CROSS-REFERENCE TO RELATED APPLICATION
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This is continuation-in-part patent application of
copending application No. 09/474,818 filed December 29,
1999, which is hereby incorporated by reference in its
entirety.
BACKGROUND OF THE INVENTION
1. Field of the Invention
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The present invention relates to modular electrical
connectors and, more particularly, to card edge connectors
with modular inserts.
2. Discussion of Earlier Developments
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Electrical connectors assembled from a plurality of
connector modules are well known in the art. Card edge
connectors for connecting an edge of a printed circuit
board to another electronic component are also well known
in the art. There is a desire to provide an electrical
connector which can be assembled from a combination of
connector modules from distinct groups of different types
of connector modules, which can allow intra-group
interchangeable selection and assembly in a predetermined
area, but prevent inter-groups interchangeable selection
and assembly of connector module from different groups.
SUMMARY OF THE INVENTION
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In accordance with one embodiment of the present invention,
an electrical connector is provided comprising a frame, at
least one first connector module and at least one different
second connector module. The frame has at least one
connector module receiving area adapted to receive a
plurality of connector modules. The frame comprises a
first array of connector module locating features and a
different second array of connector module locating
features. The first connector module is located in the at
least one receiving area. The first connector module has a
housing and electrical contacts. The first connector
module comprises a mating first array of positioning
features interlocked with at least a portion of the first
array of locating features in the frame. The different
second connector module is located in the at least one
receiving area. The second connector module has a housing
and electrical contacts. The second connector module
comprises a mating different second array of positioning
features interlocked with at least a portion of the second
array of locating features in the frame.
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In accordance with another embodiment of the present
invention an electrical connector is provided comprising a
frame, at least one first connector module located in a
first receiving area of the frame, and at least one second
connector module or first connector module located in a
second receiving area of the frame. The frame has a first
connector module receiving area and a spaced second
connector module receiving area. Each receiving area is
adapted to receive at least two connector modules. The
second receiving area is adapted to receive at least two
different connector modules. The at least one first
connector module is located in the first receiving area.
The at least one second connector module or first connector
module is located in the second receiving area. The
connector can be provided with connector modules in the
second receiving area with or without the second connector
modules.
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In accordance with one method of the present invention, a
method of assembling an electrical connector is provided
comprising steps of providing a frame having a connector
module receiving area; selecting at least two connector
modules from a plurality of different types of connector
modules, each connector module having a housing and an
electrical contact; and inserting the selected connector
modules into the same receiving area adjacent each other,
wherein the connector modules and the frame in the
receiving area comprise interlocking locating features to
stationarily mount the housings to the frame.
BRIEF DESCRIPTION OF THE DRAWINGS
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The foregoing aspects and other features of the present
invention are explained in the following description, taken
in connection with the accompanying drawings, wherein:
- Fig. 1 is an exploded perspective view of a card edge
connector assembly embodying the present invention.
- Fig. 2 is a side elevation view of the card edge connector
assembly illustrated in Fig. 1, certain parts being cut
away and shown in section;
- Fig. 3 is a top plan view of the card edge connector
assembly illustrated in Figs. 1 and 2;
- Fig. 4 is an end elevation view of the card edge connector
assembly illustrated in Figs. 1, 2, and 3;
- Fig. 5 is a perspective view of a grouping of modules
according to the invention positioned on a motherboard but
absent the outer frame which normally envelops the
modules;
- Fig 6 is a perspective view of an insulative housing for a
module with elongated contacts in place;
- Fig. 7 is another perspective view of the insulative
housing for a module but without elongated contacts being
illustrated;
- Fig. 8A is a front elevation view of the insulative housing
illustrated in Figs. 6 and 7;
- Fig. 8B is a side elevation view of the insulative housing
illustrated in Figs. 6, 7, and 8A;
- Fig. 8C is a rear elevation view of the insulative housing
illustrated in Figs. 6, 7, 8A, and 8B;
- Fig. 8D is a side elevation view, taken opposite that of
Fig. 8B of the insulative housing illustrated in Figs. 6,
7, 8A, 8B, and 8C;
- Fig. 9 is a perspective view illustrating opposed ground
shields, each having a C-shaped cross section for slidable
reception, respectively, on an outer peripheral surface of
the insulative housing of Figs. 6, 7, 8A, 8B, 8C, and 8D;
- Fig. 10 is a front elevation view of a module into which
a planar card such as a daughter board is about to be
inserted;
- Fig. 11 is a side elevation view of the module
illustrated in Fig. 10
- Fig. 12 is a perspective view illustrating a single tubular
ground shield which is another embodiment of the pair of
opposed ground shields illustrated in Fig. 9;
- Fig. 13 is side elevation view of a modified module which
includes the single tubular ground shield illustrated in
Fig. 12;
- Fig. 14 is a detail view in section illustrating a portion
of the outer frame provided with a variety of locating
features at a plurality of longitudinally spaced locations
for positioning the modules at defined spaced locations
within the outer frame;
- Figs. 15, 16, 17, 18, are detail section views, similar to
Fig. 14, illustrating variations of the construction of
Fig. 14, each illustrating a portion of the outer frame
provided with a variety of different locating features at a
plurality of longitudinally spaced locations, also for
positioning the modules at defined spaced locations
within the outer frame;
- Fig. 19 is a detail exploded view in elevation illustrating
a modified outer frame in which a pair of longitudinally
spaced septum members are provided, each with a
registration feature enabling a suitably formed planar card
with conductive contact members to be fully inserted into
the card receiving slot of the card edge connector
assembly;
- Fig. 20 is a partial perspective view with a cut away
section of an electrical connector incorporating features
of the present invention attached to a printed circuit
board;
- Fig. 21 is a schematic bottom plan view of an alternate
embodiment of an electrical connector frame;
- Figs. 22a-22c are schematic bottom plan views of three
different first type of connector modules for use with the
frame shown in Fig. 21; and
- Figs. 23a-23c are schematic bottom plan views of three
different second type of connector modules for use with the
frame shown in Fig. 21.
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
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Referring to Fig. 1, there is shown an exploded perspective
view of a card edge connector assembly 20 incorporating
features of the present invention. Although the present
invention will be described with reference to the
embodiments shown in the drawings, it should be understood
that the present invention can be embodied in many
alternate forms of embodiments. In addition, any suitable
size, shape or type of elements or materials could be used.
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The card edge connector assembly 20 mounts to a plurality
of contact pads 22 arranged in a contact pattern 23 on an
underlying contact surface 24 in the form of a motherboard
26, for example. A planar card 28, a daughter board, for
example, has first and second opposed surfaces 30, 32 with
conductive contact members 34 on at least one of the
opposed surfaces.
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Viewing now also Figs. 2-5, an elongated longitudinally
extending outer frame 36 defines a reception region 38
which is adapted to receive a plurality of modules 40.
Each of the modules 40 includes contact members (to be
described below) and the modules lie side by side in
parallel laterally extending planes which, as an assembly,
are positioned to connectively engage with the mating
contact pads 22 on the underlying contact surface 24. The
outer frame 36 includes opposed spaced end walls 42,
opposed spaced side walls 44, and a top wall 46 integrally
joining the end walls and the side walls. The end walls,
side walls, and top wall together define the reception
region 38, the top wall having a longitudinally extending
aperture 48. The end walls 42 and the side walls 44 extend
to a lower rim 50 distant from the top wall 46 and define,
interiorly, an opening 52 through which the modules are
inserted into the reception region 38.
-
Turning now to Figs. 6, 7, and 8A-8D, each module 40
includes an insulative housing 54 which has first and
second spaced generally parallel elongated passages 56, 58
therein and a card receiving recess 60 for reception of the
planar card 28 (Fig. 1) between the first and second
passages. A first elongated contact 62 is firmly received
in a known manner in the first passage 56 and has a first
contact surface 64 positioned for engagement with an
associated contact pad 22 (Fig. 1) on the contact pattern
23 of the underlying contact surface 24 using known
techniques. In a similar fashion, a second elongated
contact 66 is firmly received in the second passage 58
having a first contact surface 68 positioned for engagement
with another associated contact pad 22 on the contact
pattern 23 of the underlying contact surface 24. Although
shown as being surface mount contacts, any type of
termination (e.g. press-fit, pin-in-paste) could be used.
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As seen in Fig. 1, the card receiving recesses 60 of the
plurality of modules 40 integrated as a group within the
outer frame 36 define a longitudinally extending card
receiving slot 70. Turning back to Fig. 6, the first
elongated contact 62 includes a second contact surface 72
projecting into the card receiving slot 70 (or recess 60 of
an individual module 40). The second contact surface 72
engages with an associated conductive contact member 34 on
the first surface 30 of the planar card 28 inserted into
the card receiving slot. In a similar fashion, the second
elongated contact 66 includes a second contact surface 74
projecting into the card receiving slot 70 (or recess 60 of
an individual module 40) in the direction of the first
elongated contact 62. This time, the second contact
surface 74 engages with a second one of the conductive
contact members 34, this one being on the second surface 32
of the planar card 28 inserted into the card receiving
slot.
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With continued attention to Fig. 1, the lower rim 50 of the
outer frame 36 includes a cutout region 76 enabling visual
inspection of the first contact surfaces 64, 68 of the
first and second elongated contacts 62, 66 when engaged
with their associated contact pads, respectively. Also,
aperture 48 of the outer frame 36 is aligned with the card
receiving slot 70 when the plurality of modules are
received in the reception region 38.
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Turn now to Figs. 9, 10, and 11 which illustrate opposed
ground shields 78, 80, each having a C-shaped cross section
for slidable reception, respectively, on an outer
peripheral surface 82 of the insulative housing. When so
received on the insulative housing, the ground shields 78,
80 are positioned in opposed relationship and in proximate
engagement with the outer peripheral surface 82. The first
ground shield 78 generally overlies the first elongated
passage 56 and the second ground shield 80 generally
overlies the second elongated passage 58. The ground
shields 78, 80 both include a first integral ground contact
84 for engagement (Fig. 1) with an associated ground
contact or pad 86 of an external unit such as the mother
board 26. In turn, the ground contact or pad 86 is
associated with the mating contact pads 22 engaged by the
first contact surfaces 64, 68 of the first and second
elongated contacts 62, 66. Further, each of the ground
shields 78, 80 includes a second integral ground contact 88
for engagement with an associated ground contact surface 90
on the planar card 28 inserted into the card receiving slot
70. As seen especially well in Figs. 9, 10, and 11, each
of the ground shields 78, 80 has a cutout region 92. The
cutout region 92 enables visual inspection of the first
contact surfaces 64, 68 of the first and second elongated
contacts 62, 66 when engaged with their associated mating
contact pads 22, respectively, and of the first and second
ground contacts 84 when engaged with their respective
mating ground contact pads 86 of the external unit or
motherboard 26.
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Viewing especially Figs. 8A, 8B, 8C, and 8D, the outer
peripheral surface 82 of the insulative housing 54 has
first and second opposed major sides 94, 96, respectively,
and a first minor side 98 joining the first and second
major sides. In a similar manner, the outer peripheral
surface 82 of the insulative housing 54 has third and
fourth opposed major sides 100, 102 and a second minor side
104 joining the first and second major sides. The first
and third major sides 94, 100 are coplanar and the second
and fourth major sides 96, 102 are coplanar. By the same
token, the first and second minor sides 98, 104 lie in
parallel spaced apart planes. The insulative frame 54 also
has a first elongated slot 106 spaced from and aligned with
the card receiving recess 60 and having an inlet positioned
intermediate the first and third major sides, 94, 100. The
first elongated slot 106 is generally parallel with the
first and second minor sides 98, 104. The insulative frame
54 also has a second elongated slot 107, also spaced from
and aligned with the card receiving recess 60 and having an
inlet positioned intermediate the second and fourth major
sides 96, 102, respectively. The second elongated slot 107
is generally parallel with the first and second minor sides
98, 104 and coplanar with the first elongated slot 106.
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A complete module 40 includes, as earlier described in a
more general description, the first and second ground
shields 78, 80, and these will now be described more
completely as they are mounted on the insulative housing
54. Each ground shield 78, 80 has a C-shaped cross section
and has earlier been described as being slidably received
on the insulative housing in opposed relationship and in
proximate engagement with the outer peripheral surface 82.
The first ground shield 78 generally overlies the first
elongated passage 56 and the second ground shield 80
generally overlies the second elongated passage 58. The
first ground shield 78 has first and second opposed limbs
108, 110 proximately overlying the first and second major
sides 94, 96, respectively, and a first side limb 112
proximately overlies the first minor side 98. A first
flange limb 114 extends transverse of the first opposed
limb 108 and is slidably received in the first elongated
slot 106. With this construction, the first ground shield
78 substantially completely surrounds the first elongated
contact 62 received in the first elongated passage 58.
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In a similar manner, the second ground shield 80 has third
and fourth opposed limbs 116, 118 proximately overlying the
third and fourth major sides 100, 102, respectively. A
second side limb 120 proximately overlies the second minor
side 104. A second flange limb 122 extends transverse of
the third opposed limb 116 and is slidably received in the
second elongated slot 107. With this construction, the
second ground shield substantially completely surrounds the
second elongated contact 66 received in the second passage
58.
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It was earlier explained that the first and second ground
shields 78, 80 both include a first integral downwardly
projecting ground contact 84 for engagement with a mating
ground contact or pad 86 of an external unit such the
motherboard 26. As earlier noted, the mating ground
contact or pad 86 is associated with the mating contacts 22
engaged by the first contact surfaces 64, 68 of the first
and second elongated contacts 62, 66. Also, each of the
first and second ground shields 78, 80 includes a second
integral ground contact 88 for engagement with an
associated ground contact surface 90 on the planar card 28
inserted into the card receiving slot 60.
-
As particularly well seen in Figs. 1 and 10, both of the
second integral ground contacts 88 of the first and second
ground shields 78, 80 project into the card receiving
recess 60, with the ground contact 88 of the first ground
shield 78 generally facing the ground contact 88 of the
second ground shield 80. Further, each of the second
integral ground contacts 88 of the first and second ground
shields project into the card receiving recess 60 at a
location nearer the top wall 46 of the outer frame 36 than
either of the second contact surfaces 72, 74 of the first
and second elongated contacts 62, 66. In this manner, an
early mate, late break, grounding operation can be
established. More specifically, this construction serves
to establish in a preemptive manner common electrical
grounding across the contact interface in advance of other
electrical interconnection of the first and second
electrical contacts 62, 66.
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Turn now to Figs. 12 and 13 for a description of another
embodiment of the invention. In this instance, in place of
the pair of opposed ground shields 78, 80 enveloping the
insulative housing 54, a single tubular ground shield 128
is slidably received on the insulative housing in proximate
engagement with the outer peripheral surface 82. As with
the combined pair of C-shaped ground shields 78, 80, the
tubular ground shield 128 includes a first pair of integral
ground contacts 130, each provided for engagement with a
ground contact 86 (Fig. 1) of an external unit or
motherboard 26 associated with the mating contacts engaged
by the first contact surfaces of the first and second
elongated contacts 62, 66.
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The tubular ground shield 128 also includes a second pair
of integral ground contacts 132 for engagement with the
ground contact surfaces 90 (see Fig. 1) on the planar card
28 inserted into the card receiving slot 70 of the
insulative housing 54. In every way, the tubular ground
shield 128 operates in the manner of the pair of opposed
ground shields 78, 80. This includes the provision of a
pair of flange limbs 134, similar to the flange limbs 122,
which are mutually opposed and coplanar and are slidably
received in the second elongated slots 106, 107 of the
insulative housing 54. With this construction, the ground
shield 128 substantially completely surrounds each of the
elongated contacts 62, 66 received in the passages 56, 58.
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In a preferred construction, again viewing Figs. 6 and 7,
the insulative housing 54 is formed with first and second
spaced pairs of generally parallel elongated passages
therein 56 and 56A and 58 and 58A with an elongated contact
firmly received in each in the manner previously described.
As previously, each elongated contact has first and second
contact surfaces with the construction previously described
for mating contact with associated contact surfaces on the
motherboard 26 and on the planar card 28.
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In order to hold the modules at defined spaced locations
within the outer frame 36, the outer frame may be provided
with a variety of locating features at a plurality of
longitudinally spaced locations. In Fig. 14, for example,
the top wall 46 is provided with a plurality of laterally
extending protrusions 136 projecting into the reception
region 38 which engage associated modules 40 and maintain
them in a spaced side-by-side relationship. In this
instance, the spacing between each pair of protrusions is
approximately equal to the thickness of a module and
adjacent modules are maintained a slight distance apart.
Similar constructions are illustrated in Figs. 15 and 16.
In Fig. 15, a plurality of similarly spaced upright
protrusions 138 are provided on the inside surfaces of the
side walls 44. In Fig. 16, a plurality of similarly spaced
corner protrusions 140 are provided at the inner interface
between the side walls 44 and top wall 46. In each
instance, the protrusions 136 or 138 or 140 repeat at the
same pitch distances for the entire length of the outer
frame 36.
-
In other instances illustrated in Figs. 17and 18, each
module has complimentary locating features formed for
engagement with locating features of the outer frame,
again, such that each module is positively positioned with
respect to the outer frame. In Fig. 17, for instance,
lateral protrusions 142 are illustrated which may be of the
nature and longitudinal spacing of the protrusions 136. In
this instance, modified modules 40A have a laterally
extending groove 144 which matingly receives the lateral
protrusions 142 to maintain the modules in a spaced side-by-side
relationship with adjacent modules maintained a
slight distance apart. In Fig. 18, downwardly extending
protrusions 146 are appropriately located to project into
the uppermost end portions of the elongated passages 56,
56A, 58, and 58A of the insulative housing 54. This
construction is also seen, for example, in Fig. 2. In the
same manner as in the previously described embodiments, in
this instance, the modules are maintained in a spaced side-by-side
relationship with adjacent modules maintained a
slight distance apart.
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As seen in Figs. 1, 2, and 3, a septum member 148 may be
provided intermediate the spaced end walls 42 and lying in
a plane parallel to the end walls. With this construction,
the reception region 38 is separated into first and second
chambers 150, 152 (Fig 2) for receiving the modules 40. A
retention clip 154 may be attached to the septum member 148
at the lower rim, extending away from the outer frame 36 in
a direction away from the top wall 46.
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Indeed, a plurality of retention clips 154 may be provided
for attaching the outer frame 36 to an underlying surface,
for example, to the motherboard 26, one of the retention
clips mounted on each end wall 42 and on each septum member
148 at the lower rim 50. In each instance, the retention
clip extends in a direction away from the top wall 46 and
are secured to the substrate with known techniques.
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In Fig. 19, a modified outer frame 36A is illustrated in
which a pair of longitudinally spaced septum members 156,
158 are provided intermediate the spaced end walls 42A.
The septum members 156, 158 lie in planes parallel to the
end walls 42A and thereby separate the reception region 38A
into a plurality of chambers 160, 162, 164 for receiving
the modules 40. Each of the septum members 156, 158
includes a registration feature, for example, uppermost
edges 166, 168 enabling a modified planar card 28A with
conductive contact members thereon (not shown) and
complementary registration features 170, 172 to be fully
inserted through the longitudinally extending aperture of
the top wall 46A and into the card receiving slot. When
this occurs, the slotted registration features 170, 172 are
positioned and sized for engageable reception, first of the
uppermost edges 166, 168, respectively, then the remainder
of the septum members 156, 158 so that, in turn, the
conductive contact members on the planar card 28A can be
mechanically and electrically engaged by the second
elongated contact surfaces of the elongated contacts 62, 66
of the plurality of modules.
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Of course, the corollary is true, that if the planar card
28A does not possess the registration features 170, 172
positioned and sized to receive the septum members 156,
158, the planar card would be rejected and incapable of use
with the system of the invention.
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When the modules 40 are arranged in side-by-side fashion
within the outer frame 36, it may be desirable to provide
some further instrumentality, other than those already
described, to keep adjacent modules at spaced distances
apart. This can be achieved, for example, by providing at
least one boss member 174, and preferably several at spaced
apart locations on the outer peripheral surface 82 of one
insulative housing 54 of a module 40 such that it is, or
they are, engageable with the insulative housing of an
adjoining module. See Fig. 2. The boss member would be
dimensioned to prevent mutual engagement of the ground
shield 128 or ground shields 78, 80 of the adjoining
modules.
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In an alternative construction, a plurality of mutually
opposed pairs of boss members 176, 178 (Figs. 2 and 11) may
be provided on the insulative housings of adjoining
modules. In this instance, the mutually opposed pairs of
boss members are aligned for engagement and dimensioned to
prevent mutual engagement of the ground shields of the
adjoining modules.
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Recognizing that there are instances in which it is
desirable for the ground shields of adjoining modules to be
electrically in common, a bridging contact 180 (Figs. 5 and
9) may be provided on at least one of the ground shields of
one of the members 40 engageable with the ground shield of
its adjoining member.
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Referring now to Fig. 20, there is shown a partial top and
longitudinal side perspective view of an alternate
embodiment of an electrical connector 200, with a cut-away
section, which is attached to a printed circuit board 202.
A portion of the top 206 of the housing frame 204 of the
connector 200 is shown cut-away from the card edge
receiving slot 208 back to one side wall 210. The
connector 200 generally comprises the housing frame 204 and
connector modules or modules 212, 214, 216 connected to the
frame 204. In this embodiment the modules 212, 214, 216
comprise modules from two different families of modules.
However, more or less than two families of modules could be
provided. In addition, each family of modules could
comprise only one or more than one type of different
modules as explained in further detail below.
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The frame 204 comprises two module receiving areas 218,
220. However, more or less than two module receiving areas
could be provided. In this embodiment the two module
receiving areas 218, 220 are separated from each other by a
portion 222 of the frame which also comprises a septum
member 224. However, any suitable separation could be
provided. The first receiving area 218 includes a first
array of connector module location features 226. The
locating features 226 comprise inward projections along the
side walls 210, 211. In alternate embodiments the locating
features could comprise recesses and/or could extend
downward from the top 206 into the receiving area 218. The
first receiving area 218 could also comprise more than one
array of locating features. The second receiving area 220
includes a second array of connector module locating
features 226. The locating features in the second area 220
are the same as the locating features in the first area
218. However, in an alternate embodiment they could be
different. The centerline spacing S between adjacent
locating features 226 is also the same in both receiving
areas 218; 220, but could be different.
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The first family of modules, in the embodiment shown,
comprise the two different types of modules 212, 214.
However, the first family could comprise merely one type of
module or more than two types of modules. In this
embodiment both types of modules in the first family
comprise a same housing 228 and same signal contacts 230.
However, in alternate embodiments the housings and/or
signal contacts for the different types of modules in the
first family of modules could be different. Each housing
228 has an array of positioning features 232 which
interlock with at least a portion of the first array of
locatinc features 226 in the frame 204. In this embodiment
the positioning features 232 comprise grooves or recesses
along opposite side walls of the housing 228; one on each
side wall. However, in alternate embodiments any suitable
array could be provided and the positioning features could
have any suitable shape so long as they interlockingly mate
with locating features on the frame. In this embodiment,
the difference between the two types of modules 212 and 214
of the first family is the presence or absence of a ground
shield. The first type of modules 212 comprise ground
shields 234 substantially identical to the shields 128
shown in Fig. 12, but the shields 234 can have slots to
accommodate the mating locating features 226 and
positioning features 232. The second type of modules 214
do not comprise ground shields. In alternate embodiments
other features could differentiate the two types of modules
212, 214. The shields 234 of adjacent first type of
modules 212 can be formed as differential pair signal and
ground contacts for high speed signal transmission. The
contacts 230 in the second type of module 214 could merely
be ordinary signal contacts for slower speed signal
transmission. The first and second types of modules 212,
214 could be intermixed or arranged in any suitable pattern
in the first receiving area 218.
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The second family of modules, in the embodiment shown,
merely comprises one third type of module 216. However, in
alternate embodiments the second family of modules could
comprise more than one type module having, for example,
different housings, and/or contacts, and/or shielding. In
this embodiment the connector 200 merely comprises two of
the modules 216, but more or less could be provided. Each
module 216 has a housing 236 and contacts 238. The
housings 236 each comprise an array of positioning features
240 which interlock with at least a portion of the second
array of locating features 226 in the second receiving area
220. In this embodiment the positioning features 240
comprise grooves or recesses along opposite side walls of
the housing 236; two on each side. However, in alternate
embodiments any suitable array could be provided and the
positioning features could have any suitable shape. In
this embodiment the modules 216 do not comprise shielding
and are not intended for high speed signal transmission.
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With the present invention the first receiving area 218 can
have modules from the first family of modules which are
separate from the second receiving area 220. The second
receiving area 220 can have modules from the second family
of modules. In this case, the two families of modules are
differentiated from each other by their different housings
228 and 236. However, in alternate embodiments the
differentiation among families of modules could be based
upon additional features or alternative features. For
example, the housings could have different positioning
features or different types of contacts. One of the
features of the present invention is the ability to
configure the types of modules which are located in the
first receiving area 218 from a selection of different
types of modules in a first family of modules and, the
ability for configuration or patterning of the different
types of modules from a same family in the same receiving
area. For example, only modules 212, only modules 214, or
mixtures of modules 212 and 214 could be provided in the
first receiving area 218.
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Another feature of the present invention is the ability to
configure the connector to have modules from multiple
families of modules, or alternatively to have modules from
only one family of modules. Fig. 20 shows the connector
200 with modules from two families of modules. However,
the connector could alternatively be configured to have
modules from only the first family of modules; i.e.,
without using the modules 216. More specifically, the
modules 212 or 214 could be located in the second receiving
area 220. This is because the locating features 226 in the
first and second receiving areas have the same size and
spacing, such that the positioning features 232 can work in
the second receiving area. Furthermore, length of the
housing 236 is a multiple of the length of the housing 228.
In this embodiment the length multiple is 2, however, any
suitable multiple could be used. Therefore, in this
embodiment, each of the modules 216 can be replaced by two
of the modules 212 and/or 214.
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Referring now to Figs. 21, 22a-22c and 23a-23c, additional
features of the present invention will be described. Fig.
21 shows a schematic bottom plan view of a housing frame
250 for an electrical connector, for example a card edge
connector. In this embodiment the frame 250 has three
connector module receiving areas 252, 254, 256. The first
receiving area 252 has a main section 258 and a first array
of a first type of locating features 260. The second
receiving area 254 has a main section 262 and a second
array of a second type of locating features 264. The third
receiving area 256 has a main section 266 and a third array
of locating features comprising a mixture or combination of
the arrays of first and second types of locating features
260 and 264. When the arrays overlap, they can form larger
third type of locating features 268. In this embodiment
the locating features 258, 264 and 268 comprise grooves in
the inside surfaces of the side walls 270, 272 of the frame
250. However, any suitable locating features could be
provided.
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A first family of connector modules for use with the frame
250 are shown in Figs. 22a-22c. In this embodiment the
first family of modules comprises three different types of
modules 274, 276, 278. The first module 274 has a first
type of housing 280 and first contacts 282. The first
housing 280 has positioning features 284 for positioning in
a portion of the first array of locating features 260. The
first contacts 282 are preferably signal contacts located
in two groups 286, 288 with different contact pitches. The
module 276 has a second housing 290 and first contacts 282.
The second housing 290 has a same length as the first
housing 280 and a same pattern of the locating features
260, but has a different contact pitch (only the pitch
equivalent to group 288) for its contacts 282. The third
module 278 has a housing 292 with a longer length than the
housings 280 and 290, but has a same repeating pattern for
its positioning features 284 and only one contact pitch for
its contacts 282. The third housing 292 is sized and
shaped to substantially precisely fit inside the first
receiving area 252. Alternatively, two of the first and/or
second types of modules 274, 276 could be located in the
first receiving area 252. The first family of connector
modules could have different housing lengths and contact
positions, but in this embodiment they can all be
identified by the size, shape and relative positioning of
their positioning features 284.
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The second family of connector modules for use with the
frame 250 are shown in Figs. 23a-23b. In this embodiment
the second family of modules comprises three different
types of modules 294, 296, 298. The first module 294 has a
first type of housing 300 and second contacts 302. The
first housing 300 has positioning features 304 for position
in a portion of the second array of locating features 264.
The second contacts are preferably power contacts. The
second module 296 has a second housing 306 and a third type
of contact 308. The second housing 306 has a same length
as the first housing 300 and a same pattern to the position
features 304, but merely has a different size and shape
hole for the contact 308. The contact is preferably a
power contact, but has a different shape from the power
contacts 302. The third module 298 has a housing 310 with
a longer length than the housings 300 and 306, but has a
same repeating pattern for its positioning features 304.
The third module 298 has both the first and second types of
power contacts 302 and 308. Other members of the second
type of family could also be provided, such as having
different contacts, housing lengths, or other variations,
but they can all be identified by the size, shape and
relative positioning of their positioning features 304.
Combinations of modules 294 and/or 296 and/or 298 can be
used to fill in the second receiving area 254 in the frame
250.
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The locating features 260 in the first receiving area 252
and the locating features 264 in the second receiving area
254 are configured to receive modules from only the first
family of connector modules and the second family of
connector modules, respectively. The connector modules
294-298 of the second family cannot be inserted into the
first receiving area 252 because of the differences between
locating features 260 and positioning features 304.
Likewise, the connector modules 274-278 of the first family
cannot be inserted into the second receiving area 254
because of the differences between the locating features
264 and the positioning features 284.
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The third receiving area 256 is adapted to receive modules
from both of the module families. In alternate embodiments
the third receiving area might not be provided, or more
than one third receiving area could be provided or, one or
both of the first and second receiving areas might not be
provided. In the embodiment shown, the right side of the
third area 256 could receive two of the modules 294 and/or
296. The left side and center of the third area 256 could
receive modules 274, 276 and/or 278. In addition, the
right side of the third area 256, and/or the center and
right side of the area 256, might include one or more of
the first- family of modules. This is because the array of
first type of locating features 260 overlaps the second
array of locating features 264 in the third receiving area
256; allowing the modules 274-278 to be positioned
throughout the entire third receiving area 256. After
reading the above description, variations in patterns
should be easily envisioned by those skilled in the art to
produce other obvious embodiments incorporating features of
the present invention. More than two different types of
positioning and/or locating features could also be used.
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The present invention can allow for a connector frame to be
able to receive heterogeneous groups of modular units ( s)
of sets of various designs and purposes (families) to form
electrical connectors. The connector frame can comprise
locating features designed to selectively admit subset
combinations of families in some predetermined locations
while rejecting these subsets in favor of other subsets
from a different family. The assembly can comprise subassemblies
of identical shielded modular units which can be
interspersed with lower cost non-shielded units and/or
special-purpose units (such as for high current
interconnections). Some positions in the frame could be
left blank or could be filled with blank or dummy modules.
Sets of frames and modules may be designed with distinct
families of position structures and features, whereby these
frames, in offering a first set of positioning structures
in any one aperture and a mechanically incompatible second
and distinct series of positioning structures in any other
aperture will prevent the mingling of one family of module
designs with a second family of designs within the same
aperture. This segregation may be advantageous as a
polarity feature, or as a means of eliminating assembly
operator error, or to provide a special and proprietary
series of product distinct from a general commodity design.
An additional advantage of such segregation is the
separation and deliberate location of a distinct series of
modules of an especially robust design capable of
withstanding severe service, such as high voltages, high
currents, or exceptional mating life demands, whose special
positioning structures are mechanically incompatible with
elements from the series of standard service designs. In
this case, such segregation can advantageously prevent an
undesirable or dangerous condition, including the untimely
or catastrophic failure of any improperly positioned
standard service unit or group accidentally subjected to
severe service.
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It should be understood that the foregoing description is
only illustrative of the invention. Various alternatives
and modifications can be devised by those skilled in the
art without departing from the invention. Accordingly, the
present invention is intended to embrace all such
alternatives, modifications and variances which fall within
the scope of the appended claims.