EP1661178B1 - Electronic component comprising a cooling surface - Google Patents

Electronic component comprising a cooling surface Download PDF

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Publication number
EP1661178B1
EP1661178B1 EP04764701A EP04764701A EP1661178B1 EP 1661178 B1 EP1661178 B1 EP 1661178B1 EP 04764701 A EP04764701 A EP 04764701A EP 04764701 A EP04764701 A EP 04764701A EP 1661178 B1 EP1661178 B1 EP 1661178B1
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EP
European Patent Office
Prior art keywords
electronic component
component according
circuit board
connecting element
connection element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP04764701A
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German (de)
French (fr)
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EP1661178A1 (en
Inventor
Christoph Fluhrer
Herbert Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102004004074A external-priority patent/DE102004004074A1/en
Application filed by Rohde and Schwarz GmbH and Co KG filed Critical Rohde and Schwarz GmbH and Co KG
Publication of EP1661178A1 publication Critical patent/EP1661178A1/en
Application granted granted Critical
Publication of EP1661178B1 publication Critical patent/EP1661178B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
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    • H01L2924/01072—Hafnium [Hf]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to an electronic component for mounting on the surface of a printed circuit board, in particular a power transistor for high-frequency applications.
  • Electronic components in particular power transistors, which are mounted on the surface of a printed circuit board are known. If these are components that have to be cooled during operation, then in addition to the contact surfaces of the component to the component to provide a mounting option by means of which a heat sink can be fixed to the device.
  • a heat sink can be fixed to the device.
  • Such a device is known from US-A-4 436 951. From the technical data sheet "MRF 1535T1 / D", Motorola Inc., 2002, z. Example, a high-frequency power transistor known which has a plastic housing. From the plastic housing laterally connecting elements of the transistor are led out and formed in the direction of the printed circuit board facing side of the device.
  • a contact surface is formed, so that the component can be fixed on the surface of a printed circuit board.
  • a flat surface is provided, which can be brought into abutment with a heat sink and on the side facing away from the circuit board of the component forms a part of the housing of the component.
  • recesses are provided in the housing made of plastic of the transistor, by means of which the transistor and the heat sink can be screwed together on the circuit board.
  • connection elements are disadvantageous.
  • the curved geometry of the connecting elements is a high parasitic inductance and possibly also generates parasitic capacitance, which reduce the usable frequency range.
  • a special heat sink is required in order to be able to reliably dissipate the amount of heat produced during the operation of such a power transistor.
  • This special heat sink also requires an immediate fixation on the housing of the device to ensure a good heat transfer.
  • the contact surfaces are arranged on connection elements such that the electronic component can be fastened with the contact surfaces on the surface of a printed circuit board.
  • a connecting element is formed so that it has formed on the side facing away from the printed circuit board an at least partially planar cooling surface, which can be brought into abutment against a heat sink.
  • This connection element is designed on the side facing the printed circuit board such that it has at least one raised region and at least one recessed region.
  • the contact surface of this first connection element is formed on such a raised region of the connection element.
  • the further connection element or the further connection elements are arranged in the recessed areas of the first connection element and the respective contact surface is formed thereon.
  • the further connection elements are formed in the at least one recessed region of the first connection element and that the contact surface of the first connection element is formed in a raised portion of the first connection element, the further connection elements can be guided in a straight line in the direction of the surface of the circuit board. This not only shortens the entire signal path from the contact point on the circuit board to the semiconductor substrate which is connected to the individual connection elements with bonding wires, but also results in comparison with known components which are provided for mounting on the surface of a printed circuit board , Improved geometry of the connection elements and thus a reduction of the parasitic inductances and capacitances.
  • connection elements are arranged within the projection of the flat cooling surface.
  • This can be a heat sink, which is in contact with the flat cooling surface on the circuit board z. B. by means of a spring clip, which presses the heat sink to the electronic component, without having to be considered in the corresponding area of the circuit board any existing solder pads for the contact surfaces of the connection elements.
  • the soldering surfaces are inevitably also within the projection of the flat cooling surface on the printed circuit board.
  • the coverage of all components of the component by the flat cooling surface which is made of a metallic material, already results in a shielding of the existing or existing high-frequency radiation in the component.
  • a further improvement of the shielding of the component is achieved in that the raised area surrounds the recessed area in an annular manner.
  • the flat cooling surface and the elevated area thus form a trough-like geometry, in which the remaining components of the device are used.
  • connection element which can be formed, for example, by milling a cuboidal blank, wherein a semiconductor substrate is arranged in each of the recessed areas and additionally the further connection elements required for each semiconductor substrate are formed in the corresponding recessed area are.
  • a symmetrical structure known e.g. as a "push-pull” or “push-pull” design, improves the behavior of the electronic device in the high frequency range and thus reduces the effort required for a matching network.
  • the first connection element is used jointly for all semiconductor substrates of the electronic component, wherein, according to a particularly preferred embodiment, the first connection element is a source connection of a field-effect transistor.
  • the first connection element is a source connection of a field-effect transistor.
  • the entire, facing away from the circuit board surface of the electronic component is formed as a flat cooling surface.
  • a difference between the level of the flat cooling surface and the adjacent housing component is formed, which is a flat resting prevents the heat sink on the flat surface.
  • first connection element 2 is formed with a rectangular base. Parallel to an outer edge of the rectangular base area, a first raised area 3.1, a second raised area 3.2 and a third raised area 3.3 are formed on the side of the electronic component 1 arranged on the printed circuit board after assembly. The three raised areas 3.1, 3.2 and 3.3 are distributed uniformly over the base area of the first connection element 2.
  • a recessed area 4 or 4 ' is formed in each case.
  • These recessed regions 4 and 4 ' are particularly advantageously formed in the first connection element 2, in that the two recessed regions 4 and 4' are formed by introducing parallel longitudinal grooves, for example by means of a milling cutter.
  • the recessed area 4 extends from the first raised area 3.1 to the second raised area 3.2 and has a base area 5.
  • a semiconductor substrate 6 is applied and connected to the first connection element 2 conductively.
  • the semiconductor substrate 6 may, for. B. a transistor element or a group of transistors of a field effect transistor whose acting as a source region with the base 5 is adhesively bonded. Instead of gluing another, known per se connection technique can be used.
  • connection element 7 and 8 are arranged on the base 5 of the recessed area 4.
  • these further connection elements 7 and 8 are not fixed in a conductive manner but isolated on the base surface 5 of the recessed area 4 of the first connection element 2.
  • the second connection element 7 is connected to the semiconductor substrate 6 by means of bonding wires 11.
  • the third connection element 8 is likewise connected to the drain by means of bonding wires 12.
  • the electronic component 1 has at the three elevated areas 3.1, 3.2 and 3.3 each have a contact surface 13.1, 13.2 and 13.3, which are connected to a corresponding soldering surface on the surface of the circuit board.
  • a second contact surface 9 is formed for making electrical contact between the electronic component 1 and the second connection element 1.
  • a corresponding third contact surface 10 is formed, which, like the second contact surface 9, is oriented in the same direction as the contact surfaces 13.1, 13.2 and 13.3.
  • the second contact surface 9 and the third contact surface 10 are also provided for soldering with a corresponding soldering surface on the surface of the circuit board.
  • the second connection element 7 and the third connection element 8 are arranged on the base surface 5 in the recessed region 4 of the first connection element 2 such that the side of the connection elements 7 and 8 oriented toward the outside of the first connection element 2 is flush with the respective one Side surface of the first connection element 2 terminates. It is likewise conceivable that the second connection element 7 and the third connection element 8 are arranged a distance from the outer boundary of the first connection element 2, set back on the base surface 5.
  • the relative height difference between the three elevated areas 3.1, 3.2 and 3.3 and the recessed areas 4 and 4 'disposed therebetween is chosen to be so large that the bonding wires 11 and 12 running in an arc run completely within the recessed area 4 and thus, for. B. can be protected by casting the recessed area 4 with a plastic material.
  • Fig. 1 The embodiment of Fig. 1 is shown in Fig. 2 again in a further perspective view, wherein the recessed areas 4 and 4 'already to protect the elements arranged therein with, for example, a plastic 14 and 14' are poured out. From the surface of the plastic 14 and 14 'oriented toward the printed circuit board, only the ones protrude Contact surfaces 13.1, 13.2 and 13.3 and the second contact surfaces 9 and 9 'and the third contact surfaces 10 and 10' out.
  • connection elements 7 and 7 ' which face to the side are also not covered by the plastic covering.
  • connection elements 7 and 8 can also be offset in the direction of the center of the first connection element 2, so that of the second and third connection elements 7 and 8 exclusively the respective contact surfaces 9 and 10 through the Surface of the plastic cladding protrude.
  • the average contact surface 13.2 can be used for electrical contacting.
  • the two remaining contact surfaces 13.1 and 13.2 of the first connection element 2 can then be placed in a non-conductive region of the surface of the circuit board and serve to absorb mechanical stresses that arise, for example, by attaching a heat sink on the plane in the figure lying flat cooling surface.
  • FIG. 3 a further embodiment of an electronic component 1 'is shown, wherein the matching with the elements of the first embodiment of Fig. 1 elements are provided with identical reference numerals and is omitted to avoid unnecessary repetition on a re-description.
  • the recessed areas 4 and 4 ' are completely surrounded by raised areas.
  • additional elevated areas 3.4 and 3.5 are provided, the on opposite outer sides of the first connection element 2 ', the elevated areas 3.1, 3.2 and 3.3 connect together. Due to the raised areas 3.1, 3.2, 3.4 and 3.5 so that the recessed area 4 is completely enclosed in a ring. Accordingly, by the elevated areas 3.2, 3.3, 3.4 and 3.5. also the second recessed area 4 'is enclosed surrounded.
  • the only side of the electronic component 1 'that side is not enveloped by a conductive material, which faces the surface of the circuit board.
  • the electronic component 1 'mounted on the printed circuit board therefore does not require any additional shielding against high-frequency radiation since all the elements, in particular the semiconductor substrates 6 and 6', are surrounded by the first connecting element 2 '.
  • Fig. 4 the electronic component 1 'of Fig. 3 is shown again in a perspective view, wherein the two recessed areas 4 and 4' are shed again. From the material used to cast the recessed areas 4 and 4 'protrude only the contact surfaces of the raised areas 3.1, 3.2, 3.3, 3.4 and 3.5 and the second contact surfaces 9 and 9' and third contact surfaces 10 and 10 'out to them with appropriate To connect solder pads on the circuit board.
  • the raised portion 13.2 is absent. Otherwise, the structure corresponds to the second embodiment.
  • a large, recessed area 4 is formed in which both the semiconductor substrate 6 and the further semiconductor substrate 6 'and the respective second connection element 7 and 7' and the respective third connection element 8 and 8 'are arranged together are.
  • the large recessed area 4 and the elements arranged therein are jointly surrounded by the raised areas 3.1, 3.3, 3.4 and 3.5 annular and thus again well protected against high-frequency radiation.
  • FIG. 6 shows the contact surfaces 9, 9 ', 10, 10' and 13.1, 13.3, 13.4 and 13.5 of the electronic component 1 "of the third exemplary embodiment that protrude from a plastic sheath arranged in the single recessed area 4.
  • FIG. 7 The arrangement of the electronic component 1 according to the invention, as has been explained in detail with reference to FIGS. 1 and 2, with regard to the mounting on a printed circuit board 16 is illustrated in FIG. 7.
  • the flat cooling surface 15 is identical to the outer dimensions of the entire electronic component 1.
  • all other connection elements 7 and 7 'and 8 or 8' within the Projection of the outer periphery of the flat cooling surface 15 on the surface of the circuit board 16 is arranged.
  • the illustrated embodiment of the planar cooling surface 15 on the electronic component 1 corresponds to the formation of the planar cooling surfaces on the electronic components 1 and 1 '' of the second and third embodiment.
  • a likewise flat surface of any, exemplified heat sink 20, which is suitable for a fixations on the circuit board, can be placed.
  • standard heatsink 20 can be placed on the electronic component 1 and held by a spring clip 21 in contact with the cooling surface 15.
  • FIG. 7 shows first solder surfaces 17.1, 17.2 and 17.3 on which the contact surfaces 13.1, 13.2 and 13.3 of the corresponding raised regions 3.1, 3.2 and 3.3 of the first connection element 2 are placed. Accordingly, second solder surfaces 18 and 18 'are provided for the second connection elements 7 and 7'. Finally, for the third connection elements 8 and 8 ', which are not visible in FIG. 7, third solder surfaces 19 and 19' are provided on the surface of the printed circuit board 16.
  • each raised region 3.1, 3.2 and 3.3 it is not necessary for each raised region 3.1, 3.2 and 3.3 to have a corresponding soldering surface 17.1, 17.2 and 17.3 for soldering to the respective contact surface 13.1, 13.2 and 13.3.
  • the formation of the flat cooling surface 15 over the entire area occupied by the electronic component 1 not only enables the use of standard heat sinks, but also ensures a particularly large contact area between the heat sink 20 and the electronic component 1.
  • the design and manufacture of high-performance heat sinks which have a special, matched to the design of the housing of a high-frequency transistor geometry is not required.
  • the component 1 or 1 'or 1 "according to the invention also has the advantage that only a minor influence of the geometry of the further connection elements 7, 7' or 8, 8 'occurs because parasitic inductances and capacitances only occur to a small extent.
  • heat sinks of microprocessors that are normally used in computer systems are used as such standard heat sinks. There they are used for cooling the central processing unit, e.g. an Intel Pentium or an AMD Athlon used.
  • the central processing unit e.g. an Intel Pentium or an AMD Athlon used.
  • microprocessor heat sinks have a square footprint of about 80 mm edge length.
  • a heat sink extends beyond the dimensions of the power transistor to be cooled with a typical rectangular geometry with edge lengths of 15 mm and 30 mm considerably. Due to the arrangement on the electronic component 1 according to the invention a sufficient cooling capacity is still ensured precisely because of this size together with the higher compared to the computer system temperature difference between the component and the environment.
  • connection elements of the component 1 according to the invention are guided largely in a straight line in the direction of the printed circuit board. Only for fixing the bonding wires, a slight deviation from the straight geometry is required, so that the connection elements have an L-shaped geometry whose inductive character is negligible.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to an electronic component comprising at least two connection elements (2, 7, 8), each provided with at least one contact surface (13.1, 13.2, 13.3, 9, 10) which is used to fix the electronic component (1) to a surface of a printed circuit board. An at least partially plane cooling surface is formed on the first connection element (2), for placing on a cooling body that is oriented in the direction of the side of the electronic component (1) opposing the printed circuit board. The first connection element (2) has at least one raised area (3.1, 3.2, 3.3) on the side thereof facing the printed circuit board, on which the contact surface (13.1, 13.2, 13.3) of the first connection element (2) is formed. Said first connection element (2) also has at least one recessed area (4, 4') in which the at least one other connection element (7, 7'; 8, 8') is arranged.

Description

Die Erfindung betrifft ein elektronisches Bauelement zur Montage auf der Oberfläche einer Leiterplatte, insbesondere einen Leistungstransistor für Hochfrequenzanwendungen.The invention relates to an electronic component for mounting on the surface of a printed circuit board, in particular a power transistor for high-frequency applications.

Elektronische Bauelemente, insbesondere Leistungstransistoren, die auf der Oberfläche einer Leiterplatte montiert werden, sind bekannt. Wenn es sich dabei um Bauelemente handelt, welche während des Betriebs gekühlt werden müssen, so ist zusätzlich zu den Kontaktflächen des Bauelements an dem Bauelement eine Befestigungsmöglichkeit vorzusehen, mittels derer ein Kühlkörper an dem Bauelement fixiert werden kann. Ein solches Bauelement ist aus der Patentschrift US-A-4 436 951 bekannt. Aus dem technischen Datenblatt "MRF 1535T1/D", Motorola Inc., 2002, ist z. B. ein Hochfrequenz-Leistungstransistor bekannt, der ein Kunststoffgehäuse aufweist. Aus dem Kunststoffgehäuse sind seitlich Anschlusselemente des Transistors herausgeführt und in Richtung der der Leiterplatte zugewandten Seite des Bauelements umgeformt. An den umgelegten Enden der Anschlusselemente ist jeweils eine Kontaktfläche ausgebildet, so dass das Bauelement auf der Oberfläche einer Leiterplatte fixiert werden kann. Auf der gegenüberliegenden Seite des Bauelements ist eine ebene Fläche vorgesehen, die mit einem Kühlkörper in Anlage gebracht werden kann und auf der der Leiterplatte abgewandten Seite des Bauelements einen Teil des Gehäusses des Bauteils ausbildet. Um den Kühlkörper an dieser Anlagefläche zu fixieren, sind in dem aus Kunststoff gefertigen Gehäuse des Transistors Aussparungen vorgesehen, mittels derer der Transistor und der Kühlkörper gemeinsam auf der Leiterplatte verschraubt werden können.Electronic components, in particular power transistors, which are mounted on the surface of a printed circuit board are known. If these are components that have to be cooled during operation, then in addition to the contact surfaces of the component to the component to provide a mounting option by means of which a heat sink can be fixed to the device. Such a device is known from US-A-4 436 951. From the technical data sheet "MRF 1535T1 / D", Motorola Inc., 2002, z. Example, a high-frequency power transistor known which has a plastic housing. From the plastic housing laterally connecting elements of the transistor are led out and formed in the direction of the printed circuit board facing side of the device. At the folded ends of the connection elements in each case a contact surface is formed, so that the component can be fixed on the surface of a printed circuit board. On the opposite side of the device, a flat surface is provided, which can be brought into abutment with a heat sink and on the side facing away from the circuit board of the component forms a part of the housing of the component. In order to fix the heat sink to this contact surface, recesses are provided in the housing made of plastic of the transistor, by means of which the transistor and the heat sink can be screwed together on the circuit board.

Insbesondere für Anwendungen im Hochfrequenz-Bereich ist das Umlegen der Anschlusselemente nachteilig. Durch die gekrümmte Geometrie der Anschlusselemente wird eine hohe parasitäre Induktivität und ggf. Auch parasitäre Kapazität erzeugt, die den nutzbaren Frequenzbereich reduzieren. Ferner wird durch die nur geringe Kontaktfläche zwischen dem Kühlkörper und dem Transistor ein spezieller Kühlkörper benötigt, um die im Betrieb eines solchen Leistungstransistors anfallende Wärmemenge zuverlässig ableiten zu können. Dieser spezielle Kühlkörper erfordert darüber hinaus eine unmittelbare Fixierung an dem Gehäuse des Bauelements um einen guten Wärmeübergang sicherzustellen.In particular, for applications in the high-frequency range, the folding of the connection elements is disadvantageous. By the curved geometry of the connecting elements is a high parasitic inductance and possibly also generates parasitic capacitance, which reduce the usable frequency range. Furthermore, due to the only small contact area between the heat sink and the transistor, a special heat sink is required in order to be able to reliably dissipate the amount of heat produced during the operation of such a power transistor. This special heat sink also requires an immediate fixation on the housing of the device to ensure a good heat transfer.

Es ist die Aufgabe der Erfindung, ein elektronisches Bauelement zu schaffen, welches eine einfache Montage auf der Oberfläche einer Leiterplatte und eine vereinfachte Anordnung eines Kühlkörpers ermöglicht, wobei das Auftreten einer parasitären Induktivität und/oder Kapazität vermieden wird.It is the object of the invention to provide an electronic component which allows easy mounting on the surface of a printed circuit board and a simplified arrangement of a heat sink, wherein the occurrence of a parasitic inductance and / or capacitance is avoided.

Die Aufgabe wird durch das erfindungsgemäße Bauelement nach Anspruch 1 gelöst.The object is achieved by the device according to the invention according to claim 1.

Bei dem erfindungsgemäßen Bauelement sind die Kontaktflächen so an Anschlusselementen angeordnet, dass das elektronische Bauelement mit den Kontaktflächen auf der Oberfläche einer Leiterplatte befestigt werden kann. Dabei ist ein Anschlusselemente so ausgebildet, dass es auf der der Leiterplatte abgewandten Seite eine zumindest teilweise ebene Kühlfläche ausgebildet hat, welche in Anlage an einen Kühlkörper gebracht werden kann. Dieses Anschlusselemente ist auf der der Leiterplatte zugewandtem Seite so ausgebildet, dass es mindestens einen erhöhten Bereich und mindestens einen vertieften Bereich aufweist. Die Kontaktfläche dieses ersten Anschlusselements ist an einem solchen erhöhten Bereich des Anschlusselements ausgebildet. Das weitere Anschlusselements bzw. die weiteren Anschlusselemente sind in dem oder den vertieften Bereichen des ersten Anschlusselements angeordnet und die jeweilige Kontaktfläche ist daran ausgebildet.In the case of the component according to the invention, the contact surfaces are arranged on connection elements such that the electronic component can be fastened with the contact surfaces on the surface of a printed circuit board. In this case, a connecting element is formed so that it has formed on the side facing away from the printed circuit board an at least partially planar cooling surface, which can be brought into abutment against a heat sink. This connection element is designed on the side facing the printed circuit board such that it has at least one raised region and at least one recessed region. The contact surface of this first connection element is formed on such a raised region of the connection element. The further connection element or the further connection elements are arranged in the recessed areas of the first connection element and the respective contact surface is formed thereon.

Dadurch, dass die weiteren Anschlusselemente in dem zumindest einen vertieften Bereich des ersten Anschlusselements ausgebildet sind und dass die Kontaktfläche des ersten Anschlusselements in einem erhöhten Bereich des ersten Anschlusselements ausgebildet ist, können die weiteren Anschlusselemente geradlinig in Richtung der Oberfläche der Leiterplatte geführt werden. Damit verkürzt sich nicht nur der gesamte Signalweg von der Kontaktstelle auf der Leiterplatte bis hin zu dem Halbleitersubstrat, das mit Bonddrähten mit den einzelnen Anschlusselementen verbunden ist, sondern es ergibt sich auch eine gegenüber bekannten Bauelementen, die zur Montage auf der Oberfläche einer Leiterplatte vorgesehen sind, verbesserte Geometrie der Anschlusselemente und damit eine Reduzierung der parasitären Induktivitäten und Kapazitäten.Characterized in that the further connection elements are formed in the at least one recessed region of the first connection element and that the contact surface of the first connection element is formed in a raised portion of the first connection element, the further connection elements can be guided in a straight line in the direction of the surface of the circuit board. This not only shortens the entire signal path from the contact point on the circuit board to the semiconductor substrate which is connected to the individual connection elements with bonding wires, but also results in comparison with known components which are provided for mounting on the surface of a printed circuit board , Improved geometry of the connection elements and thus a reduction of the parasitic inductances and capacitances.

In den Unteransprüchen sind vorteilhafte Weiterbildungen des erfindungsgemäßen elektronischen Bauelements ausgeführt.In the dependent claims advantageous developments of the electronic component according to the invention are carried out.

Die Anschlusselemente sind innerhalb der Projektion der ebenen Kühlfläche angeordnet. Damit lässt sich ein Kühlkörper, der mit der ebenen Kühlfläche in Anlage ist, auf der Leiterplatte z. B. mittels einer Federspange befestigen, die den Kühlkörper auf das elektronische Bauelement drückt, ohne dass in dem entsprechenden Bereich der Leiterplatte eventuell vorhandene Lötflächen für die Kontaktflächen der Anschlusselemente berücksichtigt werden müssen. Die Lötflächen liegen durch die Anordnung der Anschlusselemente zwangsläufig ebenfalls innerhalb der Projektion der ebenen Kühlfläche auf der Leiterplatte. Zudem ergibt sich durch die Abdeckung sämtlicher Bauteile des Bauelements durch die ebene Kühlfläche, die aus einem metallischen Material gefertigt ist, bereits eine Abschirmung der im Bauelement entstehenden bzw. vorhandenen hochfrequenten Strahlung.The connection elements are arranged within the projection of the flat cooling surface. This can be a heat sink, which is in contact with the flat cooling surface on the circuit board z. B. by means of a spring clip, which presses the heat sink to the electronic component, without having to be considered in the corresponding area of the circuit board any existing solder pads for the contact surfaces of the connection elements. Due to the arrangement of the connecting elements, the soldering surfaces are inevitably also within the projection of the flat cooling surface on the printed circuit board. In addition, the coverage of all components of the component by the flat cooling surface, which is made of a metallic material, already results in a shielding of the existing or existing high-frequency radiation in the component.

Eine weitere Verbesserung der Abschirmung des Bauelements wird dadurch erreicht, dass der erhöhte Bereich den vertieften Bereich ringsörmig geschlossen umgibt. Die ebene Kühlfläche und der erhöhte Bereich bilden damit eine wannenartige Geometrie aus, in die die übrigen Bauteile des Bauelements eingesetzt werden. Durch das Aufsetzen des gesamten Bauelements auf die Leiterplatte ergibt sich damit eine Kapselung des Bauelements durch das metallisch ausgeführte erste Anschlusselement und damit eine Abschirmung durch das elektronische Bauelement selbst, ohne dass eine zusätzliche Abdeckung erforderlich ist.A further improvement of the shielding of the component is achieved in that the raised area surrounds the recessed area in an annular manner. The flat cooling surface and the elevated area thus form a trough-like geometry, in which the remaining components of the device are used. By placing the entire component on the circuit board, this results in an encapsulation of the device by the metallically executed first connection element and thus a shield by the electronic component itself, without any additional cover is required.

Weiterhin ist es vorteilhaft, in dem ersten Anschlusselement mehrere vertiefte Bereiche auszubilden, die beispielsweise durch Ausfräsen eines quaderförmigen Rohlings ausgebildet werden können, wobei in jedem der vertieften Bereiche ein Halbleitersubstrat angeordnet ist und zusätzlich die für jedes Halbleitersubstrat erforderlichen weiteren Anschlusselemente in dem entsprechenden vertieften Bereich ausgebildet sind. Ein auf diese Weise symmetrischer Aufbau, bekannt z.B. als "Push-Pull-" oder "Gegentakt-Aufbau", verbessert das Verhalten des elektronischen Bauelements im Hochfrequenzbereich und reduziert damit den Aufwand, der für ein Anpassnetzwerk erforderlich ist.Furthermore, it is advantageous to form a plurality of recessed areas in the first connection element, which can be formed, for example, by milling a cuboidal blank, wherein a semiconductor substrate is arranged in each of the recessed areas and additionally the further connection elements required for each semiconductor substrate are formed in the corresponding recessed area are. A symmetrical structure, known e.g. as a "push-pull" or "push-pull" design, improves the behavior of the electronic device in the high frequency range and thus reduces the effort required for a matching network.

Anders als die weiteren Anschlusselemente wird das erste Anschlusselement gemeinsam für sämtliche Halbleitersubstrate des elektronischen Bauelements genutzt, wobei gemäß einer besonders bevorzugten Ausführungsform das erste Anschlusselement ein Source-Anschluss eines Feldeffekttransistors ist. Durch das gemeinsame Nutzen des ersten Anschlusselements als Source-Anschluss für einen Feldeffekttransistor mit mehreren Halbleitersubstraten wird in vorteilhafter Weise vermieden, dass zwischen den jeweiligen Source-Anschlüssen der einzelnen Halbleitersubstrate Potenzialdifferenzen auftreten.Unlike the other connection elements, the first connection element is used jointly for all semiconductor substrates of the electronic component, wherein, according to a particularly preferred embodiment, the first connection element is a source connection of a field-effect transistor. By sharing the first connection element as a source terminal for a field effect transistor having a plurality of semiconductor substrates, it is advantageously avoided that potential differences occur between the respective source terminals of the individual semiconductor substrates.

Weiterhin ist es vorteilhaft, die gesamte, von der Leiterplatte abgewandte Oberfläche des elektronischen Bauelements als ebene Kühlfläche auszubilden. Neben der großen Berührungsfläche zwischen dem Kühlkörper und dem elektronischen Bauelement, die den Wärmeübergang begünstigt, wird damit verhindert, dass beim Wärmeübergang zwischen der ebenen Fläche und einem angrenzenden Gehäusebauteil eine Differenz zwischen dem Niveau der ebenen Kühlfläche und dem angrenzenden Gehäusebauteil entsteht, die ein flächiges Aufliegen des Kühlkörpers auf der ebenen Fläche verhindert.Furthermore, it is advantageous to form the entire, facing away from the circuit board surface of the electronic component as a flat cooling surface. In addition to the large contact area between the heat sink and the electronic component, which favors the heat transfer, it is prevented that the heat transfer between the flat surface and an adjacent housing component, a difference between the level of the flat cooling surface and the adjacent housing component is formed, which is a flat resting prevents the heat sink on the flat surface.

Das erfindungsgemäße elektronische Bauelement ist in der Zeichnung dargestellt und wird in der nachfolgenden Beschreibung näher erläutert. Es zeigen:

Fig. 1
ein erstes Ausführungsbeispiel für ein erfindungsgemäßes elektronisches Bauelement,
Fig. 2
eine schematische Darstellung der Anordnung der Kontaktflächen des ersten Ausführungsbeispiels eines elektronischen Bauelements,
Fig. 3
ein zweites Ausführungsbeispiel für ein erfindungsgemäßes elektronisches Bauelement,
Fig. 4
eine schematische Darstellung der Anordnung der Kontaktflächen des zweiten Ausführungsbeispiels eines elektronischen Bauelements,
Fig. 5
ein drittes Ausführungsbeispiel für ein erfindungsgemäßes elektronisches Bauelement,
Fig. 6
eine schematische Darstellung der Anordnung der Kontaktflächen des dritten Ausführungsbeispiels eines erfindungsgemäßen elektronischen Bauelements und
Fig. 7
eine beispielhafte Darstellung von auf einer Leiterplatte angeordneten Lötflächen zur Aufnahme des ersten Ausführungsbeispiels des erfindungsgemäßen Bauelements sowie eine beispielhafte Darstellung eines Kühlkörpers.
The electronic component according to the invention is shown in the drawing and will be explained in more detail in the following description. Show it:
Fig. 1
a first embodiment of an inventive electronic component,
Fig. 2
a schematic representation of the arrangement of the contact surfaces of the first embodiment of an electronic component,
Fig. 3
A second embodiment of an inventive electronic component,
Fig. 4
a schematic representation of the arrangement of the contact surfaces of the second embodiment of an electronic component,
Fig. 5
A third embodiment of an inventive electronic component,
Fig. 6
a schematic representation of the arrangement of the contact surfaces of the third embodiment of an electronic component according to the invention and
Fig. 7
an exemplary representation of arranged on a circuit board solder pads for receiving the first embodiment of the device according to the invention and an exemplary illustration of a heat sink.

Fig. 1 zeigt ein erstes Ausführungsbeispiel eines erfindungsgemäßen elektronischen Bauelements 1. Ein wesentlicher Teil des Gehäuses des elektronischen Bauelements 1 wird dabei von einem ersten Anschlusselement 2 gebildet. In dem ersten Ausführungsbeispiel ist das erste Anschlusselement 2 mit einer rechteckigen Grundfläche ausgebildet. Parallel zu einer Außenkante der rechteckigen Grundfläche sind an der nach der Montage auf der Leiterplatte angeordneten Seite des elektronischen Bauelements 1 ein erster erhöhter Bereich 3.1, ein zweiter erhöhter Bereich 3.2 und ein dritter erhöhter Bereich 3.3 ausgebildet. Die drei erhöhten Bereiche 3.1, 3.2 und 3.3 sind dabei gleichmäßig über die Grundfläche des ersten Anschlusselements 2 verteilt.1 shows a first exemplary embodiment of an electronic component 1 according to the invention. A substantial part of the housing of the electronic component 1 is formed by a first connection element 2. In the first embodiment, the first connection element 2 is formed with a rectangular base. Parallel to an outer edge of the rectangular base area, a first raised area 3.1, a second raised area 3.2 and a third raised area 3.3 are formed on the side of the electronic component 1 arranged on the printed circuit board after assembly. The three raised areas 3.1, 3.2 and 3.3 are distributed uniformly over the base area of the first connection element 2.

Zwischen den benachbarten erhöhten Bereichen, also zwischen dem ersten erhöhten Bereich 3.1 und dem zweiten erhöhten Bereich 3.2 bzw. dem zweiten erhöhten Bereich 3.2 und dritten erhöhten Bereich 3.3 ist jeweils ein vertiefter Bereich 4 bzw. 4' ausgebildet. Besonders vorteilhaft werden diese vertieften Bereiche 4 und 4' in dem ersten Anschlusselement 2 ausgebildet, indem die beiden vertieften Bereiche 4 und 4' durch Einbringen von parallelen Längsnuten beispielsweise mittels einer Fräse ausgebildet werden.Between the adjacent raised areas, ie between the first raised area 3.1 and the second raised area 3.2 or the second raised area 3.2 and third raised area 3.3, a recessed area 4 or 4 'is formed in each case. These recessed regions 4 and 4 'are particularly advantageously formed in the first connection element 2, in that the two recessed regions 4 and 4' are formed by introducing parallel longitudinal grooves, for example by means of a milling cutter.

Im folgenden wird der Einfachheit halber lediglich auf die Anordnung von weiteren Elementen in dem ersten der beiden vertieften Bereiche 4 eingegangen. Die Anordnung in dem zweiten der vertieften Bereiche 4' entspricht der des vertieften Bereichs 4. Sich entsprechende Elemente der beiden Bereiche sind in dem zweiten vertieften Bereich 4' mit gestrichenen Bezugszeichen versehen.In the following, for the sake of simplicity, only the arrangement of further elements in the first of the two recessed areas 4 will be discussed. The arrangement in the second of the recessed areas 4 'corresponds to that of the recessed area 4. Corresponding elements of the two areas are provided with primed reference numerals in the second recessed area 4'.

Der vertiefte Bereich 4 erstreckt sich von dem ersten erhöhten Bereich 3.1 bis zu dem zweiten erhöhten Bereich 3.2 und weist eine Grundfläche 5 auf. Auf dieser Grundfläche 5 ist ein Halbleitersubstrat 6 aufgebracht und mit dem ersten Anschlusselement 2 leitend verbunden. Das Halbleitersubstrat 6 kann z. B. ein Transistorelement bzw. eine Gruppe von Transistoren eines Feldeffekttransistors sein, dessen als Source wirkender Bereich mit der Grundfläche 5 leitend verklebt ist. Anstelle des Klebens kann auch eine andere, an sich bekannte Verbindungstechnik eingesetzt werden.The recessed area 4 extends from the first raised area 3.1 to the second raised area 3.2 and has a base area 5. On this base 5, a semiconductor substrate 6 is applied and connected to the first connection element 2 conductively. The semiconductor substrate 6 may, for. B. a transistor element or a group of transistors of a field effect transistor whose acting as a source region with the base 5 is adhesively bonded. Instead of gluing another, known per se connection technique can be used.

Ebenfalls auf der Grundfläche 5 des vertieften Bereichs 4 ist ein zweites Anschlusselement 7 und ein drittes Anschlusselement 8 angeordnet. Im Gegensatz zu dem Halbleitersubstrat 6 sind diese weiteren Anschlusselemente 7 und 8 jedoch nicht leitend sondern isoliert auf der Grundfläche 5 des vertieften Bereichs 4 des ersten Anschlusselements 2 befestigt. Zur Kontaktierung z.B. des Gate ist das zweite Anschlusselement 7 mittels Bonddrähten 11 mit dem Halbleitersubstrat 6 verbunden. Dementsprechend ist das dritte Anschlusselement 8 ebenfalls mittels Bonddrähten 12 mit dem Drain verbunden.Also on the base 5 of the recessed area 4, a second connection element 7 and a third connection element 8 is arranged. In contrast to the semiconductor substrate 6, however, these further connection elements 7 and 8 are not fixed in a conductive manner but isolated on the base surface 5 of the recessed area 4 of the first connection element 2. For contacting e.g. of the gate, the second connection element 7 is connected to the semiconductor substrate 6 by means of bonding wires 11. Accordingly, the third connection element 8 is likewise connected to the drain by means of bonding wires 12.

Das elektronische Bauelement 1 weist an den drei erhöhten Bereichen 3.1, 3.2 und 3.3 jeweils eine Kontaktfläche 13.1, 13.2 und 13.3 auf, welche mit einer korrespondierenden Lötfläche auf der Oberfläche der Leiterplatte verbunden werden. Zudem ist zur elektrischen Kontaktierung des elektronischen Bauelements 1 an dem zweiten Anschlusselement 1 eine zweite Kontaktfläche 9 ausgebildet. An dem dritten Anschlusselement 8 ist eine entsprechende dritte Kontaktfläche 10 ausgebildet, die wie die zweite Kontaktfläche 9 in dieselbe Richtung wie die Kontaktflächen 13.1, 13.2 und 13.3 orientiert ist. Die zweite Kontaktfläche 9 und die dritte Kontaktfläche 10 sind ebenfalls zum Verlöten mit einer korrespondierenden Lötfläche auf der Oberfläche der Leiterplatte vorgesehen.The electronic component 1 has at the three elevated areas 3.1, 3.2 and 3.3 each have a contact surface 13.1, 13.2 and 13.3, which are connected to a corresponding soldering surface on the surface of the circuit board. In addition, a second contact surface 9 is formed for making electrical contact between the electronic component 1 and the second connection element 1. At the third connection element 8, a corresponding third contact surface 10 is formed, which, like the second contact surface 9, is oriented in the same direction as the contact surfaces 13.1, 13.2 and 13.3. The second contact surface 9 and the third contact surface 10 are also provided for soldering with a corresponding soldering surface on the surface of the circuit board.

In dem dargestellten ersten Ausführungsbeispiel sind das zweite Anschlusselement 7 und das dritte Anschlusselement 8 so auf der Grundfläche 5 in dem vertieften Bereich 4 des ersten Anschlusselements 2 angeordnet, dass die zur Außenseite des ersten Anschlusselements 2 orientierte Seite der Anschlusselemente 7 und 8 bündig mit der jeweiligen Seitenfläche des ersten Anschlusselements 2 abschließt. Ebenso ist es denkbar, dass das zweite Anschlusselement 7 und das dritte Anschlusselement 8 ein Stück von der äußeren Begrenzung des ersten Anschlusselements 2 zurückversetzt auf der Grundfläche 5 angeordnet sind.In the illustrated first exemplary embodiment, the second connection element 7 and the third connection element 8 are arranged on the base surface 5 in the recessed region 4 of the first connection element 2 such that the side of the connection elements 7 and 8 oriented toward the outside of the first connection element 2 is flush with the respective one Side surface of the first connection element 2 terminates. It is likewise conceivable that the second connection element 7 and the third connection element 8 are arranged a distance from the outer boundary of the first connection element 2, set back on the base surface 5.

Die relative Höhendifferenz zwischen den drei erhöhten Bereichen 3.1, 3.2 und 3.3 und den jeweils dazwischen angeordneten vertieften Bereichen 4 und 4' ist so groß gewählt, dass die in einem Bogen verlaufenden Bonddrähte 11 und 12 vollständig innerhalb des vertieften Bereichs 4 verlaufen und damit z. B. durch einen Vergießen des vertieften Bereichs 4 mit einem Kunststoffmaterial geschützt werden können. Im dargestellten Ausführungsbeispiel wird die nötige Höhe für das zweite Anschlusselement 7 und das dritte Anschlusselement 8, die benötigt wird, um die zweite Kontaktfläche 9 und die dritte Kontaktfläche 10 auf dasselbe Niveau wie die Kontaktflächen 13.1, 13.2 und 13.3 zu bringen, dadurch erreicht, dass die beiden Anschlusselemente 7 und 8 eine L-förmige Geometrie aufweisen, deren flacher, auf der Grundfläche 5 angeordneter Bereich über die Bonddrähte 11 und 12 mit dem Gate oder Drain verbunden sind.The relative height difference between the three elevated areas 3.1, 3.2 and 3.3 and the recessed areas 4 and 4 'disposed therebetween is chosen to be so large that the bonding wires 11 and 12 running in an arc run completely within the recessed area 4 and thus, for. B. can be protected by casting the recessed area 4 with a plastic material. In the illustrated embodiment, the necessary height for the second connection element 7 and the third connection element 8, which is required to bring the second contact surface 9 and the third contact surface 10 to the same level as the contact surfaces 13.1, 13.2 and 13.3, achieved in that the two connection elements 7 and 8 have an L-shaped geometry whose flat area arranged on the base area 5 is connected to the gate or drain via the bonding wires 11 and 12.

Das Ausführungsbeispiel aus Fig. 1 ist in Fig. 2 noch einmal in einer weiteren perspektivischen Darstellung dargestellt, wobei die vertieften Bereiche 4 und 4' bereits zum Schutz der darin angeordneten Elemente mit beispielsweise einem Kunststoff 14 und 14' ausgegossen sind. Aus der zu der Leiterplatte hin orientierten Oberfläche des Kunststoffs 14 und 14' ragen lediglich die Kontaktflächen 13.1, 13.2 und 13.3 sowie die zweiten Kontaktflächen 9 und 9' und die dritten Kontaktflächen 10 und 10' heraus.The embodiment of Fig. 1 is shown in Fig. 2 again in a further perspective view, wherein the recessed areas 4 and 4 'already to protect the elements arranged therein with, for example, a plastic 14 and 14' are poured out. From the surface of the plastic 14 and 14 'oriented toward the printed circuit board, only the ones protrude Contact surfaces 13.1, 13.2 and 13.3 and the second contact surfaces 9 and 9 'and the third contact surfaces 10 and 10' out.

In dem dargestellten Ausführungsbeispiel ist ferner zu erkennen, dass auch die zur Seite zeigenden Begrenzungsflächen der Anschlusselemente 7 und 7' von der Kunststoffumhüllung nicht verdeckt werden. Wie bei der Beschreibung der Fig. 1 bereits erläutert wurde, können die Anschlusselemente 7 und 8 auch in Richtung der Mitte des ersten Anschlusselements 2 versetzt werden, so dass von den zweiten und dritten Anschlusselementen 7 und 8 ausschließlich die jeweiligen Kontaktflächen 9 und 10 durch die Oberfläche der Kunststoffumhüllung ragen.In the illustrated embodiment, it can also be seen that the boundary surfaces of the connection elements 7 and 7 'which face to the side are also not covered by the plastic covering. As has already been explained in the description of FIG. 1, the connection elements 7 and 8 can also be offset in the direction of the center of the first connection element 2, so that of the second and third connection elements 7 and 8 exclusively the respective contact surfaces 9 and 10 through the Surface of the plastic cladding protrude.

Anstelle der Nutzung der drei Kontaktflächen 13.1, 13.2 und 13.3 des ersten Anschlusselements 2 kann zur elektrischen Kontaktierung auch beispielsweise lediglich die mittlere Kontaktfläche 13.2 verwendet werden. Die beiden übrigen Kontaktflächen 13.1 und 13.2 des ersten Anschlusselements 2 können dann in einem nicht leitenden Bereich der Oberfläche der Leiterplatte aufgesetzt werden und zum Aufnehmen mechanischer Belastungen dienen, die beispielsweise durch das Anbringen eines Kühlkörpers auf der in der Figur verdeckt liegenden ebenen Kühlfläche entstehen.Instead of using the three contact surfaces 13.1, 13.2 and 13.3 of the first connection element 2, for example, only the average contact surface 13.2 can be used for electrical contacting. The two remaining contact surfaces 13.1 and 13.2 of the first connection element 2 can then be placed in a non-conductive region of the surface of the circuit board and serve to absorb mechanical stresses that arise, for example, by attaching a heat sink on the plane in the figure lying flat cooling surface.

In Fig. 3 ist ein weiteres Ausführungsbeispiel für ein elektronisches Bauelement 1' dargestellt, wobei die mit den Elementen des ersten Ausführungsbeispiels aus Fig. 1 übereinstimmenden Elemente mit identischen Bezugszeichen versehen sind und zur Vermeidung unnötiger Wiederholungen auf eine erneute Beschreibung verzichtet wird.In Fig. 3, a further embodiment of an electronic component 1 'is shown, wherein the matching with the elements of the first embodiment of Fig. 1 elements are provided with identical reference numerals and is omitted to avoid unnecessary repetition on a re-description.

Im Unterschied zu dem ersten Ausführungsbeispiel sind in der Fig. 3 die vertieften Bereiche 4 und 4' vollständig von erhöhten Bereichen umgeben. Neben den bereits aus der Fig. 1 bekannten erhöhten Bereichen 3.1, 3.2 und 3.3 sind daher weitere erhöhte Bereiche 3.4 und 3.5 vorgesehen, die an gegenüberliegenden Außenseiten des ersten Anschlusselements 2' die erhöhten Bereiche 3.1, 3.2 und 3.3 miteinander verbinden. Durch die erhöhten Bereiche 3.1, 3.2, 3.4 und 3.5 wird damit der vertiefte Bereich 4 vollständig ringförmig umschlossen. Dementsprechend ist durch die erhöhten Bereiche 3.2, 3.3, 3.4 und 3.5. auch der zweite vertiefte Bereich 4' geschlossen umgeben. Damit ist als einzige Seite des elektronischen Bauelements 1' diejenige Seite nicht von einem leitenden Material umhüllt, die der Oberfläche der Leiterplatte zugewandt ist.In contrast to the first embodiment, in FIG. 3, the recessed areas 4 and 4 'are completely surrounded by raised areas. In addition to the already known from Fig. 1 elevated areas 3.1, 3.2 and 3.3, therefore, additional elevated areas 3.4 and 3.5 are provided, the on opposite outer sides of the first connection element 2 ', the elevated areas 3.1, 3.2 and 3.3 connect together. Due to the raised areas 3.1, 3.2, 3.4 and 3.5 so that the recessed area 4 is completely enclosed in a ring. Accordingly, by the elevated areas 3.2, 3.3, 3.4 and 3.5. also the second recessed area 4 'is enclosed surrounded. Thus, as the only side of the electronic component 1 'that side is not enveloped by a conductive material, which faces the surface of the circuit board.

Das auf der Leiterplatte montierte elektronische Bauelement 1' benötigt daher keine zusätzliche Abschirmung gegen hochfrequente Einstrahlung, da sämtliche Elemente, insbesondere die Halbleitersubstrate 6 und 6' von dem ersten Anschlusselement 2' umgeben sind.The electronic component 1 'mounted on the printed circuit board therefore does not require any additional shielding against high-frequency radiation since all the elements, in particular the semiconductor substrates 6 and 6', are surrounded by the first connecting element 2 '.

In Fig. 4 ist das elektronische Bauelement 1' aus Fig. 3 noch einmal in einer perspektivischen Darstellung gezeigt, wobei die beiden vertieften Bereiche 4 und 4' erneut vergossen sind. Aus dem zum Vergießen der vertieften Bereiche 4 und 4' verwendeten Material ragen lediglich die Kontaktflächen der erhöhten Bereiche 3.1, 3.2, 3.3, 3.4 und 3.5 sowie die zweiten Kontaktflächen 9 und 9' und dritten Kontaktflächen 10 und 10' heraus, um sie mit entsprechenden Lötflächen auf der Leiterplatte verbinden zu können.In Fig. 4, the electronic component 1 'of Fig. 3 is shown again in a perspective view, wherein the two recessed areas 4 and 4' are shed again. From the material used to cast the recessed areas 4 and 4 'protrude only the contact surfaces of the raised areas 3.1, 3.2, 3.3, 3.4 and 3.5 and the second contact surfaces 9 and 9' and third contact surfaces 10 and 10 'out to them with appropriate To connect solder pads on the circuit board.

Bei dem dritten Ausführungsbeispiel, wie es in Fig. 5 dargestellt ist, ist der erhöhte Bereich 13.2 nicht vorhanden. Ansonsten entspricht der Aufbau dem zweiten Ausführungsbeispiel. Durch das Entfernen des erhöhten Bereichs 13.2 wird lediglich ein großflächiger, vertiefter Bereich 4 ausgebildet, in dem sowohl das Halbleitersubstrat 6 als auch das weitere Halbleitersubstrat 6' sowie das jeweilige zweite Anschlusselement 7 und 7' und das jeweilige dritte Anschlusselement 8 und 8' gemeinsam angeordnet sind. Der große vertiefte Bereich 4 und die darin angeordneten Elemente werden gemeinsam von den erhöhten Bereichen 3.1, 3.3, 3.4 und 3.5 ringförmig umgeben und damit wiederum gut gegen hochfrequente Einstrahlung geschützt.In the third embodiment, as shown in Fig. 5, the raised portion 13.2 is absent. Otherwise, the structure corresponds to the second embodiment. By removing the raised area 13.2, only a large, recessed area 4 is formed in which both the semiconductor substrate 6 and the further semiconductor substrate 6 'and the respective second connection element 7 and 7' and the respective third connection element 8 and 8 'are arranged together are. Of the large recessed area 4 and the elements arranged therein are jointly surrounded by the raised areas 3.1, 3.3, 3.4 and 3.5 annular and thus again well protected against high-frequency radiation.

Zudem ergibt sich bei der Montage auf der Leiterplatte für alle drei Ausführungsbeispiele eine gute Abstützung des elektronischen Bauelements durch die erhöhten Bereiche auf der Oberfläche der Leiterplatte, so dass ein Kühlkörper, der nicht an dem elektronischen Bauelement selbst, sondern an einer nicht dargestellten Befestigungsvorrichtung auf der Leiterplatte montiert wird, z. B. durch eine Federvorrichtung an die Anlagefläche an dem ersten Anschlusselement angepresst werden kann. Durch das Aufnehmen der Kräfte durch das erste Anschlusselement 2' wird zudem verhindert, dass durch die Kunststoffummantelung Kräfte z. B. bei der Montage des Kühlkörpers aufgenommen werden müssen, die im Extremfall zu einer zerstörenden Belastung für die darin angeordneten Bauelemente werden können.In addition, results in the mounting on the circuit board for all three embodiments, a good support of the electronic component by the raised areas on the surface of the circuit board, so that a heat sink, not on the electronic component itself, but on a fastening device, not shown on the Printed circuit board is mounted, z. B. can be pressed by a spring device to the contact surface on the first connection element. By absorbing the forces through the first connection element 2 'is also prevented by the plastic sheath forces z. B. must be included in the assembly of the heat sink, which can be a destructive load for the components arranged therein in the extreme case.

In Fig. 6 sind die wiederum aus einer in dem einzigen vertieften Bereich 4 angeordneten Kunststoffumhüllung herausragenden Kontaktflächen 9, 9', 10, 10' und 13.1, 13.3, 13.4 und 13.5 des elektronischen Bauelements 1'' des dritten Ausführungsbeispiels dargestellt.FIG. 6 shows the contact surfaces 9, 9 ', 10, 10' and 13.1, 13.3, 13.4 and 13.5 of the electronic component 1 "of the third exemplary embodiment that protrude from a plastic sheath arranged in the single recessed area 4.

Die Anordnung des erfindungsgemäßen elektronischen Bauelements 1, wie es ausführlich unter Bezugnahme auf die Figuren 1 und 2 erläutert wurde, hinsichtlich der Montage auf einer Leiterplatte 16 ist in Fig. 7 dargestellt. Die Ansicht des elektronischen Bauelements 1 von der Rückseite, also der von der Leiterplatte 16 abgewandten Seite, zeigt eine ebene Kühlfläche 15, die an dem ersten Anschlusselement 2 ausgebildet ist. In dem dargestellten Ausführungsbeispiel ist die ebene Kühlfläche 15 identisch mit den äußeren Abmessungen des gesamten elektronischen Bauelements 1. Damit sind sämtliche weiteren Anschlusselemente 7 bzw. 7' und 8 bzw. 8' innerhalb der Projektion des äußeren Umfangs der ebenen Kühlfläche 15 auf die Oberfläche der Leiterplatte 16 angeordnet. Die gezeigte Ausbildung der ebenen Kühlfläche 15 an dem elektronischen Bauelement 1 entspricht der Ausbildung der ebenen Kühlflächen an den elektronischen Bauelementen 1 und 1'' des zweiten und dritten Ausführungsbeispiels.The arrangement of the electronic component 1 according to the invention, as has been explained in detail with reference to FIGS. 1 and 2, with regard to the mounting on a printed circuit board 16 is illustrated in FIG. 7. The view of the electronic component 1 from the rear side, that is, the side facing away from the printed circuit board 16 side, shows a flat cooling surface 15, which is formed on the first connection element 2. In the illustrated embodiment, the flat cooling surface 15 is identical to the outer dimensions of the entire electronic component 1. Thus, all other connection elements 7 and 7 'and 8 or 8' within the Projection of the outer periphery of the flat cooling surface 15 on the surface of the circuit board 16 is arranged. The illustrated embodiment of the planar cooling surface 15 on the electronic component 1 corresponds to the formation of the planar cooling surfaces on the electronic components 1 and 1 '' of the second and third embodiment.

Auf der ebenen Kühlfläche 15 kann eine ebenfalls ebene Fläche eines beliebigen, beispielhaft dargestellten Kühlkörpers 20, der für eine Fixierungen auf der Leiterplatte geeignet ist, aufgesetzt werden. Beispielsweise kann ein für Prozessoren von Computern vorgesehener Standard-Kühlkörper 20 auf das elektronische Bauelement 1 aufgesetzt werden und von einer Federklammer 21 in Anlage an der Kühlfläche 15 gehalten werden.On the flat cooling surface 15, a likewise flat surface of any, exemplified heat sink 20, which is suitable for a fixations on the circuit board, can be placed. For example, provided for processors of computers standard heatsink 20 can be placed on the electronic component 1 and held by a spring clip 21 in contact with the cooling surface 15.

Zum Fixieren des elektronischen Bauelements 1 und zum Kontaktieren der Anschlusselemente des elektronischen Bauelements 1 sind auf der Leiterplatte 16 Lötflächen vorgesehen. Beispielhaft sind in der Fig. 7 erste Lötflächen 17.1, 17.2 und 17.3 gezeigt, auf welchen die Kontaktflächen 13.1, 13.2 und 13.3 der entsprechenden erhöhten Bereiche 3.1, 3.2 und 3.3 des ersten Anschlusselements 2 aufgesetzt werden. Entsprechend sind für die zweiten Anschlusselemente 7 und 7' zweite Lötflächen 18 und 18' vorgesehen. Schließlich sind für die in der Fig. 7 nicht erkennbaren dritten Anschlusselemente 8 und 8' dritte Lötflächen 19 und 19' auf der Oberfläche der Leiterplatte 16 vorgesehen.For fixing the electronic component 1 and for contacting the connection elements of the electronic component 1 16 soldering surfaces are provided on the circuit board. By way of example, FIG. 7 shows first solder surfaces 17.1, 17.2 and 17.3 on which the contact surfaces 13.1, 13.2 and 13.3 of the corresponding raised regions 3.1, 3.2 and 3.3 of the first connection element 2 are placed. Accordingly, second solder surfaces 18 and 18 'are provided for the second connection elements 7 and 7'. Finally, for the third connection elements 8 and 8 ', which are not visible in FIG. 7, third solder surfaces 19 and 19' are provided on the surface of the printed circuit board 16.

Wie bereits bei der Erläuterung der Ausführungsbeispiele des elektronischen Bauelements 1 ausgeführt wurde, muss nicht für jeden erhöhten Bereiche 3.1, 3.2 und 3.3 eine entsprechende Lötfläche 17.1, 17.2 und 17.3 zum Verlöten mit der jeweiligen Kontaktfläche 13.1, 13.2 und 13.3 vorhanden sein. Für eine symmetrische Kontaktierung der jeweiligen Halbleitersubstrate 6 und 6' ist es zum Beispiel ausreichend, wenn lediglich die Lötfläche 17.2 mit der entsprechenden Kontaktfläche 13.2 des erhöhten Bereichs 3.2 des ersten Anschlusselements 2 vorhanden ist.As was already explained in the explanation of the exemplary embodiments of the electronic component 1, it is not necessary for each raised region 3.1, 3.2 and 3.3 to have a corresponding soldering surface 17.1, 17.2 and 17.3 for soldering to the respective contact surface 13.1, 13.2 and 13.3. For a symmetrical contacting of the respective semiconductor substrates 6 and 6 ', it is sufficient, for example, if only the soldering surface 17.2 with the corresponding contact surface 13.2 of the raised portion 3.2 of the first connection element 2 is present.

Das Ausbilden der ebenen Kühlfläche 15 über die gesamte Fläche, die das elektronische Bauelement 1 einnimmt, ermöglicht nicht nur die Verwendung von Standard-Kühlkörpern, sondern stellt auch eine besonders große Kontaktfläche zwischen dem Kühlkörper 20 und dem elektronischen Bauelement 1 sicher. Das Konstruieren und Herstellen von Hochleistungskühlkörpern, die eine besondere, auf die Bauform des Gehäuses eines Hochfrequenztransistors abgestimmte Geometrie aufweisen, ist damit nicht erforderlich. Gegenüber herkömmlichen Transistoren für Hochfrequenzanwendungen hat das erfindungsgemäße Bauelement 1 bzw. 1' oder 1'' zudem den Vorteil, dass ein nur geringfügiger Einfluss der Geometrie der weiteren Anschlusselemente 7, 7' bzw. 8, 8' auftritt, da parasitäre Induktivitäten und Kapazitäten lediglich in geringem Umfang auftreten.The formation of the flat cooling surface 15 over the entire area occupied by the electronic component 1 not only enables the use of standard heat sinks, but also ensures a particularly large contact area between the heat sink 20 and the electronic component 1. The design and manufacture of high-performance heat sinks, which have a special, matched to the design of the housing of a high-frequency transistor geometry is not required. Compared with conventional transistors for high-frequency applications, the component 1 or 1 'or 1 "according to the invention also has the advantage that only a minor influence of the geometry of the further connection elements 7, 7' or 8, 8 'occurs because parasitic inductances and capacitances only occur to a small extent.

Als solche Standard-Kühlkörper werden insbesondere Kühlkörper von Mikroprozessoren verwendet, die normalerweise in Computersystemen eingesetzt werden. Dort werden sie für die Kühlung der zentralen Recheneinheit, z.B. eines Intel Pentium oder eines AMD Athlon eingesetzt. Typischerweise haben solche Mikroprozessor-Kühlkörper eine quadratische Grundfläche von etwa 80 mm Kantenlänge. Damit überragt ein solcher Kühlkörper die Dimensionen des zu kühlenden Leistungstransistors mit einer typischen rechteckigen Geometrie mit Kantenlängen von 15 mm und 30 mm beträchtlich. Durch die Anordnung auf dem erfindungsgemäßen elektronischen Bauelement 1 ist eine ausreichende Kühlleistung gerade wegen dieser Größe zusammen mit der im Vergleich zum Computersystem höheren Temperaturdifferenz zwischen Bauelement und Umgebung dennoch sichergestellt.In particular, heat sinks of microprocessors that are normally used in computer systems are used as such standard heat sinks. There they are used for cooling the central processing unit, e.g. an Intel Pentium or an AMD Athlon used. Typically, such microprocessor heat sinks have a square footprint of about 80 mm edge length. Thus, such a heat sink extends beyond the dimensions of the power transistor to be cooled with a typical rectangular geometry with edge lengths of 15 mm and 30 mm considerably. Due to the arrangement on the electronic component 1 according to the invention a sufficient cooling capacity is still ensured precisely because of this size together with the higher compared to the computer system temperature difference between the component and the environment.

Zur Vermeidung von parasitären Induktivitäten und Kapazitäten trägt insbesondere bei, dass die Anschlusselemente nicht seitlich aus einem Gehäuse herausgeführt werden und dann im Bogen um ein nicht leitendes Kunststoffgehäuse so umgeformt werden, dass die eigentliche Kontaktfläche wiederum innerhalb einer Projektion des Gehäuses des Bauelements auf die Leiterplatte angeordnet ist, so wie dies bei dem Transistor MRF 1535 T1 der Motorol Inc. der Fall ist. Die Anschlusselemente des erfindungsgemäßen Bauelements 1 werden vielmehr weitgehend geradlinig in Richtung der Leiterplatte geführt. Lediglich zum Fixieren der Bonddrähte ist eine geringe Abweichung von der geraden Geometrie erforderlich, so dass die Anschlusselemente eine L-förmige Geometrie aufweisen, deren induktiver Charakter jedoch vernachlässigbar ist.To avoid parasitic inductances and capacities contributes in particular that the Connecting elements are not led out laterally from a housing and then be transformed in the arc around a non-conductive plastic housing so that the actual contact surface is again arranged within a projection of the housing of the device on the circuit board, as in the case of the transistor MRF 1535 T1 Motorol Inc. is the case. Rather, the connection elements of the component 1 according to the invention are guided largely in a straight line in the direction of the printed circuit board. Only for fixing the bonding wires, a slight deviation from the straight geometry is required, so that the connection elements have an L-shaped geometry whose inductive character is negligible.

Claims (14)

  1. Electronic component with at least two connecting elements (2, 2', 2''; 7, 7'; 8, 8'), each of which has at least one contact surface (13.1, 13.2, 13.3, 13.4, 13.5; 9, 9'; 10, 10'), with which the electronic component (1, 1', 1'') can be attached to a surface of a printed-circuit board (16), wherein an at least partially flat cooling surface (15), which is orientated in the direction of the side of the electronic component (1, 1', 1'') facing away from the contact surfaces (13.1, 13.2, 13.3, 13.4, 13.5; 9, 9', 9''; 10, 10'), is formed on a first connecting element (2, 2', 2'') for contact with a cooling element (20),
    characterised in that
    the first connecting element (2, 2', 2'') provides at least one raised region (3.1, 3.2, 3.3, 3.4, 3.5) on the side facing towards the printed-circuit board (16), on which the at least one contact surface (13.1, 13.2, 13.3, 13.4, 13.5) of the first connecting element (2, 2', 2'') is formed, and provides at least one recessed region (4, 4'), in which the at least one further connecting element (7, 7'; 8, 8') is arranged.
  2. Electronic component according to claim 1,
    characterised in that
    the further connecting elements (7, 7'; 8, 8') are arranged in such a manner that their vertical projection is arranged on the cooling surface (15) within the exterior limit of the cooling surface (15).
  3. Electronic component according to claim 1 or 2,
    characterised in that
    the at least one raised region (3.1, 3.2, 3.3, 3.4, 3.5) extends essentially over the entire longitudinal extension of the electronic component (1, 1', 1'').
  4. Electronic component according to any one of claims 1 to 3,
    characterised in that
    the at least one raised region (3.1, 3.2, 3.3, 3.4, 3.5) surrounds the at least one recessed region (4, 4') in the form of an enclosed ring.
  5. Electronic component according to any one of claims 1 to 4,
    characterised in that
    the contact surfaces (13.1, 13.2, 13.3, 13.4, 13.5; 9, 9', 10, 10') of the connecting elements (2, 2', 2''; 7, 7'; 8, 8') are formed as surfaces plane-parallel to the flat cooling surface (15) on the side of the electronic component (1, 1', 1'') facing towards the printed-circuit board (16).
  6. Electronic component according to any one of claims 1 to 5,
    characterised in that
    the recessed regions (4, 4') are formed as recesses in a cuboidal connecting element (2, 2', 2'').
  7. Electronic component according to any one of claims 1 to 6,
    characterised in that
    at least one semiconductor substrate (6, 6') is arranged in the at least one recessed region (4, 4').
  8. Electronic component according to any one of claims 1 to 6,
    characterised in that
    several semiconductor substrates (6, 6') are arranged in the at least one recessed region (4).
  9. Electronic component according to claim 8,
    characterised in that
    several recessed regions (4, 4') are formed in the first connecting element (2, 2'), in each of which one semiconductor substrate (6, 6') is arranged.
  10. Electronic component according to claim 9,
    characterised in that
    at least one further connecting element (7, 7'; 8, 8'), which is arranged in the respective recessed region (4, 4') receiving the semiconductor substrate (6, 6'), is provided for each semiconductor substrate (6, 6').
  11. Electronic component according to claim 10,
    characterised in that
    the first connecting element (2, 2', 2'') is provided as a common electrical connecting element for all of the semiconductor substrates (6, 6') of the electronic component (1, 1', 1'').
  12. Electronic component according to any one of claims 1 to 11,
    characterised in that
    the first connecting element (2, 2', 2'') is a source connection of a field-effect power transistor.
  13. Electronic component according to claim 12,
    characterised in that
    the further connecting elements (7', 7', 8, 8') are formed as a gate connection and a drain connection of the field-effect power transistor.
  14. Electronic component according to any one of claims 1 to 13,
    characterised in that
    the entire cooling surface (15) facing away from the printed-circuit board (16) is formed as a contact surface for a cooling element (20).
EP04764701A 2003-09-05 2004-09-01 Electronic component comprising a cooling surface Expired - Fee Related EP1661178B1 (en)

Applications Claiming Priority (3)

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DE10341081 2003-09-05
DE102004004074A DE102004004074A1 (en) 2003-09-05 2004-01-27 Electronic component with cooling surface
PCT/EP2004/009740 WO2005024937A1 (en) 2003-09-05 2004-09-01 Electronic component comprising a cooling surface

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EP1661178A1 EP1661178A1 (en) 2006-05-31
EP1661178B1 true EP1661178B1 (en) 2006-12-06

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EP (1) EP1661178B1 (en)
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JP4691455B2 (en) * 2006-02-28 2011-06-01 富士通株式会社 Semiconductor device
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JP6633861B2 (en) * 2015-07-31 2020-01-22 ルネサスエレクトロニクス株式会社 Semiconductor device

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DE3028178C2 (en) * 1980-07-25 1985-05-09 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module
DE340959T1 (en) 1988-05-06 1990-08-16 Digital Equipment Corp., Maynard, Mass. CIRCUIT CHIP PACK FOR PROTECTION AGAINST ELECTROMAGNETIC INTERFERENCES, ELECTROSTATIC DISCHARGES AND THERMAL AND MECHANICAL VOLTAGES.
DE19522455A1 (en) 1995-06-21 1997-01-02 Telefunken Microelectron Electromagnetic compatibility screening of electronic components esp. integrated circuits in motor vehicles
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WO2005022591A2 (en) * 2003-08-26 2005-03-10 Advanced Interconnect Technologies Limited Reversible leadless package and methods of making and using same
KR101075169B1 (en) * 2003-08-27 2011-10-19 페어차일드코리아반도체 주식회사 Power module flip chip package

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US7633158B2 (en) 2009-12-15
WO2005024937A1 (en) 2005-03-17
DE502004002254D1 (en) 2007-01-18
US20060284289A1 (en) 2006-12-21
EP1661178A1 (en) 2006-05-31

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