EP1673836B1 - Contact surfaces for electrical contacts - Google Patents
Contact surfaces for electrical contacts Download PDFInfo
- Publication number
- EP1673836B1 EP1673836B1 EP04762578A EP04762578A EP1673836B1 EP 1673836 B1 EP1673836 B1 EP 1673836B1 EP 04762578 A EP04762578 A EP 04762578A EP 04762578 A EP04762578 A EP 04762578A EP 1673836 B1 EP1673836 B1 EP 1673836B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- graphite particles
- contact surface
- layer
- range
- surface according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 239000010439 graphite Substances 0.000 claims description 18
- 229910002804 graphite Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910015373 AuCo Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 229910016347 CuSn Inorganic materials 0.000 description 1
- 229910015800 MoS Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- CWVZGJORVTZXFW-UHFFFAOYSA-N [benzyl(dimethyl)silyl]methyl carbamate Chemical compound NC(=O)OC[Si](C)(C)CC1=CC=CC=C1 CWVZGJORVTZXFW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000007705 chemical test Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000546 pharmaceutical excipient Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12625—Free carbon containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Definitions
- the invention relates to improved contact surfaces for electrical contacts according to the preamble of the independent claim.
- Electrical connectors such as sockets and plugs are typically made from a copper-based alloy substrate which provides good electrical conductivity.
- the substrate is made of a copper-based alloy having high strength and high stress relaxation resistance.
- cover layer In order to reduce the startup of the copper-base substrate at elevated temperature and to improve solderability, a cover layer is often applied to the substrate.
- Typical cover layers consist of nickel, palladium / nickel alloys, tin or tin alloys.
- tin is often used, which is usually hot-dip galvanized or electrodeposited layers in the range of a few ⁇ m. In this case, tin is characterized by its ductility and by its good electrical conductivity.
- the substrate consists of copper-based alloys such as CuSn 4 bronze, CuNiSi, etc., which often serve as a base material for electrical connectors.
- copper may diffuse out of the substrate and combine with the tin to form intemal metallic compounds such as Cu 6 Sn 5 and Cu 3 Sn.
- intemal metallic compounds such as Cu 6 Sn 5 and Cu 3 Sn.
- the formation of these intermetallic compounds reduces the Amount of unreacted or free tin on the surface. This degrades the electrical, corrosion and other performance characteristics.
- Thermotin is known as a "tin layer" which is formed by thermal aging and which consists of 100% of inttenetalic phases.
- thermotin has not yet proven to be a successful solution under all test conditions (e.g., chemical tests or abrasive loading) and therefore has a negligible market share.
- tin alloys tend due to their low hardness or low wear resistance due to frequent mating or vehicle or engine vibration in the connector easily to increased oxidation (fretting corrosion) and to through. This abrasion or the fretting corrosion can lead to failure of a component (sensor, control unit, electrical components in general).
- layer abrasion or layer spalling may lead to tribological wear mechanisms of the base material or the intermediate layer (often Cu or Ni) due to poor adhesion.
- a composite coating for electrical contacts that includes a ductile metal matrix and a uniformly dispersed polymer component.
- the polymer component is present in a concentration which reduces the frictional forces occurring when a contact is inserted into a corresponding socket.
- the composite coating has lower friction and improved frictional oxidation as opposed to an electrodeposited tin coating.
- the US-A 5,916,695 discloses an electrical contact with a copper-based substrate provided with a tin-based capping layer.
- a barrier layer is applied between the substrate and the cover layer.
- This barrier layer contains 20 to 40% by weight of nickel and preferably consists mainly of copper (Cu base).
- the tin-based covering layer may contain additives such as SiO 2 , Al 2 O 3 , SiC, graphite or MoS 2 as lubricants.
- the DE 4133 466 A1 shows a movable electrical sliding contact having a surface which is in sliding contact with a corresponding mating contact, the surface being coated with a mixture of materials in which graphite particles are dispersed in a matrix of silver.
- the coating is applied by electroplating, wherein the electroplating liquid is provided with a concentration of metallic silver, calcium cyanide, potassium hydroxide, graphite powder and a dispersing agent for dispersing the graphite powder in the electroplating liquid.
- the contact surfaces according to the invention have the advantage over the prior art that they require lower insertion forces while the electrical contact is still good.
- FIG. 1 An embodiment of the invention is illustrated in the drawing and explained in more detail in the following description.
- the figure shows the arrangement of the graphite particles in an Ag contact layer.
- the core of the invention is the construction of an Ag covering layer with finely dispersed graphite particles embedded therein on a copper-based substrate for electrical contacts in the automobile, which allows lower insertion forces to be required with consistently good contacting.
- an Ag contact surface 12 is formed by means of electroplating processes, for example, baths or reel-to-reel processes.
- the Ag layer may be coated with or without intermediate layers as diffusion barriers, such as undilickeling, and with or without flash of precious metal, such as e.g. Au, Pt, Ru or Pd are deposited.
- the layer thickness of the deposited Ag layer is according to the invention, depending on the application between about 1.0 and about 10 microns.
- finely dispersed graphite particles 14 are introduced, for example.
- the graphite particles are preferably present as platelets or flakes and have a length in the range of 1 to 10 microns, a thickness in the range of 0.05 to 2 microns and a width in the range of 0.05 to 2 microns. It is preferable if the maximum value, ie 2 ⁇ m, does not simultaneously occur with regard to thickness and width.
- the graphite particles are anisotropically arranged along the plane of habit of the Ag layer, i.e., along the longest axis of the layer plane (see Fig.).
- the aspect ratio of the graphite particles that is, the length to thickness ratio is 1: 2 to 1:40.
- the contact surfaces of the invention allow lower insertion forces due to the existing lubricant graphite. Due to the electrical conductivity of the lubricant good contact is guaranteed. Antioxidants contained in the lubricant protect the surface against corrosion, high wear resistance and a high number of mating cycles are obtained.
- the contact surfaces according to the invention are preferably used in electrical contacts in motor-car connectors.
Description
Die Erfindung betrifft verbesserte Kontaktoberflächen für elektrische Kontakte nach dem Oberbegriff des unabhängigen Anspruches.The invention relates to improved contact surfaces for electrical contacts according to the preamble of the independent claim.
Elektrische Verbinder wie Buchsen und Stecker werden typischerweise aus einem Substrat aus einer Legierung auf Kupferbasis, das für eine gute elektrische Leitfähigkeit sorgt, hergestellt. Wenn der elektrische Verbinder während des Betriebs erhöhter Temperatur ausgesetzt wird, wie bspw. unter der Motorhaube eines Kraftfahrzeugs, wird das Substrat aus einer Legierung auf Kupferbasis mit hoher Festigkeit und hohem Spannungsrelaxations-Widerstand hergestellt.Electrical connectors such as sockets and plugs are typically made from a copper-based alloy substrate which provides good electrical conductivity. When the electrical connector is exposed to elevated temperature during operation, such as under the hood of a motor vehicle, the substrate is made of a copper-based alloy having high strength and high stress relaxation resistance.
Zur Verringerung des Anlaufens des Substrats aufKupferbasis bei erhöhter Temperatur und zur Verbesserung der Lötbarkeit wird häufig eine Deckschicht auf das Substrat aufgebracht. Typische Deckschichten bestehen aus Nickel, Palladium/Nickel-Legierungen, Zinn oder Zinnlegierungen. Zur Kostenminimierung wird häufig Zinn verwendet, wobei es sich meist um feuerverzinnte oder galvanisch abgeschiedene Schichten im Bereich weniger µm handelt. Hierbei zeichnet sich Zinn durch seine Duktilität sowie durch seine gute elektrische Leitfähigkeit aus.In order to reduce the startup of the copper-base substrate at elevated temperature and to improve solderability, a cover layer is often applied to the substrate. Typical cover layers consist of nickel, palladium / nickel alloys, tin or tin alloys. In order to minimize costs, tin is often used, which is usually hot-dip galvanized or electrodeposited layers in the range of a few μm. In this case, tin is characterized by its ductility and by its good electrical conductivity.
Üblicherweise besteht das Substrat aus Kupfer-Basis-Legierungen wie z.B. CuSn4-Bronze, CuNiSi, usw., die häufig als Grundwerkstoff für elektrische Steckverbindungen dienen. Bei erhöhten Temperaturen kann es dazu kommen, dass Kupfer aus dem Substrat heraus diffundiert und sich mit dem Zinn unter Bildung intemletallischer Verbindungen wie Cu6Sn5 und Cu3Sn vereinigt. Die Bildung dieser intermetallischen Verbindungen verringert die Menge an unreagiertem oder freiem Zinn an der Oberfläche. Dies verschlechtert die elektrischen, Korrosions- und andere Leistungsmerkmale.Usually, the substrate consists of copper-based alloys such as CuSn 4 bronze, CuNiSi, etc., which often serve as a base material for electrical connectors. At elevated temperatures, copper may diffuse out of the substrate and combine with the tin to form intemal metallic compounds such as Cu 6 Sn 5 and Cu 3 Sn. The formation of these intermetallic compounds reduces the Amount of unreacted or free tin on the surface. This degrades the electrical, corrosion and other performance characteristics.
Als Thermozinn ist eine durch Warmauslagerung entstehende "Zinnschicht" bekannt, die zu 100% aus intennetallischen Phasen besteht. Darüber hinaus werden häufig AuCo-Legierungen mit Unternickelung sowie Ag-Oberflächen, z.T. mit Unterkupferung oder Unternickelung, eingesetzt.Thermotin is known as a "tin layer" which is formed by thermal aging and which consists of 100% of inttenetalic phases. In addition, AuCo alloys with nickel plating and Ag surfaces, eg. with sub-copper or nickel-nickel, used.
Thermozinn hat sich bislang jedoch nicht unter allen Prüfbedingungen (z.B., chemische Tests oder abrasive Belastung) als erfolgreiche Lösung herausgestellt und hat daher nur einen vernachlässigbar kleinen Marktanteil.However, thermotin has not yet proven to be a successful solution under all test conditions (e.g., chemical tests or abrasive loading) and therefore has a negligible market share.
Es ist weiterhin bekannt, dass Zinnlegierungen aufgrund ihrer geringen Härte bzw. ihres geringen Verschleißwiderstandes durch häufiges Stecken oder fahrzeug- bzw. motorbedingte Vibrationen im Steckverbinder leicht zur verstärkten Oxidation (Reibkorrosion) und zum Durchrieb neigen. Dieser Durchrieb bzw. die Reibkorrosion können zu einem Ausfall einer Komponente (Sensor, Steuergerät, elektrische Komponenten allgemein) führen.It is also known that tin alloys tend due to their low hardness or low wear resistance due to frequent mating or vehicle or engine vibration in the connector easily to increased oxidation (fretting corrosion) and to through. This abrasion or the fretting corrosion can lead to failure of a component (sensor, control unit, electrical components in general).
Hinzu kommt, dass die Steckkräfte aufgrund der hohen Adhäsionsneigung und der plastischen Verformung für viele Anwendungsfälle wie hochpolige Steckverbinder )> 100 Pins bzw. Kontakte) zu hoch sind. Speziell Oberflächen auf der Basis von Zinn und Silber neigen zur Kaltverschweißung aufgrund von Adhäsion und sind in Selbstpaarungen durch hohe Reibwerte gekennzeichnet (Reibungskoeffizient µ ∼ 1).In addition, because of the high adhesion tendency and the plastic deformation, the insertion forces are too high for many applications such as multi-pin connectors)> 100 pins or contacts). Especially surfaces based on tin and silver are prone to cold welding due to adhesion and are characterized by high coefficients of friction in self-pairing (coefficient of friction μ~1).
Auch bei herkömmlichen Silber- oder Goldschichten kann es bei einem Schichtdurchrieb oder Schichtabplatzern aufgrund schlechter Haftung zu tribologischen Verschleißmechanismen des Grundmaterials oder der Zwischenschicht (häufig Cu oder Ni) kommen.Even with conventional silver or gold layers, layer abrasion or layer spalling may lead to tribological wear mechanisms of the base material or the intermediate layer (often Cu or Ni) due to poor adhesion.
Aufgrund der Altautorichtlinie EG 2000/53 ist es untersagt, bleihaltige Zinnschichten zu verwenden. Da das Blei die Whiskerbildung (Whisker sind winzige haarförmige Kristalle) hemmt, kommt es bei galvanischem Reinzinn verstärkt zum Whiskerwachstum, was zu Kurzschlüssen führen kann.Due to the old car directive EG 2000/53 it is forbidden to use tin layers containing lead. Since lead inhibits whisker formation (whiskers are tiny hair-shaped crystals), galvanic pure tin increasingly causes whisker growth, which can lead to short circuits.
In der
Die
Die
Die erfindungsgemäßen Kontaktoberflächen haben gegenüber dem Stand der Technik den Vorteil, dass sie bei weiterhin guter elektrischer Kontaktierung niedrigere Steckkräfte erfordern.The contact surfaces according to the invention have the advantage over the prior art that they require lower insertion forces while the electrical contact is still good.
Weiterhin ist vorteilhaft, dass sie durch den Gehalt an Antioxidanzien im enthaltenen Schmierstoff einen Schutz der Oberfläche vor Korrosion bieten.Furthermore, it is advantageous that they provide protection of the surface from corrosion by the content of antioxidants in the lubricant contained.
Außerdem ergibt sich der Vorteil eines erhöhten Verschleißschutzes und somit einer Lebensdauererhöhung der Kontakte.In addition, there is the advantage of increased wear protection and thus an increase in the service life of the contacts.
Vorteilhafte Weiterbildungen der Erfindung ergeben sich aus den in den Unteransprüchen genannten Maßnahmen.Advantageous developments of the invention will become apparent from the measures mentioned in the dependent claims.
Ein Ausführungsbeispiele der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Die Figur zeigt die Anordnung der Graphitteilchen in einer Ag-Kontaktschicht.An embodiment of the invention is illustrated in the drawing and explained in more detail in the following description. The figure shows the arrangement of the graphite particles in an Ag contact layer.
Kern der Erfindung ist der Aufbau einer Ag-Deckschicht mit darin eingebetteten feindispersen Graphitteilchen auf einem kupferbasierten Substrat für elektrische Kontakte im Automobil, die es erlaubt, dass bei gleichbleibend guter Kontaktierung niedrigere Steckkräfte erforderlich sind.The core of the invention is the construction of an Ag covering layer with finely dispersed graphite particles embedded therein on a copper-based substrate for electrical contacts in the automobile, which allows lower insertion forces to be required with consistently good contacting.
Wie in der Figur gezeigt, wird zunächst auf dem elektrischen Kontakt, d.h., auf dem kupferbasierten Substrat 10 eine Ag-Kontaktoberfläche 12 mittels galvanischer Verfahren, bspw. Bäder oder reel-to-reel-Verfahren, erzeugt.As shown in the figure, first on the electrical contact, that is, on the copper-based
Die Ag-Schicht kann mit oder auch ohne Zwischenschichten als Diffusionsbarrieren, wie Untemickelung, sowie mit oder ohne Flash aus Edelmetall wie z.B. Au, Pt, Ru oder Pd abgeschieden werden.The Ag layer may be coated with or without intermediate layers as diffusion barriers, such as undilickeling, and with or without flash of precious metal, such as e.g. Au, Pt, Ru or Pd are deposited.
Die Schichtdicke der abgeschiedenen Ag-Schicht liegt erfindungsgemäß, je nach Anwendung zwischen etwa 1,0 und etwa 10 µm.The layer thickness of the deposited Ag layer is according to the invention, depending on the application between about 1.0 and about 10 microns.
In die Ag-Schicht sind feindisperse Graphitteilchen 14 eingebracht, bspw. durch Verwirbelung von Graphit und chemischen Hilfsstoffen zum Einbinden (Netzmittel), wobei die Graphitmengen im Bereich von 1 bis 3 Gew.-% Kohlenstoff der Ag-Schicht bzw. im Bereich von 3 bis 10 Flächen-% Kohlenstoff liegen. Die Graphitteilchen liegen bevorzugt als Plättchen oder Flakes vor und haben eine Länge im Bereich von 1 bis 10 µm, eine Dicke im Bereich von 0,05 bis 2 µm und eine Breite im Bereich von 0,05 bis 2 µm. Bevorzugt ist, wenn bzgl. Dicke und Breite nicht gleichzeitig der maximale Wert, also 2 µm, auftritt.In the Ag layer finely dispersed
Die Graphitteilchen sind anisotrop entlang der Habitusebene der Ag-Schicht, d.h., entlang der längsten Achse der Schichtebene angeordnet (vgl. Fig.).The graphite particles are anisotropically arranged along the plane of habit of the Ag layer, i.e., along the longest axis of the layer plane (see Fig.).
Das Aspektverhältnis der Graphitteilchen, d.h., das Verhältnis Länge zu Dicke beträgt 1:2 bis 1:40.The aspect ratio of the graphite particles, that is, the length to thickness ratio is 1: 2 to 1:40.
Die erfindungsgemäßen Kontaktoberflächen erlauben niedrigere Steckkräfte aufgrund des vorhandenen Schmierstoffs Graphit. Aufgrund der elektrischen Leitfähigkeit des Schmierstoffes ist eine gute Kontaktierung gewährleistet. Im Schmiermittel enthaltene Antioxidanzien schützen die Oberfläche vor Korrosion, es wird eine hohe Verschleißbeständigkeit sowie eine hohe Steckzyklenzahl erhalten.The contact surfaces of the invention allow lower insertion forces due to the existing lubricant graphite. Due to the electrical conductivity of the lubricant good contact is guaranteed. Antioxidants contained in the lubricant protect the surface against corrosion, high wear resistance and a high number of mating cycles are obtained.
Die erfindungsgemäßen Kontaktoberflächen finden bevorzugt Verwendung in elektrischen Kontakte in motomahen Automobilsteckverbindungen.The contact surfaces according to the invention are preferably used in electrical contacts in motor-car connectors.
Claims (6)
- Contact surface for electrical contacts, wherein a silver layer deposited by means of electroplating processes is disposed on a copper-based substrate, wherein the silver layer contains finely dispersed graphite particles in a quantity which amounts to 1 to 3% by weight of the silver layer, and wherein the length of the graphite particles is in the range from 0.5 to 20 µm, characterized in that the graphite particles are arranged anisotropically along the habit plane of the silver layer, the thickness to length ratio of the graphite particles being in the range from 1:2 to 1:40.
- Contact surface according to Claim 1, characterized in that the length of the graphite particles is in the range from 1 to 10 µm.
- Contact surface according to Claim 1 or 2, characterized in that the thickness of the graphite particles is in the range from 0.05 to 2 µm.
- Contact surface according to one of the preceding claims, characterized in that the layer thickness of the Ag layer is in the range from about 1 to about 10 µm.
- Contact surface according to one of the preceding claims, characterized in that the graphite particles do not simultaneously have the maximum thickness and width.
- Use of the contact surface according to one of the preceding claims for electrical contacts in automotive plug connections in close proximity to the engine.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10346206A DE10346206A1 (en) | 2003-10-06 | 2003-10-06 | Contact surface e.g. for motor vehicle electrical contacts in engine bay, has silver layer with finely dispersed graphite particles |
PCT/DE2004/001733 WO2005046000A1 (en) | 2003-10-06 | 2004-08-03 | Contact surfaces for electrical contacts |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1673836A1 EP1673836A1 (en) | 2006-06-28 |
EP1673836B1 true EP1673836B1 (en) | 2010-10-13 |
Family
ID=34399256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04762578A Active EP1673836B1 (en) | 2003-10-06 | 2004-08-03 | Contact surfaces for electrical contacts |
Country Status (4)
Country | Link |
---|---|
US (1) | US7638721B2 (en) |
EP (1) | EP1673836B1 (en) |
DE (2) | DE10346206A1 (en) |
WO (1) | WO2005046000A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108468017A (en) * | 2018-03-20 | 2018-08-31 | 西安福莱电工合金有限公司 | A kind of magnetically controlled sputter method preparing silver-colored graphite composite deposite in copper contact surfaces |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM379095U (en) * | 2009-09-30 | 2010-04-21 | Elitegroup Computer Sys Co Ltd | Conductive pin structure of main board and connector |
CN103582722B (en) * | 2011-06-03 | 2016-11-23 | 松下电器产业株式会社 | Contact part |
DE102011121133A1 (en) * | 2011-12-13 | 2013-06-13 | Kostal Kontakt Systeme Gmbh | Fluid-tight contact feedthrough |
CN103958611B (en) * | 2011-12-27 | 2016-06-29 | 松下知识产权经营株式会社 | Anisotropic thermal compositions and products formed thereof |
DE102013005705A1 (en) * | 2013-03-30 | 2014-10-02 | Kostal Kontakt Systeme Gmbh | Fluid-tight contact feedthrough |
DE102014005339B4 (en) | 2014-01-28 | 2022-06-09 | Wolfgang B. Thörner | Process for the production of a contact element |
DE102015118779A1 (en) | 2014-11-07 | 2016-05-12 | Harting Kgaa | Electric contact |
DE102014119114A1 (en) | 2014-12-18 | 2016-06-23 | Harting Kgaa | Contact plating |
DE102016102319A1 (en) * | 2016-02-10 | 2017-08-10 | Harting Ag & Co. Kg | Process for coating a contact element with a copper-nickel alloy |
DE102018005352A1 (en) | 2018-07-05 | 2020-01-09 | Dr.-Ing. Max Schlötter GmbH & Co KG | Silver electrolyte for the deposition of dispersion silver layers and contact surfaces with dispersion silver layers |
DE102018005348A1 (en) | 2018-07-05 | 2020-01-09 | Dr.-Ing. Max Schlötter GmbH & Co KG | Silver electrolyte for the deposition of dispersion silver layers and contact surfaces with dispersion silver layers |
EP3636804A1 (en) | 2018-10-11 | 2020-04-15 | ABB Schweiz AG | Silver-graphene composite coating for sliding contact and electroplating method thereof |
JP6804597B1 (en) * | 2019-08-01 | 2020-12-23 | Dowaメタルテック株式会社 | Composite plating material and its manufacturing method |
DE102021118820A1 (en) | 2021-07-21 | 2023-01-26 | Umicore Galvanotechnik Gmbh | silver electrolyte |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2543082C3 (en) * | 1975-09-26 | 1979-06-28 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Cyanidic silver electrolyte and process for the electrodeposition of silver-graphite dispersion coatings and its application |
US4622269A (en) * | 1985-12-30 | 1986-11-11 | Gte Products Corporation | Electrical contact and process for making the same |
US4699763A (en) * | 1986-06-25 | 1987-10-13 | Westinghouse Electric Corp. | Circuit breaker contact containing silver and graphite fibers |
US5028492A (en) | 1990-03-13 | 1991-07-02 | Olin Corporation | Composite coating for electrical connectors |
US5199553A (en) * | 1990-10-09 | 1993-04-06 | Fuji Electric Co., Ltd. | Sliding contactor for electric equipment |
GB2251133B (en) | 1990-10-09 | 1995-03-15 | Fuji Electric Co Ltd | Sliding contactor for electric equipment |
DE4111683A1 (en) * | 1991-04-10 | 1992-10-22 | Duerrwaechter E Dr Doduco | MATERIAL FOR ELECTRICAL CONTACTS MADE OF SILVER WITH CARBON |
FR2731106A1 (en) | 1995-02-27 | 1996-08-30 | Schneider Electric Sa | METHOD FOR MANUFACTURING COMPOSITE ELECTRIC CONTACT MATERIAL |
US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
EP0825682A3 (en) | 1996-08-20 | 1999-05-06 | Wermelinger AG | Maintenance-free push-in phy |
US5967860A (en) * | 1997-05-23 | 1999-10-19 | General Motors Corporation | Electroplated Ag-Ni-C electrical contacts |
-
2003
- 2003-10-06 DE DE10346206A patent/DE10346206A1/en not_active Withdrawn
-
2004
- 2004-08-03 US US10/574,879 patent/US7638721B2/en not_active Expired - Fee Related
- 2004-08-03 EP EP04762578A patent/EP1673836B1/en active Active
- 2004-08-03 DE DE502004011782T patent/DE502004011782D1/en active Active
- 2004-08-03 WO PCT/DE2004/001733 patent/WO2005046000A1/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108468017A (en) * | 2018-03-20 | 2018-08-31 | 西安福莱电工合金有限公司 | A kind of magnetically controlled sputter method preparing silver-colored graphite composite deposite in copper contact surfaces |
Also Published As
Publication number | Publication date |
---|---|
EP1673836A1 (en) | 2006-06-28 |
DE502004011782D1 (en) | 2010-11-25 |
US20070275611A1 (en) | 2007-11-29 |
US7638721B2 (en) | 2009-12-29 |
WO2005046000A1 (en) | 2005-05-19 |
DE10346206A1 (en) | 2005-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1673836B1 (en) | Contact surfaces for electrical contacts | |
EP1547107B1 (en) | Electrical contact | |
US5780172A (en) | Tin coated electrical connector | |
EP1636402A2 (en) | Contact surfaces for electrical contacts and method for producing the same | |
EP3797184B1 (en) | Silver electrolyte for depositing dispersion silver layers and contact surfaces with dispersion silver layers | |
DE60006335T2 (en) | Electrolytically deposited precious metal coating that contains abrasion-resistant particles | |
EP1369504A1 (en) | Metal strip for the manufacture of components for electrical connectors | |
EP2195885A1 (en) | Electrical contact element and a method of producing the same | |
DE19606116A1 (en) | Electrical contact elements | |
DE10138204B4 (en) | Electric contact | |
DE102014117410B4 (en) | Electrical contact element, press-fit pin, socket and leadframe | |
EP1157820A1 (en) | Metal strip with high electric conductibility and connector made from it | |
DE102008056965B4 (en) | Sliding bearing composite material with galvanically deposited sliding layer | |
DE10025106A1 (en) | Electrically conductive metal tape and connectors from it | |
WO2015027982A1 (en) | Contact element with gold coating | |
DE112016005445T5 (en) | Vehicle mounted electronic module, card edge connector and connector | |
DE3312713A1 (en) | Silver-coated electrical materials and process for their production | |
DE69823713T2 (en) | Copper-based alloys and connecting elements | |
DE102011088211A1 (en) | Contact element and method for its production | |
DE19744667A1 (en) | Low voltage cable for motor vehicles | |
DE102005055742A1 (en) | Electrochemical process to coat electrical connector metal component with tin or silver | |
DE102011013881B3 (en) | Sliding bearing composite material and slide bearing element produced therefrom | |
KR100467896B1 (en) | Cladding including copper substrate, tin cladding layer and electroplated barrier layer | |
EP3375910A2 (en) | Connector | |
EP1288321B1 (en) | Material for a metal strip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20060508 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT |
|
17Q | First examination report despatched |
Effective date: 20060803 |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB IT |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REF | Corresponds to: |
Ref document number: 502004011782 Country of ref document: DE Date of ref document: 20101125 Kind code of ref document: P |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20110714 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502004011782 Country of ref document: DE Effective date: 20110714 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20110803 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20120430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20110803 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20110803 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20110831 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20231025 Year of fee payment: 20 |