EP1316062A1 - Method for producing chips, especially for sim cards,in a series. - Google Patents

Method for producing chips, especially for sim cards,in a series.

Info

Publication number
EP1316062A1
EP1316062A1 EP01960678A EP01960678A EP1316062A1 EP 1316062 A1 EP1316062 A1 EP 1316062A1 EP 01960678 A EP01960678 A EP 01960678A EP 01960678 A EP01960678 A EP 01960678A EP 1316062 A1 EP1316062 A1 EP 1316062A1
Authority
EP
European Patent Office
Prior art keywords
chips
chip
personalization data
carrier
related personalization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01960678A
Other languages
German (de)
French (fr)
Inventor
Sven Gossel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HID Global GmbH
Original Assignee
ACG AG fur CHIPKARTEN und INFORMATIONSSYSTEME
ACG AG fur CHIPKARTEN und INF
Acg AG fur Chipkarten und Informationssysteme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP00119163A external-priority patent/EP1187064A1/en
Priority claimed from EP00119162A external-priority patent/EP1187063A1/en
Application filed by ACG AG fur CHIPKARTEN und INFORMATIONSSYSTEME, ACG AG fur CHIPKARTEN und INF, Acg AG fur Chipkarten und Informationssysteme filed Critical ACG AG fur CHIPKARTEN und INFORMATIONSSYSTEME
Priority to EP01960678A priority Critical patent/EP1316062A1/en
Publication of EP1316062A1 publication Critical patent/EP1316062A1/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Definitions

  • the present invention relates to a method for the serial production of chips, in particular for SIM cards, which comprises the following steps: software is created; the software is applied to a chip; Chip carrier-related and user-related personalization data are applied to the chip.
  • the invention is concerned with the production of all types of chips and primarily with the production of so-called SIM cards (Subscriber Identity Module), ie mobile phone cards that have to be inserted into the mobile phone and activated by entering a PIN in order to use the mobile phone to be able to make calls or take calls.
  • SIM cards Subscriber Identity Module
  • the information that the mobile phone needs to log on to a mobile network after switching on is stored in a chip on the SIM card.
  • the data that must be stored on the chip for this purpose is called personalization data, whereby a distinction is made between chip carrier-related personalization data, which are identical for all chip carriers of a type for which the chips are intended, such as wristwatches, cards, etc., and user-related personalization data individualize the card such as serial number, PIN number, etc.
  • SIM cards are usually produced in the manner shown schematically in FIG. 1 and described below:
  • the first step is software development, which takes about 6 months. Based on this software, a mask is created, on the basis of which a ROM chip is produced. This takes around 16 weeks. The chip is then embedded in a module and tested (approx. 6 weeks). If errors occur, the software is modified and the process of mask making, chip making, module making, reviewing and modification is repeated until the test results are correct. Only then does series production begin, whereby the ROM chips are first manufactured and embedded in a module, which takes about 16 weeks. Then plastic cards are produced and, if necessary, printed and the chip modules are embedded in the cards. The personalization data are then applied to the chips.
  • the process described above is very complex and leads on the one hand to considerable delivery times and on the other hand to considerable production costs.
  • the object of the invention is therefore to develop a method for the series production of chips of the type mentioned in such a way that the production times and production costs can be reduced.
  • chip carrier-related personalization data are first applied to the chips and only in a later production step are the user-related personalization data applied separately from the chip carrier-related personalization data on the chips.
  • the invention is therefore based on the idea of not personalizing the chips in a production step as in the prior art, but first of all applying the customer-specific, ie chip carrier-related personalization data to the chips as part of a pre-personalization and subsequently carrying out post-personalization, within the framework of which the user-related personalization data such as the key and ID numbers are applied to the cards. This separation of pre- and post-personalization brings a significant reduction in production costs.
  • the user-related personalization data are security-relevant data which may only be applied to the chips in appropriate security environments. While in the prior art all of the personalization data are simultaneously applied to the chips in a security environment, for which a programming time of one minute is required, the chips need by the invented According to the invention, the breakdown of the personalization data is only spent in a security environment that is required to apply the user-related personalization data to the chips. However, this is only a few seconds, so that the investments for the security environments and control measures are low.
  • the chip carrier-related personalization data are applied to the chips in one production step with chip module production.
  • This embodiment is based on the consideration that the chip modules must be tested for their functionality immediately after their manufacture by a test device, which usually takes about 4 to 5 seconds. Exactly this time is now used to carry out the pre-personalization.
  • a corresponding number of programming heads can be used to ensure that the pre-personalization, which takes approximately 20 to 80 seconds, does not slow down module production and checking. As a result, the time for personalization in a separate production step can be reduced considerably. This also helps to reduce production costs.
  • the pre-personalization data can be applied as part of the module production by a separate device which has a corresponding number of more than 16 programming heads.
  • the test device for checking the chips can also be equipped with such a number of programming heads.
  • pre-personalization data in an earlier production step, for example in the manufacture of the wafers from which the chips ultimately result or the chips.
  • the wafers are also usually subjected to a functional test, so that the test time required here would also be available for pre-personalization without slowing down the process.
  • a separate device can also be provided for the pre-personalization or the test device for the wafers can be equipped with a corresponding number of at least 16 programming heads.
  • the personalization is carried out in a separate production step or whether it is integrated into an existing production step. It is essential that the pre-personalization is carried out separately from the post-personalization, although the pre-personalization can also be carried out in several stages or levels.
  • the personalization can also be carried out by a separate programming device with at least one corresponding Prammierkopf.
  • a separate programming device with at least one corresponding Prammierkopf.
  • the user-related personalization data in the product step of automatically embedding the chip modules in a carrier such as a card the cards are applied to the chip.
  • This in-line application of the user-related personalization data during the embedding process of the modules enables the production times to be reduced further, since these data no longer need to be introduced in a separate production step.
  • flash controllers are used for the chips instead of the ROMs previously used.
  • this software can then be used in conjunction with the flash controllers. Lengthy development and test times are therefore eliminated or can be shortened considerably.
  • Figure 1 is a flowchart illustrating the development and manufacture of smart cards according to the prior art and Figure 2 is a flow diagram illustrating the method for mass production of smart cards in accordance with the present invention.
  • the corresponding software is first developed, which, as in the prior art, takes about 6 months.
  • This software is designed in such a way that it shortens porting to other semiconductors to a minimum of time and costs (hardware abstraction layer) and can be used in conjunction with flash controllers.
  • the flash controller chips are produced in parallel to this software development.
  • the chips are then embedded in modules in the usual way by appropriate machines and then programmed with the developed software.
  • the chip modules programmed in this way are transported to a test device, for example by conveyor belts, and are tested there for their functionality. This test mode is known per se and will therefore not be described further here. It is only interesting that a test time of 20 to 80 seconds is required for each chip, which is why several chips are tested at the same time in order not to slow down the process of module production and programming.
  • the previous Personalization data ie the card-related personalization data
  • the test device is equipped with a total of more than 16 programming heads, to which the chip modules are automatically transported. Since the pre-personalization takes more time than the previously performed function test, several chips are programmed in parallel, for which purpose a corresponding number of programming heads are provided.
  • the chip modules thus finished and programmed with the pre-personalization data are then embedded in plastic cards in the usual way.
  • prefabricated plastic blanks with a corresponding cavity and plug-in form are preferably used.
  • the user-related personalization data is applied to the chips by a corresponding programming device.
  • This personalization step which is the only security-relevant step in production, since only the keys and ID numbers are entered here, is carried out in a security environment. Because this part of personalization takes only a few seconds, investments in security environments can be kept low.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention relates to a method for producing chips, especially for SIM cards, in a series, comprising of the following steps: software is created; the software is disposed on a chip; personalisation data relating to the chip carrier and the user is applied to the chip. The invention is characterised in that the personalisation data relating to the chip carrier is applied to the chip first and the personal user data is applied separately from the personal data relating to the chip carrier in a later production step.

Description

Beschreibung;Description;
Verfahren zur Serienherstellung von Chips, insbesondere für SIM-KartenProcess for the serial production of chips, in particular for SIM cards
Die vorliegende Erfindung betrifft ein verfahren zur Serienherstellung von Chips, insbesondere für SIM-Karten, das die folgenden Schritte umfaßt: es wird eine Software erstellt; die Software wird auf einen Chip aufgebracht; chipträgerbezogene und benutzerbezogene Personalisierungsdaten werden auf den Chip aufgebracht.The present invention relates to a method for the serial production of chips, in particular for SIM cards, which comprises the following steps: software is created; the software is applied to a chip; Chip carrier-related and user-related personalization data are applied to the chip.
Die Erfindung befaßt sich mit der Herstellung aller Arten von Chips und in erster Linie mit der Herstellung von sogenannten SIM-Karten (Subscriber Identity Module), d.h. Mobilfunkkarten, die ins Mobiltelefon eingesteckt und durch eine Eingabe einer PIN aktiviert werden müssen, um mit dem Mobiltelefon selbst telefonieren oder Anrufe entgegennehmen zu können. In einem Chip auf der SIM-Karte sind die Informationen gespeichert, die das Mobiltelefon braucht, um sich nach dem Einschalten an einem Mobilfunknetz anzumelden. Die Daten, die hierzu auf dem Chip gespeichert sein müssen, werden Personalisierungsdaten genannt, wobei man zwischen chipträgerbezogenen Personalisierungsdaten, die für alle Chipträger eines Typs, für welche die Chips bestimmt sind wie beispielsweie Armbanduhren, Karten etc. identisch sind, und benutzerbezogenen Personalisierungsdaten, welche die Karte individualisie- ren wie beispielsweise die Seriennummer, die PIN-Nummer etc. voneinander unterscheidet.The invention is concerned with the production of all types of chips and primarily with the production of so-called SIM cards (Subscriber Identity Module), ie mobile phone cards that have to be inserted into the mobile phone and activated by entering a PIN in order to use the mobile phone to be able to make calls or take calls. The information that the mobile phone needs to log on to a mobile network after switching on is stored in a chip on the SIM card. The data that must be stored on the chip for this purpose is called personalization data, whereby a distinction is made between chip carrier-related personalization data, which are identical for all chip carriers of a type for which the chips are intended, such as wristwatches, cards, etc., and user-related personalization data individualize the card such as serial number, PIN number, etc.
Die Herstellung von SIM-Karten erfolgt heute üblicherweise in der in Figur 1 schematisch dargestellten und nachfolgend beschriebenen Weise:Today, SIM cards are usually produced in the manner shown schematically in FIG. 1 and described below:
An erster Stelle erfolgt die Softwareentwicklung, die einen Zeitraum von etwa 6 Monaten in Anspruch nimmt. Basierend auf dieser Software wird eine Maske erstellt, auf deren Grundlage wiederum ein ROM-Chip hergestellt wird. Hierfür werden etwa 16 Wochen benötigt. Der Chip wird anschließend in ein Modul eingebettet und getestet (ca. 6 Wochen) . Beim Auftreten von Fehlern wird die Software modifiziert und der Prozeß der Maskenherstellung, Chipherstellung, Modulproduktion, Überprüfung und Modifizierung wird wiederholt, bis die Testergebnisse einwandfrei sind. Erst dann beginnt die Serienproduktion, wobei zunächst die ROM-Chips hergestellt und in ein Modul eingebettet werden, was etwa 16 Wochen in Anspruch nimmt. Anschließend werden Kunststoffkarten hergestellt und gegebenenfalls bedruckt und die Chipmodule in die Karten eingebettet. Anschließend werden auf die Chips die Personalisierungsdaten aufgebracht.The first step is software development, which takes about 6 months. Based on this software, a mask is created, on the basis of which a ROM chip is produced. This takes around 16 weeks. The chip is then embedded in a module and tested (approx. 6 weeks). If errors occur, the software is modified and the process of mask making, chip making, module making, reviewing and modification is repeated until the test results are correct. Only then does series production begin, whereby the ROM chips are first manufactured and embedded in a module, which takes about 16 weeks. Then plastic cards are produced and, if necessary, printed and the chip modules are embedded in the cards. The personalization data are then applied to the chips.
Der zuvor beschriebene Prozeß ist sehr aufwendig und führt einerseits zu erheblichen Lieferzeiten und zum anderen zu erheblichen Produktionskosten. Aufgabe der Erfindung ist es daher, ein Verfahren zur Serienherstellung von Chips der eingangs genannten Art in der Weise weiterzubilden, daß die Produktionszeiten sowie Produktionskosten herabgesetzt werden können.The process described above is very complex and leads on the one hand to considerable delivery times and on the other hand to considerable production costs. The object of the invention is therefore to develop a method for the series production of chips of the type mentioned in such a way that the production times and production costs can be reduced.
Diese Aufgabe ist erfindungsgemäß dadurch gelöst, daß zunächst die chipträgerbezogenen Personalisierungsdaten auf die Chips aufgebracht werden und erst in einem späteren Produktionsschritt die benutzerbezogenen Personalisierungsdaten getrennt von den chipträgerbezogenen Personalisierungsdaten auf die Chips aufgebracht werden. Der Erfindung liegt damit der Gedanke zugrunde, die Personalisierung der Chips nicht wie im Stand der Technik in einem Produktionsschritt vorzunehmen, sondern zunächst im Rahmen einer Vorpersonalisierung die kundenspezifischen, d.h. chipträgerbezogenen Personalisierungsdaten auf die Chips aufzubringen und später eine Nachpersonalisierung vorzunehmen, in deren Rahmen dann die benutzerbezogenen Personalisierungsdaten wie beispielsweise die Schlüssel- und die ID-Nummern auf die Karten aufgebracht werden. Diese Trennung von Vor- und Nachpersonalisierung bringt eine erhebliche Senkung der Produktionskosten mit sich. Dies liegt daran, daß es sich bei den benutzerbezogenen Personalisierungsdaten um sicherheitsrelevante Daten handelt, die nur in entsprechenden Sicherheitsumgebungen auf die Chips aufgebracht werden dürfen. Während im Stand der Technik die gesamten Personalisierungsdaten gleichzeitig in einer Sicherheitsumgebung auf die Chips aufgebracht werden, wozu etwa eine Programmierzeit von einer Minute erforderlich ist, brauchen die Chips durch die erfin- dungsgemäß vorgenommene Aufgliederung der Personalisierungsdaten nur diejenige Zeit in einer Sicherheitsumgebung zu verbringen, die benötigt wird, um die benutzerbezogenen Personalisierungsdaten auf die Chips aufzubringen. Diese beträgt jedoch nur wenige Sekunden, so daß die Investitionen für die Sicherheitsumgebungen und Kontrollmaßnahmen gering sind.This object is achieved according to the invention in that the chip carrier-related personalization data are first applied to the chips and only in a later production step are the user-related personalization data applied separately from the chip carrier-related personalization data on the chips. The invention is therefore based on the idea of not personalizing the chips in a production step as in the prior art, but first of all applying the customer-specific, ie chip carrier-related personalization data to the chips as part of a pre-personalization and subsequently carrying out post-personalization, within the framework of which the user-related personalization data such as the key and ID numbers are applied to the cards. This separation of pre- and post-personalization brings a significant reduction in production costs. This is due to the fact that the user-related personalization data are security-relevant data which may only be applied to the chips in appropriate security environments. While in the prior art all of the personalization data are simultaneously applied to the chips in a security environment, for which a programming time of one minute is required, the chips need by the invented According to the invention, the breakdown of the personalization data is only spent in a security environment that is required to apply the user-related personalization data to the chips. However, this is only a few seconds, so that the investments for the security environments and control measures are low.
Gemäß einer bevorzugten Ausführungsform ist vorgesehen, daß die chipträgerbezogenen Personalisierungsdaten in einem Produktionsschritt mit einer Chipmodulherstellung auf die Chips aufgebracht werden. Dieser Ausgestaltung liegt die Überlegung zugrunde, daß die Chipmodule unmittelbar nach ihrer Herstellung von einem Testgerät auf ihre Funktionsfähigkeit getestet werden müssen, was üblicherweise etwa 4 bis 5 Sekunden in Anspruch nimmt. Genau diese Zeit wird nun genutzt, um die Vorpersonalisierung vorzunehmen. Dabei kann durch eine entsprechende Anzahl von Programmierköpfen sichergestellt werden, daß durch die Vorpersonalisierung, die etwa 20 bis 80 Sekunden in Anspruch nimmt, die Modulherstellung und -Überprüfung nicht verlangsamt werden. Hierdurch kann die Zeit für eine Personalisierung in einem separaten Produktionsschritt erheblich herabgesenkt werden. Dies trägt ebenfalls zur Senkung der Produktionskosten bei.According to a preferred embodiment, it is provided that the chip carrier-related personalization data are applied to the chips in one production step with chip module production. This embodiment is based on the consideration that the chip modules must be tested for their functionality immediately after their manufacture by a test device, which usually takes about 4 to 5 seconds. Exactly this time is now used to carry out the pre-personalization. A corresponding number of programming heads can be used to ensure that the pre-personalization, which takes approximately 20 to 80 seconds, does not slow down module production and checking. As a result, the time for personalization in a separate production step can be reduced considerably. This also helps to reduce production costs.
Die Aufbringung der Vorpersonalisierungsdaten kann im Rahmen der Modulherstellung durch eine separate Vorrichtung vorgenommen werden, die über eine entsprechende Anzahl von mehr als 16 Programmierköpfen verfügt. In glei- eher Weise kann auch das Testgerät zur Überprüfung der Chips mit einer solchen Anzahl von Programmierköpfen ausgestattet sein.The pre-personalization data can be applied as part of the module production by a separate device which has a corresponding number of more than 16 programming heads. In the same rather, the test device for checking the chips can also be equipped with such a number of programming heads.
Alternativ ist es möglich, die Vorpersonalisierungsdaten bereits in einem früheren Produktionssschritt vorzunehmen, beispielsweise bei der Herstellung der Wafer, aus denen letztendlich die Chips entstehen, oder der Chips. Auch die Wafer werden in der Regel einem Funktionstest unterzogen, so daß die hier erforderliche Testzeit auch für eine Vorpersonalisierung zur Verfügung stünde, ohne den Prozeß zu verlangsamen. Für die Vorpersonalisierung kann ebenfalls eine separate Vorrichtung vorgesehen oder das Testgerät für die Wafer mit einer entsprechenden Anzahl von wenigstens 16 Programmierköpfen ausgestattet sein.Alternatively, it is possible to carry out the pre-personalization data in an earlier production step, for example in the manufacture of the wafers from which the chips ultimately result or the chips. The wafers are also usually subjected to a functional test, so that the test time required here would also be available for pre-personalization without slowing down the process. A separate device can also be provided for the pre-personalization or the test device for the wafers can be equipped with a corresponding number of at least 16 programming heads.
Letztendlich spielt es aber keine Rolle, ob die Personalisierung in einem separaten Produktionsschritt vorgenommen wird oder in einen bestehenden Produktionsschritt eingegliedert ist. Wesentlich ist, daß die Vorpersonalisierung getrennt von der Nachpersonalisierung erfolgt, wobei die Vorpersonalisierung durchaus auch in mehreren Stufen oder Ebenen erfolgen kann.Ultimately, it doesn't matter whether the personalization is carried out in a separate production step or whether it is integrated into an existing production step. It is essential that the pre-personalization is carried out separately from the post-personalization, although the pre-personalization can also be carried out in several stages or levels.
Die Nachpersonalisierung kann ebenfalls durch eine separate Programmiervorrichtung mit wenigstens einem entsprechenden Prammierkopf vorgenommen werden. Gemäß einer bevorzugten Ausführungsform ist allerdings vorgesehen, daß die benutzerbezogenen Personalisierungsdaten im Produkti- onsschritt der automatischen Einbettung der Chipmodule in einen Träger wie beispielsweise eine Karte die Karten auf den Chip aufgebracht werden. Durch diese In-Line- Aufbringung der benutzerbezogenen Personalisierungsdaten während des Einbettungsprozesses der Module können die Produktionszeiten weiter herabgesetzt werden, da diese Daten nicht mehr in einem separaten Produktionsschritt eingebracht zu werden brauchen.The personalization can also be carried out by a separate programming device with at least one corresponding Prammierkopf. According to a preferred embodiment, however, it is provided that the user-related personalization data in the product step of automatically embedding the chip modules in a carrier such as a card, the cards are applied to the chip. This in-line application of the user-related personalization data during the embedding process of the modules enables the production times to be reduced further, since these data no longer need to be introduced in a separate production step.
Gemäß einem weiteren Aspekt der vorliegenden Erfindung werden Flashcontroller anstelle der bisher verwendeten ROMs für die Chips eingesetzt. Hierdurch können Entwicklungslose wie im Stand der Technik vermieden und die langwierigen Chipproduktionen umgangen werden. Mit einer entsprechenden Softwareplattform, die die Portierung von Software auf andere Halbleiter verkürzt (Hardware Abs=20traction Layer), kann diese Software dann in Verbindung mit den Flashcontrollern sofort eingesetzt werden. Langwierige Entwicklungs- und Testzeiten entfallen daher bzw. können erheblich verkürzt werden.According to a further aspect of the present invention, flash controllers are used for the chips instead of the ROMs previously used. As a result, development lots can be avoided, as in the prior art, and the lengthy chip productions can be avoided. With an appropriate software platform that shortens the porting of software to other semiconductors (Hardware Abs = 20traction Layer), this software can then be used in conjunction with the flash controllers. Lengthy development and test times are therefore eliminated or can be shortened considerably.
Hinsichtlich weiterer vorteilhafter Ausgestaltungen der Erfindung wird auf die Unteransprüche sowie die nachfolgende Beschreibung eines Ausführungsbeispiels unter Bezugnahme auf die beiliegende Zeichnung verwiesen. In der Zeichnung zeigt:With regard to further advantageous refinements of the invention, reference is made to the subclaims and the following description of an exemplary embodiment with reference to the accompanying drawing. The drawing shows:
Figur 1 ein Ablaufdiagramm, das die Entwicklung und Herstellung von Chipkarten gemäß dem Stand der Technik darstellt und Figur 2 ein Flußdiagramm, das das Verfahren zur Serienherstellung von Chipkarten gemäß der vorliegenden Erfindung darstellt.Figure 1 is a flowchart illustrating the development and manufacture of smart cards according to the prior art and Figure 2 is a flow diagram illustrating the method for mass production of smart cards in accordance with the present invention.
Nach dem in Figur 2 dargestellten Verfahren zur Serienherstellung von Chipkarten gemäß der vorliegenden Erfindung erfolgt zunächst die Entwicklung einer entsprechenden Software, die wie im Stand der Technik etwa 6 Monate in Anspruch nimmt. Diese Software ist so gestaltet, daß sie die Portierung auf andere Halbleiter auf ein Zeitminimum und Kostenminimum verkürzt (Hardware Abstraction Layer) und in Verbindung mit Flashcontrollern einsatzfähig ist. Parallel zu dieser Softwareentwicklung werden die Flashcontroller-Chips hergestellt. Die Chips werden dann in üblicher Weise durch entsprechende Maschinen in Module eingebettet und im Anschluß daran mit der entwik- kelten Software programmiert. Die so programmierten Chipmodule werden durch beispielsweise Transportbänder zu einem Testgerät transportiert und dort auf ihre Funktionsfähigkeit getestet. Dieser Testmodus ist an sich bekannt und soll deshalb an dieser Stelle nicht weiter beschrieben werden. Interessant ist lediglich, daß für jeden Chip eine Testzeit von 20 bis 80 Sekunden erforderlich ist, weshalb gleichzeitig jeweils mehrere Chips getestet werden, um den Prozeß der Modulherstellung und der Programmierung nicht zu verlangsamen.According to the method for serial production of chip cards according to the present invention shown in FIG. 2, the corresponding software is first developed, which, as in the prior art, takes about 6 months. This software is designed in such a way that it shortens porting to other semiconductors to a minimum of time and costs (hardware abstraction layer) and can be used in conjunction with flash controllers. The flash controller chips are produced in parallel to this software development. The chips are then embedded in modules in the usual way by appropriate machines and then programmed with the developed software. The chip modules programmed in this way are transported to a test device, for example by conveyor belts, and are tested there for their functionality. This test mode is known per se and will therefore not be described further here. It is only interesting that a test time of 20 to 80 seconds is required for each chip, which is why several chips are tested at the same time in order not to slow down the process of module production and programming.
Im Anschluß an die Überprüfung der Funktionsfähigkeit werden auf die funktionstüchtigen Chipmodule die Vorper- sonalisierungsdaten, d.h. die kartenbezogenen Personalisierungsdaten, aufgebracht, wozu das Testgerät mit insgesamt mehr als 16 Programmierköpfen ausgestattet ist, zu denen die Chipmodule automatisch transportiert werden. Da die Vorpersonalisierung mehr Zeit in Anspruch nimmt als der vorher durchgeführte Funktionstest, erfolgt eine Parallelprogrammierung mehrerer Chips, wozu entsprechend viele Programmierköpfe vorgesehen sind.After checking the functionality, the previous Personalization data, ie the card-related personalization data, is applied, for which purpose the test device is equipped with a total of more than 16 programming heads, to which the chip modules are automatically transported. Since the pre-personalization takes more time than the previously performed function test, several chips are programmed in parallel, for which purpose a corresponding number of programming heads are provided.
Die so fertiggestellten und mit den Vorpersonalisierungsdaten programmierten Chipmodule werden anschließend in üblicher Weise in Kunststoffkarten eingebettet. Hierzu werden in bevorzugter Weise vorgefertigte Kunststoffrohlinge mit einer entsprechenden Kavität und Plug-in-Form verwendet. Der Einbettung vorgeschaltet oder nachgeschaltet, jedoch in dem gleichen Produktionsschritt, erfolgt die Aufbringung der benutzerbezogenen Personalisierungsdaten auf die Chips durch eine entsprechende Programmiervorrichtung. Dieser Personalisierungsschritt, welcher der einzige sicherheitsrelevante Schritt in der Produktion darstellt, da nur hier die Schlüssel und ID-Nummern eingetragen werden, wird in einer Sicherungsumgebung durchgeführt. Da für diesen Teil der Personalisierung nur wenige Sekunden erforderlich sind, können die Investitionen für Sicherheitsumgebungen gering gehalten werden.The chip modules thus finished and programmed with the pre-personalization data are then embedded in plastic cards in the usual way. For this purpose, prefabricated plastic blanks with a corresponding cavity and plug-in form are preferably used. Upstream or downstream of the embedding, but in the same production step, the user-related personalization data is applied to the chips by a corresponding programming device. This personalization step, which is the only security-relevant step in production, since only the keys and ID numbers are entered here, is carried out in a security environment. Because this part of personalization takes only a few seconds, investments in security environments can be kept low.
Es hat sich gezeigt, daß durch die Anwendung des erfindungsgemäßen Verfahrens, d.h. den Einsatz von Flashcontrollern anstelle von ROMs, die Vorpersonalisierung im Rahmen der Modulherstellung und die Aufbringung der be- nutzerbezogenen Personalisierungsdaten während der Moduleinbettung in die Karten die Produktionszeiten und -kosten erheblich gesenkt werden können. It has been shown that through the application of the method according to the invention, ie the use of flash controllers instead of ROMs, the pre-personalization within the framework of module production and the application of the required user-related personalization data during module embedding in the cards, the production times and costs can be significantly reduced.

Claims

Ansprüche:Expectations:
Verfahren zur Serienherstellunα von Chips, insbesondere für SIM-KartenMethod for series production of chips, in particular for SIM cards
Verfahren zur Serienherstellung von Chips, insbesondere für SIM-Karten, das die folgenden Schritte umfaßt:Process for the serial production of chips, in particular for SIM cards, comprising the following steps:
es wird eine Software erstellt; die Software wird auf einen Chip aufgebracht; chipträgerbezogene und benutzerbezogene Personalisierungsdaten werden auf den Chip aufgebracht;software is created; the software is applied to a chip; Chip carrier-related and user-related personalization data are applied to the chip;
wobei das Verfahren dadurch gekennzeichnet ist, daßthe method being characterized in that
zunächst die chipträgerbezogenen Personalisierungsdaten auf die Chips aufgebracht werden und erst in einem späteren Produktionsschritt die benutzerbezogenen Personalisierungsdaten getrennt von den chipträgerbezogenen Personalisierungsdaten auf die Chips aufgebracht werden.first the chip carrier-related personalization data are applied to the chips and only in a later production step the user-related personalization data are applied separately from the chip carrier-related personalization data to the chips.
Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die chipträgerbezogenen Personalisierungsdaten in mehreren Schritten auf die Chips aufgebracht werden. Method according to claim 1, characterized in that the chip carrier-related personalization data are applied to the chips in several steps.
3. Verfahren nach Anspruch 1 oder 2 , dadurch gekennzeichnet, daß die chipträgerbezogenen Personalisierungsdaten einem Produktionsschritt mit einer Chipmodulherstellung auf die Chips aufgebracht werden.3. The method according to claim 1 or 2, characterized in that the chip carrier-related personalization data are applied to the chips in a production step with a chip module production.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Chipmodule von einem Testgerät auf ihre Funktionsfähigkeit getestet werden und die systembezogenen Personalisierungsdaten im Rahmen dieses Testbetriebs auf die Chips aufgebracht werden.4. The method according to claim 3, characterized in that the chip modules are tested for functionality by a test device and the system-related personalization data are applied to the chips in the course of this test operation.
5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Aufbringung der Software in einem Produktionsschritt mit der Chipmodulproduktion erfolgt.5. The method according to claim 1, characterized in that the application of the software takes place in one production step with the chip module production.
6. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die chipträgerbezogenen Personalisierungsdaten auf Wafer aufgebracht werden, aus denen die Chips hergestellt werden.6. The method according to claim 1, characterized in that the chip carrier-related personalization data are applied to wafers from which the chips are produced.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die Wafer auf ihre Funktionsfähigkeit getestet werden und die chipträgerbezogenen Personalisierungsdaten während dieses Tests auf die Wafer aufgebracht werden.7. The method according to claim 6, characterized in that the wafers are tested for their functionality and the chip carrier-related personalization data are applied to the wafers during this test.
8. Verfahren nach einem der vorherigen Ansprüche, dadurch gekennzeichnet, daß Flashcontroller für die Chips eingesetzt werden. 8. The method according to any one of the preceding claims, characterized in that flash controllers are used for the chips.
9. Verfahren nach einem der vorherigen Ansprüche, dadurch gekennzeichnet, daß die Chipmodule jeweils in einen Träger, insbesondere in eine Karte, eingebettet werden und die benutzerbezogenen Personalisierungsdaten im Produktionsschritt der automatischen Einbettung der Chipmodule in die Träger auf den Chip aufgebracht werden.9. The method according to any one of the preceding claims, characterized in that the chip modules are each embedded in a carrier, in particular in a card, and the user-related personalization data in the production step of the automatic embedding of the chip modules in the carrier are applied to the chip.
10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, daß vorgefertigte Karten mit einer Kavität für die einzubettenden Chipmodule als Träger verwendet werden.10. The method according to claim 9, characterized in that prefabricated cards with a cavity for the chip modules to be embedded are used as carriers.
11. Verfahren nach Anspruch 10, dadurch gekennzeichnet, daß vorgefertigte Karten mit einer Kavität und Plug-in-Form für die einzubettenden Chips verwendet werden.11. The method according to claim 10, characterized in that prefabricated cards with a cavity and plug-in form are used for the chips to be embedded.
12. Vorrichtung zum Testen von Wafern, dadurch gekennzeichnet, daß sie mehr als 16 Programmierköpfe aufweist, um chiptägerbezogene Personalisierungsdaten auf die Chips aufzubringen.12. Device for testing wafers, characterized in that it has more than 16 programming heads in order to apply chip carrier-related personalization data to the chips.
13. Vorrichtung zum Testen von Chips oder gesägten Wafern auf ihre Funktionsfähigkeit, dadurch gekennzeichnet, daß sie mehr als 16 und insbesondere 32 Programmierköpfe aufweist, um chipträgerbezogene Personalisierungsdaten auf die Chips au zubringen. 13. Device for testing chips or sawn wafers for their functionality, characterized in that it has more than 16 and in particular 32 programming heads in order to apply chip carrier-related personalization data to the chips.
14. Vorrichtung zur Herstellung von Chipmodulen, dadurch gekennzeichnet, daß sie mehr als 16 Programmierköpfe aufweist, um chipträgerbezogene Personalisierungsdaten auf die Chips aufzubringen.14. Device for the production of chip modules, characterized in that it has more than 16 programming heads in order to apply chip carrier-related personalization data to the chips.
15. Vorrichtung zum Testen von Chipmodulen, dadurch gekennzeichnet, daß sie mehr als 16 Programmierköpfe aufweist, um chipträgerbezogene Personalisierungsdaten auf die Chips aufzubringen.15. Device for testing chip modules, characterized in that it has more than 16 programming heads in order to apply chip carrier-related personalization data to the chips.
16. Vorrichtung zum Einbetten von Chipmodulen in einen insbesondere kartenförmigen Träger, dadurch gekennzeichnet, daß sie wenigstens einen Programmierkopf aufweist, um benutzerbezogene Personalisierungsdaten auf die Chips der Chipmodule aufzubringen.16. Device for embedding chip modules in a card-shaped carrier in particular, characterized in that it has at least one programming head in order to apply user-related personalization data to the chips of the chip modules.
17. Vorrichtung zur Personalisierung von in einen Träger eingebetteten Chips, dadurch gekennzeichnet, daß sie wenigstens einen Porgrammierkopf zur Aufbringung von benutzerbezogenen Personalisierungsdaten aufweist. 17. Device for personalizing chips embedded in a carrier, characterized in that it has at least one programming head for applying user-related personalization data.
EP01960678A 2000-09-05 2001-08-18 Method for producing chips, especially for sim cards,in a series. Ceased EP1316062A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01960678A EP1316062A1 (en) 2000-09-05 2001-08-18 Method for producing chips, especially for sim cards,in a series.

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
EP00119163A EP1187064A1 (en) 2000-09-05 2000-09-05 Method for batch manufacturing of chip cards, especially SIM cards
EP00119163 2000-09-05
EP00119162 2000-09-05
EP00119162A EP1187063A1 (en) 2000-09-05 2000-09-05 Method for batch manufacturing of chip cards, especially SIM cards
EP00121636A EP1187065A3 (en) 2000-09-05 2000-10-04 Method for batch manufacturing of chips, in particular for SIM cards
EP00121636 2000-10-04
PCT/EP2001/009550 WO2002021434A1 (en) 2000-09-05 2001-08-18 Method for producing chips, especially for sim cards,in a series.
EP01960678A EP1316062A1 (en) 2000-09-05 2001-08-18 Method for producing chips, especially for sim cards,in a series.

Publications (1)

Publication Number Publication Date
EP1316062A1 true EP1316062A1 (en) 2003-06-04

Family

ID=27223112

Family Applications (2)

Application Number Title Priority Date Filing Date
EP00121636A Withdrawn EP1187065A3 (en) 2000-09-05 2000-10-04 Method for batch manufacturing of chips, in particular for SIM cards
EP01960678A Ceased EP1316062A1 (en) 2000-09-05 2001-08-18 Method for producing chips, especially for sim cards,in a series.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP00121636A Withdrawn EP1187065A3 (en) 2000-09-05 2000-10-04 Method for batch manufacturing of chips, in particular for SIM cards

Country Status (4)

Country Link
US (1) US20040015612A1 (en)
EP (2) EP1187065A3 (en)
AU (1) AU2001282103A1 (en)
WO (1) WO2002021434A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101010679A (en) * 2004-08-27 2007-08-01 传感电子公司 System and method including partial pre-programming of RFID data
DE102005025684B4 (en) * 2005-02-02 2006-11-30 Rohde & Schwarz Sit Gmbh Method for post-individualization of ancillary equipment or systems manufactured by at least one supplier by the manufacturer
US8118214B2 (en) * 2006-03-24 2012-02-21 Atmel Corporation Method and system for generating electronic keys
DE102006020227A1 (en) * 2006-05-02 2007-11-08 Giesecke & Devrient Gmbh Method of personalizing electronic data carriers and personalization machines therefor
ITMI20120124A1 (en) * 2012-01-31 2013-08-01 St Microelectronics Srl METHOD TO CUSTOMIZE SIM CARDS WITH A PRODUCTION MACHINE
FR3029322B1 (en) * 2014-12-01 2018-01-05 Idemia France METHODS AND SYSTEMS FOR CUSTOMIZING MICROCIRCUITS, ESPECIALLY MICROCIRCUITS MADE WITHIN A CUP.

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4742215A (en) * 1986-05-07 1988-05-03 Personal Computer Card Corporation IC card system
FR2604274B1 (en) * 1986-09-22 1991-01-11 Flonic Sa MULTI-FUNCTION ELECTRONIC MEMORY CARD AND DEVICES FOR PROCESSING SAID CARDS
KR970010656B1 (en) * 1992-09-01 1997-06-30 마쯔시다 덴기 산교 가부시끼가이샤 Semiconductor test device, semiconductor test circuit chip and probe card
JP2935613B2 (en) * 1992-10-15 1999-08-16 沖電気工業株式会社 IC card and IC card system
US5434398A (en) * 1994-02-22 1995-07-18 Haim Labenski Magnetic smartcard
US5889941A (en) * 1996-04-15 1999-03-30 Ubiq Inc. System and apparatus for smart card personalization
US6078845A (en) * 1996-11-25 2000-06-20 Schlumberger Technologies, Inc. Apparatus for carrying semiconductor devices
CA2306139C (en) * 1997-10-14 2007-04-17 Visa International Service Association Personalization of smart cards
DE19858343A1 (en) * 1998-12-17 2000-06-21 Giesecke & Devrient Gmbh Method and device for producing personalized chip cards
DE19908285A1 (en) * 1999-02-26 2000-08-31 Orga Kartensysteme Gmbh Device for loading a chip card with personalization data

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0221434A1 *

Also Published As

Publication number Publication date
US20040015612A1 (en) 2004-01-22
AU2001282103A1 (en) 2002-03-22
WO2002021434A1 (en) 2002-03-14
EP1187065A3 (en) 2002-07-31
EP1187065A2 (en) 2002-03-13

Similar Documents

Publication Publication Date Title
DE69100256T2 (en) Method for managing a user program stored in a microcircuit data carrier.
DE69925391T2 (en) Method for encrypted data transmission between a subscriber identification module and a mobile radio terminal
DE19733662C2 (en) Method and device for personalization of GSM chips by the customer
EP1011071B1 (en) Method and device for manufacturing customized chip cards
WO1998048388A2 (en) Process for generating a credit by means of a prepaid voucher
EP2289225A2 (en) Method for personalizing a safety element of a mobile terminal device
WO2017215782A1 (en) Limited-resource java card device
DE102004028218A1 (en) Method of making a portable data carrier
EP1316062A1 (en) Method for producing chips, especially for sim cards,in a series.
EP2409261B1 (en) Method for producing a smart card which has a contactless interface and an interface with contacts
EP2673731A1 (en) Method for programming a mobile terminal chip
DE69101099T2 (en) Method for confirming secret codes in memory cards.
EP1249795A2 (en) Electronic device with position-specific configuration
EP1163634A1 (en) Device for loading a chip card with personalisation data
EP1187063A1 (en) Method for batch manufacturing of chip cards, especially SIM cards
WO2007033792A2 (en) Method for initialising and/or personalising a portable data carrier
EP1610218B1 (en) Portable data carrier, system with said data carrier and method of operating said data carrier
EP1187064A1 (en) Method for batch manufacturing of chip cards, especially SIM cards
WO2015018510A2 (en) Method and devices for changing a mobile radio network
EP2092467B1 (en) Contact assignment of a portable data carrier
EP1248430B1 (en) Method and device for generating filter masks for checking relevance of features
DE102005062996A1 (en) Interface`s simultaneous operation testing method for e.g. dual interface subscriber identity module mobile radio card, involves starting data communication with interface at defined time during data communication with another interface
EP1634252B1 (en) Method for loading portable data carriers with data
DE112005003225B4 (en) Test device for use in a test system for checking transmission processes within a mobile radio network and method for operating such a test device
DE60025509T2 (en) PROCESS, DEVICE AND TERMINAL FOR ASSESSING THE RESULTS OF A COMMUNICATION COMMAND

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030220

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ACG IDENTIFICATION TECHNOLOGIES GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ACG IDENTIFICATION GMBH

17Q First examination report despatched

Effective date: 20051031

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20080516