EP1399005A3 - Housing preform and electronic apparatus using the same - Google Patents

Housing preform and electronic apparatus using the same Download PDF

Info

Publication number
EP1399005A3
EP1399005A3 EP03017439A EP03017439A EP1399005A3 EP 1399005 A3 EP1399005 A3 EP 1399005A3 EP 03017439 A EP03017439 A EP 03017439A EP 03017439 A EP03017439 A EP 03017439A EP 1399005 A3 EP1399005 A3 EP 1399005A3
Authority
EP
European Patent Office
Prior art keywords
housing
electronic apparatus
same
plate member
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03017439A
Other languages
German (de)
French (fr)
Other versions
EP1399005A2 (en
Inventor
Fumio Shinko Electric Indust. Co. Ltd. Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of EP1399005A2 publication Critical patent/EP1399005A2/en
Publication of EP1399005A3 publication Critical patent/EP1399005A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structure Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A housing preform consisting of a plate member formed to be bendable in which are formed electronic components (22) and an interconnect (24) electrically connecting the electronic components. The plate member is formed into a shape of the housing unfolded flat. The housing can be formed by folding the plate member. Due to this, it is possible to provide an electronic apparatus comprised of a housing in which electronic components are mounted.
EP03017439A 2002-08-05 2003-08-01 Housing preform and electronic apparatus using the same Withdrawn EP1399005A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002227042A JP2004071737A (en) 2002-08-05 2002-08-05 Case body and electronic apparatus using the same
JP2002227042 2002-08-05

Publications (2)

Publication Number Publication Date
EP1399005A2 EP1399005A2 (en) 2004-03-17
EP1399005A3 true EP1399005A3 (en) 2005-03-23

Family

ID=31884313

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03017439A Withdrawn EP1399005A3 (en) 2002-08-05 2003-08-01 Housing preform and electronic apparatus using the same

Country Status (4)

Country Link
US (1) US20040084759A1 (en)
EP (1) EP1399005A3 (en)
JP (1) JP2004071737A (en)
KR (1) KR20040014262A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7514116B2 (en) * 2005-12-30 2009-04-07 Intel Corporation Horizontal Carbon Nanotubes by Vertical Growth and Rolling
MY146344A (en) * 2007-10-23 2012-08-15 Semiconductor Components Ind Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
JP2015179693A (en) * 2014-03-18 2015-10-08 大日本印刷株式会社 Flexible board having circuit printed with conductive ink
US20150342069A1 (en) * 2014-05-20 2015-11-26 Freescale Semiconductor, Inc. Housing for electronic devices
JP2016129214A (en) * 2015-01-05 2016-07-14 みさこ 俵山 Three-dimensional board capable of steric configuration by combination of three-dimensional parts
US10376606B2 (en) * 2015-05-27 2019-08-13 Creative Technology Corporation Sterilizing sheet device
SG11201810789WA (en) * 2016-06-23 2018-12-28 Toray Industries Case and method for producing case
US20190355277A1 (en) * 2018-05-18 2019-11-21 Aidmics Biotechnology (Hk) Co., Limited Hand-made circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
US5406027A (en) * 1990-11-26 1995-04-11 Hitachi, Ltd. Mounting structure and electronic device employing the same
JPH10284809A (en) * 1997-04-03 1998-10-23 Taiyo Yuden Co Ltd Circuit module and its manufacture
WO1999038211A1 (en) * 1998-01-22 1999-07-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microsystem and method for the production thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3242384A (en) * 1963-10-24 1966-03-22 Burroughs Corp Circuit module
JP2570628B2 (en) * 1994-09-21 1997-01-08 日本電気株式会社 Semiconductor package and manufacturing method thereof
US5789815A (en) * 1996-04-23 1998-08-04 Motorola, Inc. Three dimensional semiconductor package having flexible appendages
US6027958A (en) * 1996-07-11 2000-02-22 Kopin Corporation Transferred flexible integrated circuit
US6208521B1 (en) * 1997-05-19 2001-03-27 Nitto Denko Corporation Film carrier and laminate type mounting structure using same
US6469903B1 (en) * 1999-10-01 2002-10-22 Seiko Epson Corporation Flexible printed circuit and semiconductor device
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
US5406027A (en) * 1990-11-26 1995-04-11 Hitachi, Ltd. Mounting structure and electronic device employing the same
JPH10284809A (en) * 1997-04-03 1998-10-23 Taiyo Yuden Co Ltd Circuit module and its manufacture
WO1999038211A1 (en) * 1998-01-22 1999-07-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microsystem and method for the production thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 01 29 January 1999 (1999-01-29) *

Also Published As

Publication number Publication date
JP2004071737A (en) 2004-03-04
KR20040014262A (en) 2004-02-14
EP1399005A2 (en) 2004-03-17
US20040084759A1 (en) 2004-05-06

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