EP1068481A1 - Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif - Google Patents
Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositifInfo
- Publication number
- EP1068481A1 EP1068481A1 EP99910447A EP99910447A EP1068481A1 EP 1068481 A1 EP1068481 A1 EP 1068481A1 EP 99910447 A EP99910447 A EP 99910447A EP 99910447 A EP99910447 A EP 99910447A EP 1068481 A1 EP1068481 A1 EP 1068481A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- capillary
- fluid
- channel
- sheets
- channels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
Definitions
- the present invention relates to the field of heat exchange devices with active fluid, and more specifically, those which contain a two-phase fluid and which comprise capillary channels.
- biphasic is meant the fact that the fluid contained in such devices is present, so that they are operational, in the form of the two liquid and gas phases. Also qualified below by “capillaries”, channels which have a very small section compared to their length, and especially which are capable of producing phenomena of pumping by capillarity on liquids.
- Bi-phase fluid thermal devices comprising capillary channels capable of producing capillarity phenomena on the liquid phase, and gas transport channels in which the gas phase of the fluid is confined, the capillary channels communicating with the channels. gas transport.
- a closed loop the device is used as a heat pipe and operates autonomously.
- the device is exposed to a cold condensation zone, also called a cold source, and a hot vaporization zone, also called a hot source.
- the fluid condenses in its liquid phase, in the cold zone and is vaporized in its gas phase in the hot zone.
- the capillary forces then act on the liquid phase of the fluid to move it from the condensation zone to the vaporization zone.
- the gas pressure being greater in the vaporization zone than in the. condensation, a gas flow is obtained in the opposite direction to the displacement of the liquid phase.
- the capillary and pressure forces act alone as a motor for the circulation of the fluid
- the device In open loop, the device is used as an evaporator and a 99/50607
- the fluid must arrive in its liquid form in the device and leave it in its gaseous form, to be condensed in a different element of the circuit
- the liquid which is denser than the gas
- the liquid can be in the form of droplets dispersed in the gas phase
- the capillary channels then make it possible to fix these droplets and to prevent them from returning to the downstream gas circuit of the device
- devices of a first type consisting of cylindrical rods with circular section stacked perpendicular to their longitudinal direction in a hexagonal network Stacked in this way, these rods define cavities between them These cavities extend longitudinally parallel to the rods and have a roughly triangular cross section These cavities contain the biphasic fluid
- the parts of the external surfaces of the rods, located in the vicinity of the vertices of the triangles, that is to say near the contact zones between two rods, constitute channels capable of exerting capillary forces on the liquid phase of the fluid
- the central zone of the cavities forms a gas transport channel
- it is essential that there is no interruption of the capillary channels along their length This requires a pre stacking cis and rigid cylindrical rods
- These rods are therefore housed and wedged in grooves made in a rectilinear and rigid bar
- a device of this type is relatively expensive to produce and has drawbacks for certain applications
- One of these drawbacks is for example its rigidity which is hardly compatible with the work of the
- a device of this other type consists of aluminum tubes, internally striated to form capillary channels open on a hollow central core, serving as a gas transport channel. Again, the cylindrical geometry of these tubes does not promote compactness and optimal performance.
- capillary essentially relates to the geometry of the tube which has a very small cross section compared to its length, which allows the gas to remain in bubbles in the liquid and push it.
- An object of the invention is to provide a thermal device with active biphasic fluid, flat, flexible, having a compactness and high performance, which includes in its thickness at least one channel of sufficiently large section so that a gas passes easily without a liquid being able to obstruct it, and at least one channel sufficiently small so that a liquid can be there propagate by capillarity.
- Another object of the invention is also to provide a device having low risks of stopping operation by local drying of the capillary channels.
- a thermal device with active biphasic fluid comprising at least one capillary channel and at least one gas transport channel, each capillary channel having a section adapted so that the liquid phase of the fluid can be pumped there by forces.
- this device allowing a reversible passage of fluid, between at least one capillary channel and at least one gas transport channel, during the liquid transition / gas or gas / liquid, consecutive temperature variations undergone by at least one zone of the device, characterized in that it comprises at least one sheet comprising on one of its two main faces, at least two parallel grooves, communicating longitudinally with each other and at least one sheet capable of covering the grooves to form at least one capillary channel and at least one transport channel t gaseous.
- a device according to the invention has a sheet structure which allows it to be flat.
- this shape makes it possible to have large contact surfaces between the device and the structures which are equipped with the device. Thus the heat exchanges between the device and these structures are facilitated.
- the capillary channel is made “flat", by forming a groove in a sheet, before being integrated into the mass of the device.
- the dimension perpendicular to the main surface of the sheet, on which the groove which constitutes it is flush can be optimized.
- This dimension which will be called “thickness of the channel "may be as weak as necessary.
- the capillary pressure tends towards a maximum when the thickness of the capillary channel tends towards zero and only the “flat” embodiment makes it possible to obtain the few microns or tens of microns necessary for a great height of lifting of the liquid.
- the thickness of the capillary channel is less than 100 ⁇ m for a high capillary pressure. But more preferably, this thickness of the capillary channel is approximately between 30 and 70 ⁇ m. Furthermore, the dimension parallel to the main surface of the sheet determines what will be called the "capillary channel width". However, the width of the capillary channel induces the pressure drop and therefore makes it possible to obtain the necessary flow of liquid. The “flat” arrangement makes it possible to increase this width as much as necessary and therefore allows a large flow and a high thermal power.
- a capillary channel has a width of the order of 0.3 to 1 mm for a sufficient flow rate and a limited pressure drop.
- the wetting heat pipes have a large section but the capillary pressure is very low, which does not allow inclined use of the heat pipe.
- the section in which the thickness of the capillary is optimal has a very small width.
- each gas transport channel is determined in thickness, by the number of stacked sheets and the thickness of each sheet, and in width by the width of the corresponding groove, engraved on the entire thickness of each sheet. .
- This section is large enough to reduce the gas velocity and allow a flow with low pressure drop. This thus makes it possible to avoid limiting the performance of the micro-heat pipe by reaching the speed of sound by the gases in the gas transport channels.
- the grooves are made directly on the sheets.
- a rigid structure is therefore not necessary, unlike devices with stacking cylindrical rods of the prior art.
- the thickness and the nature of the material of the sheets can therefore be chosen to give flexibility to the device.
- the fact of being able to choose thin sheets also makes it possible to gain in compactness and to optimize the ratio capacity of transport of heat on size of the device, to obtain high performances.
- the device according to the invention has a much smaller thickness than traditional heat pipes, typically 3 to 5 times thinner, which induces a significant lightening potential.
- the device according to the invention can also be easily deformed, which allows bending with a very small radius of curvature, close to folding. This possibility makes it possible to generate non-planar contact surfaces, in particular cylindrical, to generate changes of planes by change of altitude or angular direction, or even to generate geometries in "bellows" making it possible to make flexible connections with wells thermal.
- the transfer of gas between the capillary channels and the gas transport channels must be optimized, inter alia, to avoid drying.
- this exchange is permanent insofar as the two types of channels are integrated one into the other.
- the search for capillary pumping performance has resulted in isolation of the capillary channel, which means that the gas circulates in the capillary, promoting drying.
- the device according to the invention makes it possible to optimize both the transfer between capillary channels and gas transport channels and the performance in capillary pumping.
- a device according to the invention can comprise several capillary channels communicating longitudinally with a gas transport channel. In this way, if a local heating dries up one of the capillary channels, another of these channels can continue to ensure the circulation of the liquid phase. In addition, communication between channels 7
- the device according to the invention comprises a number of sheets stacked on each other, equal to or greater than two, each having at least one groove capable of forming a gas transport channel communicating over its entire length with a homologous groove d another sheet
- the device according to the invention comprises at least one circuit of channels operating in closed loop and ensuring, without motor, the circulation of the fluid contained in the circuit, between an evaporation zone and a condensation zone , the capillary forces exerted on the liquid phase of the fluid contained in the capillary channels playing a pumping role on the fluid
- the di spositif according to the invention constitutes a heat pipe
- a heat pipe can be composed of several subsets of sheets, each subset comprising a circuit of channels, isolated from the circuit of each other subset, each circuit being charged
- the device according to the invention comprises at least one circuit of channels, open on a circuit comprising a pump and a condenser, the device according to the invention then playing the role of an evaporator and the forces capillaries exerted on the liquid phase of the fluid making it possible to fix it in the capillary channels, and to distribute it by capillary pumping, in these channels
- the heat transfer must be optimized to avoid temperature gradients in hot and cold transfer zones.
- this quality of thermal transfer is optimized thanks to a particular geometry of the ends A “staircase” arrangement of the liquid-gas limits makes it possible to spread your menisci from these surfaces, and thereby to favor 8
- the invention is a method for producing devices according to the invention
- the main operations of construction of the device according to the invention are the cutting and engraving of the sheets, the welding "flat, with the press", and the trimming This allows the simultaneous production of a large number of parts , which is favorable to mass production This is not possible for traditional heat pipes which must be machined one by one
- the work, by cutting and engraving flat, of the sheets allows a large freedom of drawing at reduced cost, for the device according to the invention, and facilitates the networking of the conduits constituted by a gas transport channel and the capillary channels which are associated with it This particularity is all the more remarkable as the production of the etching and cutting takes place done simultaneously everywhere on a whole sheet
- the corresponding cost is therefore not proportional to the length of the necessary conduits
- FIG. 2 is an elevational view from above of a basic sheet of an embodiment of a device according to the present invention
- - Figure 3 is an elevational view from below of a sheet intermediate of the device according to the invention corresponding to the same embodiment as that of FIG. 2,
- FIG. 4 is a top elevation view of an intermediate sheet of the device according to the invention corresponding to the same embodiment as that of FIG. 2n,
- FIG. 5 is a top elevational view of an upper sheet of the device according to the invention corresponding to the same embodiment as that of Figure 2;
- FIG. 6 shows schematically in section, along line A- A, a stack of sheets shown in Figures 2, 3, 4 and 5;
- FIG. 6a represents such a stack with a very expanded scale in the direction perpendicular to the plane of the sheets;
- Figure 6b shows in more detail the cross section of a gas transport channel and adjacent associated capillary channels;
- FIG. 7 schematically shows a perspective view of an example of a device according to the invention, based on a mounting tool
- FIG. 8 shows schematically, top view, an application of a device according to the invention, to the cooling of components on electronic circuits;
- FIG. 9 shows schematically, in longitudinal section, a device according to the invention, sandwiched between two printed circuits;
- FIG. 10 schematically shows an example of use of a device according to the invention, for cooling a detector
- - Figure 1 1 is a schematic transverse section of a capillary channel in a variant of the device shown in Figure 6;
- - Figure 12 is a schematic cross section of a gas transport channel surrounded by its associated capillary channels, in a variant of the device shown in Figure 6;
- FIG. 13 is a top view, in transparency, along a plane parallel to the main plane of a variant of the device corresponding to the embodiment shown in Figures 2 to 6, of a condenser part in this variant;
- - Figure 14 is a schematic cross section along the line B- B of Figure 13, of a branch, located in the. condenser portion shown in Figure 13; and - Figure 15 is a top view, in transparency, along a plane parallel to the main plane of a variant of the device corresponding to the embodiment shown in Figures 2 to 6, of a part forming 10
- a device according to the invention can be produced according to the method illustrated in FIG. 1.
- This method comprises a step of etching a grooves in blank sheets 1, a step of localized deposition b of an assembly material, a step of stacking c sheets previously prepared according to steps a and b, and a step mounting d to weld together the sheets stacked according to step c and form for example a heat pipe 50.
- a blank sheet 1 consists of a plate preferably with a thickness between 0.1 and 1 mm.
- the material of these sheets is for example a metal. It can be copper, nickel, iron, aluminum or even one of their alloys, such as aluminum-beryllium or stainless steel. The nature of the metal of the sheets depends on the active fluid used.
- the etching step a is preferably a chemical etching with a savings mask.
- the mask defines the areas of the grooves to be engraved. These grooves are differently etched on the base sheets 2, the intermediate sheets 3 and the upper sheets 4.
- This cutting step a can be carried out in several successive operations making it possible to selectively engrave, on the one hand, the areas etched all over the thickness 5 of a sheet, and on the other hand zones engraved on a smaller thickness.
- the zones engraved over the entire thickness 5 of the sheets are intended to provide gas transport channels 6.
- the zones engraved on a smaller thickness form a step between a first level 7, located on the upper surface of each sheet , and a second level 8. This step is intended for the formation of capillary channels 9.
- the chemical attack baths used for etching adapted to the nature of the material 11
- the zones engraved between the first 7 and second 8 levels are produced parallel to the zones engraved over the entire thickness 5 and over the entire length of the latter.
- These engraved zones up to the second level 5 are located on at least one edge of the engraved zones over the entire thickness 5, so as to pass, transversely with respect to the longitudinal direction of the channels 6, 9, from the first level 7, to the second level 8, then in the zones engraved over the entire thickness 5, without going back to the first level 7.
- holes 10 and scaffolds 11 are also engraved in the sheets, to pass pins 12 and sockets 13 or respectively plugs 14 (these elements are not shown in FIG. 1). Holes 10 and notches 11 are shown in FIGS. 2 to 5.
- the step of depositing b of an assembly material is carried out according to strips suitable for obtaining a tight assembly of the sheets 2, 3, 4 therebetween and a longitudinal separation of the gas channels 6, while maintaining communication of the gas channels 6 with one another, at the ends thereof.
- this assembly material is also preferably a metal.
- this metal is deposited by electroplating, with a geometry determined by a savings mask. The metal thus deposited is suitable for the type of mounting envisaged. This metal deposition 15 can be different depending on whether the subsequent mounting step is carried out, for example, by thermo-compression or by brazing. This metal is also chosen according to the nature of the material of the sheets 2, 3, 4.
- the deposition metal must have a melting temperature lower than that of the metal constituting the sheets. 2, 3, 4.
- copper sheets 2, 3, 4 gold and silver can be used for diffusion brazing.
- the nature of the metal deposited also depends on the active fluid used. For example, when 12
- the deposited metal can be copper or silver.
- the thickness of the deposited metal is typically between 5 and 10 ⁇ m.
- the metal deposition 15 is carried out, on the upper face of the sheets, at the edge of the assembly formed by an area etched over the entire thickness 5 and at least one capillary channel 9, on either side of this assembly ( Figures 2 and 4).
- the metal deposit 15 is also made on the periphery of the sheets ( Figures 2 and 4).
- the metal is deposited in small quantities so that it does not come to fill, during assembly, the zones intended to form the capillary channels 9.
- the thickness of the metal deposit 15 is 5 to 10 ⁇ m.
- the stacking step c of the sheets, previously prepared according to steps a and b, is for example carried out by successively vertically placing three intermediate sheets 3 on a base sheet 2 and an upper sheet 4 on the intermediate sheet 3 from above.
- the sheets 2, 3, 4 are stacked, according to step c, presenting the engraved areas up to the second level 8, facing upwards.
- the zones engraved over the entire thickness 5 are placed opposite one another and define the gas transport channels 6.
- the zones engraved up to the second level 8 are covered by the sheet which is immediately above it , they constitute capillary channels 9.
- the stack of sheets 2, 3, 4 defines a heat pipe 50. As shown in FIG.
- this heat pipe 50 can also be placed on a support 16 ( tools) and cover the whole with a sheet 17 making it possible to isolate the heat pipe 50 from the weights required for assembly.
- the pins 12 are optionally arranged in the holes 10, so as to keep the sheets strictly aligned during the subsequent step of mounting d
- the mounting step d is preferably carried out by brazing.
- the brazing metal forms a liquid phase which wets the areas on which it is deposited and the areas of the adjacent sheet, located opposite them. It thus ensures the connection of the pressed sheets one on the other to ensure contact.
- This soldering can be 13
- Caps 13 and plugs 14 are arranged in the orifices produced by superposition of the notches 11.
- the biphasic fluid is introduced into the evaporator, using the pipes 13 before these are closed.
- the fluid used depends on the intended operating temperature range. It can be H 2 0, NH 3 , acetone, "Freon”, methane, ethane, etc.
- the mounting step c is carried out by brazing. It can also be carried out by thermo-compression. In this case, it is preferably carried out under vacuum to avoid passivation of the surface, by fixing non-metallic compounds (O 2 , N 2 , H 2 O, volatile fats, etc.).
- the thermo-compression temperature is located approximately 50 ° C below the melting temperature of the metal deposited in step b.
- the pressure exerted on the areas to be welded is approximately 0.1 N / mm 2 .
- It is a heat pipe 50. It comprises a basic sheet 2, three intermediate sheets 3 and an upper sheet 4.
- the base sheet 2 has an elongated shape. It has an overall size of 215 mm long, 69 mm wide and 0.25 mm thick. It includes engraved zones from the first level 7 to the second level 8. The distance between the first 1 and second 8 levels is 70 ⁇ m. The width of these areas is approximately 1 mm. A metal deposit 15 is made, on the first level 7, on the periphery of the sheet and along equidistant lines, 14
- the intermediate sheets 3 have the same shape as the basic sheet 2. They also have an overall size of 215 mm long, 69 mm wide, but a thickness of 200 microns.
- an intermediate sheet comprises zones engraved over its entire thickness 5. These zones are located at its longitudinal ends to form holes 10, at the ends of its longitudinal edges to form notches 11 and at the level of equidistant parallel and generally longitudinal lines. The latter are seven in number and are intended to form gas transport channels 6. The three most central lines are longer than the others and are extended deeper in the area between the two notches 11 arranged on the two edges opposite longitudinal of the intermediate sheet 3. All these lines lead, at each of their ends, to a zone which is transverse to them and engraved from the first level 7 to the second level 8. Thus, these zones engraved from the first level 7 to the second level 8 define capillary zones, which when bathed in the liquid phase of the fluid condensed at this level, redistribute the liquid in all the capillary channels 9.
- an intermediate sheet 3 also includes engraved zones from the first level 7 to the second level 8.
- the distance between the first 7 and second 8 levels is 70 ⁇ m.
- zones are engraved up to the second level 8, while leaving on the periphery and between each channel 6, non-engraved zones, at the first level 7.
- the areas engraved up to the second level 8 communicate with each other and with the notches 11.
- the metal deposition 15 is carried out at the periphery of the sheet and according to 15
- an upper sheet 4 has an elongated shape, identical to that of the basic sheet 2 and of the intermediate sheets 3. Its overall length and width are identical to those of the basic sheets 2 and of the intermediate 3. Its thickness is 200 ⁇ m. It comprises two holes 10 at each of its longitudinal ends.
- a base sheet 2, three intermediate sheets 3 and an upper sheet 4 are assembled, for example according to the method described above, to form a heat pipe 50 having a thickness of the order of a millimeter (Fig. 6a).
- This heat pipe 50 comprises seven gas transport channels 6. Eight capillary channels 9 open onto each gas transport channel 6 (FIG. 6b), or 56 capillary channels 9 in all.
- Each capillary channel 9 has a section of approximately 70 ⁇ m by 1 mm.
- the ribs of the stacked structure schematically shown in Figure 6, are not to scale.
- FIG. 6a in particular, has a very dilated scale in the direction perpendicular to the plane of the sheets, to reveal the capillary channels 9.
- this heat pipe 50 is provided with pipes
- the support 16 consists of a plate 220 mm long, 76 mm wide and 10 mm thick.
- the sheet 17 has an overall length and width of 219 and 73 mm, respectively. Its thickness is 1 mm.
- the heat pipe 50 is held on the support 16 with the sheet 17 by means of pins 12. It is loaded with weights isolated from the sheet 17 by shims in 16
- alumina which make it possible to avoid welding the weights on the sheet 17.
- a device can, for example, include more intermediate sheets 3.
- the number of sheets stacked to form a heat pipe 50 can be 10 or 20.
- the capillary channels 9 intended for transporting the phase liquid of the fluid by capillarity and the gas transport channels 6 can be produced in different ways.
- a heat pipe 50 has been described above with a capillary channel 9 located on either side of each zone etched over the entire thickness 5 of the sheets.
- a capillary channel 9 may only be provided on one side of each zone etched over the entire thickness 5. It is also possible to superpose several heat pipes 50, one on top of the other.
- the devices described above include metal sheets, but one will not depart from the spirit of the invention if the sheets are made of plastic, composite material, etc.
- the assembly material is then chosen accordingly. It can be a polymer adhesive, for example. It can even be envisaged to make welds between the sheets, by fusion, without assembly material.
- the capillary channels 9 of which are formed by chemical etching of grooves in a sheet. But it can also be envisaged to produce these grooves by depositing an extra thickness material on the sheets.
- Devices according to the invention can find numerous applications in space thermal, avionics, electronics, data processing, etc.
- heat pipes 50 arranged on electronic circuits 20 make it possible to cool hot zones 21 on which are installed components 22, heat generators, by transporting the heat to return zones 23, even s '' orifices or other components must be bypassed 22.
- a printed circuit 20 made of epoxy resin can be glued, flat on each main face of a heat pipe 50, by sandwiching the latter.
- the gas 6 and capillary 9 transport channels of the heat pipe 50 directly transfer the heat, from the areas of the printed circuit 20 where components 22 are to be cooled, to a heat exchanger rack 40 or a radiator.
- a thermal clamp 41 conducts the heat between the heat pipe 50 and the rack 40 or the radiator.
- the heat pipe 50 therefore plays the role here of support for the printed circuit 20 in addition to its function of thermal conductor.
- a heat pipe 50 can be configured as a bellows, for example to cool a mobile detector 30. It suffices to place this bellows so as to have folds of this bellows perpendicular to the plane in which they take place. both the movement generated by a vertical displacement device 31 and the movement generated by a horizontal displacement device 32, the heat pipe 50 connecting the detector 30 to a heat return element 33.
- the importance of the first and third components are a consequence of the low thermal conductivity of the fluid and of the concentration of the flow in the vicinity of the limit between capillary channels 9 and gas transport channels 6.
- the second component is the only one fundamentally linked to the process physical generator of the operation of the device according to the invention, in its heat pipe function.
- a capillary channel 9 has an overall U shape with two parallel side walls 25 corresponding to the branches of the U and a bottom wall 26.
- the bottom wall 26 is perpendicular to the side walls 25 between which it s extends.
- each side wall 25 has a longitudinal edge linked to the bottom wall 26 and a free longitudinal edge 27 or 28 parallel to the previous edge.
- e is the thickness of fluid ensuring thermal conduction (the thickness e is equal to half the width of the capillary channel 9 in it and decreases as one moves away from the bottom wall 26, from one free edge to the other).
- the increase in the areas of evaporation S and of condensation makes it possible to reduce the first and third components mentioned of the temperature differential between the hot source and the cold source, thanks to a reduction in the concentration of the flux in the vicinity of the limit between the capillary channel 9 and the gas transport channel 6.
- the different capillary channels 9 can all have 20
- the offset between the free longitudinal edges 27, 28 can be variable or constant over the entire length of the capillary channel 9.
- a device according to the present invention consisting of several intermediate sheets 3, it is advantageous to minimize the heat conduction paths in the mass of the base sheets 2, intermediate 3 and upper 4, between the face of the base sheet 2 or that of the upper sheet 4 and the side walls 25 and bottom 26 of each capillary channel 9.
- an arrangement and a stack of sheets 2, 3, 4 so as to form a gas transport channel 6 whose transverse section is generally triangular, with free longitudinal edges 27, 28 in steps, constitutes a configuration which makes it possible to minimize the heat conduction paths mentioned above.
- the heat collection and transfer systems which serve as heat sinks generally only allow the heat to be removed in the form of a very low heat flux, at the level of the exchange surface between the device and these collection and heat transfer systems. So to increase the heat power exchanged, it is necessary to increase this exchange surface.
- All of the ramifications 52 opening into a conduit 51 must have a total section of capillary channels 9 sufficient to that all of the condensed fluid can return by capillarity, from the cold source to the hot source, in the various capillary channels 9 of the conduits 51 located between these two sources.
- the total section of these different capillary channels 9 of the different branches 52 opening into a conduit 51 is equal to that of all of the capillary channels 9 of this conduit 51.
- the set of ramifications 52 constitutes a condenser.
- the capillary channels 9 of each branch are advantageously superposed on each other so that the longitudinal free edges 26, 27 are offset from one another, as described above, in order to '' increase the condensation surface.
- an arrangement and a stacking of the sheets 2, 3, 4 so as to form a triangular gas transport channel 6, at the level of the branches 52 constitutes an advantageous configuration which makes it possible to minimize the conduction paths mentioned above. As indicated by the arrows, in this figure, the heat flux is very distributed.
- the device according to the invention to function properly, it is necessary to fill it with heat transfer fluid with precision. Indeed, - if the filling was too low, part of the capillary channels
- the invention forming the condenser, which also made it inoperative.
- the volume of the capillary part is of the same order of magnitude as that corresponding to the gas transport channels 6.
- the filling is done with a fluid "under vacuum", that is to say under the only saturated vapor pressure. This favors the appearance of vapor bubbles almost everywhere in the filling circuit. Handling the liquid phase of the heat transfer fluid, in small quantities, is therefore very delicate. Therefore, the filling accuracy is no better than plus or minus ten percent, relative to the target amount of liquid fluid. Which is still not enough to avoid the problems mentioned above.
- the Applicant proposes to arrange at least one reservoir 54 having a volume comparable to that of a gas transport channel 6 and onto which open out capillary channels 9, which put it in communication with the rest of the device according to the invention.
- the volume of the whole of the reservoir (s) 54 must preferably be approximately equal to twenty percent of the quantity of liquid fluid, intended for filling the device according to the invention, that is to say also approximately twenty for cent of the capillary volume of the device according to the invention.
- the reservoir 54 constitutes a reserve but also makes it possible to accommodate the excess fluid.
- Each reservoir 54 must be located in the cold part of the device according to the invention. But it should not be located at the coldest point, because if it did, it would help to reduce the capillary pressure bringing the liquefied fluid from the part of the device according to the invention forming the condenser to that forming the evaporator.
- each reservoir 54 is kept cold by the contact of the device according to the invention with the external cold source. Not being heated by the circulation of gas, it is cooler than the ramifications 52 of the condenser. However, being in 23
- Figure 15 illustrates such an arrangement.
- a set of two reservoirs 54 is located between two sets of two ramifications 52.
- Each reservoir 54 is surrounded by a zone of capillary channels 9, opening onto the manifold 53 communicating with the four ramifications 52.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9803902 | 1998-03-30 | ||
FR9803902A FR2776763B1 (fr) | 1998-03-30 | 1998-03-30 | Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif |
FR9814462 | 1998-11-18 | ||
FR9814462A FR2776764B1 (fr) | 1998-03-30 | 1998-11-18 | Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif |
PCT/FR1999/000722 WO1999050607A1 (fr) | 1998-03-30 | 1999-03-29 | Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1068481A1 true EP1068481A1 (fr) | 2001-01-17 |
EP1068481B1 EP1068481B1 (fr) | 2003-09-03 |
Family
ID=26234224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99910447A Expired - Lifetime EP1068481B1 (fr) | 1998-03-30 | 1999-03-29 | Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1068481B1 (fr) |
DE (1) | DE69910996T2 (fr) |
FR (1) | FR2776764B1 (fr) |
WO (1) | WO1999050607A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2803908B1 (fr) * | 2000-01-13 | 2002-08-23 | Atmostat Etudes Et Rech S | Procede de fabrication de dispositifs de transfert thermique et dispositifs obtenus par ce procede |
JP2004506095A (ja) * | 2000-08-10 | 2004-02-26 | アトモスタット エチュード エ ルシェルシュ | 含浸、塗装または接着用の微小細孔のある表面を有するベリリウム−アルミニウム複合材料 |
US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
FR3080172B1 (fr) * | 2018-04-11 | 2020-05-08 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Caloduc a pompage capillaire a rainures reentrantes offrant un fonctionnement ameliore |
CN108568703B (zh) * | 2018-04-20 | 2020-10-27 | 西安交通大学 | 一种用于高速电主轴转轴表面冷却的柔性热管 |
JP2022016147A (ja) * | 2020-07-10 | 2022-01-21 | 尼得科超▲しゅう▼科技股▲ふん▼有限公司 | 熱伝導部材 |
FR3138942B1 (fr) * | 2022-08-17 | 2024-08-16 | Commissariat Energie Atomique | Caloduc de type à pompage capillaire, à rainures réentrantes intégrant au moins un substrat poreux à l’évaporateur. |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019098A (en) * | 1974-11-25 | 1977-04-19 | Sundstrand Corporation | Heat pipe cooling system for electronic devices |
US4602679A (en) * | 1982-03-22 | 1986-07-29 | Grumman Aerospace Corporation | Capillary-pumped heat transfer panel and system |
DE3402003A1 (de) * | 1984-01-21 | 1985-07-25 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul |
US5309457A (en) * | 1992-12-22 | 1994-05-03 | Minch Richard B | Micro-heatpipe cooled laser diode array |
US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
DE19626227C2 (de) * | 1996-06-29 | 1998-07-02 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
-
1998
- 1998-11-18 FR FR9814462A patent/FR2776764B1/fr not_active Expired - Fee Related
-
1999
- 1999-03-29 EP EP99910447A patent/EP1068481B1/fr not_active Expired - Lifetime
- 1999-03-29 DE DE69910996T patent/DE69910996T2/de not_active Expired - Fee Related
- 1999-03-29 WO PCT/FR1999/000722 patent/WO1999050607A1/fr active IP Right Grant
Non-Patent Citations (1)
Title |
---|
See references of WO9950607A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE69910996T2 (de) | 2004-07-22 |
WO1999050607A1 (fr) | 1999-10-07 |
FR2776764A1 (fr) | 1999-10-01 |
DE69910996D1 (de) | 2003-10-09 |
EP1068481B1 (fr) | 2003-09-03 |
FR2776764B1 (fr) | 2000-06-30 |
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