EP0972431A2 - Particle manipulation - Google Patents
Particle manipulationInfo
- Publication number
- EP0972431A2 EP0972431A2 EP98919213A EP98919213A EP0972431A2 EP 0972431 A2 EP0972431 A2 EP 0972431A2 EP 98919213 A EP98919213 A EP 98919213A EP 98919213 A EP98919213 A EP 98919213A EP 0972431 A2 EP0972431 A2 EP 0972431A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- plasma
- electrode
- particles
- frequency
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H3/00—Production or acceleration of neutral particle beams, e.g. molecular or atomic beams
- H05H3/04—Acceleration by electromagnetic wave pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
Definitions
- the invention relates to a method and a device for manipulating microscopic particles, in particular for manipulating particles in a plasma-crystalline state.
- a gas In the plasma state, which is generated, for example, by a glow or gas discharge, a gas comprises variously charged particles, such as positively or negatively charged ions, electrons and radicals, but also neutral atoms. If there are microscopic particles (of the order of ⁇ m) in the plasma, for example dust particles, they are electrically charged. Depending on the particle size and the plasma conditions (type of gas, plasma density, temperature, pressure etc.), the charge can reach a few hundred thousand electron charges. With suitable partial and plasma conditions, Coulomb forces are formed between the charged particles, under the effect of which the particles assume the low-plasma state as a two- or three-dimensional arrangement. In addition to the Coulomb forces, energy extraction from the particles through collisions with neutral atoms in the plasma also plays a role.
- FIG. 14 An arrangement for the formation of plasma crystals is shown by way of example in FIG. 14 (see also the publication Phys. Rev. Lett. Indicated above).
- a reactor vessel walls not shown; with a carrier gas and two flat discharge electrodes arranged one above the other.
- the lower circular or disc-shaped HF electrode 11 is controlled with an alternating voltage
- the upper, ring-shaped counter electrode 12 is grounded, for example.
- the electrode spacing is about 2 cm.
- a control circuit 13 is set up to connect the HF generator 14 to the HF electrode 11 and to control the grounding and disconnection circuit 15 of the counterelectrode 12.
- the high-frequency energy can be, for example, at a frequency of 13. 56 MHz and a power of around 5 W.
- the carrier gas is formed by noble gases or reactive gases at a pressure of approximately 0.01 - 2 mbar. Particles introduced into the reactor.
- the dust particles arrange themselves as a plasma crystal in an equilibrium state, in which the gravitational force G acting on the particles is balanced with the electric field force E, which is exerted on the dust particles as a function of their charge by e direct voltage field in the vicinity of the HF electrode 11 . If it is a monodisperse dust size distribution, the plasma crystal arrangement takes place either as a monolayer in one plane or as a multilayered state with the formation of 3-dimensional plasma crystals.
- the plasma crystal is visible to the naked eye when illuminated down to a particle size of around 1 ⁇ m.
- the visualization of the plasma crystal is improved by a helium-neon laser 16 arranged on the side, the beam of which is reduced by a cylinder lens combination 16a to the size of the lateral crystal extension with a thickness of approx. 150 ⁇ m fanned out
- the plasma crystal is observed with a CCD camera 17, which is provided with magnifying macro optics 18 and is controlled by an image processing system 19 which is also connected to the laser 16.
- the behavior of microscopic particles in plasmas is of little theoretical and practical interest.
- the theoretical interest relates in particular to the plasma crystals and their changes in state.
- the practical interest derives from the fact that plasma reactors, which are used in coating or processing methods (in particular semiconductor technology), have an electrode structure according to FIG. 14.
- the object of the invention is to provide a method for manipulating particles in plasmas, in particular for influencing the particles themselves or for modifying a substrate surface, and an apparatus for realizing the method.
- the invention is based on the following basic findings.
- the properties of a plasma crystal do not only depend on the properties of the plasma or the particles. Rather, it is possible to modify the shape of a plasma, in particular the shape of the outer border or the transverse shape, by locally selectively influencing the aforementioned equilibrium between gravitational forces and electrical forces.
- the external forces that act on the particles are varied, for example, by a location-dependent change in a static, quasi-static or low-frequency variable electric field between the electrodes of a plasma reactor, by a location-selective particle discharge or by location-selective particle irradiation (action of displacement forces).
- particles in the plasma can be arranged on any curved surfaces with any borders in a plasma-crystal state.
- the particles in the plasma can thus be moved in a predetermined manner, this movement being reversible, so that the plasma-crystal state even changes between different shapes. is adjustable.
- Another important aspect of the invention is that the locally selective deformation of a plasma crystal exposes different subregions of the plasma crystal to different plasma conditions.
- location-selective plasma treatment of parts of the plasma crystal e.g. coating or ablation
- Such a location-selective particle treatment can be followed by application on a substrate.
- an important aspect of the invention is that the formation of a plasma-crystalline state is unaffected by the presence of a substrate in a plasma reactor, in particular between reactor electrodes to form a glow or gas discharge.
- the distance can be reduced either by influencing the field forces that hold the particles in position or by moving the substrate surface. In this way, particles in the plasma-crystalline state can be deposited on substrates in any pattern.
- the invention thus provides a novel, location-selective, mask-free coating method with which modified surfaces are produced. Due to the particles applied, the modified surfaces have changed electronic, optical and / or mechanical properties. However, it is also possible to apply the locally selectively applied particles themselves for masking or conditioning the substrate surface. flat to use before another subsequent coating step.
- a device for manipulating particles in the plasma-crystal state comprises a reaction vessel which contains means for forming a plasma and at least one substrate.
- the means for forming the plasma are preferably formed by flat, essentially parallel electrodes, in the space between which the substrate is movable.
- the electrodes in the reaction vessel can have field-forming structures for the location-selective influencing of the particles in the plasma-crystalline state.
- the reaction vessel may also contain means for location-selective particle discharge (e.g. UV exposure means with a masking device), means for exerting a radiation pressure on the particles, observation means and control means.
- a particular aspect of the invention is the design of the electrodes for locally influencing the particles in the reaction vessel.
- an electrode device or: aoaptive electrode
- the high-frequency voltage is set up to generate or maintain a plasma state in the reaction vessel, while the direct or low-frequency voltage is set up to generate a static or slowly changing field distribution in the reaction vessel, under the effect of which the particles arrange or move in the reaction vessel.
- the adaptive electrode is the formation of a matrix arrangement formed from miniaturized electrode segments (point electrodes), the design of the matrix arrangement as an essentially flat, layer-orange component, the electrode side of which is the reaction vessel. points and the back carries control electronics, the pressure relief of the component z. B. by forming a negative pressure in the space to which the rear of the electrode device points, and the provision of a temperature control device for the control electronics.
- FIG. 1 shows a schematic side view of an arrangement according to the invention for manipulating particles in a plasma-crystalline state
- FIG. 2 shows a schematic plan view of part of the arrangement according to FIG. 1;
- FIG. 3 shows a plan view of a section of a plasma crystal in the free or adsorbed state to illustrate the coating technology according to the invention
- FIG. 4 shows a schematic illustration of an electrode design according to the invention for manipulating plasma crystals, and examples of a location-selective substrate coating
- FIG. 5 shows an exploded view of a reaction vessel provided with an adaptive electrode according to the invention
- FIG. 6 shows a schematic top view of an adaptive electrode according to FIG. 5;
- Fig. 7 is a schematic perspective view of a sub-unit the adaptive electrode shown in Figures 5 and 6 with the associated switching electronics;
- FIG. 8 shows a block diagram to illustrate the control electronics of an adaptive electrode according to the invention
- FIG. 9 shows a schematic illustration of a further example of a location-selective substrate coating
- Fig. 10 is an illustration to illustrate another
- Fig. 11 is a schematic plan view of a modified
- Fig. 12 e ne schematic illustration of a substrate coating with so-called bucky tubes
- FIG. 13 shows a schematic plan view of a further embodiment of an arrangement according to the invention for manipulating plasma crystals
- FIG. 14 is a schematic perspective view of a conventional plasma crystal formation reactor (prior art).
- the invention is described in the following using the example of a plasma arrangement which comprises a reactor as the reaction vessel, the structure of which in terms of plasma generation and plasma crystal observation essentially corresponds to the conventional structure as described above with reference to FIG. 14.
- a plasma arrangement which comprises a reactor as the reaction vessel
- the structure of which in terms of plasma generation and plasma crystal observation essentially corresponds to the conventional structure as described above with reference to FIG. 14.
- other constructed reactors can be used insofar as they are set up for the manipulation of particles according to the invention in the plasma-crystalline state.
- the schematic side view of an arrangement for manipulating plasma crystals shows an RF electrode 11, a grounded counter electrode 12, a control device 13, an RF generator 14, a switching device 15, an observation light source 16 with a cylindrical lens arrangement 16a, em Observation means in the form of a CCD camera 17 with magnification optics 18 and an associated control device 19.
- em Observation means in the form of a CCD camera 17 with magnification optics 18 and an associated control device 19.
- a dust dispenser 21 with a reservoir 22, a conditioning device 23 and an inlet means 24 is set up to introduce particles into the space between the HF electrode 11 and the counter electrode 12.
- the conditioning device 23 can contain, for example, a precharging device for the particles.
- the arrangement according to the invention further comprises a substrate 30 which can be moved in all spatial directions with an adjusting device 30.
- FIG. 1 does not show the wall of the reaction vessel, which forms a closed space for the carrier gas and vacuum-tightly encloses the electrodes 12, the substrate 30 and parts of the particle feed device.
- the wall can also have windows for emitting or coupling out radiation.
- FIG. 2 schematically shows a top view of parts of the arrangement according to the invention according to FIG. 1, namely the HF electrode 11 and the substrate 30 with the adjusting device 31.
- a discharge device 24, not shown in FIG. 1, is shown, which is used for the location-selective discharge of particles in the plasma crystal state.
- the discharge device 24 comprises a UV light source 25 and an imaging and masking system 26, with which parts of the plasma crystal can be irradiated and discharged under the action of UV radiation.
- plasma is ignited in a carrier gas.
- the plasma conditions can be selected by the person skilled in the art in accordance with the conditions of the plasma arrangement and the desired crystal properties. This can also be the case, for example, in low-energy argon discharges or silane discharges under the conditions used in plasma deposition in semiconductor technology.
- the use of a reactive gas such as Silane is for further treatment steps on the plasma crystal from Vorte ⁇ _.
- the energy of the ions in the plasma essentially corresponds to the gas temperature. This is determined by the discharge conditions and, if necessary, by an external cow device.
- nitrogen (not shown) can be provided in an arrangement according to the invention.
- the particles to be manipulated are introduced into the electrode space via the dust dispenser 21.
- the particle size is in the range from 20 nm to 100 ⁇ m.
- the lower limit of the particle size is determined by the pressure conditions in the reaction vessel and by the charge.
- the particles must be so heavy that in the plasma-free state the particles underneath Carry out a vertical movement under the influence of gravity and do not remain suspended.
- the upper limit of the particle size is determined by the so-called Debye length between the neighboring particles.
- the Debye length increases proportionally to the root of the plasma temperature or inversely proportional to the root of the plasma density.
- Any particles for example round, needle-shaped, tubular or plate-shaped particles, can be used.
- the particles must be solid or have sufficient shape stability under the plasma conditions.
- a material is preferably used which has special electrical or optical properties in the particle size range of interest.
- a material can also be used which is a composition of various substances, for example organic substances.
- the particles introduced into the plasma form a plasma crystal 10 (see FIGS. 1, 2).
- the plasma crystal is characterized by a flat, flat, regular particle arrangement.
- the particle arrangement can be a monolayer, as explained below with reference to FIG. 3, a multilayer or a three-dimensional structure.
- the HF electrode has a negative DC voltage.
- a diameter of the electrodes of approx. 8 to 10 cm, an electrode gap of approx. 2 cm and a bias voltage on the HF electrode 11 of approx. For example, -15 volts arrange polymer particles with a characteristic size of approx. 7 ⁇ m as a flat cloud with a distance of approx. 0.5 cm from the HF electrode 11.
- Electrode diameter can range, for example, from a few centimeters to 60 cm and the electrode spacing can range from 1 cm to 10 cm. Electrode parameters that are compatible with available and CVD reactors are preferably selected.
- the substrate 30 is arranged between the RF electrode 11 and the plasma crystal 10.
- the substrate material and the substrate shape can be used without the conditions for the plasma crystal formation changing.
- the particles are first set in a treatment position.
- This treatment position can correspond to the state of equilibrium at the end of the plasma crystal after the introduction of the parts into the reactor.
- By changing the carrier gas density a change in the particle charge and thus a change in the equilibrium state between gravitational force and electrical force can be achieved.
- the negative bias of the HF electrode changes or if the particles are externally discharged.
- the treatment position at least some of the particles are subjected to a plasma treatment or an application to the substrate in a next step.
- the plasma treatment can, for example, include flat coating or ablation. In the latter case, for example, a gradual lowering of the plasma crystal to a lower height above the HF electrode can result in the lowermost layers of the plasma crystal being subjected to a selective plasma etching process.
- a plasma change can be provided when the reactor is running.
- any suitable change in the distance between the plasma crystal and the substrate surface can be used for application to the substrate 30.
- the plasma crystal is lowered onto the substrate by changing the plasma conditions.
- the substrate is raised with the adjusting device 31 to the plasma crystal.
- the discharge between the electrodes is switched off, so that the plasma is extinguished and the particles fall onto the substrate.
- molecular attractive forces lead to adsorption of the particles on the substrate surface.
- the particle adsorption can be intensified by an overlap.
- FIG. 3 shows an example of the result of a particularly simple application of particles to the substrate surface in accordance with the third alternative mentioned above. It is a plasma-stable monolayer, as can be observed with the image recording device 17, in a free-hanging state in the plasma (structure with an unfilled border) and in the adsorbed state (structure with a filled border) shown on a substrate after the plasma has gone out.
- the particle dimensions are approx. 5 to 10 ⁇ m at distances of approx. 200 or 300 ⁇ m.
- the inventors have found for the first time that with this particularly simple application of the particles to the substrate, the regular arrangement is almost complete is retained, as shown by the minimal deviations between the particle position in the suspended or adsorbed state. Because of this property, it is possible to place microscopic particles with high accuracy on a substrate surface.
- FIG. 4 shows a schematic side view of a section of an arrangement for particle manipulation according to the invention.
- Particles in the plasma-crystalline state are arranged between the HF electrode 11 and the substrate 30 with the adjusting device 31 on the one hand and the grounded counter electrode 12.
- the plasma crystal 40 is designed with a multi-arched cross-sectional shape, which essentially corresponds to the course of the static electric field in the space between the electrodes.
- the field between the electrodes is deformed in a location-selective manner by an electrode structuring 41.
- the electrode structuring is formed by additional electrodes 41 (needle electrodes), which are subjected to a positive voltage and are isolated by the counterelectrode 12.
- the plasma crystal follows the location-selective deformation of the electric field, so that the multi-curved crystal shape is formed becomes.
- the additional electrodes 41 can be arranged in rows or flat. Instead of a positive potential, the additional electrodes 41 can also have a negative potential applied to them.
- FIG. 4 two examples of a location-selective substrate coating with a plasma crystal manipulated according to the invention are shown schematically. If the plasma crystal is formed in such a way that the crystal cross-sectional shape shows protruding bulges, an approach of the plasma crystal to the substrate 30 according to the above-mentioned first or second alternative leads to a coating pattern corresponding to the lower left part FIG. 4. Conversely, if a bulge pointing downward (due to negative potentials of the additional electrodes 41) is set, the mutual approach leads to a uniform coating according to the lower right part of FIG. 4.
- any coating pattern e.g. in the form of circles, rings, arches, strips or the like. form on the substrate surface. Additional modifications are possible if the additional electrodes according to FIG. 4 are arranged movably so that the manipulation of the plasma stall 40 can be varied over time. Accordingly, different coating patterns can be applied in succession to the substrate 30.
- FIG. 5 shows an exploded view of a reaction vessel 20 which is set up to implement the invention.
- the reaction vessel 20 is not only adapted to the adaptive electrode explained below, but can also be realized in connection with the embodiments of the invention shown in the other figures.
- the reaction vessel 20 consists of an electrode holder 201, which is in the recipient bottom
- the reaction space is from the recipient base 202 with the electrode holder 201, the recipient wall
- the recipient lid 204 has a window insert 206 which is attached to a unit 207 of the recipient lid 204 which can optionally be rotated in a vacuum-tight manner with respect to the recipient lid 204. It can be provided that the unit 207 even under Va is rotatable in a vacuum.
- the window insert 206 is designed to accommodate different observation or diagnostic means for the particles manipulated in the reaction space.
- the parts of the reaction vessel 20 are connected in the usual way as in a vacuum vessel. In addition, different diagnostic units can also be introduced via side flanges.
- FIG. 5 also shows the adaptive HF electrode 11 and the grounded counter electrode 12 (cf. FIG. 1).
- the counterelectrode 12 is ring-shaped in order to form an observation opening for the observation means (not shown).
- the adaptive electrode 11 has, in accordance with the customary cylindrical design of vacuum vessels, in order to form a field course which is as undisturbed as possible by external recipient structures.
- a ring electrode 112 Inside the border there are a ring electrode 112 and a plurality of electrode segments, which in the example shown are in electrode sub-assemblies 113 are summarized.
- the ring electrode 112 is shown as a continuous, continuous electrode area and is set up for field correction (flattening) of the electrical field of the highly segmented electrical area.
- the subunits In the transition area between the electrode subunits and the ring electrode, the subunits are changed in height such that the ring (possibly milled out from the underside) can be shot over the subunits.
- the electrode subunits 113 are provided in an inner area of the electrode 11 surrounded by the ring electrode 112. hen and each include a plurality of electrode segments.
- the shape, size and number of the electrode segments is designed depending on the application, depending on the spatial requirements for an electrical direct or low frequency field (E) between the electrodes 11, 12 (cf. FIG. 1).
- E electrical direct or low frequency field
- the greatest variability of the adjustable field profiles is achieved by a matrix arrangement of a multiplicity of point-shaped electrode segments (hereinafter referred to as point segments or point electrodes).
- point segments or point electrodes here means that although each electrode element has a finite surface pointing towards the reaction space, it has dimensions which are considerably smaller than the overall size of the electrode 11.
- each point electrode has a characteristic length dimension, which is reduced by a factor of around 1/500 to 1/100, for example 1/300, compared to the outer dimension (diameter) of the electrode 11.
- the matrix grid can also be chosen larger.
- a characteristic length dimension of the point electrode is preferably equal to or less than the Debye length of the particles in the plasma (for example about 3 mm).
- An adaptive electrode 11 has, for example, an outer diameter of approximately 50 cm with a width of the ring electrode 112 of approximately 5 cm, so that the inner region of the electrode segments 113 has a diameter of approximately 40 cm.
- the total of the adaptive electrode subunits 113 can comprise, for example, around 50,000 to 100,000 point segments.
- a preferred dimension of the segmentation is a 1.27 mm grid which is compatible with available 1/20 inch plug devices, as will be explained in more detail below with reference to FIG. 7. In this case, around 80,000 point segments which are electrically insulated from one another can be arranged within the ring electrode 112. For reasons of clarity, the lower part of FIG. 6 does not show each individual point segment, but the electrode sub-assemblies (point segment groups).
- the grouping of point segments in groups is not a mandatory feature of the invention, but has advantages in electrode control, as will be explained in detail below with reference to FIGS. 7 and 8.
- the line pattern in the lower part of FIG. 6 shows electrode subunits 113, each of which contains 8 • 32 point segments. This is illustrated by the upper part of FIG. 6, which represents an enlarged detail (X) from the edge of the electrode subunits 113.
- the invention is not limited to the combination of 8 • 32 point segments to form an electrode sub-assembly, but can comprise other groups depending on the construction and application (eg 16 • 16 point segments).
- FIG. 6 shows, by way of example, an electrode sub-region 113 with a multiplicity of point segments or point electrodes 115, which are in each case electrically separated from one another by insulating webs.
- the point electrodes 115 have square end faces facing the reaction space and having a width of 1.25 mm.
- the Elektrodensubemheit 113 includes, for example 8 • 32 point electrodes 115. From Fig. 6 it is also apparent that the ring electrode 113 overlap each other and the range of 112 Elektrodensubem lake. An optimal, dense filling of the inner area of the electrode 11 is thus also achieved at the edge of the ring electrode 112, as can be seen in the enlarged part of FIG. 6.
- Both the ring electrode 112 and the electrode subunits 113 consist of a metallic electrode material.
- the material is selected depending on the application and the desired manufacturing process for the electrode. In the etching processes explained below, stainless steel, aluminum or copper can be used as the electrode material.
- the latter is preferably covered with an insulation layer, which consists, for example, of the same insulation material as the insulation webs 116.
- the insulation layer can, for example, have a thickness of around 10 ⁇ m to 100 ⁇ m, preferably 20 ⁇ m. Any material that maintains sufficient insulation strength between the point electrodes at the voltage values that occur is suitable as the insulation material of the insulation webs 116.
- This insulation material is, for example, epoxy resin or another suitable plastic.
- the electrode sub-unit 113 again comprises 8 * 32 point electrodes 115 by way of example. These form (together with the other segments of the adaptive electrode, not shown) an upper electrode area , which is also referred to as segmented electrode 120.
- the segmented electrode furthermore consists of the insulation plate 122, into which a multiplicity of sockets are incorporated (not shown), the number and arrangement of which corresponds in each case to the point electrodes 115 of the electrode sub-assembly 113.
- the sockets are designed to accommodate plug units 123, which can optionally also be designed as an integral base plate.
- the plug units 123 are sockets and establishing an electrical connection to the sockets, which are integrated in the insulation plate, via conductive pins. There is an electrical contact between each socket of the insulation plate 122 and the corresponding point electrode 115.
- the structure of the insulation plate 122 depends on the manufacturing method of the entire electrode 11 or the area of the electrode sub-assemblies 113. A manufacturing method of this type is illustrated below by way of example.
- a bore is made through the insulation plate 122 to the later position of the respective point electrode 115, so that at the end of each point-shaped electrode, which adheres to the insulation plate with conductive adhesive, an associated socket for Recording a pin is snapped from the plug device 123.
- a metallic plate or foil made of the selected electrode material with the desired outer diameter or thickness parameters is glued to a plate made of insulation material with a thickness corresponding to the desired thickness of the insulation plate 122. Material is then removed from the metallic electrode foil to form the point electrodes 115, the corresponding positions of the point electrodes being arranged above the holes in the insulation plate.
- channel-shaped spaces are formed in accordance with the pattern of the insulating webs 116 (cf. FIG. 6). This material removal is carried out, for example, by a masked etching process in which the metallic foil is removed continuously, except at the desired positions of the point electrons, up to the insulation plate.
- the channels for forming the insulation webs 116 are then filled with an insulation material. This is done, for example, by pouring out a hardenable resin.
- corresponding structuring methods are used to form sockets m on the insulation plate 122, which are each closed to form the adaptive electrode hm and are electrically connected to the respective point electrode 115.
- the segmented electrode forms a vacuum-tight closure of the reaction space.
- plug units 123 On the side of the plug units 123 facing away from the segmented electrode, printed circuit boards 124 are attached, which carry connecting plugs 126 to the external electronics and address decoder, multiplex and demultiplexing circuits 127, 128, 129, the functions of which are described in detail below with reference to FIG 8 is explained.
- four plug units 123 (including the circuit boards 124) for 2 32 point electrodes 115 each are combined to form a MUX module for controlling 8 32 point electrodes.
- the distance between the four corresponding boards 124 is determined by the grid dimension and is slightly larger than the height of the attached circuits 127, 128, 129. Again, this dimensioning can be changed depending on the size and application.
- the four boards 124 are z. T. conductive stabilization units 126a interconnected.
- a color coding 117 can be provided on the underside of the insulation plate 122 for each electrode unit 113.
- the circuit boards 124 are designed in such a way that the electronic switching elements illustrated in FIG. 8 can be integrated.
- FIG. 8 shows in the reaction vessel 20 (see FIG. 5) point electrodes 115 as part of the HF electrode (adaptive electrode 11) and the counter electrode 12 (see also eg FIG. 1).
- the first and last point electrodes of the first and fourth circuit boards 124 are enlarged (mat positions (1,1), (2, 64), (7,1), (8, 64) and the ring electrode 112 is also shown.
- the electronics area 130 comprises all boards 124 (see FIG. 7) which are assigned to the point electrodes 115.
- a circuit board 124 for 8 • 32 point electrodes 115 is shown here as an example.
- the electronics area 130 which represents the rear side of the adaptive electrode 11 facing away from the reaction space, is subjected to a negative pressure in order to avoid an excessive pressure load on the adaptive electrode 11.
- the pressure in the electronics area 130 can be, for example, in the range from 10 to 100 mbar.
- Supply circuits 140 and a control device 150 are provided separately from the electronics area 130 under atmospheric conditions.
- the supply circuits 140 include an RF generator 141, a supply voltage circuit 142 for the ring electrode 12, and a control voltage circuit 143.
- the circuit board 124 has an embedding circuit 131 for each of the point electrodes 115.
- the coupling circuit 131 is provided for each point electrode (or generally each electrode segment) of the adaptive electrode 11 simultaneously with the output voltage of the HF generator 141 and with a segment-specific output voltage of the control voltage circuit 143 to act on.
- the fact that the HF supply is high-frequency and the location-selective generation of a field distribution in the reaction space is low-frequency or with a static electric field is used to particular advantage according to the invention.
- the output parameters of the HF generator 141 are, for example, an output frequency in the MHz range (corresponding to the usual frequencies for generating and maintaining plasmas, for example 12 to 15 MHz) and a voltage range of ⁇ 150 V ss (sinusoidal).
- each coupling circuit 131 contains a capacitor-resistor combination (C1-C256, R1-R256), the RF power being coupled together across all capacitors.
- An addressing circuit 132 is also provided on each board, which includes the address decoders, multiplexer and demultiplexer circuits 127, 128, 129 mentioned above (see FIG. 7) which cooperate as follows.
- the address decoding circuit 127 selects which voltage value from the control voltage circuit 143 with the multiplex circuit 128 to and from a central line 133 the demultiplexing circuit 129 is switched to an coupling circuit 131, again selected by the address decoding circuit 127, according to a point electrode 115.
- the control voltage circuit 143 supplies sixty-four control voltage values correspondingly on sixty-four supply lines (cf. also FIG. 8).
- the control voltage values on the voltage supply bus 143a differ, for example, with voltage steps of 0.625 V and cover the range of ⁇ 20 V (DC voltage).
- the multiplex circuit 128 makes a 1:64 selection for connecting one of the sixty-four supply lines 143a to the central line 133.
- 256 coupling circuits 131 corresponding to the 256 point electrodes 115 are also provided, so that the demultiplex circuit 129 has a 256th : 1 selection from the central line 133 to one of the coupling circuits 131.
- the point electrodes 115 belonging to a circuit board 124 are preferably controlled serially according to a certain sequence pattern.
- a double function of the coupling capacitors C1-C256 is used with particular advantage.
- the coupling-in capacitors C1-C256 are to be recharged cyclically to the desired voltage value.
- the coupling capacitors are designed so that with the application-dependent electrode voltages or power losses, the charge loss at the respective coupling capacitor and thus the voltage drop at the associated point electrode during a drive cycle ( ⁇ 1%) is in relation to the electrode voltage.
- the switching frequency of the address decoding circuit 127 is selected as a function of the number of point electrodes 115 belonging to a subunit 113, the frequency of the control voltage changes and the voltage constancy during a cycle at the point electrodes so that the serial cycle through the Subunit or segment group 113 has a significantly higher frequency than the low frequency voltage of the control voltage change.
- This rapid switching between the voltage stages of the control voltage circuit 143 also permits a location-selective modeling of the field profile in the reaction space 20 in accordance with an alternating field behavior.
- the entire control electronics 140, 150 according to FIG. 8 is potentially superimposed on the HF signal and is therefore decoupled in terms of circuitry from the control computer, the network and other interfaces for cooling purposes etc. Control signals are preferably input via control device 150 via an optocoupler.
- the adaptive electrode 11 described above and the associated control electronics can be modified as follows.
- the number, shape and arrangement of the electrode segments can be changed depending on the application.
- the combination of m segment groups can be changed depending on the application.
- the structure in the reaction vessel can be reversed by attaching the grounded electrode 12 on the lower side and the HF electrode 11 (in particular the adaptive electrode 11) on the upper side.
- the most important advantage of the adaptive electrode 11 is the creation of a programmable spatial stationary or low-frequency electrical field profile in the reaction space, with which charged particles can be held at specific locations or moved in a specific manner. As a result, the particles to be manipulated can be positioned in any way.
- FIG. 9 shows a schematic side view of parts of an arrangement according to the invention, in which the plasma crystal 50 between the HF electrode 11 and the substrate 30 with the adjusting device 31 on the one hand and the counter electrode 12 on the other hand is designed step-like.
- This plasma crystal shape can be achieved, for example, by using an unloading device according to FIG. 2.
- an unloading device according to FIG. 2.
- a partial irradiation Development of the plasma crystal with UV light is discharged em part of the particles (the left area in Fig. 9), so that the equilibrium with unchanged plasma conditions m a small height above the RF electrode 11 is adjusted.
- a partial coating of the substrate 30 can be achieved, as is illustrated in the lower part of FIG. 4.
- the electric field between the RF electrode 11 and the counter electrode 12 can be influenced in such a way that the plasma crystal only forms in an area with a potential minimum that extends over the Parts of the RF electrode 11 are located that are not covered by the structural elements 61.
- the structural elements 61 are formed, for example, by covering baffles that leave a stripe-shaped space, the plasma crystal 60 has a stripe shape (extension direction perpendicular to the plane of the drawing in FIG. 10).
- the plasma crystal 60 can in turn be stored on the substrate 30 according to the invention.
- the HF electrode 11 can be structured or masked with any structural elements 61.
- the schematic plan view of an arrangement according to the invention shows the HF electrode 11 with the control device 13 and the substrate 30 with the adjusting device 31.
- the HF electrode 11 carries structural elements (not shown) according to FIG. fenformigen plasma crystals.
- the shape of the plasma crystal 70 can be changed further by applying an alternating voltage to the deflecting electrodes 71 synchronously.
- the deflection electrodes 71 are emitted to a lateral deflection of a layered plasma crystal m in the layer plane. judges. For example, a serpentine vibration of the particles can be achieved, as is sketched in the lower part of FIG. 11. This crystal arrangement can in turn be removed on the substrate 30.
- FIG. 12 shows a surface coating with elongated particles, which is designed in particular to achieve anisotropic optical surface properties.
- the elongated particles are, for example, so-called bucky tubes (microscopic, tubular particles consisting of a regular arrangement of carbon atoms).
- the bucky tubes can have a length of a few micrometers and a diameter of around 10 to 20 nm, for example. These particles have a relatively large surface area, which leads to a strong charge in the plasma and to polarization.
- the bucky tubes are regularly aligned with their long dimension perpendicular to the planes of the discharge electrodes.
- FIG. 13 which shows a top view of parts of an arrangement according to the invention
- manipulation of the plasma crystal 90 is also possible by exerting a radiation pressure from an external light source 91.
- the external control light source can be formed, for example, by a helium-neon laser with an output of around 10 mW.
- the radiation pressure exerted on the particles with the laser beam permits precise position control, which can be monitored using an observation device 17 (see FIG. 1).
- a plasma crystal can preferably be rotated (see arrow), or else it can be arranged laterally Move the substrate.
- a device according to the invention without application on a substrate as a display device, in which anisotropic parts for displaying predetermined patterns can be switched between different “directions”, each of which, for example, has a “blackening” or “transparency” state "represent. It is also possible to manipulate different sized particles in different heights of a plasma and to illuminate them laterally with excitation light sources of different wavelengths, so that colored displays of high resolution can be built up.
- a particular advantage of the invention is that it can be implemented by an uncomplicated modification of conventional plasma reactors (e.g. from circuit production), the BetnecsDedmgitch are well known and controllable.
- the invention can be used for the production of so-called designer materials with special surface properties.
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- Spectroscopy & Molecular Physics (AREA)
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Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19713637A DE19713637C2 (en) | 1997-04-02 | 1997-04-02 | Particle manipulation |
DE19713637 | 1997-04-02 | ||
PCT/EP1998/001938 WO1998044766A2 (en) | 1997-04-02 | 1998-04-02 | Particle manipulation |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0972431A2 true EP0972431A2 (en) | 2000-01-19 |
EP0972431B1 EP0972431B1 (en) | 2005-10-26 |
Family
ID=7825258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98919213A Expired - Lifetime EP0972431B1 (en) | 1997-04-02 | 1998-04-02 | Particle manipulation |
Country Status (5)
Country | Link |
---|---|
US (1) | US6517912B1 (en) |
EP (1) | EP0972431B1 (en) |
JP (1) | JP2001518230A (en) |
DE (2) | DE19713637C2 (en) |
WO (1) | WO1998044766A2 (en) |
Families Citing this family (13)
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DE19814871A1 (en) * | 1998-04-02 | 1999-10-07 | Max Planck Gesellschaft | Method and device for targeted particle manipulation and deposition |
DE19926494C2 (en) * | 1999-06-10 | 2001-07-26 | Max Planck Gesellschaft | Method and device for imaging microscopic particles |
JP2006318702A (en) * | 2005-05-11 | 2006-11-24 | Mitsubishi Electric Corp | Manufacturing method of electron emission source |
US9246298B2 (en) * | 2012-06-07 | 2016-01-26 | Cymer, Llc | Corrosion resistant electrodes for laser chambers |
US9478408B2 (en) | 2014-06-06 | 2016-10-25 | Lam Research Corporation | Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging |
US10081869B2 (en) | 2014-06-10 | 2018-09-25 | Lam Research Corporation | Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates |
US10047438B2 (en) | 2014-06-10 | 2018-08-14 | Lam Research Corporation | Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas |
CN114666965A (en) | 2017-06-27 | 2022-06-24 | 佳能安内华股份有限公司 | Plasma processing apparatus |
PL3648550T3 (en) | 2017-06-27 | 2021-11-22 | Canon Anelva Corporation | Plasma treatment device |
WO2019004188A1 (en) | 2017-06-27 | 2019-01-03 | キヤノンアネルバ株式会社 | Plasma treatment device |
SG11201912567RA (en) | 2017-06-27 | 2020-01-30 | Canon Anelva Corp | Plasma processing apparatus |
TWI693864B (en) * | 2017-06-27 | 2020-05-11 | 日商佳能安內華股份有限公司 | Plasma treatment device |
KR102439024B1 (en) | 2018-06-26 | 2022-09-02 | 캐논 아네르바 가부시키가이샤 | Plasma processing apparatus, plasma processing method, program, and memory medium |
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US5108543A (en) | 1984-11-07 | 1992-04-28 | Hitachi, Ltd. | Method of surface treatment |
JPS61158877A (en) | 1984-12-27 | 1986-07-18 | 小宮山 宏 | Manufacture of ceramic porous membrane |
DE3729347A1 (en) | 1986-09-05 | 1988-03-17 | Mitsubishi Electric Corp | PLASMA PROCESSOR |
US4740267A (en) | 1987-02-20 | 1988-04-26 | Hughes Aircraft Company | Energy intensive surface reactions using a cluster beam |
JP2906057B2 (en) | 1987-08-13 | 1999-06-14 | セイコーエプソン株式会社 | Liquid crystal display |
JP2549433B2 (en) | 1989-03-13 | 1996-10-30 | 株式会社日立製作所 | Electro-optical modulator driving method and printer |
DE4018954A1 (en) | 1989-06-15 | 1991-01-03 | Mitsubishi Electric Corp | DRYING MACHINE |
US5102496A (en) * | 1989-09-26 | 1992-04-07 | Applied Materials, Inc. | Particulate contamination prevention using low power plasma |
DE4118072C2 (en) | 1991-06-01 | 1997-08-07 | Linde Ag | Process for shock wave coating of substrates |
JP3137682B2 (en) * | 1991-08-12 | 2001-02-26 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
US5332441A (en) * | 1991-10-31 | 1994-07-26 | International Business Machines Corporation | Apparatus for gettering of particles during plasma processing |
CH687987A5 (en) * | 1993-05-03 | 1997-04-15 | Balzers Hochvakuum | A process for the increase of the deposition rate in a plasma discharge space and plasma chamber. |
EP0624896B1 (en) * | 1993-05-13 | 1999-09-22 | Applied Materials, Inc. | Contamination control in plasma contouring the plasma sheath using materials of differing rf impedances |
DE4316349C2 (en) * | 1993-05-15 | 1996-09-05 | Ver Foerderung Inst Kunststoff | Process for the internal coating of hollow bodies with organic cover layers by plasma polymerization, and device for carrying out the process |
US5456796A (en) * | 1993-06-02 | 1995-10-10 | Applied Materials, Inc. | Control of particle generation within a reaction chamber |
KR100333237B1 (en) * | 1993-10-29 | 2002-09-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Contaminant reduction improvements for plasma etch chambers |
US5518547A (en) * | 1993-12-23 | 1996-05-21 | International Business Machines Corporation | Method and apparatus for reducing particulates in a plasma tool through steady state flows |
JPH07226395A (en) | 1994-02-15 | 1995-08-22 | Matsushita Electric Ind Co Ltd | Vacuum plasma treatment apparatus |
US5573597A (en) * | 1995-06-07 | 1996-11-12 | Sony Corporation | Plasma processing system with reduced particle contamination |
US5637190A (en) * | 1995-09-15 | 1997-06-10 | Vanguard International Semiconductor Corporation | Plasma purge method for plasma process particle control |
DE19538045C1 (en) * | 1995-10-13 | 1997-01-30 | Forschungszentrum Juelich Gmbh | Device for coating substrates |
US5746928A (en) * | 1996-06-03 | 1998-05-05 | Taiwan Semiconductor Manufacturing Company Ltd | Process for cleaning an electrostatic chuck of a plasma etching apparatus |
US5854138A (en) * | 1997-07-29 | 1998-12-29 | Cypress Semiconductor Corp. | Reduced-particle method of processing a semiconductor and/or integrated circuit |
-
1997
- 1997-04-02 DE DE19713637A patent/DE19713637C2/en not_active Expired - Fee Related
-
1998
- 1998-04-02 EP EP98919213A patent/EP0972431B1/en not_active Expired - Lifetime
- 1998-04-02 DE DE59813144T patent/DE59813144D1/en not_active Expired - Fee Related
- 1998-04-02 JP JP54117798A patent/JP2001518230A/en active Pending
- 1998-04-02 WO PCT/EP1998/001938 patent/WO1998044766A2/en active IP Right Grant
- 1998-04-02 US US09/402,295 patent/US6517912B1/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
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See references of WO9844766A3 * |
Also Published As
Publication number | Publication date |
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DE19713637C2 (en) | 1999-02-18 |
DE59813144D1 (en) | 2005-12-01 |
WO1998044766A2 (en) | 1998-10-08 |
WO1998044766A3 (en) | 1999-01-07 |
US6517912B1 (en) | 2003-02-11 |
JP2001518230A (en) | 2001-10-09 |
EP0972431B1 (en) | 2005-10-26 |
DE19713637A1 (en) | 1998-10-22 |
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