EP1040365B1 - Ultrasound sensor - Google Patents
Ultrasound sensor Download PDFInfo
- Publication number
- EP1040365B1 EP1040365B1 EP98965114A EP98965114A EP1040365B1 EP 1040365 B1 EP1040365 B1 EP 1040365B1 EP 98965114 A EP98965114 A EP 98965114A EP 98965114 A EP98965114 A EP 98965114A EP 1040365 B1 EP1040365 B1 EP 1040365B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- ultrasonic sensor
- sensor according
- hood
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002604 ultrasonography Methods 0.000 title description 3
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000004382 potting Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- AOSZTAHDEDLTLQ-AZKQZHLXSA-N (1S,2S,4R,8S,9S,11S,12R,13S,19S)-6-[(3-chlorophenyl)methyl]-12,19-difluoro-11-hydroxy-8-(2-hydroxyacetyl)-9,13-dimethyl-6-azapentacyclo[10.8.0.02,9.04,8.013,18]icosa-14,17-dien-16-one Chemical compound C([C@@H]1C[C@H]2[C@H]3[C@]([C@]4(C=CC(=O)C=C4[C@@H](F)C3)C)(F)[C@@H](O)C[C@@]2([C@@]1(C1)C(=O)CO)C)N1CC1=CC=CC(Cl)=C1 AOSZTAHDEDLTLQ-AZKQZHLXSA-N 0.000 description 1
- KKQWHYGECTYFIA-UHFFFAOYSA-N 2,5-dichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1 KKQWHYGECTYFIA-UHFFFAOYSA-N 0.000 description 1
- 229940126657 Compound 17 Drugs 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
- G10K9/122—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
- G10K9/22—Mountings; Casings
Definitions
- the invention relates to an ultrasonic sensor, consisting of a housing with a Connector, an ultrasonic transducer and a circuit board.
- a piezo transducer in which one is made of an elastic one Material formed plug is inserted into a housing.
- the plug carries on the one hand an ultrasonic transducer and on the other hand a circuit board.
- An electrical contact too the printed circuit board is made via a plug arranged on the outer housing.
- From the DE 36 218 19 A1 discloses a device for measuring the air gap in which a fan creates an air flow around a sensor and the air is driven through an outlet nozzle.
- a sensor is arranged on a holding sieve, which is used to measure the distance in the air flow.
- the holding sieve is inside one Housing arranged, the sensor and a circuit board supported by the retaining screen be next to a connector contact on an end wall of the housing Air inlet openings is arranged.
- Ultrasonic sensors used in the automotive industry for distance measurement are usually with a potting compound against harmful external influences sealed.
- the sensors are manufactured in a complex riser casting process potted and cured in the oven.
- Pot-like ultrasonic transducers are used, which consist of an annular wall and a membrane-like floor.
- the object of the present invention is to provide an ultrasonic sensor which is compact and can be assembled and cast easily and cheaply.
- the housing is divided into a carrier and a hood enclosing the carrier and in that the carrier the circuit board, the plug connection and carries the ultrasound transducer.
- the ultrasonic sensor completely with Potting compound filled and tight. So he is against protected from external influences.
- Another advantageous embodiment of the Ultrasonic sensor according to the invention is that the PCB mounted on the carrier with switching elements not yet installed hood is accessible from both sides. you the circuit on the circuit board can thus easily adjust and check and any corrections easily carry out.
- the carrier has an annular receptacle for the Ultrasonic transducer and that the connector on Carrier is formed, the plug connection with the Recording is connected by webs.
- the carrier can thus can be loaded very easily, because the already assembled Parts of the ultrasonic sensor during assembly of the remaining parts are fixed to the carrier.
- Another advantageous embodiment of the invention is that two webs are formed on the side of the carrier and the circuit board is mounted in between. The This makes the ultrasonic sensor very compact, and that PCB is mechanically well protected.
- the hood is slid over the carrier along the webs.
- the potting process is simplified because the hood remains fixed during pouring and does not slip can.
- the hood itself at two abutting Sides is open. This eliminates the time-consuming process Rising molding process of conventional sensors; the Ultrasound sensor can easily be assembled by be shed at the top.
- Another advantageous embodiment of the invention is that an open side of the hood by one flange formed on the support is closed. The simplifies production, since the potting compound during the Curing requires no further form. It also results a mechanically durable connection.
- the ultrasonic transducer with a Cap is fixed to the carrier. That makes it easier also the assembly, since the ultrasonic transducer is included is fixed, and provides a sealed connection to the Carrier.
- the ultrasonic sensor shown consists of a Ultrasonic transducer 1 with an elastic decoupling ring 2 and a cap 3.
- the converter itself contains a mechanism by which ultrasonic waves are emitted electrical signals generated and received and in electrical signals can be implemented. Since it is the ultrasonic transducer around a sensitive vibrating System, it must be from the rest of the ultrasonic sensor decoupled and vibration-damped in the ultrasonic sensor be stored. For this, the decoupling ring 2 intended. In addition to the sealing function, it also performs the Damping unwanted vibrations.
- the carrier 4 consists of a plug connection 5, one annular receptacle 6 for the ultrasonic transducer 1 with a locking groove 7 for the cap 3 and two Crosspieces 8, the recording 6 of the Connect the ultrasonic transducer 1 to the connector 5.
- the ultrasonic sensor is in one state shown in which it is completely pre-assembled.
- the Ultrasonic transducer 1 is in its cap 3 Recording 6 attached to the carrier 4.
- the circuit board 9 is with the connecting lines of the ultrasonic transducer 12 and Plug connection 13 connected and fixed in the carrier 4.
- the potting compound 17 (Fig. 3) fills all cavities in and around the ultrasonic transducer PCB around and ensures a mechanical durable and tight encapsulation of the ultrasonic sensor.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
Die Erfindung betrifft einen Ultraschallsensor, bestehend aus einem Gehäuse mit einer Steckverbindung, einem Ultraschallwandler und einer Leiterplatte.The invention relates to an ultrasonic sensor, consisting of a housing with a Connector, an ultrasonic transducer and a circuit board.
Aus der DE 43 290 55 A1 ist ein Piezowandler bekannt, bei der ein aus einem elastischen Material gebildeter Stopfen in ein Gehäuse eingesetzt ist. Der Stopfen trägt einerseits einen Ultraschallwandler und andererseits eine Leiterplatte. Ein elektrischer Kontakt zu der Leiterplatte erfolgt über ein an dem äußeren Gehäuse angeordneten Stecker. Aus der DE 36 218 19 A1 ist eine Vorrichtung zur Luftabstandsmessung bekannt, bei der durch einen Ventilator eine Luftströmung um einen Sensor herum erzeugt wird und die Luft durch eine Austrittsdüse getrieben wird. An einem Haltesieb ist ein Sensor angeordnet, der zur Abstandsmessung in der Luftströmung dient. Das Haltesieb ist im Inneren eines Gehäuses angeordnet, wobei der Sensor und eine Leiterplatte von dem Haltesieb getragen werden, während ein Steckerkontakt an einer Abschlusswand des Gehäuses neben Lufteintrittsöffnungen angeordnet ist.From DE 43 290 55 A1, a piezo transducer is known in which one is made of an elastic one Material formed plug is inserted into a housing. The plug carries on the one hand an ultrasonic transducer and on the other hand a circuit board. An electrical contact too the printed circuit board is made via a plug arranged on the outer housing. From the DE 36 218 19 A1 discloses a device for measuring the air gap in which a fan creates an air flow around a sensor and the air is driven through an outlet nozzle. A sensor is arranged on a holding sieve, which is used to measure the distance in the air flow. The holding sieve is inside one Housing arranged, the sensor and a circuit board supported by the retaining screen be next to a connector contact on an end wall of the housing Air inlet openings is arranged.
Ultraschallsensaren, die in der Automobilindustrie zur Abstandsmessung verwendet werden, sind üblicherweise mit einer Vergussmasse gegen schädliche äußere Einflüsse abgedichtet. Die Sensoren werden dafür in einem aufwendigen Steiggussverfahren vergossen und im Ofen ausgehärtet. In modernen Ultraschallsensoren werden vielfach topfartige Ultraschallwandler eingesetzt, die aus einer ringförmigen Wand und einem membranartigen Boden bestehen.Ultrasonic sensors used in the automotive industry for distance measurement are usually with a potting compound against harmful external influences sealed. For this purpose, the sensors are manufactured in a complex riser casting process potted and cured in the oven. In modern ultrasonic sensors, there are many Pot-like ultrasonic transducers are used, which consist of an annular wall and a membrane-like floor.
Aufgabe der vorliegenden Erfindung ist es, einen Ultraschallsensor anzugeben, der kompakt ist und der einfach und billig montiert und vergossen werden kann.The object of the present invention is to provide an ultrasonic sensor which is compact and can be assembled and cast easily and cheaply.
Diese Aufgabe wird bei dem erfindungsgemäßen Ultraschallsensor dadurch gelöst, dass
das Gehäuse in einen Träger und eine den Träger umschließende Haube unterteilt ist und
dass der Träger die Leiterplatte, die Steckverbindung
und den Ultraschallwandler trägt. Das hat den Vorteil, daß
alle Bauteile auch nach dem Vormontieren frei zugänglich
sind und geprüft werden können.This object is achieved in the ultrasonic sensor according to the invention in that the housing is divided into a carrier and a hood enclosing the carrier and in that the carrier the circuit board, the plug connection
and carries the ultrasound transducer. This has the advantage that all components are freely accessible and can be checked even after preassembly.
Vorzugsweise ist bei der Ausgestaltung der Erfindung vorgesehen, daß der Ultraschallsensor vollständig mit Vergußmasse ausgefüllt und dicht ist. Damit ist er gegen äußere Einflüsse geschützt.Preferably in the configuration of the invention provided that the ultrasonic sensor completely with Potting compound filled and tight. So he is against protected from external influences.
Eine weitere vorteilhafte Ausgestaltung des erfindungsgemäßen Ultraschallsensors besteht darin, daß die an dem Träger montierte Leiterplatte mit Schaltelementen bei noch nicht montierter Haube beidseitig zugänglich ist. Man kann die Schaltung auf der Leiterplatte somit leicht abgleichen und prüfen und eventuelle Korrekturen leicht durchführen.Another advantageous embodiment of the Ultrasonic sensor according to the invention is that the PCB mounted on the carrier with switching elements not yet installed hood is accessible from both sides. you the circuit on the circuit board can thus easily adjust and check and any corrections easily carry out.
Bei einem Ausführungsbeispiel der Erfindung ist vorgesehen, daß der Träger eine ringförmige Aufnahme für den Ultraschallwandler besitzt und daß die Steckverbindung am Träger angeformt ist, wobei die Steckverbindung mit der Aufnahme durch Stege verbunden ist. Der Träger kann somit sehr einfach bestückt werden, da die bereits montierten Teile des Ultraschallsensors während der Montage der restlichen Teile am Träger fixiert sind.In one embodiment of the invention, that the carrier has an annular receptacle for the Ultrasonic transducer and that the connector on Carrier is formed, the plug connection with the Recording is connected by webs. The carrier can thus can be loaded very easily, because the already assembled Parts of the ultrasonic sensor during assembly of the remaining parts are fixed to the carrier.
Eine weitere vorteilhafte Ausgestaltung der Erfindung besteht darin, daß zwei Stege seitlich am Träger angeformt sind und die Leiterplatte dazwischen montiert ist. Der Ultraschallsensor wird dadurch sehr kompakt, und die Leiterplatte ist mechanisch gut geschützt.Another advantageous embodiment of the invention is that two webs are formed on the side of the carrier and the circuit board is mounted in between. The This makes the ultrasonic sensor very compact, and that PCB is mechanically well protected.
Bei einer Ausführungsform der Erfindung ist vorgesehen, daß die Haube entlang der Stege über den Träger geschoben ist. Der Vergießprozeß vereinfacht sich dadurch, da die Haube während des Vergießens fixiert bleibt und nicht verrutschen kann.In one embodiment of the invention it is provided that the hood is slid over the carrier along the webs. The potting process is simplified because the hood remains fixed during pouring and does not slip can.
Bei einer weiteren Ausführungsform der Erfindung ist vorgesehen, daß die Haube selbst an zwei aneinanderstoßenden Seiten offen ist. Dadurch entfällt der aufwendige Steigvergußprozeß herkömmlicher Sensoren; der Ultraschallsensor kann nach dem Zusammensetzen einfach von oben vergossen werden.In another embodiment of the invention provided that the hood itself at two abutting Sides is open. This eliminates the time-consuming process Rising molding process of conventional sensors; the Ultrasound sensor can easily be assembled by be shed at the top.
Eine weitere vorteilhafte Ausgestaltung der Erfindung besteht darin, daß eine offene Seite der Haube durch einen am Träger angeformten Flansch verschlossen ist. Das vereinfacht die Herstellung, da die Vergußmasse während des Aushärtens keiner weiteren Form bedarf. Außerdem ergibt sich eine mechanisch haltbare Verbindung.Another advantageous embodiment of the invention is that an open side of the hood by one flange formed on the support is closed. The simplifies production, since the potting compound during the Curing requires no further form. It also results a mechanically durable connection.
Bei einer vorteilhaften Ausführungsform der Erfindung ist vorgesehen, daß der Ultraschallwandler mit einer Überwurfkappe an dem Träger fixiert ist. Das erleichtert ebenfalls die Montage, da der Ultraschallwandler dabei fixiert ist, und sorgt für eine abgedichtete Verbindung zum Träger.In an advantageous embodiment of the invention provided that the ultrasonic transducer with a Cap is fixed to the carrier. That makes it easier also the assembly, since the ultrasonic transducer is included is fixed, and provides a sealed connection to the Carrier.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung anhand mehrerer Figuren dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigt:
- Fig. 1
- als Explosionszeichnung die Einzelteile eines kompletten Ultraschallsensors,
- Fig. 2
- den vormontierten Ultraschallsensor vor dem Aufschieben der Haube auf den Träger und
- Fig. 3
- den fertigen Ultraschallsensor.
- Fig. 1
- as an exploded view the individual parts of a complete ultrasonic sensor,
- Fig. 2
- the pre-assembled ultrasonic sensor before sliding the hood onto the carrier and
- Fig. 3
- the finished ultrasonic sensor.
Gleiche Teile sind in den Figuren mit gleichen Bezugszeichen versehen. Die Figuren zeigen das Ausführungsbeispiel in verschiedenen Montagezuständen. Die Abstrahl- und Empfangsseite ist jeweils links.Identical parts are given the same reference symbols in the figures Mistake. The figures show the embodiment in different assembly states. The radiation and The reception side is on the left.
Der dargestellte Ultraschallsensor besteht aus einem
Ultraschallwandler 1 mit einem elastischen Entkopplungsring
2 und einer Überwurfkappe 3. Der Wandler selbst enthält
einen Mechanismus, mit dem Ultraschallwellen aus
elektrischen Signalen erzeugt und empfangen und in
elektrische Signale umgesetzt werden können. Da es sich bei
dem Ultraschallwandler um ein empfindliches schwingendes
System handelt, muß er vom restlichen Ultraschallsensor
entkoppelt und schwingungsgedämpft im Ultraschallsensor
gelagert werden. Hierfür ist der Entkopplungsring 2
vorgesehen. Er übernimmt neben der Dichtfunktion auch die
Dämpfung unerwünschter Schwingungen.The ultrasonic sensor shown consists of a
Der Träger 4 besteht aus einer Steckverbindung 5, einer
ringförmigen Aufnahme 6 für den Ultraschallwandler 1 mit
einer Rastnut 7 für die Überwurfkappe 3 und aus zwei
Verbindungsstegen 8, die die Aufnahme 6 des
Ultraschallwandlers 1 mit der Steckverbindung 5 verbinden.
Nach der Montage des Ultraschallwandlers 1 und der
Leiterplatte 9 wird der Träger 4 - wie eine Schublade - in
die Haube 10 geschoben, bis zu einem Flansch 11, der die
Haube nach einer Seite verschließt. Ferner sind noch
Durchführungen für den Ultraschallwandler 1 in der
Überwurfkappe 14 und im Träger 15 sowie ein Raststeg 16 in
der Überwurfkappe 1 dargestellt.The carrier 4 consists of a
In Fig. 2 ist der Ultraschallsensor in einem Zustand
dargestellt, in dem er komplett vormontiert ist. Der
Ultraschallwandler 1 ist mit der Überwurfkappe 3 in seiner
Aufnahme 6 am Träger 4 befestigt. Die Leiterplatte 9 ist mit
den Anschlußleitungen des Ultraschallwandlers 12 und der
Steckverbindung 13 verbunden und im Träger 4 fixiert.2, the ultrasonic sensor is in one state
shown in which it is completely pre-assembled. The
Nach dem Prüfen und Abgleichen der Schaltung auf der
Leiterplatte 9 wird die Haube 10 über den Träger 4
geschoben, und der Ultraschallsensor wird vollständig mit
Vergußmasse gefüllt, so daß er dicht gegenüber
Umwelteinflüssen wird. Die Vergußmasse 17 (Fig. 3) füllt
sämtliche Hohlräume im Ultraschallwandler und um die
Leiterplatte herum aus und sorgt für eine mechanisch
haltbare und dichte Verkapselung des Ultraschallsensors.After checking and adjusting the circuit on the
Printed
Claims (9)
- Ultrasonic sensor comprising a housing with a plug-in connection (5), an ultrasonic transducer (1) and a printed circuit board (9), the housing being subdivided into a carrier (4) and a hood (10) surrounding the carrier, and the carrier (4) supporting the printed circuit board (a), the plug-in connection (5) and the ultrasonic transducer (1).
- Ultrasonic sensor according to Claim 1, characterized in that the ultrasonic sensor is filled up completely with setting compound and is tight.
- Ultrasonic sensor according to one of Claims 1 or 2, characterized in that the printed circuit board (9) mounted on the carrier (4) is accessible on both sides with the aid of switching elements with the hood (10) not yet mounted.
- Ultrasonic sensor according to one of the preceding claims, characterized in that the carrier (4) has an annular holder (6) for the ultrasonic transducer (1), and in that the plug-in connection (5) is integrally formed on the carrier (4), the plug-in connection (5) being connected to the holder (6) by webs (8).
- Ultrasonic sensor according to Claim 4, characterized in that two webs (8) are integrally formed laterally on the carrier (4), and the printed circuit board (9) is mounted therebetween.
- Ultrasonic sensor according to one of Claims 4 or 5, characterized in that the hood (10) is pushed over the carrier (4) along the webs (8).
- Ultrasonic sensor according to one of the preceding claims, characterized in that the hood (10) itself is open on two abutting sides.
- Ultrasonic sensor according to Claim 7, characterized in that one open side of the hood (10) is sealed by a flange (11) integrally formed on the carrier (4).
- Ultrasonic sensor according to one of the preceding claims, characterized in that the ultrasonic transducer is fixed on the carrier (4) with the aid of a sleeve cap (3).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19755729A DE19755729A1 (en) | 1997-12-15 | 1997-12-15 | Ultrasonic sensor |
DE19755729 | 1997-12-15 | ||
PCT/DE1998/003655 WO1999031526A1 (en) | 1997-12-15 | 1998-12-14 | Ultrasound sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1040365A1 EP1040365A1 (en) | 2000-10-04 |
EP1040365B1 true EP1040365B1 (en) | 2003-07-09 |
Family
ID=7851989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98965114A Expired - Lifetime EP1040365B1 (en) | 1997-12-15 | 1998-12-14 | Ultrasound sensor |
Country Status (4)
Country | Link |
---|---|
US (1) | US6532193B1 (en) |
EP (1) | EP1040365B1 (en) |
DE (2) | DE19755729A1 (en) |
WO (1) | WO1999031526A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10000924B4 (en) * | 2000-01-12 | 2011-11-24 | Volkswagen Ag | ultrasonic sensor |
US6982532B2 (en) * | 2003-12-08 | 2006-01-03 | A. O. Smith Corporation | Electric machine |
DE102005009620A1 (en) * | 2005-02-23 | 2006-08-31 | Valeo Schalter Und Sensoren Gmbh | Ultrasound sensor, for vehicle parking assistance apparatus, has separate coupling housing for electrical connector, allowing sensor housing to be combined with different coupling housings |
JP4438667B2 (en) * | 2005-03-29 | 2010-03-24 | 株式会社デンソー | Ultrasonic sensor and ultrasonic transducer |
DE102006007710A1 (en) * | 2006-02-14 | 2007-08-23 | Valeo Schalter Und Sensoren Gmbh | Sensor holder, in particular for mounting distance sensors on vehicle parts |
DE102006040344B4 (en) | 2006-08-29 | 2022-09-29 | Robert Bosch Gmbh | Holding device for an ultrasonic transducer |
JP5386910B2 (en) * | 2008-09-26 | 2014-01-15 | 株式会社デンソー | Electronic circuit equipment |
JP5607990B2 (en) * | 2010-05-14 | 2014-10-15 | パナソニック株式会社 | Ultrasonic sensor |
US8982578B2 (en) * | 2010-10-14 | 2015-03-17 | Tyco Electronics Corporation | Connector system and assembly having integrated protection circuitry |
JP2012198106A (en) * | 2011-03-22 | 2012-10-18 | Panasonic Corp | Ultrasonic sensor |
DE102017204600A1 (en) * | 2017-03-20 | 2018-09-20 | Robert Bosch Gmbh | A connector for connecting two housing parts and housings comprising two housing parts and at least one connector |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4281404A (en) | 1979-08-27 | 1981-07-28 | Morrow Electronics, Inc. | Depth finding apparatus |
JPH0453586Y2 (en) * | 1986-02-21 | 1992-12-16 | ||
DE3621819C2 (en) * | 1986-06-28 | 1995-05-18 | Mpv Mes Und Prueftechnik Vogt | Method and device for measuring airborne sound |
US4745893A (en) * | 1986-12-03 | 1988-05-24 | Caterpillar Inc. | Digital oil level sensor |
DE3933474C2 (en) * | 1989-10-06 | 1994-01-27 | Endress Hauser Gmbh Co | Level measuring device |
DE4329055A1 (en) * | 1993-08-28 | 1995-03-02 | Teves Gmbh Alfred | Pressure-tight converter for motor vehicles |
US5659423A (en) * | 1994-09-30 | 1997-08-19 | Donnelly Corporation | Modular variable reflectance mirror assembly |
US5617866A (en) | 1996-01-05 | 1997-04-08 | Acuson Corporation | Modular transducer system |
DE29603390U1 (en) * | 1996-02-24 | 1997-06-26 | Robert Bosch Gmbh, 70469 Stuttgart | Electronic control unit |
-
1997
- 1997-12-15 DE DE19755729A patent/DE19755729A1/en not_active Withdrawn
-
1998
- 1998-12-14 WO PCT/DE1998/003655 patent/WO1999031526A1/en active IP Right Grant
- 1998-12-14 EP EP98965114A patent/EP1040365B1/en not_active Expired - Lifetime
- 1998-12-14 US US09/581,957 patent/US6532193B1/en not_active Expired - Fee Related
- 1998-12-14 DE DE59809001T patent/DE59809001D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6532193B1 (en) | 2003-03-11 |
DE59809001D1 (en) | 2003-08-14 |
WO1999031526A1 (en) | 1999-06-24 |
DE19755729A1 (en) | 1999-06-17 |
EP1040365A1 (en) | 2000-10-04 |
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Legal Events
Date | Code | Title | Description |
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