EP1256144B1 - Method for contacting a printed circuit board to a conductor arranged on a support, and device - Google Patents

Method for contacting a printed circuit board to a conductor arranged on a support, and device Download PDF

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Publication number
EP1256144B1
EP1256144B1 EP01911408A EP01911408A EP1256144B1 EP 1256144 B1 EP1256144 B1 EP 1256144B1 EP 01911408 A EP01911408 A EP 01911408A EP 01911408 A EP01911408 A EP 01911408A EP 1256144 B1 EP1256144 B1 EP 1256144B1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
circuit board
carrier
contact
conductor track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01911408A
Other languages
German (de)
French (fr)
Other versions
EP1256144A1 (en
Inventor
Reinhold Preissl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1256144A1 publication Critical patent/EP1256144A1/en
Application granted granted Critical
Publication of EP1256144B1 publication Critical patent/EP1256144B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Definitions

  • the invention is based on a method of the type of the main claim.
  • US 5,255,155 it is known Arrange circuit boards in a motor vehicle and by means of To connect foil conductor tracks.
  • a radio and display instruments arranged need a large number of circuit boards at the same time to be assembled.
  • the foil conductor tracks mechanically loaded and destroyed.
  • Components produced by different manufacturers may be required to lead the Conductor foils to the connections of the individual To adapt printed circuit boards, thereby cutting the Trace foils can result in a high loss or a Numerous differently tailored conductor track foils is required.
  • the inventive method with the features of The main claim has the advantage that it without a high installation effort is possible, several Printed circuit boards in a vehicle connect with each other. Because first in one Metallization process on all necessary traces applied to a carrier, it is then on simple way possible to place a circuit board individually on this Arrange carrier. The arrangement of circuit boards can thus take place one after the other. This makes it special possible to check after each arrangement whether the individual Printed circuit boards are also completely electrically conductive have been contacted. Another advantage is that on Connecting wires or foil conductor tracks that run from the Take away the circuit board, can be dispensed with, because all Conductor tracks that lead to the circuit board already in the Carriers are present. The arranged on the carrier Conductor tracks can be installed before installing printed circuit boards checked for their conductivity and / or short circuits become.
  • circuit board with a Conducting glue to one when metallizing the surface of the wearer, protruding contact with a Conductive adhesive is glued. This makes it possible to Manufacturing step of arranging the circuit board on the Applying a conductive adhesive and arranging the Circuit board to reduce the contact. During the The corresponding contact can surface metallization the surface of the carrier are formed with.
  • the Carrier part of a housing for the at least one PCB is so that the carrier is not only the Printed circuit board carries, but also mechanical protection represents for the circuit board.
  • the carrier partly made of metal and partly made of to produce metal-repellent polyamide because such a Manufacture of the carrier by simple injection molding Way is possible.
  • the at least one Printed circuit board is a flexible film so that it can also be can adapt to a non-planar design of the carrier, as it e.g. a rounded surface of a cockpit module requires.
  • FIG. 1a, 1b and 1c show a first Embodiment for an inventive method for Contacting a circuit board with a carrier
  • the Figures 2a, 2b and 2c a second embodiment for an inventive method for contacting a Printed circuit board with a support
  • the figures 3a to 3e third embodiment for an inventive Process for contacting a circuit board with a Carrier.
  • Figure 4 shows an arrangement according to the invention of several printed circuit boards on a carrier
  • the figure 5a shows an arrangement of several circuit boards according to the invention in a cockpit module of a motor vehicle
  • FIG. 5b shows an inventive embodiment for a Interconnection of several arranged on a motor vehicle Printed circuit boards.
  • a carrier 1 is shown, the one Surface 3 has. On the surface 3 is a second one Conductor 2 applied. From the carrier 1 and the second Conductor 2 is just a small section shown on which a contact to a circuit board is created.
  • the carrier 1 is preferably made of one Made of plastic material, e.g. B. polyamide. Except for one area 5 of the second conductor track 2 Carrier 1 is the carrier made of a metal-repellent Made of material on which metal e.g. in a solder bath or does not adhere, or adheres only very poorly, to vapor deposition. The area 5 which lies on the surface 3 of the carrier However, is made so that metal in a solder bath or attached to a vapor.
  • the second conductor track 2 leads e.g. to an electrical in the carrier Plug connection or to another circuit board.
  • the Carrier 1 is preferably as a cockpit module in one Motor vehicle executed, on the cockpit module Display instruments and controls are arranged so e.g. the speedometer and the radio that are in the Figure are not shown.
  • the contact 6 On the second conductor track 2 a contact 6 is applied, the contact 6 preferably consists of a metal. This is in the figure 1b. Here and in the following correspond to the same Reference numerals also the same elements.
  • the contact 6 will e.g. during the metallization of the surface 3 with applied. It is also possible to contact e.g. in to attach a solder bath to the surface 3.
  • the first trace 8 and the contact area is shown in dashed lines. She are on the side facing the carrier 1 Printed circuit board 7.
  • the embodiment is the first conductor 8 also on the the carrier 1 facing away from the circuit board 7.
  • In 1c is only a section of the circuit board 7 shown, the environment of the contact area 9.
  • Conductive adhesive 10 that is, electrically conductive adhesive the contact area 9 and / or the contact 6 applied there is now a conductive contact between the first conductor 8 and the second conductor 2.
  • the Procedure is not based on the arrangement of printed circuit boards and Carriers limited to one conductor track each, but it can also have multiple conductor tracks on one carrier multiple metallic contacts in one production step with a circuit board with a variety of Contact areas and conductor tracks can be contacted.
  • FIGS. 2a-2c Procedure for contacting described.
  • Figure 2a the circuit board 7 with the first conductor 8 in the Contact area 9 shown.
  • a second metallic contact 11 is applied on the contact area 9 .
  • the application can e.g. by the Apply solder.
  • Figure 2c is the Printed circuit board 7, the 12 by means of conductive adhesive the contact area 9 with the second conductor track 2 on the Surface 3 of the carrier 1 has been contacted. That too
  • the method described in FIGS. 2a to 2c differs differs from that described in FIGS. 1a to 1c Process in that here first a metallic Contact is arranged on the circuit board 7, the first then with the second conductor track 2 on the carrier 1 is brought into contact.
  • FIGS. 3a-3e Procedure described. Starting from the carrier 1, as in FIG. 3a is shown and described in relation to FIG. 1a was a metallic contact 20 on the second Conductor 2 applied. This is in Figure 3b shown.
  • the metallic contact 20 is preferred executed cylindrical.
  • the metallic contact 20 can either by conductive adhesive on the second conductor track 2 be glued or during the metallization of the surface 3 be shaped.
  • the arrangement is also metallic Possible, e.g. in a recess of the carrier 1.
  • FIG. 3c shows a second circuit board 21.
  • the first trace 22 and the second Printed circuit board 21 have an opening 24 which extends from one electrically connected to the first conductor 22 Contact area 23 is surrounded.
  • the second circuit board 21 is via the metallic contact 20 with the opening 24th slipped.
  • a stamp 25 moves on the carrier facing away from the second circuit board 21 on the metallic contact 20 too. This is in Figure 3d shown.
  • the embossing stamp 25 makes the third metallic contact pressed in width and over the Contact area 23 of the second circuit board 21 expanded.
  • the metallic contact now holds, as in FIG. 3e shown, the second circuit board 21 on or just above the surface 3 of the carrier 1.
  • the first is Conductor 22 with the second conductor 2 over the metallic contact 20 and the contact area 23 in one electrically conductive connection.
  • the stamp 25 is preferably executed heatable so that it during his Touching the metallic contact 20 the metallic Contact 20 heats and shapes.
  • the stamp 25 is for this purpose on its third, assigned to the metallic contact 20 Side preferably concave. This is in the Drawing represented by a dashed line 26.
  • To the stamping of the metallic contact 20 Embossing stamp 25 again from the second printed circuit board 21 away.
  • the movement of the die is in the figures 3d and 3e by arrows in the direction of the carrier 1 and from it Carrier 1 indicated away. In Figure 3e is the finished with the carrier 1 contacted second circuit board 21st shown.
  • a carrier 1 is shown in FIG Surface 3 a first circuit board 30, a second Printed circuit board 31 and a third printed circuit board 32 is.
  • the circuit boards are through on the surface 3 arranged conductor tracks 33 electrically conductive with each other connected. With the conductor tracks 33, the circuit boards are 30, 31 and 32 connected via metallic contacts.
  • the metallic contacts are according to that of Figures 3a - 3e described procedures created. For the closer Description is a metallic contact 35 selected.
  • the metallic contact is located above an upper region 36 35 in connection with an edge region 37 of a conductor track 38, which is arranged on the first printed circuit board 30.
  • A has further conductor track 40 on the first printed circuit board 30 a plug contact 39.
  • the carrier 1 has one Front 41, which is opposite the surface 3 and onto which the conductor tracks are guided from the surface 3 become. They then continue on the front 41. This is not shown in the drawing.
  • FIG. 5a shows a cross section through a cockpit module 50 shown in a motor vehicle.
  • the cockpit module 50 is located in a front area of the vehicle and closes on the one hand on a windshield 51 and on the other hand, to an engine compartment 49 of the vehicle.
  • a steering wheel 52 Before the Cockpit module 50 is a steering wheel 52.
  • Im Cockpit module are carrying elements 53, as well Supply lines 54, such as. B. lines for the Air supply.
  • the cockpit module has a cavity 55 in which in addition to the mentioned support elements 53 and Supply lines 54 further elements are arranged, e.g. electrical supply lines, for the sake of No clarity of the drawing in the figure are drawn.
  • the walls 56 of the cockpit module 50 are executed as a carrier for printed circuit boards 57.
  • the circuit boards 57 are in the to the figures 1a to 1c, 2a to 2c, and 3a to 3e described methods on the walls 56 of the cockpit module which act as carriers 50 arranged.
  • the circuit boards serve e.g. B. the Control of display instruments, the radio, the climate control and / or a navigation device in the Vehicle.
  • a flexible circuit board 81 which is made of a flexible film is in one Corner of the cockpit module 50 arranged and adapts to the Form of the cockpit module 50.
  • a cover 80 surrounds one the circuit board 57.
  • the cover 80 is used electromagnetic shielding and is e.g. from a conductive plastic. The radiation electromagnetic radiation with which e.g. Circuits on the other circuit boards could be affected at least diminished.
  • FIG. 5b is a circuit between individual Functional groups and the circuit boards schematically shown.
  • the cockpit module 50 is shown by a dashed line Outline shown.
  • a first circuit board 60 serves the Activation of a display device 61, to which several Guide tracks 62.
  • Guide tracks 62 For the individual connections from Conductor tracks to other elements in FIG. 5b are available drawn conductor tracks symbolically for a variety of conductor tracks. The number of conductor tracks depends according to e.g. for one power supply and one Data transmission required number of conductor tracks.
  • In of the display device 61 are e.g. Speed and Speed of the vehicle is displayed. These are from sensors 63, which is outside the cockpit module 50 in the vehicle are arranged, detected and to an electronic evaluation system is arranged on the first printed circuit board 60, forwarded.
  • Electrical components 64 are on the first circuit board 60 indicated. There are also conductor tracks 65 arranged on the first circuit board 60.
  • the first Printed circuit board 60 is connected via conductor tracks 66 which are on the Surface of the cockpit module are arranged with a second circuit board 67 connected.
  • the second circuit board 67 is connected to a GPS receiver 68.
  • the GPS signal is arranged by one on the second circuit board 67 Computing unit 58 evaluated and for locating one Vehicle position used.
  • the computing unit 58 determined data are sent to a on the first circuit board 60 arranged control electronics of the display device 61 forwarded and arrive in the display device 61 see full ad.
  • the second circuit board 67 is with a third circuit board 69 connected via conductor tracks 70, and the third circuit board 69 is in turn via conductor tracks 71 connected to an operating element 72, which is via push buttons 73 and / or knobs 74.
  • an operating element 72 With the control element 72 it is possible to use the display device 61, at least for Computation unit 58 used and one on the third Printed circuit board 69 arranged climate control device 75 influence.
  • the air conditioning control device 75 has Actuators and sensors 78, not explained in detail, via which Ventilation flaps can be controlled and temperatures in the Indoor and outdoor space can be measured. Because of The traces are clear on the drawing the second circuit board 67 and the third circuit board 69 not shown.

Abstract

Disclosed is a method which is used to simplify the contacting of printed circuit boards to a support which is preferably embodied as a cockpit module in a motor vehicle. According to the inventive method, the printed circuit board is initially connected to the conductors which are disposed on the support, whereby (preferably) various conductors arranged inside said vehicle are electroconductively connected to each other.

Description

Stand der TechnikState of the art

Die Erfindung geht aus von einem Verfahren nach der Gattung des Hauptanspruchs. Aus der US 5,255,155 ist es bekannt, Leiterplatten in einem Kraftfahrzeug anzuordnen und mittels Folienleiterbahnen zu verbinden. Hierbei ist es jedoch erforderlich, die Leiterplatten schon vor einer Montage in dem Fahrzeug elektrisch leitend mit den Folien zu verbinden und dann die bereits verbundenen Leiterplatten mit den Folien in dem Kraftfahrzeug zu montieren. Insbesondere bei der Montage in einem Cockpitmodul, in dem z.B. eine Klimasteuerung, ein Radio und Anzeigeinstrumente angeordnet sind, müssen eine Vielzahl von Leiterplatten gleichzeitig montiert werden. Hierbei können die Folienleiterbahnen mechanisch belastet und zerstört werden. Ferner ist es bei Komponenten, die von verschiedenen Herstellern erzeugt werden, möglicherweise erforderlich, die Führung der Leiterbahnfolien an die Anschlüsse der einzelnen Leiterplatten anzupassen, wodurch bei dem Schnitt der Leiterbahnfolien ein hoher Verlust entstehen kann oder eine Vielzahl verschieden zugeschnittener Leiterbahnfolien erforderlich ist.The invention is based on a method of the type of the main claim. From US 5,255,155 it is known Arrange circuit boards in a motor vehicle and by means of To connect foil conductor tracks. Here it is, however required, the circuit boards before assembly in to connect the vehicle with the foils in an electrically conductive manner and then the already connected circuit boards with the To install foils in the motor vehicle. Especially at installation in a cockpit module, in which e.g. a Climate control, a radio and display instruments arranged need a large number of circuit boards at the same time to be assembled. Here, the foil conductor tracks mechanically loaded and destroyed. It is also at Components produced by different manufacturers may be required to lead the Conductor foils to the connections of the individual To adapt printed circuit boards, thereby cutting the Trace foils can result in a high loss or a Numerous differently tailored conductor track foils is required.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße Verfahren mit den Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß es ohne einen hohen Montageaufwand möglich ist, mehrere Leiterplatten in einem Fahrzeug elektrisch leitend miteinander zu verbinden. Da zunächst in einem Metallisierungsprozeß alle notwendigen Leiterbahnen auf einem Träger aufgebracht werden, ist es anschließend auf einfache Weise möglich, eine Leiterplatte einzeln auf diesem Träger anzuordnen. Die Anordnung von Leiterplatten kann somit nacheinander erfolgen. Hierdurch ist es insbesondere möglich, nach jeder Anordnung zu prüfen, ob die einzelnen Leiterplatten jeweils auch vollständig elektrisch leitend kontaktiert wurden. Ein weiterer Vorteil ist, daß auf Verbindungsdrähte oder Folienleiterbahnen, die von der Leiterplatte wegführen, verzichtet werden kann, da alle Leiterbahnen, die zu der Leiterplatte führen, bereits in dem Träger vorhanden sind. Die an dem Träger angeordneten Leiterbahnen können vor einer Installation von Leiterplatten auf ihre Leitfähigkeit und/oder auf Kurzschlüsse geprüft werden.The inventive method with the features of The main claim has the advantage that it without a high installation effort is possible, several Printed circuit boards in a vehicle connect with each other. Because first in one Metallization process on all necessary traces applied to a carrier, it is then on simple way possible to place a circuit board individually on this Arrange carrier. The arrangement of circuit boards can thus take place one after the other. This makes it special possible to check after each arrangement whether the individual Printed circuit boards are also completely electrically conductive have been contacted. Another advantage is that on Connecting wires or foil conductor tracks that run from the Take away the circuit board, can be dispensed with, because all Conductor tracks that lead to the circuit board already in the Carriers are present. The arranged on the carrier Conductor tracks can be installed before installing printed circuit boards checked for their conductivity and / or short circuits become.

Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen des im Hauptanspruch angegebenen Verfahrens möglich. Besonders vorteilhaft ist es, wenn die Leiterplatte mit einem Leitkleber an einen bei der Metallisierung der Oberfläche des Trägers erzeugten, hervorstehenden Kontakt mit einem Leitkleber angeklebt wird. Hierdurch ist es möglich, den Fertigungsschritt der Anordnung der Leiterplatte auf das Auftragen eines Leitklebers und das Anordnen der Leiterplatte an den Kontakt zu reduzieren. Während der Oberflächenmetallisierung kann der entsprechende Kontakt an der Oberfläche des Trägers mit ausgeformt werden. By the measures listed in the subclaims advantageous developments and improvements in Main claim specified procedure possible. Especially It is advantageous if the circuit board with a Conducting glue to one when metallizing the surface of the wearer, protruding contact with a Conductive adhesive is glued. This makes it possible to Manufacturing step of arranging the circuit board on the Applying a conductive adhesive and arranging the Circuit board to reduce the contact. During the The corresponding contact can surface metallization the surface of the carrier are formed with.

Weiterhin ist es vorteilhaft, die Leiterplatte mit einer dafür vorgesehenen Öffnung um einen an der Oberfläche des Trägers befindlichen Kontakt anzuordnen, um mit einem Prägestempel diesen Kontakt so zu verbreitern, daß er einerseits die Leiterplatte hält und sich andererseits ein elektrischer Kontakt zu einer dafür vorgesehenen Fläche auf der Leiterplatte ergibt. Somit kann in einem Fertigungsschritt sowohl ein tragender Kontakt als auch eine elektrische Verbindung zwischen der Leiterplatte und dem Träger erstellt werden.It is also advantageous to use a printed circuit board intended opening around a on the surface of the Arrange the contact located to wear with a Mint stamp to broaden this contact so that it on the one hand holds the circuit board and on the other hand one electrical contact to a designated area the printed circuit board. Thus, in one Manufacturing step both a key contact and one electrical connection between the circuit board and the Carriers are created.

Weiterhin ist es vorteilhaft, eine Vielzahl von Leiterplatten in einem Fahrzeug nach dem erfindungsgemäßen Verfahren zu verbinden, da auf einfache Weise eine elektrische Verbindung direkt über die Herstellung des Trägers realisiert werden kann.It is also advantageous to have a variety of Printed circuit boards in a vehicle according to the invention To combine procedures, because a simple way electrical connection directly via the making of the Carrier can be realized.

Ferner ist es vorteilhaft, daß auf der Leiterplatte bereits elektrische Bauelemente angeordnet sind, so daß die Leiterplatte fertig montiert in das Fahrzeug eingebracht werden kann. Dabei ist es weiterhin vorteilhaft, daß der Träger ein Teil eines Gehäuses für die mindestens eine Leiterplatte ist, so daß der Träger nicht nur die Leiterplatte trägt, sondern auch einen mechanischen Schutz für die Leiterplatte darstellt. Ferner ist es vorteilhaft, den Träger teilweise aus metallisierbarem und teilweise aus metallabweisendem Polyamid zu fertigen, da so eine Herstellung des Trägers im Spritzgußverfahren auf einfache Weise möglich ist. Bei der Erstellung eines Cockpitmoduls kann hierdurch die äußere Form des Trägers an eine für die Form des Cockpitmoduls gewünschte Form angepaßt werden.It is also advantageous that already on the circuit board electrical components are arranged so that the Printed circuit board installed in the vehicle can be. It is also advantageous that the Carrier part of a housing for the at least one PCB is so that the carrier is not only the Printed circuit board carries, but also mechanical protection represents for the circuit board. It is also advantageous the carrier partly made of metal and partly made of to produce metal-repellent polyamide, because such a Manufacture of the carrier by simple injection molding Way is possible. When creating a cockpit module can thereby the outer shape of the carrier to one for the Shape of the cockpit module desired shape can be adjusted.

Ferner ist es vorteilhaft, daß die mindestens eine Leiterplatte eine flexible Folie ist, so daß sie sich auch an eine nicht plane Gestaltung des Trägers anpassen kann, wie es z.B. eine abgerundete Oberfläche eines Cockpitmoduls erfordert.It is also advantageous that the at least one Printed circuit board is a flexible film so that it can also be can adapt to a non-planar design of the carrier, as it e.g. a rounded surface of a cockpit module requires.

Zeichnungdrawing

Ausführungsbeispiele der Erfindung sind in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen die Figuren 1a, 1b und 1c ein erstes Ausführungsbeispiel für ein erfindungsgemäßes Verfahren zur Kontaktierung einer Leiterplatte mit einem Träger, die Figuren 2a, 2b und 2c ein zweites Ausführungsbeispiele für ein erfindungsgemäßes Verfahren zur Kontaktierung einer Leiterplatte mit einem Träger, die Figuren 3a bis 3e ein drittes Ausführungsbeispiel für ein erfindungsgemäßes Verfahren zur Kontaktierung einer Leiterplatte mit einem Träger. Die Figur 4 zeigt eine erfindungsgemäße Anordnung von mehreren Leiterplatten auf einem Träger, die Figur 5a zeigt eine erfindungsgemäße Anordnung mehrerer Leiterplatten in einem Cockpitmodul eines Kraftfahrzeugs, die Figur 5b zeigt ein erfindungsgemäßes Ausführungsbeispiel für eine Verschaltung mehrerer, an einem Kraftfahrzeug angeordneter Leiterplatten.Embodiments of the invention are in the drawing shown and in the description below explained. Figures 1a, 1b and 1c show a first Embodiment for an inventive method for Contacting a circuit board with a carrier, the Figures 2a, 2b and 2c a second embodiment for an inventive method for contacting a Printed circuit board with a support, the figures 3a to 3e third embodiment for an inventive Process for contacting a circuit board with a Carrier. Figure 4 shows an arrangement according to the invention of several printed circuit boards on a carrier, the figure 5a shows an arrangement of several circuit boards according to the invention in a cockpit module of a motor vehicle, FIG. 5b shows an inventive embodiment for a Interconnection of several arranged on a motor vehicle Printed circuit boards.

Beschreibung des AusführungsbeispielsDescription of the embodiment

In der Figur 1a ist ein Träger 1 dargestellt, der eine Oberfläche 3 aufweist. Auf der Oberfläche 3 ist eine zweite Leiterbahn 2 aufgebracht. Von dem Träger 1 und der zweiten Leiterbahn 2 ist lediglich ein kleiner Ausschnitt dargestellt, an dem ein Kontakt zu einer Leiterplatte erstellt wird. Der Träger 1 ist vorzugsweise aus einem Kunststoffmaterial gefertigt, z. B. Polyamid. Bis auf einen, sich an der zweiten Leiterbahn 2 befindlichen Bereich 5 des Trägers 1 ist der Träger aus einem metallabweisenden Material gefertigt, an dem Metall z.B. in einem Lötbad oder bei einer Bedampfung nicht oder nur sehr schlecht haftet. Der Bereich 5, der an der Oberfläche 3 des Trägers liegt, ist jedoch so gefertigt, daß Metall bei einem Löttauchbad oder bei einer Bedampfung anhaftet. Die zweite Leiterbahn 2 führt z.B. zu einem in dem Träger befindlichen, elektrischen Steckanschluß oder zu einer weiteren Leiterplatte. Der Träger 1 ist vorzugsweise als ein Cockpitmodul in einem Kraftfahrzeug ausgeführt, wobei an dem Cockpitmodul Anzeigeinstrumente und Bedienelemente angeordnet sind, so z.B. die Geschwindigkeitsanzeige und das Radio, die in der Figur nicht dargestellt sind. Auf die zweite Leiterbahn 2 wird ein Kontakt 6 aufgebracht, wobei der Kontakt 6 vorzugsweise aus einem Metall besteht. Dies ist in der Figur 1b dargestellt. Hier und im folgenden entsprechen gleiche Bezugszeichen auch gleichen Elementen. Der Kontakt 6 wird z.B. während der Metallisierung der Oberfläche 3 mit aufgebracht. Ferner ist es auch möglich, den Kontakt z.B. in einem Lötbad an der Oberfläche 3 anzubringen. Anschließend werden eine Leiterplatte 7 mit einer ersten Leiterbahn 8 und einem Kontaktbereich 9 an dem Kontakt 6 angeordnet, wie es in der Figur 1c dargestellt ist. Die erste Leiterbahn 8 und der Kontaktbereich sind gestrichelt dargestellt. Sie befinden sich auf der dem Träger 1 zugewandten Seite der Leiterplatte 7. In einem in der Figur nicht dargestellten Ausführungsbeispiel ist die erste Leiterbahn 8 auch auf die dem Träger 1 abgewandte Seite der Leiterplatte 7 geführt. In der Figur 1c ist nur ein Ausschnitt aus der Leiterplatte 7 dargestellt, die Umgebung des Kontaktbereichs 9. Auf der Leiterplatte 7 angeordnete elektrische Bauelemente sind in der Figur nicht dargestellt. Indem vor einer Kontaktierung Leitkleber 10, also elektrisch leitfähiger Klebstoff, auf den Kontaktbereich 9 und/oder den Kontakt 6 aufgebracht wird, besteht nun ein leitfähiger Kontakt zwischen der ersten Leiterbahn 8 und der zweiten Leiterbahn 2. Das Verfahren ist nicht auf die Anordnung von Leiterplatten und Trägern mit jeweils einer Leiterbahn beschränkt, sondern es können auch mehrere Leiterbahnen auf einem Träger mit mehreren metallischen Kontakten in einem Fertigungsschritt mit einer Leiterplatte mit einer Vielzahl von Kontaktbereichen und Leiterbahnen kontaktiert werden.In Figure 1a, a carrier 1 is shown, the one Surface 3 has. On the surface 3 is a second one Conductor 2 applied. From the carrier 1 and the second Conductor 2 is just a small section shown on which a contact to a circuit board is created. The carrier 1 is preferably made of one Made of plastic material, e.g. B. polyamide. Except for one area 5 of the second conductor track 2 Carrier 1 is the carrier made of a metal-repellent Made of material on which metal e.g. in a solder bath or does not adhere, or adheres only very poorly, to vapor deposition. The area 5 which lies on the surface 3 of the carrier However, is made so that metal in a solder bath or attached to a vapor. The second conductor track 2 leads e.g. to an electrical in the carrier Plug connection or to another circuit board. The Carrier 1 is preferably as a cockpit module in one Motor vehicle executed, on the cockpit module Display instruments and controls are arranged so e.g. the speedometer and the radio that are in the Figure are not shown. On the second conductor track 2 a contact 6 is applied, the contact 6 preferably consists of a metal. This is in the figure 1b. Here and in the following correspond to the same Reference numerals also the same elements. The contact 6 will e.g. during the metallization of the surface 3 with applied. It is also possible to contact e.g. in to attach a solder bath to the surface 3. Subsequently are a circuit board 7 with a first conductor 8 and a contact area 9 arranged on the contact 6, as is is shown in Figure 1c. The first trace 8 and the contact area is shown in dashed lines. she are on the side facing the carrier 1 Printed circuit board 7. In a not shown in the figure The embodiment is the first conductor 8 also on the the carrier 1 facing away from the circuit board 7. In 1c is only a section of the circuit board 7 shown, the environment of the contact area 9. On the Printed circuit board 7 arranged electrical components are in not shown in the figure. By contacting Conductive adhesive 10, that is, electrically conductive adhesive the contact area 9 and / or the contact 6 applied there is now a conductive contact between the first conductor 8 and the second conductor 2. The Procedure is not based on the arrangement of printed circuit boards and Carriers limited to one conductor track each, but it can also have multiple conductor tracks on one carrier multiple metallic contacts in one production step with a circuit board with a variety of Contact areas and conductor tracks can be contacted.

Anhand der Figuren 2a-2c wird ein weiteres erfindungsgemäßes Verfahren zur Kontaktierung beschrieben. In der Figur 2a ist die Leiterplatte 7 mit der ersten Leiterbahn 8 in dem Kontaktbereich 9 dargestellt. Auf den Kontaktbereich 9 wird ein zweiter metallischer Kontakt 11 aufgebracht. Dies ist in der Figur 2b gezeigt. Das Aufbringen kann z.B. durch das Aufbringen von Lötzinn erfolgen. In der Figur 2c ist die Leiterplatte 7 dargestellt, die mittels Leitkleber 12 über den Kontaktbereich 9 mit der zweiten Leiterbahn 2 auf der Oberfläche 3 des Trägers 1 kontaktiert worden ist. Das zu den Figuren 2a bis 2c beschriebene Verfahren unterscheidet sich von dem zu den Figuren 1a bis 1c beschriebenen Verfahren dadurch, daß hier zunächst ein metallischer Kontakt auf der Leiterplatte 7 angeordnet wird, der erst anschließend mit der zweiten Leiterbahn 2 auf dem Träger 1 in Kontakt gebracht wird.Another one according to the invention is shown in FIGS. 2a-2c Procedure for contacting described. In Figure 2a the circuit board 7 with the first conductor 8 in the Contact area 9 shown. On the contact area 9 is a second metallic contact 11 is applied. This is in shown in Figure 2b. The application can e.g. by the Apply solder. In Figure 2c is the Printed circuit board 7, the 12 by means of conductive adhesive the contact area 9 with the second conductor track 2 on the Surface 3 of the carrier 1 has been contacted. That too The method described in FIGS. 2a to 2c differs differs from that described in FIGS. 1a to 1c Process in that here first a metallic Contact is arranged on the circuit board 7, the first then with the second conductor track 2 on the carrier 1 is brought into contact.

Anhand der Figuren 3a-3e ist ein weiteres erfindungsgemäßes Verfahren beschrieben. Ausgehend von dem Träger 1, wie er in der Figur 3a dargestellt ist und zu der Figur 1a beschrieben wurde, wird ein metallischer Kontakt 20 auf die zweite Leiterbahn 2 aufgebracht. Dies ist in der Figur 3b dargestellt. Der metallische Kontakt 20 ist vorzugsweise zylinderförmig ausgeführt. Der metallische Kontakt 20 kann entweder durch Leitkleber auf die zweite Leiterbahn 2 geklebt werden oder bei der Metallisierung der Oberfläche 3 ausgeformt werden. Auch ist die Anordnung eines metallischen Stiftes möglich, z.B. in einer Vertiefung des Trägers 1. In der Figur 3c ist eine zweite Leiterplatte 21 dargestellt. Another example according to the invention is shown in FIGS. 3a-3e Procedure described. Starting from the carrier 1, as in FIG. 3a is shown and described in relation to FIG. 1a was a metallic contact 20 on the second Conductor 2 applied. This is in Figure 3b shown. The metallic contact 20 is preferred executed cylindrical. The metallic contact 20 can either by conductive adhesive on the second conductor track 2 be glued or during the metallization of the surface 3 be shaped. The arrangement is also metallic Possible, e.g. in a recess of the carrier 1. In FIG. 3c shows a second circuit board 21.

Auf der zweiten Leiterplatte 21 ist auf einer dem Träger 1 abgewandten Oberfläche 27 eine erste Leiterbahn 22 angeordnet. Die erste Leiterbahn 22 und die zweite Leiterplatte 21 weisen eine Öffnung 24 auf, die von einem elektrisch mit der ersten Leiterbahn 22 verbundenen Kontaktbereich 23 umgeben ist. Die zweite Leiterplatte 21 wird über den metallischen Kontakt 20 mit der Öffnung 24 gestülpt. Ein Prägestempel 25 bewegt sich an der dem Träger abgewandten Seite der zweiten Leiterplatte 21 auf den metallischen Kontakt 20 zu. Dies ist in der Figur 3d dargestellt. Durch den Prägestempel 25 wird der dritte metallische Kontakt in die Breite gedrückt und über den Kontaktbereich 23 der zweiten Leiterplatte 21 erweitert. Der metallische Kontakt hält nun, wie in der Figur 3e dargestellt, die zweite Leiterplatte 21 auf oder knapp über der Oberfläche 3 des Trägers 1. Ferner steht die erste Leiterbahn 22 mit der zweiten Leiterbahn 2 über den metallischen Kontakt 20 und den Kontaktbereich 23 in einer elektrisch leitenden Verbindung. Der Prägestempel 25 ist vorzugsweise erhitzbar ausgeführt, so daß er während seiner Berührung des metallischen Kontaktes 20 den metallischen Kontakt 20 erwärmt und formt. Hierzu ist der Prägestempel 25 auf seiner dritten, dem metallischen Kontakt 20 zugewiesenen Seite vorzugsweise konkav ausgeführt. Dies ist in der Zeichnung durch eine gestrichelte Linie 26 dargestellt. Nach dem Prägen des metallischen Kontaktes 20 wird der Prägestempel 25 wieder von der zweiten Leiterplatte 21 entfernt. Die Bewegung des Prägestempels ist in den Figuren 3d und 3e durch Pfeile in Richtung des Trägers 1 und von dem Träger 1 weg weisend angedeutet. In der Figur 3e ist die fertig mit dem Träger 1 kontaktierte zweite Leiterplatte 21 dargestellt.On the second printed circuit board 21, the carrier 1 surface 27 facing away from a first conductor 22 arranged. The first trace 22 and the second Printed circuit board 21 have an opening 24 which extends from one electrically connected to the first conductor 22 Contact area 23 is surrounded. The second circuit board 21 is via the metallic contact 20 with the opening 24th slipped. A stamp 25 moves on the carrier facing away from the second circuit board 21 on the metallic contact 20 too. This is in Figure 3d shown. The embossing stamp 25 makes the third metallic contact pressed in width and over the Contact area 23 of the second circuit board 21 expanded. The metallic contact now holds, as in FIG. 3e shown, the second circuit board 21 on or just above the surface 3 of the carrier 1. Furthermore, the first is Conductor 22 with the second conductor 2 over the metallic contact 20 and the contact area 23 in one electrically conductive connection. The stamp 25 is preferably executed heatable so that it during his Touching the metallic contact 20 the metallic Contact 20 heats and shapes. The stamp 25 is for this purpose on its third, assigned to the metallic contact 20 Side preferably concave. This is in the Drawing represented by a dashed line 26. To the stamping of the metallic contact 20 Embossing stamp 25 again from the second printed circuit board 21 away. The movement of the die is in the figures 3d and 3e by arrows in the direction of the carrier 1 and from it Carrier 1 indicated away. In Figure 3e is the finished with the carrier 1 contacted second circuit board 21st shown.

In der Figur 4 ist ein Träger 1 dargestellt, auf dessen Oberfläche 3 eine erste Leiterplatte 30, eine zweite Leiterplatte 31 und eine dritte Leiterplatte 32 angeordnet ist. Die Leiterplatten sind durch auf der Oberfläche 3 angeordnete Leiterbahnen 33 elektrisch leitend miteinander verbunden. Mit den Leiterbahnen 33 stehen die Leiterplatten 30, 31 und 32 über metallische Kontakte in Verbindung. Die metallischen Kontakte sind nach dem zu den Figuren 3a - 3e beschriebenen Verfahren erstellt. Für die nähere Beschreibung ist ein metallischer Kontakt 35 ausgewählt. Über einen oberen Bereich 36 steht der metallische Kontakt 35 in Verbindung zu einem Randbereich 37 einer Leiterbahn 38, die auf der ersten Leiterplatte 30 angeordnet ist. Eine weitere Leiterbahn 40 auf der ersten Leiterplatte 30 weist einen Steckkontakt 39 auf. Aus Gründen der Übersichtlichkeit sind auf den Leiterplatten angeordnete Bauelemente in der Figur 4 nicht eingezeichnet. Der Träger 1 weist eine Vorderseite 41 auf, die der Oberfläche 3 gegenüberliegt und auf die die Leiterbahnen von der Oberfläche 3 geführt werden. Sie verlaufen dann auf der Vorderseite 41 weiter. Dies ist in der Zeichnung nicht dargestellt.A carrier 1 is shown in FIG Surface 3 a first circuit board 30, a second Printed circuit board 31 and a third printed circuit board 32 is. The circuit boards are through on the surface 3 arranged conductor tracks 33 electrically conductive with each other connected. With the conductor tracks 33, the circuit boards are 30, 31 and 32 connected via metallic contacts. The metallic contacts are according to that of Figures 3a - 3e described procedures created. For the closer Description is a metallic contact 35 selected. The metallic contact is located above an upper region 36 35 in connection with an edge region 37 of a conductor track 38, which is arranged on the first printed circuit board 30. A has further conductor track 40 on the first printed circuit board 30 a plug contact 39. For the sake of clarity are components arranged on the printed circuit boards in the Figure 4 not shown. The carrier 1 has one Front 41, which is opposite the surface 3 and onto which the conductor tracks are guided from the surface 3 become. They then continue on the front 41. This is not shown in the drawing.

In der Figur 5a ist ein Querschnitt durch ein Cockpitmodul 50 in einem Kraftfahrzeug dargestellt. Das Cockpitmodul 50 befindet sich in einem vorderen Bereich des Fahrzeugs und schließt einerseits an einer Windschutzscheibe 51 und andererseits an einen Motorraum 49 des Fahrzeugs an. Vor dem Cockpitmodul 50 befindet sich ein Lenkrad 52. Im Cockpitmodul befinden sich Trageelemente 53, sowie Versorgungsleitungen 54, wie z. B. Leitungen für die Luftzufuhr. Das Cockpitmodul weist einen Hohlraum 55 auf, in dem neben den genannten Trageelementen 53 und Versorgungsleitungen 54 weitere Elemente angeordnet sind, z.B. elektrische Versorgungsleitungen, die aus Gründen der Übersichtlichkeit der Zeichnung in der Figur nicht eingezeichnet sind. Die Wände 56 des Cockpitmoduls 50 sind als Träger für Leiterplatten 57 ausgeführt. Dabei bilden die Wände 56 außerdem einen Sicht- und Berührschutz gegenüber einem sich vor dem Lenkrad 52 befindenden Benutzer des Fahrzeugs. Die Leiterplatten 57 sind in der zu den Figuren 1a bis 1c, 2a bis 2c, bzw. 3a bis 3e beschriebenen Verfahren auf die als Träger fungierenden Wände 56 des Cockpitmoduls 50 angeordnet. Die Leiterplatten dienen z. B. der Ansteuerung von Anzeigeinstrumenten, dem Radio, der Klimasteuerung und/oder einer Navigationsvorrichtung in dem Fahrzeug. Auf den Leiterplatten sind elektrische Bauelemente 59 angeordnet, vorzugsweise durch einen Lötprozeß, insbesondere in SMD-Technik. Eine flexible Leiterplatte 81, die aus einer flexiblen Folie gefertigt ist, ist in einer Ecke des Cockpitmoduls 50 angeordnet und paßt sich an die Form des Cockpitmoduls 50 an. Eine Abdeckung 80 umgibt eine der Leiterplatten 57. Die Abdeckung 80 dient der elektromagnetischen Abschirmung und ist z.B. aus einem leitfähigen Kunststoff ausgeführt. Die Abstrahlung elektromagnetischer Strahlen, mit denen z.B. Schaltungen auf den übrigen Leiterplatten beeinflußt werden könnten, wird zumindest vermindert.FIG. 5a shows a cross section through a cockpit module 50 shown in a motor vehicle. The cockpit module 50 is located in a front area of the vehicle and closes on the one hand on a windshield 51 and on the other hand, to an engine compartment 49 of the vehicle. Before the Cockpit module 50 is a steering wheel 52. Im Cockpit module are carrying elements 53, as well Supply lines 54, such as. B. lines for the Air supply. The cockpit module has a cavity 55 in which in addition to the mentioned support elements 53 and Supply lines 54 further elements are arranged, e.g. electrical supply lines, for the sake of No clarity of the drawing in the figure are drawn. The walls 56 of the cockpit module 50 are executed as a carrier for printed circuit boards 57. Thereby form the Walls 56 also opposite a privacy and touch protection a user of the in front of the steering wheel 52 Vehicle. The circuit boards 57 are in the to the figures 1a to 1c, 2a to 2c, and 3a to 3e described methods on the walls 56 of the cockpit module which act as carriers 50 arranged. The circuit boards serve e.g. B. the Control of display instruments, the radio, the Climate control and / or a navigation device in the Vehicle. There are electrical components on the circuit boards 59 arranged, preferably by a soldering process, especially in SMD technology. A flexible circuit board 81, which is made of a flexible film is in one Corner of the cockpit module 50 arranged and adapts to the Form of the cockpit module 50. A cover 80 surrounds one the circuit board 57. The cover 80 is used electromagnetic shielding and is e.g. from a conductive plastic. The radiation electromagnetic radiation with which e.g. Circuits on the other circuit boards could be affected at least diminished.

In der Figur 5b ist eine Schaltung zwischen einzelnen Funktionsgruppen und den Leiterplatten schematisch dargestellt. Das Cockpitmodul 50 ist durch eine gestrichelte Umrandung dargestellt. Eine erste Leiterplatte 60 dient der Ansteuerung einer Anzeigevorrichtung 61, zu der mehrere Leiterbahnen 62 führen. Bei den einzelnen Verbindungen von Leiterbahnen zu anderen Elementen in der Figur 5b stehen die eingezeichneten Leiterbahnen symbolisch für eine Vielzahl von Leiterbahnen. Die Anzahl der Leiterbahnen richtet sich nach der z.B. für eine Spannungsversorgung und eine Datenübertragung erforderliche Anzahl von Leiterbahnen. In der Anzeigevorrichtung 61 werden z.B. Geschwindigkeit und Drehzahl des Fahrzeugs angezeigt. Diese werden von Sensoren 63, die außerhalb des Cockpitmoduls 50 im Fahrzeug angeordnet sind, erfaßt und an eine Auswerteelektronik, die auf der ersten Leiterplatte 60 angeordnet ist, weitergeleitet. Elektrische Bauelemente 64 sind auf der ersten Leiterplatte 60 angedeutet. Ebenso sind Leiterbahnen 65 auf der ersten Leiterplatte 60 angeordnet. Die erste Leiterplatte 60 ist über Leiterbahnen 66, die auf der Oberfläche des Cockpitmoduls angeordnet sind, mit einer zweiten Leiterplatte 67 verbunden. Die zweite Leiterplatte 67 ist mit einem GPS-Empfänger 68 verbunden. Das GPS-Signal wird von einer auf der zweiten Leiterplatte 67 angeordneten Recheneinheit 58 ausgewertet und für eine Ortung einer Fahrzeugposition verwendet. Die von der Recheneinheit 58 ermittelten Daten werden an eine auf der ersten Leiterplatte 60 angeordnete Ansteuerungselektronik der Anzeigevorrichtung 61 weitergeleitet und gelangen in der Anzeigevorrichtung 61 zur Anzeige. Die zweite Leiterplatte 67 ist mit einer dritten Leiterplatte 69 über Leiterbahnen 70 verbunden, und die dritte Leiterplatte 69 ist wiederum über Leiterbahnen 71 mit einem Bedienelement 72 verbunden, das über Druckknöpfe 73 und/oder Drehknöpfe 74 verfügt. Mit dem Bedienelement 72 ist es möglich, die Anzeigevorrichtung 61, die zumindest zur Ortung verwendete Recheneinheit 58 und eine auf der dritten Leiterplatte 69 angeordnete Klimasteuervorrichtung 75 zu beeinflussen. Die Klimasteuervorrichtung 75 verfügt über nicht näher erläuterte Aktoren und Sensoren 78, über die Lüftungsklappen gesteuert werden und Temperaturen im Innenraum und Außenraum gemessen werden. Aus Gründen der Übersichtlichkeit der Zeichnung sind die Leiterbahnen auf der zweiten Leiterplatte 67 und der dritten Leiterplatte 69 nicht dargestellt.In Figure 5b is a circuit between individual Functional groups and the circuit boards schematically shown. The cockpit module 50 is shown by a dashed line Outline shown. A first circuit board 60 serves the Activation of a display device 61, to which several Guide tracks 62. For the individual connections from Conductor tracks to other elements in FIG. 5b are available drawn conductor tracks symbolically for a variety of conductor tracks. The number of conductor tracks depends according to e.g. for one power supply and one Data transmission required number of conductor tracks. In of the display device 61 are e.g. Speed and Speed of the vehicle is displayed. These are from sensors 63, which is outside the cockpit module 50 in the vehicle are arranged, detected and to an electronic evaluation system is arranged on the first printed circuit board 60, forwarded. Electrical components 64 are on the first circuit board 60 indicated. There are also conductor tracks 65 arranged on the first circuit board 60. The first Printed circuit board 60 is connected via conductor tracks 66 which are on the Surface of the cockpit module are arranged with a second circuit board 67 connected. The second circuit board 67 is connected to a GPS receiver 68. The GPS signal is arranged by one on the second circuit board 67 Computing unit 58 evaluated and for locating one Vehicle position used. The computing unit 58 determined data are sent to a on the first circuit board 60 arranged control electronics of the display device 61 forwarded and arrive in the display device 61 see full ad. The second circuit board 67 is with a third circuit board 69 connected via conductor tracks 70, and the third circuit board 69 is in turn via conductor tracks 71 connected to an operating element 72, which is via push buttons 73 and / or knobs 74. With the control element 72 it is possible to use the display device 61, at least for Computation unit 58 used and one on the third Printed circuit board 69 arranged climate control device 75 influence. The air conditioning control device 75 has Actuators and sensors 78, not explained in detail, via which Ventilation flaps can be controlled and temperatures in the Indoor and outdoor space can be measured. Because of The traces are clear on the drawing the second circuit board 67 and the third circuit board 69 not shown.

Claims (13)

  1. Method for making electrical contact with a printed circuit board (7, 21, 30, 57, 60, 81) and a carrier (1, 50) in a motor vehicle, preferably in a cockpit module, having a first conductor track (8, 22, 65) which is arranged on the printed circuit board and having a second conductor track (2, 62, 66, 70) which is arranged on a carrier, the carrier being preferably moulded using an injection moulding method, partially from a metallizable and partially from a metal-repellent material, the surface (3) of the carrier (1, 50) being formed with metal-repellent and metallizable (5) regions, the second conductor track being created by metallizing the metallizable part of the surface of the carrier, the first conductor track on the printed circuit board being electrically conductively connected to the second conductor track on the carrier, and the printed circuit board being supported by the carrier.
  2. Method according to Claim 1, characterized in that, during the metallization, a contact (6, 20, 11, 35) which protrudes from the surface (3) of the carrier (1, 50) is formed on the second conductor track (2, 62, 66, 70).
  3. Method according to Claim 2, characterized in that a contact face (9), connected to the first conductor track, of the printed circuit board is bonded to the contact (6) using a conductive bonding agent (10).
  4. Method according to either of Claims 2 and 3, characterized in that the contact (20) is introduced into an opening (24) in the printed circuit board, in that a die (25) is pressed onto the contact from one side of the printed circuit board facing away from the surface (3) of the carrier (1, 50), in that the contact (20) is widened by the force transmitted via the die, at least on the side of the printed circuit board facing away from the surface of the carrier, and that the widened contact is pressed on to a surface (25) which is arranged on the printed circuit board and is electrically conductively connected to the first conductor track (22).
  5. Method according to Claim 4, characterized in that the contact (20) is heated during or before it is touched by the die (25).
  6. Method according to Claim 1, characterized in that a contact (6) which is electrically conductively connected to the second conductor track (2) and protrudes above the surface (3) of the printed circuit board is arranged on the printed circuit board, and in that the contact is bonded to a contact face of the first conductor track.
  7. Method for connecting printed circuit boards in a motor vehicle, the printed circuit boards (57) being placed in contact, according to a method according to one of the preceding claims (1-6), with a carrier, characterized in that the printed circuit boards are equipped with electrical components in such a way that the printed circuit boards are arranged in a cockpit module (50), and in that the printed circuit boards are each electrically conductively connected to one another via second conductor tracks which are arranged on the carrier.
  8. Device having a carrier (1, 50) and having at least one printed circuit board (7, 21, 30, 57, 60, 81) in a motor vehicle, first conductor tracks (8, 22, 65) and electrical components (59, 64) being arranged on the printed circuit board (7, 21, 30, 57, 60, 81), second conductor tracks (2, 62, 66, 70) being arranged on the carrier (1, 50) and the first and second conductor tracks being electrically conductively connected according to a method according to Claims 1 to 6.
  9. Device according to Claim 8, characterized in that the carrier (1, 50) is part of a housing for the at least one printed circuit board (7, 21, 30, 57, 60, 81).
  10. Device according to either of Claims 8 and 9, characterized in that the carrier (1, 50) is fabricated at least partially from metallizable polyamide and at least partially from metal-repellent polyamide.
  11. Device according to one of Claims 8-10, characterized in that the at least one printed circuit board is a flexible film (81).
  12. Device according to one of Claims 8-11, characterized in that a multiplicity of printed circuit boards (30, 31, 32, 60, 67, 69) are arranged in the motor vehicle, in that the drive electronics for a display device (61), for an air-conditioning control device (75), for a radio device and/or for a navigation device (58) are arranged on the printed circuit boards (30, 31, 32, 60, 67, 69).
  13. Device according to Claim 12, characterized in that the printed circuit boards (30, 31, 32, 60, 67, 69) are at least partially surrounded by an electromagnetic screening cover (80).
EP01911408A 2000-02-01 2001-01-31 Method for contacting a printed circuit board to a conductor arranged on a support, and device Expired - Lifetime EP1256144B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10004162A DE10004162A1 (en) 2000-02-01 2000-02-01 Method of electrically contacting circuit board with conductive track on substrate in motor vehicle, involves electrically connecting first and second tracks and carrying circuit board on substrate
DE10004162 2000-02-01
PCT/DE2001/000383 WO2001057960A1 (en) 2000-02-01 2001-01-31 Method for contacting a printed circuit board to a conductor arranged on a support, and device

Publications (2)

Publication Number Publication Date
EP1256144A1 EP1256144A1 (en) 2002-11-13
EP1256144B1 true EP1256144B1 (en) 2003-10-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01911408A Expired - Lifetime EP1256144B1 (en) 2000-02-01 2001-01-31 Method for contacting a printed circuit board to a conductor arranged on a support, and device

Country Status (4)

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EP (1) EP1256144B1 (en)
AU (1) AU2001240449A1 (en)
DE (2) DE10004162A1 (en)
WO (1) WO2001057960A1 (en)

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DE10004162A1 (en) 2001-08-09
EP1256144A1 (en) 2002-11-13
WO2001057960A1 (en) 2001-08-09
DE50100722D1 (en) 2003-11-06
AU2001240449A1 (en) 2001-08-14

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