EP1688969A3 - Serial resistor - Google Patents

Serial resistor Download PDF

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Publication number
EP1688969A3
EP1688969A3 EP06000592A EP06000592A EP1688969A3 EP 1688969 A3 EP1688969 A3 EP 1688969A3 EP 06000592 A EP06000592 A EP 06000592A EP 06000592 A EP06000592 A EP 06000592A EP 1688969 A3 EP1688969 A3 EP 1688969A3
Authority
EP
European Patent Office
Prior art keywords
serial resistor
wall
resistor
directly
serial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06000592A
Other languages
German (de)
French (fr)
Other versions
EP1688969A2 (en
Inventor
Andreas Dipl.-Ing. Fink
Jürgen Dipl.-Ing. Otto (FH)
Harald Dipl.-Ing. Dr. Riegel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle Behr GmbH and Co KG
Original Assignee
Behr GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr GmbH and Co KG filed Critical Behr GmbH and Co KG
Publication of EP1688969A2 publication Critical patent/EP1688969A2/en
Publication of EP1688969A3 publication Critical patent/EP1688969A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146Conductive polymers, e.g. polyethylene, thermoplastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003Thick film resistors
    • H01C7/005Polymer thick films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

Die Erfindung betrifft einen Vorwiderstand, der als Widerstandsschicht (2) ausgebildet in eine Wand (1') körperlich integriert oder direkt an einer Fläche (1) der Wand (1') angebracht und flächig entlang derselben verlaufend ausgebildet ist.

Figure imgaf001
The invention relates to a series resistor which is formed as a resistance layer (2) in a wall (1 ') physically integrated or directly on a surface (1) of the wall (1') and formed flat along the same running.
Figure imgaf001

EP06000592A 2005-02-02 2006-01-12 Serial resistor Withdrawn EP1688969A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005004911 2005-02-02
DE102005033152 2005-07-13

Publications (2)

Publication Number Publication Date
EP1688969A2 EP1688969A2 (en) 2006-08-09
EP1688969A3 true EP1688969A3 (en) 2006-09-13

Family

ID=36101577

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06000592A Withdrawn EP1688969A3 (en) 2005-02-02 2006-01-12 Serial resistor

Country Status (1)

Country Link
EP (1) EP1688969A3 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042079A (en) * 1990-04-18 1992-01-07 Aisin Seiki Co Ltd Planar heat emitting molded object and manufacture thereof
EP1245361A1 (en) * 2001-03-26 2002-10-02 Abb Research Ltd. Method for injection molding parts with electrically conductive elements and electrical component with such a part
DE10212042C1 (en) * 2002-03-19 2003-08-14 Sidler Gmbh & Co Low-cost, injection-molded adjustable resistor with cooling fins and mountings, has contacts inlaid in conductive plastic with bridging sections which can be cut to select resistance
EP1467598A2 (en) * 2003-04-10 2004-10-13 Integral Technologies, Inc. Low cost heating devices manufactured from conductive resin-based materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042079A (en) * 1990-04-18 1992-01-07 Aisin Seiki Co Ltd Planar heat emitting molded object and manufacture thereof
EP1245361A1 (en) * 2001-03-26 2002-10-02 Abb Research Ltd. Method for injection molding parts with electrically conductive elements and electrical component with such a part
DE10212042C1 (en) * 2002-03-19 2003-08-14 Sidler Gmbh & Co Low-cost, injection-molded adjustable resistor with cooling fins and mountings, has contacts inlaid in conductive plastic with bridging sections which can be cut to select resistance
EP1467598A2 (en) * 2003-04-10 2004-10-13 Integral Technologies, Inc. Low cost heating devices manufactured from conductive resin-based materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 142 (E - 1187) 9 April 1992 (1992-04-09) *

Also Published As

Publication number Publication date
EP1688969A2 (en) 2006-08-09

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