper unit 5 is directly above a smaller component to be picked up 9 and was pushed by the lifting station 6 in a vertical coordinate direction z down so far that they detect the device 9 by suction and could already lift out partially from the feeder 8.
- two preceding gripper units 5 are already occupied by the components 9.
- Larger components 10 are provided in adjacent feeders 8.
- the components 9 of smaller design can be easily measured at the scanning station 7.
- the gripper unit 5 has a spindle 13 and a rotary drive 14 for defined rotation of the spindle 13 about its longitudinal axis, wherein the outer end face of the spindle 13 is provided with a suction opening, not shown, for the components 9 and 10
- the larger components 10 can still be transported through the placement head through, but they are too thick or too long for the scanning station 7. Between two of the larger components 10 each one of the gripper units of components remains free to avoid mutual collision.
- the smaller components 9, which are received in immediate succession, can already be measured synchronously with the removal of the larger components 10 at the scanning station 7.
- FIG. 4 shows the placement head 1 at the end of the component recording.
- an oversized component 10 can be included here, which no longer fits through the placement head 1.
- the placement head 1 after FIG. 5 via a stationary optical scanning device 11, which is anchored to a chassis 12 of the placement device.
- the rotor 3 has not been further rotated, so that now this device can be measured by the first scanning device 11.
- the gripper unit 5 associated rotary drive 14 it is possible to turn the occupied with the oversized component 10 spindle 13 so far that the device 10 is rotated in the required placement position and immediately on a substrate 15 (Fig. FIG. 7 ) can be placed.
- the dash-dotted lines indicated less large component 10 does not need to be placed immediately on the circuit board, but may initially remain on his gripper unit 5.
- FIG. 6 To FIG. 6 is the placement after placing the oversized component 10 on the substrate 15 (FIG. FIG. 7 ) returned to the scanning device 11 to measure the reverse of the rotor 3 successively the remaining of the large components 10, which can then be rotated by means of the individual rotary actuators 14 in its attachment position.
- FIGS. 7 and 8 can first be the larger components 10 then the smaller building elements 9 are placed on a substrate 15 in immediate succession with which the placement cycle is completed.
- the cycle in a different order.
- the large components 10 can already be measured before the oversized component 10 is picked up be so that the substrate 15 can be fitted in one revolution of the rotor 3 without interruption. Due to the possibility of forward and backward rotation of the rotor 3, depending on the type and number of components 9, 10 a different time-optimized mode can be selected.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Specific Conveyance Elements (AREA)
Description
Die Erfindung bezieht sich auf ein Verfahren und einen Bestückkopf zum Bestücken von Substraten mit elektrischen Bauelementen mittels einer Bestückvorrichtung, die ein Chassis und einen parallel zum Substrat verschiebbaren revolverartigen Bestückkopf mit einem schrittweise drehbaren Rotor aufweist, der mit umlaufend angeordneten Greifereinheiten mit drehbaren Spindeln zum Halten der Bauelemente versehen ist, wobei der Bestückkopf zumindest einen Drehantrieb für die Spindeln aufweist und wobei die peripher bereitgestellten Bauelemente jeweils in einer Hubposition an die Spindeln angesaugt und auf das Substrat aufgesetzt werden.The invention relates to a method and a placement head for equipping substrates with electrical components by means of a placement device comprising a chassis and a parallel to the substrate movable turret-like placement head with a stepwise rotatable rotor with rotatably arranged gripper units with rotatable spindles for holding the Components is provided, wherein the placement head has at least one rotary drive for the spindles and wherein the peripherally provided components are each sucked in a lifting position to the spindles and placed on the substrate.
Ein derartiges Verfahren ist z.B. durch die
Solche Bauelemente werden üblicherweise z.B. durch einen Bestückkopf mit einer feststehenden Greifereinheit gehandhabt und an einer am Chassis verankerten stationären Abtastvorrichtung vermessen, die zwischen den Zuführeinrichtungen und dem Substrat angeordnet ist. Die Dauer eines Bestückzyklus ist entsprechend groß. Die stationäre Abtasteinrichtung unterliegt keinen Gewichts- und Raumbeschränkungen. Sie eignet sich daher auch für Bauelemente, die eine erhöhte Positioniergenauigkeit erfordern.Such components are typically handled, for example, by a placement head with a fixed gripper unit and a stationary scanning device anchored to the chassis measured, which is arranged between the feeders and the substrate. The duration of a placement cycle is correspondingly large. The stationary scanner is not subject to weight and space limitations. It is therefore also suitable for components that require increased positioning accuracy.
Der Erfindung liegt die Aufgabe zugrunde, das Spektrum der mit dem revolverartigen Bestückkopf bestückbaren Bauelemente zu vergrößern, um einen zweiten Bestückkopf überflüssig zu machen.The invention has for its object to increase the spectrum of equippable with the turret-type placement head components to make a second placement unnecessary.
Diese Aufgabe wird durch die Erfindung gemäß den Ansprüchen 1 und 5 gelöst.This object is achieved by the invention according to
Durch das Verfahren nach Anspruch 1 ist es möglich, mit dem revolverartigen Bestückkopf auch Bauelemente zu handhaben, die mit der am Bestückkopf vorhandenen Abtaststation nicht vermessen werden können. Das bedeutet, dass diese Bauelemente, sofern sie in die Umlaufbahn des Bestückkopfes passen, in größere Stückzahl zunächst an den Zuführeinrichtungen für die Bauelemente aufgenommen werden können. Die restlichen Spindeln können mit normal großen Bauelementen belegt werden, die durch die kopfeigene Abtaststation zeitsparend vermessen werden können. Danach verfährt der Bestückkopf über die im Chassis verankerte stationäre Abtasteinrichtung, an der die größeren Bauelemente in schrittweiser Abfolge vermessen werden. Im Anschluss daran können sämtliche am Bestückkopf gehaltenen Bauelemente in einem Drehumlauf auf das Substrat aufgesetzt werden. Das bedeutet, dass für die einzelnen größeren Bauelemente keine zusätzlichen Verfahrbewegungen des Bestückkopfes erforderlich sind, wie dies bei einem Einfachkopf der Fall wäre, auf den nun vollständig verzichtet werden kann.By the method according to claim 1, it is possible to handle with the turret-like placement head and components that can not be measured with the sampling station present at the placement. This means that these components, if they fit into the orbit of the placement, can be added in large numbers initially to the feeders for the components. The remaining spindles can be covered with normal sized components, which can be measured by the head-own scanning station to save time. Thereafter, the placement head moves over the anchored in the chassis stationary scanning device, at which the larger components are measured in a gradual sequence. Following this, all components held on the placement head can be placed on the substrate in a rotary circulation. This means that no additional traversing movements of the placement head are required for the individual larger components, as would be the case with a single head, which can now be completely dispensed with.
Nach einer Weiterbildung der Erfindung kann eines der Bauelemente an der Abtasteinrichtung optisch vermessen und ohne weitere Rotordrehung auf das Substrat aufgesetzt werden. Dies setzt voraus, dass der Bestückkopf mit einem Drehantrieb für die in der Aufsetzposition befindliche Spindel ausgestattet ist. Durch den Verzicht auf eine Rotordrehung für dieses eine Bauelement kann eine höhere Positioniergenauigkeit erreicht werden, die für einige Bauelementetypen gefordert sein kann. Diese Vorgehensweise ist auch für übergroße Bauelemente angezeigt, die für die Umlaufbahn im Bestückkopf zu sperrig sind. Es versteht sich, dass hierbei die letzte freie Greifereinheit ein solches Bauteil von der entsprechenden Zuführeinrichtung abholt, über der Abtasteinrichtung vermisst und ohne jede Rotordrehung auf das Substrat aufsetzt, worauf auch die kleineren Bauelemente auf das Substrat aufgesetzt werden können.According to a development of the invention, one of the components can optically measured on the scanning and without further rotor rotation are placed on the substrate. This assumes that the placement head is equipped with a rotary drive for the spindle located in the placement position. By dispensing with a rotor rotation for this one component, a higher positioning accuracy can be achieved, which may be required for some types of components. This approach is also indicated for oversized components that are too bulky for the orbit in the placement head. It is understood that in this case the last free gripper unit picks up such a component from the corresponding feeder, measures over the scanning device and without any rotor rotation touches the substrate, whereupon the smaller components can be placed on the substrate.
Nach einer anderen Weiterbildung der Erfindung werden mehrere der angesaugten Bauelemente in unmittelbarer Folge an der Abtasteinrichtung vermessen und auf das Substrat aufgesetzt. Das bedeutet, dass die Bauelemente, die zwar durch die Umlaufbahn im Bestückkopf hindurchgeführt werden können, die aber für die kopfeigene Abtaststation zu groß sind, gruppenweise von einander benachbarten Greifereinheiten aufgenommen werden können. Dadurch ist es möglich, diese Bauelemente in einer ununterbrochenen Folge zu vermessen und auf das Substrat aufzusetzen. Die restlichen kleineren Bauelemente werden dann sinnvoll ebenfalls in einer zusammenhängenden Folge von benachbarten Greifereinheiten aufgenommen, im Bestückkopf gemäß Anspruch 4 vermessen und in ununterbrochener Folge auf das Substrat aufgesetzt.According to another embodiment of the invention, a plurality of the sucked components are measured in immediate succession to the scanning device and placed on the substrate. This means that the components that can be passed through the orbit in the placement, but which are too large for the head-own scanning station, can be added in groups of adjacent gripper units. This makes it possible to measure these components in an uninterrupted sequence and set up on the substrate. The remaining smaller components are then also meaningfully added in a contiguous sequence of adjacent gripper units, measured in the placement head according to claim 4 and placed in an uninterrupted sequence on the substrate.
Eine Einrichtung zur Positionierung einer Bauelementeaufnahmeeinheit eines Bestückautomaten für Leiterplatten, wobei zur individuellen Drehpositionierung einer Saugpipette um ihre eigene Achse eine Inkrementalgeberanordnung vorgesehen ist, ist aus
Durch die Erfindung gemäß Anspruch 5 ist es möglich, die Bauelementedrehung während des Rotorumlaufes nach dem Vermessen der kleineren Bauelemente an der kopfeigenen Abtaststation durchzuführen. Das an der stationären Abtasteinrichtung vermessene letzte Bauelement kann in dieser Rotorstellung verbleiben und durch den zugehörigen Drehantrieb in die geforderte Aufsetzstellung mit hoher Genauigkeit verdreht werden.By the invention according to
Durch die Verdrehbarkeit des Rotors nach Anspruch 6 in beiden Drehrichtungen ist es zum Beispiel möglich, die zuletzt aufgenommenen größeren Bauelemente in umgekehrter Drehrichtung über der stationären Abtasteinrichtung in ununterbrochener Folge zeitsparend zu positionieren. Durch die freie Wählbarkeit der Drehrichtung ist es möglich, unter Beibehaltung dieser Drehrichtung zuerst die kleineren Bauelemente abzusetzen oder unter erneut gewechselter Drehrichtung zuerst die größeren Bauelemente zu bestücken.Due to the rotatability of the rotor according to claim 6 in both directions of rotation, it is possible, for example, to position the last recorded larger components in the reverse direction of rotation over the stationary scanning device in an uninterrupted sequence in a time-saving manner. Due to the free selectability of the direction of rotation, it is possible, while maintaining this direction, first to sell the smaller components or to re-equip the larger components with a renewed direction of rotation first.
Im Folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zeigen schematisiert:
- Figur 1
- eine Stirnansicht eines revolverartigen Bestückkopfes mit elektrischen Bauelementen über einer Zuführeinrichtung für die Bauelemente,
Figur 2- eine Seitenansicht des Bestückkopfes nach
Figur 1 , Figur 3- den Bestückkopf nach
Figur 1 über einer anderen Zuführeinrichtung, - Figur 4
- den Bestückkopf nach
in einer anderen Ablaufphase,Figur 3 Figur 5- den Bestückkopf nach
Figur 1 über einer stationären optischen Abtasteinrichtung, - Figur 6
- den Bestückkopf nach
in einer nachfolgenden Ablaufphase,Figur 5 Figur 7- den Bestückkopf nach
Figur 1 mit einem Substrat, Figur 8- den Bestückkopf nach
in einer weiteren Ablaufphase.Figur 7
- FIG. 1
- an end view of a turret-like mounting head with electrical components on a feed device for the components,
- FIG. 2
- a side view of the placement after
FIG. 1 . - FIG. 3
- the placement head
FIG. 1 over another feeder, - FIG. 4
- the placement head
FIG. 3 in another phase of the process, - FIG. 5
- the placement head
FIG. 1 over a stationary optical scanner, - FIG. 6
- the placement head
FIG. 5 in a subsequent process phase, - FIG. 7
- the placement head
FIG. 1 with a substrate, - FIG. 8
- the placement head
FIG. 7 in a further process phase.
Nach den
Der Bestückkopf 1 befindet sich hier über einer Zuführeinrichtung 8 für elektrische Bauelemente 9 in einem peripheren Bereich der Bestückvorrichtung. Dabei befindet sich die untere Greifereinheit 5 unmittelbar über einem abzuholenden kleineren Bauelement 9 und wurde durch die Hubstation 6 in einer senkrechten Koordinatenrichtung z soweit nach unten geschoben, dass sie das Bauelement 9 durch Ansaugen erfassen und bereits teilweise aus der Zuführeinrichtung 8 herausheben konnte. In gleicher Weise sind bereits zwei vorangehende Greifereinheiten 5 mit den Bauelementen 9 belegt. Größere Bauelemente 10 sind in benachbarten Zuführeinrichtungen 8 bereitgestellt. Die Bauelemente 9 von kleinerer Bauart können problemlos an der Abtaststation 7 vermessen werden. Die Greifereinheit 5 weist eine Spindel 13 und einen Drehantrieb 14 zum definierten Drehen der Spindel 13 um ihre Längsachse auf, wobei die äußere Stirnfläche der Spindel 13 mit einer nicht dargestellten Ansaugöffnung für die Bauelemente 9 und 10 versehen istThe placement head 1 is located here above a
Nach den
Anschließend wird der Bestückkopf 1 nach
Nach
Nach
Es ist auch möglich, den Zyklus mit einer anderen Reihenfolge zu betreiben. Beispielsweise können die großen Bauelemente 10 bereits vor dem Abholen des übergroßen Bauelementes 10 vermessen werden, so dass das Substrat 15 in einem Umlauf des Rotors 3 ohne Unterbrechung bestückt werden kann. Durch die Möglichkeit der Vorwärts- und Rückwärtsdrehung des Rotors 3 kann je nach der Art und der Anzahl der Bauelemente 9, 10 ein abweichender zeitoptimierter Modus gewählt werden.It is also possible to operate the cycle in a different order. For example, the
- 11
- Bestückkopfplacement
- 22
- Statorstator
- 33
- Rotorrotor
- 44
- Motorengine
- 55
- Greifereinheitgripper unit
- 66
- HubstationLifting station
- 77
- Abtaststationscanning
- 88th
- Zuführeinheitfeed
- 99
- Bauelementmodule
- 1010
- Bauelementmodule
- 1111
- Abtasteinrichtungscanning
- 1212
- Chassischassis
- 1313
- Spindelspindle
- 1414
- Drehantriebrotary drive
- 1515
- Substratsubstratum
Claims (6)
- Method for equipping substrates (15) with electrical components (9, 10) in an equipping device which comprises a chassis (12) and a revolver-like equipping head (1) displaceable parallel to the substrate (15) and with a progressively rotatable rotor (3) which is provided with circumferentially arranged gripper units (5) with rotatable spindles (13) for holding the components (9, 10), the equipping head (1) comprising at least one rotary drive (14) for the spindles (13) and the peripherally provided components (9, 10) in each case being drawn by suction in a lifting position onto the spindles (13), optically scanned and placed onto the substrate (15), characterised in that at least one of the suctioned components (10) is moved in the lifting position via an optical scanning device (11) anchored to the chassis (12), and in that the spindle (13) is rotated with the component (10) by the rotary drive (14) into a predetermined angular position and placed onto the substrate (15).
- Method according to claim 1, characterised in that one of the components (10) is optically measured at the scanning device (11) and placed onto the substrate (15) without further rotation of the rotor.
- Method according to claim 1 or 2, characterised in that a plurality of suctioned components (10) are measured in direct succession at the scanning device (11) and placed onto the substrate (15).
- Method according to claim 1, 2 or 3, characterised in that the components (9) are measured in an optical scanning station (7) of the equipping head (1).
- Revolver-like equipping head (1) comprising a plurality of gripper units (5), mounted on a rotor (3), for drawing by suction electrical components (9, 10) that are to be placed on a substrate (15), the progressively rotatable rotor (3) being displaceable at least in one coordinate direction parallel to the substrate (15), the gripper unit (5) comprising a spindle (13) that is rotatable about an axle and to which the component (9, 10) can be fixed, according to any one of the preceding claims, and the equipping head (1) comprising at least one rotary drive (4) for the spindles (13), characterised in that each of the gripper units (5) comprises a rotary drive (14) for the associated spindle (13).
- Equipping head (1) according to claim 5, characterised in that the rotor (3) can be driven in opposing directions of rotation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004015848A DE102004015848A1 (en) | 2004-03-31 | 2004-03-31 | Method and turret-type placement head for mounting substrates with electrical components |
PCT/EP2005/050876 WO2005096687A1 (en) | 2004-03-31 | 2005-03-01 | Method and revolver-like equipping head for equipping substrates with electrical components |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1731008A1 EP1731008A1 (en) | 2006-12-13 |
EP1731008B1 true EP1731008B1 (en) | 2008-05-14 |
Family
ID=34965757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05716850A Active EP1731008B1 (en) | 2004-03-31 | 2005-03-01 | Method and revolver-like equipping head for equipping substrates with electrical components |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1731008B1 (en) |
JP (1) | JP2007531293A (en) |
CN (1) | CN1939109B (en) |
DE (2) | DE102004015848A1 (en) |
WO (1) | WO2005096687A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016222590A1 (en) | 2016-11-16 | 2018-05-17 | Asm Assembly Systems Gmbh & Co. Kg | Method for equipping a substrate with components, control unit, computer program product and placement machine |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2322021A1 (en) * | 2008-09-01 | 2011-05-18 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Pick-and-place machine |
KR101910375B1 (en) * | 2014-01-06 | 2018-10-22 | 한화에어로스페이스 주식회사 | Head assembly for chip mounter |
FR3045427B1 (en) * | 2015-12-17 | 2018-05-25 | Psa Automobiles Sa. | ASSEMBLY STATION OF AN INDUSTRIAL MANUFACTURING LINE |
DE102019125134A1 (en) | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Component handling, component inspection |
CN111343847B (en) * | 2020-04-26 | 2021-06-11 | 方强 | Ultra-high-speed chip mounting method and chip mounting head |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3870811D1 (en) * | 1987-11-10 | 1992-06-11 | Siemens Ag | DEVICE AND METHOD FOR EQUIPPING CIRCUIT BOARDS WITH COMPONENTS. |
FR2661309A1 (en) * | 1990-04-20 | 1991-10-25 | Eurosoft Robotique | Head for picking up and positioning electronic components for a machine for assembling on printed circuits |
EP0906011A3 (en) * | 1997-09-24 | 2000-05-24 | Siemens Aktiengesellschaft | Apparatus for mounting of electrical components on flat component carriers |
WO1999049662A2 (en) * | 1998-03-26 | 1999-09-30 | Koninklijke Philips Electronics N.V. | Automatic installation |
KR20020062358A (en) * | 1999-12-21 | 2002-07-25 | 지멘스 악티엔게젤샤프트 | Insertion head comprising a rotational device for electric components |
DE10100619C2 (en) * | 2001-01-09 | 2003-05-08 | Siemens Production Und Logisti | Device for positioning a component receiving unit of an automatic placement machine for printed circuit boards |
-
2004
- 2004-03-31 DE DE102004015848A patent/DE102004015848A1/en not_active Withdrawn
-
2005
- 2005-03-01 JP JP2007505534A patent/JP2007531293A/en active Pending
- 2005-03-01 EP EP05716850A patent/EP1731008B1/en active Active
- 2005-03-01 WO PCT/EP2005/050876 patent/WO2005096687A1/en active IP Right Grant
- 2005-03-01 CN CN2005800103897A patent/CN1939109B/en active Active
- 2005-03-01 DE DE502005004120T patent/DE502005004120D1/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016222590A1 (en) | 2016-11-16 | 2018-05-17 | Asm Assembly Systems Gmbh & Co. Kg | Method for equipping a substrate with components, control unit, computer program product and placement machine |
DE102016222590B4 (en) * | 2016-11-16 | 2021-04-15 | Asm Assembly Systems Gmbh & Co. Kg | Method for equipping a substrate with components, control device, computer program product and automatic equipping machine |
Also Published As
Publication number | Publication date |
---|---|
CN1939109B (en) | 2010-07-14 |
CN1939109A (en) | 2007-03-28 |
JP2007531293A (en) | 2007-11-01 |
DE502005004120D1 (en) | 2008-06-26 |
WO2005096687A1 (en) | 2005-10-13 |
DE102004015848A1 (en) | 2005-10-27 |
EP1731008A1 (en) | 2006-12-13 |
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