EP0757081A2 - Curable oil- and water-repellent silicone composition - Google Patents
Curable oil- and water-repellent silicone composition Download PDFInfo
- Publication number
- EP0757081A2 EP0757081A2 EP96305474A EP96305474A EP0757081A2 EP 0757081 A2 EP0757081 A2 EP 0757081A2 EP 96305474 A EP96305474 A EP 96305474A EP 96305474 A EP96305474 A EP 96305474A EP 0757081 A2 EP0757081 A2 EP 0757081A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- sio
- stannous
- composition
- group
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 36
- 239000005871 repellent Substances 0.000 title abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 150000001282 organosilanes Chemical class 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 229910020487 SiO3/2 Inorganic materials 0.000 claims description 33
- -1 2-ethylhexyl Chemical group 0.000 claims description 30
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 28
- 229910020485 SiO4/2 Inorganic materials 0.000 claims description 15
- 229910020388 SiO1/2 Inorganic materials 0.000 claims description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 230000007062 hydrolysis Effects 0.000 claims description 7
- 238000006460 hydrolysis reaction Methods 0.000 claims description 7
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 6
- 229910020447 SiO2/2 Inorganic materials 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 5
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 4
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 claims description 4
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- TUXYZHVUPGXXQG-UHFFFAOYSA-M 4-bromobenzoate Chemical compound [O-]C(=O)C1=CC=C(Br)C=C1 TUXYZHVUPGXXQG-UHFFFAOYSA-M 0.000 claims description 2
- KMQLIDDEQAJAGJ-UHFFFAOYSA-N 4-oxo-4-phenylbutyric acid Chemical compound OC(=O)CCC(=O)C1=CC=CC=C1 KMQLIDDEQAJAGJ-UHFFFAOYSA-N 0.000 claims description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 claims description 2
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 claims description 2
- IPBVNPXQWQGGJP-UHFFFAOYSA-N acetic acid phenyl ester Natural products CC(=O)OC1=CC=CC=C1 IPBVNPXQWQGGJP-UHFFFAOYSA-N 0.000 claims description 2
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 claims description 2
- 229940114081 cinnamate Drugs 0.000 claims description 2
- 150000001868 cobalt Chemical class 0.000 claims description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 claims description 2
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 159000000014 iron salts Chemical class 0.000 claims description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 claims description 2
- 229940070765 laurate Drugs 0.000 claims description 2
- 229940049918 linoleate Drugs 0.000 claims description 2
- 150000002696 manganese Chemical class 0.000 claims description 2
- SNVLJLYUUXKWOJ-UHFFFAOYSA-N methylidenecarbene Chemical compound C=[C] SNVLJLYUUXKWOJ-UHFFFAOYSA-N 0.000 claims description 2
- 125000005609 naphthenate group Chemical group 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- CYCFYXLDTSNTGP-UHFFFAOYSA-L octadecanoate;tin(2+) Chemical compound [Sn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CYCFYXLDTSNTGP-UHFFFAOYSA-L 0.000 claims description 2
- 229940049964 oleate Drugs 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229940049953 phenylacetate Drugs 0.000 claims description 2
- WLJVXDMOQOGPHL-UHFFFAOYSA-N phenylacetic acid Chemical compound OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims description 2
- JACRWUWPXAESPB-UHFFFAOYSA-M tropate Chemical compound OCC(C([O-])=O)C1=CC=CC=C1 JACRWUWPXAESPB-UHFFFAOYSA-M 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- SWIFFTPTJGCBPS-UHFFFAOYSA-N [1-[butylamino(methoxy)amino]-2-ethoxy-1-oxopropan-2-yl] acetate Chemical compound CON(C(C(C)(OC(C)=O)OCC)=O)NCCCC SWIFFTPTJGCBPS-UHFFFAOYSA-N 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 abstract description 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 28
- 238000000576 coating method Methods 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 22
- 239000003960 organic solvent Substances 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 14
- 239000000243 solution Substances 0.000 description 11
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 10
- 239000008096 xylene Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- GETTZEONDQJALK-UHFFFAOYSA-N (trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC=C1 GETTZEONDQJALK-UHFFFAOYSA-N 0.000 description 3
- XXZOEDQFGXTEAD-UHFFFAOYSA-N 1,2-bis(trifluoromethyl)benzene Chemical group FC(F)(F)C1=CC=CC=C1C(F)(F)F XXZOEDQFGXTEAD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000004566 IR spectroscopy Methods 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 230000008034 disappearance Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003039 volatile agent Substances 0.000 description 3
- QEGNUYASOUJEHD-UHFFFAOYSA-N 1,1-dimethylcyclohexane Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 150000001367 organochlorosilanes Chemical class 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- ZCVOUFBEEYGNOL-UHFFFAOYSA-N trichloro(3,3,4,4,5,5,6,6,6-nonafluorohexyl)silane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)CC[Si](Cl)(Cl)Cl ZCVOUFBEEYGNOL-UHFFFAOYSA-N 0.000 description 2
- PMQIWLWDLURJOE-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F PMQIWLWDLURJOE-UHFFFAOYSA-N 0.000 description 2
- IJROHELDTBDTPH-UHFFFAOYSA-N trimethoxy(3,3,4,4,5,5,6,6,6-nonafluorohexyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)F IJROHELDTBDTPH-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical group CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical group CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
Definitions
- the present invention relates generally to curable silicone compositions and more particularly to compositions that form a highly water-repellent and highly oil-repellent cured coating.
- JP-A 51-148749 teaches a silicone composition that cures at room temperature to form a coating.
- This composition comprises organopolysiloxane resin and two types of alkoxysilanes.
- JP-A 55-48245 describes a composition comprising organopolysiloxane resin, alpha,omegadihydroxydiorganosiloxane, and organosilane.
- JP-A 5-59285 discloses a composition comprising organopolysiloxane resin, alpha,omega-dihydroxyfluoroalkylmethylpolysiloxane, and organosilane.
- compositions do not yield cured films with fully satisfactory levels of water and oil repellency. As a result, these compositions cannot be used in applications where higher levels of water- and oil-repellency performance are required.
- a curable silicone composition that comprises:
- the organopolysiloxane resin constituting component (A) is defined by the average unit formula given above.
- the R in this formula represents substituted and unsubstituted monovalent hydrocarbon groups and is exemplified by alkyl groups such as methyl, ethyl, propyl, tert-butyl, 2-ethylhexyl, dodecyl and octadecyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl and naphthyl; and substituted alkyl groups such as chloromethyl, 3,3,3-trifluoropropyl, 3,3,4,4,5,5,5-heptafluoropentyl and difluoromonochloropropyl.
- Alkyl and alkenyl are preferred among the preceding, and methyl is particularly preferred.
- Z is the hydrogen atom or a C1 to C6 alkyl group, for example, methyl, ethyl, propyl, or butyl.
- the group represented by OZ is therefore either the hydroxyl group or an alkoxy group.
- the subscript a has a value from 0.80 to 1.80.
- the subscript b has a value that gives a content of silicon-bonded hydroxyl or alkoxy in this compound of 0.01 to 10 weight% and preferably gives a value of 0.05 to 5 weight%.
- Organopolysiloxane resin (A) is prepared, for example, by subjecting a mixture of organochlorosilanes, having on average 0.80 to 1.80 monovalent hydrocarbon groups per silicon atom, to hydrolysis in the presence of organic solvent followed by condensation. Submitting the organopolysiloxane resin thus prepared to heat treatment will yield organopolysiloxane resin in which a portion of the silanol has been condensed.
- the organochlorosilane mixture is exemplified by mixtures of methyltrichlorosilane and dimethyldichlorosilane, optionally with the addition of trimethylchlorosilane or tetrachlorosilane. A portion of the chlorosilane may be replaced with alkoxysilane.
- the fluorosilicone resin (B) defined by the preceding average unit formulae is the component that characterizes the present invention.
- R in the preceding formulae represents substituted and unsubstituted monovalent hydrocarbon groups, which are exemplified by the same groups as elaborated above. Alkyl and alkenyl are again preferred, and methyl is also particularly preferred.
- R 1 is an alkylene or alkyleneoxyalkylene group, wherein the alkylene groups are exemplified by ethylene, methylethylene, ethylethylene, propylethylene, butylethylene, propylene, butylene, 1-methylpropylene, pentylene, hexylene, heptylene, octylene, nonylene, and decylene, and the alkyleneoxyalkylene groups are exemplified by ethyleneoxyethylene, ethyleneoxypropylene, ethyleneoxybutylene, propyleneoxyethylene, propyleneoxypropylene, propyleneoxybutylene, butyleneoxyethylene, and butyleneoxypropylene.
- the subscript c is an integer with a value of at least 4 and preferably with a value from 4 to 12. It is typically exemplified by 4, 6, and 8.
- the subscript d is an integer from 1 to 3, m is a number with a value greater than 0, and n is a number with a value greater than 0.
- the fluorosilicone resin (B) is prepared, for example, by running a condensation reaction in organic solvent in the presence of a condensation-accelerating catalyst between fluoroalkylsilane with the general formula F(CF 2 ) c -R 1 -SiX 3 (wherein R 1 and c are defined as above, and X is a halogen atom such as chlorine or bromine or an alkoxy group such as methoxy, ethoxy, propoxy, and butoxy) and an organopolysiloxane resin comprising the R 3 SiO 1/2 and SiO 4/2 siloxane units (R is defined as above).
- a condensation-accelerating catalyst between fluoroalkylsilane with the general formula F(CF 2 ) c -R 1 -SiX 3 (wherein R 1 and c are defined as above, and X is a halogen atom such as chlorine or bromine or an alkoxy group such as methoxy, ethoxy, propoxy, and butoxy
- Useable organic solvents are exemplified by aromatic solvents such as toluene, or xylene, and by fluorinated solvents such as alpha, alpha,alpha-trifluorotoluene or hexafluoroxylene.
- the subject fluorosilicone resin is also prepared by subjecting the fluoroalkylsilane F(CF 2 ) c -R 1 -SiX 3 (R 1 , c, and X are defined as above) and optionally organosilane with the general formula R d SiX 4-d (R, X, and d are defined as above) to (co)hydrolysis in the presence of organic solvent and acidic aqueous solution followed by condensation.
- his particular method is carried out, for example, by dissolving the silane with the general formula or formulas given above in organic solvent and adding this solution dropwise to a stirred acidic aqueous solution, or by adding the acidic aqueous solution dropwise to the stirred organic solvent solution.
- Organic solvents useable for this purpose preferably are capable of dissolving both the silane precursor and the fluorosilicone resin product.
- ethers such as diethyl ether and tetrahydrofuran
- ketones such as acetone and methyl isobutyl ketone
- fluorinated solvents such as alpha,alpha,alpha-trifluorotoluene and hexafluoroxylene
- volatile silicone solvents such as hexamethyldisiloxane, hexamethylcyclotrisiloxane, and octamethylcyclotetrasiloxane.
- the silane concentration in the organic solvent is preferably selected to give a concentration of 10 to 80 weight% for the fluorosilicone resin product.
- Aqueous solutions of sulfuric acid, nitric acid, hydrochloric acid and other strong protic acids may be used as the acidic aqueous solution.
- the use of aqueous hydrochloric acid is preferred, in which case a hydrogen chloride concentration of at least 5 weight% is preferred.
- the temperature during and after dropwise addition is preferably in the range from 0°C to 120°C.
- the resulting fluorosilicone resin solution is then allowed to stand to obtain separation of the aqueous layer.
- the organic solvent layer containing the fluorosilicone resin is, at this point, preferably washed with water to neutrality.
- the organic solvent layer is then preferably dried after the water wash step, wherein this drying preferably employs an azeotrope with organic solvent and a water-separation tube.
- the organic solvent used for this purpose should have a low solubility in water.
- the resulting fluorosilicone resin (B) will contain some residual silanol, and its silanol content will generally be in the range from 0.01 to 10 weight%, and preferably is in the range from 0.05 to 5 weight%.
- Component (B) is added at 0.5 to 500 weight parts, and preferably at 0.5 to 100 weight parts, in each case per 100 weight parts component (A).
- the use of less than 0.5 weight part results in a cured coating with an inadequate water- and oil-repellency, while the use of more 500 weight parts causes the cured film to be soft and thus to have an Inadequate durability.
- the fluorosilicone resin (B) is exemplified by compounds with the following average unit formulae: ⁇ (CH 3 ) 3 SiO 1/2 ⁇ 0.9 (SiO 4/2 ) 1.0 ⁇ F(CF 2 ) 4 C 2 H 4 SiO 3/2 ⁇ 0.1 ⁇ (CH 3 ) 3 SiO 1/2 ⁇ 0.9 (SiO 4/2 ) 1.0 ⁇ F(CF 2 ) 8 C 2 H 4 SiO 3/2 ⁇ 0.05 ⁇ (CH 3 ) 2 SiO 2/2 ⁇ 1.8 ⁇ F(CF 2 ) 4 C 2 H 4 SiO 3/2 ⁇ 12.2 ⁇ (CH 3 )SiO 3/2 ⁇ 0.7 ⁇ F(CF 2 ) 4 C 2 H 4 SiO 3/2 ⁇ 5.5 (SiO 4/2 ) 0.35 ⁇ F(CF 2 ) 4 C 2 H 4 SiO 3/2 ⁇ 4.34 (F(CF 2 ) 4 C 2 H 4 SiO 3/2 ) ⁇ (CH 3 )SiO 3/2
- Component (C) which is an organosilane with one of the general formulae given above, or the partial hydrolysis condensate thereof, functions to induce the cure of the composition of this invention at room temperature in the presence of moisture.
- R in the above formula represents substituted and unsubstituted monovalent hydrocarbon groups, which are exemplified by the same groups as elaborated above.
- Y is a hydrolyzable group and is exemplified by diorganoketoxime groups such as dimethyl ketoxime and methyl ethyl ketoxime; alkoxy groups such as methoxy and ethoxy; acyloxy groups such as acetoxy; organoamino groups such as N-butylamino; organoacylamide groups such as methylacetamide; N,N-diorganohydroxyamino groups such as N,N-diethylhydroxyamino; and by alkenyloxy groups such as propenoxy.
- the subscript e is an integer with a value of 1 or 2 and preferably has a value of 1.
- Component (C) may consist of only a single organosilane or partial hydrolysis condensate thereof. or it may consist of a mixture of two or more different organosilanes or partial hydrolysis condensates thereof.
- Component (C) is added at from 1 to 90 weight parts, and preferably at from 1 to 60 weight parts, in each case per 100 weight parts component (A).
- the cure-accelerating catalyst (D) is employed to accelerate the cure of the composition according to the present invention.
- the condensation reaction-accelerating catalysts used for the dehydration condensation of silanol groups are generally effective as this catalyst.
- Specific examples are the tin salts of carboxylic acids such as dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dioctoate, stannous octoate, stannous naphthenate, stannous oleate, stannous isobutyrate, stannous linoleate, stannous stearate, stannous benzoate, stannous naphthoate, stannous laurate, stannous o-thymotate, stannous beta-benzoylpropionate, stannous crotonate, stannous tropate, stannous p-bromobenzoate, stannous palmitoleate, stannous cinnamate and stannous
- Component (D) is added in sufficient quantity to induce the cure of our claimed composition and will generally be added in the range from 0.0001 to 10 weight parts per 100 weight parts component (A).
- composition of this invention comprises the components (A) through (D) described above, but it may also contain silane coupling agents (as exemplified below) for the purpose of improving the adherence to a range of substrates.
- silane coupling agents as exemplified below.
- the silane coupling agent may be used in the form of a single silane coupling agent, or it may be a mixture of two or more different silane coupling agents.
- the silane coupling agent is preferably added at from 0.01 to 10 weight% referred to the composition of the present invention.
- composition is prepared by mixing the above-described components (A) to (D) to homogeneity, in the absence of moisture.
- the mixing sequence is not critical, but when the organopolysiloxane resin (A) is a solid it is preferably first dissolved in organic solvent and the resulting solution is then mixed with the other components.
- Organic solvents useful for this purpose are exemplified by aromatic solvents such as benzene, toluene and xylene; aliphatic solvents such as cyclohexane, methylcyclohexane and dimethylcyclohexane; chlorinated solvents such as trichloroethylene, 1,1,1-trichloroethane, carbon tetrachloride and chloroform; saturated aliphatic hydrocarbon solvents such as hexane and industrial gasoline; ethers such as diethyl ether and tetrahydrofuran; ketone solvents such as methyl isobutyl ketone; fluorinated solvents such as alpha,alpha,alpha-trifluorotoluene, and hexafluoroxylene; and volatile silicones such as hexamethyldisiloxane, hexamethylcyclotrisiloxane and octamethylcyclotetrasiloxane.
- composition of the present invention is preferably used diluted with organic solvent, and useable organic solvents are exemplified by the same solvents as used for dissolution of the organopolysiloxane resin (A).
- organic solvent it is preferably used in an amount that gives a value of 5 to 90 weight% of our total composition.
- composition as described above can be stored in the absence of moisture for long periods of time. It cures at room temperature in the presence of moisture to form a coating with an excellent water repellency, oil repellency, resistance to fouling and staining, heat resistance, weathering resistance, and chemical resistance. Curing can also be accelerated by heating.
- the composition of the present invention is therefore highly useful in a variety of applications where the aforementioned properties are required. For example, it is suitable as an agent for preventing the adhesion of water drops. snow. and ice; as an antifouling or antistaining coating; and as a release coating, including mold-release applications.
- the water repellency of our cured coatings was evaluated through the contact angle with water and the water sliding angle.
- the oil repellency was evaluated through the contact angle with n-hexadecane.
- the contact angles were measured as follows: using a microsyringe, water or hexadecane was dripped at 20°C onto the cured coating at 10 locations; the corresponding contact angles were measured using a contact angle meter from Kyowa Kaimen Kagaku Kabushiki Kaisha; and these values were then averaged to give the contact angle for the cured coating.
- the water sliding angle was measured as follows: water was dripped as above onto the cured coating at 5 locations; the corresponding sliding angles of these water drops were measured using a drop sliding angle meter from Erma Inc.; and these values were averaged to give the sliding angle of the cured coating.
- a curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 1 g of the fluorosilicone resin whose synthesis is described in Synthesis Example 1, along with 7.3 g of methyltri(methyl ethyl ketoxime)silane, and 1 g of dibutyltin diacetate.
- the resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature.
- the contact angles of this cured coating were measured with the following results: 105° versus water and 58° versus n-hexadecane.
- the sliding angle for water was 21°.
- a curable silicone composition was prepared as in Example 1, but without the fluorosilicone resin of Synthesis Example 1.
- the resulting silicone composition was also cured as directed in Example 1, and the contact angles of this coating were measured with the following results: 104° versus water and 34° versus n-hexadecane. The sliding angle for water was 36°.
- a curable silicone composition was prepared by addition to the preceding, with mixing to homogeneity, of 1.5 g of the fluorosilicone resin of Synthesis Example 2, along with 7.3 g of methyltri(methyl ethyl ketoxime)silane, and 1 g of dibutyltin diacetate.
- the resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature.
- the contact angles of this cured coating were measured with the following results: 110° versus water and 63° versus n-hexadecane.
- the sliding angle for water was 22°.
- a curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 1 g of the fluorosilicone resin of Synthesis Example 2, along with 7.3 g of methyltrimethoxysilane, 1 g of 3-(2-aminoethyl)aminopropyltrimethoxysilane, and 1 g of dibutyltin dilaurate.
- the resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature.
- the contact angles of this cured coating were measured with the following results: 107° versus water and 59° versus n-hexadecane.
- the sliding angle for water was 23°.
- a curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 0.5 g of the fluorosilicone resin of Synthesis Example 3, along with 7.3 g of methyltrimethoxysilane, 1 g of 3-(2-aminoethyl)aminopropyltrimethoxysilane, and 1 g of dibutyltin dilaurate.
- the resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature. The contact angles of this cured coating were measured with the following results: 109° versus water and 66° versus n-hexadecane.
- the curable silicone composition of our invention comprises the components (A) to (D) as described above, and in particular because it contains the organopolysiloxane resin (A) and the fluorosilicone resin (B), our claimed composition unexpectedly cures at room temperature in the presence of moisture to yield a highly water and oil-repellent coating.
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Abstract
Description
- The present invention relates generally to curable silicone compositions and more particularly to compositions that form a highly water-repellent and highly oil-repellent cured coating.
- JP-A 51-148749 teaches a silicone composition that cures at room temperature to form a coating. This composition comprises organopolysiloxane resin and two types of alkoxysilanes. With respect to silicone compositions that form water-repellent cured films, JP-A 55-48245 describes a composition comprising organopolysiloxane resin, alpha,omegadihydroxydiorganosiloxane, and organosilane.
- Similarly, JP-A 5-59285 discloses a composition comprising organopolysiloxane resin, alpha,omega-dihydroxyfluoroalkylmethylpolysiloxane, and organosilane.
- The afore-mentioned compositions, however, do not yield cured films with fully satisfactory levels of water and oil repellency. As a result, these compositions cannot be used in applications where higher levels of water- and oil-repellency performance are required.
- It is therefore an object of the present invention to provide a curable silicone composition that cures at room temperature in the presence of moisture and which affords a highly water and oil-repellent coating.
- In the present invention, there is provided a curable silicone composition that comprises:
- (A) 100 weight parts of organopolysiloxane resin with the average unit formula
Ra (OZ) bSiO(4-a-b)/2
wherein R denotes substituted or unsubstituted monovalent hydrocarbon groups, Z is hydrogen atom or a C1 to C6 alkyl group, a ranges from 0.80 to 1.80, and b is a value that affords a content of silicon-bonded hydroxyl or alkoxy group in this composition of from 0.01 to 10 weight%; - (B) 0.5 to 500 weight parts of a fluorosilicone resin selected from the group of fluorosilicone resins having the average unit formulae
{F(CF2)c-R1-SiO3/2}m(RdSiO(4-d)/2)n
{F(CF2)c-R1-SiO3/2}m(SiO4/2)n
{F(CF2)c-R1-SiO3/2}m
and
{F(CF2)c-R1-SiO3/2}f(R3SiO1/2)g(SiO4/2)h
wherein R denotes substituted and unsubstituted monovalent hydrocarbon groups, R1 is an alkylene or alkyleneoxyalkylene group, c is an integer with a value of at least 4, d is an integer with a value from 1 to 3, m, n, f, g, and h are each numbers greater than 0 and (g + h) ≥ f. - (C) 1 to 90 weight parts of an organosilane selected from the group consisting of organosilanes having the general formulae
ReSiY4-e
and
SiY4
wherein R denotes substituted and unsubstituted monovalent hydrocarbon groups, Y is a hydrolyzable group, and e is an integer with a value of 1 or 2, or the partial hydrolysis condensate thereof;
and - (D) a cure-accelerating catalyst in sufficient quantity to cure the composition.
- The organopolysiloxane resin constituting component (A) is defined by the average unit formula given above. The R in this formula represents substituted and unsubstituted monovalent hydrocarbon groups and is exemplified by alkyl groups such as methyl, ethyl, propyl, tert-butyl, 2-ethylhexyl, dodecyl and octadecyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl and naphthyl; and substituted alkyl groups such as chloromethyl, 3,3,3-trifluoropropyl, 3,3,4,4,5,5,5-heptafluoropentyl and difluoromonochloropropyl. Alkyl and alkenyl are preferred among the preceding, and methyl is particularly preferred. Z is the hydrogen atom or a C1 to C6 alkyl group, for example, methyl, ethyl, propyl, or butyl. The group represented by OZ is therefore either the hydroxyl group or an alkoxy group. The subscript a has a value from 0.80 to 1.80. The subscript b has a value that gives a content of silicon-bonded hydroxyl or alkoxy in this compound of 0.01 to 10 weight% and preferably gives a value of 0.05 to 5 weight%.
- Organopolysiloxane resin (A) is prepared, for example, by subjecting a mixture of organochlorosilanes, having on average 0.80 to 1.80 monovalent hydrocarbon groups per silicon atom, to hydrolysis in the presence of organic solvent followed by condensation. Submitting the organopolysiloxane resin thus prepared to heat treatment will yield organopolysiloxane resin in which a portion of the silanol has been condensed. The organochlorosilane mixture is exemplified by mixtures of methyltrichlorosilane and dimethyldichlorosilane, optionally with the addition of trimethylchlorosilane or tetrachlorosilane. A portion of the chlorosilane may be replaced with alkoxysilane.
- The fluorosilicone resin (B) defined by the preceding average unit formulae is the component that characterizes the present invention. R in the preceding formulae represents substituted and unsubstituted monovalent hydrocarbon groups, which are exemplified by the same groups as elaborated above. Alkyl and alkenyl are again preferred, and methyl is also particularly preferred. R1 is an alkylene or alkyleneoxyalkylene group, wherein the alkylene groups are exemplified by ethylene, methylethylene, ethylethylene, propylethylene, butylethylene, propylene, butylene, 1-methylpropylene, pentylene, hexylene, heptylene, octylene, nonylene, and decylene, and the alkyleneoxyalkylene groups are exemplified by ethyleneoxyethylene, ethyleneoxypropylene, ethyleneoxybutylene, propyleneoxyethylene, propyleneoxypropylene, propyleneoxybutylene, butyleneoxyethylene, and butyleneoxypropylene. The subscript c is an integer with a value of at least 4 and preferably with a value from 4 to 12. It is typically exemplified by 4, 6, and 8. The subscript d is an integer from 1 to 3, m is a number with a value greater than 0, and n is a number with a value greater than 0.
- The fluorosilicone resin (B) is prepared, for example, by running a condensation reaction in organic solvent in the presence of a condensation-accelerating catalyst between fluoroalkylsilane with the general formula F(CF2)c-R1-SiX3 (wherein R1 and c are defined as above, and X is a halogen atom such as chlorine or bromine or an alkoxy group such as methoxy, ethoxy, propoxy, and butoxy) and an organopolysiloxane resin comprising the R3SiO1/2 and SiO4/2 siloxane units (R is defined as above). Useable organic solvents are exemplified by aromatic solvents such as toluene, or xylene, and by fluorinated solvents such as alpha, alpha,alpha-trifluorotoluene or hexafluoroxylene. The subject fluorosilicone resin is also prepared by subjecting the fluoroalkylsilane F(CF2)c-R1-SiX3 (R1, c, and X are defined as above) and optionally organosilane with the general formula RdSiX4-d (R, X, and d are defined as above) to (co)hydrolysis in the presence of organic solvent and acidic aqueous solution followed by condensation. his particular method is carried out, for example, by dissolving the silane with the general formula or formulas given above in organic solvent and adding this solution dropwise to a stirred acidic aqueous solution, or by adding the acidic aqueous solution dropwise to the stirred organic solvent solution. Organic solvents useable for this purpose preferably are capable of dissolving both the silane precursor and the fluorosilicone resin product. They are exemplified by ethers such as diethyl ether and tetrahydrofuran; ketones such as acetone and methyl isobutyl ketone; fluorinated solvents such as alpha,alpha,alpha-trifluorotoluene and hexafluoroxylene; and by volatile silicone solvents such as hexamethyldisiloxane, hexamethylcyclotrisiloxane, and octamethylcyclotetrasiloxane.
- The silane concentration in the organic solvent is preferably selected to give a concentration of 10 to 80 weight% for the fluorosilicone resin product. Aqueous solutions of sulfuric acid, nitric acid, hydrochloric acid and other strong protic acids, may be used as the acidic aqueous solution. The use of aqueous hydrochloric acid is preferred, in which case a hydrogen chloride concentration of at least 5 weight% is preferred. The temperature during and after dropwise addition is preferably in the range from 0°C to 120°C.
- After the optional addition of organic solvent or water, the resulting fluorosilicone resin solution is then allowed to stand to obtain separation of the aqueous layer. The organic solvent layer containing the fluorosilicone resin is, at this point, preferably washed with water to neutrality. The organic solvent layer is then preferably dried after the water wash step, wherein this drying preferably employs an azeotrope with organic solvent and a water-separation tube. The organic solvent used for this purpose should have a low solubility in water. The resulting fluorosilicone resin (B) will contain some residual silanol, and its silanol content will generally be in the range from 0.01 to 10 weight%, and preferably is in the range from 0.05 to 5 weight%.
- Component (B) is added at 0.5 to 500 weight parts, and preferably at 0.5 to 100 weight parts, in each case per 100 weight parts component (A). The use of less than 0.5 weight part results in a cured coating with an inadequate water- and oil-repellency, while the use of more 500 weight parts causes the cured film to be soft and thus to have an Inadequate durability.
- The fluorosilicone resin (B) is exemplified by compounds with the following average unit formulae:
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)4C2H4SiO3/2}0.1
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)8C2H4SiO3/2}0.05
{(CH3)2SiO2/2}1.8{F(CF2)4C2H4SiO3/2}12.2
{(CH3)SiO3/2}0.7{F(CF2)4C2H4SiO3/2}5.5
(SiO4/2)0.35{F(CF2)4C2H4SiO3/2}4.34
(F(CF2)4C2H4SiO3/2)
{(CH3)SiO3/2}0.5{F(CF2)4C2H4OC2H4SiO3/2}2.0
- Component (C), which is an organosilane with one of the general formulae given above, or the partial hydrolysis condensate thereof, functions to induce the cure of the composition of this invention at room temperature in the presence of moisture. R in the above formula represents substituted and unsubstituted monovalent hydrocarbon groups, which are exemplified by the same groups as elaborated above. Y is a hydrolyzable group and is exemplified by diorganoketoxime groups such as dimethyl ketoxime and methyl ethyl ketoxime; alkoxy groups such as methoxy and ethoxy; acyloxy groups such as acetoxy; organoamino groups such as N-butylamino; organoacylamide groups such as methylacetamide; N,N-diorganohydroxyamino groups such as N,N-diethylhydroxyamino; and by alkenyloxy groups such as propenoxy. The subscript e is an integer with a value of 1 or 2 and preferably has a value of 1. Component (C) may consist of only a single organosilane or partial hydrolysis condensate thereof. or it may consist of a mixture of two or more different organosilanes or partial hydrolysis condensates thereof. Component (C) is added at from 1 to 90 weight parts, and preferably at from 1 to 60 weight parts, in each case per 100 weight parts component (A).
- The cure-accelerating catalyst (D) is employed to accelerate the cure of the composition according to the present invention. The condensation reaction-accelerating catalysts used for the dehydration condensation of silanol groups are generally effective as this catalyst. Specific examples are the tin salts of carboxylic acids such as dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dioctoate, stannous octoate, stannous naphthenate, stannous oleate, stannous isobutyrate, stannous linoleate, stannous stearate, stannous benzoate, stannous naphthoate, stannous laurate, stannous o-thymotate, stannous beta-benzoylpropionate, stannous crotonate, stannous tropate, stannous p-bromobenzoate, stannous palmitoleate, stannous cinnamate and stannous phenylacetate; the iron salts, manganese salts, and cobalt salts of the preceding carboxylic acids; as well as the tetraalkyl titanates, complex salts of dialkyl titanates and organosiloxytitanates.
- Component (D) is added in sufficient quantity to induce the cure of our claimed composition and will generally be added in the range from 0.0001 to 10 weight parts per 100 weight parts component (A).
- The composition of this invention comprises the components (A) through (D) described above, but it may also contain silane coupling agents (as exemplified below) for the purpose of improving the adherence to a range of substrates.
NH2CH2CH2Si(OC2H5)3
NH2CH2CH2NH(CH2)3Si(OCH3)3
CH2=CHSi(OCH3)3
CH2=CHSi(OC2H5)3
CH2=CHSi (OOCCH3)3
HS (CH2)3Si (OCH3)3
CH2=C (CH3)Si (OCH3)3
- The silane coupling agent may be used in the form of a single silane coupling agent, or it may be a mixture of two or more different silane coupling agents. The silane coupling agent is preferably added at from 0.01 to 10 weight% referred to the composition of the present invention.
- Our composition is prepared by mixing the above-described components (A) to (D) to homogeneity, in the absence of moisture. The mixing sequence is not critical, but when the organopolysiloxane resin (A) is a solid it is preferably first dissolved in organic solvent and the resulting solution is then mixed with the other components. Organic solvents useful for this purpose are exemplified by aromatic solvents such as benzene, toluene and xylene; aliphatic solvents such as cyclohexane, methylcyclohexane and dimethylcyclohexane; chlorinated solvents such as trichloroethylene, 1,1,1-trichloroethane, carbon tetrachloride and chloroform; saturated aliphatic hydrocarbon solvents such as hexane and industrial gasoline; ethers such as diethyl ether and tetrahydrofuran; ketone solvents such as methyl isobutyl ketone; fluorinated solvents such as alpha,alpha,alpha-trifluorotoluene, and hexafluoroxylene; and volatile silicones such as hexamethyldisiloxane, hexamethylcyclotrisiloxane and octamethylcyclotetrasiloxane.
- The composition of the present invention is preferably used diluted with organic solvent, and useable organic solvents are exemplified by the same solvents as used for dissolution of the organopolysiloxane resin (A). When an organic solvent is used, it is preferably used in an amount that gives a value of 5 to 90 weight% of our total composition.
- Our composition as described above can be stored in the absence of moisture for long periods of time. It cures at room temperature in the presence of moisture to form a coating with an excellent water repellency, oil repellency, resistance to fouling and staining, heat resistance, weathering resistance, and chemical resistance. Curing can also be accelerated by heating. The composition of the present invention is therefore highly useful in a variety of applications where the aforementioned properties are required. For example, it is suitable as an agent for preventing the adhesion of water drops. snow. and ice; as an antifouling or antistaining coating; and as a release coating, including mold-release applications.
- The water repellency of our cured coatings was evaluated through the contact angle with water and the water sliding angle. The oil repellency was evaluated through the contact angle with n-hexadecane. The contact angles were measured as follows: using a microsyringe, water or hexadecane was dripped at 20°C onto the cured coating at 10 locations; the corresponding contact angles were measured using a contact angle meter from Kyowa Kaimen Kagaku Kabushiki Kaisha; and these values were then averaged to give the contact angle for the cured coating. The water sliding angle was measured as follows: water was dripped as above onto the cured coating at 5 locations; the corresponding sliding angles of these water drops were measured using a drop sliding angle meter from Erma Inc.; and these values were averaged to give the sliding angle of the cured coating.
- 67.1 g of methylpolysiloxane resin (silanol content = 2 weight%) composed of (CH3)3SiO1/2 and SiO4/2 siloxane units in a 0.9 to 1.0 molar ratio, 200 g of xylene hexafluoride, 19.3 g of nonafluorohexyltrimethoxysilane F(CF2)4C2H4Si(OCH3)3, and 1 g of dibutyltin dilaurate were placed in a flasK equipped with a stirrer, thermometer, and condenser. Reaction at 100°C for 9 hours afforded a homogeneous and transparent solution. Analysis of this transparent solution by gas chromatography demonstrated complete disappearance of the nonafluorohexyltrimethoxysilane peak. The volatiles were thereafter eliminated by heating the transparent solution under reduced pressure. Analysis of the resulting reaction product by infrared absorption spectroscopy and nuclear magnetic resonance spectroscopy confirmed it to be fluorosilicone resin with the following average unit formula.
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)4C2H4SiO3/2}0.1
- 67.1 g of methylpolysiloxane resin (silanol content = 2 weight%) composed of (CH3)3SiO1/2 and SiO4/2 siloxane units in a 0.9 to 1.0 molar ratio, 200 g of xylene hexafluoride, 8.4 g of heptadecafluorodecyltriethoxysilane F (CF2)8C2H4Si (OC2H5)3, and 1 g of dibutyltin dilaurate were placed in a flask equipped with a stirrer, thermometer, and condenser. Reaction at 100°C for 9 hours afforded a homogeneous and transparent solution. Analysis of this transparent solution by gas chromatography demonstrated complete disappearance of the heptadecafluorodecyltriethoxysilane peak. The volatiles were thereafter eliminated by heating the transparent solution under reduced pressure. Analysis of the resulting reaction product by infrared absorption spectroscopy and nuclear magnetic resonance spectroscopy confirmed it to be fluorosilicone resin with the following average unit formula.
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)8C2H4SiO3/2}0.05
- 6 g of 2-propanol, 30 g of xylene hexafluoride, and 8 g of water were introduced into a flask equipped with a stirrer, thermometer, and condenser. A mixture of 20 g of xylene hexafluoride and 57.2 g of nonafluorohexyltrichlorosilane was then added dropwise while stirring. Mixing was continued for an additional 2 hours after addition completion. The reaction solution was subsequently held at quiescence to separate the organic solvent layer, which was then washed repeatedly with water. Gas chromatographic analysis of the water-washed organic solvent layer confirmed the complete disappearance of the nonafluorohexyltrichlorosilane peak. The volatiles were then eliminated by heating the organic solvent layer under reduced pressure. Analysis of the resulting reaction product by infrared absorption spectroscopy and nuclear magnetic resonance spectroscopy confirmed it to be fluorosilicone resin (degree of polymerization = approximately 7) with the following average unit formula.
{F(CF2)4C2H4SiO3/2}
- 10 g of methylpolysiloxane resin (silanol content = 0.9 weight), composed of 80 mole% siloxane unit with the formula (CH3)SiO3/2 and 20 mole% siloxane unit with the formula (CH3)2SiO2/2 was dissolved in 10 g of toluene and 70 g of xylene inexafluoride. A curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 1 g of the fluorosilicone resin whose synthesis is described in Synthesis Example 1, along with 7.3 g of methyltri(methyl ethyl ketoxime)silane, and 1 g of dibutyltin diacetate. The resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature. The contact angles of this cured coating were measured with the following results: 105° versus water and 58° versus n-hexadecane. The sliding angle for water was 21°.
- A curable silicone composition was prepared as in Example 1, but without the fluorosilicone resin of Synthesis Example 1. The resulting silicone composition was also cured as directed in Example 1, and the contact angles of this coating were measured with the following results: 104° versus water and 34° versus n-hexadecane. The sliding angle for water was 36°. These results confirmed that the cured coating of this invention, as prepared in Example 1, exhibited better water and oil repellencies.
- 10 g of methylpolysiloxane resin (silanol content = 0.9 weight%), composed of 80 mole% siloxane unit with the formula (CH3)SiO3/2 and 20 mole% siloxane unit with the formula (CH3)2SiO2/2, was dissolved in 10 g of toluene and 70 g of xylene hexafluoride. A curable silicone composition was prepared by addition to the preceding, with mixing to homogeneity, of 1.5 g of the fluorosilicone resin of Synthesis Example 2, along with 7.3 g of methyltri(methyl ethyl ketoxime)silane, and 1 g of dibutyltin diacetate. The resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature. The contact angles of this cured coating were measured with the following results: 110° versus water and 63° versus n-hexadecane. The sliding angle for water was 22°.
- 10 g of methylpolysiloxane resin (silanol content = 1.5 weight%), composed of 90 mole% siloxane unit with the formula (CH3)SiO3/2 and 10 mole% siloxane unit with the formula (CH3)2siO2/2, was dissolved in 10 g of toluene and 70 g of xylene hexafluoride. A curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 1 g of the fluorosilicone resin of Synthesis Example 2, along with 7.3 g of methyltrimethoxysilane, 1 g of 3-(2-aminoethyl)aminopropyltrimethoxysilane, and 1 g of dibutyltin dilaurate. The resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature. The contact angles of this cured coating were measured with the following results: 107° versus water and 59° versus n-hexadecane. The sliding angle for water was 23°.
- 10 g of methylpolysiloxane resin (silanol content = 1.0 weight%), composed of 85 mole% siloxane unit with the formula (CH3)SiO3/2 and 15 mole% siloxane unit with the formula (CH3)2SiO2/2, was dissolved in 10 g of toluene and 20 g of xylene hexafluoride. A curable silicone composition was prepared by the addition to the preceding, with mixing to homogeneity, of 0.5 g of the fluorosilicone resin of Synthesis Example 3, along with 7.3 g of methyltrimethoxysilane, 1 g of 3-(2-aminoethyl)aminopropyltrimethoxysilane, and 1 g of dibutyltin dilaurate. The resulting silicone composition was coated onto a smooth, flat glass plate using a spin coater, and a cured coating was formed by then holding for 1 week at room temperature. The contact angles of this cured coating were measured with the following results: 109° versus water and 66° versus n-hexadecane.
- Because the curable silicone composition of our invention comprises the components (A) to (D) as described above, and in particular because it contains the organopolysiloxane resin (A) and the fluorosilicone resin (B), our claimed composition unexpectedly cures at room temperature in the presence of moisture to yield a highly water and oil-repellent coating.
Claims (9)
- A moisture-curable silicone composition comprising:(A) 100 weight parts of organopolysiloxane resin with the average unit formula
Ra (OZ)bSiO(4-a-b)/2
wherein R denotes substituted or unsubstituted monovalent hydrocarbon groups, Z is hydrogen atom or a C1 to C6 alkyl group, a ranges from 0.80 to 1.80, and b is a value that affords a content of silicon-bonded hydroxyl or alkoxy group in this composition of from 0.01 to 10 weight%;(B) 0.5 to 500 weight parts of a fluorosilicone resin selected from the group of fluorosilicone resins having the average unit formulae
{F(CF2)c-R1-SiO3/2}m(RdSiO(4-d)/2)n
{F(CF2)c-R1-SiO3/2}m(SiO4/2)n
{F(CF2)c-R1-SiO3/2}m
and
{F(CF2)c-R1-SiO3/2}f(R3SiO1/2)g(SiO4/2)h
wherein R denotes substituted and unsubstituted monovalent hydrocarbon groups, R1 is an alkylene or alkyleneoxyalkylene group, c is an integer with a value of at least 4, d is an integer with a value from 1 to 3, m, n, f, g, and h are each numbers greater than 0 and
(g + h) ≥ f.(C) 1 to 90 weight parts of an organosilane selected from the group consisting of organosilanes having the general formulae
ReSiY4-e
and
SiY4
wherein R denotes substituted and unsubstituted monovalent hydrocarbon groups, Y is a hydrolyzable group, and e is an integer with a value of 1 or 2, or the partial hydrolysis condensate thereof;
and(D) a cure-accelerating catalyst in sufficient quantity to cure the composition. - The composition of Claim 1 wherein R is selected from the group consisting of methyl, ethyl, propyl, tert-butyl, 2-ethylhexyl, dodecyl, octadecyl, vinyl, allyl, phenyl, naphthyl, chloromethyl, 3,3,3-trifluoropropyl, 3,3,4,4,5,5,5-heptafluoropentyl and difluoromonochloropropyl.
- The composition of Claim 1 or Claim 2 wherein R1 is an alkylene or alkyleneoxyalkylene group selected from the group consisting of ethylene, methylethylene, ethylethylene, propylethylene, butylethylene, propylene, butylene, 1-methylpropylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, ethyleneoxyethylene, ethyleneoxypropylene, ethyleneoxybutylene, propyleneoxyethylene, propyleneoxypropylene, propyleneoxybutylene, butyleneoxyethylene, and butyleneoxypropylene.
- The composition of any of Claims 1 to 3 wherein Y is a hydrolyzable group selected from the group consisting of dimethyl ketoxime, methyl ethyl ketoxime, methoxy, ethoxy, acetoxy, N-butylamino, methylacetamide, N,N-diethylhydroxyamino and propenoxy.
- The composition of any of Claims 1 to 4 wherein said cure accelerating catalyst (D) is selected from the group consisting of dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dioctoate, stannous octoate, stannous naphthenate, stannous oleate, stannous isobutyrate, stannous linoleate, stannous stearate, stannous benzoate, stannous naphthoate, stannous laurate, stannous o-thymotate, stannous beta-benzoylpropionate, stannous crotonate, stannous tropate, stannous p-bromobenzoate, stannous palmitoleate, stannous cinnamate, stannous phenylacetate, iron salts, manganese salts, and cobalt salts of the preceding carboxylic acids, tetraalkyl titanates, complex salts of dialkyl titanates and organosiloxytitanates.
- The composition of any of Claims 1 to 5 wherein said fluorosilicone resin (B) is selected from the group consisting of
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)4C2H4SiO3/2}0.1
{(CH3)3SiO1/2}0.9(SiO4/2)1.0{F(CF2)8C2H4SiO3/2}0.05
{(CH3)2SiO2/2}1.8{F(CF2)4C2H4SiO3/2}12.2
{(CH3)SiO3/2}0.7{F(CF2)4C2H4SiO3/2}5.5
(SiO4/2)0.35{F(CF2)4C2H4SiO3/2}4.34
(F(CF2)4C2H4SiO3/2)
{(CH3)SiO3/2}0.5{F(CF2)4C2H4OC2H4SiO3/2}2.0.
- The composition of any of Claims 1 to 6 further comprising (E) a silane coupling agent.
- A cured silicone composition obtainable by reacting a composition according to any of Claims 1 to 8 in the presence of atmospheric moisture.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP21415695 | 1995-07-31 | ||
JP214156/95 | 1995-07-31 | ||
JP21415695A JP3540452B2 (en) | 1995-07-31 | 1995-07-31 | Curable silicone composition |
Publications (3)
Publication Number | Publication Date |
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EP0757081A2 true EP0757081A2 (en) | 1997-02-05 |
EP0757081A3 EP0757081A3 (en) | 1997-10-01 |
EP0757081B1 EP0757081B1 (en) | 2002-06-05 |
Family
ID=16651161
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EP96305474A Expired - Lifetime EP0757081B1 (en) | 1995-07-31 | 1996-07-25 | Curable oil- and water-repellent silicone composition |
Country Status (4)
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US (1) | US5880227A (en) |
EP (1) | EP0757081B1 (en) |
JP (1) | JP3540452B2 (en) |
DE (1) | DE69621529T2 (en) |
Families Citing this family (12)
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US6051665A (en) * | 1998-05-20 | 2000-04-18 | Jsr Corporation | Coating composition |
WO2001018134A1 (en) * | 1999-08-20 | 2001-03-15 | Csl Silicones Inc. | One-part organopolysiloxane rubber composition for use as a corrosion protection coating |
JP4332360B2 (en) * | 2003-02-28 | 2009-09-16 | 大日本印刷株式会社 | Wetting pattern forming coating liquid and pattern forming body manufacturing method |
WO2005012431A1 (en) * | 2003-07-25 | 2005-02-10 | Henkel Corporation | Low voc-solvent based mold release agent and curable mold release compositions based thereon |
US20060079600A1 (en) * | 2004-10-13 | 2006-04-13 | Gopalratnam Usha S | Anti-stick coating for surfaces |
JP4672354B2 (en) * | 2004-12-09 | 2011-04-20 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Room temperature curable polyorganosiloxane composition |
US7253238B2 (en) * | 2005-04-12 | 2007-08-07 | Momentine Performance Materials Inc. | Fluoroalkylsilylated MQ resin and solvent-resistant pressure sensitive adhesive composition containing same |
US20070281167A1 (en) * | 2006-06-06 | 2007-12-06 | Jeffrey Allen Odle | Method for improving cleanability of surfaces |
US20080057251A1 (en) * | 2006-09-01 | 2008-03-06 | General Electric Company | Laminates utilizing pressure sensitive adhesive composition and conventional silicon liners |
KR101523819B1 (en) * | 2012-09-04 | 2015-05-28 | (주)엘지하우시스 | Anti-reflection coating composition containing siloxane compound, anti-reflection film using the same |
KR101526649B1 (en) * | 2012-11-21 | 2015-06-05 | (주)엘지하우시스 | Antireflection film with excellent optical characteristics having a hard coating layer |
CN114806405B (en) * | 2022-04-26 | 2022-11-11 | 宁波辉宏新材料有限公司 | Composite fluorosilicone resin emulsion release agent and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06329913A (en) * | 1993-05-26 | 1994-11-29 | Shin Etsu Chem Co Ltd | Room-temperature-curable organopolysiloxane composition |
EP0641843A1 (en) * | 1993-08-26 | 1995-03-08 | Dow Corning Toray Silicone Company, Limited | Surface-treatment composition |
US5405929A (en) * | 1993-06-30 | 1995-04-11 | Dow Corning Toray Silicone Co., Ltd. | Curable silicone composition |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS51148749A (en) * | 1975-06-16 | 1976-12-21 | Toray Silicone Co Ltd | Silicone resin composition |
GB2067212A (en) * | 1980-01-07 | 1981-07-22 | Toray Silicone Co | Room Temperature Curing Silicone Resin Compositions |
JPH0559285A (en) * | 1991-08-29 | 1993-03-09 | Toray Dow Corning Silicone Co Ltd | Curable silicone resin composition |
JP2905336B2 (en) * | 1992-06-18 | 1999-06-14 | 東レ・ダウコーニング・シリコーン株式会社 | Curable coating agent composition |
-
1995
- 1995-07-31 JP JP21415695A patent/JP3540452B2/en not_active Expired - Fee Related
-
1996
- 1996-07-25 DE DE69621529T patent/DE69621529T2/en not_active Expired - Lifetime
- 1996-07-25 EP EP96305474A patent/EP0757081B1/en not_active Expired - Lifetime
- 1996-07-25 US US08/684,895 patent/US5880227A/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06329913A (en) * | 1993-05-26 | 1994-11-29 | Shin Etsu Chem Co Ltd | Room-temperature-curable organopolysiloxane composition |
US5405929A (en) * | 1993-06-30 | 1995-04-11 | Dow Corning Toray Silicone Co., Ltd. | Curable silicone composition |
EP0641843A1 (en) * | 1993-08-26 | 1995-03-08 | Dow Corning Toray Silicone Company, Limited | Surface-treatment composition |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 95, no. 2, 31 March 1995 & JP 06 329913 A (SHIN-ETSU), 29 November 1994, & DATABASE WPI Week 9507 Derwent Publications Ltd., London, GB; AN 95-049018 * |
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DE69621529T2 (en) | 2003-01-16 |
JPH0940869A (en) | 1997-02-10 |
EP0757081A3 (en) | 1997-10-01 |
EP0757081B1 (en) | 2002-06-05 |
US5880227A (en) | 1999-03-09 |
JP3540452B2 (en) | 2004-07-07 |
DE69621529D1 (en) | 2002-07-11 |
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