EP1547113B1 - Self-configuring component by means of arcing - Google Patents

Self-configuring component by means of arcing Download PDF

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Publication number
EP1547113B1
EP1547113B1 EP03750445A EP03750445A EP1547113B1 EP 1547113 B1 EP1547113 B1 EP 1547113B1 EP 03750445 A EP03750445 A EP 03750445A EP 03750445 A EP03750445 A EP 03750445A EP 1547113 B1 EP1547113 B1 EP 1547113B1
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EP
European Patent Office
Prior art keywords
component
conductor
arc
circuit element
conductive layer
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EP03750445A
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German (de)
French (fr)
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EP1547113A1 (en
Inventor
Stephan Hell
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Wickmann Werke GmbH
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Wickmann Werke GmbH
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/46Circuit arrangements not adapted to a particular application of the protective device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411Miniature fuses
    • H01H2085/0412Miniature fuses specially adapted for being mounted on a printed circuit board

Definitions

  • the invention relates to a device with an internal conductor, which is designed so that it is cut at a predetermined location to form an arc, provided that predetermined current / voltage conditions occur at terminals of the device.
  • Such devices are e.g. from document US 5 148 141 known.
  • a component of the type mentioned is, for example, a fuse element in the embodiment as a chip fuse. If the current flow through the chip fuse exceeds a maximum value for a predetermined duration, it may turn off the fuse, i. come to a cutting of a fuse conductor. Starting at the point of separation, an arc is formed in the fuse component, which allows a continued flow of current between the terminals of the chip fuse despite the severed fusible conductor. The arc and the continued current flow are undesirable. In particular, in the event of a short circuit, undesired destruction of the fuse component and the surrounding circuit may occur in the case of very high currents transported via the arc.
  • the object of the invention is therefore to provide a device with which a fuse component can be produced, in which a reduced current flow in the case of shutdown is possible without adversely affecting the operating parameters during normal operation (before shutdown).
  • the core idea of the invention is to utilize the energy released when switching off the arc in such a way that the electrical properties of a circuit element of a component are changed in a desired manner, ie the component is reconfigured.
  • the component can be a two-terminal coil with two terminals, wherein the change in the electrical properties of the circuit element caused by the arc leads to an altered two-pole behavior of the component.
  • the internal conductor trace severed by the arc and the circuit element whose electrical characteristics are changed could be connected to separate terminals of the device.
  • the device is a layer device in which the conductor and the circuit element of structured layers are formed on a substrate.
  • these are thick-film conductive layers and resistor layers.
  • the circuit element reconfigured by the arc may be any two-terminal.
  • this two pole changes its electrical resistance upon the action of the arc; Preferably, the resistance is increased.
  • the circuit element is a second conductor, which is severed when exposed to the arc. In this embodiment, so to speak, first the internal Conductor divided to form the arc and then cut as a result of this arc, the second conductor also. In order to enable an energetically favorable action of the arc on the second conductor, the second conductor preferably crosses the internal conductor at the predetermined location at which the internal conductor is severed to form the arc.
  • a preferred embodiment of the device is characterized in that in the device parallel to the second conductor, on which the arc can act, a resistance element is connected.
  • the parallel circuit thus formed has a very low resistance before the action of the arc and, after the action of the arc, the resistance of the resistance element alone.
  • this parallel circuit of circuit element and resistive element is connected in series with the internal circuit trace which is severed to form the arc.
  • This series connection has a very low resistance before the formation of an arc, namely the series connection of the internalnatices and the secondêttagens.
  • the resistive element is connected in series with the still existing arc of the internal circuit trace. The resistive element then limits the current flow through the arc.
  • the latter embodiment is preferably used as a fuse component, wherein the internal conductor is severed to form an arc, as long as a current through the conductor exceeds a maximum value for an associated maximum duration.
  • a "cut-off" can be carried out at different currents, wherein at higher current values, a lower Stromflußdauer to to shut down is required.
  • Such a fuse component has the advantage that in the case of switching off with a resulting arc, a resistor is connected in the current path.
  • the resistance ie the resistance element
  • the resistor element connected in parallel with the second conductor has a resistance between 5 ⁇ and 20 ⁇ .
  • the dimensioning of the resistance element, both in terms of the ohmic resistance and its maximum power loss depends on the application of the fuse component, in particular from the cut-off and the maximum applied voltage.
  • the internal and the second conductor line and the resistance element are formed from structured layers on a substrate, wherein the internal conductor line is arranged over a portion of the second conductor line and separated therefrom by an electrically insulating layer.
  • the internal conductor trajectory crosses the second conductor traction covered by an insulator layer.
  • FIG. 1A shows a schematic plan view of the upper side of a component 1.
  • a substrate 2 for example an Al 2 O 3 substrate or another ceramic substrate.
  • a number of layers are applied on the upper side of a substrate 2, for example an Al 2 O 3 substrate or another ceramic substrate.
  • Figure 1A illustrates only the layers essential to the invention.
  • a number of further layers may be applied below, between or over the illustrated layers, for example insulator, capping, protective layers and layers which influence heat dissipation.
  • a first conductive layer 5 is first applied and patterned, which in addition to the pads 6 and 7 comprises a transverse to the longitudinal direction of the substrate 2 extending conductor 8.
  • the conductor 8 is part of a U-shaped Porterzugschleife in the conductive layer 5.
  • a resistance layer 9 is applied, which is structured so that an approximately rectangular portion of the resistance layer, the legs of the U-shaped Porterzugschleife at the upper ends combines. That is, between the conductive layer 5 and the resistance layer 9, an electrical contact is made.
  • the resistive layer 9 could also be disposed under the conductive layer 5. This arrangement of the patterned resistive layer 9 and the structured conductive layer 5 creates a parallel connection between a resistor and a U-shaped conductor loop, wherein one terminal of the parallel circuit is connected directly to the contact surface 6.
  • An electrically insulating layer (not shown in FIG. 1 a) is applied over the conductive layer 5 and at least one further structured conductive layer 3 is applied to this insulator layer.
  • the further conductive layer 3 is structured so that it forms a PorterzugstMail which overlaps the contact surface 7 at one end and overlaps at its other end the U-shaped Porterzug. In both overlapping regions, a window is formed in the insulator layer arranged between the conductive layer 5 and the at least one further conductive layer 3, so that contacts can be produced between the conductive layer 5 and the conductive layer 3 at these locations.
  • the contact of the conductive layer 3 to the underlying conductive layer 5 in the U-shaped Porterzug Anlagen is located at that end of the U-shaped Porterzugschleife that forms not connected to the contact surface 6 node of the parallel circuit of resistance layer 9 and U-shaped Leitzugschleife.
  • a section 4 of the at least one further conductive layer 3 crosses the conductor 8.
  • the section 4 of the conductive layer 3 crossing the conductor 8 is separated from the conductor 8 by the insulator layer.
  • the portion 4 of the at least one conductive layer 3 is formed as a fusible element, for example (as shown in Figure 1A) of smaller width than the rest of the conductor formed in the conductive layer 3 Porterzugs.
  • the fusible element forming portion 4 in the at least one conductive layer 3 may include, for example, a thick-film conductor containing silver and, in addition, a solder layer deposited thereon.
  • FIG. 1B shows a circuit diagram of the arrangement shown schematically in FIG. 1A.
  • the contact surfaces 6 and 7 correspond to the terminals 16 and 17, respectively.
  • the U-shaped conductor loop in the conductive layer 5 corresponds to the short-circuit connection 18.
  • the resistance element formed in the resistance layer 9 corresponds to the resistor R 19.
  • the fusible conductor element formed in the at least one second conductive layer 3 in the section 4 corresponds to the fusible conductor element 14 in FIG. 1B.
  • the currents flowing through the device 1 are sufficiently small so that the fuse element 14 remains intact, the current flows essentially through the short-circuit connection 18 and the fuse element 14 between the terminals 16 and 17.
  • the device 1 has a small ohmic resistance.
  • the fusible conductor element 14, ie the section 4 in the conductive layer 3 is severed.
  • the process of severing depends on the structure of the fusible element. For example, if a conductive layer 3 containing silver particles is covered at a predetermined location by a solder layer (containing tin and lead), and if the current flowing causes the device to be heated, the conductive layer is severed due to a complex process associated with melting of the device Lotimetalls, the diffusion of the metal into the silver layer, the increase in the resistivity of the conductive layer, the local heating and the evaporation of the conductive layer is accompanied.
  • the process of severing is primarily determined by evaporation of the conductive layer material due to local heating.
  • the arc causes further vaporization of the located at the two ends of the
  • FIGS. 2A and 2B schematically show the fuse component 1 shown in FIG. 1A and the circuit shown in FIG. 1B in the case where an arc 10 has formed in the region of the severed portion 4 of the conductive layer.
  • the energy of the arc simultaneously evaporates the material of the underlying insulator layer and a portion of the underlayer material of the conductive layer 5 in the circuit trace 8.
  • the circuit trace 8 becomes finally severed.
  • the thickness of the insulator layer between the conductive layer 3 and conductive layer 5 in the region of Porterzugs 8 must be chosen so that on the one hand provides sufficient electrical insulation available, on the other hand is as thin as possible to a high proportion of the arc energy to the conductive layer. 5 allow the conductor 8.
  • the combination of conductive layer 5 (in Porterzug Scheme 8) and insulator layer must be designed so that an ignition of an arc between the connected to the terminal 6 portion of the broken Porterzugs 8 and connected to the terminal 7 portion of the conductive layer 3 is avoided. This can be achieved by a suitable layout design and insulator layer thickness.
  • Figure 2B shows the circuit diagram that results when the arc 10 is ignited and the conductor 8 is already severed.
  • the resistor 19 connected in parallel short-circuit connection 18 is cut, so that between the terminals 16 and 17, the resistor R19 is connected in series with the arc 10.
  • the resistor R thus limits the current flowing across the arc 10 current.
  • the dimensioning of the resistor 19, both in terms of resulting ohmic resistance R as well as in terms of power consumption (maximum power dissipation) depends on several factors, which depend on the maximum voltage between the contacts 16 and 17 and the desired maximum current (short-circuit current). In one embodiment, R could have a resistance between 5 ⁇ and 20 ⁇ , for example 10 ⁇ .
  • the layout shown in FIG. 1A (with the same circuit diagram) could be considerably modified.
  • the order of the layer application could also be changed.
  • the conductor 8 could be arranged parallel to the section 4 of the conductor 3 or 3 cross the section 4 twice in a U-shaped course of the conductor.
  • the energy of the arc could also be used to modify a layer deposited on the substrate 2 without vaporizing it.
  • the action of the arc could cause an increase in the sheet resistance, for example by alloying effects.

Abstract

The component (1) has an internal conductor train (3) that is separated at a defined point (4) with the formation of a spark if defined current/voltage conditions occur at component connections (6,7). A circuit element (8) is arranged in the component so that a spark produced at the defined point can act upon the circuit element so as to change its electrical properties.

Description

Die Erfindung betrifft ein Bauelement mit einem internen Leiterzug, der so ausgebildet ist, daß er an einer vorgegebenen Stelle unter Bildung eines Lichtbogens durchtrennt wird, sofern vorgegebene Strom/Spannungsbedingungen an Anschlüssen des Bauelements auftreten. Solche Bauelemente sind z.B. aus dem Dokument US 5 148 141 bekannt.The invention relates to a device with an internal conductor, which is designed so that it is cut at a predetermined location to form an arc, provided that predetermined current / voltage conditions occur at terminals of the device. Such devices are e.g. from document US 5 148 141 known.

Ein Bauelement der eingangs genannten Art ist beispielsweise ein Schmelzsicherungsbauelement in der Ausführung als Chipsicherung. Wenn der Stromfluß durch die Chipsicherung für eine vorgegebene Dauer einen Maximalwert überschreitet, kann es zu einem Abschalten der Sicherung, d.h. zu einem Durchtrennen eines Schmelzleiters kommen. Beginnend an der Trennstelle bildet sich in dem Sicherungsbauelement ein Lichtbogen aus, der einen fortgesetzten Stromfluß zwischen den Anschlüssen der Chipsicherung trotz des durchtrennten Schmelzleiters ermöglicht. Der Lichtbogen und der dadurch fortgesetzte Stromfluß sind unerwünscht. Insbesondere kann es im Kurzschlußfall bei sehr hohen, über den Lichtbogen transportierten Strömen zu unerwünschten Zerstörungen des Sicherungsbauelements und der umgebenden Schaltung kommen. Deshalb ist zumindest eine Begrenzung des im Kurzschlußfall beim Abschalten über den Lichtbogen fließenden Stromes erwünscht. Eine solche Strombegrenzung könnte beispielsweise durch einen in Reihe zu dem Sicherungsbauelement geschalteten Widerstand realisiert werden. Ein solcher Vorwiderstand wäre aber im normalen Betriebsfall bei intakter Sicherung störend, weil ein möglichst geringer Widerstand des Sicherungsbauelement erwünscht ist.A component of the type mentioned is, for example, a fuse element in the embodiment as a chip fuse. If the current flow through the chip fuse exceeds a maximum value for a predetermined duration, it may turn off the fuse, i. come to a cutting of a fuse conductor. Starting at the point of separation, an arc is formed in the fuse component, which allows a continued flow of current between the terminals of the chip fuse despite the severed fusible conductor. The arc and the continued current flow are undesirable. In particular, in the event of a short circuit, undesired destruction of the fuse component and the surrounding circuit may occur in the case of very high currents transported via the arc. Therefore, at least a limitation of the current flowing in the event of a short circuit when switching off via the arc current is desired. Such a current limitation could be realized, for example, by a resistor connected in series with the fuse component. Such a series resistor would be disturbing in the normal operating case with intact fuse, because the lowest possible resistance of the fuse component is desired.

Aufgabe der Erfindung ist es daher, ein Bauelement zu schaffen, mit dem ein Sicherungsbauelement herstellbar ist, bei dem ein verringerter Stromfluß im Falle des Abschaltens möglich ist, ohne die Betriebsparameter im normalen Betrieb (vor dem Abschalten) negativ zu beeinflussen.The object of the invention is therefore to provide a device with which a fuse component can be produced, in which a reduced current flow in the case of shutdown is possible without adversely affecting the operating parameters during normal operation (before shutdown).

Diese Aufgabe wird bei einem Bauelement der eingangs genannten Art dadurch gelöst, daß in dem Bauelement ein Schaltungselement so angeordnet ist, daß ein an der vorgegebenen Stelle erzeugter Lichtbogen derart auf das Schaltungselement einwirken kann, daß das Schaltungselement dabei seine elektrischen Eigenschaften ändert.This object is achieved in a device of the type mentioned above in that in the device a circuit element is arranged so that an arc generated at the predetermined location can act on the circuit element such that the circuit element thereby changes its electrical properties.

Kerngedanke der Erfindung ist es, die beim Abschalten durch den Lichtbogen freiwerdende Energie derart zu nutzen, daß damit die elektrischen Eigenschaften eines Schaltungselements eines Bauelements in einer gewünschten Weise geändert werden, also das Bauelement umkonfiguriert wird. Aus den Dokumenten DE 199 57 423 und DE 197 35 552 sind Sicherungen bekannt, die mit Hilfe eines externen Lichtbogens Teile eines Bauelementes um Konfigurieren. Im einfachsten Fall kann das Bauelement ein Zweipol mit zwei Anschlüssen sein, wobei die durch den Lichtbogen bewirkte Änderung der elektrischen Eigenschaften des Schaltungselements zu einem geänderten Zweipolverhalten des Bauelements führt. Bei einer (nachfolgend nicht näher erörterten) alternativen Ausführungsform könnten der durch den Lichtbogen durchtrennte interne Leiterzug und das Schaltungselement, dessen elektrische Eigenschaften geändert werden, mit separaten Anschlüssen des Bauelements verbunden sein.The core idea of the invention is to utilize the energy released when switching off the arc in such a way that the electrical properties of a circuit element of a component are changed in a desired manner, ie the component is reconfigured. From the documents DE 199 57 423 and DE 197 35 552 fuses are known, which with the help of an external arc parts of a component to configure. In the simplest case, the component can be a two-terminal coil with two terminals, wherein the change in the electrical properties of the circuit element caused by the arc leads to an altered two-pole behavior of the component. In an alternative embodiment (not further discussed below), the internal conductor trace severed by the arc and the circuit element whose electrical characteristics are changed could be connected to separate terminals of the device.

Bei einer bevorzugten Ausführungsform ist das Bauelement ein Schichtbauelement, bei dem der Leiterzug und das Schaltungselement aus strukturierten Schichten auf einem Substrat gebildet sind. Beispielsweise handelt es sich um Dickschicht-Leitschichten und -Widerstandsschichten.In a preferred embodiment, the device is a layer device in which the conductor and the circuit element of structured layers are formed on a substrate. For example, these are thick-film conductive layers and resistor layers.

Das durch den Lichtbogen umkonfigurierte Schaltungselement kann beispielsweise ein beliebiger Zweipol sein. Bei einer Ausführungsform ändert dieser Zweipol beim Einwirken des Lichtbogens seinen elektrischen Widerstand; vorzugsweise wird der Widerstand erhöht. Bei einer anderen, bevorzugten Ausführungsform, ist das Schaltungselement ein zweiter Leiterzug, der beim Einwirken des Lichtbogens durchtrennt wird. Bei dieser Ausführungsform wird sozusagen zunächst der interne Leiterzug unter Bildung des Lichtbogens durchtrennt und dann infolge dieses Lichtbogens der zweite Leiterzug ebenfalls durchtrennt. Um eine energetisch günstige Einwirkung des Lichtbogens auf den zweiten Leiterzug zu ermöglichen, kreuzt der zweite Leiterzug vorzugsweise den internen Leiterzug an der vorgegebenen Stelle, an der der interne Leiterzug unter Bildung des Lichtbogens durchtrennt wird.For example, the circuit element reconfigured by the arc may be any two-terminal. In one embodiment, this two pole changes its electrical resistance upon the action of the arc; Preferably, the resistance is increased. In another preferred embodiment, the circuit element is a second conductor, which is severed when exposed to the arc. In this embodiment, so to speak, first the internal Conductor divided to form the arc and then cut as a result of this arc, the second conductor also. In order to enable an energetically favorable action of the arc on the second conductor, the second conductor preferably crosses the internal conductor at the predetermined location at which the internal conductor is severed to form the arc.

Eine bevorzugte Ausführungsform des Bauelements ist dadurch gekennzeichnet, daß in dem Bauelement parallel zu dem zweiten Leiterzug, auf den der Lichtbogen einwirken kann, ein Widerstandselement geschaltet ist. Die so gebildete Parallelschaltung hat vor der Einwirkung des Lichtbogens einen sehr geringen Widerstand und nach der Einwirkung des Lichtbogens den Widerstand des Widerstandselements allein. Vorzugsweise ist diese Parallelschaltung aus Schaltungselement und Widerstandselement in Reihe zu dem internen Leiterzug, der unter Bildung des Lichtbogens durchtrennt wird, geschaltet. Diese Reihenschaltung hat vor Ausbildung eines Lichtbogens einen sehr geringen Widerstand, nämlich den der Reihenschaltung des internen Leiterzugs und des zweiten Leiterzugs. Unter vorgegebenen Strom/Spannungsbedingungen an den Anschlüssen des Bauelements, beispielsweise dann, wenn ein hoher Strom fließt, wird der interne Leiterzug unter Bildung des Lichtbogens durchtrennt. Dabei wird der zweite Leiterzug ebenfalls durchtrennt. Infolgedessen wird das Widerstandselement in Reihe zu dem noch bestehenden Lichtbogen des internen Leiterzugs geschaltet. Das Widerstandselement begrenzt dann den Stromfluß durch den Lichtbogen.A preferred embodiment of the device is characterized in that in the device parallel to the second conductor, on which the arc can act, a resistance element is connected. The parallel circuit thus formed has a very low resistance before the action of the arc and, after the action of the arc, the resistance of the resistance element alone. Preferably, this parallel circuit of circuit element and resistive element is connected in series with the internal circuit trace which is severed to form the arc. This series connection has a very low resistance before the formation of an arc, namely the series connection of the internal Leiterzugs and the second Leiterzugs. Under predetermined current / voltage conditions at the terminals of the device, for example, when a high current flows, the internal Leiterzug is severed to form the arc. In this case, the second conductor is also severed. As a result, the resistive element is connected in series with the still existing arc of the internal circuit trace. The resistive element then limits the current flow through the arc.

Die letztgenannte Ausführungsform wird vorzugsweise als Sicherungsbauelement verwendet, wobei der interne Leiterzug unter Bildung eines Lichtbogens durchtrennt wird, sofern ein Strom durch den Leiterzug einen Höchstwert für eine zugehörige Höchstdauer überschreitet. Eine "Abschaltung" (Durchtrennung) kann bei unterschiedlichen Strömen erfolgen, wobei bei höheren Stromwerten eine geringere Stromflußdauer bis zum Abschalten erforderlich ist. Ein solches Sicherungsbauelement hat den Vorzug, daß im Fall des Abschaltens mit einem dabei entstehenden Lichtbogen ein Widerstand in den Strompfad geschaltet wird. Der Widerstand (d.h. das Widerstandselement) muß dabei unter Berücksichtigung der Verlustleistung so ausgelegt sein, daß der Kurzschlußstrom auf einen Bruchteil begrenzt wird, der eine wesentlich geringere Beanspruchung des Bauelements und der umgebenden Schaltung bewirkt.The latter embodiment is preferably used as a fuse component, wherein the internal conductor is severed to form an arc, as long as a current through the conductor exceeds a maximum value for an associated maximum duration. A "cut-off" (cut-through) can be carried out at different currents, wherein at higher current values, a lower Stromflußdauer to to shut down is required. Such a fuse component has the advantage that in the case of switching off with a resulting arc, a resistor is connected in the current path. The resistance (ie the resistance element) must be designed taking into account the power loss so that the short-circuit current is limited to a fraction which causes a much lower stress on the device and the surrounding circuit.

Bei einer bevorzugten Ausführungsform weist das zum zweiten Leiterzug parallel geschaltete Widerstandselement einen Widerstand zwischen 5Ω und 20Ω auf. Die Dimensionierung des Widerstandselements, sowohl hinsichtlich des ohmschen Widerstands als auch seiner maximalen Verlustleistung, hängt vom Einsatzfall des Sicherungsbauelements, insbesondere vom Abschaltstrom und der maximal anliegenden Spannung ab.In a preferred embodiment, the resistor element connected in parallel with the second conductor has a resistance between 5Ω and 20Ω. The dimensioning of the resistance element, both in terms of the ohmic resistance and its maximum power loss depends on the application of the fuse component, in particular from the cut-off and the maximum applied voltage.

Bei einer bevorzugten Ausführungsform des Sicherungsbauelements sind der interne und der zweite Leiterzug und das Widerstandselement aus strukturierten Schichten auf einem Substrat gebildet, wobei der interne Leiterzug über einem Abschnitt des zweiten Leiterzugs angeordnet und von diesem durch eine elektrisch isolierende Schicht getrennt ist. Beispielsweise kreuzt der interne Leiterzug den mit einer Isolatorschicht überdeckten zweiten Leiterzug.In a preferred embodiment of the fuse component, the internal and the second conductor line and the resistance element are formed from structured layers on a substrate, wherein the internal conductor line is arranged over a portion of the second conductor line and separated therefrom by an electrically insulating layer. For example, the internal conductor trajectory crosses the second conductor traction covered by an insulator layer.

Vorteilhafte und bevorzugte Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet.Advantageous and preferred developments of the invention are characterized in the subclaims.

Im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten bevorzugten Ausführungsbeispiels näher beschrieben. In der Zeichnung zeigen:

  • Figur 1A eine schematische Darstellung der wesentlichen Elemente des Layouts eines erfindungsgemäßen Sicherungsbauelements in normalen Betrieb;
  • Figur 1B ein Schaltbild des Sicherungsbauelements gemäß Figur 1A;
  • Figur 2A eine schematische Darstellung der wesentlichen Elemente des Layouts des Sicherungsbauelements gemäß Figur 1A nach der Ausbildung eines Lichtbogens beim Durchtrennen des Sicherungsbauelements; und
  • Figur 2B ein Prinzipschaltbild des Sicherungsbauelements gemäß Figur 2A nach Ausbildung des Lichtbogens.
In the following the invention will be described with reference to a preferred embodiment shown in the drawing. In the drawing show:
  • Figure 1A is a schematic representation of the essential elements of the layout of a fuse component according to the invention in normal operation;
  • FIG. 1B is a circuit diagram of the fuse component according to FIG. 1A;
  • Figure 2A is a schematic representation of the essential elements of the layout of the fuse component according to Figure 1A after the formation of an arc during cutting of the fuse device; and
  • FIG. 2B shows a block diagram of the fuse component according to FIG. 2A after the arc has been formed.

Figur 1A zeigt eine schematische Draufsicht auf die Oberseite eines Bauelements 1. Auf der Oberseite eines Substrats 2, beispielsweise eines Al2O3-Substrats oder eines anderen Keramiksubstrats, sind eine Reihe von Schichten (vorzugsweise in Dickschichttechnik) aufgebracht. Figur 1A stellt nur die für die Erfindung wesentlichen Schichten dar. Neben den dargestellten Schichten können eine Reihe weiterer Schichten unter, zwischen oder über den dargestellten Schichten aufgebracht sein, beispielsweise Isolator-, Abdeck-, Schutzschichten und Schichten, die die Wärmeableitung beeinflussen. Auf dem Substrat 2 ist zunächst eine erste leitfähige Schicht 5 aufgebracht und strukturiert, die neben den Anschlußflächen 6 und 7 einen quer zur Längsrichtung des Substrats 2 verlaufenden Leiterzug 8 umfaßt. Der Leiterzug 8 ist Teil einer U-förmigen Leiterzugschleife in der leitfähigen Schicht 5. Über der leitfähigen Schicht 5 ist eine Widerstandsschicht 9 aufgebracht, die so strukturiert ist, daß ein etwa rechteckiger Bereich der Widerstandsschicht die Schenkel der U-förmigen Leiterzugschleife an deren oberen Enden verbindet. D.h., zwischen der leitfähigen Schicht 5 und der Widerstandsschicht 9 ist ein elektrischer Kontakt hergestellt. Bei einem alternativen Ausführungsbeispiel könnte die Widerstandsschicht 9 auch unter der leitfähigen Schicht 5 angeordnet sein. Durch diese Anordnung der strukturierten Widerstandsschicht 9 und der strukturierten Leitschicht 5 entsteht eine Parallelschaltung zwischen einem Widerstand und einer U-förmig ausgebildeten Leiterzugschleife, wobei ein Anschluß der Parallelschaltung direkt mit der Kontaktfläche 6 verbunden ist.FIG. 1A shows a schematic plan view of the upper side of a component 1. On the upper side of a substrate 2, for example an Al 2 O 3 substrate or another ceramic substrate, a number of layers (preferably in thick-film technology) are applied. Figure 1A illustrates only the layers essential to the invention. In addition to the illustrated layers, a number of further layers may be applied below, between or over the illustrated layers, for example insulator, capping, protective layers and layers which influence heat dissipation. On the substrate 2, a first conductive layer 5 is first applied and patterned, which in addition to the pads 6 and 7 comprises a transverse to the longitudinal direction of the substrate 2 extending conductor 8. The conductor 8 is part of a U-shaped Leiterzugschleife in the conductive layer 5. About the conductive layer 5, a resistance layer 9 is applied, which is structured so that an approximately rectangular portion of the resistance layer, the legs of the U-shaped Leiterzugschleife at the upper ends combines. That is, between the conductive layer 5 and the resistance layer 9, an electrical contact is made. In an alternative embodiment, the resistive layer 9 could also be disposed under the conductive layer 5. This arrangement of the patterned resistive layer 9 and the structured conductive layer 5 creates a parallel connection between a resistor and a U-shaped conductor loop, wherein one terminal of the parallel circuit is connected directly to the contact surface 6.

Über der leitfähigen Schicht 5 wird eine (in Figur 1a nicht dargestellte) elektrisch isolierende Schicht und auf dieser Isolatorschicht wenigstens eine weitere strukturierte Leitschicht 3 aufgebracht. Die weitere Leitschicht 3 ist so strukturiert, daß sie einen Leiterzugstreifen bildet, der an seinem einen Ende die Kontaktfläche 7 überlappt und an seinem anderen Ende den U-förmigen Leiterzug überlappt. In beiden Überlappungsbereichen ist ein Fenster in der zwischen der Leitschicht 5 und der wenigstens einen weiteren Leitschicht 3 angeordneten Isolatorschicht ausgebildet, so daß an diesen Stellen Kontakte zwischen der Leitschicht 5 und der Leitschicht 3 hergestellt werden können. Der Kontakt der Leitschicht 3 zu der darunter angeordneten Leitschicht 5 im U-förmigen Leiterzugbereich befindet sich an demjenigen Ende der U-förmigen Leiterzugschleife, das den nicht mit der Kontaktfläche 6 verbundenen Knoten der Parallelschaltung von Widerstandsschicht 9 und U-förmiger Leiterzugschleife bildet. Darüber hinaus kreuzt ein Abschnitt 4 der wenigstens einen weiteren Leitschicht 3 den Leiterzug 8. Der den Leiterzug 8 kreuzende Abschnitt 4 der Leitschicht 3 ist durch die Isolatorschicht von dem Leiterzug 8 getrennt. Darüber hinaus ist der Abschnitt 4 der wenigstens einen Leitschicht 3 als Schmelzleiterelement ausgebildet, beispielsweise (wie es in Figur 1A dargestellt ist) von geringerer Breite als der Rest des in der Leitschicht 3 gebildeten Leiterzugs. Der das Schmelzleiterelement bildende Abschnitt 4 in der wenigstens einen Leitschicht 3 kann beispielsweise einen Silber enthaltenden Dickschichtleiter und zusätzlich eine darauf aufgebrachte Lotschicht enthalten.An electrically insulating layer (not shown in FIG. 1 a) is applied over the conductive layer 5 and at least one further structured conductive layer 3 is applied to this insulator layer. The further conductive layer 3 is structured so that it forms a Leiterzugstreifen which overlaps the contact surface 7 at one end and overlaps at its other end the U-shaped Leiterzug. In both overlapping regions, a window is formed in the insulator layer arranged between the conductive layer 5 and the at least one further conductive layer 3, so that contacts can be produced between the conductive layer 5 and the conductive layer 3 at these locations. The contact of the conductive layer 3 to the underlying conductive layer 5 in the U-shaped Leiterzugbereich is located at that end of the U-shaped Leiterzugschleife that forms not connected to the contact surface 6 node of the parallel circuit of resistance layer 9 and U-shaped Leitzugschleife. In addition, a section 4 of the at least one further conductive layer 3 crosses the conductor 8. The section 4 of the conductive layer 3 crossing the conductor 8 is separated from the conductor 8 by the insulator layer. In addition, the portion 4 of the at least one conductive layer 3 is formed as a fusible element, for example (as shown in Figure 1A) of smaller width than the rest of the conductor formed in the conductive layer 3 Leiterzugs. The fusible element forming portion 4 in the at least one conductive layer 3 may include, for example, a thick-film conductor containing silver and, in addition, a solder layer deposited thereon.

Figur 1B zeigt ein Schaltbild der in Figur 1A schematisch dargestellten Anordnung. Die Kontaktflächen 6 und 7 entsprechen den Anschlüssen 16 bzw. 17. Die U-förmige Leiterzugschleife in der Leitschicht 5 entspricht der Kurzschlußverbindung 18. Das in der Widerstandsschicht 9 ausgebildete Widerstandselement entspricht dem Widerstand R 19. Das in der wenigstens einen zweiten Leitschicht 3 im Abschnitt 4 ausgebildete Schmelzleiterelement entspricht dem Schmelzleiterelement 14 in Figur 1B.FIG. 1B shows a circuit diagram of the arrangement shown schematically in FIG. 1A. The contact surfaces 6 and 7 correspond to the terminals 16 and 17, respectively. The U-shaped conductor loop in the conductive layer 5 corresponds to the short-circuit connection 18. The resistance element formed in the resistance layer 9 corresponds to the resistor R 19. The fusible conductor element formed in the at least one second conductive layer 3 in the section 4 corresponds to the fusible conductor element 14 in FIG. 1B.

Im normalen Betrieb, bei dem die das Bauelement 1 durchfließenden Ströme ausreichend gering sind, so daß das Schmelzleiterelement 14 intakt bleibt, fließt der Strom im wesentlichen über die Kurzschlußverbindung 18 und das Schmelzleiterelement 14 zwischen den Anschlüssen 16 und 17. Das Bauelement 1 hat einen geringen ohmschen Widerstand.In normal operation, in which the currents flowing through the device 1 are sufficiently small so that the fuse element 14 remains intact, the current flows essentially through the short-circuit connection 18 and the fuse element 14 between the terminals 16 and 17. The device 1 has a small ohmic resistance.

Wenn der Stromfluß durch das Bauelement 1 eine bestimmte Stromstärke für eine vorgegebene Zeitdauer überschreitet, wird das Schmelzleiterelement 14, d.h. der Abschnitt 4 in der Leitschicht 3, durchtrennt. Der Vorgang des Durchtrennens (Abschaltens) hängt vom Aufbau des Schmelzleiterelements ab. Wenn beispielsweise eine Silberpartikel enthaltende Leitschicht 3 an einer vorgegebenen Stelle von einer Lotschicht (die Zinn und Blei enthält) überdeckt ist und wenn das Fließen des Stromes ein Aufheizen des Bauelements bewirkt, so wird die Leitschicht aufgrund eines komplexen Vorgangs durchtrennt, der mit dem Schmelzen des Lotmetalls, dem Eindiffundieren des Metalls in die Silberschicht, der Erhöhung des spezifischen Widerstands der Leitschicht, der lokalen Aufheizung und dem Verdampfen des Leitschicht einhergeht. In anderen Fällen, bei denen das Schmelzleiterelement lediglich eine Leitschicht enthält, wird der Vorgang des Durchtrennens vorrangig vom Verdampfen des Leitschichtmaterials infolge lokaler Erhitzung bestimmt. In jedem Fall kommt es zu einer lokalen Durchtrennung der Leitschicht 3 im Abschnitt 4, wobei sich an der Trennstelle ein Lichtbogen ausbildet, mit dessen Hilfe ein fortgesetzter Stromfluß bei durchtrennter Leitbahn ermöglicht wird. Der Lichtbogen bewirkt ein weiteres Verdampfen der an den beiden Enden des Lichtbogens befindlichen Leitschichtbereiche der Schicht 3, wobei sich die verbleibenden Enden der Leitschicht, zwischen denen der Lichtbogen ausgebildet ist, weiter voneinander entfernen, wobei sich der Lichtbogen verlängert.If the current flow through the device 1 exceeds a certain current for a predetermined period of time, the fusible conductor element 14, ie the section 4 in the conductive layer 3, is severed. The process of severing (switching off) depends on the structure of the fusible element. For example, if a conductive layer 3 containing silver particles is covered at a predetermined location by a solder layer (containing tin and lead), and if the current flowing causes the device to be heated, the conductive layer is severed due to a complex process associated with melting of the device Lotimetalls, the diffusion of the metal into the silver layer, the increase in the resistivity of the conductive layer, the local heating and the evaporation of the conductive layer is accompanied. In other cases where the fusible element contains only one conductive layer, the process of severing is primarily determined by evaporation of the conductive layer material due to local heating. In any case, there is a local separation of the conductive layer 3 in section 4, which forms an arc at the separation point, with the aid of a continuous flow of current is made possible with severed interconnect. The arc causes further vaporization of the located at the two ends of the arc Leitschichtbereiche the layer 3, wherein the remaining ends of the conductive layer, between where the arc is formed, further from each other, whereby the arc lengthens.

In den Figuren 2A und 2B ist schematisch das in Figur 1A gezeigte Sicherungsbauelement 1 bzw. die in Figur 1B dargestellte Schaltung für den Fall dargestellt, daß sich ein Lichtbogen 10 im Bereich des durchtrennten Abschnitts 4 der Leitschicht ausgebildet hat. Während der Lichtbogen 10 das Material des Abschnitts 4 verdampft, führt die Energie des Lichtbogens gleichzeitig zu einem Verdampfen des Materials der darunterliegenden Isolatorschicht und eines Teils des unter der Isolatorschicht liegenden Materials der Leitschicht 5 im Leiterzug 8. Durch Einwirken des Lichtbogens 10 wird der Leiterzug 8 schließlich durchtrennt. Die Dicke der Isolatorschicht zwischen Leitschicht 3 und Leitschicht 5 im Bereich des Leiterzugs 8 muß dabei so gewählt werden, daß sie einerseits eine ausreichende elektrische Isolation zur Verfügung stellt, andererseits möglichst dünn ist, um ein Einwirken eines möglichst hohen Anteils der Lichtbogenenergie auf die Leitschicht 5 des Leiterzugs 8 zu ermöglichen. Außerdem muß die Kombination aus Leitschicht 5 (im Leiterzugbereich 8) und Isolatorschicht so ausgebildet sein, daß ein Zünden eines Lichtbogens zwischen dem mit dem Anschluß 6 verbundenen Abschnitt des unterbrochenen Leiterzugs 8 und dem mit dem Anschluß 7 verbundenen Abschnitt der Leitschicht 3 vermieden wird. Dies kann durch eine geeignete Layoutgestaltung und Isolatorschichtdicke erreicht werden.FIGS. 2A and 2B schematically show the fuse component 1 shown in FIG. 1A and the circuit shown in FIG. 1B in the case where an arc 10 has formed in the region of the severed portion 4 of the conductive layer. As the arc 10 vaporizes the material of the section 4, the energy of the arc simultaneously evaporates the material of the underlying insulator layer and a portion of the underlayer material of the conductive layer 5 in the circuit trace 8. By the action of the arc 10, the circuit trace 8 becomes finally severed. The thickness of the insulator layer between the conductive layer 3 and conductive layer 5 in the region of Leiterzugs 8 must be chosen so that on the one hand provides sufficient electrical insulation available, on the other hand is as thin as possible to a high proportion of the arc energy to the conductive layer. 5 allow the conductor 8. In addition, the combination of conductive layer 5 (in Leiterzugbereich 8) and insulator layer must be designed so that an ignition of an arc between the connected to the terminal 6 portion of the broken Leiterzugs 8 and connected to the terminal 7 portion of the conductive layer 3 is avoided. This can be achieved by a suitable layout design and insulator layer thickness.

Figur 2B zeigt das Schaltbild, das sich ergibt, wenn der Lichtbogen 10 gezündet ist und der Leiterzug 8 bereits durchtrennt ist. Die zum Widerstand 19 parallel geschaltete Kurzschlußverbindung 18 ist durchtrennt, so daß zwischen den Anschlüssen 16 und 17 der Widerstand R19 in Reihe zu dem Lichtbogen 10 geschaltet ist. Der Widerstand R begrenzt somit den über dem Lichtbogen 10 fließenden Strom. Die Dimensionierung des Widerstands 19, sowohl hinsichtlich des sich ergebenden ohmschen Widerstands R als auch hinsichtlich der Stromaufnahmefähigkeit (maximale Verlustleistung) hängt von mehreren Faktoren ab, die von der zwischen den Kontakten 16 und 17 maximal anliegenden Spannung und dem gewünschten Maximalstrom (Kurzschlußstrom) abhängen. Bei einer Ausführungsform könnte R einen Widerstand zwischen 5 Ω und 20 Ω, beispielsweise 10 Ω, haben.Figure 2B shows the circuit diagram that results when the arc 10 is ignited and the conductor 8 is already severed. The resistor 19 connected in parallel short-circuit connection 18 is cut, so that between the terminals 16 and 17, the resistor R19 is connected in series with the arc 10. The resistor R thus limits the current flowing across the arc 10 current. The dimensioning of the resistor 19, both in terms of resulting ohmic resistance R as well as in terms of power consumption (maximum power dissipation) depends on several factors, which depend on the maximum voltage between the contacts 16 and 17 and the desired maximum current (short-circuit current). In one embodiment, R could have a resistance between 5Ω and 20Ω, for example 10Ω.

Im Rahmen des Erfindungsgedankens sind zahlreiche alternative Ausführungsformen denkbar.Numerous alternative embodiments are conceivable within the scope of the inventive concept.

Bei der Verwendung des Bauelements als Sicherungsbauelement könnte (bei an sich gleichem Schaltbild) das in Figur 1A dargestellte Layout erheblich abgewandelt werden. Auch die Reihenfolge der Schichtaufbringung könnte geändert sein. Beispielsweise könnte der Leiterzug 8 parallel zu dem Abschnitt 4 des Leiterzugs 3 angeordnet sein oder bei einem U-förmigen Verlauf des Leiterzugs 8 den Abschnitt 4 zweimal kreuzen. Bei einer alternativen Ausführungsform könnte die Energie des Lichtbogens auch genutzt werden, um eine auf dem Substrat 2 aufgebrachte Schicht zu modifizieren, ohne sie zu verdampfen. Beispielsweise könnte die Einwirkung des Lichtbogens eine Erhöhung des Schichtwiderstands bewirken, beispielsweise durch Legierungseffekte.When the component is used as a fuse component, the layout shown in FIG. 1A (with the same circuit diagram) could be considerably modified. The order of the layer application could also be changed. For example, the conductor 8 could be arranged parallel to the section 4 of the conductor 3 or 3 cross the section 4 twice in a U-shaped course of the conductor. In an alternative embodiment, the energy of the arc could also be used to modify a layer deposited on the substrate 2 without vaporizing it. For example, the action of the arc could cause an increase in the sheet resistance, for example by alloying effects.

Claims (12)

  1. A component (1) with an internal conductor (3), which is so configured that it is ruptured at a predetermined position (4) whilst forming an arc (10) if predetermined current/voltage conditions occur at the terminals (6, 7) of the component (1), characterised in that a circuit element (8) is so arranged in the component (1) that an arc (10) formed at the predetermined position (4) can act on the circuit element (8) such that the circuit element (8) alters its electrical properties.
  2. A component as claimed in claim 1, characterised in that the component (1) is a layered component, the conductor (3) and the circuit element (8) being constituted by structured layers on a substrate (2).
  3. A component as claimed in claim 1 or 2, characterised in that the component (1) has two terminals (6, 7) and that the internal conductor (3) and the circuit element (8) are connected between the two terminals (6, 7).
  4. A component as claimed in one of claims 1-3, characterised in that the circuit element is a two-pole component, which alters its electrical resistance under the action of the arc.
  5. A component as claimed in one of claims 1-3 characterised in that the circuit element is a second conductor (8), which is ruptured under the action of the arc (10).
  6. A component as claimed in claim 5, characterised in that the second conductor (8) crosses the internal conductor (3) at the predetermined position (4).
  7. A component as claimed in claim 5 or 6, characterised in that a resistive element (9) is connected in the component (1) in parallel with the second conductor (8), on which the arc (10) can act.
  8. A component as claimed in claim 7, characterised in that the internal conductor (3), which is ruptured to form an arc (10), is connected in series with the parallel circuit comprising the circuit element (8) and resistive element (9).
  9. A component as claimed in claim 8 for use as a fuse component, characterised in that the internal conductor (3) is ruptured to form an arc (10) if a current through the conductor exceeds a maximum value for an associated maximum period of time.
  10. A component as claimed in claim 9, characterised in that the resistive element (9), which is connected in parallel with the second conductor, has a resistance between 5Ω and 20Ω.
  11. A component as claimed in claim 9 or 10, characterised in that the internal conductor (3) includes a fusible conductor.
  12. A component as claimed in one of claims 9 to 11, characterised in that the internal conductor (3) and the second conductor (8) and the resistive element (9) are constituted by structured layers on a substrate (2), the internal conductor (3) being arranged above a section of the second conductor (8) and separated from it by an electrically insulating layer.
EP03750445A 2002-09-28 2003-08-27 Self-configuring component by means of arcing Expired - Lifetime EP1547113B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10245393A DE10245393A1 (en) 2002-09-28 2002-09-28 Protection component that is self-configuring using sparks, has circuit element arranged in component so that spark produced at defined point can act upon circuit element to change electrical properties
DE10245393 2002-09-28
PCT/EP2003/009458 WO2004034416A1 (en) 2002-09-28 2003-08-27 Self-configuring component by means of arcing

Publications (2)

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EP1547113A1 EP1547113A1 (en) 2005-06-29
EP1547113B1 true EP1547113B1 (en) 2006-09-27

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EP03750445A Expired - Lifetime EP1547113B1 (en) 2002-09-28 2003-08-27 Self-configuring component by means of arcing

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US (1) US7417526B2 (en)
EP (1) EP1547113B1 (en)
AT (1) ATE341096T1 (en)
DE (2) DE10245393A1 (en)
WO (1) WO2004034416A1 (en)

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US20100141375A1 (en) * 2008-12-09 2010-06-10 Square D Company Trace fuse with positive expulsion
US8319573B2 (en) * 2009-12-23 2012-11-27 Infineon Technologies Austria Ag Signal transmission arrangement

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Publication number Publication date
DE10245393A1 (en) 2004-04-08
EP1547113A1 (en) 2005-06-29
DE50305199D1 (en) 2006-11-09
ATE341096T1 (en) 2006-10-15
WO2004034416A1 (en) 2004-04-22
US7417526B2 (en) 2008-08-26
US20060138588A1 (en) 2006-06-29

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