EP0998370A1 - Procede et dispositif pour la production d'une matrice - Google Patents

Procede et dispositif pour la production d'une matrice

Info

Publication number
EP0998370A1
EP0998370A1 EP98941339A EP98941339A EP0998370A1 EP 0998370 A1 EP0998370 A1 EP 0998370A1 EP 98941339 A EP98941339 A EP 98941339A EP 98941339 A EP98941339 A EP 98941339A EP 0998370 A1 EP0998370 A1 EP 0998370A1
Authority
EP
European Patent Office
Prior art keywords
laser beam
engraving
cutting
die
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98941339A
Other languages
German (de)
English (en)
Inventor
Horst Ranke
Thomas Wolf
Klaus Renz
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LASERCOMB LASER COMBINATION SYSTEMS GMBH & CO. KG
Original Assignee
Lasercomb Laser-Kombinationssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lasercomb Laser-Kombinationssysteme GmbH filed Critical Lasercomb Laser-Kombinationssysteme GmbH
Publication of EP0998370A1 publication Critical patent/EP0998370A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
    • B23P15/406—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools rotary or plane die cutters

Definitions

  • the invention relates to a method for producing a punching die, in particular a punching die for the packaging industry, in which grooves are cut into a workpiece, in particular made of wood, for receiving cutting or grooving knives in one operation by means of a directed laser beam, and in another in one Work processes by means of a laser beam predetermined structures are engraved into the surface of the die, at least some of the structures clearly identifying and / or specifying the die.
  • the invention relates to a device for producing a die, in particular a die for the packaging industry, in which a laser beam emitted by a laser arrangement and focused on a workpiece, in particular by means of optics, in the workpiece for receiving cutting or grooving knives cuts, the workpiece being engraved with given structures for identification and / or specification.
  • CO 2 lasers are preferably used for this.
  • CO 2 lasers have also been used to cut dies that are used in the packaging industry.
  • either the laser beam focused via an optical system moves over a motionless surface or the material to be cut or treated moves on a cross table that can be moved in the X and Y directions under a focused, but stationary, laser beam.
  • grooves are cut with high precision in specially glued wooden boards, the grooves representing the development contour of a package to be subsequently punched.
  • the cutting process uses cutting or creasing knives in these grooves, which act as punching or creasing in the subsequent process.
  • the present invention is based on the object of developing the method and the device specified at the outset in such a way that the marking of machined workpieces or other materials, also with regard to extensive information and detailed information is possible without affecting the actual workflow, especially with regard to the processing time.
  • This object is achieved in the specified method in that a controllable scanner with mirrors and an auxiliary deflecting mirror are provided, with the auxiliary deflecting mirror emitting the laser beam emitted by the laser arrangement during an interruption of the cutting in order to engrave the predetermined structures into a surface of the workpiece leads to the scanner.
  • this object is achieved in that a controllable scanner with mirrors and an auxiliary deflecting mirror are provided, with the auxiliary deflecting mirror emitting the laser beam emitted by the laser arrangement during an interruption of the laser beam in order to engrave the specified structures into a surface of the workpiece Cutting leads to the scanner.
  • a scanner is used as an additional unit, which is used on a conventional laser system to carry out the desired engraving process in a very short time.
  • the periods are used for which the first operation, during which the cutting die is cut by means of a laser beam, is interrupted, for example in order to pivot the workpiece or the cutting die or the laser beam or the corresponding optical arrangement, in order to turn the cutting beam on another place on the die or to continue the cutting process there.
  • a subsidiary reflecting mirror is introduced, which guides the laser beam to the scanner (scanning device) where the laser beam is then used to make the engraving.
  • Scanners are systems that, simply represented, consist of a lens and two tiltable mirrors. The two mirrors are controlled so that the laser beam can be moved back and forth on a plane that corresponds to the surface of the die to be machined.
  • Such a scanner can carry out engravings on the surface of the workpiece using a corresponding program that is stored in a PC (personal computer).
  • PC personal computer
  • a cutting die consists of precise cutting channels which are interrupted by so-called bridges in order to prevent the cut sections from falling out of the cutting die. While the table or, in the case of a fixed table, the focusing optics are moving over the area of a bridge, the laser power is currently either shut down or the laser power is absorbed by a shutter. This time is lost in the production time. Likewise, a die can only be cut with empty travels that are optimized with good programs. However, it is often the case that the empty travels use a considerable part of the production time due to the programming of the die layout. According to the invention, these time periods are used for the engraving of the die.
  • the mean power of the laser beam per unit area can be set as desired by rapid, controlled deflection of the laser beam by means of the scanner, in order thereby to reduce the laser power from the machining of the workpiece, for example cutting the Outer contour of the die or cutting grooves and grooves for holding knives to go over to engraving.
  • machining a workpiece to form a die is divided into several individual sections or processes, ie the machining process
  • the laser beam is changed several times in its position relative to the workpiece in accordance with the cutting or machining pattern. Short periods of time remain between these individual changes, which are used according to the invention to carry out an engraving.
  • these machining sections on the one hand and the engraving or engravings to be carried out on the other hand are analyzed and calculated in a computing unit and the engravings to be carried out into individual machining sections subdivided, which are then carried out during the respective repositioning and reallocations between the laser beam and the workpiece.
  • the engraving is then carried out in sections which, according to the calculation, are favorable to the machining section being processed, so that it is ensured that the scanner is also conveniently located to the workpiece and can carry out its engraving.
  • the respective structure data or engraving data and the cutting data are combined in one Computing and control unit stored and the temporal and local cutting and / or welding process is analyzed. Then the interruptions are determined Engraving processes are analyzed and these processes are divided into individual structural or engraving sections. Depending on the respective lengths and local assignments of the respective interruptions between cutting sections, one (or more) structural or engraving section (s) are then assigned to these sections. In this way, the engraving processing will be optimally assigned to the respective interruptions.
  • the focusing and deflection of the laser beam for engraving is adapted at the transition points or starting points, so that a finished and engraved die shape has a uniform appearance , ie that there are no starting or transition points in the area where the laser interrupted the engraving of a line and continued it in a subsequent engraving section.
  • the individual cutting dies can also be identified and / or specified immediately before, during or after their processing.
  • an essential component is the auxiliary deflecting mirror, which can be pivoted into the beam path of the laser beam focused on the workpiece in order to deflect the laser beam towards the scanner. Because of this deflecting mirror, it is not necessary to change the laser power or the laser beam reposition itself and thus the focused optics that are required during cutting.
  • the auxiliary deflecting mirror should therefore also be arranged in front of the focusing optics, viewed in the direction of beam propagation, in order to direct the laser beam onto the scanner essentially unaffected by optical elements, in order then to carry out the engraving with the laser beam.
  • the mirrors of the scanner are arranged so as to be movable and correlated with the movement of the workpiece.
  • the distance of the scanner from the workpiece surface should be changeable with a corresponding change in the position of the focusing optics.
  • the usual material processing system with which workpieces W and the like are to be processed in order to cut punching dies, comprises a laser which is focused on the workpiece W via a deflecting mirror U and a focusing lens F.
  • the workpiece itself is arranged on a table T.
  • the laser is controlled directly with regard to its power with CNC data or with data stored in a PC.
  • the system can be constructed in such a way that the laser beam is deflected vertically onto the work surface via the deflecting mirror U and is focused with the focusing optics F in such a way that the cutting contours by moving the table T via a suitable drive in the x and y -Direction can be cut or welded.
  • the focusing optics or the deflecting mirror and the focusing optics can be changed in order to guide the laser beam L over the fixed workpiece W.
  • the table T or, in the case of a stationary table the focusing optics F moves empty for this purpose, the laser power is conventionally reduced or the laser power is absorbed by a so-called "shutter" or shutter. This time is lost in the production time.
  • a tiltable mirror K is pivoted into the beam path between the deflecting mirror U and the focusing optics F via a suitable drive A ⁇ , and always if the laser optics or the table is in a bridge position or in the phase of an empty travel path.
  • the entire laser power is laterally reflected into a scanner S, where it is directed onto two mirrors S s which can be positioned in directions perpendicular to one another, indicated by the arrows in the figure. Due to the mirror movement, there is a paintable area on the working plane of approx. 600 x 600 mm.
  • This area can now be engraved in an extremely short time using the engraving information available on a PC.
  • the full laser power can be used in conventional systems, which in turn considerably reduces the time span for the engraving process.
  • the control system for the laser or for the table that can be moved in the x and y directions usually consists of a CNC control or else of a PC.
  • the control program calculates in advance which contour the laser beam travels on the surface to be processed. It can therefore also calculate the phases in which the laser is either on a bridge position or on an empty path.
  • the control also knows in advance in which part of the entire work area the laser is located at this time.
  • This information is passed on to the separate PC that controls the scanner, so that the image information that is to be scanned for this partial area can be stored in a temporary memory in good time in order to store this image information in the scanner S immediately after the laser beam has been reflected into the scanner Engrave part of the workpiece W.
  • the entire area of the work area is covered with partial areas that are covered by the scanner.
  • these are approached separately after the cutting process has ended in order to also engrave the last areas not previously reached.
  • the system is linked to the moving optics or the moving table surface in such a way that the engraving takes place sequentially in overlapping zones. Since the Sanner S must be focused on the surface of the plate to be engraved when it is equipped with different lenses or when engraving on materials with different material thicknesses, it should be connected to the optics F, which can be moved in the z direction anyway.
  • the deflecting mirror K which is intended to send the beam either through the internal optics F or through the scanner S, is accommodated in the nozzle tube and is controlled there via the central control of the laser system.
  • the empty travel paths of the laser in which the laser beam is usually switched off, should be used for the engraving process, ie the laser beam should not be switched off during the empty travel path, but should instead be directed onto the surface by the scanner optics S s .

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé pour la production d'une matrice, en particulier d'une matrice pour l'industrie d'emballage. Lors d'une opération, on découpe au moyen d'un rayon laser dirigé des rainures dans une pièce, en particulier du bois, rainures devant loger des couteaux à tailler ou à rainures. Lors d'une autre opération, on grave au moyen d'un rayon laser des structures définies dans la surface de la matrice, une partie des structures au moins identifiant ou définissant la matrice de manière univoque. Ce procédé est caractérisé en ceci que, pendant une interruption de l'opération de découpe des rainures, le rayon laser utilisé pour la découpe est irradié dans un scanner à l'aide d'un miroir de déviation auxiliaire et que, pendant cette interruption, les structures sont gravées au moyen du scanner, avec guidage de ce rayon laser, dans la surface de la matrice à produire.
EP98941339A 1997-07-18 1998-07-17 Procede et dispositif pour la production d'une matrice Withdrawn EP0998370A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19730789 1997-07-18
DE19730789 1997-07-18
PCT/EP1998/004423 WO1999003635A1 (fr) 1997-07-18 1998-07-17 Procede et dispositif pour la production d'une matrice

Publications (1)

Publication Number Publication Date
EP0998370A1 true EP0998370A1 (fr) 2000-05-10

Family

ID=7836079

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98941339A Withdrawn EP0998370A1 (fr) 1997-07-18 1998-07-17 Procede et dispositif pour la production d'une matrice

Country Status (4)

Country Link
EP (1) EP0998370A1 (fr)
JP (1) JP2001510102A (fr)
DE (1) DE19831883A1 (fr)
WO (1) WO1999003635A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10054291A1 (de) * 2000-11-02 2002-05-08 Tobias Olbort Verfahren sowie Anlage zur Beschriftung von Paletten
DE102010012973B4 (de) * 2010-03-23 2012-07-19 Lasercomb Gmbh Verfahren und Vorrichtung zur Herstellung einer Stanzform
DE102011000768B4 (de) 2011-02-16 2016-08-18 Ewag Ag Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung
DE102013218483A1 (de) * 2013-09-16 2015-03-19 Homag Holzbearbeitungssysteme Gmbh Verfahren zur Laserbearbeitung sowie Bearbeitungsmaschine
CN104988496B (zh) * 2015-07-15 2017-10-24 广东奥基德信机电有限公司 一种能够实现金属粉末微区熔化及精加工的复合系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4540867A (en) * 1984-06-25 1985-09-10 Motorola, Inc. Linearized scanning system and method for an energy beam
EP0229194B1 (fr) * 1985-11-18 1990-08-01 Matsushita Electric Industrial Co., Ltd. Appareil de traitement au rayon laser
CH680842A5 (fr) * 1989-09-22 1992-11-30 Electro Optic Ag
SE503327C2 (sv) * 1993-08-18 1996-05-28 Staallinjestans Laserform Ab Sätt vid tillverkning av rotationsstans och del till en rotationsstans
US5566594A (en) * 1993-11-05 1996-10-22 Michlin; Steven B. Long life re-rulable steel rule die system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9903635A1 *

Also Published As

Publication number Publication date
WO1999003635A1 (fr) 1999-01-28
JP2001510102A (ja) 2001-07-31
DE19831883A1 (de) 1999-03-04

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