EP1221134A2 - Chip card and a method for producing a chip card - Google Patents

Chip card and a method for producing a chip card

Info

Publication number
EP1221134A2
EP1221134A2 EP00967540A EP00967540A EP1221134A2 EP 1221134 A2 EP1221134 A2 EP 1221134A2 EP 00967540 A EP00967540 A EP 00967540A EP 00967540 A EP00967540 A EP 00967540A EP 1221134 A2 EP1221134 A2 EP 1221134A2
Authority
EP
European Patent Office
Prior art keywords
contact surfaces
electronic component
chip card
chip
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00967540A
Other languages
German (de)
French (fr)
Inventor
Thies Janczek
Rüdiger MENTZER
Carsten Senge
Karl-Heinz König
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Publication of EP1221134A2 publication Critical patent/EP1221134A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Definitions

  • the invention relates to a chip card with a card body consisting of:
  • At least one first electronic component having a conductor track structure
  • a second electronic component the components being electrically connected to one another at respective contact surfaces thereof.
  • the invention further relates to a method for producing a chip card with a card body consisting of several layers, wherein an electronic component for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer to form a transfer module ,
  • a chip card with a card body which has two electronic components, a first electronic component as a coil for energy and data transmission between an external device and a second electronic component formed as a chip in the card body with the same is electrically connected.
  • the coil is applied to a transfer layer of the card body by means of screen printing and consists of an electrically conductive material.
  • An electrically conductive adhesive is provided for the electrical connection of the coil to the chip.
  • DE 195 00 925 C2 describes a method for producing a chip card with a card body consisting of several layers, wherein a transmission element for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer. This transmission element is designed as a coil.
  • an electrically conductive adhesive is used, which is applied to the respective contact surfaces of the coil or the chip.
  • a disadvantage of the known chip card or the known method for producing the chip card is that an electrically conductive adhesive is required for contacting the electronic components in question, an additional process step being necessary for the application.
  • the object of the present invention is therefore to provide a chip card and a method for producing a chip card that ensure reliable and at the same time simplified contacting of at least two electronic components integrated in the chip card.
  • the chip card in connection with the preamble of claim 1 is characterized in that at least the contact surfaces of an electronic component are formed from a conductor material having a thermoplastic base material with enclosed metal particles.
  • the advantage of the chip card according to the invention is that the electronic components to be contacted electrically are already due to the composition of the circuit Substance of the contact surfaces are able to be able to be electrically contacted with one another without the addition of further materials.
  • the basic idea of the invention is to design at least the contact surfaces of the electronic components in such a way that an adhesive electrical connection between the corresponding contact surfaces is made possible by heating them. An additional electrically conductive adhesive for connecting the opposite contact surfaces of the components is not necessary.
  • an electronic component is designed as a coil, the entire component consisting of the same conductor material, forming a conductor track structure.
  • a transducer module can be created by applying the coil to a layer of the card body, by means of which contacting with contact surfaces of another component is made possible.
  • the contact surfaces of the transmitter module can have a greater thickness than the contact surfaces of the second electronic component to be connected, so that the contact surfaces of the second electronic module do not have to have the electrically adhesive material composition as the contact surfaces of the transmitter module, but instead, for example, exclusively consist of a metal material.
  • the method according to the invention in connection with the preamble of claim 8 is characterized in that a powdered thermoplastic material on the one hand and a powdered metal on the other hand are mixed with the addition of binders to form a conductor material, that the conductor material is applied to the transfer layer by means of screen printing with formation of contact areas and that contact areas of the chip are positioned such that they come into contact with the contact areas of the transfer module and under the influence of heat and pressure electrically and mechanically be connected to the contact surfaces.
  • the advantage of the method according to the invention is that there is no process step, namely the application of an adhesive, electrically conductive adhesive.
  • the heat input introduced when the card body is laminated can advantageously be used to soften the conductor material at the contact surfaces, so that an intimate and firm connection is created between the opposite contact surfaces.
  • a contact temperature that is higher than the lamination temperature is introduced briefly and selectively onto the contact surfaces during the lamination process.
  • the contacting temperature lies in a range between 160 ° C and 200 ° C.
  • the duration of exposure to the contacting temperature is advantageously approximately one second.
  • Figure 1 a plan view of a transmitter module
  • FIG. 1 a cross section through a chip card.
  • a transmitter module 1 as the first electronic component, consisting of a coil with turns 2 and widened contact surfaces 3 arranged at the ends of the turns 2, the coil being applied to a transfer layer 4.
  • the transmitter module 1 can be provided as a semifinished product and then joined together with other layers of a card body 5 to form a chip card.
  • the coil 1 forms with the turns 2 and the contact surfaces 3 a conductor track structure, which is preferably applied by means of screen printing to the transfer layer 4 consisting of a plastic.
  • the windings 2 and the contact surfaces 3 consist of a conductor material which is composed of a thermoplastic base material and a metal material.
  • the metal material can have a volume fraction of 45% to 65% of the total volume.
  • the thermoplastic base material can for example consist of PVC, ABS, PC, etc.
  • FIG. 2 shows a card structure 5 consisting of a plurality of layers connected to one another by lamination, of which the transfer layer 4 with the conductor tracks 2 is located in a central region.
  • a covering layer a is arranged with recesses corresponding to the contact surfaces 3 of the coil 1, so that the contact surfaces 3 extend flush with the top of the covering layer a.
  • a card body 6 formed in this way has a recess 7 for implanting a chip module 8.
  • the chip module 8 has a carrier layer 9 with external contacts for the contact-based operation of the chip card. Furthermore, the chip module 8 has a chip, not shown, which is connected to a contact rail 10 by means of individual wires.
  • the con- The clock bar 10 extends parallel to the carrier layer 9 from a central region, in which a casting compound 13 protecting the chip is arranged, into an outer region, in which contact surfaces 11 of the chip module 8 are arranged.
  • An electrically conductive connection is provided between the contact rail 10 and the outer contacts of the chip module 8, not shown.
  • the contact rail 10 can consist of a metallic material or - as in a first embodiment according to the composition of the contact surfaces 11 - of a conductor material that matches the conductor material of the contact surfaces 3.
  • both the contact rail 10 and the contact surfaces 11 can consist of the same thermoplastic material comprising a conductor material.
  • the chip module 8 For contacting the chip module 8 with the coil 1, the chip module 8 is placed on an abutment shoulder 12 of the laminated card structure 5, the contact surfaces 11 of the chip module 8 coming directly into contact with the corresponding contact surfaces 3 of the coil 1.
  • the conductor material of the contact surfaces 3, 11 softens due to subsequent heat and, if appropriate, pressure acting on the connection points, so that an intimate and firm connection between the contact surfaces 3, 11 is produced.
  • the contacting temperature generated in this case corresponds to the softening temperature of the conductor material and can be in a range from 150 ° C to 200 ° C.
  • the contacting temperature is preferably higher than the lamination temperature, so that, according to a further exemplary embodiment, the contacting of the contact surfaces 3, 11 can be integrated into the lamination process and thus takes place parallel to the lamination.
  • the invention covers any electronic component on the chip card, such as batteries, switches, displays. Diodes etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a chip card with a card body consisting of at least one first electronic component that is provided with a printed conductor structure and a second electronic component. The components are electrically connected to each other at the respective contact connections thereof. At least the contact surfaces (3, 11) of an electronic component (1) are formed from a conducting material that is provided with a thermoplastic supporting board with included metal particles.

Description

Beschreibung :Description :
Chipkarte und Verfahren zur Herstellung einer ChipkarteChip card and method for producing a chip card
Die Erfindung betrifft ein Chipkarte mit einem Kartenkörper bestehend aus:The invention relates to a chip card with a card body consisting of:
- mindestens einem eine Leiterbahnstruktur aufweisendes ersten elektronisches Bauelement und- At least one first electronic component having a conductor track structure and
- einem zweiten elektronischen Bauelement, wobei die Bauelemente an jeweiligen Kontaktflächen derselben elektrisch miteinander verbunden sind.a second electronic component, the components being electrically connected to one another at respective contact surfaces thereof.
Ferner betrifft die Erfindung ein Verfahren zur Herstellung einer Chipkarte mit einem aus mehreren Schichten bestehenden Kartenkörper, wobei ein elektronisches Bauelement zur Energie- und Datenübertragung zwischen einem externen Gerät und einem in dem Kartenkörper integrierten Chip und vice versa auf eine Übertragerschicht aufgebracht wird zur Bildung eines Übertragermoduls .The invention further relates to a method for producing a chip card with a card body consisting of several layers, wherein an electronic component for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer to form a transfer module ,
Aus der DE 44 16 697 AI ist eine Chipkarte mit einem Kartenkörper bekannt, die zwei elektronische Bauelemente aufweist, wobei ein erstes elektronisches Bauelement als Spule zur Energie- und Datenübertragung zwischen einem externen Gerät und einem als Chip in dem Kartenkörper ausgebildeten zweiten elektronischen Bauelement mit demselben elektrisch verbunden ist. Die Spule ist mittels Siebdrucken auf eine Übertrager- schicht des Kartenkörpers aufgebracht und besteht aus einem elektrisch leitenden Material. Zur elektrischen Verbindung der Spule mit dem Chip ist ein elektrisch leitender Kleber vorgesehen. Aus der DE 195 00 925 C2 ist ein Verfahren zur Herstellung einer Chipkarte mit einem aus mehreren Schichten bestehenden Kartenkörper, wobei ein Übertragungselement zur Energie- und Datenübertragung zwischen einem externen Gerät und einem in dem Kartenkörper integrierten Chip und vice versa auf eine Übertragerschicht aufgebracht wird. Dieses Übertragungselement ist als Spule ausgebildet. Zur Kontaktierung der Spule mit dem Chip wird ein elektrisch leitender Kleber verwendet, der auf die jeweiligen Kontaktflächen der Spule bzw. des Chips aufgebracht wird.From DE 44 16 697 AI a chip card with a card body is known which has two electronic components, a first electronic component as a coil for energy and data transmission between an external device and a second electronic component formed as a chip in the card body with the same is electrically connected. The coil is applied to a transfer layer of the card body by means of screen printing and consists of an electrically conductive material. An electrically conductive adhesive is provided for the electrical connection of the coil to the chip. DE 195 00 925 C2 describes a method for producing a chip card with a card body consisting of several layers, wherein a transmission element for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer. This transmission element is designed as a coil. To contact the coil with the chip, an electrically conductive adhesive is used, which is applied to the respective contact surfaces of the coil or the chip.
Nachteilig an der bekannten Chipkarte bzw. dem bekannten Verfahren zur Herstellung der Chipkarte ist, daß zur Kontaktierung der betreffenden elektronischen Bauelemente ein elektrisch leitender Kleber erforderlich ist, wobei zu dem Auftrag ein zusätzlicher Prozeßschritt notwendig ist.A disadvantage of the known chip card or the known method for producing the chip card is that an electrically conductive adhesive is required for contacting the electronic components in question, an additional process step being necessary for the application.
Aufgabe der vorliegenden Erfindung ist es daher, eine Chipkarte und ein Verfahren zur Herstellung einer Chipkarte anzugeben, daß eine zuverlässige und zugleich vereinfachte Kontaktierung von mindestens zwei in der Chipkarte integrierten elektronischen Bauelementen gewährleistet ist.The object of the present invention is therefore to provide a chip card and a method for producing a chip card that ensure reliable and at the same time simplified contacting of at least two electronic components integrated in the chip card.
Zur Lösung dieser Aufgabe ist die Chipkarte in Verbindung mit dem Oberbegriff des Patentanspruchs 1 dadurch gekennzeichnet, daß zumindest die Kontaktflächen eines elektronischen Bauelements aus einem ein thermoplastisches Basismaterial mit eingeschlossenen Metallpartikeln aufweisenden Leiterwerkstoff gebildet sind.To achieve this object, the chip card in connection with the preamble of claim 1 is characterized in that at least the contact surfaces of an electronic component are formed from a conductor material having a thermoplastic base material with enclosed metal particles.
Der Vorteil der erfindungsgemäßen Chipkarte besteht darin, daß die elektrisch zu kontaktierenden elektronischen Bauelementen bereits aufgrund der Zusammensetzung des Leiterwerk- Stoffs der Kontaktflächen in der Lage sind, ohne Zusatz von weiteren Materialien miteinander elektrisch kontaktiert werden zu können. Grundgedanke der Erfindung ist es, zumindest die Kontaktflächen der elektronischen Bauelemente derart auszubilden, daß durch Erwärmung derselben eine haftende elektrischen Verbindung zwischen den entsprechenden Kontaktflächen ermöglicht wird. Ein zusätzlicher elektrisch leitender Kleber zur Verbindung der gegenüberliegenden Kontaktflächen der Bauelemente ist nicht erforderlich.The advantage of the chip card according to the invention is that the electronic components to be contacted electrically are already due to the composition of the circuit Substance of the contact surfaces are able to be able to be electrically contacted with one another without the addition of further materials. The basic idea of the invention is to design at least the contact surfaces of the electronic components in such a way that an adhesive electrical connection between the corresponding contact surfaces is made possible by heating them. An additional electrically conductive adhesive for connecting the opposite contact surfaces of the components is not necessary.
Nach einer Weiterbildung der Erfindung ist ein elektronisches Bauelement als eine Spule ausgebildet, wobei das gesamte Bauelement unter Bildung einer Leiterbahnstruktur aus demselben Leiterwerkstoff besteht. Auf diese Weise kann bereits mit dem Aufbringen der Spule auf eine Schicht des Kartenkörpers eine Übertragermodul geschaffen werden, mittels dessen eine Kontaktierung mit Kontaktflächen eines anderen Bauelements ermöglicht wird.According to a development of the invention, an electronic component is designed as a coil, the entire component consisting of the same conductor material, forming a conductor track structure. In this way, a transducer module can be created by applying the coil to a layer of the card body, by means of which contacting with contact surfaces of another component is made possible.
Nach einer Ausführungsform der Erfindung können die Kontaktflächen des Übertragermoduls eine größere Dicke aufweisen als die Kontaktflächen des zu verbindenden zweiten elektronischen Bauelements, so daß die Kontaktflächen des zweiten elektronischen Moduls nicht die elektrisch haftende Materialzusammensetzung aufweisen muß, wie die Kontaktflächen des Übertragermoduls, sondern beispielsweise ausschließlich aus einem Metallwerkstoff bestehen.According to one embodiment of the invention, the contact surfaces of the transmitter module can have a greater thickness than the contact surfaces of the second electronic component to be connected, so that the contact surfaces of the second electronic module do not have to have the electrically adhesive material composition as the contact surfaces of the transmitter module, but instead, for example, exclusively consist of a metal material.
Zur Lösung der Aufgabe ist das erfindungsgemäße Verfahren in Verbindung mit dem Oberbegriff des Patentanspruchs 8 dadurch gekennzeichnet, daß ein pulverisiertes thermoplastisches Kunststoffmaterial einerseits und ein pulverisiertes Metall andererseits unter Zusatz von Bindemittel vermischt werden zur Bildung eines Leiterwerkstoffs, daß der Leiterwerkstoff mittels Siebdrucken auf die Übertragerschicht aufgebracht wird unter Bildung von Kontaktflächen und daß Kontaktflächen des Chips derart positioniert werden, daß sie in Bezug auf die Kontaktflächen des Übertragermoduls zur Anlage kommen und unter Einwirkung von Hitze und Druck elektrisch und mechanisch mit den Kontaktflächen verbunden werden.To achieve the object, the method according to the invention in connection with the preamble of claim 8 is characterized in that a powdered thermoplastic material on the one hand and a powdered metal on the other hand are mixed with the addition of binders to form a conductor material, that the conductor material is applied to the transfer layer by means of screen printing with formation of contact areas and that contact areas of the chip are positioned such that they come into contact with the contact areas of the transfer module and under the influence of heat and pressure electrically and mechanically be connected to the contact surfaces.
Der Vorteil des erfindungsgemäßen Verfahrens besteht darin, daß ein Prozeßschritt wegfällt, nämlich das Auftragen eines haftenden elektrisch leitenden Klebers. Vorteilhaft kann die ohnehin beim Laminieren des Kartenkörpers eingebrachte Wärmezufuhr dazu genutzt werden, den Leiterwerkstoff an den Kontaktflächen zu erweichen, so daß eine innige und feste Verbindung zwischen den gegenüberliegenden Kontaktflächen geschaffen wird.The advantage of the method according to the invention is that there is no process step, namely the application of an adhesive, electrically conductive adhesive. The heat input introduced when the card body is laminated can advantageously be used to soften the conductor material at the contact surfaces, so that an intimate and firm connection is created between the opposite contact surfaces.
Nach einer Weiterbildung des Verfahrens erfolgt während des Laminierprozesses eine kurzzeitige und punktuell auf die Kontaktflächen gerichtete Einbringung einer gegenüber der Laminationstemperatur erhöhten Kontakiertemperatur .According to a further development of the method, a contact temperature that is higher than the lamination temperature is introduced briefly and selectively onto the contact surfaces during the lamination process.
Nach einer Weiterbildung des Verfahrens liegt die Kontaktie- rungstemperatur in einem Bereich zwischen 160 °C und 200 °C . Vorteilhaft beträgt die Einwirkungsdauer der Kontaktierung- stemperatur ca. eine Sekunde.According to a further development of the method, the contacting temperature lies in a range between 160 ° C and 200 ° C. The duration of exposure to the contacting temperature is advantageously approximately one second.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand der Zeichnungen näher beschrieben.An embodiment of the invention is described below with reference to the drawings.
Es zeigen:Show it:
Figur 1: eine Draufsicht auf ein Übertragermodul undFigure 1: a plan view of a transmitter module and
Figur 2: ein Querschnitt durch eine Chipkarte. In Figur 1 ist ein Übertragermodul 1 als erstes elektronisches Bauelement dargestellt, bestehend aus einer Spule mit Windungen 2 und an den Enden der Windungen 2 angeordneten verbreiterten Kontaktflächen 3, wobei die Spule auf eine Übertragerschicht 4 aufgebracht ist. Das Übertragermodul 1 kann als Halbzeug bereitgestellt sein und dann zusammen mit anderen Schichten eines Kartenkörpers 5 zur Bildung einer Chipkarte zusammengefügt werden.Figure 2: a cross section through a chip card. 1 shows a transmitter module 1 as the first electronic component, consisting of a coil with turns 2 and widened contact surfaces 3 arranged at the ends of the turns 2, the coil being applied to a transfer layer 4. The transmitter module 1 can be provided as a semifinished product and then joined together with other layers of a card body 5 to form a chip card.
Die Spule 1 bildet mit den Windungen 2 und den Kontaktflächen 3 eine Leiterbahnstruktur, die vorzugsweise mittels Siebdruk- ken auf die aus einem Kunststoff bestehenden Übertragerschicht 4 aufgebracht ist. Die Windungen 2 und die Kontaktflächen 3 bestehen aus einem Leiterwerkstoff, der sich aus einem thermoplastischen Basismaterial und einem Metallwerkstoff zusammensetzt. Der Metallwerkstoff kann einen Volumenanteil von 45% bis 65% an dem Gesamtvolumen betragen. Das thermoplastische Basismaterial kann beispielsweise aus PVC, ABS, PC usw. bestehen.The coil 1 forms with the turns 2 and the contact surfaces 3 a conductor track structure, which is preferably applied by means of screen printing to the transfer layer 4 consisting of a plastic. The windings 2 and the contact surfaces 3 consist of a conductor material which is composed of a thermoplastic base material and a metal material. The metal material can have a volume fraction of 45% to 65% of the total volume. The thermoplastic base material can for example consist of PVC, ABS, PC, etc.
In Figur 2 ist ein Kartenaufbau 5 bestehend aus mehreren durch Lamination miteinander verbundenen Schichten dargestellt, worunter sich in einem mittleren Bereich die Übertragerschicht 4 mit den Leiterbahnen 2 befindet. Oberhalb derselben ist eine abdeckende Schicht a mit zu den Kontaktflächen 3 der Spule 1 korrespondierenden Aussparungen angeordnet, so daß sich die Kontaktflächen 3 bündig zu der Oberseite der abdeckende Schicht a erstrecken.FIG. 2 shows a card structure 5 consisting of a plurality of layers connected to one another by lamination, of which the transfer layer 4 with the conductor tracks 2 is located in a central region. Above this, a covering layer a is arranged with recesses corresponding to the contact surfaces 3 of the coil 1, so that the contact surfaces 3 extend flush with the top of the covering layer a.
Ein so gebildeter Kartenkörper 6 weist eine Ausnehmung 7 auf zum Implantieren eines Chipmoduls 8. Das Chipmodul 8 weist eine Trägerschicht 9 mit äußeren Kontakten auf zum kontaktbehafteten Betrieb der Chipkarte. Ferner weist das Chipmodul 8 einen nicht dargestellten Chip auf, der mittels einzelner Drähte mit einer Kontaktschiene 10 verbunden ist. Die Kon- taktschiene 10 erstreckt sich parallel zur Trägerschicht 9 von einem mittleren Bereich, in dem eine den Chip schützende Vergußmasse 13 angeordnet ist, in einen äußeren Bereich, in dem Kontaktflächen 11 des Chipmoduls 8 angeordnet sind. Zwischen der Kontaktschiene 10 und den äußeren Kontakten des Chipmoduls 8 ist eine elektrisch leitende Verbindung vorgesehen, nicht dargestellt. Die Kontaktschiene 10 kann aus einem metallischen Material oder - wie nach einer ersten Ausführungsform gemäß der Zusammensetzung der Kontaktflächen 11 - aus einem mit dem Leiterwerkstoff der Kontaktflächen 3 übereinstimmenden Leiterwerkstoff bestehen.A card body 6 formed in this way has a recess 7 for implanting a chip module 8. The chip module 8 has a carrier layer 9 with external contacts for the contact-based operation of the chip card. Furthermore, the chip module 8 has a chip, not shown, which is connected to a contact rail 10 by means of individual wires. The con- The clock bar 10 extends parallel to the carrier layer 9 from a central region, in which a casting compound 13 protecting the chip is arranged, into an outer region, in which contact surfaces 11 of the chip module 8 are arranged. An electrically conductive connection is provided between the contact rail 10 and the outer contacts of the chip module 8, not shown. The contact rail 10 can consist of a metallic material or - as in a first embodiment according to the composition of the contact surfaces 11 - of a conductor material that matches the conductor material of the contact surfaces 3.
Alternativ können sowohl die Kontaktschiene 10 als auch die Kontaktflächen 11 aus demselben thermoplastischen Material aufweisenden Leiterwerkstoff bestehen.Alternatively, both the contact rail 10 and the contact surfaces 11 can consist of the same thermoplastic material comprising a conductor material.
Zur Kontaktierung des Chipmoduls 8 mit der Spule 1 wird das Chipmodul 8 auf eine Anlageschulter 12 des laminierten Kartenaufbaus 5 gesetzt, wobei die Kontaktflächen 11 des Chipmoduls 8 unmittelbar auf den korrespondierenden Kontaktflächen 3 der Spule 1 zur Anlage kommen. Durch nachfolgende punktuell auf die Anschlußstellen gerichtete Wärme- und gegebenenfalls Druckeinwirkung erweicht der Leiterwerkstoff der Kontaktflächen 3, 11, so daß eine innige und feste Verbindung zwischen den Kontaktflächen 3, 11 hergestellt wird. Die dabei erzeugte Kontaktierungstemperatur entspricht der Erweichungstemperatur des Leiterwerkstoffs und kann in einem Bereich von 150 °C bis 200 °C liegen.For contacting the chip module 8 with the coil 1, the chip module 8 is placed on an abutment shoulder 12 of the laminated card structure 5, the contact surfaces 11 of the chip module 8 coming directly into contact with the corresponding contact surfaces 3 of the coil 1. The conductor material of the contact surfaces 3, 11 softens due to subsequent heat and, if appropriate, pressure acting on the connection points, so that an intimate and firm connection between the contact surfaces 3, 11 is produced. The contacting temperature generated in this case corresponds to the softening temperature of the conductor material and can be in a range from 150 ° C to 200 ° C.
Vorzugsweise ist die Kontaktierungstemperatur höher als die Laminierungstemperatur, so daß nach einem weiteren Ausführungsbeispiel die Kontaktierung der Kontaktflächen 3, 11 in den Laminierungsprozeß integriert werden kann und damit parallel zur Laminierung erfolgt. Die Erfindung erfaßt jegliches elektronisches Bauelement auf der Chipkarte, wie beispielsweise Batterien, Schalter, Displays. Dioden etc.. The contacting temperature is preferably higher than the lamination temperature, so that, according to a further exemplary embodiment, the contacting of the contact surfaces 3, 11 can be integrated into the lamination process and thus takes place parallel to the lamination. The invention covers any electronic component on the chip card, such as batteries, switches, displays. Diodes etc.

Claims

Patentansprüche claims
1. Chipkarte mit einem Kartenkörper bestehend aus:1. Chip card with a card body consisting of:
- mindestens einem eine Leiterbahnstruktur aufweisendes ersten elektronisches Bauelement und- At least one first electronic component having a conductor track structure and
- einem zweiten elektronischen Bauelement, wobei die Bauelemente an jeweiligen Kontaktanschlüssen derselben elektrisch miteinander verbunden sind, dadurch gekennzeichnet,a second electronic component, the components being electrically connected to one another at respective contact connections thereof, characterized in that
- daß zumindest die Kontaktflächen (3, 11) eines elektronischen Bauelements (1) aus einem ein thermoplastisches Basismaterial mit eingeschlossenen Metallpartikeln aufweisenden Leiterwerkstoff gebildet sind.- That at least the contact surfaces (3, 11) of an electronic component (1) are formed from a conductor material having a thermoplastic base material with enclosed metal particles.
2. Chipkarte nach Anspruch 1, dadurch gekennzeichnet, daß der Anteil der Metallpartikel an dem Gesamtvolumen des Leiterwerkstoffs in einem Bereich von 40% bis 60% liegt.2. Chip card according to claim 1, characterized in that the proportion of metal particles in the total volume of the conductor material is in a range from 40% to 60%.
3. Chipkarte nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das thermoplastische Basismaterial aus PVC oder ABS oder PC besteht.3. Chip card according to claim 1 or 2, characterized in that the thermoplastic base material consists of PVC or ABS or PC.
4. Chipkarte nach einem der Ansprüche 1 bis 3 , dadurch gekennzeichnet , daß das erste elektronische Bauelement als Übertragermodul (1) mit einer Leiterbahnstruktur (2, 3) ausgebildet ist, das zur Energie- und Datenübertragung zwischen einem externen Gerät und dem als Chip ausgebildeten zweiten elektronischen Bauelement (11) dient.4. Chip card according to one of claims 1 to 3, characterized in that the first electronic component is designed as a transmitter module (1) with a conductor track structure (2, 3), which is designed for energy and data transmission between an external device and the chip second electronic component (11) is used.
5. Chipkarte nach einem der Ansprüche 1 bis 3 , dadurch gekennzeichnet , daß das Übertragermodul als Spule (1) ausgebildet ist, die auf einer Übertragerschicht (4) angeordnet ist, und daß die Leiterbahnstruktur (2) aus dem- selben Leiterwerkstoff besteht wie die Kontaktflächen5. Chip card according to one of claims 1 to 3, characterized in that the transmitter module is designed as a coil (1) which is arranged on a transmitter layer (4), and that the conductor track structure (2) from the the same conductor material as the contact areas
(3) .(3).
6. Chipkarte nach Anspruch 4, dadurch gekennzeichnet, daß die Spule (1) auf die Übertragerschicht (4) aufgedruckt ist .6. Chip card according to claim 4, characterized in that the coil (1) is printed on the transfer layer (4).
7. daß die Kontaktflächen (3) des Übertragermoduls (1) eine größere Dicke aufweisen als die Kontaktflächen (11) des anderen elektronischen Bauelements (8) und daß die Kontaktflächen (11) des anderen elektronischen Bauelements (8) aus einem Metallwerkstoff bestehen.7. that the contact surfaces (3) of the transmitter module (1) have a greater thickness than the contact surfaces (11) of the other electronic component (8) and that the contact surfaces (11) of the other electronic component (8) consist of a metal material.
8. Verfahren zur Herstellung einer Chipkarte mit einem aus mehreren Schichten bestehenden Kartenkörper, wobei ein elektronisches Bauelement zur Energie- und Datenübertragung zwischen einem externen Gerät und einem in dem Kartenkörper integrierten Chip und vice versa auf eine Übertragerschicht aufgebracht wird zur Bildung eines Übertragermoduls, dadurch gekennzeichnet,8. A method for producing a chip card with a card body consisting of several layers, wherein an electronic component for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer to form a transfer module, characterized .
- daß ein pulverisiertes thermoplastisches Kunststoffmaterial einerseits und ein pulverisiertes Metall andererseits unter Zusatz von Bindemittel vermischt werden zur Bildung eines Leiterwerkstoffs,that a powdered thermoplastic material on the one hand and a powdered metal on the other hand are mixed with the addition of binders to form a conductor material,
- daß der Leiterwerkstoff mittels Siebdrucken auf die Übertragerschicht (4) aufgebracht wird unter Bildung von Kontaktflächen (3) und- That the conductor material is applied by means of screen printing to the transfer layer (4) to form contact surfaces (3) and
- daß Kontaktflächen (11) des Chips derart positioniert werden, daß sie in Bezug auf die Kontaktflächen (3) des Übertragermoduls (1) zur Anlage kommen und unter Einwirkung von Hitze und Druck elektrisch und mechanisch mit den Kontaktflächen (3) verbunden werden. - That contact surfaces (11) of the chip are positioned such that they come into contact with the contact surfaces (3) of the transmitter module (1) and are electrically and mechanically connected to the contact surfaces (3) under the action of heat and pressure.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß die elektrische Verbindung der gegenüberliegenden Kontaktflächen (3, 11) vor einer Lamination der Schichten (5) bei einer Kontaktierungstemperatur erfolgt, die größer ist als die Laminierungstemperatur.9. The method according to claim 8, characterized in that the electrical connection of the opposite contact surfaces (3, 11) before lamination of the layers (5) at a contacting temperature which is greater than the lamination temperature.
10. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß die elektrische Verbindung der gegenüberliegenden Kontaktflächen (3, 11) gleichzeitig mit einer Lamination der Schichten (5) bei einer Kontaktierungstemperatur erfolgt, die größer ist als die Laminierungstemperatur. 10. The method according to claim 8, characterized in that the electrical connection of the opposite contact surfaces (3, 11) takes place simultaneously with a lamination of the layers (5) at a contacting temperature which is greater than the lamination temperature.
EP00967540A 1999-09-01 2000-08-29 Chip card and a method for producing a chip card Withdrawn EP1221134A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1999141637 DE19941637A1 (en) 1999-09-01 1999-09-01 Chip card and method for producing a chip card
DE19941637 1999-09-01
PCT/DE2000/002903 WO2001016876A2 (en) 1999-09-01 2000-08-29 Chip card and a method for producing a chip card

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AU (1) AU7770300A (en)
DE (1) DE19941637A1 (en)
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WO2001016876A3 (en) 2001-05-31
DE19941637A1 (en) 2001-03-08
WO2001016876A2 (en) 2001-03-08

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