EP1309033A2 - Agencement d' émission des signaux radiofréquences par émetteur radio - Google Patents

Agencement d' émission des signaux radiofréquences par émetteur radio Download PDF

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Publication number
EP1309033A2
EP1309033A2 EP02023476A EP02023476A EP1309033A2 EP 1309033 A2 EP1309033 A2 EP 1309033A2 EP 02023476 A EP02023476 A EP 02023476A EP 02023476 A EP02023476 A EP 02023476A EP 1309033 A2 EP1309033 A2 EP 1309033A2
Authority
EP
European Patent Office
Prior art keywords
layers
isolator
arrangement according
elongate element
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02023476A
Other languages
German (de)
English (en)
Other versions
EP1309033A3 (fr
Inventor
Zalman Schwartzman
Ovadia Grossman
Gadi Shirazi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of EP1309033A2 publication Critical patent/EP1309033A2/fr
Publication of EP1309033A3 publication Critical patent/EP1309033A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines

Definitions

  • This invention relates to an arrangement for radiating RF signals from a radio transmitter and in particular to the use in such an arrangement of an electrical isolator device for current suppression.
  • Such a device when used in combination with a radio frequency (RF) radiating devices such as antennae is useful to suppress interference from currents in an associated device.
  • RF radio frequency
  • radio communications In modern electronics and telecommunications equipment a variety of products are able to send information by radio communications. Such products include a radio transmitter and radio receiver often combined as a transceiver. Components such as antennae are employed in the radio transceivers to send and receive communications signals by RF radiation.
  • the electronic products often have conducting structures which in use can cause interference to RF signals required to be sent or received.
  • the electronic product may be a laptop computer in which the conducting structure is a metallic chassis usually grounded.
  • isolator Various forms of isolator are known in the prior art to block interfering currents.
  • ferrite beads are known for this purpose.
  • sleeve dipoles are known which are designed to provide shielding around a feed to a dipole antenna.
  • an arrangement for radiating RF signals from a radio transmitter which comprises an antenna and an electrical isolator connected to the antenna for isolating the antenna from the transmitter, wherein the isolator includes a conducting elongate element along which RF electrical signals are fed in use, and further conductors which are not electrically connected to the elongate element, the further conductors comprising first and second conducting layers arranged with the elongate element extending between them and third and fourth conducting layers arranged with the first and second layers extending between them, the further conductors forming in use an electromagnetic shield to RF electrical signals passing along the elongate element, the antenna being connected to the elongate member of the isolator.
  • the elongate element may be a wire or strip extending substantially along an axis of the isolator.
  • the first and second layers may comprise substantially planar sheets or strips which are respectively in two planes which are preferably parallel with one another and parallel with a plane in which the elongate element is contained.
  • the elongate element is preferably equidistant from the two planes.
  • the third and fourth layers may comprise substantially planar sheets or strips which are respectively in two further planes which are preferably parallel and with one another and preferably parallel with planes containing the first and second layers.
  • the elongate element is preferably substantially equidistant from the third and fourth layers separated from such layers by a distance greater than that separating the elongate element from the first and second layers.
  • the first layer may be on the same side of the elongate element as the third layer and the second layer may be on the same side of the elongate element as the fourth layer.
  • the total combined effective electrical length of the first and third layers along the axis of the isolator may be or approximate to 0.5 ⁇ , where ⁇ is the mean wavelength of RF electrical signals to be passed in use along the elongate element.
  • the total combined effective electrical length of the second and fourth layers along the axis of the isolator may be or approximate to 0.5 ⁇ .
  • the effective electrical length of each of the first, second, third and fourth layers along the axis is or approximates to 0.25 ⁇ .
  • the isolator is such that in use the RF signal loss in the isolator is not greater than 0.2dB.
  • two or more, desirably all of, the first, second, third and fourth conducting layers are electrically connected together at an end thereof.
  • the connection is made at an end thereof toward which RF signals are directed in use for outward transmission.
  • Such an end is usually connected in use to an antenna.
  • the conductors are preferably not connected at their other end which in use is the end nearer a RF transmission signal generator which has produced the RF signals.
  • At least one of the conducting layers is connected to ground at the end distant from that at which the layers are connected.
  • the elongate element is relatively narrow, in order to minimise loss of signal in the isolator.
  • the width of the first and second layers measured perpendicular to the axis of the isolator in the plane of these layers is between 0.5w and 5w, desirably between w and 3w, where w is the width of the elongate element.
  • the impedance of the isolator to RF signals in use is not greater than 50 ohms.
  • the elongate element and the first, second, third and fourth layers may be separated by layers of insulating material.
  • the elongate element and the first second, third and fourth layers may be formed of the same conducting material.
  • the layers of insulating material may be formed of the same insulating material.
  • the conducting and insulating materials employed may be materials known and used in the art.
  • the conducting and insulating materials may be materials as employed in the production of printed circuit boards.
  • the conducting material may for example be a copper based material (e.g. a material containing at least 80% by weight copper) and the insulating material may be a ceramic material or an organic polymeric material optionally containing strengthening fibres or filler to provide a composite, e.g. a glass-fibre reinforced composite.
  • the matrix material of such a composite may for example be an epoxy resin. Insulating materials having higher dielectric constants at operating frequencies are preferred.
  • the isolator of the arrangement according to the invention may be produced from multiple layers of insulating material on each of which is deposited a film of conducting material. Again, known printed circuit board technology may be employed to produce these multiple layers. The layers may be bonded together with an adhesive, e.g. an organic adhesive, to form a stack.
  • an adhesive e.g. an organic adhesive
  • the isolator may in use connect a signal output conductor of a RF transmission signal generator to the antenna.
  • the antenna may extend along an axis which is perpendicular to the axis of the isolator.
  • the antenna may comprise a monopole antenna.
  • the antenna may alternatively comprise a dipole.
  • the isolator of the arrangement according to the invention may be formed integrally as part of a printed circuit board.
  • the isolator may be formed as a separate component. Where used in conjunction with a printed circuit board and formed separately, it may be bonded to the printed circuit board, e.g. at or near an edge thereof.
  • the isolator of the arrangement according to the present invention is of a new form which can have a compact shape and size beneficially allowing use of the isolator in applications where space is restricted yet still giving efficient suppression of unwanted interfering currents, especially from ground plane conductors in an associated device.
  • an isolator is more lossy as its volume increases so making the isolator more compact allows losses to be minimised.
  • the isolator of the arrangement according to the invention acts as an efficient counterpoise that helps to enhance the gain performance of an antenna connected to the isolator. This beneficially allows a compact monopole antenna to be employed, if desired, having a gain which is close to that of a dipole antenna. This also allows good wideband matching to be achieved in the transmission system.
  • the isolator for use in the arrangement according to the invention can be relatively easy to assemble and can be produced cheaply.
  • the RF arrangement according to the invention may find use in various applications, especially wideband applications.
  • the arrangement is particularly suitable for use in a radio modem for a PC (personal computer), e.g. produced as a card for insertion in a PC.
  • PC personal computer
  • Figure 1 is perspective view of layers used in construction of an isolator useful in an RF arrangement embodying the invention.
  • Figure 2 is a partly schematic partly perspective view of an isolator connected to an antenna in an RF arrangement embodying the invention.
  • Figure 3 is an end view of an arrrangement embodying the invention of an isolator mounted on a printed circuit board and connected to an antenna.
  • Figure 1 illustrates construction of an isolator for use in an RF arrangement embodying the invention.
  • Five rectangular, flat layers 1,2,3,4 and 5 having the same overall dimensions are obtained each comprising an insulating substrate carrying on its surface a metal film.
  • a metal film M1 is deposited on the upper surface of the layer 1 and covers all of the upper surface of the layer 1.
  • a metal film M2 is deposited on the upper surface of the layer 2 and forms a strip running along the length of the layer 2.
  • the film M2 is deposited symmetrically with respect to a longitudinal central axis A2 of the layer 2.
  • a metal film M3 is deposited on the upper surface of the layer 3 and forms a strip running along the length of the layer 3.
  • the film M3 is deposited symmetrically with respect to a longitudinal central axis A3 of the layer 3.
  • the width of the film M3 is about one third that of the film M2.
  • a metal film M4 is deposited on the upper surface of the layer 4 and forms a strip running along the length of the layer 4.
  • the film M4 is deposited symmetrically with respect to a longitudinal central axis A4 of the layer 4.
  • the width of the film M4 is the same as that of the film M2.
  • the layer 4 also has a further metal film M4A deposited on its underside covering all of the surface area of the underside of the layer 4.
  • a metal film M5 is deposited on the upper surface of the layer 5 and covers all of the upper surface of the layer 5.
  • the layers 1 to 5 are mutually arranged so that they form a uniform rectangular stack.
  • Metal films M4A and M5 are soldered together to form a metal joint between the two.
  • the metal films M1, M2, M4 and M4A are electrically connected together by soldereing at one end which is their left hand end as shown in Figure 1.
  • the metal film M3 is not electrically connected to any of the other metal films. None of the metal films is electrically connected to any other metal film at the end of the films which is the right hand end as shown in Figure 1.
  • the layers 1 to 5 are bonded together by an organic adhesive, e.g. epoxy resin, applied at parts of their edges at their ends.
  • Figure 2 shows the completed stack labelled 10 of the layers 1 to 5.
  • Figure 2 shows how the metal films of the layers 1 to 5 in Figure 1 are connected.
  • a conductor 12 is soldered to the film M3.
  • the conductor 12 is connected at its other end to a RF signal transmitter (not shown).
  • the film M3 is soldered at its end distant from the conductor 12 to an electrical connector 14 leading to a monopole antenna 16.
  • Conductors 18 and 20 are soldered respectively to the metal films M2 and M4 and at their other end (not shown) are grounded.
  • the films M1, M2, M4 and M5 are, as described earlier, connected together (not shown) at their end adjacent to the connector 14.
  • the films M1 and M5 are unconnected at their other end.
  • RF signals produced by a transmission signal generator (not shown) are delivered along the conductor 12 and the metal film M3 and to the antenna 16 via the connector 14.
  • RF radiation signals are sent by the antenna 16 to a distant receiver (not shown).
  • the metal films M2 and M4 serve as the first and second conducting layers referred to earlier and the metal films M1 and M4A serve as the third and fourth conducting layers referred to earlier.
  • the stack 10 is bonded to a board 22 which may be a printed circuit board.
  • circuits of the RF transmission signal generator (not shown) may be provided on the same board.
  • the bonding of the stack 10 to the board 22 may be by an organic adhesive.
  • the antenna 16 is shown less schematically in Figure 3. It consists of a monopole conducting rod having an axis which is perpendicular to the surface planes of the layers forming the stack 10.
  • the layer 5 shown in Figure 1 may be replaced by a printed circuit board (not shown) containing metallisation in a particular part in place of the metal film M5 in Figure 1.
  • the isolator is formed directly on a printed circuit board.

Landscapes

  • Details Of Aerials (AREA)
  • Transmitters (AREA)
EP02023476A 2001-11-01 2002-10-21 Agencement d' émission des signaux radiofréquences par émetteur radio Withdrawn EP1309033A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0126222A GB2382231B (en) 2001-11-01 2001-11-01 Isolator devices for current suppression
GB0126222 2001-11-01

Publications (2)

Publication Number Publication Date
EP1309033A2 true EP1309033A2 (fr) 2003-05-07
EP1309033A3 EP1309033A3 (fr) 2004-08-25

Family

ID=9924938

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02023476A Withdrawn EP1309033A3 (fr) 2001-11-01 2002-10-21 Agencement d' émission des signaux radiofréquences par émetteur radio

Country Status (2)

Country Link
EP (1) EP1309033A3 (fr)
GB (1) GB2382231B (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7741943B2 (en) 2007-05-10 2010-06-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniature transformers adapted for use in galvanic isolators and the like
US7791900B2 (en) 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US7852186B2 (en) 2006-08-28 2010-12-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
US7948067B2 (en) 2009-06-30 2011-05-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer isolator packages
US8061017B2 (en) 2006-08-28 2011-11-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Methods of making coil transducers
US8093983B2 (en) 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
CN102509883A (zh) * 2011-12-08 2012-06-20 鸿富锦精密工业（深圳）有限公司 可抑制天线间相互干扰的天线结构
US8258911B2 (en) 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US8305233B2 (en) 2010-01-19 2012-11-06 Elster Solutions, Llc Planar distributed element antenna isolation board
US8385043B2 (en) 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
US8427844B2 (en) 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US8436709B2 (en) 2006-08-28 2013-05-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US9105391B2 (en) 2006-08-28 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. High voltage hold-off coil transducer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441190B1 (de) * 1974-08-28 1975-09-25 Dornier System Gmbh Resonator
JPS6478004A (en) * 1987-09-18 1989-03-23 Denki Kogyo Co Ltd Mobile station diversity antenna device
US5949383A (en) * 1997-10-20 1999-09-07 Ericsson Inc. Compact antenna structures including baluns
EP1150311A2 (fr) * 2000-04-27 2001-10-31 TDK Corporation Matériau magnétique composite et matériau diélectrique composite pour parties électroniques

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2277832B (en) * 1993-04-27 1997-01-15 British Aerospace Thin film multi-layer interconnect
WO1998006243A1 (fr) * 1996-07-31 1998-02-12 Dyconex Patente Procede de production de conducteurs de connexion

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441190B1 (de) * 1974-08-28 1975-09-25 Dornier System Gmbh Resonator
JPS6478004A (en) * 1987-09-18 1989-03-23 Denki Kogyo Co Ltd Mobile station diversity antenna device
US5949383A (en) * 1997-10-20 1999-09-07 Ericsson Inc. Compact antenna structures including baluns
EP1150311A2 (fr) * 2000-04-27 2001-10-31 TDK Corporation Matériau magnétique composite et matériau diélectrique composite pour parties électroniques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 301 (E-785), 11 July 1989 (1989-07-11) -& JP 01 078004 A (DENKI KOGYO KK; others: 01), 23 March 1989 (1989-03-23) *

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8427844B2 (en) 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US7852186B2 (en) 2006-08-28 2010-12-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
US9105391B2 (en) 2006-08-28 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. High voltage hold-off coil transducer
US8093983B2 (en) 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
US7791900B2 (en) 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US9019057B2 (en) 2006-08-28 2015-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US8061017B2 (en) 2006-08-28 2011-11-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Methods of making coil transducers
US8436709B2 (en) 2006-08-28 2013-05-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US8385043B2 (en) 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
US8385028B2 (en) 2006-08-28 2013-02-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US7741943B2 (en) 2007-05-10 2010-06-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniature transformers adapted for use in galvanic isolators and the like
US8237534B2 (en) 2007-05-10 2012-08-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniature transformers adapted for use in galvanic isolators and the like
US8258911B2 (en) 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US7948067B2 (en) 2009-06-30 2011-05-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer isolator packages
US8305233B2 (en) 2010-01-19 2012-11-06 Elster Solutions, Llc Planar distributed element antenna isolation board
CN102509883A (zh) * 2011-12-08 2012-06-20 鸿富锦精密工业（深圳）有限公司 可抑制天线间相互干扰的天线结构

Also Published As

Publication number Publication date
GB0126222D0 (en) 2002-01-02
GB2382231B (en) 2003-12-24
GB2382231A (en) 2003-05-21
EP1309033A3 (fr) 2004-08-25

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