EP0969705A2 - Connector particularly for a thin smart card - Google Patents

Connector particularly for a thin smart card Download PDF

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Publication number
EP0969705A2
EP0969705A2 EP99112609A EP99112609A EP0969705A2 EP 0969705 A2 EP0969705 A2 EP 0969705A2 EP 99112609 A EP99112609 A EP 99112609A EP 99112609 A EP99112609 A EP 99112609A EP 0969705 A2 EP0969705 A2 EP 0969705A2
Authority
EP
European Patent Office
Prior art keywords
contact
contact carrier
carrier
contact element
contacting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99112609A
Other languages
German (de)
French (fr)
Other versions
EP0969705A3 (en
Inventor
Manfred Reichardt
Gerhard Braun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amphenol Tuchel Electronics GmbH
Original Assignee
Amphenol Tuchel Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amphenol Tuchel Electronics GmbH filed Critical Amphenol Tuchel Electronics GmbH
Publication of EP0969705A2 publication Critical patent/EP0969705A2/en
Publication of EP0969705A3 publication Critical patent/EP0969705A3/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Definitions

  • the invention relates to a contacting device with a contact carrier, in which preferably several contact elements arranged, preferably injected.
  • FIG. 1 A known contacting device on which the relating to the following invention is shown in FIG.
  • This Contacting device has a contact carrier which to accommodate the contact forces that occur during contact encloses the fastening part of the contact elements. This results in the minimum overall height of the contact carrier from the sum of the material thickness below the Contact element, the material thickness of the contact element and the material thickness over the contact element.
  • the material thickness the extrusion can not be reduced arbitrarily be otherwise the stability of the contacting device is too low, or the bearing point due to small wall thickness is not completely encapsulated (Minimum wall thickness for mold filling).
  • Another problem with the known contacting device 4 is that the compared to Contact part opposite connection part of the Contact element before or after the injection or insertion process the or the contact elements in the contact carrier must be deformed, in particular for SMD solder connections to achieve the necessary coplanarity. Required due to the spring properties of the contact this is a very precise setting and testing during the Manufacturing process.
  • the invention has for its object a contacting device of the type described in such a way that a good fixation of the contact elements in a contact carrier is achieved with a minimal overall height.
  • the invention provides a contacting device of the type mentioned in claim 1.
  • Preferred embodiments of the invention result from the dependent claims.
  • the contacting device 1 for a chip card reader according to state of the art to be explained.
  • the contacting device 1 consists of a large number of contact elements 2 (only one is shown) and a contact carrier 7 together.
  • the contact carrier 7 is generally on one Printed circuit board 11 and the contact elements 2 are electrically connected to the circuit board (e.g. at solder joints).
  • the contact elements 2 are through several zones or Parts formed.
  • 4 is a contact coupling part 3 of the contact element 2, on which a first flat or horizontal part 4, an angled or sloping part 6 and a second flat or horizontal Part 5 connects.
  • the contact element is connected to the printed circuit board 11.
  • the first flat part 4 of the contact element 2 is from Contact carrier 7 held in a fixed position.
  • the Contact carrier 7 has an upper part 8 and a lower part Part 9 on.
  • the contact element 2 lies with one part its bottom 19 on the holding surface 9a of the lower Part 9 of the contact carrier 7.
  • Part of the top 18 of the contact element 2 is from the bottom 8a of the upper part 8 of the contact carrier 7 held.
  • a contacting force 14 (F K ) is exerted on the contact coupling part 3 of the contact element 2, the opposing forces 16 (F st.V ) and 15 (F st.H ) on the contact carrier counteract it.
  • the supporting force 16 (F st.V ) of the lower part 9 of the contact carrier counteracts the contacting force 14.
  • the supporting force 15 (F st.H ) of the upper part 8 of the contact carrier counteracts a deflection of the contact element 2 upwards.
  • the overall height 13 of the contacting device 1 results from the sum of the thicknesses or heights of the contact element 2 and the upper and lower parts 8, 9 of the contact carrier 7.
  • the thickness of the material of the contact carrier 7 (upper and lower part 8.9) cannot be chosen arbitrarily because otherwise the required stability will not be achieved becomes what is therefore a lower limit for the overall height specifies.
  • the contact element is for connection to the printed circuit board 11 2 bent towards the circuit board 11 (Compare the sloping part 6). Parts 6 of the Contact elements are subsequently shaped and should be the most accurate coplanarity for the solder connections (generally in the area of the second flat part 5 of the Ensure contact element) on the circuit board 11. Required due to the spring property of the contact element this is a very precise setting and testing during of the manufacturing process.
  • FIG. 1 illustrates a contacting device 10 for a smart card reader according to the present invention in a top view. It has contact elements 20 and one Contact carrier 30 on. Between the contact elements 20 Intermediate parts 29 of the contact carrier 30 form. Contact surfaces 39 of the intermediate parts 29 touch side surfaces 27 of the contact elements. In the area of the contact elements 20 is the width of the contact carrier 30 in front and rear parts 31 and 32 divided (see see also Fig. 2).
  • the contacting device 10 is in one in FIG Section in the area of a contact element 20 along the Line 2-2 illustrates.
  • Fig. 2 it can be seen that the contact element 20 into four essential parts is divided into a contact coupling part 21, one first flat or horizontal part 22, an oblique or angled part 23 and a second flat or horizontal part 24.
  • the angled part 23 also forms the flat parts an angle that is exemplified by the angle 25 is shown in Fig. 3.
  • the contact carrier is in the illustrated embodiment around fastening parts 28 of the contact elements 20 injection molded (the contact elements can also be used be) and is divided in the area of the fasteners 28 across its width 26 in the aforementioned first front or lower parts 31 and second rear or upper parts 32.
  • Fig. 3 is an enlarged section of Fig. 2 and illustrates the contacting device 10 in the area of the contact carrier 30.
  • Part of a top 41 and a bottom 40 of the contact element 20 touch the corresponding support or holding surfaces 33 and 34 of the Contact carrier 30.
  • In the area of the front part 31 of the Contact carrier 30 is a bearing surface 42 of the contact element 20 on a support or holding surface 36 of the Contact carrier 30 and is held by this.
  • in the Area of the rear part 32 of the contact carrier 30 holds a holding surface 35 of the contact carrier part 43 of the Top 41 of the contact element 20.
  • In the area of the angled Part 23 of the contact element 20 is embedded oblique holding surface part 38 of the front contact carrier part 31 an inclined part 44 of the underside 40 of the Contact element.
  • An inclined holding surface part 37 of the rear contact carrier part 32 holds one in this area sloping part 45 of the top 40 of the contact element 20th
  • the underside 40 of the contact element a bearing surface part 46 on the circuit board 11 and generally stands with a top 12 of the PCB 11 in contact.
  • the bearing surface part 46 of the contact elements, the top 12 of the circuit board and an underside 61 of the front part 31 of the contact carrier 30 are preferably coplanar.
  • part 47 of the top 41 of the contact elements 20 coplanar with a top 62 of the posterior Part 32 of the contact carrier 30.
  • part 47 of the Top 41 and below the support surface part 46 the underside 40 of the contact elements 20 is located no contact carrier material.
  • a contacting force 14 is exerted on the contact coupling part 21 of the contact element 20
  • a torque is generated rotating about an imaginary bearing point in the contact carrier 30 in the direction of the contacting force 14.
  • Opposing forces 16 and 15 on the contact carrier 30 counteract this torque.
  • the supporting force 16 (F st.V ) of the front part 31 of the contact carrier counteracts the contacting force 14.
  • This force 16 is distributed over the holding surface parts 36 and 38 of the front contact carrier part 31.
  • the supporting force 15 (F st.H ), which is exerted by the rear contact carrier part 32 from above onto the contact element 20, is distributed over the holding surface parts 35 and 37 of the rear Contact carrier part 32.
  • the first and second flat parts 22 and 24 and the angled one Part 23 of the contact element form within the Contact carrier 30 one level. This allows a height 50 can be achieved, which is lower than in relation prior art described in Fig. 4, since the contact elements to be supported only in the areas who need it.
  • the step is also designed such that a part 46 the bottom 40 of the contact element after assembly the contacting device 10 on the circuit board 11 in Comes into contact with the printed circuit board 11 and parallel or coplanar to the surface 12 and the bottom 61 thereof front contact carrier part 31 runs.
  • the stage will fixed by the contact carrier.
  • An elastic dodge of the contact element 20 in the region of the second plane Part 24 due to spring forces from the deformation is therefore no longer possible. This has the advantage that all contact elements in their parts 24th can be coplanar and in this position are fixed by the contact carrier.
  • fixation of the level means the sloping part 23 in the contact carrier 30 that the contact elements 20 also with respect to transverse displacements that are parallel can be anchored to the flat parts 22 and 24 are and are held in their position.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connecting Device With Holders (AREA)

Abstract

The contact upper section (21) makes connection to the card pads. A fastening section is embedded in the contact holder (30), and ends at the terminal section (24) connecting to the circuit board (11). The contact holder surrounds the contact to the extent required to accept the loading (14).

Description

Die Erfindung bezieht sich auf eine Kontaktiervorrichtung mit einem Kontaktträger, in dem vorzugsweise mehrere Kontaktelemente angeordnet, vorzugsweise eingespritzt sind.The invention relates to a contacting device with a contact carrier, in which preferably several contact elements arranged, preferably injected.

Eine bekannte Kontaktiervorrichtung, auf die sich die folgende Erfindung bezieht, ist in Fig. 4 gezeigt. Diese Kontaktiervorrichtung weist einen Kontaktträger auf, der zur Aufnahme der beim Kontaktieren auftretenden Kontaktkräfte den Befestigungsteil der Kontaktelemente umschließt. Dabei ergibt sich die minimale Bauhöhe des Kontaktträgers aus der Summe der Materialdicke unter dem Kontaktelement, der Materialdicke des Kontaktelements und der Materialdicke über dem Kontaktelement. Die Materialdicken der Umspritzung können dabei nicht beliebig reduziert werden, da sonst die Stabilität der Kontaktiervorrichtung zu gering ist, oder die Lagerstelle aufgrund zu geringer Wandstärke nicht vollständig umspritzt wird (Mindestwandstärke für Formfüllung).A known contacting device on which the relating to the following invention is shown in FIG. This Contacting device has a contact carrier which to accommodate the contact forces that occur during contact encloses the fastening part of the contact elements. This results in the minimum overall height of the contact carrier from the sum of the material thickness below the Contact element, the material thickness of the contact element and the material thickness over the contact element. The material thickness the extrusion can not be reduced arbitrarily be otherwise the stability of the contacting device is too low, or the bearing point due to small wall thickness is not completely encapsulated (Minimum wall thickness for mold filling).

Ein weiteres Problem bei der bekannten Kontaktiervorrichtung gemäß Fig. 4 besteht darin, daß der gegenüber dem Kontaktteil entgegengesetzt liegende Anschlußteil des Kontaktelements vor oder nach dem Einspritz- bzw. Einsetzvorgang des bzw. der Kontaktelemente in den Kontaktträger verformt werden muß, um die insbesondere für SMD-Lötanschlüsse erforderliche Koplanarität zu erreichen. Aufgrund der Federeigenschaften des Kontakts erfordert dies eine sehr genaue Einstellung und Prüfung während des Fertigungsprozesses.Another problem with the known contacting device 4 is that the compared to Contact part opposite connection part of the Contact element before or after the injection or insertion process the or the contact elements in the contact carrier must be deformed, in particular for SMD solder connections to achieve the necessary coplanarity. Required due to the spring properties of the contact this is a very precise setting and testing during the Manufacturing process.

Der Erfindung liegt die Aufgabe zugrunde, eine Kontaktiervorrichtung der beschriebenen Art derart auszubilden, daß eine gute Fixierung des bzw. der Kontaktelemente in einem Kontaktträger bei minimaler Bauhöhe erreicht wird. The invention has for its object a contacting device of the type described in such a way that a good fixation of the contact elements in a contact carrier is achieved with a minimal overall height.

Ferner soll durch den Wegfall einer nachträglichen Verformung eine gute Koplanarität erreicht werden.Furthermore, by eliminating a subsequent deformation good coplanarity can be achieved.

Zur Lösung dieser Aufgabe sieht die Erfindung eine Kontaktiervorrichtung der im Anspruch 1 genannten Art vor. Bevorzugte Ausgestaltungen der Erfindung ergeben sich aus den abhängigen Ansprüchen.To achieve this object, the invention provides a contacting device of the type mentioned in claim 1. Preferred embodiments of the invention result from the dependent claims.

Weiter Vorteile, Ziele und Einzelheiten der Erfindung ergeben sich aus der Beschreibung eines Ausführungsbeispiels anhand der Zeichnungen; in den Zeichnungen zeigt:

Fig. 1
eine Draufsicht einer auf einer Leiterplatte angeordneten Kontaktiervorrichtung für einen Chipkartenleser gemäß der Erfindung;
Fig. 2
eine Schnittansicht einer Kontaktiervorrichtung entlang der Linie 2-2 in Fig. 1;
Fig. 3
einen vergrößerten Ausschnitt aus Fig. 2; und
Fig. 4
eine Schnittansicht einer Kontaktiervorrichtung für einen Chipkartenleser gemäß dem Stand der Technik.
Further advantages, goals and details of the invention emerge from the description of an exemplary embodiment with reference to the drawings; in the drawings shows:
Fig. 1
a plan view of a contacting device arranged on a printed circuit board for a chip card reader according to the invention;
Fig. 2
a sectional view of a contacting device along the line 2-2 in Fig. 1;
Fig. 3
an enlarged section of Fig. 2; and
Fig. 4
a sectional view of a contacting device for a chip card reader according to the prior art.

Zunächst soll unter Bezugnahme auf Fig. 4 eine Kontaktiervorrichtung 1 für einen Chipkartenleser gemäß dem stand Technik erläutert werden. Die Kontaktiervorrichtung 1 setzt sich aus einer Vielzahl von Kontaktelementen 2 (nur eines ist gezeigt) und einem Kontaktträger 7 zusammen. Der Kontaktträger 7 ist im allgemeinen auf einer Leiterplatte 11 montiert und die Kontaktelemente 2 werden elektrisch leitend mit der Leiterplatte verbunden (z.B. an Lötstellen).First, with reference to FIG. 4, a contacting device 1 for a chip card reader according to state of the art to be explained. The contacting device 1 consists of a large number of contact elements 2 (only one is shown) and a contact carrier 7 together. The contact carrier 7 is generally on one Printed circuit board 11 and the contact elements 2 are electrically connected to the circuit board (e.g. at solder joints).

Die Kontaktelemente 2 werden durch mehrere Zonen oder Teile gebildet. In der Fig. 4 ist ein Kontaktkuppenteil 3 des Kontaktelements 2 dargestellt, an dem sich ein erster ebener bzw. horizontaler Teil 4, ein abgewinkelter bzw. schräger Teil 6 und ein zweiter ebener bzw. horizontaler Teil 5 anschließt. Im Bereich des zweiten ebenen Teils 5 wird das Kontaktelement mit der Leiterplatt 11 verbunden.The contact elements 2 are through several zones or Parts formed. 4 is a contact coupling part 3 of the contact element 2, on which a first flat or horizontal part 4, an angled or sloping part 6 and a second flat or horizontal Part 5 connects. In the area of the second flat part 5 the contact element is connected to the printed circuit board 11.

Der erste ebene Teil 4 des Kontaktelements 2 wird vom Kontaktträger 7 in einer festen Position gehalten. Der Kontaktträger 7 weist einen oberen Teil 8 und einen unteren Teil 9 auf. Das Kontaktelement 2 liegt mit einem Teil seiner Unterseite 19 auf der Haltefläche 9a des unteren Teils 9 des Kontaktträgers 7 auf. Ein Teil der Oberseite 18 des Kontaktelements 2 wird von der Unterseite 8a des oberen Teils 8 des Kontaktträgers 7 gehalten.The first flat part 4 of the contact element 2 is from Contact carrier 7 held in a fixed position. The Contact carrier 7 has an upper part 8 and a lower part Part 9 on. The contact element 2 lies with one part its bottom 19 on the holding surface 9a of the lower Part 9 of the contact carrier 7. Part of the top 18 of the contact element 2 is from the bottom 8a of the upper part 8 of the contact carrier 7 held.

Wird eine Kontaktierkraft 14 (FK) auf den Kontaktkuppenteil 3 des Kontaktelements 2 ausgeübt, so wirken ihr die Gegenkräfte 16 (Fst.V) und 15 (Fst.H) am Kontaktträger entgegen. Im vorderen Bereich (in der Zeichnung links) des Kontaktträgers 7 wirkt die Stützkraft 16 (Fst.V) des unteren Teils 9 des Kontaktträgers der Kontaktierkraft 14 entgegen. Im hinteren Bereich (in der Zeichnung rechts) des Kontaktträgers 7 wirkt die Stützkraft 15 (Fst.H) des oberen Teils 8 des Kontaktträgers einem Ausweichen des Kontaktelements 2 nach oben entgegen.If a contacting force 14 (F K ) is exerted on the contact coupling part 3 of the contact element 2, the opposing forces 16 (F st.V ) and 15 (F st.H ) on the contact carrier counteract it. In the front area (on the left in the drawing) of the contact carrier 7, the supporting force 16 (F st.V ) of the lower part 9 of the contact carrier counteracts the contacting force 14. In the rear area (on the right in the drawing) of the contact carrier 7, the supporting force 15 (F st.H ) of the upper part 8 of the contact carrier counteracts a deflection of the contact element 2 upwards.

Die Bauhöhe 13 der Kontaktiervorrichtung 1 ergibt sich aus der Summe der Dicken bzw. Höhen des Kontaktelements 2 und des oberen und des unteren Teils 8, 9 des Kontaktträgers 7. Die Dicke des Materials des Kontaktträgers 7 (oberer und unterer Teil 8,9) kann nicht beliebig gewählt werden, weil sonst die erforderte Stabilität nicht erreicht wird, was somit eine untere Grenze für die Bauhöhe festlegt.The overall height 13 of the contacting device 1 results from the sum of the thicknesses or heights of the contact element 2 and the upper and lower parts 8, 9 of the contact carrier 7. The thickness of the material of the contact carrier 7 (upper and lower part 8.9) cannot be chosen arbitrarily because otherwise the required stability will not be achieved becomes what is therefore a lower limit for the overall height specifies.

Für eine Verbindung mit der Leiterplatte 11 ist das Kontaktelement 2 in Richtung der Leiterplatte 11 gebogen (vergleiche dazu den schrägen Teil 6). Die Teile 6 der Kontaktelemente werdem nachträglich geformt und sollen eine möglichst genaue Koplanarität für die Lötanschlüsse (im allgemeinen im Bereich des zweiten ebenen Teils 5 des Kontaktelements) an die Leiterplatte 11 gewährleisten. Aufgrund der Federeigenschaft des Kontaktelements erfordert dies eine sehr genaue Einstellung und Prüfung während des Fertigungsprozesses.The contact element is for connection to the printed circuit board 11 2 bent towards the circuit board 11 (Compare the sloping part 6). Parts 6 of the Contact elements are subsequently shaped and should be the most accurate coplanarity for the solder connections (generally in the area of the second flat part 5 of the Ensure contact element) on the circuit board 11. Required due to the spring property of the contact element this is a very precise setting and testing during of the manufacturing process.

Die Erfindung sei nunmehr unter Bezugnahme auf ein in Fig. 1-3 gezeigtes Ausführungsbeispiel beschrieben.The invention is now with reference to an in 1-3 shown embodiment described.

Fig. 1 veranschaulicht eine Kontaktiervorrichtung 10 für einen Chipkartenleser gemäß der vorliegenden Erfindung in einer Draufsicht. Sie weist Kontaktelemente 20 und einen Kontaktträger 30 auf. Zwischen den Kontaktelementen 20 bilden sich Zwischenteile 29 des Kontakttägers 30 aus. Anlageflächen 39 der Zwischenteile 29 berühren Seitenflächen 27 der Kontakelemente. Im Bereich der Kontaktelemente 20 wird über ihre Breite 26 der Kontaktträger 30 in vordere und hintere Teile 31 bzw. 32 unterteilt (siehe dazu auch Fig. 2).1 illustrates a contacting device 10 for a smart card reader according to the present invention in a top view. It has contact elements 20 and one Contact carrier 30 on. Between the contact elements 20 Intermediate parts 29 of the contact carrier 30 form. Contact surfaces 39 of the intermediate parts 29 touch side surfaces 27 of the contact elements. In the area of the contact elements 20 is the width of the contact carrier 30 in front and rear parts 31 and 32 divided (see see also Fig. 2).

Die Kontaktiervorrichtung 10 ist in Fig. 2 in einem Schnitt im Bereich eines Kontaktelements 20 entlang der Linie 2-2 veranschaulicht. In Fig. 2 ist zu sehen, daß sich das Kontaktelement 20 in vier wesentliche Teile gliedert, und zwar in einen Kontaktkuppenteil 21, einen ersten ebenen bzw. horizontalen Teil 22, einen schrägen bzw. abgewinkelten Teil 23 und einen zweiten ebenen bzw. horizontalen Teil 24. Der abgewinkelte Teil 23 bildet mit den ebenen Teilen einen Winkel, der beispielhaft durch den Winkel 25 in Fig. 3 dargestellt ist.The contacting device 10 is in one in FIG Section in the area of a contact element 20 along the Line 2-2 illustrates. In Fig. 2 it can be seen that the contact element 20 into four essential parts is divided into a contact coupling part 21, one first flat or horizontal part 22, an oblique or angled part 23 and a second flat or horizontal part 24. The angled part 23 also forms the flat parts an angle that is exemplified by the angle 25 is shown in Fig. 3.

Der Kontaktträger ist im dargestellten Ausführungsbeispiel um Befestigungsteile 28 der Kontaktelemente 20 spritzgegossen (die Kontaktelemente können aber auch eingesetzt sein) und unterteilt sich im Bereich der Befestigungsteile 28 über ihre Breite 26 in die zuvor genannten ersten vorderen oder unteren Teile 31 und zweiten hinteren oder oberen Teile 32.The contact carrier is in the illustrated embodiment around fastening parts 28 of the contact elements 20 injection molded (the contact elements can also be used be) and is divided in the area of the fasteners 28 across its width 26 in the aforementioned first front or lower parts 31 and second rear or upper parts 32.

Fig. 3 ist ein vergrößerter Ausschnitt aus Fig. 2 und veranschaulicht die Kontaktiervorrichtung 10 im Bereich des Kontaktträgers 30. Ein Teil einer Oberseite 41 und einer Unterseite 40 des Kontaktelements 20 berühren die entsprechenden Auflage- bzw. Halteflächen 33 bzw. 34 des Kontaktträgers 30. Im Bereich des vorderen Teils 31 des Kontaktträgers 30 liegt eine Auflagefläche 42 des Kontaktelements 20 auf einer Auflage- bzw. Haltefläche 36 des Kontaktträgers 30 auf und wird von dieser gehalten. Im Bereich des hinteren Teils 32 des Kontaktträgers 30 hält eine Haltefläche 35 des Kontaktträgers einen Teil 43 der Oberseite 41 des Kontaktelements 20. Im Bereich des abgewinkelten Teils 23 des Kontaktelements 20 lagert ein schräger Halteflächenteil 38 des vorderen Kontaktträgerteils 31 einen schrägen Teil 44 der Unterseite 40 des Kontaktelements. Ein schräger Halteflächenteil 37 des hinteren Kontaktträgerteils 32 hält in diesem Bereich einen schrägen Teil 45 der Oberseite 40 des Kontaktelements 20.Fig. 3 is an enlarged section of Fig. 2 and illustrates the contacting device 10 in the area of the contact carrier 30. Part of a top 41 and a bottom 40 of the contact element 20 touch the corresponding support or holding surfaces 33 and 34 of the Contact carrier 30. In the area of the front part 31 of the Contact carrier 30 is a bearing surface 42 of the contact element 20 on a support or holding surface 36 of the Contact carrier 30 and is held by this. in the Area of the rear part 32 of the contact carrier 30 holds a holding surface 35 of the contact carrier part 43 of the Top 41 of the contact element 20. In the area of the angled Part 23 of the contact element 20 is embedded oblique holding surface part 38 of the front contact carrier part 31 an inclined part 44 of the underside 40 of the Contact element. An inclined holding surface part 37 of the rear contact carrier part 32 holds one in this area sloping part 45 of the top 40 of the contact element 20th

Im Bereich des zweiten ebenen Teils 24 des Kontaktelements 20 liegt die Unterseite 40 des Kontaktelements mit einer Auflageflächenteil 46 auf der Leiterplatte 11 auf und steht im allgemeinenen mit einer Oberseite 12 der Leiterplatte 11 in Berührung. Der Auflageflächenteil 46 der Kontaktelemente, die Oberseite 12 der Leiterplatte und eine Unterseite 61 des vorderen Teils 31 des Kontaktträgers 30 sind bevorzugterweise koplanar.In the area of the second flat part 24 of the contact element 20 is the underside 40 of the contact element a bearing surface part 46 on the circuit board 11 and generally stands with a top 12 of the PCB 11 in contact. The bearing surface part 46 of the contact elements, the top 12 of the circuit board and an underside 61 of the front part 31 of the contact carrier 30 are preferably coplanar.

Ebenso ist ein Teil 47 der Oberseite 41 der Kontaktelemente 20 koplanar mit einer Oberseite 62 des hinteren Teils 32 des Kontaktträgers 30. Oberhalb des Teils 47 der Oberseite 41 und unterhalb des Auflagenflächenteils 46 der Unterseite 40 der Kontaktelemente 20 befindet sich kein Kontaktträgermaterial.Likewise, part 47 of the top 41 of the contact elements 20 coplanar with a top 62 of the posterior Part 32 of the contact carrier 30. Above part 47 of the Top 41 and below the support surface part 46 the underside 40 of the contact elements 20 is located no contact carrier material.

Wird eine Kontaktierkraft 14 auf den Kontaktkuppenteil 21 des Kontaktelements 20 ausgeübt, so wird ein Drehmoment um eine imaginäre Lagerstelle im Kontaktträger 30 herum in Richtung der Kontaktierkraft 14 drehend erzeugt. Diesem Drehmoment wirken Gegenkräfte 16 und 15 am Kontaktträger 30 entgegen. Im vorderen Bereich (in der Zeichnung links) des Kontaktträgers 30 wirkt die Stützkraft 16 (Fst.V) des vorderen Teils 31 des Kontaktträgers der Kontaktierkraft 14 entgegen. Diese Kraft 16 verteilt sich über die Halteflächenteile 36 und 38 des vorderen Kontaktträgerteils 31. Die Stützkraft 15 (Fst.H), die vom hinteren Kontaktträgerteil 32 von oben auf das Kontaktelement 20 ausgeübt wird, verteilt sich über die Halteflächenteile 35 und 37 des hinteren Kontaktträgerteils 32.If a contacting force 14 is exerted on the contact coupling part 21 of the contact element 20, a torque is generated rotating about an imaginary bearing point in the contact carrier 30 in the direction of the contacting force 14. Opposing forces 16 and 15 on the contact carrier 30 counteract this torque. In the front area (on the left in the drawing) of the contact carrier 30, the supporting force 16 (F st.V ) of the front part 31 of the contact carrier counteracts the contacting force 14. This force 16 is distributed over the holding surface parts 36 and 38 of the front contact carrier part 31. The supporting force 15 (F st.H ), which is exerted by the rear contact carrier part 32 from above onto the contact element 20, is distributed over the holding surface parts 35 and 37 of the rear Contact carrier part 32.

Setzt man nun das Kontaktelement 20 im Bereich der Lagerstelle im Kontakttäger 30 stufenförmig ab, so kann die Bauhöhe (durch 50 in der Fig. 2 angezeigt) dadurch reduziert werden, daß das Kontaktelement 20 durch den Kontaktträger 30 nur noch entsprechend der Belastung abgestützt wird.Now place the contact element 20 in the area of the bearing in the contact carrier 30 from step, so the Overall height (indicated by 50 in Fig. 2) thereby reduced that the contact element 20 through the contact carrier 30 only supported according to the load becomes.

Dadurch, daß das Kontaktelement 20 nur an den erforderlichen Stellen entsprechend unterstützt werden muß, kann im vorderen Bereich des Kontaktträgers 30, wo aufgrund der Kontaktierkraft 14 eine der Kraft 16 entsprechende Kraft nach unten ausgeübt wird, Material des Kontaktträgers (verglichen mit dem Stand der Technik aus Fig. 4) weggenommen werden. Das Aufliegen der Auflageflächen 42 und 44 auf den Halteflächen 36 und 38 verhindert eine Bewegung des Kontaktelements 20 in diesem Bereich nach unten (Stützkraft 16). Im hinteren Bereich des Kontaktträgers 30, wo aufgrund der Kontaktierkraft 14 eine der Kraft 15 entsprechende Kraft nach unten ausgeübt wird, verhindern die Halteflächen 35 und 37 des hinteren Kontaktträgerteils 32, an den die Auflageflächen 43 und 47 der Oberseite 41 des Kontaktelements 20 anliegen, eine Bewegung des Kontaktelements 20 nach oben (Stützkraft 15). Im vorderen Bereich des Kontaktelements ist bei der dargestellten Beanspruchung kein Kontaktträgermaterial oberhalb des Kontaktelements nötig und kann daher im Vergleich zum beschriebenen Stand der Technik über dem Teil 47 der Oberseite 41 der Kontaktelemente 20 ebenfalls weggenommen werden.In that the contact element 20 only at the required Places must be supported accordingly, can front area of the contact carrier 30, where due to Contacting force 14 a force corresponding to the force 16 is exerted downwards, material of the contact carrier (compared to the prior art of Fig. 4) removed become. The bearing surfaces 42 and 44 on the holding surfaces 36 and 38 prevents movement of the contact element 20 in this area down (Support force 16). In the rear area of the contact carrier 30, where one of the forces 15 due to the contact force 14 appropriate force is exerted down, prevent the holding surfaces 35 and 37 of the rear contact carrier part 32, on which the bearing surfaces 43 and 47 of the top 41 of the contact element 20 rest, a movement of the contact element 20 upwards (supporting force 15). In the front The area of the contact element is shown in the No contact carrier material above the stress Contact element necessary and can therefore in comparison to the described State of the art over part 47 of the top 41 of the contact elements 20 also removed become.

Der erste und zweite ebene Teil 22 und 24 und der abgewinkelte Teil 23 des Kontaktelements bilden innerhalb des Kontaktträgers 30 eine Stufe aus. Dadurch kann eine Bauhöhe 50 erzielt werden, die geringer ist als im in Bezug auf Fig. 4 beschriebenen Stand der Technik, da die Kontaktelemente nur in den Bereichen unterstützt werden, in denen es erforderlich ist.The first and second flat parts 22 and 24 and the angled one Part 23 of the contact element form within the Contact carrier 30 one level. This allows a height 50 can be achieved, which is lower than in relation prior art described in Fig. 4, since the contact elements to be supported only in the areas who need it.

Die Stufe ist auch derart ausgebildet, daß ein Teil 46 der Unterseite 40 des Kontaktelements nach der Montage der Kontaktiervorrichtung 10 auf der Leiterplatte 11 in Berührung mit der Leiterplatt 11 kommt und parallel bzw. koplanar zu deren Oberfläche 12 und der Unterseite 61 des vorderen Kontaktträgerteils 31 verläuft. Die Stufe wird durch den Kontaktträger fixiert. Ein elastisches Ausweichen des Kontaktelements 20 im Bereich des zweiten ebenen Teils 24 aufgrund von Federkräften, die von der Verformung herrühren, ist daher nicht mehr möglich. Dies hat den Vorteil, daß alle Kontaktelemente in ihren Teilen 24 koplanar ausgebildet werden können und in dieser Position durch den Kontaktträger fixiert sind.The step is also designed such that a part 46 the bottom 40 of the contact element after assembly the contacting device 10 on the circuit board 11 in Comes into contact with the printed circuit board 11 and parallel or coplanar to the surface 12 and the bottom 61 thereof front contact carrier part 31 runs. The stage will fixed by the contact carrier. An elastic dodge of the contact element 20 in the region of the second plane Part 24 due to spring forces from the deformation is therefore no longer possible. this has the advantage that all contact elements in their parts 24th can be coplanar and in this position are fixed by the contact carrier.

Des weiteren bedeuted das Fixieren der Stufe bzw. des schrägen Teils 23 im Kontaktträger 30, daß die Kontaktelemente 20 auch bezüglich Querverschiebungen, die parallel zu den ebenen Teilen 22 und 24 sein können, verankert sind und in ihrer Position gehalten werden.Furthermore, the fixation of the level means the sloping part 23 in the contact carrier 30 that the contact elements 20 also with respect to transverse displacements that are parallel can be anchored to the flat parts 22 and 24 are and are held in their position.

Claims (7)

Kontaktiervorrichtung (10) die folgendes aufweist: einen Kontaktträger (30); und mindestens ein Kontaktelement (20), welches folgendes aufweist: einen Kontaktkuppenteil (21), insbesondere zur Kontaktierung eines Chipkartenkontaktes; einen vom Kontaktträger (30) umschlossenen Befestigungsteil (28); und einen Kontaktteil (24), insbesondere zur Kontaktierung einer Leiterplatte (11);
wobei der Befestigungsteil (29) eine Stufe bildet, die innerhalb des Kontaktträgers (30) gelegen ist und wobei desweiteren der Kontaktträger (30) derart ausgebildet ist, daß er das Kontaktelement (20) nur entsprechend dem Auftreten der Belastung (14) umschließt. Contacting device (10) which has the following: a contact carrier (30); and at least one contact element (20), which has the following: a contact coupling part (21), in particular for contacting a chip card contact; a fastening part (28) enclosed by the contact carrier (30); and a contact part (24), in particular for contacting a circuit board (11);
in which the fastening part (29) forms a step, which is located within the contact carrier (30) and wherein further the contact carrier (30) is designed such that it surrounds the contact element (20) only in accordance with the occurrence of the load (14). Kontaktiervorrichtung nach Anspruch 1, wobei der Kontakttäger (30) über die Breite (26) der Kontaktelemente (20) hinweg in erste vordere und zweite hintere Teile (31 bzw. 32) durch die Stufen der Kontaktelemente (20) unterteilt ist.Contacting device according to claim 1, wherein the Contact carrier (30) across the width (26) of the contact elements (20) into first front and second rear parts (31 or 32) through the steps of the contact elements (20) is divided. Kontaktiervorrichtung nach Anspruch 1 oder 2, wobei die Kontaktelemente (20) im Kontaktträger (30) durch Spritzguß umschlossen sind.Contacting device according to claim 1 or 2, wherein the contact elements (20) in the contact carrier (30) Injection molding are enclosed. Kontaktiervorrichtung nach einem der vorhergeneden Ansprüche, wobei die ersten vorderen Teile (31) und die zweiten hinteren Teile (32) des Kontaktträgers (30) mit Zwischenteilen (29), die zwischen den Kontaktelementen ausgebildet sind, einstückig sind. Contacting device according to one of the preceding Claims, wherein the first front parts (31) and the second rear parts (32) of the contact carrier (30) with intermediate parts (29) formed between the contact elements are one piece. Kontaktiervorrichtung nach Anspruch 1, wobei der Kontaktträger (30) mit dem vorderen Teil (31) das Kontaktelement (20) einschließlich seines schrägen Teils (23) von unten unterstützt und
der hintere Teil (32) des Kontaktträgers (30) das Kontaktelement (20) einschließlich seines schrägen Teils (23) von oben unterstützt, wobei im Bereich eines ersten ebenen Teils (22) des Kontaktelements (20) kein Kontaktträgermaterial oberhalb und im Bereich eines zweiten ebenen Teils (24) des Kontaktelements (20) kein Kontaktträgermaterial unterhalb des Kontaktelements vorhanden ist.Contacting device according to claim 1, wherein the contact carrier (30) with the front part (31) supports the contact element (20) including its inclined part (23) from below and
the rear part (32) of the contact carrier (30) supports the contact element (20) including its inclined part (23) from above, with no contact carrier material above and in the region of a second in the region of a first flat part (22) of the contact element (20) flat part (24) of the contact element (20) there is no contact carrier material below the contact element. Kontaktiervorrichtung nach einen der vorhergehenden Ansprüche, worin die Stufen des Kontaktelements (20) so ausgebildet sind, daß die Kontaktteile (24) zur Kontaktierung der Leiterplatte (11) koplanar mit der Oberfläche (12) der Leiterplatte (11) und einer Unterseite (61) des Kontaktträgers (30) sind.Contacting device according to one of the preceding claims, wherein the steps of the contact member (20) are so formed are that the contact parts (24) for contacting the Printed circuit board (11) coplanar with the surface (12) of the printed circuit board (11) and an underside (61) of the contact carrier (30) are. Kontaktiervorrichtung nach einem der vorhergehenden Ansprüche, wobei ein Winkel (25) der Stufe des Konatktelements (20) sich zwischen 30 und 90 Grad erstrecken kann.Contacting device according to one of the preceding claims, an angle (25) of the step of the contact element (20) can extend between 30 and 90 degrees.
EP99112609A 1998-07-01 1999-07-01 Connector particularly for a thin smart card Withdrawn EP0969705A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19829467A DE19829467C2 (en) 1998-07-01 1998-07-01 Contact carrier especially for a thin smart card connector
DE19829467 1998-07-01

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EP0969705A2 true EP0969705A2 (en) 2000-01-05
EP0969705A3 EP0969705A3 (en) 2002-01-16

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US (1) US6190213B1 (en)
EP (1) EP0969705A3 (en)
JP (1) JP2000067973A (en)
DE (1) DE19829467C2 (en)

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Also Published As

Publication number Publication date
DE19829467A1 (en) 2000-01-20
US6190213B1 (en) 2001-02-20
JP2000067973A (en) 2000-03-03
EP0969705A3 (en) 2002-01-16
DE19829467C2 (en) 2003-06-18

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