EP0809720A1 - Pulse-modulated d.c. voltage application process - Google Patents
Pulse-modulated d.c. voltage application processInfo
- Publication number
- EP0809720A1 EP0809720A1 EP96900953A EP96900953A EP0809720A1 EP 0809720 A1 EP0809720 A1 EP 0809720A1 EP 96900953 A EP96900953 A EP 96900953A EP 96900953 A EP96900953 A EP 96900953A EP 0809720 A1 EP0809720 A1 EP 0809720A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- voltage
- pulse
- modulated
- rectifier
- adjustable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/18—Electrophoretic coating characterised by the process using modulated, pulsed, or reversing current
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/08—AC plus DC
Definitions
- the present invention relates to a method and a device for coating objects by means of direct current.
- the rectifier generators currently on the market also have considerable disadvantages. Depending on the design, they have a ripple that depends on the type and quality of rectification and smoothing of the input AC voltage (see Vincent, Journal of Coatings Technology Vol. 62, No. 785, June 1990). In addition, this residual ripple is load-dependent, i.e. feedback is obtained via the coating process itself. This residual ripple is then only interpreted as a disturbance.
- the adjustable AC voltage components are preferably generated from periodic signals, in particular harmonic vibrations (sine vibrations), which are readily available.
- the superimposition of the DC voltage with the AC voltage components can be switched on and off in an adjustable duty cycle.
- the pulse modulation as a variation of the conventional coating method with pure direct current, can be limited to specific time segments of the coating, such as the beginning or the end.
- the preferred duty cycles of On: Off are the ranges between 10: 1 and 1:10.
- the duration of the "on" period in which pulse modulation takes place is between 10 ms and 100 s.
- the DC voltages used according to the invention are in the range from 0 to 500 V.
- the AC voltage components to be superimposed are between 0 and 500 V.
- the superimposition takes place in such a way that the resulting voltage does not change its direction, that is to say is a pulse-modulated DC voltage.
- the device according to the invention is however, not limited to this, so that it is also possible to work with a resulting alternating voltage if this results in advantages.
- the period of the periodic AC components used for the superimposition is between 1 and 500 ms. This corresponds to a frequency of 1000 to 2 Hz. It is preferred to work with a frequency that results from the mains voltage, e.g. 50 Hz or a multiple thereof.
- One variant consists in connecting an alternating current (stell) transformer in series with a direct current generator.
- alternating current (stell) transformer via a rectifier so that a rectified alternating voltage is coupled in. If a diode is connected between the AC source and the input of the rectifier, further modulation of the voltage is achieved in such a way that only the positive or only the negative half-waves reach the rectifier.
- the pulse modulation can optionally be switched on in such a way that the coupling of the AC voltage components takes place via a mechanical or electronic relay.
- the latter can be controlled via a function generator (i.e. with low current) to achieve a defined duty cycle.
- the function generator can be a commercially available electronic device. It is preferably implemented as a programmable microprocessor system, particularly preferably by a computer with appropriate software, with an analog / digital converter for receiving the control voltage and an output unit for the trigger pulses.
- a preferred use of the device according to the invention takes place in electrocoating.
- the amount of paint deposited in the processing time depends directly on the amount of charge that has flowed - and thus indirectly on the immersion voltage. It should be noted that the so-called break-off voltage due to heating and boiling processes creates a gas layer that can break off the current flow. It is also important to obtain a uniform and sufficient layer thickness of the lacquer even in inaccessible places, i.e. sufficient wrap with reduced outer layer thickness.
- the method according to the invention surprisingly produces an optimized result with respect to this in part. conflicting requirements achieved.
- FIG. 1 shows the DC voltage generator 2 and the galvanically decoupled AC variable transformer 1.
- the coupling which can optionally be switched on and off via a switch c, is effected via the rectifier 3.
- the diode b is bridged via the switch a or not, all half-waves or only the positive half-waves are rectified on the rectifier.
- the resulting pulse-modulated voltage is shown in diagram a) (switch a open) or b) (switch a closed, diode bridged) in FIG. 1.
- the current values of current and voltage can be recorded and monitored by a measuring system 6.
- the electrodeposition bath is marked with the number 7.
- FIG. 2 shows a variant of the circuit of Figure 1, in which instead of the elements a, b and c there is a semiconductor relay 4 between the transformer 1 and the rectifier 3.
- This semiconductor relay 4 is controlled by a function generator 5.
- the pulse modulation is in a defined duty cycle on and off.
- Diagram a) at the lower edge of FIG. 2 schematically shows the resulting pulse-modulated voltage U tot depending on the signal U st from the function generator.
- FIG. 3 shows a circuit in which the function generator 8 intervenes in the phase control 9 of a thyristor bridge rectifier 10 for a three-phase source 11. This periodically switches between two phase angles Fi and F 2 , which correspond to two output voltages U 1 and U 2 . The pulses then have the form of smoothed three-phase pulses shown in the diagram a) of FIG. 3 at two voltage levels. The residual ripple of the signals can be adjusted by dimensioning the smoothing 12. Of course, it is also possible with this circuit arrangement to switch over more than 2 voltage levels via the function generator.
- FIG. 4 shows a further variant of the device according to the invention with a series connection of direct current and alternating current generator, in which the diode 13 has been added.
- the rectifier circuit according to FIG. 1 was used.
- the maximum current that can be achieved in the test setup was limited to 6 A on average by the variable transformer.
- the required current density was then achieved by reducing the active area of the metal sheets to be coated.
- a pulse modulation with two pulse half-waves is set (frequency quasi 100 Hz, see diagram a) in FIG. 9).
- the results are shown in Figure 5 and Tables 1 and 2 (column 1). Up to a strength of 60 V, the breaking voltage is determined by the peak voltage reached. The pulse rate was increased to 250 V in some cases. As a result, peak voltages could be reached, some of which were 40 - 50 V higher than those of a pure DC voltage separation.
- Pulse modulation with a pulse half-wave was set (frequency quasi 50 Hz, see diagram b) in FIG. 9). The results are shown in Figure 6 and Tables 1 and 2 (column 2). By reducing the pulse frequency, significantly higher peak voltages were possible for all products. This effect already started with voltage pulses of 30 V and increased with increasing pulse strength. With voltage pulses of 150 - 250 V, the difference between the break voltage of a DC voltage separation and the possible voltage peaks rose to values of 70 - 80 V. The layer thickness at 20 V under break voltage decreased with increasing pulse proportion.
- the novel process has the following advantages:
- the total voltage can be increased significantly above the breakdown voltage of conventional methods before a breakdown occurs.
- the voltage that must be applied to achieve a certain layer thickness can be varied within a wide range by the method according to the invention by adjusting the ratio of the pulse voltage and DC voltage components.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19502470A DE19502470A1 (en) | 1995-01-27 | 1995-01-27 | Pulse-modulated DC application method |
DE19502470 | 1995-01-27 | ||
PCT/EP1996/000138 WO1996023090A1 (en) | 1995-01-27 | 1996-01-15 | Pulse-modulated d.c. voltage application process |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0809720A1 true EP0809720A1 (en) | 1997-12-03 |
EP0809720B1 EP0809720B1 (en) | 2002-05-08 |
Family
ID=7752413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96900953A Expired - Lifetime EP0809720B1 (en) | 1995-01-27 | 1996-01-15 | Pulse-modulated d.c. voltage application process |
Country Status (7)
Country | Link |
---|---|
US (1) | US6197179B1 (en) |
EP (1) | EP0809720B1 (en) |
JP (1) | JPH10513503A (en) |
BR (1) | BR9606848A (en) |
DE (2) | DE19502470A1 (en) |
ES (1) | ES2176430T3 (en) |
WO (1) | WO1996023090A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
DE19912897A1 (en) * | 1999-03-23 | 2000-09-28 | Daimler Chrysler Ag | Catalyst and process for making a catalyst |
AU2002224434A1 (en) * | 2000-10-18 | 2002-04-29 | Tecnu, Inc. | Electrochemical processing power device |
US6620303B2 (en) * | 2001-05-21 | 2003-09-16 | Hong Kong Polytechnic University | Process for making nickel electroforms |
US6746591B2 (en) * | 2001-10-16 | 2004-06-08 | Applied Materials Inc. | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
DE10325656C5 (en) * | 2003-06-06 | 2007-12-27 | Eisenmann Anlagenbau Gmbh & Co. Kg | Electrophoretic dip painting system |
DE102006044050A1 (en) * | 2006-09-20 | 2008-04-03 | Eisenmann Anlagenbau Gmbh & Co. Kg | Process for the electrophoretic coating of workpieces and coating equipment |
US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
WO2020160531A1 (en) * | 2019-02-01 | 2020-08-06 | Lumishield Technologies Incorporated | Methods and compositions for improved adherence of organic coatings to materials |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1534494A (en) | 1967-08-21 | 1968-07-26 | Peter Stoll Fa | Method and device for electrically covering electrically conductive objects |
US3702813A (en) | 1967-09-14 | 1972-11-14 | Sumitomo Electric Industries | Process of insulating wire by electrophoresis plus non-electrophoresis coating steps |
DE1796176A1 (en) | 1967-09-14 | 1972-03-23 | Sumitomo Electric Industries | Insulated wire and process for its manufacture |
US3579769A (en) * | 1968-02-19 | 1971-05-25 | Akira Matsushita | Capacitors and production thereof |
US3616434A (en) * | 1968-04-18 | 1971-10-26 | Novachrome Inc | Apparatus with power source for plating |
US3971708A (en) * | 1971-07-08 | 1976-07-27 | Scm Corporation | Electrocoating process |
JPS5852038B2 (en) * | 1980-03-26 | 1983-11-19 | 株式会社 日本軽金属総合研究所 | Manufacturing method of colored aluminum material |
US4478689A (en) * | 1981-07-31 | 1984-10-23 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
ATE160451T1 (en) * | 1992-04-09 | 1997-12-15 | Raychem Corp | ELECTRODEPOSITION METHOD FOR ATTACHING MICRO-ENCAPSULED LIQUID CRYSTAL MATERIAL TO ELECTRODES |
US5550104A (en) * | 1994-09-09 | 1996-08-27 | Davis, Joseph & Negley | Electrodeposition process for forming superconducting ceramics |
-
1995
- 1995-01-27 DE DE19502470A patent/DE19502470A1/en not_active Ceased
-
1996
- 1996-01-15 JP JP8522583A patent/JPH10513503A/en active Pending
- 1996-01-15 BR BR9606848A patent/BR9606848A/en not_active IP Right Cessation
- 1996-01-15 EP EP96900953A patent/EP0809720B1/en not_active Expired - Lifetime
- 1996-01-15 ES ES96900953T patent/ES2176430T3/en not_active Expired - Lifetime
- 1996-01-15 WO PCT/EP1996/000138 patent/WO1996023090A1/en active IP Right Grant
- 1996-01-15 US US08/894,074 patent/US6197179B1/en not_active Expired - Fee Related
- 1996-01-15 DE DE59609188T patent/DE59609188D1/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO9623090A1 * |
Also Published As
Publication number | Publication date |
---|---|
BR9606848A (en) | 1997-11-25 |
ES2176430T3 (en) | 2002-12-01 |
DE59609188D1 (en) | 2002-06-13 |
JPH10513503A (en) | 1998-12-22 |
EP0809720B1 (en) | 2002-05-08 |
US6197179B1 (en) | 2001-03-06 |
DE19502470A1 (en) | 1996-08-01 |
WO1996023090A1 (en) | 1996-08-01 |
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