EP0987922A2 - Multi-resonant panel - Google Patents

Multi-resonant panel Download PDF

Info

Publication number
EP0987922A2
EP0987922A2 EP99114408A EP99114408A EP0987922A2 EP 0987922 A2 EP0987922 A2 EP 0987922A2 EP 99114408 A EP99114408 A EP 99114408A EP 99114408 A EP99114408 A EP 99114408A EP 0987922 A2 EP0987922 A2 EP 0987922A2
Authority
EP
European Patent Office
Prior art keywords
resonance plate
interface
driver
plate according
resonance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99114408A
Other languages
German (de)
French (fr)
Other versions
EP0987922B1 (en
EP0987922A3 (en
Inventor
Wolfgang Prof. Dr. Bachmann
Gerhard Dr. Krump
Hans-Jürgen Regl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harman Becker Automotive Systems GmbH
Original Assignee
Harman Becker Automotive Systems GmbH
Harman Audio Electronic Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman Becker Automotive Systems GmbH, Harman Audio Electronic Systems GmbH filed Critical Harman Becker Automotive Systems GmbH
Publication of EP0987922A2 publication Critical patent/EP0987922A2/en
Publication of EP0987922A3 publication Critical patent/EP0987922A3/en
Application granted granted Critical
Publication of EP0987922B1 publication Critical patent/EP0987922B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2440/00—Bending wave transducers covered by H04R, not provided for in its groups
    • H04R2440/01—Acoustic transducers using travelling bending waves to generate or detect sound

Definitions

  • the invention is concerned with multi-resonance plates, in particular with the Signal supply and signal processing in such multi-resonance plates.
  • Multi-resonance plates for sound radiation are known in the prior art and essentially comprise a flat sound panel, which of at least an electrodynamic driver connected to the sound panel is driven. More details on the structure and the mode of operation such multi-resonance plates are also known under the abbreviation DML for example, the documents DE 19757097 and DE 19757098 which are made the subject of the present application.
  • Such multi-resonance plates are intended for the reproduction of sound events be used, it is necessary to have appropriate driver electronics provide with which the received or generated sound signals processed before they are made available to the drivers. Because with this Technology the multi-resonance plates as single Sound reproduction devices can be used, but mainly as so-called baffles with a large number of juxtaposed and connected multi-resonance plates are operated according to the state of the Engineering the driver electronics essentially from an amplifier and in the respective signal path integrated switches. But this technique is disadvantageous in several respects, since the various individual components for Enabling a versatile application in their respective individual data must be oversized. Depending on the application, this may be because Driver power between about 10 and 100 watts must be transmitted mean that, for example, special plug connections in the signal path, extremely low loss cables, complex shielding, large power reserves or large margins in impedances are required.
  • the invention is therefore based on the object of a multi-resonance plate specify which simplifies the effort for the driver electronics.
  • the entire driver electronics in the air volume integrated multi-resonance plate can or can Multi-resonance plates with each other and / or with little effort Sound signal receiving or generating sound signal source connected become.
  • each of these multi-resonance plates one has complete driver electronics in the air volume. Rather, in this Case the complete driver electronics for such multi-resonance plates one Baffle that optimizes, for example, radiation in the high frequency range are formed on the air volumes of the reproducing this sound area Multi-resonance plates should be distributed.
  • the Suspension that connects the multi-resonance plate to the frame that The air volume between the frame and the multi-resonance plate is hermetic includes, because in this case the multi-resonance plate and the im Air volume arranged driver electronics also easily in Eavesdropping rooms that are explosive or polluted with the environment or the climate operate.
  • the audio electronics the Power amplifier and the respective crossover for frequency separation contains.
  • the communication electronics which are responsible for the connection between the Audio electronics and a sound signal source and / or in several, for example multi-resonance plates combined to form a baffle for the connection between the different multi-resonance plates or which one Command inputs carried out in dialog form the interface between those of one User generated commands and the driver electronics and / or one with the Multiresonance plate forms related multimedia center.
  • a battery backup which with the other driver electronics in Connection is established.
  • the Driver electronics not necessary all of the above components must include. This means, for example, that battery backup is not must be realized if the power supply is able to, too Cover excellence.
  • the respective driver electronics comprises one on the each driver tailored power amplifier, this can be with regard to the driver to be driven can be optimized.
  • This optimization of Power amplifier has compared to the conventional technology, in which in the Usually an amplifier feeds one or a plurality of drivers, the advantage that the power amplifiers according to the invention have no power reserves must be there, in contrast to the prior art, where the combination between Amplifiers and drivers are often realized by the end user, amplifiers and Driver form a unit.
  • This unit formation also has the advantage that the Components are coordinated with each other, which optimizes the different components possible and a mutual destructive effect between these components is excluded.
  • the driver electronics with electronic filters in Equipped with an analog or digital structure the frequency separation below Very much use of the power amplifiers assigned to the respective drivers be carried out economically. In particular, the otherwise does not apply to the Prior art arrangements necessary for frequency separation Power electronics.
  • the driver electronics from a DC voltage source fed can still be carried out in connection with claim 8 - the power supply together with the audio signal lines, which the Connect the driver electronics to the audio signal source.
  • the driver electronics from a DC voltage source fed can still be carried out in connection with claim 8 - the power supply together with the audio signal lines, which the Connect the driver electronics to the audio signal source.
  • the (first) Interface which connects the driver electronics with the Sound signal source is used as a bus-compatible interface, because in this If the multi-resonance plates can be operated wherever appropriate bus lines are available. In other words, this makes the multi-resonance plate with appropriate bus technology sole terminal.
  • the bus line leading to the multi-resonance plate simultaneously also include the power supply. This makes it very flexible Operation of the multi-resonance plates achieved.
  • Is there a further interface according to claim 9, for networking between several multi-resonance plates and / or for reception and Forwarding of command inputs carried out in dialog can for example, communication with the via a second interface Power amplifier or a multimedia center. Because of Flexibility should be wireless communication, such as infrared technology his.
  • a multi-resonance plate 10 is shown in side section, wherein from the true dimensions of such a presentation Multiresonance plate 10 are not shown.
  • this multi-resonance plate 10 is also one Core layer 11 and two cover layers 12.1 and 12.2 formed by those Surfaces of the core layer 11, which have the largest surface area, are connected to the cover layers 12.1, 12.2.
  • Multi-resonance plate 10 at least one driver 13 in connection, which the Multiresonance plate 10 vibrated.
  • the driver shown in Fig. 1 13 has been given as an example, so that of its design and Positioning no restrictions.
  • the multi-resonance plate 10 is at a lateral distance from the Narrow sides 14 of the core layer 11 surrounded by a frame 15, so that an air volume 16 between the narrow sides 14 and the frame 15 remains.
  • the multi-resonance plate 10 is suspended in the frame 15.
  • the one for this required suspension 17 is present in the present case from the two cover layers 12.1, 12.2 realized by these two cover layers 12.1, 12.2 to Frame 15 guided and connected to it.
  • the air volume 16 is hermetically sealed, so that only the outer surfaces of the frame 15 and the cover layers 12.1, 12.2 Are exposed to environmental influences. Since the latter areas with very made simple means resistant to climate or pollutant influences can be, the multi-resonance plates designed according to the invention 10 also largely independent of the others inside the Multiresonance plate 10 arranged components easily even the most difficult Conditions are suspended.
  • the suspensions 17 can be under tension when connected to the frame 15.
  • the multiresonance plate 10 can be connected as already carried out with another application by the applicant - a particularly good one Bring the bass down.
  • the entire driver electronics 18 is in the Air volume 16 housed.
  • a power amplifier 18.1 optimized for the driver 13 includes present a filter arrangement 18.2.
  • the advantages that come with the mutual adaptation of Driver electronics 18 and driver 13 are already connected. Any misunderstandings that may arise in this context
  • a plurality of Drivers 13 can supply.
  • the invention can also be modified so that a Power amplifier 18. 1 with the subordinate arrangement of several multi-resonance plates 10 Driver 13 feeds from various multi-resonance plates 10.
  • the frame 15 is formed from metal and / or with cooling fins (not shown) is provided for good heat dissipation from the Driver electronics 18 concerned.
  • a battery 20 is also integrated in the air volume 16 according to FIG. 1, which has a DC-powered charging electronics.
  • This battery 20 has the Task, the driver (s) 13 when requesting excellence with the necessary voltage. Will not be top performances requested, the state of charge of the battery 20 is checked and, if necessary, a Reloading causes. The latter can be realized, for example, that Entry of a low level to charge the battery 20 an automatic Volume reduction with dynamic compression is activated. If the battery is 20 provided with a capacitor connected in parallel (not shown), a particularly low-distortion playback of rare pulse events ensured.
  • the electronics connected to the battery 20 be modified so that if the external DC power source fails (not shown) the sound reproduction by means of the battery 20 can still be ensured. The latter is particularly important for securing escape routes This is important because important announcements are still possible.
  • FIG. 2 the frame 15 of a multi-resonance plate 10 according to FIG. 1 is enlarged shown.
  • This multi-resonance plate 10 not only has in the air volume 16 a power amplifier 18.1 and a battery 20, but also a first and one second interface 21.1 and 21.2 on The supply of sound signals takes place via the first interface 21.1 by connecting the interface 21.1 with the plug 22 of the cable harness 19 is connected. If this interface 21.1 is only intended for the supply of sound signals, the shown Interface / connector combination for example as a fiber or Bus connection. But also a conventional connection via Speaker sockets and speaker plugs would be possible. Most notably It is advantageous to design the interface / plug combination as Bus connection, because in this case not only the sound signals, but also the power supply can take place.
  • the second interface 21.2 is designed as an infrared sensor.
  • the second interface 21.2 for networking between several Multiresonance plates 10 and / or forwarding of dialogues Command entries can be used. If the second interface 21.2 for example as a reception sensor of a wireless operator Transmission arrangement can be equipped by this Interface 21.2 user-activated and for example with a remote control triggered commands received and to the power amplifier 18.1 or to a the first-bus-compatible interface 21.1 connected multimedia center (not shown).

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Amplifiers (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Building Environments (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)

Abstract

The multi-resonance plate has a unit containing a core layer (11) and two covering layers (12.1,12.2). The covering layers are connected to opposing surfaces of the core layer. A frame (15) encloses the unit so as to leave an air volume (16). A suspension (17) connects the unit to the frame, enclosing the air volume. At least one electromagnetic driver acts on the unit. The entire drive electronic arrangement, which contains an output amplifier optimized for the particular driver, is integrated into the enclosed air volume.

Description

Technisches GebietTechnical field

Die Erfindung befaßt sich Multiresonanzplatten, insbesondere mit der Signalzuführung und Signalaufbereitung bei solchen Multiresonanzplatten.The invention is concerned with multi-resonance plates, in particular with the Signal supply and signal processing in such multi-resonance plates.

Stand der TechnikState of the art

Multiresonanzplatten zur Schallabstrahlung sind im Stand der Technik bekannt und umfassen im wesentlichen ein flaches Klangpaneel, welches von wenigstens einem mit dem Klangpaneel verbundenen elektrodynamischen Treiber angetrieben wird. Nähere Einzelheiten zum Aufbau und der Wirkungsweise solcher auch unter der Abkürzung DML bekannten Multiresonanzplatten sind beispielsweise den Schriften DE 19757097 und DE 19757098 entnehmbar, welche zum Gegenstand der vorliegenden Anmeldung gemacht werden.Multi-resonance plates for sound radiation are known in the prior art and essentially comprise a flat sound panel, which of at least an electrodynamic driver connected to the sound panel is driven. More details on the structure and the mode of operation such multi-resonance plates are also known under the abbreviation DML for example, the documents DE 19757097 and DE 19757098 which are made the subject of the present application.

Sollen derartige Multiresonanzplatten zur Wiedergabe von Schallereignissen eingesetzt werden, ist es notwendig, eine entsprechende Treiberelektronik vorzusehen, mit welcher die empfangenen oder generierten Tonsignale aufbereitet werden , bevor Sie den Treibern zur Verfügung gestellt werden. Da bei dieser Technik die Multiresonanzplatten zwar auch als einzelne Schallwiedergabeanordnungen eingesetzt werden können, hauptsächlich aber als sogenannte Schallwände mit einer Vielzahl von nebeneinander angeordneten und verbundenen Multiresonanzplatten betrieben werden, wird gemäß dem Stand der Technik die Treiberelektronik im wesentlichen von einem Verstärker und von in den jeweiligen Signalweg integrierten Weichen gebildet. Diese Technik ist aber in mehrfacher Hinsicht nachteilig, da die verschiedenen Einzelkomponenten zur Ermöglichung einer vielseitigen Anwendung in ihren jeweiligen Einzeldaten überdimensioniert ausgebildet sein müssen. Je nach Anwendung kann dies, da Treiberleistungen zwischen etwa 10 und 100 Watt übertragen werden müssen, bedeuten, daß beispielsweise besondere Steckverbindungen im Signalweg, extrem verlustarme Kabel, aufwendige Abschirmungen, große Leistungsreserven oder große Spielräume bei den Impedanzen erforderlich werden.Such multi-resonance plates are intended for the reproduction of sound events be used, it is necessary to have appropriate driver electronics provide with which the received or generated sound signals processed before they are made available to the drivers. Because with this Technology the multi-resonance plates as single Sound reproduction devices can be used, but mainly as so-called baffles with a large number of juxtaposed and connected multi-resonance plates are operated according to the state of the Engineering the driver electronics essentially from an amplifier and in the respective signal path integrated switches. But this technique is disadvantageous in several respects, since the various individual components for Enabling a versatile application in their respective individual data must be oversized. Depending on the application, this may be because Driver power between about 10 and 100 watts must be transmitted mean that, for example, special plug connections in the signal path, extremely low loss cables, complex shielding, large power reserves or large margins in impedances are required.

Daher liegt der Erfindung die Aufgabe zugrunde, eine Multiresonanzplatte anzugeben, welche den Aufwand für die Treiberelektronik vereinfacht. The invention is therefore based on the object of a multi-resonance plate specify which simplifies the effort for the driver electronics.

Darstellung der ErfindungPresentation of the invention

Diese Aufgabe wird mit den in Anspruch 1 angegebenen Merkmalen gelöst. Vorteilhafte Aus- und Weiterbildungen sind den Ansprüchen 2 bis 9 entnehmbar.This object is achieved with the features specified in claim 1. Advantageous training and further developments can be found in claims 2 to 9.

Wird gemäß Anspruch 1 die gesamte Treiberelektronik im Luftvolumen der jeweiligen Multiresonanzplatte integriert, kann oder können diejeweiligen Multiresonanzplatten ohne großen Aufwand miteinander und/oder mit einer Tonsignale empfangenden oder generierenden Tonsignalquelle verbunden werden. Hierbei wird aber nicht ausgeschlossen, daß bei Multiresonanzplatten, die zu einer Schallwand kombiniert sind, jede dieser Multiresonanzplatten eine vollständige Treiberelektronik im Luftvolumen aufweist. Vielmehr kann in diesem Fall die komplette Treiberelektronik für solche Multiresonanzplatten einer Schallwand, die beispielsweise zur Abstrahlung im Hochtonbereich optimiert ausgebildet sind, aufdie Luftvolumina der diesen Tonbereich wiedergebenden Multiresonanzplatten verteilt sein. Von ganz besonderem Vorteil ist es, wenn die Aufhängung, welche die Multiresonanzplatte mit dem Rahmen verbindet, das zwischen Rahmen und Multiresonanzplatte befindliche Luftvolumen hermetisch einschließt, denn in diesem Fall kann die Multiresonanzplatte und die im Luftvolumen angeordnete Treiberelektronik auch problemlos in explosionsgefährdeten oder umwelt- bzw. klimabelasteten Abhörräumen betrieben werden.According to claim 1, the entire driver electronics in the air volume integrated multi-resonance plate, can or can Multi-resonance plates with each other and / or with little effort Sound signal receiving or generating sound signal source connected become. However, it is not excluded that with multi-resonance plates, which are combined into a baffle, each of these multi-resonance plates one has complete driver electronics in the air volume. Rather, in this Case the complete driver electronics for such multi-resonance plates one Baffle that optimizes, for example, radiation in the high frequency range are formed on the air volumes of the reproducing this sound area Multi-resonance plates should be distributed. It is particularly advantageous if the Suspension that connects the multi-resonance plate to the frame that The air volume between the frame and the multi-resonance plate is hermetic includes, because in this case the multi-resonance plate and the im Air volume arranged driver electronics also easily in Eavesdropping rooms that are explosive or polluted with the environment or the climate operate.

Unter der Treiberelektronik werden im Zusammenhang dieser Anmeldung im wesentlichen die folgenden Komponenten verstanden: Die Audioelektronik, die Endverstärker und die jeweiligen Weichen zur Frequenztrennung enthält. Ferner die Kommunikationselektronik, welche für die Verbindung zwischen der Audioelektronik und einer Tonsignalquelle und/oder bei mehreren, beispielsweise zu einer Schallwand kombinierten Multiresonanzplatten für die Verbindung zwischen den verschiedenen Multiresonanzplatten zuständig ist oder welche bei im Dialog geführten Befehlseingaben die Schnittstelle zwischen den von einem Benutzer generierten Befehlen und der Treiberelektronik und/oder einer mit der Multiresonanzplatte in Verbindung stehenden Multimediazentrale bildet. Und schließlich eine Akkupufferung, welche mit der übrigen Treiberelektronik in Verbindung steht. Um möglichen Zweifeln in diesem Zusammenhang vorzubeugen, sei schon an dieser Stelle daraufhingewiesen, daß die Treiberelektronik nicht notwendig sämtliche der oben angeführten Komponenten umfassen muß. Dies bedeutet, daß beispielsweise die Akkupufferung nicht realisiert sein muß, wenn die Spannungsversorgung in der Lage ist, auch Spitzenleistungen abzudecken. Under the driver electronics in connection with this application in essentially understood the following components: the audio electronics, the Power amplifier and the respective crossover for frequency separation contains. Further the communication electronics, which are responsible for the connection between the Audio electronics and a sound signal source and / or in several, for example multi-resonance plates combined to form a baffle for the connection between the different multi-resonance plates or which one Command inputs carried out in dialog form the interface between those of one User generated commands and the driver electronics and / or one with the Multiresonance plate forms related multimedia center. And finally a battery backup, which with the other driver electronics in Connection is established. For possible doubts in this context To prevent, it should be pointed out at this point that the Driver electronics not necessary all of the above components must include. This means, for example, that battery backup is not must be realized if the power supply is able to, too Cover excellence.

Umfaßt gemäß Anspruch 2 die jeweilige Treiberelektronik einen auf den jeweiligen Treiber zugeschnittenen Endverstärker, kann dieser in Hinblick auf den anzutreibenden Treiber optimiert ausgelegt werden. Diese Optimierung der Endverstärker hat gegenüber der herkömmlichen Technik, bei welcher in der Regel ein Verstärker einen oder eine Mehrzahl von Treibern speist, den Vorteil, daß die erfindungsgemäßen Endverstärker keine Leistungsreserven aufweisen müssen, da im Gegensatz zum Stand der Technik, wo die Kombination zwischen Verstärker und Treibern oft vom Endverbraucher realisiert wird, Verstärker und Treiber eine Einheit bilden. Diese Einheitsbildung hat auch den Vorteil, daß die Komponenten aufeinander abgestimmt sind, womit eine Optimierung der verschiedenen Komponenten möglich und eine gegenseitige zerstörende Wirkung zwischen diesen Komponenten ausgeschlossen ist.According to claim 2, the respective driver electronics comprises one on the each driver tailored power amplifier, this can be with regard to the driver to be driven can be optimized. This optimization of Power amplifier has compared to the conventional technology, in which in the Usually an amplifier feeds one or a plurality of drivers, the advantage that the power amplifiers according to the invention have no power reserves must be there, in contrast to the prior art, where the combination between Amplifiers and drivers are often realized by the end user, amplifiers and Driver form a unit. This unit formation also has the advantage that the Components are coordinated with each other, which optimizes the different components possible and a mutual destructive effect between these components is excluded.

Ist gemäß Anspruch 3 die Treiberelektronik mit elektronischen Filtern in analogem oder digitalem Aufbau ausgestattet, kann die Frequenztrennung unter Nutzung der denjeweiligen Treibern zugeordneten Endverstärkern sehr ökonomisch ausgeführt werden. Insbesondere entfällt die sonst bei den Anordnungen gemäß dem Stand der Technik zur Frequenztrennung notwendige Leistungselektronik.According to claim 3, the driver electronics with electronic filters in Equipped with an analog or digital structure, the frequency separation below Very much use of the power amplifiers assigned to the respective drivers be carried out economically. In particular, the otherwise does not apply to the Prior art arrangements necessary for frequency separation Power electronics.

Wird gemäß Anspruch 4 die Treiberelektronik von einer Gleichspannungsquelle gespeist, kann -wie noch im Zusammenhang mit Anspruch 8 ausgeführt werden wird- die Spannungversorgung zusammen mit den Tonsignalleitungen, welche die Treiberelektronik mit der Tonsignalquelle verbinden, erfolgen. Außerdem sind im Gegensatz zur Spanungsversorgung von Verstärkern durch Netzspannung bei der erfindungsgemäßen Gleichstromversorgung in Niederspannungstechnik offene Stecker oder Buchsen in bezug aufgesundheitliche Schädigungen weitgehend unproblematisch.According to claim 4, the driver electronics from a DC voltage source fed, can still be carried out in connection with claim 8 - the power supply together with the audio signal lines, which the Connect the driver electronics to the audio signal source. In addition, Contrary to the power supply of amplifiers by mains voltage at the DC power supply according to the invention in low voltage technology open Plugs or sockets with regard to health damage to a large extent unproblematic.

Die insbesondere bei Treibern im Tieftonbreich impulsweise notwendigen Spitzenleistungen bedingen dann keine Aufweitung der Spannungversorgung, wenn gemäß Anspruch 5 im Luftvolumen ein Akku mit gleichstromgespeister Ladeelektronik integriert ist, welcher bei Abforderung von Spitzenleistungen diese bereitstellt. Ist der Akku noch durch einen parallel geschalteten Kondensator unterstützt, wird eine besonders verzerrungsarme Wiedergabe seltener Impulsereignisse gewährleistet. Außerdem wird durch die Akkupufferung erreicht, daß in Notfällen beispielsweise bei Ausfall der Gleichspannungsversorgung die Multiresonanzplatten noch einige Zeit einsatzbereit bleiben und zur Sicherung etwa von Fluchtwegen beitragen können. Ein Absinken des Ladezustandes des Akkus unter einen kritischen Ladezustand, etwa durch die Abforderung von Spitzenleistungen über einen längeren Zeitraum wird durch die Ladeelektronik ausgeschlossen, welche bei Erreichen dieses Zustandes eine automatische Lautstärkeregelung mit Dynamikkompensation aktiviert.The impulses that are particularly necessary for drivers in the low frequency range Then peak performance does not require an expansion of the voltage supply, if according to claim 5 in the air volume, a battery with DC power Charging electronics is integrated, which when peak performance is requested provides this. Is the battery still connected in parallel Capacitor supported, is a particularly low-distortion reproduction Less frequent impulse events guaranteed. In addition, the battery backup achieved that in emergencies, for example, if the DC power supply to the multi-resonance plates for some time Remain ready for use and can help to secure escape routes, for example. A drop in the state of charge of the battery below a critical state of charge, for example by demanding top performance over a longer period of time is excluded by the charging electronics, which when this is reached Automatic volume control with dynamic compensation activated.

Ganz besonders vorteilhaft ist es, wenn gemäß Anspruch 7 die (erste) Schnittstelle, welche zur Verbindung der Treiberelektronik mit der Tonsignalquelle dient, als busfähige Schnittstelle ausgebildet wird, weil in diesem Fall die Multiresonanzplatten überall dort betrieben werden können, wo entsprechende Busleitungen zur Verfügung stehen. Mit anderen Worten, hierdurch wird bei entsprechender Bustechnologie die Multiresonanzplatte zum alleinigen Endgerät.It is particularly advantageous if the (first) Interface which connects the driver electronics with the Sound signal source is used as a bus-compatible interface, because in this If the multi-resonance plates can be operated wherever appropriate bus lines are available. In other words, this makes the multi-resonance plate with appropriate bus technology sole terminal.

Wird der jeweilige Endverstärker von einer Gleichstromquelle gespeist, kann gemäß Anspruch 8 die zur Multiresonanzplatte geführte Busleitung gleichzeitig auch die Spannungsversorgung mit umfassen. Hierdurch wird ein sehr flexibler Betrieb der Multiresonanzplatten erreicht.If the respective power amplifier is powered by a direct current source, can according to claim 8, the bus line leading to the multi-resonance plate simultaneously also include the power supply. This makes it very flexible Operation of the multi-resonance plates achieved.

Ist gemäß Anspruch 9 eine weitere Schnittstelle vorhanden, die zur Vernetzung zwischen mehreren Multiresonanzplatten und/oder zum Empfang und Weiterleitung von im Dialog geführten Befehlseingaben ausgestattet ist, kann beispielsweise über eine zweite Schnittstelle die Kommunikation mit dem Endverstärker oder einer Multimediazentrale geführt werden. Aus Gründen der Flexibilität sollte die Kommunikation drahtlos, etwa in Infrarottechnik ausgeführt sein.Is there a further interface according to claim 9, for networking between several multi-resonance plates and / or for reception and Forwarding of command inputs carried out in dialog can for example, communication with the via a second interface Power amplifier or a multimedia center. Because of Flexibility should be wireless communication, such as infrared technology his.

Kurze Darstellung der FigurenBrief presentation of the figures

Es zeigen:

Fig. 1
eine Multiresonanzplatte im Seitenschnitt; und
Fig. 2
eine Einbausituation einer Multiresonanzplatte.
Show it:
Fig. 1
a multi-resonance plate in side section; and
Fig. 2
an installation situation of a multi-resonance plate.

Wege zum Ausführen der ErfindungWays of Carrying Out the Invention

Die Erfindung soll nun an Hand der beiden Figuren näher erläutert werdenThe invention will now be explained in more detail with reference to the two figures

In Fig. 1 ist eine Multiresonanzplatte 10 im Seitenschnitt gezeigt, wobei aus darstellungstechnischen Gründen die wahren Abmessungen einer solchen Multiresonanzplatte 10 nicht gezeigt sind. Wie schon in anderen Anmeldungen der Anmelderin erläutert, wird auch diese Multiresonanzplatte 10 von einer Kernschicht 11 und zwei Deckschichten 12.1 und 12.2 gebildet, indem diejenigen Oberflächen der Kernschicht 11, welche die größte Flächenausdehnung haben, mit den Deckschichten 12.1, 12.2 verbunden sind. Ferner steht mit der Multiresonanzplatte 10 wenigstens ein Treiber 13 in Verbindung, welcher die Multiresonanzplatte 10 in Schwingungen versetzt. Der in Fig. 1 gezeigte Treiber 13 ist beispielhaft angegeben worden, so daß von seiner Ausgestaltung und Positionierung keine Beschränkungen ausgehen.In Fig. 1, a multi-resonance plate 10 is shown in side section, wherein from the true dimensions of such a presentation Multiresonance plate 10 are not shown. As in other registrations explained to the applicant, this multi-resonance plate 10 is also one Core layer 11 and two cover layers 12.1 and 12.2 formed by those Surfaces of the core layer 11, which have the largest surface area, are connected to the cover layers 12.1, 12.2. It also says Multi-resonance plate 10 at least one driver 13 in connection, which the Multiresonance plate 10 vibrated. The driver shown in Fig. 1 13 has been given as an example, so that of its design and Positioning no restrictions.

Ferner wird die Multiresonanzplatte 10 mit seitlichem Abstand zu den Schmalseiten 14 der Kernschicht 11 von einem Rahmen 15 umgeben, so daß zwischen den Schmalseiten 14 und dem Rahmen 15 ein Luftvolumen 16 verbleibt. Die Multiresonanzplatte 10 ist im Rahmen 15 aufgehängt. Die hierfür erforderliche Aufhängung 17 wird vorliegend von den beiden Deckschichten 12.1, 12.2 realisiert, indem diese beiden Deckschichten 12.1, 12.2 bis zum Rahmen 15 geführt und mit diesem verbunden sind. Dadurch, daß die Aufhängen 17 in der Form der beiden Deckschichten 12.1, 12.2 umlaufend mit dem Rahmen 15 verbunden sind, wird das Luftvolumen 16 hermetisch eingeschlossen, so daß lediglich die Außenflächen des Rahmens 15 und der Deckschichten 12.1, 12.2 Umwelteinflüssen ausgesetzt sind. Da die letztbenannten Flächen mit sehr einfachen Mitteln gegen Klima- oder Schadstoffeinflüsse resistent gemacht werden können, können die erfindungsgemäß ausgebildeten Multiresonanzplatten 10 auch weitgehend unabhängig von den sonstigen im Inneren der Multiresonanzplatte 10 angeordneten Bauteilen problemlos auch schwierigsten Bedingungen ausgesetzt werden.Furthermore, the multi-resonance plate 10 is at a lateral distance from the Narrow sides 14 of the core layer 11 surrounded by a frame 15, so that an air volume 16 between the narrow sides 14 and the frame 15 remains. The multi-resonance plate 10 is suspended in the frame 15. The one for this required suspension 17 is present in the present case from the two cover layers 12.1, 12.2 realized by these two cover layers 12.1, 12.2 to Frame 15 guided and connected to it. By hanging 17 in the form of the two cover layers 12.1, 12.2 all around the frame 15 are connected, the air volume 16 is hermetically sealed, so that only the outer surfaces of the frame 15 and the cover layers 12.1, 12.2 Are exposed to environmental influences. Since the latter areas with very made simple means resistant to climate or pollutant influences can be, the multi-resonance plates designed according to the invention 10 also largely independent of the others inside the Multiresonance plate 10 arranged components easily even the most difficult Conditions are suspended.

Nur der Vollständigkeit halber sei daraufhingewiesen, daß die Aufhängungen 17 im mit dem Rahmen 15 verbundenen Zustand unter Spannung stehen können. Hierdurch läßt sich mit der Multiresonanzplatte 10 -wie schon im Zusammenhang mit einer anderen Anmeldung der Anmelderin ausgeführt- eine besonders gute Tieftonwiedergabe herbeiführen.For the sake of completeness, it should be pointed out that the suspensions 17 can be under tension when connected to the frame 15. As a result, the multiresonance plate 10 can be connected as already carried out with another application by the applicant - a particularly good one Bring the bass down.

Wie der Fig. 1 weiter entnehmbar ist, ist die gesamte Treiberelektronik 18 im Luftvolumen 16 untergebracht. Diese Treiberelektronik 18, welche ggf. auch mit einem Überlastschutz (nicht dargestellt) versehen sein kann, umfaßt vorliegend einen aufden Treiber 13 optimierten Endverstärker 18.1 und eine Filteranordnung 18.2. Aufdie Vorteile, welche mit der gegenseitigen Anpassung von Treiberelektronik 18 und Treiber 13 verbunden sind, wurde bereits hingewiesen. Um eventuell in diesem Zusammenhang aufkommenden Mißverständnissen vorzubeugen, sei daraufhingewiesen, daß bei mehreren mit der Multiresonanzplatte 10 verbundenen Treibern 13 aus Kostengründen der in der Multiresonanzplatte 10 integrierte Endverstärker 18.1 auch eine Mehrzahl von Treibern 13 versorgen kann. Auch kann die Erfindung so modifiziert sein, daß ein Endverstärker 18. 1 bei Nebenordnung von mehreren Multiresohanzplatten 10 Treiber 13 von verschiedenen Multiresonanzplatten 10 speist.As can be seen from FIG. 1, the entire driver electronics 18 is in the Air volume 16 housed. This driver electronics 18, which if necessary also with an overload protection (not shown) can be provided, includes present a power amplifier 18.1 optimized for the driver 13 and a filter arrangement 18.2. On the advantages that come with the mutual adaptation of Driver electronics 18 and driver 13 are already connected. Any misunderstandings that may arise in this context To prevent, it should be noted that in several with the Multiresonance plate 10 connected drivers 13 for reasons of cost in the Multi-resonance plate 10 integrated power amplifier 18.1 also a plurality of Drivers 13 can supply. The invention can also be modified so that a Power amplifier 18. 1 with the subordinate arrangement of several multi-resonance plates 10 Driver 13 feeds from various multi-resonance plates 10.

Wird der Rahmen 15 beispielsweise aus Metall gebildet und/oder mit Kühlrippen (nicht dargestellt) versehen, ist für eine gute Wärmeabfuhr von der Treiberelektronik 18 gesorgt.For example, the frame 15 is formed from metal and / or with cooling fins (not shown) is provided for good heat dissipation from the Driver electronics 18 worried.

Besonders vorteilhaft ist es, wenn dem jeweiligen Endverstärker 18.1 keine Netzspannung, sondern Gleichspannung zugeführt wird. Hierdurch wird nicht nur ein erheblicher Beitrag zur Berührsicherheit von offenen Anschlüssen geleistet, sondern auch die Möglichkeit geschaffen, die Spannungsversorgung und die Tonsignale in einem Kabelstrang 19 zu integrieren. Da i.ü. die Signalverstärkung bei der erfindungsgemäßen Anordnung erst in der Multiresonanzplatte 10 selbst erfolgt, kann im Gegensatz zu Multiresonanzplatten 10, welche über keinen in der Multiresonanzplatte 10 integrierten Verstärker verfügen, der Aufwand für die Tonsignalkabel (nicht dargestellt) erheblich reduziert werden.It is particularly advantageous if none of the respective output amplifiers 18.1 Mains voltage, but DC voltage is supplied. This will not only made a significant contribution to the safety of touching open connections, but also created the possibility of power supply and the To integrate sound signals in a cable harness 19. Since i.ü. the signal amplification in the arrangement according to the invention only in the multi-resonance plate 10 itself takes place, in contrast to multi-resonance plates 10, which have none in the Multiresonance plate 10 integrated amplifiers have the effort for Tone signal cable (not shown) can be significantly reduced.

Ferner ist im Luftvolumen 16 gemäß Fig. 1 noch ein Akku 20 integriert, welcher über eine gleichstromgespeiste Ladeelektronik verfügt. Dieser Akku 20 hat die Aufgabe, den oder die Treiber 13 bei Abforderung von Spitzenleistungen mit der notwendigen Spannung zu versehen. Werden keine Spitzenleistungen abgefordert, wird der Ladezustand des Akkus 20 überprüft und ggf. eine Nachladung bewirkt. Letzteres kann beispielsweise so realisiert sein, daß bei Eintritt eines Niedrigstandes zur Ladung des Akkus 20 eine automatische Lautstärkeabsenkung mit Dynamikkompression aktiviert wird. Ist der Akku 20 mit einem parallelgeschalteten Kondensator ( nicht gezeigt) versehen, wird eine besonders verzerrungsarme Wiedergabe seltener Impulsereignisse sichergestellt. Darüber hinaus kann die mit dem Akku 20 in Verbindung stehenden Elektronik so modifiziert sein, daß bei Ausfall der externen Gleichstromquelle (nicht gezeigt) die Tonwiedergabe mittels des Akkus 20 noch sichergestellt werden kann. Letzteres hat insbesondere für die Sicherung von Fluchtwegen besondere Bedeutung, da hierdurch wichtige Durchsagen noch möglich bleiben.Furthermore, a battery 20 is also integrated in the air volume 16 according to FIG. 1, which has a DC-powered charging electronics. This battery 20 has the Task, the driver (s) 13 when requesting excellence with the necessary voltage. Will not be top performances requested, the state of charge of the battery 20 is checked and, if necessary, a Reloading causes. The latter can be realized, for example, that Entry of a low level to charge the battery 20 an automatic Volume reduction with dynamic compression is activated. If the battery is 20 provided with a capacitor connected in parallel (not shown), a particularly low-distortion playback of rare pulse events ensured. In addition, the electronics connected to the battery 20 be modified so that if the external DC power source fails (not shown) the sound reproduction by means of the battery 20 can still be ensured. The latter is particularly important for securing escape routes This is important because important announcements are still possible.

In Fig. 2 ist der Rahmen 15 einer Multiresonanzplatte 10 gemäß Fig. 1 vergrößert dargestellt. Diese Multiresonanzplatte 10 weist im Luftvolumen 16 nicht nur einen Endverstärker 18.1 und einen Akku 20, sondern auch eine erste und eine zweite Schnittstelle 21.1 und 21.2 auf Die Zuführung von Tonsignalen erfolgt über die erste Schnittstelle 21.1, indem die Schnittstelle 21.1 mit dem Stecker 22 des Kabelstrangs 19 verbunden wird. Sofern diese Schnittstelle 21.1 ausschließlich zur Versorgung mit Tonsignalen vorgesehen ist, kann die gezeigte Schnittstellen-/Steckerkombination beispielsweise als Glasfaser- oder Busverbindung ausgeführt sein. Aber auch eine herkömmliche Verbindung über Lautsprecherbuchsen und Lautsprecherstecker wäre möglich. Ganz besonders vorteilhaft ist dabei die Ausbildung der Schnittstellen-/Steckerkombination als Busverbindung, da in diesem Fall über diese Anordnung nicht nur die Tonsignale, sondern auch die Spannungsversorgung erfolgen kann.2, the frame 15 of a multi-resonance plate 10 according to FIG. 1 is enlarged shown. This multi-resonance plate 10 not only has in the air volume 16 a power amplifier 18.1 and a battery 20, but also a first and one second interface 21.1 and 21.2 on The supply of sound signals takes place via the first interface 21.1 by connecting the interface 21.1 with the plug 22 of the cable harness 19 is connected. If this interface 21.1 is only intended for the supply of sound signals, the shown Interface / connector combination for example as a fiber or Bus connection. But also a conventional connection via Speaker sockets and speaker plugs would be possible. Most notably It is advantageous to design the interface / plug combination as Bus connection, because in this case not only the sound signals, but also the power supply can take place.

Erfolgt über die erste Schnittstelle 21.1 ausschließlich die Spannungsversorgung des Endverstärkers 18.1 und des Akkus 20, ist eine zweite Schnittstelle erforderlich, über welche dem Endverstärker 18.1 die Tonsignale zugeführt werden können. Durch diese Trennung von Tonsignal- und Spannungszuführung wird es möglich die Tonsignalzuführung auch drahtlos auszuführen, indem etwa die zweite Schnittstelle 21.2 als Infrarotsensor ausgebildet wird.Only the voltage supply takes place via the first interface 21.1 the power amplifier 18.1 and the battery 20 is a second interface required via which the sound signals are fed to the power amplifier 18.1 can be. Through this separation of sound signal and voltage supply it is possible to carry out the audio signal feed wirelessly, for example by the second interface 21.2 is designed as an infrared sensor.

Aber auch wenn die Versorgung der Multiresonanzplatte 10 mit Spannung und Tonsignalen ausschließlich über die erste Schnittstelle 21.1 erfolgt, kann die zweite Schnittstelle 21.2 zur Vernetzung zwischen mehreren Multiresonanzplatten 10 und/oder Weiterleitung von im Dialog geführten Befehlseingaben genutzt werden. Ist dazu die zweite Schnittstelle 21.2 beispielsweise als Empfangssensor einer drahtlos arbeitenden Übertragungsanordnung ausgestattet, können von dieser so ausgestatteten Schnittstelle 21.2 benutzeraktivierte und beispielsweise mit einer Fernbedienung ausgelöste Befehle empfangen und an den Endverstärker 18.1 oder an eine über die erste -busfähige- Schnittstelle 21.1 verbundene Multimediazentrale (nicht gezeigt) weitergeleitet werden.But even if the supply of the multi-resonance plate 10 with voltage and Tone signals exclusively via the first interface 21.1, the second interface 21.2 for networking between several Multiresonance plates 10 and / or forwarding of dialogues Command entries can be used. If the second interface 21.2 for example as a reception sensor of a wireless operator Transmission arrangement can be equipped by this Interface 21.2 user-activated and for example with a remote control triggered commands received and to the power amplifier 18.1 or to a the first-bus-compatible interface 21.1 connected multimedia center (not shown).

Claims (9)

Multiresonanzplatte 10 mit einer Einheit, welche aus einer Kernschicht 11 und zwei Deckschichten 12,1, 12.2 gebildet ist, wobei die Deckschichten 12.1, 12.2 miteinander gegenüberliegenden Oberflächen der Kernschicht 11 verbunden sind, mit einem Rahmen 15, der die Einheit unter Belassung eines Luftvolumens 16 umrandet, mit einer Aufhängung 17, welche die Einheit mit dem Rahmen 15 verbindet und dabei das Luftvolumen 16 einschließt, und mit wenigstens einem elektromagnetischen Treiber 13, der aufdie Einheit wirkt,
dadurch gekennzeichnet, daß im Luftvolumen 16 die gesamte Treiberelektronik 18, 18.1, 18.2 integriert ist. Multi-resonance plate 10 with a unit which is formed from a core layer 11 and two cover layers 12, 12.2, the cover layers 12.1, 12.2 being connected to surfaces of the core layer 11 lying opposite one another, with a frame 15 which surrounds the unit while leaving an air volume 16, with a suspension 17, which connects the unit to the frame 15 and thereby encloses the air volume 16, and with at least one electromagnetic driver 13 acting on the unit,
characterized, that the entire driver electronics 18, 18.1, 18.2 is integrated in the air volume 16. Multiresonanzplatte nach Anspruch 1
dadurch gekennzeichnet, daß die Treiberelektronik 18 einen auf den jeweiligen Treiber 13 optimierten Endverstärker 18.1 umfaßt. Multi-resonance plate according to claim 1
characterized, that the driver electronics 18 comprise a power amplifier 18.1 optimized for the respective driver 13. Multiresonanzplatte nach Anspruch 1 oder Anspruch 2,
dadurch gekennzeichnet, daß die Treiberelektronik 18 eine Filteranordnung 18.2 aufweist. Multi-resonance plate according to claim 1 or claim 2,
characterized, that the driver electronics 18 has a filter arrangement 18.2. Multiresonanzplatte nach einem der Ansprüche 1 bis 3
dadurch gekennzeichnet, daß die Treiberelektronik 18 von einer Gleichspannungsquelle gespeist ist. Multi-resonance plate according to one of Claims 1 to 3
characterized, that the driver electronics 18 is powered by a DC voltage source. Multiresonanzplatte nach Anspruch 4
dadurch gekennzeichnet, daß im Luftvolumen 16 ein Akku 20 mit gleichstromgespeister Ladeelektronik integriert ist. Multi-resonance plate according to claim 4
characterized, that a battery 20 with DC-powered charging electronics is integrated in the air volume 16. Multiresonanzplatte nach einem der Ansprüche 1 bis 5
dadurch gekennzeichnet, daß die Treiberelektronik 18 eine erste Schnittstelle 21.1 aufweist, die wenigstens mit einer Tonsignalquelle verbindbar ist. Multi-resonance plate according to one of Claims 1 to 5
characterized, that the driver electronics 18 has a first interface 21.1 which can be connected to at least one audio signal source. Multiresonanzplatte nach Anspruch 6
dadurch gekennzeichnet, daß die erste Schnittstelle 21.1 eine busfähige Schnittstelle ist. Multi-resonance plate according to claim 6
characterized, that the first interface 21.1 is a bus-compatible interface. Multiresonanzplatte nach Anspruch 6 oder 7
dadurch gekennzeichnet, daß die erste Schnittstelle 21.1 auch den Gleichspannungsanschluß umfaßt. Multi-resonance plate according to claim 6 or 7
characterized, that the first interface 21.1 also includes the DC voltage connection. Multiresonanzplatte nach einem der Ansprüche 1 bis 8
dadurch gekennzeichnet, daß eine zweite Schnittstelle 21.2 vorhanden ist, die zur Vernetzung zwischen mehreren Multiresonanzplatten 10 und/oder zum Empfang und zur Weiterleitung von im Dialog geführten Befehlseingaben ausgestattet ist. Multi-resonance plate according to one of Claims 1 to 8
characterized, that a second interface 21.2 is present, which is equipped for networking between a plurality of multi-resonance plates 10 and / or for receiving and forwarding command inputs carried out in dialog.
EP99114408A 1998-09-19 1999-07-22 Multi-resonant panel Expired - Lifetime EP0987922B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843079 1998-09-19
DE19843079A DE19843079A1 (en) 1998-09-19 1998-09-19 Multi-resonance plate

Publications (3)

Publication Number Publication Date
EP0987922A2 true EP0987922A2 (en) 2000-03-22
EP0987922A3 EP0987922A3 (en) 2006-12-06
EP0987922B1 EP0987922B1 (en) 2007-09-12

Family

ID=7881602

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99114408A Expired - Lifetime EP0987922B1 (en) 1998-09-19 1999-07-22 Multi-resonant panel

Country Status (4)

Country Link
US (1) US6748090B1 (en)
EP (1) EP0987922B1 (en)
AT (1) ATE373400T1 (en)
DE (2) DE19843079A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE524284C2 (en) * 2002-04-18 2004-07-20 A2 Acoustics Ab Device for driving a diaphragm arranged in an opening to a space and vehicles comprising a device for driving a diaphragm arranged in an opening of the vehicle
US20080080734A1 (en) * 2006-10-03 2008-04-03 Forth Robert A Sports audio player and two-way voice/data communication device
DE102012025313B3 (en) * 2012-12-22 2014-02-20 Audi Ag Transducer for converting electrical signals into airborne sound, has frame that is formed by two frame elements, which are tightly connectable to each other, in frame plane
RU2754074C2 (en) 2015-09-14 2021-08-25 Уинг Акустикс Лимитэд Improvement of audio converters or improvements related to them
US11166100B2 (en) 2017-03-15 2021-11-02 Wing Acoustics Limited Bass optimization for audio systems and devices
TW201904310A (en) 2017-03-22 2019-01-16 紐西蘭商威恩音響有限公司 System, method and device for audio converter, thin electronic device and hinge system
WO2020118065A1 (en) * 2018-12-05 2020-06-11 Oda Inc. Speaker
CN209767821U (en) 2019-06-20 2019-12-10 苏州上声电子股份有限公司 loudspeaker driven by multipath input
CN210053564U (en) * 2019-07-02 2020-02-11 苏州茹声电子有限公司 Multi-input driven loudspeaker

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720415A2 (en) * 1994-12-28 1996-07-03 Kabushiki Kaisha Kenwood Speaker component, speaker, and its manufacturing method
WO1997009861A1 (en) * 1995-09-02 1997-03-13 New Transducers Limited Inertial vibration transducers
WO1998022987A2 (en) * 1996-11-19 1998-05-28 Mctaggart Stephen I Laminated sheet product containing a printed battery

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2063945A (en) 1933-08-02 1936-12-15 Pierce George Washington Diaphragm and method
US3247925A (en) * 1962-03-08 1966-04-26 Lord Corp Loudspeaker
DE2112516B1 (en) * 1971-03-16 1972-10-19 Kurtze Guenther Dipl Phys Prof Directional loudspeaker
NL7308103A (en) * 1973-06-12 1974-12-16
JPS5748153Y2 (en) * 1977-11-26 1982-10-22
US4352961A (en) * 1979-06-15 1982-10-05 Hitachi, Ltd. Transparent flat panel piezoelectric speaker
US4625328A (en) * 1983-06-13 1986-11-25 Konutra Industries, Ltd. Integrated amplifier and speaker system with improved cooling efficiency
US5031222A (en) * 1988-07-22 1991-07-09 Murata Manufacturing Co., Ltd. Piezoelectric speaker
DE69106712T2 (en) * 1990-08-04 1995-06-08 Secr Defence Brit PANEL-SHAPED SPEAKER.
US5533132A (en) * 1995-01-23 1996-07-02 Jbl Incorporated Loudspeaker thermal management structure
UA51671C2 (en) 1995-09-02 2002-12-16 Нью Транзд'Юсез Лімітед Acoustic device
GB2305809B (en) 1995-09-28 1997-11-05 Harman Int Ind Power amplifier and loudspeaker frame integration
US5702230A (en) * 1996-01-29 1997-12-30 General Electric Company Actively controlled acoustic treatment panel
GB2319923B (en) * 1996-11-27 2000-09-27 Sony Uk Ltd Loudspeaker
US6243472B1 (en) * 1997-09-17 2001-06-05 Frank Albert Bilan Fully integrated amplified loudspeaker
DE19757098C2 (en) * 1997-12-20 2003-01-09 Harman Audio Electronic Sys Suspension for sound reproduction arrangements based on the bending wave principle
DE19757099A1 (en) 1997-12-20 1999-06-24 Nokia Deutschland Gmbh Contacting for a sound reproduction arrangement based on the bending wave principle
DE19757097B4 (en) 1997-12-20 2004-04-15 Harman Audio Electronic Systems Gmbh Sound reproduction device
JPH11275678A (en) * 1998-03-25 1999-10-08 Sony Corp Loudspeaker device
DE19821861A1 (en) 1998-05-15 1999-11-18 Nokia Deutschland Gmbh Device for dynamically exciting flat panel loudspeaker
DE19821860A1 (en) 1998-05-15 1999-11-18 Nokia Deutschland Gmbh Driver for flat panel loudspeaker
DE19821624A1 (en) 1998-05-15 1999-11-18 Nokia Deutschland Gmbh Projection screen with sound radiating segments
DE19840375C2 (en) 1998-09-04 2003-08-28 Harman Audio Electronic Sys baffle
DE10001410C2 (en) 2000-01-14 2001-12-06 Harman Audio Electronic Sys Flat speaker arrangement
DE10025460B4 (en) 2000-05-23 2004-03-18 Harman Audio Electronic Systems Gmbh tweeter
US6386315B1 (en) * 2000-07-28 2002-05-14 Awi Licensing Company Flat panel sound radiator and assembly system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720415A2 (en) * 1994-12-28 1996-07-03 Kabushiki Kaisha Kenwood Speaker component, speaker, and its manufacturing method
WO1997009861A1 (en) * 1995-09-02 1997-03-13 New Transducers Limited Inertial vibration transducers
WO1998022987A2 (en) * 1996-11-19 1998-05-28 Mctaggart Stephen I Laminated sheet product containing a printed battery

Also Published As

Publication number Publication date
US6748090B1 (en) 2004-06-08
ATE373400T1 (en) 2007-09-15
DE59914497D1 (en) 2007-10-25
DE19843079A1 (en) 2000-03-23
EP0987922B1 (en) 2007-09-12
EP0987922A3 (en) 2006-12-06

Similar Documents

Publication Publication Date Title
EP0591791A1 (en) Programmable hearing-aid
EP0136643A2 (en) Hearing aid
EP0835041A1 (en) Electric hearing aid with protection device against electromagnetic radiation
EP0987922B1 (en) Multi-resonant panel
DE60225345T2 (en) MODULAR SPEAKER
DE19716315C2 (en) Omnidirectional loudspeaker system
DE4329991B4 (en) Headphones with electrostatic push-pull converter
EP0500988B1 (en) Hearing aid to be worn on the head
DE1487475A1 (en) Loudspeaker with audio frequency amplifier
DE4121311C1 (en)
DE2360342B1 (en) Hearing aid for the hearing impaired
DE60002737T2 (en) DEVICE FOR AN IMPEDANCE-ADAPTING TUBE AMPLIFIER FOR AUDIO SIGNALS FOR INSERTING IN A SIGNAL WAY
EP3150035B1 (en) Electric device with a modular design
EP0989773A2 (en) Soundtransducer apparatus
DE3006365A1 (en) HOERGERAET
DE102010005394A1 (en) Electrical flush-mounted installation device for a mobile audio device
DE202008003377U1 (en) Device for conference tables or the like
DE2138750B2 (en) Modular microphone with amplifier in transducer module - has power supply and cable connector in secondary module
EP0054240A2 (en) Electric apparatus for mounting in the open air, especially a telephone set for two-way, duplex or loudspeaker equipment
DE19521124C1 (en) Termination device for loudspeaker box
DE69812743T2 (en) Protective screen with built-in speakers for monitor
EP1103936A2 (en) Emergency call device for vehicle
DE3306264A1 (en) Device for retrofitting a telephone set with a loudspeaker amplifier
WO2023198249A1 (en) Musical instrument pickup, correspondingly equipped system, and use of an automotive audio bus (a2b) for same
DE202007006900U1 (en) Multimedia-computer-keyboard, has audio output device provided within sound chamber of body of keyboard and connected with control circuit, where tweeter and woofer of output device are connected with output connector of power amplifier

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

17P Request for examination filed

Effective date: 20070111

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AKX Designation fees paid

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REF Corresponds to:

Ref document number: 59914497

Country of ref document: DE

Date of ref document: 20071025

Kind code of ref document: P

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070912

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070912

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071213

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071223

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

ET Fr: translation filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071212

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070912

26N No opposition filed

Effective date: 20080613

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070912

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080731

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070912

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080722

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080722

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080731

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20140717

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20140725

Year of fee payment: 16

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150722

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20160331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150731

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20180620

Year of fee payment: 20

Ref country code: GB

Payment date: 20180621

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 59914497

Country of ref document: DE

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

Expiry date: 20190721

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20190721