EP1105257A1 - Doigts de prise de tranches - Google Patents

Doigts de prise de tranches

Info

Publication number
EP1105257A1
EP1105257A1 EP00916400A EP00916400A EP1105257A1 EP 1105257 A1 EP1105257 A1 EP 1105257A1 EP 00916400 A EP00916400 A EP 00916400A EP 00916400 A EP00916400 A EP 00916400A EP 1105257 A1 EP1105257 A1 EP 1105257A1
Authority
EP
European Patent Office
Prior art keywords
wafer
finger
groove
edge
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00916400A
Other languages
German (de)
English (en)
Inventor
Jaydeep Kumar Sinha
Noel S. Poduje
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADE Corp
Original Assignee
ADE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADE Corp filed Critical ADE Corp
Publication of EP1105257A1 publication Critical patent/EP1105257A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B25J15/10—Gripping heads and other end effectors having finger members with three or more finger members
    • B25J15/103—Gripping heads and other end effectors having finger members with three or more finger members for gripping the object in three contact points

Definitions

  • grooves of the present invention which have a curved shape with a radius of curvature great enough, typically greater than that of the wafer edge, so that contact occurs only are one point, patch or region of the edge. That point or region of contact is also centrally located so that there is a minimum of stress build up that can deform the wafer shape.
  • the wafer groove is coated or made of Teflon to further minimize the deforming forces thereon.
  • Fig. 1 is a view of a wafer held in position by a series of grippers;
  • Figs. 2a - 2c are views of a prior art gripper;
  • Figs. 3a - 3c are views of a gripper according to the invention;
  • Figs. 4 and 5 illustrate considerations in the design of a gripper groove according to the invention.
  • Fig. 6 illustrates the gripper of the invention in use in wafer testing.
  • Fig. 1 shows a wafer 12, typically of a semiconductor material such as silicon.
  • the wafer 12 is supported by three fingers or grippers 14, 16, and 18 which may be part of a wafer transport handle, not shown, or a support fixture for holding the wafer at a wafer test station, vertically or horizontally.
  • Figs. 2a - ac Prior art versions of the fingers or grippers 14, 16, and 18 are illustrated in Figs. 2a - ac.
  • the fingers have a body 20 with an end section 22, typically of PEEK, having a groove 24 at the end where the wafer 12 is to be held.
  • the groove 24 makes contact with the wafer 12 at two points 26 and 28 which are physically separated.
  • the forces are additionally directed out of the plane of the wafer. The result is that the wafer will in some or all cases experience a deforming set of forces and torques that can result in erroneous dimensional measurements.
  • Figs. 3a - 3c illustrate a finger 32 and groove 34 of a curved shape where the radius of curvature is greater than that of the edge of wafer 12.
  • the wafer makes contact at only one central point 36, which in reality may be a patch or region of finite size rather than an infinitely small point. The limited single point or region of contact minimizes the deforming forces on the wafer and leads to greater accuracy in their measurement.
  • the fingers 32 may have the grooves coated with
  • Fig. 4 shows in greater detail the contact patch
  • Fig. 5 graphs the effects on shear and in planer forces of the radius of the groove varying over a range from the same as the edge, re, to twice or more.
  • the shear force clearly drops off substantially with expanding radius of curvature of the groove.
  • Fig. 6 illustrates the use of the edge holding groove of the invention in a typical test fixture.
  • a wafer 12 is placed in grippers 32 which are part of a test fixture and hold the wafer horizontally or vertically as the instrument warrants. Vertical orientation enhances the benefits of the invention by holding the wafer in a manner where the gravitational forces are also in the plane of the wafer 12.
  • the wafer is held for measurement by one or more probes 40 that measure a desired dimensionally sensitive parameter including warp, bow, flatness among others.

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Des tranches (12) sont saisies par des élément de préhension (14, 16, 18) présentant des encoches (34) courbées et éventuellement recouvertes de Téflon (34), avec un rayon de courbure supérieur à celui du bord de la tranche saisie. Ceci réduit au minimum la contrainte et le couple de torsion appliqués à la tranche, qui pourraient sinon la déformer et compromettre la précision des mesures des paramètres de tranches.
EP00916400A 1999-03-16 2000-03-16 Doigts de prise de tranches Withdrawn EP1105257A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12464799P 1999-03-16 1999-03-16
US124647P 1999-03-16
PCT/US2000/006895 WO2000054941A1 (fr) 1999-03-16 2000-03-16 Doigts de prise de tranches

Publications (1)

Publication Number Publication Date
EP1105257A1 true EP1105257A1 (fr) 2001-06-13

Family

ID=22416053

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00916400A Withdrawn EP1105257A1 (fr) 1999-03-16 2000-03-16 Doigts de prise de tranches

Country Status (3)

Country Link
EP (1) EP1105257A1 (fr)
JP (1) JP2002539621A (fr)
WO (1) WO2000054941A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4671724B2 (ja) 2005-03-16 2011-04-20 信越半導体株式会社 半導体ウェーハの保持用グリッパー及び保持方法並びに形状測定装置
JP2009141081A (ja) * 2007-12-05 2009-06-25 Sumco Corp 半導体ウェーハ表面検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
US4717190A (en) * 1986-10-30 1988-01-05 Witherspoon Linda L Wafer handling and placement tool
US4960298A (en) * 1988-12-20 1990-10-02 Texas Instruments Incorporated Semiconductor wafer pick-up device
IT1228105B (it) * 1988-12-20 1991-05-28 Sgs Thomson Microelectronics Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0054941A1 *

Also Published As

Publication number Publication date
WO2000054941A1 (fr) 2000-09-21
JP2002539621A (ja) 2002-11-19
WO2000054941A9 (fr) 2001-11-29

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