EP1538514B1 - Transparent substrate with invisible electrodes and devices incorporating the same - Google Patents
Transparent substrate with invisible electrodes and devices incorporating the same Download PDFInfo
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- EP1538514B1 EP1538514B1 EP03027566A EP03027566A EP1538514B1 EP 1538514 B1 EP1538514 B1 EP 1538514B1 EP 03027566 A EP03027566 A EP 03027566A EP 03027566 A EP03027566 A EP 03027566A EP 1538514 B1 EP1538514 B1 EP 1538514B1
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- Prior art keywords
- transparent
- conductive film
- electrodes
- substrate
- conductive
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 239000002243 precursor Substances 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 3
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- 229920005989 resin Polymers 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 230000003667 anti-reflective effect Effects 0.000 claims 2
- 229910003437 indium oxide Inorganic materials 0.000 claims 2
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- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
- Y10S977/781—Possessing nonosized surface openings that extend partially into or completely through the host material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
- Y10S977/784—Electrically conducting, semi-conducting, or semi-insulating host material
Definitions
- the present invention relates to a transparent substrate having at least one face provided with transparent electrodes whose structure is such that their contours can not be perceived by an observer in the wavelength range of visible light.
- the invention also relates to devices, generally electronic devices, comprising one or more transparent substrates with invisible electrodes in which the electrodes have control or energy collector roles, and more particularly such devices arranged above the electrodes. display of an electronic device on which the information of said display must be read without being hindered by the structuring and the arrangement of the electrodes.
- the invention also relates to a method for performing, economically and with high precision, structuring of the electrodes on any transparent substrate while providing optical compensation between the electrodes to make their contours invisible.
- the ice can also be replaced or supplemented by a cell formed of two substrates with transparent electrodes between which is placed an active material, for example to form a photovoltaic cell constituting the energy source as described in document WO 93/19479 , or to form a liquid crystal cell which may have a transparent state and a state to display on request additional or different information from that displayed on an underlying dial, as described in the document WO 99/32945 .
- TCO transparent conductive oxides
- ITO indium
- ITO indium
- ITO indium
- ITO indium
- SnO 2 doped with antimony
- It can also be used as a conductive film for structuring electrodes of transparent conductive polymers which are conjugated double bond organic compounds whose conductivity can be enhanced by chemical or electrochemical doping. It is for example a polyacetylene or polyanilines such as Ormecon®.
- These deposits of the order of 50 to 100 nm, are made directly on the transparent substrate or on an intermediate layer by a large number of known techniques such as spraying, evaporation, sol-gel technique, and techniques. of vapor deposition (CVD), which will particularly note laser assisted deposition (LICVD).
- CVD vapor deposition
- LICVD laser assisted deposition
- the structuring of the electrodes there are also various known methods used, using at least one mask corresponding to the electrode contour, or during the deposition of the TCO by localized crystallization of a sol-gel film by irradiation with a UV laser, either by performing a chemical etching on a continuous TCO film, or a localized ablation by irradiating with a UV laser at a sufficient fluence or mechanical ablation, as described in FIG. US Patent 6,225,577 .
- the nature of the transparent substrate, glass or plastic is obviously decisive from the technical and economic point of view for the choice of the process to be applied.
- Localized crystallization of a sol-gel film by UV laser is, for example, hardly applicable to a plastic substrate, such as PMMA, because it is a photothermal process.
- non-conductive spaces between the electrodes can still remain perceptible to the naked eye, regardless of how to fill said non-conductive spaces.
- These non-conductive spaces may also be visible because of the difficulty of filling them without forming beads or depressions capable of deflecting the light rays, since it is necessary to use two complementary masks, respectively for etching and for the lining.
- the method proposed in the application European EP 1 457 865 in the name of the applicant, consists in using a single mask by employing laser radiation whose characteristics (fluence, number of pulses, frequency) are adjusted in two different modes for two successive steps.
- the first step is to completely eliminate the TCO in the non-conductive spaces, and the second step to cause the deposition of a material of refractive index and thickness appropriate in said spaces. It seemed rather obvious that two close electrodes from each other could only be electrically isolated by removing all traces of conductive material in the space between them.
- the subject of the invention is a transparent substrate with invisible electrodes comprising a transparent support on which is deposited a transparent conductive film in which electrodes are structured with contours separated by non-conductive spaces.
- the substrate is characterized in that the conductive film at the location of said non-conductive spaces comprises nanofissures, the greater number of which crosses the entire thickness of the conductive film, making it possible to interrupt the electrical conductivity between adjacent electrodes, without modifying the path of a ray of light in a manner noticeable to the naked eye.
- edges of these nanofissures are at most separated by a few microns and can not be seen by an observer whose visual acuity does not allow him to distinguish, in close vision (20 - 30 cm), objects distant from less than 1 / 10 millimeters.
- the conductive film may be a transparent conductive oxide (TCO), but also a transparent conductive polymer.
- TCO transparent conductive oxide
- TCOs which are the most known products for producing transparent electrodes.
- the transparent support prior to the deposition of the TCO film, is coated with a layer of hard non-conductive hard material (Hard coating) which contributes to the formation of nanofissures.
- Hard coating hard non-conductive hard material
- the entire surface of the substrate that is to say the electrodes and the non-conductive spaces, with the possible exception of the contact zones of the electrodes, is covered with a protective film, which can also have anti-reflection properties and helps stabilize the nanofissures over time.
- radiation characteristics is meant the fluence, the number of pulses and their frequency.
- the method according to the invention therefore has the advantage of not requiring the above step, and therefore of being more economical. Nor does it impose the delicate choice of a dielectric material having a refractive index and a thickness adapted to obtain a satisfactory optical compensation, given the specific characteristics of the TCO film (refractive index and thickness).
- the substrate After structuring the electrodes, it may be advantageous to leave the substrate in the enclosure, to replace the previous mask with another mask whose UV-transparent window makes it possible to deposit a transparent protective film on the entire substrate. , that is to say the electrodes and the non-conductive spaces, with the possible exception of the contact areas of the electrodes, by introducing a precursor gas into the chamber.
- a material is preferably chosen whose nature and thickness make it possible to have anti-reflection properties.
- the film also has the advantage of stabilizing nanofissures over time.
- a transparent substrate with invisible electrodes is usable in all the applications mentioned in the preamble by offering qualities of transparency and uniformity superior to those of the known products of the prior art.
- the figure 1 schematically represents the device which basically comprises a source 14 of UV radiation constituted by a laser source, a telescope type optical comprising a converging lens 16 and a diverging lens 18 making it possible to reduce the section of the laser beam in order to increase its fluence, a mask 10 comprising zones 12 transparent to UV radiation, and an enclosure 2.
- the enclosure 2 comprises a window 8 transparent to UV radiation, a gas supply 4 and a pumping outlet 6.
- the chamber 2 may also include an additional supply (not shown) of a carrier gas of a precursor gas.
- a substrate which, in this example, has a transparent base which is already coated with a TCO film. It would obviously be possible to form the TCO film directly in the enclosure 2, for example by LICVD, but of less economic interest, since the energy consumption would be 100 times greater.
- the UV radiation source is an eximeric laser, such as a long pulse (250 ns) XeF laser (308 nm) providing maximum energy 150 mJ per pulse with a 1.9 x 2.4 cm 2 rectangular beam, or a short pulse (20 ns) KrF (248 nm) laser providing a maximum energy of 180 mJ per pulse with a rectangular beam of 1 , 5 x 4 cm 2 .
- a long pulse (250 ns) XeF laser (308 nm) providing maximum energy 150 mJ per pulse with a 1.9 x 2.4 cm 2 rectangular beam or a short pulse (20 ns) KrF (248 nm) laser providing a maximum energy of 180 mJ per pulse with a rectangular beam of 1 , 5 x 4 cm 2 .
- Other lasers for example a tripled or quadrupled Nd: YAG laser, can of course be used, provided that the characteristics are adjusted to the desired objective.
- FIGS. 2 and 3 correspond to the simplest embodiment in which a support 1 of a transparent material is coated with a continuous film of TCO, such as a tin oxide and indium (ITO) having in this example a thickness of 70 nm. It would obviously be possible to use another TCO, such as In 2 O 3 or Sn O 2 doped with Sb, and to have a different thickness, for example between 50 and 100 nm, preferably between 65 and 75 nm.
- TCO such as tin oxide and indium (ITO) having in this example a thickness of 70 nm.
- another TCO such as In 2 O 3 or Sn O 2 doped with Sb
- non-conductive spaces 9 created by nanofissures 11 passing through the ITO film and electrically separating the electrodes 7 and the contact zones 15 are formed.
- the substrate consists of a support 1, which is in this example PMMA, on which is deposited an intermediate layer 3 made of a non-conductive hard hard material (hardcoating).
- This intermediate layer which protects the PMMA and which contributes to stabilize the base of the ITO after nanofissuration, is for example composed of a resin incorporating SiO 2 and its thickness is of the order of 20 microns.
- This substrate is placed in the chamber 2, then subjected through the mask 10 to the UV radiation of a source 14.
- the figure 5 schematically represents the formation of nanofissures 11 creating the non-conductive spaces 9 separating the electrodes 7 and the contact zones 15.
- the figure 6 represents an optional step in which the substrate remains in the chamber 2, but where the mask 10 has been replaced by another mask whose radiation-transparent window delimits the useful contour of the transparent substrate.
- a precursor gas is then introduced into the chamber via the supply duct 4, which makes it possible to deposit a protective film 13 by performing a new adjustment of the characteristics of the UV radiation.
- the film 13 is for example constituted by a deposition of uniform thickness of SiO 2 and TiO 2 optionally modified to have anti-reflection properties.
- the film 13 also allows one hand to stabilize the nanofissures 11 in time, on the other hand to make the electrodes even less visible by filling the spaces between the nanofissures.
- the Figures 7 to 11 show on examples how to adjust the characteristics of UV radiation.
- three identical samples were taken comprising an intermediate layer having a thickness of 20 ⁇ m onto which a 70 nm thick ITO film was deposited and a surface of 3 ⁇ 4 mm was illuminated with an excimer laser. at 308 nm long pulses with 20 pulses at 5 Hz, varying the fluence.
- the diagram shown in figure 7 corresponds to an assembly for measuring the electrical characteristics of the samples in the illuminated area.
- the "sample portion 23" is taken between two tips 24 0.3 to 0.5 mm apart on either side of a nanofissure, as shown in FIG. figure 8 . It is also possible to use a loop-shaped end (not shown), that is to say to have a softened contact to prevent deterioration of the ITO film by the tips.
- the resistance between tips is 180 ⁇ for a current flowing through the sample of 1.5 mA with a calibrated resistor of 670 ⁇ .
- the observed image was redrawn by reflection microscopy with a magnification of about 15 times, after irradiation with a laser beam having the above characteristics and a fluence of 65 mJ / cm 2 . It is observed that nonofissures are numerous. By performing the same electrical measurements as for the non-illuminated sample with the same distance between measuring points, the alternating current is no longer measurable ("0.2 ⁇ A), which means that the ITO other of the crack 11 are sufficiently electrically insulated.
- the nanofissure has a maximum depth of 75 nm, that is to say that the base of said nanofissure penetrates very slightly into the hardcoating insulator 3 making the lower edges of the nanofissure are electrically separated by about 70 nm. It can also be seen that, at the upper part, the maximum width of the nanofissure 11 is of the order of 500 nm, that is to say a width much too small to be detected with the naked eye.
- fissures are also obtained, as shown in FIG. figure 9 , but with a small variation in electrical characteristics.
- an initial resistance of 670 Q a resistance between 800 ⁇ peaks and a current of 1.19 mA is observed, meaning that there is still a significant conductivity at the crack.
- AFM imaging it is indeed possible to determine that the maximum depth of the crack is 66 nm, that is to say that there remains an electrical conduction junction at the base of the crack.
- zones 22 are formed in which the ITO film is torn off to a width sufficient to make the zone separating the electrodes visible to the naked eye.
- the electrical conductivity is obviously interrupted, but it is then necessary to carry out a complementary manufacturing step to obtain an optical compensation, for example according to the method proposed in the application EP No. 1,457,865 already mentioned.
- the skilled person can therefore easily, by some preliminary tests, determine the optimal conditions for causing nanofissures without removal of material, but so sufficient to interrupt the electrical conductivity between electrodes.
Abstract
Description
La présente invention a pour objet un substrat transparent ayant au moins une face pourvue d'électrodes transparentes dont la structuration est telle que leurs contours ne peuvent pas être perçus par un observateur dans le domaine de longueurs d'ondes de la lumière visible.The present invention relates to a transparent substrate having at least one face provided with transparent electrodes whose structure is such that their contours can not be perceived by an observer in the wavelength range of visible light.
L'invention concerne également des dispositifs, généralement des appareils électroniques, comportant un ou plusieurs substrats transparents à électrodes invisibles dans lesquels les électrodes ont des rôles de commandes ou de collecteurs d'énergie, et plus particulièrement de tels dispositifs disposés au-dessus de l'affichage d'un appareil électronique sur lequel on doit pouvoir lire les informations dudit affichage, sans être gêné par la structuration et l'agencement des électrodes.The invention also relates to devices, generally electronic devices, comprising one or more transparent substrates with invisible electrodes in which the electrodes have control or energy collector roles, and more particularly such devices arranged above the electrodes. display of an electronic device on which the information of said display must be read without being hindered by the structuring and the arrangement of the electrodes.
L'invention concerne également un procédé permettant d'effectuer, de façon économique et avec une grande précision, une structuration des électrodes sur un substrat transparent quelconque tout en procurant une compensation optique entre les électrodes permettant de rendre leurs contours invisibles.The invention also relates to a method for performing, economically and with high precision, structuring of the electrodes on any transparent substrate while providing optical compensation between the electrodes to make their contours invisible.
Des solutions ont déjà été proposées pour que l'interface constituée par des électrodes disposées entre un affichage et un observateur reste la plus discrète possible et ne nuise pas à l'aspect esthétique de l'appareil électronique, notamment dans le cas d'une pièce d'horlogerie. On connaît par exemple des montres-bracelets dont la face intérieure de la glace comporte des électrodes permettant une commande tactile des fonctions horaires ou non horaires par effet capacitif ou résistif, comme cela est décrit de façon non limitative dans les
Pour réaliser les électrodes on utilise de façon connue des oxydes conducteurs transparents (TCO), c'est-à-dire des matériaux qui sont à la fois bon conducteurs et transparents dans le visible, tels que l'oxyde d'étain et d'indium (ITO), In2O3 ou SnO2 dopé à l'antimoine. On peut également utiliser comme film conducteur servant à la structuration des électrodes des polymères conducteurs transparents qui sont des composés organiques à doubles liaisons conjuguées dont la conductivité peut être améliorée par dopage chimique ou électrochimique. II s'agit par exemple d'un polyacétylène ou de polyanilines telles que l'Ormecon®. Ces dépôts, de l'ordre de 50 à 100nm, sont effectués directement sur le substrat transparent ou sur une couche intermédiaire par un grand nombre de techniques connues telles que la pulvérisation, l'évaporation, la technique sol-gel, ainsi que des techniques de dépôt en phase vapeur (CVD), dont on retiendra particulièrement le dépôt assisté par laser (LICVD).To achieve the electrodes transparent conductive oxides (TCO) are used in known manner, that is to say materials which are both good conductors and transparent in the visible, such as tin oxide and indium (ITO), In 2 O 3 or SnO 2 doped with antimony. It can also be used as a conductive film for structuring electrodes of transparent conductive polymers which are conjugated double bond organic compounds whose conductivity can be enhanced by chemical or electrochemical doping. It is for example a polyacetylene or polyanilines such as Ormecon®. These deposits, of the order of 50 to 100 nm, are made directly on the transparent substrate or on an intermediate layer by a large number of known techniques such as spraying, evaporation, sol-gel technique, and techniques. of vapor deposition (CVD), which will particularly note laser assisted deposition (LICVD).
En ce qui concerne la structuration des électrodes, il existe également différentes méthodes connues mises en oeuvre, en utilisant au moins un masque correspondant au contour des électrodes, soit lors du dépôt du TCO par cristallisation localisée d'un film sol-gel par irradiation avec un laser UV, soit en effectuant sur un film continu de TCO une attaque chimique, ou une ablation localisée en irradiant avec un laser UV à une fluence suffisante ou une ablation mécanique, comme décrit dans le
D'autre part, l'emploi de composés chimiques très agressifs dans les procédés de gravage sélectif peut conduire à une dégradation du substrat ou d'une couche intermédiaire interposée entre ledit substrat et le film de TCO, telle que les espaces non conducteurs entre les électrodes peuvent encore rester perceptibles à l'oeil nu, quelle que soit la façon de garnir lesdits espaces non conducteurs. Ces espaces non conducteurs peuvent également être visibles en raison de la difficulté à les garnir sans former ni bourrelets, ni dépressions susceptibles de dévier les rayons lumineux, étant donné qu'il est nécessaire d'utiliser deux masques complémentaires, respectivement pour la gravure et pour le garnissage.On the other hand, the use of very aggressive chemical compounds in selective etching processes can lead to a degradation of the substrate or an intermediate layer interposed between said substrate and the TCO film, such as non-conductive spaces between the electrodes can still remain perceptible to the naked eye, regardless of how to fill said non-conductive spaces. These non-conductive spaces may also be visible because of the difficulty of filling them without forming beads or depressions capable of deflecting the light rays, since it is necessary to use two complementary masks, respectively for etching and for the lining.
Pour pallier l'inconvénient sus-indiqué, le procédé proposé dans la demande
Il est toutefois apparu de façon surprenante que la conductivité électrique pouvait être abaissée à niveau si faible que deux électrodes proches soient isolées électriquement, sans pour autant éliminer le TCO, ce qui permet de maintenir les propriétés optiques initiales, et donc de rendre invisibles les contours des électrodes, quel que soit l'angle sous lequel on observe un substrat transparent comportant lesdites électrodes.Surprisingly, however, it appeared that the electrical conductivity could be lowered to such a low level that two adjacent electrodes were electrically isolated, without however eliminating the TCO, which makes it possible to maintain the initial optical properties, and thus to make the contours invisible. electrodes, regardless of the angle under which there is a transparent substrate having said electrodes.
A cet effet, l'invention a pour objet un substrat transparent à électrodes invisibles comprenant un support transparent sur lequel est déposé un film transparent conducteur dans lequel des électrodes sont structurées avec des contours séparés par des espaces non conducteurs. Le substrat est caractérisé en ce que le film conducteur se trouvant à l'emplacement desdits espaces non conducteurs comporte des nanofissures dont le plus grand nombre traverse toute l'épaisseur du film conducteur en permettant d'interrompre la conductivité électrique entre électrodes voisines, sans modifier le trajet d'un rayon lumineux d'une façon perceptible à l'oeil nu. Les bords de ces nanofissures sont au plus écartées de quelques microns et ne peuvent être vus par un observateur dont l'acuité visuelle ne lui permet pas de distinguer, en vision rapprochée (20 - 30 cm), des objets distants de moins de 1/10 de millimètre.To this end, the subject of the invention is a transparent substrate with invisible electrodes comprising a transparent support on which is deposited a transparent conductive film in which electrodes are structured with contours separated by non-conductive spaces. The substrate is characterized in that the conductive film at the location of said non-conductive spaces comprises nanofissures, the greater number of which crosses the entire thickness of the conductive film, making it possible to interrupt the electrical conductivity between adjacent electrodes, without modifying the path of a ray of light in a manner noticeable to the naked eye. The edges of these nanofissures are at most separated by a few microns and can not be seen by an observer whose visual acuity does not allow him to distinguish, in close vision (20 - 30 cm), objects distant from less than 1 / 10 millimeters.
Le film conducteur peut être un oxyde conducteur transparent (TCO), mais aussi un polymère conducteur transparent. Toutefois, dans la suite de la description on se référera essentiellement aux TCO qui sont les produits les plus connus pour réaliser des électrodes transparentes.The conductive film may be a transparent conductive oxide (TCO), but also a transparent conductive polymer. However, in the remainder of the description, reference will be made essentially to TCOs, which are the most known products for producing transparent electrodes.
Dans un mode de réalisation préféré, préalablement au dépôt du film de TCO, le support transparent est revêtu d'une couche en un matériau dur transparent non conducteur (Hard coating) qui contribue à la formation des nanofissures.In a preferred embodiment, prior to the deposition of the TCO film, the transparent support is coated with a layer of hard non-conductive hard material (Hard coating) which contributes to the formation of nanofissures.
Selon un autre mode de réalisation préféré, après la structuration des électrodes, toute la surface du substrat, c'est-à-dire les électrodes et les espaces non conducteurs, à l'exception éventuellement des zones de contact des électrodes, est recouverte d'un film protecteur, pouvant également avoir des propriétés anti-reflets et contribuant à stabiliser les nanofissures au cours du temps.According to another preferred embodiment, after the structuring of the electrodes, the entire surface of the substrate, that is to say the electrodes and the non-conductive spaces, with the possible exception of the contact zones of the electrodes, is covered with a protective film, which can also have anti-reflection properties and helps stabilize the nanofissures over time.
Les nanofissures dans la couche de TCO sont obtenues par irradiation UV au moyen d'une source laser. Pour cela, le procédé consiste à :
- placer le substrat, formé du support et du film de TCO éventuellement déposé sur une couche intermédiaire, dans une enceinte fermée ayant une amenée de fluide gazeux et une sortie de pompage;
- interposer, entre la source de rayonnement UV et le substrat, un masque comportant des fenêtres transparentes au rayonnement UV, lesdites fenêtres reproduisant les contours désirés des espaces non conducteurs, et
- en fonction des matériaux utilisés pour former le substrat, de leurs épaisseurs et du choix de la source émettrice, ajuster les caractéristiques du rayonnement pour provoquer une nanofissuration du film de TCO sans enlèvement de matière.
- placing the substrate, formed of the support and the TCO film optionally deposited on an intermediate layer, in a closed chamber having a gaseous fluid supply and a pumping outlet;
- interposing, between the UV radiation source and the substrate, a mask having windows transparent to UV radiation, said windows reproducing the desired contours of the non-conductive spaces, and
- depending on the materials used to form the substrate, their thickness and the choice of the emitting source, adjust the characteristics of the radiation to cause nanofissuration of the TCO film without removal of material.
En ce qui concerne le choix de la source, on utilise de préférence un laser à excimère pulsé qui émet principalement dans l'ultraviolet et dont l'usage est connu pour effectuer de la photoablation ou du marquage. Il s'agit par exemple d'un excimère KrF (λ = 248 nm) à impulsions courtes (20 ns) ou d'un excimère XeF (λ = 308 nm) à impulsions longues (250 ns). Par "caractéristiques du rayonnement" on entend la fluence, le nombre d'impulsions et leur fréquence.As regards the choice of the source, a pulsed excimer laser which emits mainly in the ultraviolet light and whose use is known to carry out photoablation or marking is preferably used. It is, for example, a short-pulse (20 ns) KrF (λ = 248 nm) excimer or a long-pulse (250 ns) XeF (λ = 308 nm) excimer. By "radiation characteristics" is meant the fluence, the number of pulses and their frequency.
L'ajustement de ces caractéristiques doit s'effectuer entre une limite inférieure où on peut observer des fissures, mais sans baisse suffisante de la conductivité électrique, et une limite supérieure provoquant l'ablation de la couche de TCO rendant les contours des électrodes visibles, étant donné que l'espace isolant usuel entre les électrodes est de l'ordre de quelques dixièmes de millimètres. Il est évidemment possible, comme indiqué dans la demande
Le procédé selon l'invention présente donc l'avantage de ne pas nécessiter l'étape ci-dessus, et donc d'être plus économique. Il n'impose pas non plus le choix délicat d'un matériau diélectrique ayant un indice de réfraction et une épaisseur adaptés pour obtenir une compensation optique satisfaisante, compte tenu des caractéristiques propres du film de TCO (indice de réfraction et épaisseur).The method according to the invention therefore has the advantage of not requiring the above step, and therefore of being more economical. Nor does it impose the delicate choice of a dielectric material having a refractive index and a thickness adapted to obtain a satisfactory optical compensation, given the specific characteristics of the TCO film (refractive index and thickness).
Après la structuration des électrodes, il peut être avantageux de laisser le substrat dans l'enceinte, de remplacer le masque précédent par un autre masque dont la fenêtre transparente aux UV permet d'effectuer le dépôt d'un film protecteur transparent sur tout le substrat, c'est-à-dire les électrodes et les espaces non conducteurs, à l'exception éventuellement des zones de contact des électrodes, en introduisant un gaz précurseur dans l'enceinte. On choisit de préférence pour former le film protecteur un matériau dont la nature et l'épaisseur permettent d'avoir des propriétés anti-reflets. Le film présente également l'avantage de stabiliser les nanofissures dans le temps.After structuring the electrodes, it may be advantageous to leave the substrate in the enclosure, to replace the previous mask with another mask whose UV-transparent window makes it possible to deposit a transparent protective film on the entire substrate. , that is to say the electrodes and the non-conductive spaces, with the possible exception of the contact areas of the electrodes, by introducing a precursor gas into the chamber. To form the protective film, a material is preferably chosen whose nature and thickness make it possible to have anti-reflection properties. The film also has the advantage of stabilizing nanofissures over time.
Ainsi, un substrat transparent à électrodes invisibles est utilisable dans toutes les applications citées en préambule en offrant des qualités de transparence et d'uniformité supérieures à celles des produits connus de l'art antérieur.Thus, a transparent substrate with invisible electrodes is usable in all the applications mentioned in the preamble by offering qualities of transparency and uniformity superior to those of the known products of the prior art.
D'autres caractéristiques et avantages de la présente invention apparaîtront dans la description suivante, donnée à titre illustratif et non limitatif, en référence aux dessins annexés dans lesquels :
- la
figure 1 est une représentation schématique d'un dispositif permettant d'obtenir un substrat transparent à électrodes invisibles selon l'invention; - les
figures 2 et 3 représentent les étapes de fabrication d'un premier mode de réalisation; - les
figures 4, 5 et 6 représentent les étapes de fabrication d'un deuxième mode de réalisation; - la
figure 7 représente le schéma de montage permettant d'effectuer des mesures électriques; - la
figure 8 est une vue d'une zone diélectrique nanofissurée selon l'invention; - la
figure 9 correspond à lafigure 8 lorsque les caractéristiques du rayonnement UV sont insuffisantes; - la
figure 10 correspond à lafigure 8 lorsque les caractéristiques du rayonnement UV sont au contraire excessives, et - la
figure 11 est une image AFM d'une nanofissure référencée à lafigure 8 .
- the
figure 1 is a schematic representation of a device for obtaining a transparent substrate with invisible electrodes according to the invention; - the
Figures 2 and 3 represent the manufacturing steps of a first embodiment; - the
Figures 4, 5 and 6 represent the manufacturing steps of a second embodiment; - the
figure 7 represents the circuit diagram for performing electrical measurements; - the
figure 8 is a view of a nanofissured dielectric zone according to the invention; - the
figure 9 corresponds to thefigure 8 when the characteristics of UV radiation are insufficient; - the
figure 10 corresponds to thefigure 8 when the characteristics of the UV radiation are on the contrary excessive, and - the
figure 11 is an AFM image of a nanofissure referenced to thefigure 8 .
La
La source de rayonnement UV est constituée par un laser eximère, tel qu'un laser XeF (308 nm) à impulsions longues (250 ns) fournissant une énergie maximale de 150 mJ par impulsion avec un faisceau rectangulaire de 1,9 x 2,4 cm2, ou un laser KrF (248 nm) à impulsions courtes (20 ns) fournissant une énergie maximale de 180 mJ par impulsion avec un faisceau rectangulaire de 1,5 x 4 cm2. D'autres lasers, par exemple un laser Nd:YAG triplé ou quadruplé, peuvent évidemment être utilisés, à condition d'en ajuster les caractéristiques au but recherché.The UV radiation source is an eximeric laser, such as a long pulse (250 ns) XeF laser (308 nm) providing maximum energy 150 mJ per pulse with a 1.9 x 2.4 cm 2 rectangular beam, or a short pulse (20 ns) KrF (248 nm) laser providing a maximum energy of 180 mJ per pulse with a rectangular beam of 1 , 5 x 4 cm 2 . Other lasers, for example a tripled or quadrupled Nd: YAG laser, can of course be used, provided that the characteristics are adjusted to the desired objective.
Les
A la
La
La
Les
Le schéma représenté à la
Lorsque l'échantillon n'a subi aucune irradiation UV, la résistance entre pointes est de 180 Ω pour un courant traversant l'échantillon de 1,5 mA avec une résistance calibrée de 670 Ω.When the sample has not undergone any UV irradiation, the resistance between tips is 180 Ω for a current flowing through the sample of 1.5 mA with a calibrated resistor of 670 Ω.
A la
Cela est confirmé par l'imagerie AFM faite à travers une nanofissure et représentée à la
En effectuant sur un deuxième échantillon la même irradiation mais avec une fluence plus faible, à savoir de 60 mJ/cm2, on obtient également des fissures, comme représenté à la
Inversement, en se référant à la
Il est bien évident que l'homme de métier peut, en fonction d'une part de la nature du film de TCO, voire de celle de la couche intermédiaire et de leurs épaisseurs respectives, définir les caractéristiques du rayonnement UV en fonction de la source laser utilisée pour se situer entre une limite inférieure où l'interruption de conductivité électrique est insuffisante et une limite supérieure où il se produit un arrachage de TCO.It is obvious that one skilled in the art can, depending on a part of the nature of the TCO film, or even that of the intermediate layer and their respective thicknesses, define the characteristics of the UV radiation depending on the source laser used to be between a lower limit where the interruption of electrical conductivity is insufficient and an upper limit where there is TCO pulling.
Ainsi on peut, dans les mêmes conditions de mesures que celles décrites en référence à la
En utilisant un laser à 248 nm, impulsions courtes, on obtient également le résultat correspondant à la
En fonction de la source laser utilisée qui n'est pas limité à un laser à eximère, l'homme de métier peut donc facilement, par quelques essais préliminaires, déterminer les conditions optimales permettant de provoquer des nanofissures sans enlèvement de matière, mais de façon suffisante pour interrompre la conductivité électrique entre électrodes.Depending on the laser source used which is not limited to an eximer laser, the skilled person can therefore easily, by some preliminary tests, determine the optimal conditions for causing nanofissures without removal of material, but so sufficient to interrupt the electrical conductivity between electrodes.
Claims (16)
- Transparent substrate with invisible electrodes including a transparent support (1) on which there is deposited a transparent conductive film (5),
characterized in that fissures (11) whose maximum width is less than the human acuteness of vision are incorporated in the transparent conductive film (5) in order to define non-conductive spaces (9) appropriate to structure in a non visible manner in said transparent conductive film electrodes (7) and their contact zones (15). - Substrate according to claim 1, characterized in that the transparent conductive film (5) is a transparent conductive oxide (TCO), selected from the group comprising tin and indium oxide (ITO), In2O3 and SnO2 doped with Sb.
- Substrate according to claim 2, characterized in that the conductive film (5) is an ITO film having a thickness comprised between 50 and 100 nm, preferably between 65 and 75 nm.
- Substrate according to claim 1, characterized in that the transparent conductive film (5) is a doped conductive polymer with conjugated double bonds selected from among a polyacetylene and polyanilines.
- Substrate according to any of the preceding claims, characterized in that an intermediate layer (3) made of a transparent hard non-conductive material or hardcoating is inserted between the support (1) and the transparent conductive film (5).
- Substrate according to claim 5, characterized in that the intermediate layer (3) is formed of a resin incorporating SiO2 and having a thickness at least equal to 20 µm.
- Substrate according to any of the preceding claims, characterized in that the majority of the fissures (11) pass through the entire conductive film.
- Substrate according to any of the preceding claims, characterized in that the support (1) is made of a material selected from among polymethylene methacrylate (PMMA) and polycarbonate (PC).
- Substrate according to any one of the preceding claims, characterized in that the electrodes (7) and the non-conductive spaces (9) are further coated with a protective film (13) also able to have anti-reflective properties, said protective film (13) not covering the contact zones (15) of the electrodes (7).
- Substrate according to any of the preceding claims, characterized in that it forms a touch-type control screen for an electronic apparatus in which it is integrated.
- Substrate according to any of claims 1 to 9, characterized in that it forms at least one closing plate for a liquid crystal display cell or a photovoltaic cell for an electronic apparatus.
- Method of manufacturing a transparent substrate with invisible electrodes including a transparent support (1) on which there is deposited a transparent conductive film (5) wherein electrodes (7) are structured with contours separated by non-conductive spaces (9), by UV radiation by means of a radiation source (14),
characterized in that it comprises of the following steps:- placing the substrate, formed of the support (1) and the transparent conductive film (5) possibly deposited on an intermediate layer (3) made of a transparent hard non-conductive material, in a sealed enclosed space (2) having a gaseous fluid supply inlet (4) and a pump outlet (6);- inserting, between the UV radiation source (14) and the substrate, a mask (10) including windows (12) transparent to UV radiation, said windows corresponding to the non-conductive spaces (9), and- adjusting, as a function of the choice of materials used for the substrate and the emitting source (14), the UV radiation features to cause fissures to be created in the transparent conductive film (5) whose maximum width is less than the human acuteness of vision in the radiated zone. - Method according to claim 12, characterized in that it includes an additional step of depositing a conductive film (13), which may be anti-reflective, from a precursor gas with the same UV source (14), but replacing the mask (10) used by another mask corresponding to the desired useful surface of the transparent substrate, while leaving the contact zones (15) of the electrodes (7) visible.
- Method according to claim 12, characterized in that the transparent conductive film (5) is a transparent conductive oxide (TOC) selected from the group comprising tin and indium oxide (ITO), In2O3 and SnO2 doped with Sb.
- Method according to claim 12, characterized in that the transparent conductive film (5) is a doped conductive polymer selected from among a polyacetylene and polyanilines.
- Method according to claim 12, characterized in that the source (14) is formed by an excimer laser selected from among XeF long pulse lasers and KrF short pulse lasers.
Priority Applications (9)
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EP03027566A EP1538514B1 (en) | 2003-12-01 | 2003-12-01 | Transparent substrate with invisible electrodes and devices incorporating the same |
ES03027566T ES2311666T3 (en) | 2003-12-01 | 2003-12-01 | TRANSPARENT SUBSTRATE, WITH INVISIBLE ELECTRODES AND DEVICES THAT INCLUDE IT. |
AT03027566T ATE403184T1 (en) | 2003-12-01 | 2003-12-01 | TRANSPARENT SUBSTRATE WITH INVISIBLE ELECTRODES AND DEVICES COMPRISING THIS SUBSTRATE |
DE60322549T DE60322549D1 (en) | 2003-12-01 | 2003-12-01 | Transparent substrate with invisible electrodes and devices with this substrate |
KR1020040096668A KR101093301B1 (en) | 2003-12-01 | 2004-11-24 | Transparent substrate with invisible electrodes and devices incorporating the same |
CNB200410095531XA CN100472301C (en) | 2003-12-01 | 2004-11-29 | Transparent substrate with invisible electrodes and device incorporating the same |
US10/998,800 US7843061B2 (en) | 2003-12-01 | 2004-11-30 | Transparent substrate with invisible electrodes and device incorporating the same |
JP2004348546A JP4836442B2 (en) | 2003-12-01 | 2004-12-01 | Transparent substrate with invisible electrode and device incorporating the same |
HK05109898.9A HK1077887A1 (en) | 2003-12-01 | 2005-11-07 | Transparent substrate with invisible electrodes and devices incorporating the same |
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EP03027566A EP1538514B1 (en) | 2003-12-01 | 2003-12-01 | Transparent substrate with invisible electrodes and devices incorporating the same |
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EP1538514A1 EP1538514A1 (en) | 2005-06-08 |
EP1538514B1 true EP1538514B1 (en) | 2008-07-30 |
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EP (1) | EP1538514B1 (en) |
JP (1) | JP4836442B2 (en) |
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EP2109116B1 (en) * | 2007-01-16 | 2012-04-25 | Teijin Limited | Transparent conductive multilayer body and touch panel made of the same |
CN101330796B (en) * | 2007-06-22 | 2011-08-17 | 宝创科技股份有限公司 | Turn-on structure and application thereof |
JP5380723B2 (en) * | 2007-08-07 | 2014-01-08 | Nltテクノロジー株式会社 | Surface display device and electronic device |
US8068710B2 (en) | 2007-12-07 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | Decoupled holographic film and diffuser |
US8118468B2 (en) | 2008-05-16 | 2012-02-21 | Qualcomm Mems Technologies, Inc. | Illumination apparatus and methods |
US9274553B2 (en) | 2009-10-30 | 2016-03-01 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
EP2519868A1 (en) | 2009-12-29 | 2012-11-07 | Qualcomm Mems Technologies, Inc. | Illumination device with metalized light-turning features |
CN102236457A (en) * | 2010-04-28 | 2011-11-09 | 友发科技股份有限公司 | Touch element |
KR101489161B1 (en) | 2010-07-30 | 2015-02-06 | 주식회사 잉크테크 | Method for manufacturing transparent conductive layer and transparent conductive layer manufactured by the method |
TWI490789B (en) * | 2011-05-03 | 2015-07-01 | Synaptics Inc | Fingerprint sensor and integratable electronic display |
WO2015083874A1 (en) * | 2013-12-03 | 2015-06-11 | 재단법인 멀티스케일 에너지시스템 연구단 | High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same |
CN104699310A (en) * | 2015-03-31 | 2015-06-10 | 合肥京东方光电科技有限公司 | Touch screen and manufacturing method thereof |
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- 2003-12-01 EP EP03027566A patent/EP1538514B1/en not_active Expired - Lifetime
- 2003-12-01 AT AT03027566T patent/ATE403184T1/en active
- 2003-12-01 ES ES03027566T patent/ES2311666T3/en not_active Expired - Lifetime
-
2004
- 2004-11-24 KR KR1020040096668A patent/KR101093301B1/en not_active IP Right Cessation
- 2004-11-29 CN CNB200410095531XA patent/CN100472301C/en not_active Expired - Fee Related
- 2004-11-30 US US10/998,800 patent/US7843061B2/en active Active
- 2004-12-01 JP JP2004348546A patent/JP4836442B2/en not_active Expired - Fee Related
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2005
- 2005-11-07 HK HK05109898.9A patent/HK1077887A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7843061B2 (en) | 2010-11-30 |
JP2005165329A (en) | 2005-06-23 |
CN1624609A (en) | 2005-06-08 |
KR101093301B1 (en) | 2011-12-14 |
ATE403184T1 (en) | 2008-08-15 |
JP4836442B2 (en) | 2011-12-14 |
EP1538514A1 (en) | 2005-06-08 |
DE60322549D1 (en) | 2008-09-11 |
US20050116343A1 (en) | 2005-06-02 |
HK1077887A1 (en) | 2006-02-24 |
ES2311666T3 (en) | 2009-02-16 |
KR20050052992A (en) | 2005-06-07 |
CN100472301C (en) | 2009-03-25 |
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