EP0834602A1 - Process for protecting a silver surface and electrical contact with a silver surface - Google Patents
Process for protecting a silver surface and electrical contact with a silver surface Download PDFInfo
- Publication number
- EP0834602A1 EP0834602A1 EP97116157A EP97116157A EP0834602A1 EP 0834602 A1 EP0834602 A1 EP 0834602A1 EP 97116157 A EP97116157 A EP 97116157A EP 97116157 A EP97116157 A EP 97116157A EP 0834602 A1 EP0834602 A1 EP 0834602A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tin layer
- layer
- silver
- tin
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
Definitions
- the invention relates to a method for protecting a Silver surface with electrical contacts and one corresponding electrical contact.
- DE 276 499 A1 discloses a method for passivating surfaces made of silver or silver alloys, which can be used in particular for electrical contacts.
- tin ions are implanted in the surface to a maximum depth of 0.5 ⁇ m.
- the ion implantation can take place, for example, in a chamber evacuated to a pressure of less than 5 x 10 -6 mbar at an angle between 0 ° and 90 ° with ions of energy between 15 and 100 keV.
- the invention is related to the method by Method with the features of claim 1 and regarding contact through contact with the characteristics of claim 6 solved.
- Advantageous further training are specified in the subclaims.
- the purpose of the method according to the invention is to: Protect silver plating from it during their To start life.
- the solution according to the invention exists with a touch of tinning on the silver platinum to provide.
- the thin layer of tin surface then oxidizes and so forms a tin oxide layer that the underlying Silver layer protects against corrosion.
- the tin oxide layer is very hard and corrosion and temperature resistant.
- Like tests of the corresponding layer system are those contact physical properties with those of silver comparable.
- the intermetallic Forming a component, it is not necessary to make contacts Suspend heat treatment because the oxidation of the Tin layer even without it.
- the tin oxide layer on the silver layer forms a perfect seal. Of the Contact resistance remains constant and after a low one Wiping movement low, because of this wiping movement Tin oxide layer is broken.
- the Friction coefficient for a silver layer with a Tin tinning especially with low normal forces less than with a tin and silver coating. Also occur high between layers of silver Adhesive forces caused by the use of the Tin tinning can be reduced.
- tin coatings to a temperature range up to a maximum of 155 ° Celsius is a tin plating that oxidizes, too at significantly higher temperatures (over 200 ° Celsius) still persistent.
- care must be taken that the Tin forms a completely closed coating. This can be checked with a microscope, for example.
- the layer should at most be so thick that after some mating cycles not with a layer of tin, but electrical contact is made with the silver layer. It can be assumed that the tin oxide layer at Contact is broken up. To break up this layer a contact must have a corresponding normal force.
- the silver layer has, for example a thickness of 3 microns, the thickness of the tin layer is between 0.1 and 0.2 ⁇ m.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Contacts (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zum Schützen einer Silberoberfläche bei elektrischen Kontakten und einen entsprechenden elektrischen Kontakt.The invention relates to a method for protecting a Silver surface with electrical contacts and one corresponding electrical contact.
Aus der DE 276 499 A1 ist ein Verfahren zum Passivieren von Oberflächen aus Silber oder Silberlegierungen bekannt, das insbesondere für elektrische Kontakte anwendbar ist. Zum Passivieren der Silberoberflächen werden in die Oberfläche Zinn-Ionen bis zu einer Tiefe von maximal 0.5 µm implantiert. Die Ionen-Implantation kann beipspielsweise in einer auf einen Druck von weniger 5 x 10-6 mbar evakuierten Kammer unter einem Winkel zwischen 0° und 90° mit Ionen der Energie zwischen 15 und 100 keV erfolgen.DE 276 499 A1 discloses a method for passivating surfaces made of silver or silver alloys, which can be used in particular for electrical contacts. To passivate the silver surfaces, tin ions are implanted in the surface to a maximum depth of 0.5 µm. The ion implantation can take place, for example, in a chamber evacuated to a pressure of less than 5 x 10 -6 mbar at an angle between 0 ° and 90 ° with ions of energy between 15 and 100 keV.
Weitere bekannte Verfahren zur Korrosions- bzw. Anlaufbeständigkeit sind chemische Verfahren, beispielsweise durch Tauchbäder oder als Poliermittel. Die Nachteile dieser Verfahren bestehen in der schweren Handhabung und dem Problem des Einsatzes aggressiver Substanzen. Zudem ist die Schutzschicht nicht dauerhaft. Ein anderes Problem ist der reduzierte Reibungswiderstand. Eine weitere Möglichkeit besteht in einer Hauchvergoldung. Diese weist aber den Nachteil auf, dass sehr teure Edelmetalle eingesetzt werden und eine Diffusion unter einer Wärmeeinwirkung erfolgen muss, die ein sehr heikles Verfahren ist.Other known methods for corrosion or Resistance to tarnishing are chemical processes, for example by immersion baths or as a polishing agent. The disadvantages of this Procedures consist of heavy handling and the problem the use of aggressive substances. In addition, the Protective layer is not permanent. Another problem is that reduced frictional resistance. One more way is gilded gold. But this shows the Disadvantage that very expensive precious metals are used and diffusion must take place under the influence of heat, which is a very delicate process.
Es ist Aufgabe der Erfindung einen Korrosionsschutz für Oberflächen aus Silber zu entwickeln, der möglichst einfach durchführbar ist und trotzdem einen dauerhaften Schutz mit einem geringen Kontaktwiderstand bietet. Weiter soll ein Kontakt, der nach dem erfindungsgemässen Verfahren hergestellt ist, angegeben werden.It is an object of the invention to provide protection against corrosion Developing surfaces from silver as easy as possible is feasible and yet with permanent protection offers a low contact resistance. Next one should Contact made according to the inventive method is produced.
Die Erfindung wird in Bezug auf das Verfahren durch ein Verfahren mit den Merkmalen des Patentanspruches 1 und bezüglich des Kontaktes durch einen Kontakt mit den Merkmalen des Patentanspruches 6 gelöst. Vorteilhafte Weiterbildungen sind jeweils in den Unteransprüchen angegeben.The invention is related to the method by Method with the features of claim 1 and regarding contact through contact with the characteristics of claim 6 solved. Advantageous further training are specified in the subclaims.
Der Zweck des erfindungsgemässen Verfahrens ist, eine Silberplatinierung davor zu schützen, während ihrer Lebensdauer anzulaufen. Die erfindungsgemässe Lösung besteht darin auf der Silberplatinierung eine Hauchverzinnung vorzusehen. Die dünne Zinnoberflächenschicht oxidiert dann und bildet so eine Zinnoxidschicht, die die darunterliegende Silberschicht vor Korrosion schützt. Die Zinnoxidschicht ist sehr hart und korrosions- und temperaturbeständig. Wie Tests des entsprechenden Schichtsystems gezeigt haben, sind die kontaktphysikalischen Eigenschaften mit denen von Silber vergleichbar.The purpose of the method according to the invention is to: Protect silver plating from it during their To start life. The solution according to the invention exists with a touch of tinning on the silver platinum to provide. The thin layer of tin surface then oxidizes and so forms a tin oxide layer that the underlying Silver layer protects against corrosion. The tin oxide layer is very hard and corrosion and temperature resistant. Like tests of the corresponding layer system are those contact physical properties with those of silver comparable.
Im Gegensatz zu Schichtkombinationen, die intermetallische Komponente bilden, ist es nicht nötig, die Kontakte einer Temperaturbehandlung auszusetzen, da die Oxidation der Zinnschicht auch ohne diese einsetzt. Die Zinnoxidschicht auf der Silberschicht bildet eine perfekte Versiegelung. Der Kontaktwiderstand bleibt konstant und nach einer geringen Wischbewegung niedrig, da durch diese Wischbewegung die Zinnoxidschicht aufgebrochen wird.In contrast to layer combinations, the intermetallic Forming a component, it is not necessary to make contacts Suspend heat treatment because the oxidation of the Tin layer even without it. The tin oxide layer on the silver layer forms a perfect seal. Of the Contact resistance remains constant and after a low one Wiping movement low, because of this wiping movement Tin oxide layer is broken.
Wie Messungen ebenfalls gezeigt haben, ist der Reibungskoeffizient für eine Silberschicht mit einer Hauchverzinnung insbesondere bei geringen Normalkräften geringer als bei einer Zinn- und Silberbeschichtung. Auch treten zwischen aufeinanderliegenden Silberschichten hohe Adhäsionskräfte auf, die durch die Verwendung der Hauchverzinnung reduziert werden. Während Zinnbeschichtungen auf einen Temperaturbereich bis maximal 155° Celsius beschränkt sind, ist eine Hauchverzinnung, die oxidiert, auch bei erheblich höheren Temperaturen (über 200° Celsius) weiterhin beständig. Als Kriterium für die Hauchverzinnung ist bei der Dicke der Zinnschicht darauf zu achten, dass das Zinn eine komplett geschlossene Beschichtung bildet. Dies kann beispielsweise mit einem Mikroskop überprüft werden.As measurements have also shown, the Friction coefficient for a silver layer with a Tin tinning especially with low normal forces less than with a tin and silver coating. Also occur high between layers of silver Adhesive forces caused by the use of the Tin tinning can be reduced. During tin coatings to a temperature range up to a maximum of 155 ° Celsius is a tin plating that oxidizes, too at significantly higher temperatures (over 200 ° Celsius) still persistent. As a criterion for the tin tinning with the thickness of the tin layer, care must be taken that the Tin forms a completely closed coating. This can be checked with a microscope, for example.
Die Schicht sollte aber maximal so dick sein, dass nach einigen Steckzyklen nicht mit einer Zinnschicht, sondern elektrischer Kontakt mit der Silberschicht hergestellt wird. Dabei ist davon auszugehen, dass die Zinnoxidschicht beim Kontaktieren aufgebrochen wird. Zum Aufbrechen dieser Schicht muss ein Kontakt eine entsprechende Normalkraft aufweisen.However, the layer should at most be so thick that after some mating cycles not with a layer of tin, but electrical contact is made with the silver layer. It can be assumed that the tin oxide layer at Contact is broken up. To break up this layer a contact must have a corresponding normal force.
Der Aufbau eines elektrischen Kontaktes würde im Kontaktierungsbereich wie folgt aussehen. Zunächst ein Substrat, das eine Silberschicht trägt und darauf eine Hauchverzinnung. Die Silberschicht hat dabei beispielsweise eine Dicke von 3 µm, die Dicke der Zinnschicht liegt zwischen 0.1 und 0.2 µm.The establishment of an electrical contact would Contact area look like this. First one Substrate that carries a silver layer and on top of it Tin tinning. The silver layer has, for example a thickness of 3 microns, the thickness of the tin layer is between 0.1 and 0.2 µm.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE96115452 | 1996-09-26 | ||
EP96115452 | 1996-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0834602A1 true EP0834602A1 (en) | 1998-04-08 |
Family
ID=8223225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97116157A Withdrawn EP0834602A1 (en) | 1996-09-26 | 1997-09-17 | Process for protecting a silver surface and electrical contact with a silver surface |
Country Status (1)
Country | Link |
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EP (1) | EP0834602A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1024212A2 (en) * | 1999-01-27 | 2000-08-02 | Dowa Mining Co., Ltd. | Wear resistant copper or copper base alloy, method of preparing the same and electrical part using the same |
EP1026287A1 (en) * | 1999-02-03 | 2000-08-09 | Dowa Mining Co., Ltd. | Process for production of copper or copper base alloys |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01279582A (en) * | 1988-04-30 | 1989-11-09 | Furukawa Electric Co Ltd:The | Contact |
-
1997
- 1997-09-17 EP EP97116157A patent/EP0834602A1/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01279582A (en) * | 1988-04-30 | 1989-11-09 | Furukawa Electric Co Ltd:The | Contact |
Non-Patent Citations (3)
Title |
---|
DATABASE INSPEC INSTITUTE OF ELECTRICAL ENGINEERS, STEVENAGE, GB; RONG MINGZHE ET AL: "Research on the surface dynamics of AgMeO contacts", XP002053057 * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 055 (E - 0882) 31 January 1990 (1990-01-31) * |
PROCEEDINGS OF THE CSEE, NOV. 1993, CHINA, vol. 13, no. 6, ISSN 0258-8013, pages 27 - 32 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1024212A2 (en) * | 1999-01-27 | 2000-08-02 | Dowa Mining Co., Ltd. | Wear resistant copper or copper base alloy, method of preparing the same and electrical part using the same |
EP1024212A3 (en) * | 1999-01-27 | 2001-09-05 | Dowa Mining Co., Ltd. | Wear resistant copper or copper base alloy, method of preparing the same and electrical part using the same |
US6336979B1 (en) | 1999-01-27 | 2002-01-08 | Dowa Mining Co., Ltd. | Wear resistant copper base alloy, method of preparing the same and electrical part using the same |
EP1026287A1 (en) * | 1999-02-03 | 2000-08-09 | Dowa Mining Co., Ltd. | Process for production of copper or copper base alloys |
US6312762B1 (en) | 1999-02-03 | 2001-11-06 | Dowa Mining Co., Ltd. | Process for production of copper or copper base alloys |
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