EP1231682B1 - Method and device for improving electrical contact of spring connectors - Google Patents

Method and device for improving electrical contact of spring connectors Download PDF

Info

Publication number
EP1231682B1
EP1231682B1 EP02250517A EP02250517A EP1231682B1 EP 1231682 B1 EP1231682 B1 EP 1231682B1 EP 02250517 A EP02250517 A EP 02250517A EP 02250517 A EP02250517 A EP 02250517A EP 1231682 B1 EP1231682 B1 EP 1231682B1
Authority
EP
European Patent Office
Prior art keywords
electrical
electrical component
vibration mechanism
contact
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP02250517A
Other languages
German (de)
French (fr)
Other versions
EP1231682A3 (en
EP1231682A2 (en
Inventor
Marko Kakela
Jussi Hakunti
Heikki Halkosaari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj filed Critical Nokia Oyj
Publication of EP1231682A2 publication Critical patent/EP1231682A2/en
Publication of EP1231682A3 publication Critical patent/EP1231682A3/en
Application granted granted Critical
Publication of EP1231682B1 publication Critical patent/EP1231682B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/002—Maintenance of line connectors, e.g. cleaning
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/06—Means for converting reciprocating motion into rotary motion or vice versa
    • H02K7/061—Means for converting reciprocating motion into rotary motion or vice versa using rotary unbalanced masses

Definitions

  • the present invention relates generally to spring contacts in an electronic device and, in particular, to spring contacts between a printed circuit board and an electrical connector.
  • EP0955762A1 describes a technique for mounting a vibrator for vibrating a mobile wireless device when a signal is received.
  • the object can be achieved by causing the spring contacts to move back and forth relative to the PCB and thus rub against the electrically conductive pads in a rapid motion for removing the undesirable insulation materials at the contacting points.
  • FIG. 1-5 An exemplary embodiment of the connector arrangement 1, according to the present invention, is shown in Figures 1-5.
  • a connector 20 is mounted to a printed circuit board (PCB) 10 by means of a bottom plate 80 having two guiding pins 60, 62 and two screws 70, 72.
  • the connector 20 has two frame slots 30 and 32 to accommodate the respective guiding pins 60, 62 .
  • the height of the pins 60 and 62 is slightly greater than the height of the connector 20, leaving a gap 36 between the PCB 10 and the connector 20.
  • the outer diameter of the guiding pins 60, 62 and the inner diameters of the frame slots 30, 32 are designed to have a small gap therebetween to allow the connector 20 to move in the X-Y directions relative to the PCB 10.
  • a vibration motor 40, encapsulated or surrounded by a rubber casing 50 (see Figure 4) is mechanically engaged with the connector 20, such that when the vibration motor 40 is activated, it causes the connector 20 to move in an oscillating manner, relative to the PCB
  • Figure 2 is an exploded view of the connector arrangement of Figure 1.
  • the vibration motor 40 has two electrodes 42 for providing electrical power to the vibration motor 40 for activating the motor 40 when desired.
  • a plurality of spring contacts 22, 24 and 26 extended from the connector 20 to make contact with the PCB 10.
  • the spring contacts 22, 24 and 26 are clearly shown in Figure 3, which is an exploded view of connector arrangement, as viewed from one side thereof. Some or all of these spring contacts 22, 24 and 26 can be used to provide electrical connection between the connector 20 and the PCB 10, the others can be used as mechanical means for providing an urging force against the PCB 10 to keep the connector 20 away from the PCB 10.
  • Figure 4 is another isometric view illustrating the top and rear sections of the connector arrangement without the PCB.
  • the vibration motor 40 is separated from the connector 20 by the rubber casing 50 so as to avoid mechanical damages to the connector 20 due to the vibration.
  • One or some of these spring contacts can be used to make electrical contact to one or more electronically conductive pads on the bottom side of the PCB 10, as shown in Figure 5.
  • FIG 5 is a bottom view of the PCB illustrating the electrically conductive pads on the PCB 10.
  • two pads 18 are used to provide electrical connection to the electrodes 42 of the vibration motor 40 (see Figure 4);
  • two pads 16 are used to provide electrical connection to the spring contacts 26 of the connectors;
  • pad 14 is used to provide electrical connection to the spring contact 24; and
  • a single pad 12 is used to provide electrical connection to the four spring contacts 22.
  • the connector arrangement involves an electrical connector and a printed circuit board, wherein the electrical connection between the electrical connector and the printed circuit board is provided by one or more spring contacts and one or more electrically conducting pads.
  • spring contacts and electrically conducting pads can also be used to provide electrical connection between a printed circuit board and a different electrical component, such as a switch, a solid-state display panel, and a keypad. Spring contacts and electrically conducting pads can be also used between two electrical components.
  • the vibration motor is activated for causing the connector to move only when desired.
  • a timer or a software program can be used to turn on the vibration motor periodically. It is also possible to use a monitoring means to check the electrical connection between the spring contacts and the electrically conducting pads, and the vibration motor is turned on only when needed.
  • the spring contacts are caused to move by the vibration mechanism only within designed tolerances so the contact points between the spring contacts and the pad can be cleaned because of the mechanical stress or the rubbing action.

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

A method and arrangement for improving electrical contact between a printed circuit board and an electrical component, wherein the electrical components have one or more spring contacts to provide electrical connection to one or more pads on the printed circuit board. The contacting point between a spring contact may be oxidized due to humidity, condensation water, chlorides or other environment agents. The oxidation at the contact point degrades the electrical connection and, eventually, causes a total loss in electrical contact. A vibration mechanism is used to cause the electrical components to move relative to the printed circuit board and the spring contacts to rub against the pads. The vibrating motion on the spring contacts cleans the contact points of undesirable materials at the contact points. <IMAGE>

Description

    Field of the Invention
  • The present invention relates generally to spring contacts in an electronic device and, in particular, to spring contacts between a printed circuit board and an electrical connector.
    • Background of the Invention
  • It is not unusual to mount an electrical connector or another electrical component to a printed circuit board (PCB), wherein the electrical contact between the electrical component and the PCB is provided by spring contacts on the electrical component. One general problem in using spring contacts to provide electrical contact to one or more electrically conductive pads on the PCB is that oxidation or dirt may impair the electrical contact at the contacting points. Oxidation or dirt could introduce a thin insulation layer between the contacting surface of the pads and the contacting surface of the spring contacts. Oxidation can be caused by a variety of factors such as humidity, condensation water, chlorides, nitrogen oxides and other environmental agents. If a spring contact is kept in a fixed position relative to the pad, the problem is likely to become more severe in time and, eventually, a total loss of contact between the spring contact and the PCB may occur.
  • Thus, it is advantageous and desirable to provide a method and device for improving the electrical contact between a spring contact and a PCB.
  • EP0955762A1 describes a technique for mounting a vibrator for vibrating a mobile wireless device when a signal is received.
    • Summary of the Invention
  • It is a primary object of the present invention to improve the electrical connection provided by spring contacts between two electrical components in general, and between an electrical connector and a printed circuit board (PCB), in particular. The object can be achieved by causing the spring contacts to move back and forth relative to the PCB and thus rub against the electrically conductive pads in a rapid motion for removing the undesirable insulation materials at the contacting points.
  • According to the present invention, there is provided a connector arrangement according to claim 1, and a method of improving the electrical contact in such an arrangement according to claim 6.
  • The present invention will become apparent upon reading the description taken in conjunction with Figures 1 to 5.
    • Brief Description of the Drawings
  • Figure 1 is an isometric view illustrating a connector arrangement having an electrical connector mounted to a printed circuit board (PCB), according to the present invention.
  • Figure 2 is an exploded view of the connector arrangement, as shown in Figure 1.
  • Figure 3 is an exploded view of connector arrangement, as viewed from one side of the connector arrangement.
  • Figure 4 is a top view illustrating the connector arrangement without the PCB.
  • Figure 5 is a rear view of the PCB illustrating the electrically conductive pads on the PCB.
    • Detailed Description of the Invention
  • An exemplary embodiment of the connector arrangement 1, according to the present invention, is shown in Figures 1-5. In the connector arrangement 10 as shown in Figures 1-3, a connector 20 is mounted to a printed circuit board (PCB) 10 by means of a bottom plate 80 having two guiding pins 60, 62 and two screws 70, 72. The connector 20 has two frame slots 30 and 32 to accommodate the respective guiding pins 60, 62 . The height of the pins 60 and 62 is slightly greater than the height of the connector 20, leaving a gap 36 between the PCB 10 and the connector 20. The outer diameter of the guiding pins 60, 62 and the inner diameters of the frame slots 30, 32 are designed to have a small gap therebetween to allow the connector 20 to move in the X-Y directions relative to the PCB 10. A vibration motor 40, encapsulated or surrounded by a rubber casing 50 (see Figure 4) is mechanically engaged with the connector 20, such that when the vibration motor 40 is activated, it causes the connector 20 to move in an oscillating manner, relative to the PCB 10.
  • Figure 2 is an exploded view of the connector arrangement of Figure 1. As shown in Figure 2, the vibration motor 40 has two electrodes 42 for providing electrical power to the vibration motor 40 for activating the motor 40 when desired. Also shown in Figure 2 are a plurality of spring contacts 22, 24 and 26 extended from the connector 20 to make contact with the PCB 10. The spring contacts 22, 24 and 26 are clearly shown in Figure 3, which is an exploded view of connector arrangement, as viewed from one side thereof. Some or all of these spring contacts 22, 24 and 26 can be used to provide electrical connection between the connector 20 and the PCB 10, the others can be used as mechanical means for providing an urging force against the PCB 10 to keep the connector 20 away from the PCB 10.
  • Figure 4 is another isometric view illustrating the top and rear sections of the connector arrangement without the PCB. As shown, the vibration motor 40 is separated from the connector 20 by the rubber casing 50 so as to avoid mechanical damages to the connector 20 due to the vibration. There are four spring contacts 22 in the front row, two spring contacts 26 in the back row and one spring contact 24 in the middle. One or some of these spring contacts can be used to make electrical contact to one or more electronically conductive pads on the bottom side of the PCB 10, as shown in Figure 5.
  • Figure 5 is a bottom view of the PCB illustrating the electrically conductive pads on the PCB 10. For illustrative purposes, two pads 18 are used to provide electrical connection to the electrodes 42 of the vibration motor 40 (see Figure 4); two pads 16 are used to provide electrical connection to the spring contacts 26 of the connectors; pad 14 is used to provide electrical connection to the spring contact 24; and a single pad 12 is used to provide electrical connection to the four spring contacts 22.
  • The connector arrangement, as illustrated in Figures 1-5, involves an electrical connector and a printed circuit board, wherein the electrical connection between the electrical connector and the printed circuit board is provided by one or more spring contacts and one or more electrically conducting pads. However, spring contacts and electrically conducting pads can also be used to provide electrical connection between a printed circuit board and a different electrical component, such as a switch, a solid-state display panel, and a keypad. Spring contacts and electrically conducting pads can be also used between two electrical components.
  • Furthermore, the vibration motor is activated for causing the connector to move only when desired. Alternatively, a timer or a software program can be used to turn on the vibration motor periodically. It is also possible to use a monitoring means to check the electrical connection between the spring contacts and the electrically conducting pads, and the vibration motor is turned on only when needed.
  • It is understood that the spring contacts are caused to move by the vibration mechanism only within designed tolerances so the contact points between the spring contacts and the pad can be cleaned because of the mechanical stress or the rubbing action.
  • Thus, although the invention has been described with respect to a preferred embodiment thereof, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.

Claims (8)

  1. A connector arrangement in an electronic device comprising a first electrical component (10) having at least one electrically conducting section and a second electrical component (20) comprising an electrical connector and having at least one spring contact (22, 24, 26) for making electrical contact with the electrically conducting section of the first electrical component, whereby said connector arrangement further comprises:
    a vibration mechanism (40), located adjacent to the second electrical component, capable of causing the second electrical component to move relative to the first electrical component, thereby causing the spring contact to rub against the electrically conducting section of the first electrical component; and
    means (42), electrically connected to the vibration mechanism, for providing electrical power to the vibration mechanism to cause the vibration mechanism to move the second electrical component when desired.
  2. The arrangement of claim 1, wherein the first electrical component comprises a circuit board.
  3. The arrangement of claim 1, wherein the first electrical component comprises a printed circuit board.
  4. The arrangement of claim 1, wherein the vibration mechanism comprises a motor.
  5. The arrangement of claim 1, further comprising a buffering means (50) separating the vibration mechanism from the second electrical component for avoiding mechanical damage to the second electric component when the vibration mechanism moves the second electrical component.
  6. A method of improving electrical contact between the first electrical component and the second electrical component of the arrangement according to any preceding claim, said method comprising the step of: providing electrical power to the vibration mechanism for causing the second electrical component to move relative to the first electrical component, thereby causing the spring contact to rub against the electrically conducting section of the first electrical component.
  7. The method of claim 6, wherein the electrical power is provided to the vibration mechanism when desired.
  8. The method of claim 6, wherein the electrical power is provided to the vibration mechanism when needed.
EP02250517A 2001-02-13 2002-01-25 Method and device for improving electrical contact of spring connectors Expired - Lifetime EP1231682B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/782,674 US6347945B1 (en) 2001-02-13 2001-02-13 Method and device for improving electrical contact of spring connectors
US782674 2001-02-13

Publications (3)

Publication Number Publication Date
EP1231682A2 EP1231682A2 (en) 2002-08-14
EP1231682A3 EP1231682A3 (en) 2003-12-03
EP1231682B1 true EP1231682B1 (en) 2005-11-09

Family

ID=25126821

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02250517A Expired - Lifetime EP1231682B1 (en) 2001-02-13 2002-01-25 Method and device for improving electrical contact of spring connectors

Country Status (5)

Country Link
US (1) US6347945B1 (en)
EP (1) EP1231682B1 (en)
JP (1) JP2002246084A (en)
AT (1) ATE309632T1 (en)
DE (1) DE60207123T2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7119463B2 (en) * 2003-07-31 2006-10-10 Research In Motion Limited Vibration motor boot
US7310360B2 (en) 2004-10-25 2007-12-18 The Boeing Company Apparatus and method for face cooling of optical components of a laser system
US20140039693A1 (en) * 2012-08-02 2014-02-06 Honeywell Scanning & Mobility Input/output connector contact cleaning

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133657A (en) * 1994-09-20 2000-10-17 Motorola, Inc. Vibrator bracket
JP3251305B2 (en) * 1997-10-31 2002-01-28 三菱電機株式会社 Vibrator mounting structure
US5975094A (en) * 1997-11-26 1999-11-02 Speedfam Corporation Method and apparatus for enhanced cleaning of a workpiece with mechanical energy
US6254416B1 (en) * 2000-05-18 2001-07-03 Molex Incorporated Vibrator motor holder

Also Published As

Publication number Publication date
EP1231682A3 (en) 2003-12-03
US6347945B1 (en) 2002-02-19
DE60207123D1 (en) 2005-12-15
JP2002246084A (en) 2002-08-30
DE60207123T2 (en) 2007-02-22
ATE309632T1 (en) 2005-11-15
EP1231682A2 (en) 2002-08-14

Similar Documents

Publication Publication Date Title
KR20040014582A (en) Operation type electronic component
US20050001822A1 (en) Resilient switch contact for a key switch device
JP2001029887A (en) Vibrator holder and vibrator mounting method
JP2001266700A (en) Push switch
RU2006137292A (en) DEVICE WITH ELECTRIC MOTOR AND MAIN PRINTED BOARD AND METHOD OF INSTALLATION
US5500779A (en) Disk drive memory card electrical interconnect
EP1231682B1 (en) Method and device for improving electrical contact of spring connectors
JP2006521677A (en) High density electrical connector
EP1545098B1 (en) Signal connecting apparatus for foldable mobile terminal
JP2005332644A (en) Contact device
CN110060897B (en) Integrated switch
JP2006128808A (en) Sliding portable telephone
JPH1141682A (en) Microphone mounting device and mounting method
JP2002299859A (en) Structure for mounting printed board
JPH08140301A (en) Power-supply device for flat motor
EP0984454A3 (en) A connector for a hard disk drive
JPH1154174A (en) Current-carrying connection structure
KR102420029B1 (en) Connector for Flat Cable
JP3408470B2 (en) Electronics
JP3208173B2 (en) Key switch structure
JP3583958B2 (en) Display module and display device
KR940012754A (en) Brush plate equipment for electromechanical machines
JPH065171U (en) connector
JP2004192962A (en) Contact
KR20170100270A (en) Connector for Flat Cable

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

17P Request for examination filed

Effective date: 20040318

17Q First examination report despatched

Effective date: 20040504

AKX Designation fees paid

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

TCNL Nl: translation of patent claims filed
AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20051109

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60207123

Country of ref document: DE

Date of ref document: 20051215

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060131

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20060209

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20060209

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20060209

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20060220

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20060410

ET Fr: translation filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20060810

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051109

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20120202

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20120118

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20120125

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20120117

Year of fee payment: 11

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20130801

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20130125

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20130930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130801

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130801

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60207123

Country of ref document: DE

Effective date: 20130801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130125

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130131