EP0764394A1 - A method and device for removing a surface mounted component from a circuit board - Google Patents
A method and device for removing a surface mounted component from a circuit boardInfo
- Publication number
- EP0764394A1 EP0764394A1 EP95902374A EP95902374A EP0764394A1 EP 0764394 A1 EP0764394 A1 EP 0764394A1 EP 95902374 A EP95902374 A EP 95902374A EP 95902374 A EP95902374 A EP 95902374A EP 0764394 A1 EP0764394 A1 EP 0764394A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- circuit board
- surface mounted
- adhesive joint
- thermal shock
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
Definitions
- the present invention relates to a method and a de ⁇ vice for removing a surface mounted component from a cir- cuit board.
- the removal is performed in a conventional way in that the solder joint is melted, so that the compo ⁇ nent is loosened.
- adhes- ives which often are epoxy based, so that the component is attached to the circuit board by means of an adhesive joint.
- adhesives have different properties than solder material in relevant respects, the removal thus has to be performed in another way.
- the adhe ⁇ sive joint can normally not be loosened in a way which corresponds to melting of the solder joint.
- An object of the present invention is accordingly to bring about a method and a device for removing surface mounted components, the above described risks and drawbacks being avoided.
- the removal shall further be performed quickly and inexpensively.
- Different types of passive com- ponents as well as semiconductor components and non-en ⁇ closed chips are defined as surface mounted components.
- This object is obtained in that the component and the adhesive joint are subjected to a thermal shock by being cooled down and in that the adhesive joint is imparted with internal mechanical stresses by the thermal shock, so that the component is loosened.
- the drawing shows a circuit board 10, on which a first component 11 and a second component 12 have been sur- face mounted by means of an adhesive joint on the circuit board.
- the circuit board is made of plastic and is provided with circuitry 13 and connection pads 14 of metal.
- the de ⁇ vice shown in the drawing comprises a tube 15, which is vertically movable in relation to the circuit board 10. The dimensions of the tube 15 are such that areas with other ⁇
- the shield can be brought about by means of a heat buffer or the like, for example by means of guided air streams.
- Other types of heat conduction may also solve the problem with the shielding or the isolation of the component which shall be removed.
- the method according to the invention is especially suitable at the removal of non-enclosed semiconductor com ⁇ ponents, chips and the like but is also suitable for other surface mounted components.
- the adhesive and the component shall be different, so that shear forces appear between them.
- the material in the cir ⁇ cuit board can be plastic, but also ceramic and other mate ⁇ rials may be used.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9303909 | 1993-11-25 | ||
SE9303909A SE502007C2 (en) | 1993-11-25 | 1993-11-25 | Method and Device for Removing a Surface Mounted Component Attached to a Circuit Board |
PCT/SE1994/001124 WO1995015073A1 (en) | 1993-11-25 | 1994-11-24 | A method and device for removing a surface mounted component from a circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0764394A1 true EP0764394A1 (en) | 1997-03-26 |
Family
ID=20391880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95902374A Withdrawn EP0764394A1 (en) | 1993-11-25 | 1994-11-24 | A method and device for removing a surface mounted component from a circuit board |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0764394A1 (en) |
SE (1) | SE502007C2 (en) |
WO (1) | WO1995015073A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6875774B2 (en) * | 2002-08-06 | 2005-04-05 | The University Of North Carolina | Aza-bridged bicyclic amine derivatives for use as novel cholinergic receptor ligands |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0305696B1 (en) * | 1987-08-31 | 1992-07-29 | Siemens Aktiengesellschaft | Process for desoldering glued smd components |
-
1993
- 1993-11-25 SE SE9303909A patent/SE502007C2/en not_active IP Right Cessation
-
1994
- 1994-11-24 EP EP95902374A patent/EP0764394A1/en not_active Withdrawn
- 1994-11-24 WO PCT/SE1994/001124 patent/WO1995015073A1/en not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO9515073A1 * |
Also Published As
Publication number | Publication date |
---|---|
SE502007C2 (en) | 1995-07-10 |
SE9303909L (en) | 1995-05-26 |
WO1995015073A1 (en) | 1995-06-01 |
SE9303909D0 (en) | 1993-11-25 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19960624 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): CH DE FR GB IT LI |
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GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
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GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
17Q | First examination report despatched |
Effective date: 20010330 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
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GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20011030 |