EP0612434A1 - Filling-in paste for electronic components - Google Patents
Filling-in paste for electronic componentsInfo
- Publication number
- EP0612434A1 EP0612434A1 EP93912548A EP93912548A EP0612434A1 EP 0612434 A1 EP0612434 A1 EP 0612434A1 EP 93912548 A EP93912548 A EP 93912548A EP 93912548 A EP93912548 A EP 93912548A EP 0612434 A1 EP0612434 A1 EP 0612434A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- filling
- paste
- electronic components
- polyizocyanate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
Definitions
- the invention refers to the filling-in paste for electronic components, which ensures tight and elastic filling-up of component, with perfect insulation from unfavourable influences of external environment, and at the same time it ensures the good thermal conductivity and the practical self-suppression.
- Epoxide-resine, asphalts, polyurethane-resins and similar compounds are used as filling-in pastes for electronic components. These compounds are applied with various fillers, accelerators and dryers, which influence their electrical, mechanical and chemical features and also the self -suppression. The problem is complicated with filling-in paste preparation, high price and with harmonizing of all required properties. These compounds have mostly antagonistic properties - for example the good insulation properties, but the considerable internal stress during the hardening process for example at epoxide-resins, combined often with an exotherm reaction.
- the disadvantages of till used filling-in pastes are solved by the filling-in paste of this invention.
- Substance of the invention of the filling-in paste for electronic components is, that it concerns product of reaction anhydrous ricine-oil and polyizocyanate-resin; for this resin is advantageously used aromatic polyizocyanate with the main component triphenilmethan - 4,4,'4" - triizocyanate in ratio 100 weight parts of ricine-oil and 25 weight parts of polyizocyanate-resin.
- the filling-in paste is hardened at temperature range 0 - 75°C for the duration 20 minutes till 6 hours as required.
- the advantage of the filling-in paste opposite the well-known mixtures is, that it contains no harmful organic solvents as toluene, it shortens the hardening time at lower temperatures without demands on the following hardening: and it shows very good result properties, as dielectric and electroinsulating properties, heat conductivity and resistance, mechanical elasticity, gas and steam airtightness, and also very good adhesion to common used materials.
- the optimal result properties for the given use may be reached with the filling-in paste from the invention, by the various relative mixing ratio of ricine-oil and polyizocyanate-resin (with triizocyanate as its main component). At the same time it is not necessary to use fillers, dryers, accelerators and it is possible to change the consistence from nearly liquid to solid.
- the roll of capacitor made from polypropylene-folie with aluminium metalization is filled-up in the case with filling-in paste which is prepared by mixing of vacuum dryed ricine-oil and low-polmered polyizocyanate-resin (the main component of polyizocyanate-resin is triphenilmethan - 4,4',4" - triizocyanate), in ratio 100 weight parts of ricine-oil and 25 weight parts of polyizocyanate-resin. This mixture is solidified on the temperature + 75°C for 2 hours. The completation of the capacitor is made in normal way.
- filling-in paste which is prepared by mixing of vacuum dryed ricine-oil and low-polmered polyizocyanate-resin (the main component of polyizocyanate-resin is triphenilmethan - 4,4',4" - triizocyanate), in ratio 100 weight parts of ricine-oil and 25 weight parts of polyizocyanate-resin. This mixture is solidified on the temperature + 75
- the capacitcr without the filling-in paste and the capacitor filled-up with epoxide-resin are used for comparison.
- the test result shows considerable smaller decrease of the capacitance in the case of using the filling-in paste from the invention.
- the mentioned filling-in paste slackens the process of electrochemical oxidation of aluminium or other capacitor electrodes by loading of AC voltage, due to perfect seal of the roll and hinder the access of external humidity and air-oxygen.
- the filling-in paste from the invention enables to improve parameters of filling-up components, to increase the air-humidity resisting, moisture resisting, heat resisting and also ths mechanical shock and burn resisting. It extends the range of application of components and enables to get-significantly longer life durability.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Details Of Resistors (AREA)
- Polyurethanes Or Polyureas (AREA)
- Die Bonding (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
On produit une pâte de remplissage pour composants électroniques en faisant réagir une huile de ricine anhydre avec une résine de polyisocyanate dont les rapports de poids peuvent varier entre 100 à 5 et 100 à 25 et en faisant thermodurcir le produit obtenu entre 0 et 75 °C entre 20 minutes et 6 heures.A filler paste for electronic components is produced by reacting anhydrous castor oil with a polyisocyanate resin whose weight ratios can vary between 100 to 5 and 100 to 25 and by thermosetting the product obtained between 0 and 75 ° C. between 20 minutes and 6 hours.
Description
Filling-in paste for electronic components
Field of the invention
The invention refers to the filling-in paste for electronic components, which ensures tight and elastic filling-up of component, with perfect insulation from unfavourable influences of external environment, and at the same time it ensures the good thermal conductivity and the practical self-suppression.
Background of the invention
Epoxide-resine, asphalts, polyurethane-resins and similar compounds are used as filling-in pastes for electronic components. These compounds are applied with various fillers, accelerators and dryers, which influence their electrical, mechanical and chemical features and also the self -suppression. The problem is complicated with filling-in paste preparation, high price and with harmonizing of all required properties. These compounds have mostly antagonistic properties - for example the good insulation properties, but the considerable internal stress during the hardening process for example at epoxide-resins, combined often with an exotherm reaction. The following example can the patent SU 430 124, which employs toluene as a solvent to the mixture of ricine-oil and aliphatic aromatic diizocyanate; that causes however the considerable extension of hardening time and toluene is into the bargain very harmful. The problems connected with ecology and safety standards occur by present-day filling-in pastes last but not least.
Summary of the invention
The disadvantages of till used filling-in pastes are solved by the filling-in paste of this invention. Substance of the invention of the filling-in paste for electronic components is, that it concerns product of reaction anhydrous ricine-oil and polyizocyanate-resin; for this resin is advantageously used aromatic polyizocyanate with the main component triphenilmethan - 4,4,'4" - triizocyanate in ratio 100 weight parts of ricine-oil and 25 weight parts of polyizocyanate-resin. The filling-in paste is hardened at temperature range 0 - 75°C for the duration 20 minutes till 6 hours as required.
The advantage of the filling-in paste opposite the well-known mixtures is, that it contains no harmful organic solvents as toluene, it shortens the hardening time at lower temperatures without demands on the following hardening: and it shows very good result properties, as dielectric and electroinsulating properties, heat conductivity and resistance, mechanical elasticity, gas and steam airtightness, and also very good adhesion to common used materials.
The optimal result properties for the given use may be reached with the filling-in paste from the invention, by the various relative mixing ratio of ricine-oil and polyizocyanate-resin (with triizocyanate as its main component). At the same time it is not necessary to use fillers, dryers, accelerators and it is possible to change the consistence from nearly liquid to solid.
Detailed description of the invention The roll of capacitor made from polypropylene-folie with aluminium metalization is filled-up in the case with filling-in paste which is prepared by mixing of vacuum
dryed ricine-oil and low-polmered polyizocyanate-resin (the main component of polyizocyanate-resin is triphenilmethan - 4,4',4" - triizocyanate), in ratio 100 weight parts of ricine-oil and 25 weight parts of polyizocyanate-resin. This mixture is solidified on the temperature + 75°C for 2 hours. The completation of the capacitor is made in normal way.
The capacitcr without the filling-in paste and the capacitor filled-up with epoxide-resin are used for comparison.
After the life test was applied on capacitors (400 hours, + 85°C, 340 V, polypropylene-folie 6 yum thickness with aluminium metalization), the average decreases of capacitance are: a) the capacitor without filling-in paste: δC (% ) = 2.25 b) the capacitor filled-up with epoxide-resin: δC (%) = 0.65 c) the capacitor filled-up with compound
from the invention: SC {%) = 0.35
The test result shows considerable smaller decrease of the capacitance in the case of using the filling-in paste from the invention. The mentioned filling-in paste slackens the process of electrochemical oxidation of aluminium or other capacitor electrodes by loading of AC voltage, due to perfect seal of the roll and hinder the access of external humidity and air-oxygen.
Industrial applicability
The filling-in paste from the invention enables to improve parameters of filling-up components, to increase the air-humidity resisting, moisture resisting, heat resisting and also ths mechanical shock and burn resisting. It extends the range of application of components and enables to get-significantly longer life durability.
Claims
1. The filling-in paste for electronic components c h a r a c t e r i z e d as a product of the reaction of the anhydrous ricine-oil and the polyizocyanate-resin.
2. The filling-in paste for electronic components in the point 1, c h a r a c t e r i z e d by using with advantage aromatic polyizocyanate with the main component triphenilmethan - 4,4',4" - triizocyanate, as a polyizocyanate-resin.
3. The filling-in paste for electronic components in the point 2, c h a r a c t e r i z e d by using the reaction product of anhydrous ricine-oil and polyizocyanate-resin in weight ratio 100:5 to 100:25.
4. The filling-in paste for electronic components in the point 3, c h a r a c t e r i z e d by using the reaction mixture of anhydrous ricine-oil and polyizocyanate-resin and its hardening on the temperature in range of
0 to + 75°C
5. The filling-in paste for electronic components in the point 4, c h a r a c t e r i z e d by using the reaction mixture of anhydrous ricine-oil and polyizocyanate-resin and its hardening by requirements from 20 minutes to 6 hours.
AMENDED CLAIMS
[received by the International Bureau on 4 February 1994 (04.02.94); original claims 1-5 replaced by amended claim 1 (1 page)]
The filling-in paste for electronic components
c h a r a c t e r i z e d as a product of the reaction of the anhydrous ricine-oil and the triphenilmethan - 4,4',4" -triizotyanate in the form of polyizocyanate-resin in weight ratios from 100:5 to 100:25; this product is thermosetting.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS2765/92 | 1992-09-07 | ||
| CS922765A CZ279560B6 (en) | 1992-09-07 | 1992-09-07 | Compound for electronic components encapsulating |
| PCT/CZ1993/000016 WO1994006125A1 (en) | 1992-09-07 | 1993-07-01 | Filling-in paste for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0612434A1 true EP0612434A1 (en) | 1994-08-31 |
Family
ID=5365665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP93912548A Withdrawn EP0612434A1 (en) | 1992-09-07 | 1993-07-01 | Filling-in paste for electronic components |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0612434A1 (en) |
| CZ (1) | CZ279560B6 (en) |
| RU (1) | RU94022273A (en) |
| SK (1) | SK278230B6 (en) |
| WO (1) | WO1994006125A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168258A (en) * | 1978-02-15 | 1979-09-18 | N L Industries, Inc. | Grease compatible, mineral oil extended polyurethane |
| US4514588A (en) * | 1982-12-28 | 1985-04-30 | Phillips Petroleum Company | Encapsulated electronic components and encapsulation compositions |
| JP2548032B2 (en) * | 1989-02-17 | 1996-10-30 | 日本ポリウレタン工業株式会社 | Method for producing polyurethane elastomer for sealing material and binding material |
-
1992
- 1992-09-07 CZ CS922765A patent/CZ279560B6/en unknown
- 1992-11-07 SK SK276592A patent/SK278230B6/en unknown
-
1993
- 1993-07-01 EP EP93912548A patent/EP0612434A1/en not_active Withdrawn
- 1993-07-01 RU RU94022273/07A patent/RU94022273A/en unknown
- 1993-07-01 WO PCT/CZ1993/000016 patent/WO1994006125A1/en not_active Application Discontinuation
Non-Patent Citations (1)
| Title |
|---|
| See references of WO9406125A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| SK276592A3 (en) | 1994-06-08 |
| CZ279560B6 (en) | 1995-05-17 |
| RU94022273A (en) | 1996-07-27 |
| SK278230B6 (en) | 1996-05-08 |
| CZ276592A3 (en) | 1993-03-17 |
| WO1994006125A1 (en) | 1994-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE |
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| 17P | Request for examination filed |
Effective date: 19940916 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Withdrawal date: 19960712 |