EP0699220A1 - Adhesif en poly(ethylene-vinyle alcool) retravaillable pour applications electroniques - Google Patents

Adhesif en poly(ethylene-vinyle alcool) retravaillable pour applications electroniques

Info

Publication number
EP0699220A1
EP0699220A1 EP94910779A EP94910779A EP0699220A1 EP 0699220 A1 EP0699220 A1 EP 0699220A1 EP 94910779 A EP94910779 A EP 94910779A EP 94910779 A EP94910779 A EP 94910779A EP 0699220 A1 EP0699220 A1 EP 0699220A1
Authority
EP
European Patent Office
Prior art keywords
adhesive
reworkable
conductive
temperature
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94910779A
Other languages
German (de)
English (en)
Inventor
Jean-Marc P. Pujol
Peter B. Hogerton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of EP0699220A1 publication Critical patent/EP0699220A1/fr
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/28—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/06—Polymers
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the present invention relates to adhesive compositions, and particularly to poly(ethylene-vinyl alcohol) adhesive compositions having properties especially suited for use in electronic applications.
  • the adhesive compositions are reworkable or repairable in use with an integrated circuit, rigid circuit, or flexible circuit. More specifically, the adhesive compositions are suitable for flip chip direct attachment films for mounting semiconductors on conductive substrates.
  • Electronic devices such as pocket calculators, watches, and laptop computers utilize a wide variety of semiconductor based integrated circuit elements.
  • semiconductors are fabricated on wafers and then cut into individual chips. These chips are typically installed into single-chip packages that are attached to circuit boards via some type of soldering operation. In some instances however, unpackaged chips have been attached directly onto circuit boards in order to achieve reduced product size and increased product performance.
  • the benefits of this "flip-chip" packaging method are expected to increase as I/O counts, clock-rate frequencies, and power densities continue to increase.
  • the most common attachment means used for flip-chip bonding is solder bump interconnection. With this approach, metallurgical solder joints provide both the mechanical and electrical interconnections between the chip and substrate.
  • liquid adhesives One concern relative to liquid adhesives is that they must be applied in excess to assure that the entire die bonding surface is wet during the die placement, and consequently the excess can flow into undesirable areas.
  • curable materials such as these can be expected to be difficult, if not impossible to rework.
  • adhesives can be provided in the form of self- supporting films.
  • a film is capable of being cut to the precise size of the die, which provides the exact amount of adhesive in the precise area necessary for die bonding.
  • U.S. Patent 4,820,446 Patent 4,820,446 (Prud'homme) , a thermoplastic adhesive is disclosed for use in electronic applications which is repairable.
  • a deficiency of this and other related adhesives is that they tend to display high deformation at elevated stress and temperature which leads to poor contact stability. Accordingly, such adhesives are useful only in applications involving limited stress. Thus, such adhesives are almost exclusively used for the bonding of lightweight, flexible circuits to other components in which thermal stresses are minimal.
  • thermosetting adhesive films While certain highly crosslinkable, thermosetting adhesive films perform adequately in high stress applications, these adhesives are deficient in that they are not reworkable.
  • U.S. Patent No. 5,061,549 describes heat activated adhesive films suitable for electronic applications.
  • the adhesive's main constituent is a thermoplastic polymer having a Vicat softening temperature of from 70 to 280°C.
  • Shores exemplifies a number of thermoplastic polymers (column 3, lines 14-48), but fails to recognize the beneficial effects of semi- crystalline polymers.
  • amorphous thermoplastic polymers do provide short bonding times and repairability/reworkability for bonded circuit components, they do not have the strength above glass transition temperature (T g ) to provide a high level of dimensional stability or the steep viscosity/temperature gradient in the vicinity of the melt temperature (T m ) that produces excellent wetting during bonding.
  • Crosslinkable hot-melt adhesives based on poly(ethylene-vinyl alcohol) in combination with an isocyanate and a tackifier are disclosed in European Patent Application No. 302,620 A2 (Exxon Chemical, Inc.). Like thermoset adhesive systems, these adhesives are not reworkable once they are crosslinked. Furthermore, the curing time for these adhesives is longer than 15 minutes, which is not desirable for efficient mass production of consumer electronics products.
  • poly(ethylene-vinyl alcohol) as an adhesive coating for steel is briefly described in H. Kempe and M. Kempe, Plaste Kautsch. 2 ⁇ , 210-211 (1987).
  • thermoplastic/thermoset blends are of possible interest for electrical interconnections. Such mixtures have been designed to improve high temperature performance of the thermoset materials, and/or to improve the fracture toughness of the thermoset material. See, U.S. Patent No. 3,530,087 (Hayes et al.); and R.S. Bauer, Toughened High Performance Epoxy Resins: Modifications with Thermoplastics, 34th International SAMPE Symposium, May 8-11, 1989.
  • the present invention provides a reworkable thermoplastic adhesive composition comprising one or more semi-crystalline polymers suitable for bonding electronic components.
  • the adhesive composition preferably provides a nontacky or slightly tacky adhesive film, includes poly(ethylene-vinyl alcohol) copolymers having a glass transition temperature, T g , of from 30° to 70°C, preferably from 40° to 60°C; a crystallization temperature, T c , of from 115° to 155°C, preferably from 125° to 145°C.
  • the T m will typically be 130° to 170°C, preferably 140° to 160°C.
  • the adhesive composition of the present invention preferably includes a silane coupling agent, and may also contain electrically conductive particles and other additives, especially additives selected to control the room temperature "tack" of the adhesive film.
  • the adhesive composition of the present invention has a modulus of greater than 50 MPa, preferably greater than 100 MPa, at a temperature of 20°C below the T c of the cured adhesive composition.
  • the present invention also provides a method for forming a reworkable adhesive bond between two conductive surfaces to form a conductive bonded composite.
  • the method comprises the steps of: providing a reworkable adhesive film of the present invention; providing a conductive substrate having one or more conductive bonding sites; providing one or more conductive devices, each having a conductive bonding surface; positioning the reworkable adhesive between each of the conductive bonding sites and each of the conductive devices; and applying sufficient heat and/or pressure, for a sufficient time, to form a reworkable adhesive bond between each conductive bonding site and each conductive device.
  • the reworkable adhesive has a modulus of greater than 50 MPa at a temperature of 20°C below the T c of the adhesive film.
  • the conductive substrates are typically printed circuit boards having conductive bonding sites adapted to be bonded to integrated circuits, flexible circuits, rigid circuits, or the like.
  • the bonding time required for adhesives of the present invention are typically fewer than 30 seconds, and preferably fewer than 20 seconds, at 200°C or less, preferably 185°C or less.
  • Semi-crystalline polymers are defined as, polymers that show crystalline behavior. Semi-crystalline polymer exhibit both a crystalline melting and glass transition temperature. See, e.g. Odian, Principles of Polymerization (Second Edition) , John Wiley & Sons, New York, (1981), page 25 and 30.
  • Melt temperature is the temperature at which the solid-to-liquid phase transition occurs in semi-crystalline polymers.
  • Crystalstalline temperature or “re-crystallization temperature,” as used herein, is the temperature at which the liquid-to-solid phase transition occurs in semi- crystalline polymers, since in semi-crystalline polymers there is a hysteresis in the solid-liquid phase transition depending on the temperatures through which it is approached, i.e., heating the solid-to-liquid transition, or cooling the liquid-to-solid transition.
  • Reworkable adhesives of the present invention are typically entirely removable from the substrate at a temperature of less than 200°C, preferably less than 170°C.
  • the reworkable adhesive of the invention will typically be entirely removable at T m , because the use of excessively high temperatures may degrade the substrate or conductive devices thereon.
  • the use of a suitable solvent may also be necessary to remove remaining residue.
  • the reworkable adhesive film be removable from a substrate selected from the group consisting of: conductive materials such as copper, gold, silver, aluminum, nickel, and solder; dielectrics such as ceramic, glass, silicon and epoxy/glass laminates; and polymer films such as polyimide and PET.
  • Fig. 1 is a schematic plan view of integrated circuits, printed circuit boards, and the like on which the adhesive composition of the present invention can be used;
  • Fig. 2 depicts a plot of temperature (T c , T m , T g ) as a function of ethylene content; and
  • Fig. 3 depicts elastic modulus as a function of temperature for an adhesive of the invention.
  • a reworkable adhesive composition of the present invention may be produced using one or more semi- crystalline thermoplastic poly(ethylene-vinyl alcohol) polymer having a T g of 30°C to 70°C, a T c of from 115°C to 155°C, and a T m of 130°C to 170°C.
  • the adhesive film has a sufficiently high shear strength throughout the desired range of use temperatures, but demonstrates a sufficiently rapid drop in shear strength above its T c so that at the melt temperature T m , the adhesive is reworkable.
  • Shear strength refers to the force needed to shear a chip off a glass substrate.
  • T g of the polymer exceeds the maximum temperature encountered in the use environment (T ⁇ in order to assure sufficient creep resistance to maintain electrical contact between chip and substrate. It is for this reason that many electronic die attach adhesives are "cured" (chemically crosslinked) to raise T g above T ⁇ .
  • T c recrystallization temperature
  • T m melt temperature
  • the adhesives of the present invention are film-type materials, typically coated on release liners. Due to the thermoplastic nature of the polymer in the formulations, the compositions are fast bonding adhesives and they are repairable. Despite the relatively low T g , high dimensional stability is maintained at high temperature due to the semi-crystallinity of poly(ethylene-vinyl alcohol) .
  • the polymers have a crystallization temperature (115°C to 155°C) which insures high cohesion of the bond after recrystallization.
  • the semi-crystallinity also provides a steep viscosity/temperature gradient near T m which leads to an excellent wetting during the bonding operations (see Fig. 3) .
  • the reworkable adhesive film of the present invention is also preferably storage stable for at least one month at room temperature, has a sufficiently low viscosity at the bonding temperature to provide good flow properties, is rapidly bondable at a modest temperature e.g. 145°C to 225°C, more preferrably 150°C to 215°C and most preferrably 160°C to 200°C, and is not substantially affected by conditions of up to 85°C at 85% relative humidity.
  • the reworkable adhesive of the present invention is particularly useful in electronic applications.
  • Many types of electronic components include one or more silicon chips. These chips are normally rectangular or square in shape and are of small dimension, e.g., a few millimeters (mm) on a side.
  • Each chip has at least one, and often many, conductive terminals that must be electrically connected to conductive pathways on a substrate in order to complete the desired circuit.
  • the pathways may comprise thin films or strips of metal, e.g., silver, gold, copper, etc., bonded to the substrate, or may consist of strips of an adhesive or ink which is electrically conductive or rendered electrically conductive by the presence of conductive particles therein.
  • the reworkable adhesive of the present invention is particularly useful as an attachment means in the FDCA bonding method.
  • the FDCA bonding method bonds a bare chip directly to a conductive substrate. Certain chips have bumps (bumped chips) adapted to bridge the adhesive layer and connect directly to the substrate. An unbumped chip is typically bonded using an adhesive having an array of conductive particles that will form a conductive pathway between the substrate and the chip.
  • FDCA bonding is discussed in Investigations Into The Use Of Adhesives For Level-1 Microelectronic Interconnections. P.B. Hogerton et al., Electronic Packaging Materials Science, Symposia Proceedings, April 24-29, 1989.
  • Typical commercial bonding temperatures are in the range of 145°C to 225°C, and more typically 160°C to
  • Bonding times can range from several minutes to a few hours in the use of prior art adhesives, however, for a commercially feasible, mass production assembly of an electronic component, adhesives of the present invention have preferred bonding times of 30 seconds or fewer, preferably fewer than 20 seconds.
  • the reworkable adhesive composition of the present invention is preferably provided as a film that is nontacky or slightly tacky at the intended handling temperature.
  • the advantages of such an adhesive film over a liquid or paste adhesive include ease of handling, accurate alignment of the chip, and the ability to place the exact amount of adhesive onto the chip to be bonded with minimal waste.
  • the processing temperature is the temperature at which the adhesive will be used to bond the chip to a substrate. This temperature must be sufficiently low so that the chips or substrates are not damaged during processing, and must be sufficiently high so that the adhesive will adequately bond the chip to the substrate.
  • Fig. 1 is a schematic plan view of integrated circuits, printed circuit boards, and the like, on which the adhesive composition of the present invention is particularly suitable for use.
  • a printed circuit board 10 is shown having flexible circuit terminals 20, printed circuit board terminals 30, and printed circuit board terminals 40.
  • An adhesive of the present invention may be utilized, for example, to bond flexible circuit 50 to the flexible circuit terminals 20; a printed circuit board 60 to the printed circuit board terminals 30; and a TAB, i.e., tape automated bonding, lead frame 70 to the printed circuit board terminals 40.
  • a TAB lead frame 72 is shown bonded to the printed circuit board 10.
  • the printed circuit board 60 has flip chips 61-66. Flip chip 66 is shown prior to bonding to the printed circuit board 60.
  • An adhesive of the present invention could be used to bond flip chips 61-66 to printed circuit board 60.
  • a liquid crystal display 80 is shown in Fig. 1 a liquid crystal display 80.
  • the liquid crystal display 80 has the flexible circuit 50 bonded thereto.
  • a flip chip 90 and a TAB lead frame 100 are also shown bonded to the liquid crystal display 80.
  • Fig. 2 shows a plot A of melting point (T m ) , a plot B of crystallization temperature (T c ) , and a plot C of glass transition point (T g ) as a function of ethylene content for an adhesive of the invention.
  • This plot is only a generalized example of a typical adhesive of the invention and is not meant to limit the types of co ⁇ polymers or adhesives that can be used.
  • the adhesive shown in Fig. 2 at 56% ethylene had a T g of 55°C, a T c of 142°C, and a 10-30 second bonding time at 180-230°C.
  • the molecular weight of the co-polymers used correlates to the melt viscosity such as that exemplified in Fig. 2.
  • Fig. 3 shows a plot of elastic modulus (E') as a function of temperature (°C) for an adhesive of the invention.
  • the upper modulus figure M corresponds to 100 MPa
  • the lower modulus line N corresponds to 50 MPa.
  • Adhesives of the present invention will have a modulus of greater than 50 MPa at a temperature of 20°C below the T c .
  • the temperature line B corresponds to 20°C below the T c of the adhesive depicted in Fig. 3.
  • the line A represents the T c of the adhesive depicted in Fig. 3.
  • the plot of modulus versus temperature 200 in Fig. 3 shows that the adhesive has a modulus of greater than 100 MPa at a temperature of 20°C below T c .
  • the adhesive composition of the present invention may also include a coupling agent to aid in adhesion of the adhesive to a given substrate.
  • a silane coupling agent is preferred, and is preferably provided in an amount of 0.1 to 5 percent by weight of the composition, more preferably 1 percent by weight.
  • Preferred silane coupling agents have the formula:
  • P represents an organic substituent of up to 12 carbon atoms, e.g., propyl, which should possess functional substituents such as mercapto, epoxy, glycidoxy, acrylyl, methacrylyl and amino;
  • Z represents a hydrolyzable group, e.g., alkoxy, preferably methoxy or ethoxy, and n is l, 2, or 3, preferably 3.
  • titanate and zirconate coupling agents may be utilized. See, e.g., the chapter on coupling agents by J. Cromyn in Structural
  • Page 270 provides examples of epoxy and amine silane coupling agents. Pages 306-308 discuss the use of titanate and zirconate coupling agents.
  • Conductive particles including, for example, those described in U.S. Patent No. 4,606,962 (Reylek et al.) and 4,740,657 (Tsukagoski et al.), may be added to the adhesive composition as desired.
  • Reylek describes electrically and thermally conductive particles that at the bonding temperature of the adhesive are at least as deformable as are substantially pure silver spherical particles. The thickness of the particles exceeds the thickness of the adhesive between the particles.
  • the particles described in Reylek are preferably substantially spherical and made of a metal such as silver or gold or of more than one material, such as "a solder surface layer and either a higher melting metal core such as copper or a nonmetallic core" (column 4, lines 20-21) .
  • These and other conductive particles e.g., non-spherical and/or having a thickness of less than the thickness of the adhesive
  • Conductive particles contained in adhesive compositions of the invention may be randomly dispersed therein or may be arranged in a uniform array of desired configuration. To economize the use of electrically conductive particles, they may be located only in segments of the adhesive film which are to contact individual electrical conductors.
  • fillers can be added to the adhesive composition.
  • the use of a filler can provide benefits of increased adhesion, higher modulus, and decreased coefficient of thermal expansion.
  • Useful fillers include, but are not limited to, the following: silica particles, silicate particles, quartz particles, ceramic particles, glass bubbles, inert fibers, and mica particles.
  • the filler is microcrystalline silica particles.
  • the adhesive composition have a low ionic impurity level.
  • the electronics industry specifies low extractable ion content of the adhesives. Specifications include Cl " , Na + , K + , and NH 4 + of less than 10 ppm. Such extremely low ionic contents are important to prevent corrosion of the metals and to keep the conductivity of the adhesive as low as possible except through any conductive metal particles present. In the following examples, which are intended to be merely illustrative and nonlimiting, all percentages are by weight.
  • Adhesive compositions of the present invention were made as follows using components in the amounts shown in Table 1.
  • the polymer was initially dissolved in methanol and water at 60°C.
  • the silica and conductive particles were added when the solution was still warm.
  • the adhesive composition was cast onto a TeflonTM film using a knife coater.
  • the thickness of the adhesive was set between 20 and 40 ⁇ m by adjusting the distance between the knife and the backing.
  • the adhesive film was dried at 50°C for one hour and stored in a desiccator.
  • Example 7 The adhesion was evaluated for each of Examples 1, 2, 4, 5, 6 by measuring the die shear strength. The purpose of the test was to determine the applied force needed to shear the chip from the substrate. The bond strength was measured by using a shear tester on glass chips of 2 mm x 2 mm x 1 mm bonded to glass slides of 25 mm x 25 mm x 1 mm.
  • the following method was used to bond the chip on the slide.
  • the adhesive was transferred to the glass chip by applying the chip onto the film and using heat activation and pressure to make the adhesive tacky.
  • the chip was removed from the release backing it was covered with a uniform layer of adhesive. Then it was applied to the slide.
  • the bonding was accomplished with a die bonder for several seconds at 180°C under 2.5 MPa of pressure.
  • Example 8 The adhesive compositions of Examples 1-6 were used to bond silicon chips to circuits on glass substrates using a flip chip direct attachment method.
  • the test chips (0.5 mm x 7 mm x 7 mm) were bearing 120 gold bumped pads (pad pitch: 0.2 mm) to make the electrical connections.
  • the circuits were indium tin oxide configured to permit a four probe resistance measurement.
  • the indium tin oxide was 0.1 ⁇ thick and had a sheet resistance of 20 ⁇ per square.
  • the adhesive film was transferred to the active face of the chip by heating the film to 150-180°C on a hot plate surface and applying light pressure to laminate the film on the chip.
  • the laminated structure was removed from the hot plate after a few seconds.
  • the final flip chip on glass attachment was done after alignment of the chip with the conductive electrodes on the substrate.
  • the bonding was done at 200°C by applying pressure (around 10 MPa) for 30 seconds.
  • Interconnection resistances were measured using a four probe method. Ayerage resistance, minimum and maximum resistances were determined. The data shown in Table 3 are the measured resistances. They represent twice the true interconnection resistance since two contacts are involved during the measurement; they include also the resistance of the indium tin oxide circuit on the glass substrate and the resistance of the aluminum strap connecting the gold bumps on the silicon chip. From these observations, it is considered that a value lower than 2 ⁇ indicates a good interconnection. Table 3
  • Example 3 Environmental testing of the test samples (Examples 3 and 4) from Example 8, were conducted under thermal aging and humidity aging.
  • Example 3 During 1000 hours of thermal aging at 100°C, the adhesive composition of Example 3 maintained the electrical connections without open circuits.
  • Example 4 During 1000 hours of humidity aging at 60°C, 95% relative humidity (RH) , the adhesive composition of Example 4 maintained the electrical connections without open circuits.
  • Example 10 The adhesive composition of Example 1 was used to bond flexible circuits to printed circuit boards.
  • the flexible circuits were made of polyimide tape 10 mm wide x 50 ⁇ m thick, metallized with copper and protected with a layer of lead-tin solder 12 ⁇ thick.
  • the tape had 17 conductor lines spaced at a 0.4 mm pitch.
  • the printed circuit boards were FR-4 epoxy glass laminates metallized with copper and lead-tin solder 12 ⁇ m thick with a similar pitch.
  • a piece of adhesive film 3 mm x 8 mm was transferred on the flexible circuit using heat activation and slight pressure.
  • the final bonding to the board was done by placing the tape on the board, aligning the stripes, applying pressure of 2 MPa on the tape and simultaneously heating the adhesive to 2J0°C for 30 seconds using a hot bar type bonder.
  • Interconnection resistances were measured using a four probe method. Average resistance, minimum resistance, and maximum resistance were determined. The data shown in Tables 4 and 5 are the measured resistances. They represent twice the true interconnection resistance since two bonds are made on each test sample; they include also the resistance of the circuit board and the resistance of the flexible circuit. From these observations, it is considered that a value lower than 0.5 ⁇ indicates a good interconnection.
  • Example 11 The following method was used to test the repairability of the adhesive.
  • a test sample was prepared as described in Example 10.
  • the epoxy glass laminate substrate from the test sample was heated to 150°C at which temperature the flexible circuit was easily peeled off.
  • the residues of the adhesive on the board were wiped away.
  • a new flexible circuit was bonded to the board at 200°C for 30 seconds with a new piece of adhesive using the bonding procedure described in Example 10. Connections obtained before and after rework are reported in Table 5.
  • the poly(ethylene-vinyl alcohol) compositions are repairable adhesives.
  • Example 10 Environmental testing of the test samples from Example 10 was conducted under humidity aging, thermal aging, and thermal cycling. Interconnection resistances were measure after 1000 hours of testing.
  • the results shown in Table 6 indicate that no significant degradation of contact resistances occurred.
  • the poly(ethylene-vinyl alcohol) compositions show high stability under environmental testing.
  • the following comparative examples show that film adhesives using only amorphous, thermoplastic polymers as the high molecular weight resin component are not capable of maintaining suitably low contact resistances under the temperature-humidity extremes found in a typical use environment.
  • a 30 micrometer thick, film-adhesive was prepared from a thermoplastic poly(vinyl butyral) resin designated B76.
  • B76 has a weight average molecular weight of about 50,000, a T j of 50°C, and is available from Monsanto Chemical Corp. Saint Louis, MO.
  • the film adhesive was cast from a 70% solids solution prepared by first dissolving B76 polymer in xylene followed by a sequential addition of isopropanol and water to produce a solution in which the solvent phase was 95% by weight (60:40 xylene:isopropanol) and 5% by weight water.
  • the film adhesive was prepared by knife coating the polymer solution on a TeflonTM film substrate. The thickness of the adhesive was adjusted to between 20 and 40 micrometers by adjusting the distance between the knife and the backing.
  • the adhesive was dried at 80°C for one hour and stored in a desiccator prior to bonding and testing.
  • a 28 micrometer thick, film-adhesive was prepared from a thermoplastic poly(vinyl butyral) resin designated B98.
  • B98 has a weight average molecular weight of 37,000, a T g of 65°C, and is available from Monsanto Chemical Corp., Saint Louis, MO.
  • the film adhesive was cast from a 85% solids solution prepared by first dissolving B98 polymer in xylene followed by the sequential addition of isopropanol and water to produce a solution in which the solvent phase was 95% by weight (60:40 xylene:isopropanol) and 5% by weight water.
  • the adhesive film was prepared by knife coating the polymer solution on a TeflonTM film substrate. The thickness of the adhesive was adjusted to between 20 and 40 micrometers by adjusting the distance between the knife and the backing.
  • the adhesive was dried at 80°C for one hour and stored in a desiccator prior to bonding and testing.

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  • Organic Chemistry (AREA)
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une composition adhésive thermoplastique semicristalline et retravaillable qui permet de coller des composants électroniques. La composition adhésive, qui se présente de préférence sous la forme d'un film adhésif, comporte un ou plusieurs copolymères de poly(éthylène-vinyle alcool).
EP94910779A 1993-04-05 1994-02-22 Adhesif en poly(ethylene-vinyle alcool) retravaillable pour applications electroniques Withdrawn EP0699220A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13342 1979-02-21
US1334293A 1993-04-05 1993-04-05
PCT/US1994/002143 WO1994022972A1 (fr) 1993-04-05 1994-02-22 Adhesif en poly(ethylene-vinyle alcool) retravaillable pour applications electroniques

Publications (1)

Publication Number Publication Date
EP0699220A1 true EP0699220A1 (fr) 1996-03-06

Family

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Family Applications (1)

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EP94910779A Withdrawn EP0699220A1 (fr) 1993-04-05 1994-02-22 Adhesif en poly(ethylene-vinyle alcool) retravaillable pour applications electroniques

Country Status (6)

Country Link
EP (1) EP0699220A1 (fr)
JP (1) JPH08508526A (fr)
KR (1) KR960701965A (fr)
CN (1) CN1120850A (fr)
CA (1) CA2160003A1 (fr)
WO (1) WO1994022972A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620651B2 (en) * 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US7776940B2 (en) 2005-12-20 2010-08-17 3M Innovative Properties Company Methods for reducing bond strengths, dental compositions, and the use thereof
US8026296B2 (en) 2005-12-20 2011-09-27 3M Innovative Properties Company Dental compositions including a thermally labile component, and the use thereof
US7896650B2 (en) 2005-12-20 2011-03-01 3M Innovative Properties Company Dental compositions including radiation-to-heat converters, and the use thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9422972A1 *

Also Published As

Publication number Publication date
WO1994022972A1 (fr) 1994-10-13
JPH08508526A (ja) 1996-09-10
CA2160003A1 (fr) 1994-10-13
CN1120850A (zh) 1996-04-17
KR960701965A (ko) 1996-03-28

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