EP0859404A3 - Washing solution of semiconductor substrate and washing method using the same - Google Patents

Washing solution of semiconductor substrate and washing method using the same Download PDF

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Publication number
EP0859404A3
EP0859404A3 EP98100625A EP98100625A EP0859404A3 EP 0859404 A3 EP0859404 A3 EP 0859404A3 EP 98100625 A EP98100625 A EP 98100625A EP 98100625 A EP98100625 A EP 98100625A EP 0859404 A3 EP0859404 A3 EP 0859404A3
Authority
EP
European Patent Office
Prior art keywords
substrate
fine particles
metal impurities
washing solution
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98100625A
Other languages
German (de)
French (fr)
Other versions
EP0859404A2 (en
EP0859404B1 (en
Inventor
Chizuko Matsuo
Mikio c/o Central Research Institute Kishimoto
Kazushige Takaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Silicon Corp
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Silicon Corp
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP00561297A external-priority patent/JP3354822B2/en
Priority claimed from JP561197A external-priority patent/JPH10209100A/en
Application filed by Mitsubishi Materials Silicon Corp, Mitsubishi Materials Corp filed Critical Mitsubishi Materials Silicon Corp
Publication of EP0859404A2 publication Critical patent/EP0859404A2/en
Publication of EP0859404A3 publication Critical patent/EP0859404A3/en
Application granted granted Critical
Publication of EP0859404B1 publication Critical patent/EP0859404B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D2111/22—

Abstract

Disclosed is a washing solution of a semiconductor substrate which comprises 0.0001 to 0.1 % by weight of an organic acid and 0.005 to 0.25 % by weight of hydrofluoric acid and has pH of 2 to 4. When a contaminated substrate is immersed in a washing solution, a naturally oxidized film on the surface of the substrate is removed by hydrofluoric acid, and fine particles on the film, metal impurities and metal impurities in the film transfer to the liquid. Since the washing solution is an acidic solution containing an organic acid and having pH of 2 to 4, fine particles are charged to minus as those of the fine particles, and the metal impurities ions in the liquid becomes minus complex ions due to complexing effect of the organic acid. As the results, surface potentials of the respective fine particles and metal impurities are each minus which is the same as that of surface potential of the substrate so that adhesion or re-adhesion to the substrate can be prevented.
EP98100625.7A 1997-01-16 1998-01-15 Washing solution of semiconductor substrate and washing method using the same Expired - Lifetime EP0859404B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP5611/97 1997-01-16
JP5612/97 1997-01-16
JP00561297A JP3354822B2 (en) 1997-01-16 1997-01-16 Semiconductor substrate cleaning method
JP561197A JPH10209100A (en) 1997-01-16 1997-01-16 Cleaning method of semiconductor substrate
JP5610/97 1997-01-16
JP561097 1997-01-16

Publications (3)

Publication Number Publication Date
EP0859404A2 EP0859404A2 (en) 1998-08-19
EP0859404A3 true EP0859404A3 (en) 1999-05-26
EP0859404B1 EP0859404B1 (en) 2014-04-02

Family

ID=27276827

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98100625.7A Expired - Lifetime EP0859404B1 (en) 1997-01-16 1998-01-15 Washing solution of semiconductor substrate and washing method using the same

Country Status (4)

Country Link
US (1) US6296714B1 (en)
EP (1) EP0859404B1 (en)
KR (1) KR100279911B1 (en)
TW (1) TW463261B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
DE69916728T2 (en) * 1998-08-28 2005-04-28 Mitsubishi Materials Corp. Method for cleaning a semiconductor substrate
DE19853486A1 (en) * 1998-11-19 2000-05-31 Wacker Siltronic Halbleitermat Process for the wet chemical treatment of semiconductor wafers
US6358847B1 (en) 1999-03-31 2002-03-19 Lam Research Corporation Method for enabling conventional wire bonding to copper-based bond pad features
EP1196943A4 (en) * 1999-05-26 2007-01-17 Air Prod & Chem Process for removing contaminant from a surface and composition useful therefor
FR2796319A1 (en) * 1999-07-13 2001-01-19 Lionel Girardie Powerful cleaning process used in modern microelectronic component treatments employs solution of hydrofluoric and hydrochloric acids in ultra-pure water, with citric acid
EP1189265A4 (en) * 2000-03-17 2007-04-25 Shinetsu Handotai Kk Water for storing silicon wafers and storing method
JP3510562B2 (en) * 2000-04-28 2004-03-29 Ｎｅｃエレクトロニクス株式会社 Semiconductor device manufacturing method and processing apparatus
US6762132B1 (en) 2000-08-31 2004-07-13 Micron Technology, Inc. Compositions for dissolution of low-K dielectric films, and methods of use
WO2002094462A1 (en) * 2001-05-22 2002-11-28 Mitsubishi Chemical Corporation Method for cleaning surface of substrate
US6610599B1 (en) * 2002-06-19 2003-08-26 Lucent Technologies Inc. Removal of metal veils from via holes
EP1536291A4 (en) * 2002-08-22 2008-08-06 Daikin Ind Ltd Removing solution
JP2004253775A (en) * 2003-01-31 2004-09-09 Nec Electronics Corp Chemical mechanical polishing method
SG129274A1 (en) * 2003-02-19 2007-02-26 Mitsubishi Gas Chemical Co Cleaaning solution and cleaning process using the solution
KR100672933B1 (en) * 2003-06-04 2007-01-23 삼성전자주식회사 Cleaning solution and cleaning method in a semiconductor device
WO2007045269A1 (en) * 2005-10-21 2007-04-26 Freescale Semiconductor, Inc. Method for cleaning a semiconductor structure and chemistry thereof
US8052797B2 (en) * 2006-10-24 2011-11-08 Asahi Glass Company, Limited Method for removing foreign matter from substrate surface
JP5533624B2 (en) * 2010-12-16 2014-06-25 信越半導体株式会社 Semiconductor wafer cleaning method
WO2018061670A1 (en) * 2016-09-29 2018-04-05 富士フイルム株式会社 Processing solution, and method for processing laminate
WO2018061582A1 (en) * 2016-09-29 2018-04-05 富士フイルム株式会社 Treatment fluid and method for treating laminate
FR3068509B1 (en) * 2017-06-30 2020-02-28 Technic France CHEMICAL CLEANING COMPOSITION FOR REMOVING AN AMORPHOUS PASSIVATION LAYER ON THE SURFACE OF CRYSTALLINE MATERIALS
CN109427543B (en) * 2017-08-31 2022-09-23 胜高股份有限公司 Method for cleaning silicon wafer
CN113257659B (en) * 2021-04-09 2022-09-23 上海中欣晶圆半导体科技有限公司 Method for reducing heavy metal and haze defects through BSD (back washing) post-cleaning

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4181623A (en) * 1977-03-15 1980-01-01 Colgate-Palmolive Company Cleaning compositions
EP0571950A2 (en) * 1992-05-29 1993-12-01 Texas Instruments Incorporated Removal of metal contamination
JPH06291099A (en) * 1993-03-31 1994-10-18 Sumitomo Sitix Corp Cleaning method of silicon wafer
WO1994027314A1 (en) * 1993-05-13 1994-11-24 Interuniversitair Microelektronica Centrum Method for semiconductor processing using mixtures of hf and carboxylic acid
US5382296A (en) * 1991-02-27 1995-01-17 Okmetic Oy Method for cleaning semiconductor products
EP0674343A2 (en) * 1994-03-25 1995-09-27 Shin-Etsu Handotai Company Limited Method for storing silicon wafers
FR2722511A1 (en) * 1994-07-15 1996-01-19 Ontrak Systems Inc Metal contaminant removal during substrate cleaning
DE19521389A1 (en) * 1994-12-06 1996-06-13 Mitsubishi Electric Corp Semiconductor integrated circuit mfg.
WO1996026538A1 (en) * 1995-02-21 1996-08-29 Advanced Micro Devices, Inc. Chemical solutions for removing metal-compound contaminants from wafers after cmp and the method of wafer cleaning
DE19515024A1 (en) * 1995-04-24 1996-10-31 Wacker Siltronic Halbleitermat Aq. compsn., for cleaning semi-conductor discs, esp. silicon

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409544A (en) * 1990-08-20 1995-04-25 Hitachi, Ltd. Method of controlling adhesion of fine particles to an object in liquid
US5695569A (en) * 1991-02-28 1997-12-09 Texas Instruments Incorporated Removal of metal contamination
JP2914555B2 (en) * 1994-08-30 1999-07-05 信越半導体株式会社 Cleaning method for semiconductor silicon wafer
US5714203A (en) * 1995-08-23 1998-02-03 Ictop Entwicklungs Gmbh Procedure for the drying of silicon

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4181623A (en) * 1977-03-15 1980-01-01 Colgate-Palmolive Company Cleaning compositions
US5382296A (en) * 1991-02-27 1995-01-17 Okmetic Oy Method for cleaning semiconductor products
EP0571950A2 (en) * 1992-05-29 1993-12-01 Texas Instruments Incorporated Removal of metal contamination
JPH06291099A (en) * 1993-03-31 1994-10-18 Sumitomo Sitix Corp Cleaning method of silicon wafer
WO1994027314A1 (en) * 1993-05-13 1994-11-24 Interuniversitair Microelektronica Centrum Method for semiconductor processing using mixtures of hf and carboxylic acid
EP0674343A2 (en) * 1994-03-25 1995-09-27 Shin-Etsu Handotai Company Limited Method for storing silicon wafers
FR2722511A1 (en) * 1994-07-15 1996-01-19 Ontrak Systems Inc Metal contaminant removal during substrate cleaning
DE19521389A1 (en) * 1994-12-06 1996-06-13 Mitsubishi Electric Corp Semiconductor integrated circuit mfg.
WO1996026538A1 (en) * 1995-02-21 1996-08-29 Advanced Micro Devices, Inc. Chemical solutions for removing metal-compound contaminants from wafers after cmp and the method of wafer cleaning
DE19515024A1 (en) * 1995-04-24 1996-10-31 Wacker Siltronic Halbleitermat Aq. compsn., for cleaning semi-conductor discs, esp. silicon

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Silicon Surface Cleaning Process. October 1977.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 20, no. 5, October 1977 (1977-10-01), New York, US, pages 1746 - 1747, XP002095501 *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 001 28 February 1995 (1995-02-28) *

Also Published As

Publication number Publication date
KR19980070530A (en) 1998-10-26
KR100279911B1 (en) 2001-09-06
TW463261B (en) 2001-11-11
EP0859404A2 (en) 1998-08-19
US6296714B1 (en) 2001-10-02
EP0859404B1 (en) 2014-04-02

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