EP0785053A3 - Process for the continuous production of chip- or fibreboards - Google Patents
Process for the continuous production of chip- or fibreboards Download PDFInfo
- Publication number
- EP0785053A3 EP0785053A3 EP97200068A EP97200068A EP0785053A3 EP 0785053 A3 EP0785053 A3 EP 0785053A3 EP 97200068 A EP97200068 A EP 97200068A EP 97200068 A EP97200068 A EP 97200068A EP 0785053 A3 EP0785053 A3 EP 0785053A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- chip
- continuous production
- fibreboards
- raw materials
- release agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
- B27N3/083—Agents for facilitating separation of moulds from articles
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Paper (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Bei einem Verfahren zur kontinuierlichen Herstellung von Span- oder Faserplatten aus lignocellulosehaltigen Rohstoffen werden die Rohstoffe in Span- und/oder Faserform mit einem NCO-Gruppen aufweisenden Bindemittel beleimt, zu einer Matte geformt und unter Einwirkung von Wärme zu der Span- oder Faserplatte verpreßt. Dabei wird ein äußeres Trennmittel insbesondere auf den Preßzulagen vor der Verpressung aufgebracht. Als Trennmittel findet Talkum Verwendung.In a process for the continuous production of chip or Fiberboard made from raw materials containing lignocellulose the raw materials in chip and / or fiber form with an NCO group containing binder glued, formed into a mat and under the influence of heat to the chipboard or fiberboard pressed. An external release agent is used in particular the pressing allowances applied before pressing. As a release agent talc is used.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19601401 | 1996-01-16 | ||
DE19601401A DE19601401C1 (en) | 1996-01-16 | 1996-01-16 | Continuous production of chipboard or fibreboard |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0785053A2 EP0785053A2 (en) | 1997-07-23 |
EP0785053A3 true EP0785053A3 (en) | 1999-03-31 |
EP0785053B1 EP0785053B1 (en) | 2003-03-19 |
Family
ID=7782901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97200068A Expired - Lifetime EP0785053B1 (en) | 1996-01-16 | 1997-01-10 | Process for the continuous production of chip- or fibreboards |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0785053B1 (en) |
DE (2) | DE19601401C1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007012691B4 (en) * | 2007-03-13 | 2016-05-12 | SWISS KRONO Tec AG | Process for the production of wood fiber boards and LDF, MDF and HDF boards produced by this process |
DE102009047764A1 (en) | 2009-12-10 | 2011-06-16 | Evonik Goldschmidt Gmbh | Release agent and use for the production of composite moldings |
AT509199B1 (en) | 2010-02-22 | 2011-07-15 | Mikowitsch Herbert | METHOD FOR PRODUCING A PRESSURE PLATE |
SE2250239A1 (en) * | 2022-02-22 | 2023-08-23 | Ekoligens Ab | Moulded products and systems and methods for making such moulded products from cellulose fibres |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB665673A (en) * | 1944-08-09 | 1952-01-30 | Arthur Ray Welch | Method of and apparatus for making improved wood products |
GB1148016A (en) * | 1966-03-17 | 1969-04-10 | Novopan Ges Mbh Deutsche | An improved method for producing plates or moulded bodies |
DE2647488A1 (en) * | 1976-10-21 | 1978-04-27 | Basf Ag | METHOD FOR MANUFACTURING CHIPBOARD |
US4131662A (en) * | 1978-01-03 | 1978-12-26 | Mobay Chemical Corporation | Talc-based external mold release agent for polyurethane foams |
DE3108537A1 (en) * | 1981-03-06 | 1982-11-04 | Bayer Ag, 5090 Leverkusen | Aqueous isocyanate emulsions, and use thereof as binders in a process for the production of mouldings |
US5302330A (en) * | 1993-06-08 | 1994-04-12 | Harold Umansky | Method for the manufacture of waferboard |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3820376A1 (en) | 1988-06-15 | 1989-12-21 | Novopan Gmbh | METHOD FOR PRODUCING MULTI-LAYERED CHIPBOARDS |
-
1996
- 1996-01-16 DE DE19601401A patent/DE19601401C1/en not_active Expired - Fee Related
-
1997
- 1997-01-10 EP EP97200068A patent/EP0785053B1/en not_active Expired - Lifetime
- 1997-01-10 DE DE59709532T patent/DE59709532D1/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB665673A (en) * | 1944-08-09 | 1952-01-30 | Arthur Ray Welch | Method of and apparatus for making improved wood products |
GB1148016A (en) * | 1966-03-17 | 1969-04-10 | Novopan Ges Mbh Deutsche | An improved method for producing plates or moulded bodies |
DE2647488A1 (en) * | 1976-10-21 | 1978-04-27 | Basf Ag | METHOD FOR MANUFACTURING CHIPBOARD |
US4131662A (en) * | 1978-01-03 | 1978-12-26 | Mobay Chemical Corporation | Talc-based external mold release agent for polyurethane foams |
DE3108537A1 (en) * | 1981-03-06 | 1982-11-04 | Bayer Ag, 5090 Leverkusen | Aqueous isocyanate emulsions, and use thereof as binders in a process for the production of mouldings |
US5302330A (en) * | 1993-06-08 | 1994-04-12 | Harold Umansky | Method for the manufacture of waferboard |
Also Published As
Publication number | Publication date |
---|---|
EP0785053A2 (en) | 1997-07-23 |
EP0785053B1 (en) | 2003-03-19 |
DE19601401C1 (en) | 1997-05-28 |
DE59709532D1 (en) | 2003-04-24 |
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