EP0842539A1 - Method and apparatus of operating a dual gate tft electromagnetic radiation imaging device - Google Patents
Method and apparatus of operating a dual gate tft electromagnetic radiation imaging deviceInfo
- Publication number
- EP0842539A1 EP0842539A1 EP95926347A EP95926347A EP0842539A1 EP 0842539 A1 EP0842539 A1 EP 0842539A1 EP 95926347 A EP95926347 A EP 95926347A EP 95926347 A EP95926347 A EP 95926347A EP 0842539 A1 EP0842539 A1 EP 0842539A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- voltage
- capacitor
- charge
- succession
- voltages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 20
- 230000005670 electromagnetic radiation Effects 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000009977 dual effect Effects 0.000 title claims abstract description 10
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 239000003990 capacitor Substances 0.000 claims description 44
- 230000005855 radiation Effects 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 4
- 238000012544 monitoring process Methods 0.000 claims 2
- 206010073306 Exposure to radiation Diseases 0.000 abstract description 5
- 238000013459 approach Methods 0.000 description 5
- 238000003491 array Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002059 diagnostic imaging Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Definitions
- This invention relates in general to electromagnetic radiation imaging devices, and more particularly to a method and apparatus for operating an X-ray imaging device beyond the linear range of each pixel sensor.
- a-Si:H photodiodes which produce charge in proportion to the light intensity.
- the generated charge is stored on a capacitor and is read out through a thin film transistor (TFT) as each line is addressed.
- TFT thin film transistor
- Another prior art detector has been developed by researchers at the University of Toronto in which X-rays are converted directly to charge. This system is described in W. Zhao and J.S. Rowlands, Selenium Active Matrix Universal Read-out Array Imager (SAMURAI) , Medical Imaging VII: Physics of Medical Imaging SPIE (1993). Both the prior art MASDA and SAMURAI devices require measurement of charge (or integrated current) , which is proportional to X-ray intensity, for each addressed row of the array.
- a new method and apparatus for driving electromagnetic radiation imaging devices using dual gate thin film transistors.
- the principal advantage provided by the present invention over the prior art is the elimination of sensor non-linearity at the pixel level. This advantage is achieved by selecting a range of operation of said pixel which preferably approaches the biasing voltage range, and by duplicating and comparing the pixel during measurement with the electrical conditions of the pixel resulting from exposure to radiation.
- the pixel charge electrode is preset to a predetermined voltage level prior to radiation exposure so that the pixel may be caused to operate beyond its linear operating range.
- the imaging device according to the present invention is capable of operating over a wider sensing range since the sensors are not restricted to operation in the linear range. Furthermore, practical implementation of the imager according to the present invention is simplified as a result of more relaxed fabrication design rules over prior art systems, since inter-pixel matching is not required.
- the method and apparatus for driving electromagnetic radiation imaging devices according to the present invention may advantageously be used in the electromagnetic radiation imaging device using dual gate thin film transistors as described and claimed in applicant's international patent application number PCT/CA94/00077, filed February 11, 1994, the contents of which are incorporated herein by reference.
- Figure 1 is a block schematic diagram of a parasitic independent, wide dynamic range driver for a dual gate TFT electromagnetic radiation imaging device in accordance with the preferred embodiment.
- FIG. 1 depicts a 4 x 3 pixel imaging array in accordance with the present invention.
- Each pixel comprises a radiation-to-charge transducer, X, having one electrode connected to an independent top contact, TO, and an opposite electrode connected to one gate of a dual gate TFT Tl and to the drain of a further TFT T2.
- the transducer X can be fabricated from amorphous selenium, or any other suitable material for directly converting electromagnetic radiation into electron-hole pairs.
- the top contact, TO, for each transducer X can be connected to a common terminal for all transducers, or can be separately connected, depending on the application.
- Each pixel is connected to two input source lines.
- the first source line, SO receives a DC voltage from DC supply 1, for application to the source of each TFT Tl.
- the DC voltage level is set by a control signal, VCI, applied to the supply 1.
- the other input source line, LN receives a controlled variable voltage from digital- to-analog (D/A) converter 3, for application to the source of each TFT T2.
- the DC voltage output from D/A converter 3 is set by a digital input value VC2.
- a single output sense line, SE is provided for each column of pixels.
- the drain of each TFT Tl is connected to an associated output sense line SE, which is further connected to an associated comparator CO.
- the two input source lines (SO and LN) are shared between two consecutive row pixels while the sense line (SE) is independent.
- Each pixel is controlled by two gate lines (Gl and G2), for independent switching of TFTs Tl and T2, as well as simultaneous connections of the TFTs Tl and T2 to the different voltage sources (i.e DC supply 1 and D/A converter 3) .
- Each sense line SE is connected to one of a pair of identical capacitors Cl and C2, depending on the position of switches Sl and S2.
- the capacitors Cl and C2 can also be connected to ground and to respective inputs of the associated comparator CO, via the switches Sl and S2.
- switches Sl and S2 are operated to selectively ground capacitors Cl and C2, to connect sense line SE to one of capacitors Cl and C2, and to connect the capacitors Cl and C2 to the respective inputs of the comparator CO.
- the top gate electrode of TFT Tl is first set to a predetermined voltage VI, where VI can be zero volts or any other predetermined value.
- VI can be zero volts or any other predetermined value.
- D/A converter 3 In order to preset this top electrode voltage, D/A converter 3 generates the required voltage VI, an enable voltage is applied to the gate lines G2 for enabling TFTs T2, and the top contact TO of each charge transducer X is grounded.
- a predetermined sensor range is selected for operating the TFTs Tl (which, as discussed above, the extended operating range can be outside of the normal linear pixel operating range which is generally significantly smaller than the TFT biasing voltage range (typically 1/2 or less) .
- the extended operating range provided by the driving scheme of the present invention preferably approaches the biasing voltage range.
- the TFT array is exposed to radiation (e.g. X- rays) , so that electron-hole pairs are generated in the charge transducers X.
- radiation e.g. X- rays
- the top contact TO is normally connected to a high voltage source, but can be connected to an alternate suitable voltage source in the event that a non-zero voltage VI has been applied to the top gate TFTs Tl.
- the charge acquired by the top electrodes of the Tl TFTs is measured on a row-by-row basis, as follows.
- the Cl and C2 capacitors are discharged to ground via respective switches Sl and S2.
- the DC supply 1 is caused to generate a predetermined voltage V2.
- the voltage V2 depends on the TFT technology employed.
- the gate lines Gl of the selected row are enabled, and the Cl capacitors are switched to the corresponding sense lines SE for a predetermined duration so that the charge on the top electrodes of the Tl TFTs (i.e. charge proportional to that on the pixels) , is stored on the respective capacitors Cl.
- the second gate line G2 for the selected row is enabled.
- the output voltage from D/A converter 3 is successively incremented from a minimum level, and, for each successive output voltage from D/A converter 3, a series of operations are performed for each source line, as follows: A) Connect the capacitors C2 to the sense lines SE for a predetermined duration similar to that discussed above with reference to capacitors Cl.
- the method and apparatus of the present invention effectively eliminates the effects of charge leakage, parasitic capacitances and sensor non-linearity at the pixel level, resulting in simplified fabrication of radiation imaging devices which utilize dual gate TFT arrays, and a wider pixel sensing range.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CA1995/000451 WO1997005657A1 (en) | 1995-07-31 | 1995-07-31 | Method and apparatus of operating a dual gate tft electromagnetic radiation imaging device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0842539A1 true EP0842539A1 (en) | 1998-05-20 |
EP0842539B1 EP0842539B1 (en) | 2001-09-12 |
Family
ID=4173093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95926347A Expired - Lifetime EP0842539B1 (en) | 1995-07-31 | 1995-07-31 | Method and apparatus of operating a dual gate tft electromagnetic radiation imaging device |
Country Status (5)
Country | Link |
---|---|
US (1) | US6169286B1 (en) |
EP (1) | EP0842539B1 (en) |
JP (1) | JP2001508167A (en) |
DE (1) | DE69522720T2 (en) |
WO (1) | WO1997005657A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3918248B2 (en) * | 1997-09-26 | 2007-05-23 | ソニー株式会社 | Solid-state imaging device and driving method thereof |
US6066860A (en) * | 1997-12-25 | 2000-05-23 | Seiko Epson Corporation | Substrate for electro-optical apparatus, electro-optical apparatus, method for driving electro-optical apparatus, electronic device and projection display device |
JP3466953B2 (en) * | 1999-04-12 | 2003-11-17 | キヤノン株式会社 | Image sensor |
DE19927694C1 (en) * | 1999-06-17 | 2000-11-02 | Lutz Fink | Semiconductor sensor with pixel structure e.g. for optoelectronic image sensor has overall conductive layer provided with gaps between individual pixel elements filled with relatively insulated conductive layer |
US20020121605A1 (en) * | 1999-06-17 | 2002-09-05 | Lutz Fink | Semiconductor sensor and method for its wiring |
US6953934B2 (en) * | 2002-03-06 | 2005-10-11 | Canon Kabushiki Kaisha | Radiation detection apparatus and system |
US6867420B2 (en) * | 2002-06-03 | 2005-03-15 | The Regents Of The University Of California | Solid-state detector and optical system for microchip analyzers |
KR100523671B1 (en) | 2003-04-30 | 2005-10-24 | 매그나칩 반도체 유한회사 | Cmos image sensor with double gateoxide and method of fabricating the same |
KR101894400B1 (en) * | 2009-12-28 | 2018-09-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Memory device and semiconductor device |
JP6116149B2 (en) | 2011-08-24 | 2017-04-19 | 株式会社半導体エネルギー研究所 | Semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4689487A (en) | 1984-09-03 | 1987-08-25 | Kabushiki Kaisha Toshiba | Radiographic image detection apparatus |
US5182624A (en) | 1990-08-08 | 1993-01-26 | Minnesota Mining And Manufacturing Company | Solid state electromagnetic radiation detector fet array |
DE4227096A1 (en) | 1992-08-17 | 1994-02-24 | Philips Patentverwaltung | X-ray image detector |
US5436442A (en) * | 1992-11-20 | 1995-07-25 | General Electric Company | High temperature photodetector array |
-
1995
- 1995-07-31 JP JP50703097A patent/JP2001508167A/en not_active Ceased
- 1995-07-31 DE DE69522720T patent/DE69522720T2/en not_active Expired - Fee Related
- 1995-07-31 WO PCT/CA1995/000451 patent/WO1997005657A1/en active IP Right Grant
- 1995-07-31 EP EP95926347A patent/EP0842539B1/en not_active Expired - Lifetime
- 1995-07-31 US US09/000,484 patent/US6169286B1/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO9705657A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1997005657A1 (en) | 1997-02-13 |
DE69522720T2 (en) | 2002-02-07 |
DE69522720D1 (en) | 2001-10-18 |
JP2001508167A (en) | 2001-06-19 |
US6169286B1 (en) | 2001-01-02 |
EP0842539B1 (en) | 2001-09-12 |
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