EP1590505A4 - Composition and method for copper chemical mechanical planarization - Google Patents

Composition and method for copper chemical mechanical planarization

Info

Publication number
EP1590505A4
EP1590505A4 EP03812088A EP03812088A EP1590505A4 EP 1590505 A4 EP1590505 A4 EP 1590505A4 EP 03812088 A EP03812088 A EP 03812088A EP 03812088 A EP03812088 A EP 03812088A EP 1590505 A4 EP1590505 A4 EP 1590505A4
Authority
EP
European Patent Office
Prior art keywords
composition
chemical mechanical
mechanical planarization
copper chemical
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03812088A
Other languages
German (de)
French (fr)
Other versions
EP1590505A2 (en
Inventor
Martin Nosowitz
Nicholas M Martyak
Glenn Carroll
Patrick K Janney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkema Inc
Original Assignee
Arkema Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkema Inc filed Critical Arkema Inc
Publication of EP1590505A2 publication Critical patent/EP1590505A2/en
Publication of EP1590505A4 publication Critical patent/EP1590505A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/18—Electrolytic production, recovery or refining of metals by electrolysis of solutions of lead
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/46—Specific cleaning or washing processes applying energy, e.g. irradiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
EP03812088A 2002-12-02 2003-11-19 Composition and method for copper chemical mechanical planarization Withdrawn EP1590505A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US43041802P 2002-12-02 2002-12-02
US430418P 2002-12-02
US10/706,178 US6911393B2 (en) 2002-12-02 2003-11-12 Composition and method for copper chemical mechanical planarization
US706178 2003-11-12
PCT/US2003/037184 WO2004055864A2 (en) 2002-12-02 2003-11-19 Composition and method for copper chemical mechanical planarization

Publications (2)

Publication Number Publication Date
EP1590505A2 EP1590505A2 (en) 2005-11-02
EP1590505A4 true EP1590505A4 (en) 2005-12-14

Family

ID=32511527

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03812088A Withdrawn EP1590505A4 (en) 2002-12-02 2003-11-19 Composition and method for copper chemical mechanical planarization

Country Status (10)

Country Link
US (1) US6911393B2 (en)
EP (1) EP1590505A4 (en)
JP (1) JP2006508545A (en)
KR (1) KR101015784B1 (en)
AU (1) AU2003302769B2 (en)
CA (1) CA2508332C (en)
MX (1) MXPA05005852A (en)
MY (1) MY133337A (en)
TW (1) TWI305668B (en)
WO (1) WO2004055864A2 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6355323B1 (en) * 1999-01-27 2002-03-12 Matthew L. Iwen Masking barriers
KR20050084939A (en) * 2002-11-05 2005-08-29 메르크 파텐트 게엠베하 Semiconductor surface treatment and mixture used therein
US20050076579A1 (en) * 2003-10-10 2005-04-14 Siddiqui Junaid Ahmed Bicine/tricine containing composition and method for chemical-mechanical planarization
TWI362415B (en) 2003-10-27 2012-04-21 Wako Pure Chem Ind Ltd Novel detergent and method for cleaning
JP2007088370A (en) * 2005-09-26 2007-04-05 Fujifilm Corp Aqueous polishing slurry and chemical mechanical polishing method
TWI452097B (en) * 2005-12-23 2014-09-11 Anji Microelectronics Co Ltd A chemical mechanical polishing solution is used to reduce the removal rate of aluminum
US20070147551A1 (en) * 2005-12-26 2007-06-28 Katsumi Mabuchi Abrasive-free polishing slurry and CMP process
US8551202B2 (en) * 2006-03-23 2013-10-08 Cabot Microelectronics Corporation Iodate-containing chemical-mechanical polishing compositions and methods
US7776230B2 (en) * 2006-08-30 2010-08-17 Cabot Microelectronics Corporation CMP system utilizing halogen adduct
JP5239156B2 (en) * 2006-12-20 2013-07-17 富士通株式会社 Wiring forming method and semiconductor device
US20100087065A1 (en) * 2007-01-31 2010-04-08 Advanced Technology Materials, Inc. Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications
WO2009026324A2 (en) * 2007-08-20 2009-02-26 Advanced Technology Materials, Inc. Composition and method for removing ion-implanted photoresist
CN101815811A (en) * 2007-09-06 2010-08-25 Ekc技术公司 Be used for handling the composition and the method on copper surface
US7955520B2 (en) * 2007-11-27 2011-06-07 Cabot Microelectronics Corporation Copper-passivating CMP compositions and methods
JP2009188059A (en) * 2008-02-04 2009-08-20 Nippon Chem Ind Co Ltd Polishing colloidal silica for semiconductor wafer, and method for producing same
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
WO2010017092A1 (en) * 2008-08-06 2010-02-11 Arkema Inc. Composition and method for copper chemical mechanical planarization
JP2010247079A (en) * 2009-04-16 2010-11-04 Denso Corp Method for manufacturing exhaust gas-cleaning catalyst
DE102009048436B4 (en) 2009-10-07 2012-12-20 Siltronic Ag Method for grinding a semiconductor wafer
US8987181B2 (en) * 2011-11-08 2015-03-24 Dynaloy, Llc Photoresist and post etch residue cleaning solution
TWI683889B (en) * 2013-07-31 2020-02-01 美商恩特葛瑞斯股份有限公司 Aqueous formulations for removing metal hard mask and post-etch residue with cu/w compatibility
KR102431416B1 (en) * 2017-11-15 2022-08-12 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Compositions for performing material removal operations and methods for forming same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010036799A1 (en) * 2000-04-27 2001-11-01 Sumitomo Metal Industries, Ltd. Method of polishing silicon wafer

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GB1565349A (en) * 1975-10-20 1980-04-16 Albright & Wilson Aluminium polishing compositions
US4233112A (en) 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant
US5234867A (en) 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5177908A (en) 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5020283A (en) 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5073577A (en) 1990-06-11 1991-12-17 Morton International, Inc. Mixed emulsion of a liquid polysulfide and dispension of an oxidative curative therefor
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5245790A (en) 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
US5486129A (en) 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5562530A (en) 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
KR100302671B1 (en) 1996-07-25 2001-09-22 피. 제리 코더 Chemical mechanical polishing composition and process
KR19980070753A (en) * 1997-01-28 1998-10-26 모리시타 요이치 Semiconductor device and manufacturing process
US6068879A (en) 1997-08-26 2000-05-30 Lsi Logic Corporation Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing
US6117795A (en) 1998-02-12 2000-09-12 Lsi Logic Corporation Use of corrosion inhibiting compounds in post-etch cleaning processes of an integrated circuit
CA2378790A1 (en) * 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Polishing system and method of its use
KR100844032B1 (en) 1999-12-14 2008-07-04 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 Polishing compositions for noble metals
JP2001338926A (en) * 2000-05-29 2001-12-07 Sony Corp Method of manufacturing semiconductor device
JP3825246B2 (en) * 2000-11-24 2006-09-27 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010036799A1 (en) * 2000-04-27 2001-11-01 Sumitomo Metal Industries, Ltd. Method of polishing silicon wafer

Also Published As

Publication number Publication date
EP1590505A2 (en) 2005-11-02
US20040116313A1 (en) 2004-06-17
AU2003302769B2 (en) 2009-02-26
WO2004055864A2 (en) 2004-07-01
CA2508332A1 (en) 2004-07-01
CA2508332C (en) 2010-04-06
TW200428524A (en) 2004-12-16
KR101015784B1 (en) 2011-02-18
MY133337A (en) 2007-11-30
JP2006508545A (en) 2006-03-09
AU2003302769A1 (en) 2004-07-09
WO2004055864A3 (en) 2005-01-27
TWI305668B (en) 2009-01-21
US6911393B2 (en) 2005-06-28
KR20050085311A (en) 2005-08-29
MXPA05005852A (en) 2005-08-26

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