EP1230440A1 - Cathode plate - Google Patents

Cathode plate

Info

Publication number
EP1230440A1
EP1230440A1 EP00936537A EP00936537A EP1230440A1 EP 1230440 A1 EP1230440 A1 EP 1230440A1 EP 00936537 A EP00936537 A EP 00936537A EP 00936537 A EP00936537 A EP 00936537A EP 1230440 A1 EP1230440 A1 EP 1230440A1
Authority
EP
European Patent Office
Prior art keywords
groove
metal
cathode
envelope
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00936537A
Other languages
German (de)
French (fr)
Other versions
EP1230440B1 (en
EP1230440A4 (en
Inventor
David Bailey
Revill Wayne Armstrong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Copper Refineries Pty Ltd
Original Assignee
Copper Refineries Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Copper Refineries Pty Ltd filed Critical Copper Refineries Pty Ltd
Publication of EP1230440A1 publication Critical patent/EP1230440A1/en
Publication of EP1230440A4 publication Critical patent/EP1230440A4/en
Application granted granted Critical
Publication of EP1230440B1 publication Critical patent/EP1230440B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02Electrodes; Connections thereof
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06Operating or servicing
    • C25C7/08Separating of deposited metals from the cathode

Definitions

  • the present invention relates to a cathode plate for use in electro-deposition of
  • the bottom edge of the cathode mother plate is generally
  • a release compound such as wax or a plastic edge strip to prevent
  • enveloped cathode process In such a process the lower edge of the cathode sheet is not waxed and the electro-deposited metal is allowed to grow on both sides of
  • the envelope is then closed and rotated from its vertical
  • cathode mother sheet is to at least partially separate either side of the deposited envelope
  • enveloped cathode comprises cathode sheets 20 and 30 deposited on the cathode mother
  • the cathode mother sheet is firstly flexed to provide separation of at least the upper end portion 50 of the sheets 20. 30.
  • apparatus includes a wedge stripper or air blaster 130. These wedge strippers 130 enter
  • cathode mother plate may be confirmed by the grippers 25, 35 as follows.
  • grippers 25 and 35 rotates sheets 20 and 30 upwardly and downwardly until the
  • groove 15 is formed in the bottom edge of the cathode mother plate as a 'growth
  • deposited metal may not cleanly release from the cathode plate or split into two
  • the metal envelope separates into two sheets with a lip 25 attached to one sheet. This lip
  • the present invention provides a method of electro-depositing an
  • envelope of metal on a cathode said envelope including deposited metal on either side of
  • the method comprising providing a groove on said cathode plate whereby metal
  • the groove is shaped as a V, with the line of weakness being
  • the arc of the V-groove is between 75 and 105 degrees and
  • the arc of the V-groove is substantially 90 degrees.
  • the present applicant has determined that the size and shape of the groove in the
  • cathode mother plate has an impact on the ability to separate the deposited metal
  • the fracture line may be
  • One sheet may be
  • the shape of the groove is a balance between allowing growth of the
  • the groove may be shaped to permit deposited
  • the groove is
  • the present invention provides a cathode plate for electro-
  • said cathode plate having a groove along at least one edge
  • Figures 1A-2D are end elevational views of the process for stripping electro-
  • Figure 3 is an end elevational view of a cathode mother plate with a deposited
  • Figure 4 is an end elevational view of an embodiment of the present invention.
  • Figures 5 and 6 are end elevational views showing different shaped bottom edges
  • groove 150 shown in Figure 4 is 90 degrees, however, as will be appreciated from the
  • V-groove 150 The shape and size of V-groove 150 is designed to perform several functions. Its
  • mother plate 100 into two substantially equivalent sheets 122 and 124.
  • the copper will take the path of least resistance and endeavour to deposit on the cathode as quickly as possible. Accordingly, it will be appreciated that it is easier for
  • V-groove 150 is shaped to allow deposition of copper in the V-groove
  • the groove 150 shown in Figure 4 can be compared with the V-groove shown in
  • the bridge 80 can act to strongly bind the two
  • the V-groove can be sized and shaped to trap gaseous

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

A method of electro-depositing an envelope of metal on a cathode. The metal envelope (120) comprises metal sheets (122, 124) on either side of the cathode plate (100). A groove (150) is provided along one edge of the cathode plate whereby metal deposited on and adjacent to said groove forms a frangible portion (140). The groove is shaped such that a line of weakness (A) is formed in the metal deposited within the groove such that separation of the two sheets of deposited metal is initiated along the line of weakness.

Description

TITLE: CATHODE PLATE
TECHNICAL FIELD
The present invention relates to a cathode plate for use in electro-deposition of
metal.
BACKGROUND ART
There are various processes and apparatus for electro-refining or electro-winning
metal.
One particularly successful process for electro-depositing of copper for example is
the so-called ISA PROCESS in which copper is deposited on a stainless steel cathode
mother plate. The electrolytically deposited copper is then stripped from the cathode by
first flexing the cathode to cause at least a part of the copper deposit to separate from the
cathode and then wedge stripping or gas blasting the remainder of the copper from the
cathode.
In the ISA PROCESS the bottom edge of the cathode mother plate is generally
covered with a release compound such as wax or a plastic edge strip to prevent
deposition of copper thereon. This allows for removal of the electro-deposited copper as
substantially equivalent separate sheets from both sides of the cathode plate. Such
waxing of the cathode sheet, however, is time consuming and there is added cost both
for applying the wax and for recovering the wax from the stripping process and
associated housekeeping.
To avoid these difficulties, some electro-refining/electro-winning operations use a
so-called enveloped cathode process. In such a process the lower edge of the cathode sheet is not waxed and the electro-deposited metal is allowed to grow on both sides of
the sheet and around the bottom edge of the cathode mother plate.
Removal of the electrolytically deposited envelope of metal is then accomplished
by flexing the cathode and pulling back the metal from both sides of the sheet so that it
forms a V. The cathode mother plate is then removed from between the electrolytically
deposited envelope of metal, the envelope is then closed and rotated from its vertical
position to a horizontal position and transported to a stacking/bundling station.
Not only does such a removal process require complex apparatus for opening the
metal envelope, removing the cathode mother plate prior to closing of the envelope and
rotating the envelope from the vertical to the horizontal position for stacking, such an
arrangement is time consuming and generally not as quick as the ISA PROCESS
stripping step.
In conjunction with other parties, the applicant has recently developed a new
process in which an envelope of metal is formed on the stainless steel cathode mother
plate and then stripped into two separate sheets. This process is subject of co-pending
International Patent Application No. PCT/FI99/00979. By way of summary, the new
process will be discussed with reference to figures 1A-1D and 2A-2D attached herewith.
The initial step in stripping an electrolytically deposited metal envelope from its
cathode mother sheet is to at least partially separate either side of the deposited envelope
from the cathode sheet. In this regard reference is made to figures 1A-1D. The
enveloped cathode comprises cathode sheets 20 and 30 deposited on the cathode mother
sheet 10 and joined along the lower edge thereof by a frangible portion 40. The cathode mother sheet is firstly flexed to provide separation of at least the upper end portion 50 of the sheets 20. 30.
The partially separated envelope as shown if figure ID is then subjected to a
stripping operation as shown in figures 2A and 2B. The partially separated sheets 20
and 30 are positioned in a stripping apparatus on rollers or conveyor belt 50. The
apparatus includes a wedge stripper or air blaster 130. These wedge strippers 130 enter
the gap between sheets 20. 30 and cathode mother sheet 10. The wedge strippers 130
release the sheets 20 and 30 of the electro-deposited envelope from the cathode mother
sheet 10. The sheets 20 and 30, however, are still held together by the frangible portion
40 extending along the bottom edge of the cathode sheet 10 as shown in Figure 2B. To
effect full separation of the electro-deposited metal envelope into separate substantially
equivalent sheets. These sheets are 20 and 30 is held by grippers 25, 35 and rotated about
the frangible portion 40 from the substantial vertical position shown in figure 2B to the
substantially horizontal position shown in figure 2C. This rotation separates the
deposited metal into two substantially equivalent sheets. In many cases, a single rotation
of the sheets 20, 30 from the vertical to the horizontal is all that is required to separate
the sheets. This separation of the sheets 20 and 30 from each other as well as the
cathode mother plate may be confirmed by the grippers 25, 35 as follows. The grippers
which still hold the sheet 20, 30 in the horizontal position shown in figure 2C, are
adapted to pull the respective sheets slightly outward as shown in figure 2D. If the
sheets, 20, 30 move outwardly in unison with the grippers, separation of the sheets 20,
30 is confirmed. If, however, the force to move the grippers outward is too great or
simply the grippers do not move this indicates that the frangible portion 40 has not in fact separated the sheets 20, 30 and accordingly further rotation (as shown in figure 2C) of the sheets may be required.
If further manipulation/rotation of sheets 20, 30 is required, the apparatus using
grippers 25 and 35 rotates sheets 20 and 30 upwardly and downwardly until the
aforementioned confirmation of separation of the sheets is effected.
Once the cathode sheets 20 and 30 are separated into substantially equivalent
separate sheets, it is a simple matter to transport the sheets out of the apparatus for
stacking and subsequent treatment.
In some cases it is quite difficult to separate the envelope of deposited metal into
two separate sheets. As will be appreciated, repeated rotation or flapping of the sheet
portions can be quite time consuming and reduces the overall efficiency of the process.
Reference is made to Figure 3 which shows a groove 15 in a cathode mother plate
10 with deposited metal extending around the end of the cathode mother plate 10. This
groove 15 is formed in the bottom edge of the cathode mother plate as a 'growth
effecting means' as described in co-pending International Patent Application No.
PCT/FI99/00979. The Applicant's have found, however, that even with groove 15 the
deposited metal may not cleanly release from the cathode plate or split into two
substantially equivalent sheets 20, 30. To explain, as shown in Figure 3, on occasion,
the metal envelope separates into two sheets with a lip 25 attached to one sheet. This lip
extends around almost the entire end portion of the mother plate 10. The fracture line 35
between metal sheets 20 and 30 is essentially on one side of the cathode mother plate 10
rather than being in the preferred frangible region 40 at the lower end of the mother
plate. It is an object of the present invention to overcome or ameliorate at least one of the
disadvantages of the prior art, or to provide a useful alternative to the prior art.
DISCLOSURE OF THE INVENTION
In a first aspect, the present invention provides a method of electro-depositing an
envelope of metal on a cathode said envelope including deposited metal on either side of
said cathode and joined along at least one edge by a frangible portion, and being
removable from said cathode by rotation of respective sides of the deposited metal
envelope about the frangible portion to separate the deposited metal from the cathode
into two substantially equivalent sheets,
the method comprising providing a groove on said cathode plate whereby metal
deposited on and adjacent to said groove forms said frangible portion,
and wherein said groove is shaped such that a line of weakness is formed in the
metal deposited within the groove such that separation of the two sheets of the deposited
metal is initiated along said line of weakness.
In a first embodiment, the groove is shaped as a V, with the line of weakness being
formed within the arc of the V.
In another embodiment the arc of the V-groove is between 75 and 105 degrees and
most preferably the arc of the V-groove is substantially 90 degrees.
The present applicant has determined that the size and shape of the groove in the
cathode mother plate has an impact on the ability to separate the deposited metal
envelope from the cathode into two substantially equivalent sheets.
By appropriate sizing and shaping of the groove, it is possible to reliably provide a
line of weakness between the two sides of the electro-deposited envelope, such that the separation or splitting of two separate sides of sheets of the deposited metal envelope is
initiated on the line of weakness within the groove.
If the line of weakness is not formed within the groove, the fracture line may be
initiated outside the confines of the groove and in some cases may continue to propagate
round the end of the plate to an exterior side of the cathode mother plate metal envelope
as shown in Figure 3. The sheets may then fracture at a point outside the frangible
region. Having such a line of fracture outside the frangible region creates difficulties in
the stripping process. Firstly, it can render splitting of the two sheets quite difficult. In
some instances it may be necessary to rotate or flap the sheets several times to provide
separation. Clearly this is undesirable, and increases the residence time of the plate in
the stripping machine and thereby slows production.
Further, having a line of fracture outside the frangible region will produce two
sheets which are not substantially symmetrical or equivalent in size. One sheet may be
essentially flat with another sheet having a small lip or hooked edge as shown in Figure
3. The resulting sheets with uneven edges are unsightly and difficult to handle
particularly in high speed automated machinery.
The applicant has found that the size and shape of the groove can be tailored so
that the line of weakness extending between the two sheets remains within the confines
of the groove. The shape of the groove is a balance between allowing growth of the
deposited metal in the groove while still permitting easy separation of the two sheets.
Indeed, in another embodiment the groove may be shaped to permit deposited
metal to substantially fill the entire groove. In yet another embodiment, the groove is
shaped to allow deposition of metal directly adjacent the apex of the groove. In another aspect, the present invention provides a cathode plate for electro-
deposition of metal, said cathode plate having a groove along at least one edge and
shaped such that, in use. a line of weakness is formed in the metal deposited within the
groove,
whereby during stripping of metal from said cathode, separation of the envelope of
metal into two substantially equivalent sheets is initiated along said line of weakness.
Unless the context clearly requires otherwise, throughout the description and the
claims, the words 'comprise', 'comprising', and the like are to be construed in an
inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense
of "including, but not limited to".
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will now be described by way of example only with
reference to the accompanying drawings in which:
Figures 1A-2D are end elevational views of the process for stripping electro-
deposited metal envelopes as developed by the applicant and are included for
clarification purposes only.
Figure 3 is an end elevational view of a cathode mother plate with a deposited
metal envelope partially stripped into two separate sheets,
Figure 4 is an end elevational view of an embodiment of the present invention,
Figures 5 and 6 are end elevational views showing different shaped bottom edges
of cathode plates.
MODE(S) FOR CARRYING OUT THE INVENTION Figures 1A-2D and Figure 3 all relates to prior art mechanisms and are discussed
above.
The applicants have found that it is possible to tailor a groove in the lower end of
the mother plate such that a line of weakness is formed in the groove to thereby permit
reliable fracture of the deposited metal envelope into two substantially equivalent and
preferably symmetrical sheets.
Reference is made to Figure 4 which shows cathode mother plate 100 with a V-
groove 150 formed along its lower end edge. For the sake of simplicity, the arc of
groove 150 shown in Figure 4 is 90 degrees, however, as will be appreciated from the
foregoing it is not essential that the groove by V-shaped or that the arc of the groove
equal 90 degrees.
The shape and size of V-groove 150 is designed to perform several functions. Its
primary function is to permit separation of the deposited metal envelope 120 from the
mother plate 100 into two substantially equivalent sheets 122 and 124.
How the V-groove provides this function will now be explained. As will be clear
to persons skilled in the art, when the mother plate 100 is placed in an electrolytic cell
for, say, electro-refining of copper, it is interspersed between copper anodes and
substantially immersed in an electrolytic solution. The copper from the anodes enters
the electrolyte for redepositing on the cathode. Generally, to provide a "full term"
deposit the cathode remains in the electrolyte bath for between 5 and 14 days.
When the copper crystals are deposited on the metal cathode, they are deposited at
substantially right angles to the deposition surface. This is shown by arrows in Figure 4.
Generally, the copper will take the path of least resistance and endeavour to deposit on the cathode as quickly as possible. Accordingly, it will be appreciated that it is easier for
the copper to deposit on the exterior side surfaces 102, 104 of the cathode plate 100
rather than in the V-groove 150. It is important, however, that copper is deposited in the
V-groove since when the copper envelope is removed from mother plate 100, by pulling
on the opposite sides of the metal envelope as discussed above, fracture or crack
initiation begins in the frangible region 140 at the lower end of the mother plate 100. It
is desirable that this crack initiation begins at the apex of V-groove 150. Accordingly, it
is preferable that V-groove 150 is shaped to allow deposition of copper in the V-groove
adjacent the apex with the line of weakness extending between the arc of the V-groove
150.
The applicants have found that certain groove sizes and shapes permit such
'symmetrical' splitting of the deposited metal while others do not. For instance, a V-
groove with an arc of 90° ± 15° allows growth of copper in the V-groove while
providing a line of weakness as shown by dotted line A between the arc of the V-groove.
When the deposited metal envelope is then removed, the position of line of weakness A
in the V-groove causes the splitting of the deposited metal into two substantially
equivalent sheets to initiate along the line of weakness or fracture line in the frangible
region 140.
The groove 150 shown in Figure 4 can be compared with the V-groove shown in
the Figures 5 and 6.
In Figure 5, a shallow V-groove 60 is shown. The shape of this V-groove 60 does
not provide as great a resistance to deposition of copper as does groove 150 shown in
Figure 4. Accordingly, copper is deposited quite readily in V-groove 60. This is desirable. However, the applicants have found that due to the shape of groove 60, the
length and hence effectiveness of the line of weakness is reduced. Thus a stronger bond
is formed between the two sides of the metal envelope making it more difficult to split
the metal envelope into two substantially equivalent sheets. Indeed, experimental trials
have shown that several cycles of rotation or flapping in the stripping machine may be
required to separate such sheets and in some cases they may split in a manner similar to
that shown in Figure 3.
In Figure 6, the groove 70 is narrower and deeper. This creates a greater resistance
to deposition of copper ions that enter V-groove 150 of Figure 4 or V-groove 60 of
Figure 5. In some cases, copper will not deposit throughout V-groove 70 and
particularly not near the apex of the V-groove. This causes a bridging 80 of metal across
the V-groove. This bridging of metal across the V-groove avoids formation of the line
of weakness in the arc of the V-groove. The bridge 80 can act to strongly bind the two
sides of the metal envelope which, once again, may result in the deposited metal
requiring several cycles of rotation or flapping to separate into two sheets which, most
likely, will not be substantially equivalent in size.
In another embodiment of the present invention, which is particularly suitable for
electro winning processes, the V-groove can be sized and shaped to trap gaseous
material which further acts to define a line of weakness in the arc of the groove.
It will be appreciated that variations may be made to the process and apparatus
described herein without departing from the spirit or scope of the present invention.

Claims

1. A method of electro-depositing an envelope of metal on a cathode said envelope
including deposited metal on either side of said cathode joined along at least one edge by
a frangible portion, and being removable from said cathode by rotation of respective
sides of the deposited metal envelope about the frangible portion to separate the
deposited metal from the cathode into two substantially equivalent sheets,
the method comprising providing a groove on said cathode plate whereby metal
deposited on and adjacent to said groove forms said frangible portion,
and wherein said groove is shaped such that a line of weakness is formed in the
metal deposited within the groove such that separation of the two sheets of deposited
metal is initiated along said line of weakness.
2. A method as claimed in claim 1 wherein the groove is shaped as a V, the line of
weakness being formed within the arc of the V.
3. A method as claimed in claim 1 or claim 2 wherein the sides of the groove are
between 75 and 150° apart.
4. A method as claimed in any one of the preceding claims wherein the sides of the
groove are 90° apart.
5. A method as claimed in any one of the preceding claims wherein the groove is
shaped to allow deposition of metal directly adjacent the apex of the groove.
6. A method as claimed in any one of the preceding claims wherein the groove is
shaped to permit deposited metal to substantially fill the entire groove.
7. A method as claimed in any one of the preceding claims wherein the groove is
shaped to capture gas rising from below the cathode plate during deposition of metal.
8. A cathode plate for electro-deposition of an envelope of metal, said cathode plate
having a groove along at least one edge and shaped such that, in use, a line of weakness
is formed in the metal deposited within the groove,
whereby during stripping of metal from said cathode, separation of the envelope of
metal into two substantially equivalent sheets is initiated along said line of weakness.
9. A cathode plate as claimed in claim 8 wherein the groove is shaped as a V, the line
of weakness being formed within the arc of the V.
10. A cathode plate as claimed in claim 8 or claim 9 wherein the sides of the groove
are between 75 and 150° apart.
11. A cathode plate as claimed in any one of claims 8 to 10 wherein the sides of the
groove are 90° apart.
12. A cathode plate as claimed in any one of claims 8 to 11 wherein the groove is
shaped to allow deposition of metal directly adjacent the apex of the groove.
13. A cathode plate as claimed in any one of claims 8 to 12 wherein the groove is
shaped to permit deposited metal to substantially fill the entire groove.
14. A cathode plate as claimed in any one of claims 8 to 13 wherein the groove is
shaped to capture gas rising from below the cathode plate during deposition of metal.
15. A method of electro-depositing an envelope of metal on a cathode substantially as
herein described with reference to any one of the embodiments of the invention
illustrated in the accompanying drawings and/or examples.
16. A cathode plate for electro-deposition of an envelope of metal substantially as
herein described with reference to any one of the embodiments of the invention
illustrated in the accompanying drawings and/or examples.
EP00936537.0A 1999-06-18 2000-06-16 Cathode plate Expired - Lifetime EP1230440B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AUPQ1066A AUPQ106699A0 (en) 1999-06-18 1999-06-18 Cathode plate
AUPQ106699 1999-06-18
PCT/AU2000/000669 WO2000079028A1 (en) 1999-06-18 2000-06-16 Cathode plate

Publications (3)

Publication Number Publication Date
EP1230440A1 true EP1230440A1 (en) 2002-08-14
EP1230440A4 EP1230440A4 (en) 2005-06-01
EP1230440B1 EP1230440B1 (en) 2017-03-22

Family

ID=3815257

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00936537.0A Expired - Lifetime EP1230440B1 (en) 1999-06-18 2000-06-16 Cathode plate

Country Status (17)

Country Link
EP (1) EP1230440B1 (en)
JP (1) JP2003502512A (en)
CN (1) CN1263897C (en)
AR (1) AR024402A1 (en)
AU (1) AUPQ106699A0 (en)
BR (1) BR0011752A (en)
CA (1) CA2377364C (en)
ES (1) ES2627807T3 (en)
MX (1) MXPA01013036A (en)
OA (1) OA11970A (en)
PE (1) PE20010502A1 (en)
PL (1) PL201085B1 (en)
RO (1) RO121039B1 (en)
RU (1) RU2247799C2 (en)
TR (1) TR200103610T2 (en)
WO (1) WO2000079028A1 (en)
ZA (1) ZA200110359B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI115727B (en) * 2003-12-01 2005-06-30 Outokumpu Oy Devices and methods for loosening of deposits that have occurred during electrolytic purification
JP4640637B2 (en) * 2005-03-28 2011-03-02 Jx日鉱日石金属株式会社 Management method of cathode plate V groove
DE102007000553A1 (en) 2007-10-22 2009-04-23 Wacker Chemie Ag Fluoropolymer-silicone composites and methods of preparation
JP5103635B2 (en) * 2008-03-10 2012-12-19 三井金属エンジニアリング株式会社 Deposited metal plate peeling apparatus and peeling method
FI121238B (en) * 2008-10-01 2010-08-31 Outotec Oyj Permanent cathode
JP2013040366A (en) * 2011-08-12 2013-02-28 Mesco Inc Apparatus for stripping off electrodeposited metal and method for stripping off electrodeposited metal
CN104674299B (en) * 2015-03-25 2016-11-09 大冶有色金属有限责任公司 The recovery method of a small amount of fine copper of corrosion resistant plate attachment in copper electrolyzing refining

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1427348A (en) * 1972-08-14 1976-03-10 Imp Metal Ind Kynoch Ltd Method of removing an electrodeposited metal from a cathod3
GB1366987A (en) * 1972-10-11 1974-09-18 Gen Electric Co Ltd Filament mount structures for use in electric incandescent filament lamps
DD140624A3 (en) * 1976-02-26 1980-03-19 Dietmar Schab MUTTER PLATE WITH EDGE AND FLAKE INSULATION FOR THE PRODUCTION OF STARTER SHEETS
JPS5912753B2 (en) * 1976-05-20 1984-03-26 住友金属鉱山株式会社 How to obtain multiple electrodeposited metal pieces from one mother plate
FI76382C (en) * 1986-10-03 1988-10-10 Outokumpu Oy FARING EQUIPMENT FOR ORGANIZATION OF ELECTRICAL ELECTRICAL EQUIPMENT UTFAELLNING.
GB2196989B (en) * 1986-11-04 1990-07-04 Mim Techn Marketing Ltd A method of stripping electrolytically deposited copper from a cathode
RU2020193C1 (en) * 1991-12-29 1994-09-30 Геннадий Иванович Алексеев Method for separation of electrolytic deposits from cathodes
JPH09228090A (en) * 1996-02-21 1997-09-02 Nikko Kinzoku Kk Cathode plate for wet electrolytic extraction of electrolytic refining
FI982569A7 (en) * 1998-11-27 2000-05-28 Outokumpu Oy Device for separating metal precipitate from cathode

Also Published As

Publication number Publication date
WO2000079028A1 (en) 2000-12-28
EP1230440B1 (en) 2017-03-22
RO121039B1 (en) 2006-11-30
CA2377364C (en) 2008-10-28
PE20010502A1 (en) 2001-04-27
EP1230440A4 (en) 2005-06-01
PL201085B1 (en) 2009-03-31
BR0011752A (en) 2002-04-02
AUPQ106699A0 (en) 1999-07-08
CN1357059A (en) 2002-07-03
RU2247799C2 (en) 2005-03-10
AR024402A1 (en) 2002-10-02
JP2003502512A (en) 2003-01-21
CA2377364A1 (en) 2000-12-28
ZA200110359B (en) 2002-12-18
TR200103610T2 (en) 2002-05-21
CN1263897C (en) 2006-07-12
MXPA01013036A (en) 2003-08-20
ES2627807T3 (en) 2017-07-31
PL352310A1 (en) 2003-08-11
OA11970A (en) 2006-04-17

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