EP1433114A1 - Method and arrangement for laser engraving a substrate surface - Google Patents
Method and arrangement for laser engraving a substrate surfaceInfo
- Publication number
- EP1433114A1 EP1433114A1 EP02779137A EP02779137A EP1433114A1 EP 1433114 A1 EP1433114 A1 EP 1433114A1 EP 02779137 A EP02779137 A EP 02779137A EP 02779137 A EP02779137 A EP 02779137A EP 1433114 A1 EP1433114 A1 EP 1433114A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- engraving
- substrate
- laser
- line
- movements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/007—Marks, e.g. trade marks
Definitions
- the invention relates to a method for producing a laser engraving into a surface of a substrate, in which a laser beam is directed at beam intervals or continuously onto the surface to be engraved during an engraving process, the substrate moving in an xy plane perpendicular to the beam direction during the engraving process is and the movements of the substrate movements of the laser beam in the x and y directions are superimposed.
- US Pat. No. 6,121,574 describes a method of the type mentioned in the introduction in which the substrate is moved in an x-y plane perpendicular to the beam direction during the engraving process and movements of the laser beam in the x and y directions are superimposed on the movements of the substrate.
- DE 198 40 926 AI describes an arrangement in which several laser beams are combined in one laser spot. It is possible to move the substrate in the vertical z-direction to compensate for different substrate heights and to keep the laser beam focused on the respective surface.
- Beam shaping diaphragms are arranged in the beam path of the laser beam generated by the laser generator.
- these shield part of the laser beam in order to bring it into the form, for example of alphanumeric characters, which are to be applied to the surface of a substrate.
- the beam shaping shutters serve to to split the shaped laser beam into several partial beams, which then ensure that the character to be engraved consists of several points generated by the partial beams, which considerably improves readability.
- a focusing unit is provided for imaging the beam shaped in this way.
- This focusing unit is used to focus the laser beam on the surface of the substrate lying on the substrate support and thus to sharply image the character embossed via the beam shaping diaphragm, which is then engraved into the surface by ablation.
- the laser beam is either constantly directed at the surface of the substrate or a so-called pulse laser is used, which irradiates the surface at beam intervals.
- this solution requires the entire mask drum to be replaced when a mask part that bears, for example, the most frequently used symbol is worn, which results in a considerable amount of maintenance.
- a beam deflection unit in the form of a deflection mirror is also provided, which deflects the laser beam in order to bring it onto the surface of the substrate. This deflection takes place in the beam path before passing through the planfeid lens.
- a flat field lens is used.
- a method is known from DE 37 28 622 Cl and DE 196 12 406 C2 in which information that is macroscopically, ie essentially visible to the naked eye, is superimposed or embedded with information that is not visible macroscopically.
- This information can consist of a machine-readable form, such as a barcode, or simply by omitting burn-in points or by realizing small and large burn-in points. This either produces machine-readable information, which, however, cannot be produced with justifiable effort using laser technology, or the information width is very limited if pixels are omitted.
- the object of the invention is now to create an individual and freely programmable laser engraving in the surface. nes substrate together with an invisible information with an approximately the same manufacturing time compared to conventional laser engraving.
- the laser engraving consists of a macroscopic structure which is composed of a pattern of microscopic engraving elements, the information encoded in the structure being impressed by macroscopically invisible deviations of the pattern from a desired pattern by the Structure by means of the x and y movements of the substrate and the deviations are generated by means of the x and y movements of the laser beam.
- the shape of the character can therefore be set via the movement of the substrate. This makes it possible to create a wide variety of characters with a simple change in the movement program. This allows the production of so-called micro-engravings, in which the characters consist of engraving points within a matrix. Information is encrypted behind the presence or absence of engraving points within this matrix.
- the simple change of the pattern to be engraved by the method according to the invention allows even substrate-specific patterns to be engraved and, furthermore, substrate-specific coded information to be engraved by means of micro-engraving and thus stored.
- the laser engraving consists of a macroscopic structure, which is composed of a pattern of microscopic engraving elements, information encoded on the structure is imprinted by macroscopically invisible deviations of the pattern from a target pattern. This creates the possibility of accommodating non-visible information in a normally visible structure, which in turn can convey visible information. This invisible information can then be read out again by appropriately enlarging the structure and by comparing the pattern, ie the actual pattern, with the target pattern.
- the information is introduced with two movements, in that the structure is generated by means of the x and y movements of the substrate and the deviations are generated by means of the x and y movements of the laser beam. Since the deviations only require very small geometric changes in the position of the laser beam on the substrate surface, which, however, have to be carried out with some precision, it is advisable not to use the relatively slow movement of the substrate for this, but to move the massless laser beam, which can be done with higher speed and greater precision.
- the substrate is moved in a z-direction parallel to the beam direction during the engraving process.
- This configuration makes it possible to take into account different surface structures and / or different material thicknesses of the substrates.
- the movement in the z direction is dependent on the structure of the surface. This is done in such a way that the focus of the laser beam is always on the surface at different positions of the substrate in the xy plane.
- a known surface structure of the substrates to be engraved one after the other can be taken into account in a control program, the surface structure can be programmed as it were. This then controls the z movement depending on the substrate position in the xy plane.
- Another way of controlling the z movement is to regulate the focusing. Here, it is measured to what extent the laser beam is sharply imaged on the surface of the substrate and the z movement is accordingly initiated until the focus of the laser beam is imaged on the surface.
- the beam is shaped via beam shaping diaphragms and the shape of the beam shaping diaphragms is sharply imaged on the surface as an engraving point.
- the movements of the substrate take place discontinuously. This enables a point-by-point engraving in such a way that the substrate remains in a first position, is then moved to the next position, remains there again, etc.
- a further embodiment of the discontinuous movement consists in the fact that when beam intervals are used, the movements take place in time intervals between the beam intervals.
- a step-by-step operation is thus realized: a laser pulse with relatively high energy generates the point-like engraving during a pulse interval. After the laser pulse and before the next one, the position of the substrate is changed. This offers the advantage that it is possible to work with relatively high radiation energy and that the engraving points are imaged very precisely, since ablation occurs the surface of the substrate is avoided during the process.
- the laser engraving consists of a large number of macroscopic structures. In this way, for example, visible points can be lined up. The individual structures can in turn serve to group information.
- the target pattern is a matrix of set or not set engraving elements.
- the deviations are then formed by omitting or adding or by engraving elements.
- This matrix is visible as a small dot or small square. It is possible to achieve a high information density on the smallest geometrical area. Due to the small geometrical extent of the matrix, the information can also be stored on curved surfaces, since the small geometrical extent results in only an insignificant spatial extension of the structure even with a strong curvature. This makes both writing and reading the information considerably easier.
- the matrix is provided with a matrix frame made of engraving elements.
- the matrix In the macroscopic area, the matrix always appears as a geometric structure, regardless of the number of engraving elements inserted or missing.
- Such a matrix frame also precisely defines the boundaries of the matrix.
- the target pattern is selected as engraving elements lying on a line and the deviations are formed by a macroscopically invisible offset of the engraving elements from the line.
- a line appears straight to the viewer because he does not perceive the offset, even though further information is not visibly stored in the line itself.
- the target pattern is chosen as engraving elements lying one behind the other on a double line, the line spacing of which lies in the microscopic range. The engraving elements lie on the one line of the double line in the representation of a logical 0 in the coded information and on the other line of the double line in the case of the representation of a logical 1. This results in an exact assignment of the lateral offset and thus an increase in the detection accuracy.
- the information can even be encoded twice in binary.
- FIG. 1 is a perspective view of an arrangement according to the invention with a simple steel deflection unit
- FIG. 2 is a perspective view of an arrangement according to the invention with a galvanometer head
- FIG. 3 shows a representation of a micro-engraving produced by the method according to the invention in the form of a matrix
- the arrangement shown in FIG. 1 has a laser generator 1 that generates a laser beam 2.
- This laser beam 2 passes through a beam shaping diaphragm 3, which is designed as a pinhole.
- One of the laser beams is serstrahl 2 shaped with a sharply defined circular cross section. It can be reproduced in good quality later.
- the laser beam 2 undergoes another shape correction in a correction diaphragm 4.
- the laser beam passes through a beam deflection unit 5, in which a deflection mirror 6 is arranged, which deflects the laser beam 2 perpendicular to its previous direction.
- This deflected laser beam 2 is focused in a focusing unit 7, which consists of a simple focusing lens, which is connected to the beam deflection unit 5.
- a substrate support 9 is provided, which is connected to an x-y cross table 10.
- This x-y cross table 10 can be moved in an x-y plane which is determined by the directions of movement x and y and which is perpendicular to the direction of the deflected laser beam 2.
- a z drive 1 is provided under the x-y cross table 10, through which the x-y cross table 10 and thus the substrate support 9 can be moved in a z direction lying parallel to the laser beam 2.
- This arrangement allows a so-called micro-engraving, as shown in FIG. 3, to be produced on a substrate 12 which rests on the substrate support 9 and is fixed there in a manner not shown in any more detail.
- This micro engraving consists of engraving elements, which in this example are designed as engraving points 13. However, these engraving elements can also have other shapes, and the choice of shape can also already contain information.
- the engraving points 13 are arranged within a matrix 14. Behind the presence or absence of engraving points 13- Within this matrix 14, information, for example about the substrate 12, is encrypted in that the pattern which is generated with the engraving points 13 within the matrix 14 is of a desired pattern which, in the case of the completely filled matrix 14, would correspond , deviates.
- the matrix 14 is provided with a matrix frame 15. The engraving points 13 in the matrix frame 15 are not available for coding the information.
- the x-y cross table 10 moves the substrate 12 below the focus 8, so that the focus 8 lies on the engraving point 13 to be generated. Since the substrate 12 is not flat, the focus 8 is precisely adjusted by means of the z drive 11.
- the substrate 12 remains in this position until the engraving point 13 is created. The same procedure is then followed at the next engraving point 13 to be generated in the matrix 14.
- the positioning of the focus 8 on the substrate 12 requires a high degree of accuracy, which must be realized by the x-y cross table 10. This requires a high manufacturing effort and also involves longer positioning times.
- Beam deflection unit 5 in FIG. 1 is provided with a galvanometer head 16.
- the galvanometer head 16 includes a first one
- the first galvanometer mirror 17 is about a first axis
- the second galvanometer mirror 18 is about a second axis
- the xy plane is an imaginary and not shown E- plane that expands in the x and y directions.
- the galvanometer mirrors 17 and 18 are magnetically biased and deflected by an electric field. This makes it possible to carry out deflections of the focus 8 with high speed and high precision. With this arrangement, a movement of the focus 8 can be superimposed on the movement of the substrate 12. This makes it much easier to generate the only microscopically visible deviations of the pattern from engraving points 13.
- the electrical control of the galvanometer mirrors 17 and 18 also offers the possibility that the information can be written directly from a computing device.
- the laser engraving consists of a macroscopic structure 21, which is composed of a pattern of engraving points 13. Information coded to structure 21 has been impressed on it by macroscopically invisible deviations of the pattern from a target pattern.
- the pattern is designed as engraving points 13 lying one behind the other on a double line 24.
- the line spacing of the double line 24 is in the microscopic range.
- the engraving points 13 lie on the one line of the double line 24 in the representation of a logical 0 in the coded information and on the other line of the double line 24 in the case of a logical 1.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10148759 | 2001-10-02 | ||
DE10148759A DE10148759B8 (en) | 2000-10-02 | 2001-10-02 | A method of producing a laser engraving in a surface of a substrate |
PCT/DE2002/003744 WO2003032236A1 (en) | 2001-10-02 | 2002-10-02 | Method and arrangement for laser engraving a substrate surface |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1433114A1 true EP1433114A1 (en) | 2004-06-30 |
Family
ID=7701229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02779137A Withdrawn EP1433114A1 (en) | 2001-10-02 | 2002-10-02 | Method and arrangement for laser engraving a substrate surface |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050045605A1 (en) |
EP (1) | EP1433114A1 (en) |
JP (1) | JP2005505837A (en) |
WO (1) | WO2003032236A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1016782A3 (en) * | 2005-09-22 | 2007-06-05 | Laser Engineering Applic | METHOD FOR INTERNAL LASER MARKING IN TRANSPARENT AND LASER MATERIALS AND DEVICE USED FOR THE APPLICATION OF SAID METHOD |
US8805095B2 (en) | 2010-12-03 | 2014-08-12 | International Business Machines Corporation | Analysing character strings |
WO2018216108A1 (en) * | 2017-05-23 | 2018-11-29 | 堺ディスプレイプロダクト株式会社 | Element base board production method and laser cleaning device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3786332A (en) * | 1969-03-19 | 1974-01-15 | Thomson Houston Comp Francaise | Micro positioning apparatus |
US4680459A (en) * | 1981-02-27 | 1987-07-14 | Drexler Technology Corporation | Updatable micrographic pocket data card |
DE3728622C1 (en) * | 1987-08-27 | 1988-05-19 | Daimler Benz Ag | Labeling of industrial products or individual parts thereof |
US5592211A (en) * | 1988-03-25 | 1997-01-07 | Texas Instruments Incorporated | Laser pattern/inspector with a linearly ramped chirp deflector |
US4970600A (en) * | 1989-04-04 | 1990-11-13 | Melco Industries, Inc. | Laser engraver with X-Y assembly and cut control |
JP2937361B2 (en) * | 1989-09-29 | 1999-08-23 | 日本電気株式会社 | Laser processing machine |
US6140602A (en) * | 1997-04-29 | 2000-10-31 | Technolines Llc | Marking of fabrics and other materials using a laser |
US6238847B1 (en) * | 1997-10-16 | 2001-05-29 | Dmc Degussa Metals Catalysts Cerdec Ag | Laser marking method and apparatus |
JP3557512B2 (en) * | 1997-12-03 | 2004-08-25 | ミヤチテクノス株式会社 | Laser marking method for 2D barcode |
DE19949542C2 (en) * | 1999-10-14 | 2002-07-11 | Orga Kartensysteme Gmbh | Process for the production of micro-writing on data carriers, in particular plastic cards |
-
2002
- 2002-04-17 US US10/491,382 patent/US20050045605A1/en not_active Abandoned
- 2002-10-02 EP EP02779137A patent/EP1433114A1/en not_active Withdrawn
- 2002-10-02 JP JP2003535131A patent/JP2005505837A/en not_active Withdrawn
- 2002-10-02 WO PCT/DE2002/003744 patent/WO2003032236A1/en active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO03032236A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20050045605A1 (en) | 2005-03-03 |
WO2003032236A1 (en) | 2003-04-17 |
JP2005505837A (en) | 2005-02-24 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20040408 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: RODENSTOCK GMBH Owner name: LASER 2000 GMBH |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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RTI1 | Title (correction) |
Free format text: METHOD FOR LASER ENGRAVING A SUBSTRATE SURFACE |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20080625 |