EP0609561A1 - Transducer - Google Patents

Transducer Download PDF

Info

Publication number
EP0609561A1
EP0609561A1 EP93120935A EP93120935A EP0609561A1 EP 0609561 A1 EP0609561 A1 EP 0609561A1 EP 93120935 A EP93120935 A EP 93120935A EP 93120935 A EP93120935 A EP 93120935A EP 0609561 A1 EP0609561 A1 EP 0609561A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
piëzo
disc
recess
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP93120935A
Other languages
German (de)
French (fr)
Other versions
EP0609561B1 (en
Inventor
Günther HAUENSTEIN
Volker Hensel
Horst Schupp
Martina Hinkel
Michael Steghaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrowatt Technology Innovation AG
Original Assignee
Landis and Gyr Technology Innovation AG
Landis and Gyr Bussiness Support AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Landis and Gyr Technology Innovation AG, Landis and Gyr Bussiness Support AG filed Critical Landis and Gyr Technology Innovation AG
Publication of EP0609561A1 publication Critical patent/EP0609561A1/en
Application granted granted Critical
Publication of EP0609561B1 publication Critical patent/EP0609561B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0677—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a high impedance backing

Definitions

  • the invention relates to an ultrasonic transducer or measuring transducer according to the preamble of claims 1 and 10, respectively.
  • Such ultrasonic transducers are suitable for measuring the flow velocity of a medium by means of acoustic waves, for example in the case of electronic heat meters or flow volume meters.
  • An ultrasonic transducer of this type is known from DE-PS 29 34 031, which describes the design features of the ultrasonic transducer for use in hot, liquid media.
  • the active part of the ultrasonic transducer is arranged in a transducer housing and consists of a relatively thin disk made of pi ⁇ zoceramic between flat electrodes which are arranged on the end faces of the disk.
  • the first electrode completely covers the front face and, for better contact, extends over the cylinder jacket to the rear face.
  • the disk made of pi ⁇ zoceramic is arranged in a pot-shaped recess in the converter housing behind a membrane, so that the disk is separated from the mostly aggressive medium.
  • a full-surface adhesive connection between the front face of the disc and the membrane effects a good transmission of the ultrasound into the medium and centers the disc on the axis of the converter housing.
  • the ultrasound is emitted from the front end of the pi ⁇ zoceramic disc, as is known from EP-451'355 A1, and in parallel to its axis of rotation if the disc can swing freely. Since a distance must be maintained between the end face and the inlet of the measuring tube for hydraulic reasons, part of the ultrasound can be emitted next to the measuring tube and reflected somewhere in the housing. The active one The edge of part of the ultrasonic transducer must not be pressed against the transducer housing, since this disturbs the free vibration of the disk and thus the symmetry of the emitted ultrasound.
  • the ultrasonic transducer is operated alternately in the transmit and receive phases. During the reception phase, the ultrasound waves reflected in the environment from the previous transmission phase can strike the same ultrasound transducer again and cause large measurement errors that are dependent on the temperature of the medium.
  • the invention has for its object to provide a transducer of the type specified in the preamble of claim 1 or 10, the active part can swing freely and which can be produced with an inexpensive and simple method.
  • 1 means a plate made of pi ⁇ zoceramic, 2 a plate-shaped converter housing, 3 a flexible circuit board, 4 and 4 'two connections on the circuit board, 5 a recess in the converter housing 2 and 6 holes for fastening elements.
  • the converter housing 2 can terminate a measuring section on both sides of a sensor housing.
  • the plate 1 preferably having the shape of a disk, which is referred to below as the Pi ⁇ zo disk 1 regardless of its shape.
  • a dashed circle 7 indicates the clear width of the transmitter housing, which is filled with a flowing medium.
  • the recess 5 opens against the transmitter housing and receives the Pi ⁇ zo disk 1 as an active part of the ultrasonic transducer.
  • the flexible printed circuit board 3 with conductor tracks 8 and 9 and the Pi ⁇ zo disk 1 firmly arranged on it form an assembly and connection unit which fixes the Pi ⁇ zo disk 1 in the recess 5 in a predetermined position.
  • the conductor tracks 8 and 9 connect electrodes of the Pi ⁇ zo disk 1 to the connections 4, 4 ′ located at one end of the circuit board 3. The end with the connections 4, 4 'protrudes beyond the outer edge 10 of the converter housing 2.
  • the Pi ⁇ zo 1 is highlighted by hatching and the flexible circuit board 3 by means of a dot matrix.
  • the Pi ⁇ zo disk 1 is arranged on one end of the flexible printed circuit board 3 in the center of the recess 5 or the converter housing 2, with tabs 11 of the flexible printed circuit board 3 in the radial direction over the Protruding the periphery of the Pi ⁇ zo disc 1 and resiliently center it in the recess 5 of the converter housing 2.
  • the tabs 11 have the advantage that they center the Pi ⁇ zo disk 1, which is firmly connected to the flexible printed circuit board 3, in the recess 5 easily and reproducibly, and that the Pi ⁇ zo disk 1 is mounted in the converter housing 2 without any tension.
  • the Pi ⁇ zo disc 1 has optimal vibration conditions, since it is centered in the recess 5 without touching the side wall of the recess 5 with its periphery.
  • the converter housing 2 is shown as an example in section in FIG. 2 and is in the basic form a simple plate made of metal (e.g. brass, steel etc.), the thickness of which is due to the pressure resistance prescribed for the transmitter housing as well as the space required by the Recess 5 is determined.
  • the recess 5 is lowered from the surface of the transducer housing 2 facing the transducer housing and has a completely flat base 12 in the drawing. To avoid the risk of breakage, the floor 12 can also be lowered in hazardous areas.
  • the flexible printed circuit board 3 leads over this surface of the converter housing 2 and follows the side wall of the recess 5 onto the floor 12 by means of a Z-shaped offset 3 ', in order to be located underneath the Pi ⁇ zo disk 1 as an insulating pad 13 between the two electrodes of the Pi ⁇ zo disk and the floor 12 to continue.
  • the bend 3 ' is not supported against the edge of the recess 5.
  • the length of the tabs 11 is dimensioned such that the tabs 11, as shown, bend up slightly and are resiliently supported against the cylindrical side wall of the recess 5 when the pto plate 1 is pressed into the recess 5 against the bottom 12.
  • the tabs 11 advantageously have the same angular distances from one another. With three tabs 11, for example, the distance is 120 °.
  • the recess 5 is covered by an elastic membrane 14 which is firmly connected to the converter housing 2. If the membrane 14 is drawn up to the edge 10, the membrane 14 is perforated at predetermined locations so that the fastening holes 6 can be used.
  • the membrane 14 seals the transducer housing 2 or the recess 5 against the medium 15 and presses the Pi ⁇ zo disc 1 into the recess 5.
  • the depth of the recess 5 is a few tenths of a millimeter less than the height of the front end face of the Pi ⁇ zo disc 1 above Bottom 12 so that the elastic membrane 14 presses the Pi ⁇ zo disc 1 against the support 13 and the bottom 12 and holds the Pi ⁇ zo disc 1 in a predetermined position.
  • a double-sided thin adhesive film 16 which is used as a transfer film from 3M, Minnesota Mining and Manufacturing Corp., is suitable for bonding. USA.
  • a bond by means of the adhesive film 16 is also suitable as a connection between the membrane 14 and the converter housing 2.
  • the membrane 14 can also be completely coated with the adhesive film 16 or with adhesive on the side facing the converter housing 2, so that the membrane 14 can be glued to the Pi ⁇ zo disk 1 as well as to the converter housing 2 in the same operation.
  • a thin metal foil that is transparent to ultrasound is used as the membrane 14 in order to achieve a sufficiently high compressive strength against the medium 15.
  • a metal foil is, for example, an approximately 0.1 mm thick foil made of acid-resistant, stainless steel, which has great compressive strength and corrosion resistance combined with good processability.
  • the flexible printed circuit board 3 is equipped with the Pi ⁇ zo disk 1 shown in Figure 3 and after assembly in Figure 4.
  • the circuit board 3 consists of a layered composite of two thin plastic films 17 and 18, one forming the substrate 17 for the conductor tracks 8 and 9 and the other as a cover film 18 for insulation against the two electrodes 19 and 20 of the Pi ⁇ zo disk 1, the conductor tracks 8 and 9 covers.
  • the cover film 18 has cutouts for the solder joints at the connections 4 (FIG. 3), 4 ′, a central connection 21 and an edge connection 22.
  • the large electrode 20 covers the Pi ⁇ zo disk 1 on the end face facing the membrane 14, the cylinder jacket 23 and an edge zone 24 on the opposite end face.
  • the central electrode 19, which is electrically insulated from the edge zone 24 of the large electrode 20, is arranged in the center of the second end face within the edge zone 24.
  • the electrodes 19, 20 are e.g. B. galvanically deposited from a precious metal and therefore easy to solder.
  • the plastic films 17 and 18 are advantageously made of polyimide which is resistant to soldering temperature, so that the conductor tracks 8, 9 can be soldered to this flexible printed circuit board 3 without problems, even with thin qualities.
  • the circuit boards 3 or their plastic films 17 and 18 are, for. B. available under the trade name KAPTON from DuPont, USA.
  • the flexible printed circuit board 3 in FIG. 3 has a thickness of approximately one tenth of a millimeter and consists of a connection part with the connections 4, 4 'and the support 13, which are connected to the conductor tracks 8, 9 with a narrow strip. Despite the small thickness, the rigidity of the film composite of the printed circuit board 3 is sufficient to center the Pi ⁇ zo disk 1 by means of the tabs 11.
  • the edge connection 22 lies on the outer edge of the support 13.
  • the conductor 8 leads from the connection 4 to the soldering field for the edge connection 22.
  • the soldering field for the central connection 21 lies in the center of the circular support 13 and is connected to the connection 4 'via the conductor 9. connected.
  • the printed circuit board 3 can have additional conductor pieces insulated from the connections 4, 4 ', which are of the same thickness as the conductor tracks 8, 9 and which do not require the majority of the conductor tracks 8, 9 in the drawing Cover the hatched area of the pad 13.
  • the pad 13 therefore has a uniform thickness.
  • the flexible printed circuit board 3 has at least two eyelets 25, 26, which are used for the precise alignment of the flexible printed circuit board 3 on the Pi ⁇ zo disk 1 in a device for soldering, not shown here.
  • the pi ⁇ zo disk 1 touches the corresponding soldering fields of the printed circuit board 3, which are heated through the printed circuit board 3 until the solder melts. After re-solidification, the solder mechanically and electrically stably connects the central electrode 19 and the edge zone 24 (FIG. 4) to the conductor tracks 8 and 9, so that the Pi ⁇ zo disk 1 lies completely flat on the support 13.
  • the alignment of the circuit board 3 by means of the eyelets 25, 26 on the Pi ⁇ zo disk 1 in a device has the advantage that the predetermined alignment can be reproduced with great accuracy and that the method is suitable for automating the soldering process.
  • Reflow soldering is advantageously suitable as the soldering method, since in this method the Pi ⁇ zo disc 1 is heated and cooled uniformly, so that local electrical depolarization of the Pi ⁇ zo ceramic of the disc 1 and occurrence of mechanical stresses are avoided, both of which the rotational symmetry of the ultrasound emitted in a bundle.
  • the circuit board 3 is still trimmed.
  • a cutting tool not shown here, is aligned with the help of the eyelets 25, 26 on the printed circuit board 3 and the Eyes 25, 26 removed by cutting.
  • the cut in the eyelet 26 is made in such a way that the tab 11 has exactly the right length.
  • the eyelets 25, 26 can be provided at other locations on the flexible printed circuit board 3, even at those locations that do not interfere in later operation, which eliminates the need to remove these eyelets 25, 26.
  • the printed circuit boards 3 are produced in large numbers in use and punched out of them, the tabs 11 and the eyelets 25, 26 being cut out at the same time with great accuracy.
  • FIG. 5 shows a circuit board 3, which consists of the part with the connections 4, 4 'and a base part 27, which has the same edge 10 as the converter housing 2 (FIG. 2).
  • the support 13 with the Pi ⁇ zo disc 1 can be separated from the circuit board 3 by circular ring segments 28.
  • Holes 6 for the fastening elements (eg screws) and eyelets 25 for aligning the printed circuit board 3 are provided in the base part 27 at predetermined locations.
  • the eyelets 25 serve not only to align the Pi ⁇ zo disk 1 on the printed circuit board 3, but also to align the assembly unit consisting of the printed circuit board 3 and the Pi ⁇ zo disk 1 in the converter housing 2, so that the tabs 11 (FIG. 2) are unnecessary.
  • the converter housing 2 (FIG. 2) is made in two parts and consists of a ring part 29 with the recess 5 and a circular end plate 30.
  • the ring part 29 and the end plate 30 have the same boundary 10 as a connecting flange 31 of the transmitter.
  • the ring part 29 and the end plate 30 can be screwed together to form the converter housing 2 and can be connected as a whole to the connecting flange 31.
  • the sealing between the ultrasonic transducer and the transmitter can be done by means of an elastic O-ring 32.
  • the end plate 30 on the surface facing the ring part 29 has pins 35 arranged vertically on it and arranged at predetermined locations, both engage in the eyelets 25 (FIG. 5) of the circuit board 3 laid flat on the end plate 30 with the substrate 17 (FIG. 4) and also in centering holes 36 in the ring part 29.
  • the pins 35 advantageously protrude beyond the attached ring part 29 and can be plugged into the centering holes 36 ′ of the connecting flange 31 located outside the area for the O-ring 32.
  • the recess 5 in the ring part 29 is sealed on the side facing the transducer with the membrane 14 against the medium 15.
  • the steel foil as membrane 14 can be welded directly to the ring part 29.
  • the height of the ring part 29 is dimensioned such that the Pi ⁇ zo disc 1 projects a few tenths of a millimeter beyond the ring part 29 placed on the connection plate 30, so that the membrane 14 presses the Pi ⁇ zo disc 1 against the connection plate 30.
  • the adhesive film 16 between the Pi ⁇ zo disc 1 and the membrane 14 conveys the connection necessary for the ultrasound coupling of the Pi ⁇ zo disc 1 to the membrane 14 or the medium 15.
  • the connections 4, 4 '(FIG. 5) of the ultrasound transducers can be connected via a shielded line to an electronic device 37 for the transmission and reception of ultrasound wave signals.
  • the converter housing 2 preferably has a cleat for clamping the shielded line, which as Strain relief of the connections 4, 4 'is used.
  • the substrate 17 (FIG. 4) is connected to the membrane 14, for example to the adhesive film 16 (FIG. 6).
  • the end face with the large electrode 20 (FIG. 4) is pressed against the bottom 12 by means of the membrane 14.
  • a cushion 38 made of plastic is arranged between the Pi ⁇ zo disc 1 and the base 12 in order to acoustically decouple the Pi ⁇ zo disc 1 from the base 12 and to electrically isolate the large electrode 20 from the transducer housing 2. Ultrasound is received and emitted on the side of the central electrode 19 (FIG. 4) through the printed circuit board 3 and the membrane 14.
  • the centering of the Pi ⁇ zo disc 1 on the axis of symmetry 33 of the converter housing 2 can be carried out by means of tabs 11 (FIG. 2) or by means of the pins 35 (FIG. 6) and eyelets 25 (FIG. 5) or a combination of both measures.
  • the ultrasound transducers have the advantage that the entire area of the rear end face of the pezzo disk 1 is supported by the support 13 (FIG. 5) or the cushion 38 against the bottom 12 of the recess 5 or against the end plate 30 (FIG. 6) , so that the pressure resistance of the ultrasonic transducers is increased with a minimal overall height.
  • the ultrasonic transducers can be placed reproducibly by means of the centering of the transducer housing 2 shown in FIG. 6 by means of the pins 35 and the centering holes 36, so that an exact alignment is ensured even after maintenance work.
  • the ultrasonic transducers shown in the figures have rotational symmetry with respect to the axis of symmetry 33.
  • Such ultrasonic transducers are suitable for the optimal transmission of measuring tubes 34 with a circular cross section. Instead of the circular borders, parts with other border shapes can also be used.
  • the ultrasound transducer With a square cross section of the measuring tube 34, the ultrasound transducer preferably has square shapes for the Pi ⁇ zo disc 1, the support 13, the Electrodes 19, 20, 23, 24, etc.
  • the boundary 10 of the transducer housing 2, the recess 5, etc. can be selected independently of the cross-sectional shape of the measuring tube 34.
  • the transducer described can also be used to measure physical quantities such as force, temperature, pressure, oscillation frequency and the like if the Pi ⁇ zo disk is replaced by an appropriate sensor.

Abstract

An ultrasonic transducer has a piezo wafer (1) arranged in a transducer housing (2) and having two electrodes to emit and receive ultrasonic waves. The ultrasound passes through a diaphragm (14) into a flowing medium (15). The diaphragm (14) separates the piezo wafer (1) having the electrodes from the mostly aggressive medium (15). The piezo wafer (1) is connected firmly to a flexible printed circuit board (3), which aligns the piezo wafer (1) reproducibly in a recess (5) of the transducer housing (2). The printed circuit board (3) has tongues (11) and/or eyelets as means of alignment. <IMAGE>

Description

Die Erfindung bezieht sich auf einen Ultraschallwandler bzw. Messwandler gemäss dem Oberbegriff des Anspruchs 1 bzw. 10.10. The invention relates to an ultrasonic transducer or measuring transducer according to the preamble of claims 1 and 10, respectively.

Solche Ultraschallwandler eignen sich zur Messung der Strömungsgeschwindigkeit eines Mediums mittels akustischer Wellen beispielsweise bei elektronischen Wärmezählern oder Durchflussvolumenzählern.Such ultrasonic transducers are suitable for measuring the flow velocity of a medium by means of acoustic waves, for example in the case of electronic heat meters or flow volume meters.

Es ist ein Ultraschallwandler dieser Art aus der DE-PS 29 34 031 bekannt, die die Konstruktionsmerkmale des Ultraschallwandlers für den Gebrauch in heissen, flüssigen Medien beschreibt. Der aktive Teil des Ultraschallwandlers ist in einem Wandlergehäuse angeordnet und besteht aus einer relativ dünnen Scheibe aus einer Piëzokeramik zwischen flächigen Elektroden, die auf den Stirnseiten der Scheibe angeordnet sind. Die erste Elektrode überzieht die vordere Stirnfläche völlig und greift zum besseren Kontaktieren über den Zylindermantel auf die hintere Stirnfläche über. Die Scheibe aus Piëzokeramik ist in einer topfförmigen Vertiefung des Wandlergehäuses hinter einer Membran angeordnet, damit die Scheibe vom meist aggressiven Medium getrennt ist. Eine vollflächige Klebeverbindung zwischen der vorderen Stirnfläche der Scheibe und der Membran bewirkt eine gute Uebertragung des Ultraschalls in das Medium und zentriert die Scheibe auf die Achse des Wandlergehäuses.An ultrasonic transducer of this type is known from DE-PS 29 34 031, which describes the design features of the ultrasonic transducer for use in hot, liquid media. The active part of the ultrasonic transducer is arranged in a transducer housing and consists of a relatively thin disk made of piëzoceramic between flat electrodes which are arranged on the end faces of the disk. The first electrode completely covers the front face and, for better contact, extends over the cylinder jacket to the rear face. The disk made of piëzoceramic is arranged in a pot-shaped recess in the converter housing behind a membrane, so that the disk is separated from the mostly aggressive medium. A full-surface adhesive connection between the front face of the disc and the membrane effects a good transmission of the ultrasound into the medium and centers the disc on the axis of the converter housing.

Als Piëzokeramik eignen sich Materialien, die unter dem Namen SONOX von Hoechst CeramTec in Selb, BR Deutschland, hergestellt und angeboten werden.Materials that are manufactured and offered under the name SONOX by Hoechst CeramTec in Selb, Germany, are suitable as piëzoceramics.

Der Ultraschall wird von der vorderen Stirnseite der Scheibe aus Piëzokeramik abgestrahlt, wie aus der EP-451'355 A1 bekannt ist, und zwar parallel zu ihrer Rotationsachse, falls die Scheibe frei schwingen kann. Da aus hydraulischen Gründen zwischen der Stirnfläche und dem Eingang des Messrohrs ein Abstand gewahrt werden muss, kann ein Teil des Ultraschalls neben das Messrohr gestrahlt und irgendwo im Gehäuse reflektiert werden. Der aktive Teil des Ultraschallwandlers darf mit seiner Berandung nicht gegen das Wandlergehäuse gedrückt werden, da dies die freie Schwingung der Scheibe und damit die Symmetrie des abgestrahlten Ultraschalls stört.The ultrasound is emitted from the front end of the piëzoceramic disc, as is known from EP-451'355 A1, and in parallel to its axis of rotation if the disc can swing freely. Since a distance must be maintained between the end face and the inlet of the measuring tube for hydraulic reasons, part of the ultrasound can be emitted next to the measuring tube and reflected somewhere in the housing. The active one The edge of part of the ultrasonic transducer must not be pressed against the transducer housing, since this disturbs the free vibration of the disk and thus the symmetry of the emitted ultrasound.

Der Ultraschallwandler wird abwechslungsweise in Sende- und Empfangsphasen betrieben. Während der Empfangsphase können die in der Umgebung reflektierten Ultraschallwellen der vorherigen Sendephase wieder auf den gleichen Ultraschallwandler auftreffen und grosse, von der Temperatur des Mediums abhängige Messfehler verursachen.The ultrasonic transducer is operated alternately in the transmit and receive phases. During the reception phase, the ultrasound waves reflected in the environment from the previous transmission phase can strike the same ultrasound transducer again and cause large measurement errors that are dependent on the temperature of the medium.

Der Erfindung liegt die Aufgabe zugrunde, einen Wandler der im Oberbegriff des Patentanspruchs 1 bzw. 10 angegebenen Art zu schaffen, dessen aktiver Teil frei schwingen kann und der mit einem kostengünstigen und einfachen Verfahren herstellbar ist.The invention has for its object to provide a transducer of the type specified in the preamble of claim 1 or 10, the active part can swing freely and which can be produced with an inexpensive and simple method.

Die Lösung der Aufgabe gelingt mit den im Anspruch 1 bzw. 10 angegebenen Merkmalen. Vorteilhafte Ausgestaltungen ergeben sich aus den abhängigen Ansprüchen.The problem is solved with the features specified in claims 1 and 10, respectively. Advantageous configurations result from the dependent claims.

Nachfolgend wird ein Ausführungsbeispiel der Erfindung anhand der Figuren näher erläutert.An exemplary embodiment of the invention is explained in more detail below with reference to the figures.

Es zeigt:

Figur 1
ein Wandlergehäuse mit einer flexiblen Leiterplatte und einer Piëzoscheibe,
Figur 2
einen Ultraschallwandler,
Figur 3
die flexible Leiterplatte,
Figur 4
die Verbindung zwischen der Piëzoplatte und der flexiblen Leiterplatte,
Figur 5
die Piëzoplatte angeordnet auf der flexiblen Leiterplatte,
Figur 6
ein Messwertgebergehäuse und der Ultraschallwandler sowie
Figur 7
der Ultraschallwandler mit der flexiblen Leiterplatte zwischen der Piëzoplatte und einer Membran.
It shows:
Figure 1
a converter housing with a flexible printed circuit board and a Piëzo disk,
Figure 2
an ultrasonic transducer,
Figure 3
the flexible circuit board,
Figure 4
the connection between the Piëzo plate and the flexible circuit board,
Figure 5
the Piëzo plate arranged on the flexible circuit board,
Figure 6
a transmitter housing and the Ultrasonic transducers as well
Figure 7
the ultrasonic transducer with the flexible printed circuit board between the Piëzo plate and a membrane.

In der Figur 1 bedeuten 1 eine Platte aus Piëzokeramik, 2 ein plattenförmiges Wandlergehäuse, 3 eine flexible Leiterplatte, 4 und 4' zwei Anschlüsse auf der Leiterplatte, 5 eine Ausnehmung im Wandlergehäuse 2 sowie 6 Löcher für Befestigungselemente. Das Wandlergehäuse 2 kann nach der EP-451'355 auf beiden Seiten eines Messwertgebergehäuses eine Messstrecke abschliessen.In FIG. 1, 1 means a plate made of piëzoceramic, 2 a plate-shaped converter housing, 3 a flexible circuit board, 4 and 4 'two connections on the circuit board, 5 a recess in the converter housing 2 and 6 holes for fastening elements. According to EP-451'355, the converter housing 2 can terminate a measuring section on both sides of a sensor housing.

Als Beispiel sind in der Zeichnung der Figur 1 Teile eines scheibenförmigen Ultraschallwandlers dargestellt, wobei die Platte 1 vorzugsweise die Form einer Scheibe aufweist, die nachfolgend unabhängig von ihrer Form als Piëzoscheibe 1 bezeichnet wird.As an example, parts of a disk-shaped ultrasound transducer are shown in the drawing in FIG. 1, the plate 1 preferably having the shape of a disk, which is referred to below as the Piëzo disk 1 regardless of its shape.

Ein gestrichelt gezeichneter Kreis 7 deutet die lichte Weite des Messwertgebergehäuses an, das von einem strömenden Medium erfüllt ist. Die Ausnehmung 5 öffnet sich gegen das Messwertgebergehäuse und nimmt die Piëzoscheibe 1 als aktiven Teil des Ultraschallwandlers auf. Die flexible Leiterplatte 3 mit Leiterbahnen 8 und 9 und die fest auf ihr angeordnete Piëzoscheibe 1 bilden eine Montage- und Anschlusseinheit, die die Piëzoscheibe 1 in der Ausnehmung 5 in einer vorbestimmten Lage fixiert. Die Leiterbahnen 8 und 9 verbinden Elektroden der Piëzoscheibe 1 mit den an einem Ende der Leiterplatte 3 gelegenen Anschlüssen 4, 4'. Das Ende mit den Anschlüssen 4, 4' ragt über die äussere Berandung 10 des Wandlergehäuses 2 hinaus.A dashed circle 7 indicates the clear width of the transmitter housing, which is filled with a flowing medium. The recess 5 opens against the transmitter housing and receives the Piëzo disk 1 as an active part of the ultrasonic transducer. The flexible printed circuit board 3 with conductor tracks 8 and 9 and the Piëzo disk 1 firmly arranged on it form an assembly and connection unit which fixes the Piëzo disk 1 in the recess 5 in a predetermined position. The conductor tracks 8 and 9 connect electrodes of the Piëzo disk 1 to the connections 4, 4 ′ located at one end of the circuit board 3. The end with the connections 4, 4 'protrudes beyond the outer edge 10 of the converter housing 2.

In der Zeichnung der Figur 1 ist die Piëzoscheibe 1 durch Schraffieren und die flexible Leiterplatte 3 mittels eines Punktrasters hervorgehoben. Die Piëzoscheibe 1 ist auf dem einen Ende der flexiblen Leiterplatte 3 im Zentrum der Ausnehmung 5 bzw. des Wandlergehäuses 2 angeordnet, wobei Laschen 11 der flexiblen Leiterplatte 3 in radialer Richtung über die Peripherie der Piëzoscheibe 1 hinausragen und diese in der Ausnehmung 5 des Wandlergehäuses 2 federnd zentrieren.In the drawing of Figure 1, the Piëzo 1 is highlighted by hatching and the flexible circuit board 3 by means of a dot matrix. The Piëzo disk 1 is arranged on one end of the flexible printed circuit board 3 in the center of the recess 5 or the converter housing 2, with tabs 11 of the flexible printed circuit board 3 in the radial direction over the Protruding the periphery of the Piëzo disc 1 and resiliently center it in the recess 5 of the converter housing 2.

Die Laschen 11 weisen den Vorteil auf, dass sie die mit der flexiblen Leiterplatte 3 fest verbundene Piëzoscheibe 1 in der Ausnehmung 5 leicht und reproduzierbar zentrieren und dass die Piëzoscheibe 1 völlig spannungsfrei im Wandlergehäuse 2 gelagert ist. Die Piëzoscheibe 1 besitzt optimale Schwingungsbedingungen, da sie, ohne mit ihrer Peripherie die Seitenwand der Ausnehmung 5 zu berühren, in der Ausnehmung 5 zentriert ist.The tabs 11 have the advantage that they center the Piëzo disk 1, which is firmly connected to the flexible printed circuit board 3, in the recess 5 easily and reproducibly, and that the Piëzo disk 1 is mounted in the converter housing 2 without any tension. The Piëzo disc 1 has optimal vibration conditions, since it is centered in the recess 5 without touching the side wall of the recess 5 with its periphery.

Beispielhaft ist das Wandlergehäuse 2 in der Figur 2 im Schnitt dargestellt und ist in der Grundform eine einfache Platte aus Metall (z. B. Messing, Stahl usw.), deren Dicke sowohl durch die für das Messwertgebergehäuse vorgeschriebene Druckfestigkeit als auch durch den Platzbedarf der Ausnehmung 5 bestimmt ist. Die Ausnehmung 5 ist von der dem Messwertgebergehäuse zugewandten Oberfläche des Wandlergehäuses 2 abgesenkt und weist in der Zeichnung einen völlig ebenen Boden 12 auf. Zur Vermeidung von Bruchgefahr kann der Boden 12 in gefährdeten Bereichen auch abgesenkt sein.The converter housing 2 is shown as an example in section in FIG. 2 and is in the basic form a simple plate made of metal (e.g. brass, steel etc.), the thickness of which is due to the pressure resistance prescribed for the transmitter housing as well as the space required by the Recess 5 is determined. The recess 5 is lowered from the surface of the transducer housing 2 facing the transducer housing and has a completely flat base 12 in the drawing. To avoid the risk of breakage, the floor 12 can also be lowered in hazardous areas.

Die flexible Leiterplatte 3 führt über diese Oberfläche des Wandlergehäuses 2 und folgt mittels einer Z-förmigen Abkröpfung 3' der Seitenwand der Ausnehmung 5 auf den Boden 12, um sich unterhalb der Piëzoscheibe 1 als isolierende Auflage 13 zwischen den beiden Elektroden der Piëzoscheibe und dem Boden 12 fortzusetzen. Die Abkröpfung 3' stützt sich nicht gegen den Rand der Ausnehmung 5 ab. Die Länge der Laschen 11 ist so bemessen, dass die Laschen 11, wie gezeigt, sich etwas aufbiegen und sich gegen die zylinderförmige Seitenwand der Ausnehmung 5 federnd abstützen, wenn die Piëzoscheibe 1 in die Ausnehmung 5 hinein gegen den Boden 12 gedrückt wird. Die Laschen 11 weisen mit Vorteil untereinander gleiche Winkelabstände auf. Bei drei Laschen 11, beispielsweise, beträgt der Abstand 120°.The flexible printed circuit board 3 leads over this surface of the converter housing 2 and follows the side wall of the recess 5 onto the floor 12 by means of a Z-shaped offset 3 ', in order to be located underneath the Piëzo disk 1 as an insulating pad 13 between the two electrodes of the Piëzo disk and the floor 12 to continue. The bend 3 'is not supported against the edge of the recess 5. The length of the tabs 11 is dimensioned such that the tabs 11, as shown, bend up slightly and are resiliently supported against the cylindrical side wall of the recess 5 when the pto plate 1 is pressed into the recess 5 against the bottom 12. The tabs 11 advantageously have the same angular distances from one another. With three tabs 11, for example, the distance is 120 °.

Die Ausnehmung 5 ist mittels einer elastischen Membran 14 abgedeckt, die mit dem Wandlergehäuse 2 fest verbunden ist. Falls die Membran 14 bis zur Berandung 10 gezogen ist, ist die Membran 14 an vorbestimmten Stellen gelocht, damit die Befestigungslöcher 6 nutzbar sind. Die Membran 14 dichtet das Wandlergehäuse 2 bzw. die Ausnehmung 5 gegen das Medium 15 ab und drückt die Piëzoscheibe 1 in die Ausnehmung 5. Mit Vorteil beträgt die Tiefe der Ausnehmung 5 einige Zehntelmillimeter weniger als die die Höhe der vorderen Stirnfläche der Piëzoscheibe 1 über dem Boden 12, so dass die elastische Membran 14 die Piëzoscheibe 1 gegen die Auflage 13 und den Boden 12 presst und die Piëzoscheibe 1 in einer vorbestimmten Lage hält.The recess 5 is covered by an elastic membrane 14 which is firmly connected to the converter housing 2. If the membrane 14 is drawn up to the edge 10, the membrane 14 is perforated at predetermined locations so that the fastening holes 6 can be used. The membrane 14 seals the transducer housing 2 or the recess 5 against the medium 15 and presses the Piëzo disc 1 into the recess 5. Advantageously, the depth of the recess 5 is a few tenths of a millimeter less than the height of the front end face of the Piëzo disc 1 above Bottom 12 so that the elastic membrane 14 presses the Piëzo disc 1 against the support 13 and the bottom 12 and holds the Piëzo disc 1 in a predetermined position.

Um für den Ultraschall eine gute Ankopplung der Membran 14 an die Piëzoscheibe 1 zu erzielen, hat sich ein vollflächiges Verkleben der von der flexiblen Leiterplatte 3 abgewandten Stirnseite der Piëzoscheibe 1 mit der Membran 14 bewährt (DE-PS 29 34 031). Zum Verkleben eignet sich beispielsweise eine beidseits klebende dünne Klebfolie 16, die als Transferfolie von der Firma 3M, der Minnesota Mining and Manufacturing Corp. USA, hergestellt wird.In order to achieve a good coupling of the membrane 14 to the Piëzo disk 1 for the ultrasound, full-surface bonding of the end face of the Piëzo disk 1 facing away from the flexible printed circuit board 3 to the membrane 14 has proven itself (DE-PS 29 34 031). For example, a double-sided thin adhesive film 16, which is used as a transfer film from 3M, Minnesota Mining and Manufacturing Corp., is suitable for bonding. USA.

Als Verbindung zwischen der Membran 14 und dem Wandlergehäuse 2 eignet sich auch ein Verkleben mittels der Klebfolie 16. Zum Beispiel kann die Membran 14 auch auf der dem Wandlergehäuse 2 zugewandten Seite vollflächig mit der Klebfolie 16 bzw. mit Klebstoff beschichtet sein, so dass die Membran 14 im gleichen Arbeitsgang sowohl mit der Piëzoscheibe 1 als auch mit dem Wandlergehäuse 2 verklebbar ist.A bond by means of the adhesive film 16 is also suitable as a connection between the membrane 14 and the converter housing 2. For example, the membrane 14 can also be completely coated with the adhesive film 16 or with adhesive on the side facing the converter housing 2, so that the membrane 14 can be glued to the Piëzo disk 1 as well as to the converter housing 2 in the same operation.

Mit Vorteil wird als Membran 14 eine für Ultraschall transparente, dünne Metallfolie eingesetzt, um eine genügend hohe Druckfestigkeit gegen das Medium 15 zu erreichen. Als Metallfolie eignet sich zum Beispiel eine etwa 0,1 mm dicke Folie aus säurebeständigem, rostfreiem Stahl, die eine grosse Druckfestigkeit und Korrosionsbeständigkeit in Verbindung mit einer guten Verarbeitbarkeit aufweist.Advantageously, a thin metal foil that is transparent to ultrasound is used as the membrane 14 in order to achieve a sufficiently high compressive strength against the medium 15. A metal foil is, for example, an approximately 0.1 mm thick foil made of acid-resistant, stainless steel, which has great compressive strength and corrosion resistance combined with good processability.

Die flexible Leiterplatte 3 ist vor der Bestückung mit der Piëzoscheibe 1 in der Figur 3 und nach der Bestückung in der Figur 4 dargestellt. Die Leiterplatte 3 besteht aus einem Schichtverbund aus zwei dünnen Kunststoffolien 17 und 18, wobei die eine das Substrat 17 für die Leiterbahnen 8 und 9 bildet und die andere als Deckfolie 18 zur Isolation gegen die beiden Elektroden 19 und 20 der Piëzoscheibe 1 die Leiterbahnen 8 und 9 abdeckt. Die Deckfolie 18 weist Ausschnitte für die Lötstellen bei den Anschlüssen 4 (Figur 3), 4', einem Zentralanschluss 21 und einem Randanschluss 22 auf.The flexible printed circuit board 3 is equipped with the Piëzo disk 1 shown in Figure 3 and after assembly in Figure 4. The circuit board 3 consists of a layered composite of two thin plastic films 17 and 18, one forming the substrate 17 for the conductor tracks 8 and 9 and the other as a cover film 18 for insulation against the two electrodes 19 and 20 of the Piëzo disk 1, the conductor tracks 8 and 9 covers. The cover film 18 has cutouts for the solder joints at the connections 4 (FIG. 3), 4 ′, a central connection 21 and an edge connection 22.

Die grosse Elektrode 20 bedeckt die Piëzoscheibe 1 auf der der Membran 14 zugewandten Stirnfläche, dem Zylindermantel 23 und einer Randzone 24 der gegenüberliegenden Stirnseite. Im Zentrum der zweiten Stirnseite ist innerhalb der Randzone 24 die Zentralelektrode 19 angeordnet, die elektrisch von der Randzone 24 der grossen Elektrode 20 isoliert ist. Die Elektroden 19, 20 sind z. B. galvanisch aus einem Edelmetall abgeschieden und daher gut lötbar.The large electrode 20 covers the Piëzo disk 1 on the end face facing the membrane 14, the cylinder jacket 23 and an edge zone 24 on the opposite end face. The central electrode 19, which is electrically insulated from the edge zone 24 of the large electrode 20, is arranged in the center of the second end face within the edge zone 24. The electrodes 19, 20 are e.g. B. galvanically deposited from a precious metal and therefore easy to solder.

Die Kunststoffolien 17 und 18 bestehen mit Vorteil aus löttemperaturfestem Polyimid, so dass die Leiterbahnen 8, 9 auf dieser flexiblen Leiterplatte 3 - selbst bei dünnen Qualitäten - problemlos gelötet werden können. Die Leiterplatten 3 bzw. deren Kunststoffolien 17 und 18 sind z. B. unter dem Handelsnamen KAPTON von DuPont, USA, erhältlich.The plastic films 17 and 18 are advantageously made of polyimide which is resistant to soldering temperature, so that the conductor tracks 8, 9 can be soldered to this flexible printed circuit board 3 without problems, even with thin qualities. The circuit boards 3 or their plastic films 17 and 18 are, for. B. available under the trade name KAPTON from DuPont, USA.

Die flexible Leiterplatte 3 in der Figur 3 weist eine Dicke von etwa einem Zehntelmillimeter auf und besteht aus einem Anschlussteil mit den Anschlüssen 4, 4' und der Auflage 13, die mit einem schmalen Streifen mit den Leiterbahnen 8, 9 verbunden sind. Die Steifigkeit des Folienverbunds der Leiterplatte 3 ist trotz der geringen Dicke ausreichend, um mittels der Laschen 11 die Piëzoscheibe 1 zu zentrieren. Der Randanschluss 22 liegt auf dem äusseren Rand der Auflage 13. Die Leiterbahn 8 führt vom Anschluss 4 zum Lötfeld für den Randanschluss 22. Im Zentrum der kreisförmigen Auflage 13 liegt das Lötfeld für den Zentralanschluss 21 und ist über die Leiterbahn 9 mit dem Anschluss 4' verbunden. Die nur in den Lötfeldern bei den Anschlüssen 4, 4', 21 und 22 freiliegenden Leiterbahnen 8, 9 sind zum Löten geeignet verzinnt. Im Bereich der Auflage 13 kann die Leiterplatte 3 zusätzliche, von den Anschlüssen 4, 4' isolierte Leiterstücke aufweisen, die von gleicher Dicke wie die Leiterbahnen 8, 9 sind und den grössten Teil der nicht für die Leiterbahnen 8, 9 benötigen, in der Zeichnung schraffierten Fläche der Auflage 13 einnehmen. Die Auflage 13 weist daher eine gleichmässige Dicke auf.The flexible printed circuit board 3 in FIG. 3 has a thickness of approximately one tenth of a millimeter and consists of a connection part with the connections 4, 4 'and the support 13, which are connected to the conductor tracks 8, 9 with a narrow strip. Despite the small thickness, the rigidity of the film composite of the printed circuit board 3 is sufficient to center the Piëzo disk 1 by means of the tabs 11. The edge connection 22 lies on the outer edge of the support 13. The conductor 8 leads from the connection 4 to the soldering field for the edge connection 22. The soldering field for the central connection 21 lies in the center of the circular support 13 and is connected to the connection 4 'via the conductor 9. connected. The only in the soldering fields with the Terminals 4, 4 ', 21 and 22 exposed conductor tracks 8, 9 are suitably tinned for soldering. In the area of the support 13, the printed circuit board 3 can have additional conductor pieces insulated from the connections 4, 4 ', which are of the same thickness as the conductor tracks 8, 9 and which do not require the majority of the conductor tracks 8, 9 in the drawing Cover the hatched area of the pad 13. The pad 13 therefore has a uniform thickness.

Die flexible Leiterplatte 3 weist wenigstens zwei Oesen 25, 26 auf, die zum genauen Ausrichten der flexiblen Leiterplatte 3 auf die Piëzoscheibe 1 in einer hier nicht gezeigten Vorrichtung zum Löten dienen. Die Piëzoscheibe 1 berührt mit der Seite der zentralelektrode 19 die entsprechenden Lötfelder der Leiterplatte 3, die durch die Leiterplatte 3 hindurch erhitzt werden, bis das Lot schmilzt. Nach dem Wiedererstarren verbindet das Lot mechanisch und elektrisch stabil die Zentralelektrode 19 und die Randzone 24 (Figur 4) mit den Leiterbahnen 8 und 9, so dass die Piëzoscheibe 1 völlig flach auf der Auflage 13 aufliegt.The flexible printed circuit board 3 has at least two eyelets 25, 26, which are used for the precise alignment of the flexible printed circuit board 3 on the Piëzo disk 1 in a device for soldering, not shown here. With the side of the central electrode 19, the piëzo disk 1 touches the corresponding soldering fields of the printed circuit board 3, which are heated through the printed circuit board 3 until the solder melts. After re-solidification, the solder mechanically and electrically stably connects the central electrode 19 and the edge zone 24 (FIG. 4) to the conductor tracks 8 and 9, so that the Piëzo disk 1 lies completely flat on the support 13.

Das Ausrichten der Leiterplatte 3 mittels der Oesen 25, 26 auf die Piëzoscheibe 1 in einer Vorrichtung weist den Vorteil auf, dass die vorbestimmte Ausrichtung mit grosser Genauigkeit reproduzierbar ist und dass sich die Methode zum Automatisieren des Lötvorgangs eignet.The alignment of the circuit board 3 by means of the eyelets 25, 26 on the Piëzo disk 1 in a device has the advantage that the predetermined alignment can be reproduced with great accuracy and that the method is suitable for automating the soldering process.

Als Lötverfahren eignet sich mit Vorteil das "Reflow"-Löten, da bei diesem Verfahren die Piëzoscheibe 1 gleichmässig erwärmt und abgekühlt wird, so dass eine lokale elektrische Depolarisation der Piëzokeramik der Scheibe 1 sowie ein Auftreten von mechanischen Spannungen vermieden werden, die beide die Rotationssymmetrie des in einem Bündel abgestrahlten Ultraschalls stören."Reflow" soldering is advantageously suitable as the soldering method, since in this method the Piëzo disc 1 is heated and cooled uniformly, so that local electrical depolarization of the Piëzo ceramic of the disc 1 and occurrence of mechanical stresses are avoided, both of which the rotational symmetry of the ultrasound emitted in a bundle.

Nach dem Lötvorgang wird die Leiterplatte 3 noch beschnitten. Ein hier nicht gezeigtes Schneidwerkzeug wird mit Hilfe der Oesen 25, 26 auf die Leiterplatte 3 ausgerichtet und die Oesen 25, 26 durch Abschneiden entfernt. Beispielsweise erfolgt der Schnitt bei der Oese 26 derart, dass die Lasche 11 genau die richtige Länge aufweist.After the soldering process, the circuit board 3 is still trimmed. A cutting tool, not shown here, is aligned with the help of the eyelets 25, 26 on the printed circuit board 3 and the Eyes 25, 26 removed by cutting. For example, the cut in the eyelet 26 is made in such a way that the tab 11 has exactly the right length.

Selbstverständlich können die Oesen 25, 26 an anderen Stellen der flexiblen Leiterplatte 3 vorgesehen werden, sogar an solchen Stellen, die im späteren Betrieb nicht stören, wodurch sich das Entfernen dieser Oesen 25, 26 erübrigt.Of course, the eyelets 25, 26 can be provided at other locations on the flexible printed circuit board 3, even at those locations that do not interfere in later operation, which eliminates the need to remove these eyelets 25, 26.

Die Leiterplatten 3 werden in grosser Zahl in Nutzen gefertigt und aus diesen ausgestanzt, wobei gleichzeitig mit grosser Genauigkeit die Laschen 11 und die Oesen 25, 26 ausgeschnitten werden.The printed circuit boards 3 are produced in large numbers in use and punched out of them, the tabs 11 and the eyelets 25, 26 being cut out at the same time with great accuracy.

Beispielhaft ist in der Figur 5 eine Leiterplatte 3 gezeigt, die aus dem Teil mit den Anschlüssen 4, 4' und einem Basisteil 27 besteht, der die gleiche Berandung 10 wie das Wandlergehäuse 2 (Figur 2) aufweist. Die Auflage 13 mit der Piëzoscheibe 1 kann durch Kreisringsegmente 28 von der Leiterplatte 3 abgesetzt sein. Im Basisteil 27 sind an vorbestimmten Stellen Löcher 6 für die Befestigungselemente (z. B. Schrauben) und Oesen 25 zum Ausrichten der Leiterplatte 3 angebracht. Hier dienen die Oesen 25 nicht nur zum Ausrichten der Piëzoscheibe 1 auf der Leiterplatte 3, sondern auch zum Ausrichten der aus der Leiterplatte 3 und der Piëzoscheibe 1 bestehenden Montageeinheit im Wandlergehäuse 2, so dass sich die Laschen 11 (Figur 2) erübrigen.5 shows a circuit board 3, which consists of the part with the connections 4, 4 'and a base part 27, which has the same edge 10 as the converter housing 2 (FIG. 2). The support 13 with the Piëzo disc 1 can be separated from the circuit board 3 by circular ring segments 28. Holes 6 for the fastening elements (eg screws) and eyelets 25 for aligning the printed circuit board 3 are provided in the base part 27 at predetermined locations. Here, the eyelets 25 serve not only to align the Piëzo disk 1 on the printed circuit board 3, but also to align the assembly unit consisting of the printed circuit board 3 and the Piëzo disk 1 in the converter housing 2, so that the tabs 11 (FIG. 2) are unnecessary.

In der Figur 6 ist das Wandlergehäuse 2 (Figur 2) zweiteilig ausgeführt und besteht aus einem Ringteil 29 mit der Ausnehmung 5 und einer kreisförmigen Abschlussplatte 30. Der Ringteil 29 und die Abschlussplatte 30 weisen die gleiche Berandung 10 wie ein Anschlussflansch 31 des Messwertgebers auf. Der Ringteil 29 und die Abschlussplatte 30 sind zur Bildung des Wandlergehäuses 2 miteinander verschraubbar und als ganzes mit dem Anschlussflansch 31 verbindbar. Die Abdichtung zwischen dem Ultraschallwandler und dem Messwertgeber kann mittels eines elastischen O-Ringes 32 erfolgen.In FIG. 6, the converter housing 2 (FIG. 2) is made in two parts and consists of a ring part 29 with the recess 5 and a circular end plate 30. The ring part 29 and the end plate 30 have the same boundary 10 as a connecting flange 31 of the transmitter. The ring part 29 and the end plate 30 can be screwed together to form the converter housing 2 and can be connected as a whole to the connecting flange 31. The sealing between the ultrasonic transducer and the transmitter can be done by means of an elastic O-ring 32.

Zum Ausrichten der Leiterplatte 3 mit der Piëzoscheibe 1 auf die gemeinsame Symmetrieachse 33 des Wandlergehäuses 2 und eines Messrohrs 34 im Messwertgeber, weist die Abschlussplatte 30 auf der dem Ringteil 29 zugewandten Oberfläche senkrecht auf ihr stehende, an vorbestimmten Stellen angeordnete Stifte 35 auf, die sowohl in die Oesen 25 (Figur 5) der mit dem Substrat 17 (Figur 4) flach auf die Abschlussplatte 30 gelegten Leiterplatte 3 eingreifen als auch in Zentrierlöcher 36 des Ringteils 29.To align the printed circuit board 3 with the Piëzo disk 1 on the common axis of symmetry 33 of the converter housing 2 and a measuring tube 34 in the transmitter, the end plate 30 on the surface facing the ring part 29 has pins 35 arranged vertically on it and arranged at predetermined locations, both engage in the eyelets 25 (FIG. 5) of the circuit board 3 laid flat on the end plate 30 with the substrate 17 (FIG. 4) and also in centering holes 36 in the ring part 29.

Damit die Ultraschallwandler genau und reproduzierbar auf die Symmetrieachse 33 ausrichtbar sind, ragen die Stifte 35 mit Vorteil über den aufgesetzten Ringteil 29 hinaus und sind in die ausserhalb des Bereichs für den O-Ring 32 gelegenen Zentrierlöcher 36' des Anschlussflanschs 31 steckbar.So that the ultrasonic transducers can be aligned precisely and reproducibly on the axis of symmetry 33, the pins 35 advantageously protrude beyond the attached ring part 29 and can be plugged into the centering holes 36 ′ of the connecting flange 31 located outside the area for the O-ring 32.

Die Ausnehmung 5 im Ringteil 29 ist auf der dem Messwertgeber zugewandten Seite mit der Membran 14 gegen das Medium 15 abgedichtet. Beispielsweise ist die Stahlfolie als Membran 14 direkt mit dem Ringteil 29 verschweissbar. Die Höhe des Ringteils 29 ist derart bemessen, dass die Piëzoscheibe 1 den auf die Anschlussplatte 30 aufgesetzten Ringteil 29 einige Zehntelmillimeter überragt, so dass die Membran 14 die Piëzoscheibe 1 gegen die Anschlussplatte 30 presst. Die Klebfolie 16 zwischen der Piëzoscheibe 1 und der Membran 14 vermittelt die für die Ultraschall-Ankopplung der Piëzoscheibe 1 an die Membran 14 bzw. das Medium 15 notwendige Verbindung.The recess 5 in the ring part 29 is sealed on the side facing the transducer with the membrane 14 against the medium 15. For example, the steel foil as membrane 14 can be welded directly to the ring part 29. The height of the ring part 29 is dimensioned such that the Piëzo disc 1 projects a few tenths of a millimeter beyond the ring part 29 placed on the connection plate 30, so that the membrane 14 presses the Piëzo disc 1 against the connection plate 30. The adhesive film 16 between the Piëzo disc 1 and the membrane 14 conveys the connection necessary for the ultrasound coupling of the Piëzo disc 1 to the membrane 14 or the medium 15.

Anstelle einer dünnen flexiblen Leiterplatte 3 kann in dieser Ausführung auch eine etwas dickere Leiterplattenqualität verwendet werden.Instead of a thin flexible printed circuit board 3, a somewhat thicker printed circuit board quality can also be used in this embodiment.

Die Anschlüsse 4, 4' (Figur 5) der Ultraschallwandler sind über eine abgeschirmte Leitung an ein Elektronikgerät 37 für das Senden und Empfangen von Ultraschallwellensignalen anschliessbar. Das Wandlergehäuse 2 weist vorzugsweise eine Klampe zum Festklemmen der abgeschirmten Leitung auf, die als Zugentlastung der Anschlüsse 4, 4' dient.The connections 4, 4 '(FIG. 5) of the ultrasound transducers can be connected via a shielded line to an electronic device 37 for the transmission and reception of ultrasound wave signals. The converter housing 2 preferably has a cleat for clamping the shielded line, which as Strain relief of the connections 4, 4 'is used.

In der Figur 7 ist das Substrat 17 (Figur 4) mit der Membran 14 verbunden, beispielsweise mit der Klebfolie 16 (Figur 6). Die Stirnfläche mit der grossen Elektrode 20 (Figur 4) ist mittels der Membran 14 gegen den Boden 12 gepresst. Ein Kissen 38 aus Kunststoff ist zwischen der Piëzoscheibe 1 und dem Boden 12 angeordnet, um die Piëzoscheibe 1 akustisch gegen den Boden 12 zu entkoppeln und die grosse Elektrode 20 elektrisch gegen das Wandlergehäuse 2 zu isolieren. Der Empfang und das Abstrahlen von Ultraschall erfolgt auf der Seite der Zentralelektrode 19 (Figur 4) durch die Leiterplatte 3 und die Membran 14 hindurch.In FIG. 7, the substrate 17 (FIG. 4) is connected to the membrane 14, for example to the adhesive film 16 (FIG. 6). The end face with the large electrode 20 (FIG. 4) is pressed against the bottom 12 by means of the membrane 14. A cushion 38 made of plastic is arranged between the Piëzo disc 1 and the base 12 in order to acoustically decouple the Piëzo disc 1 from the base 12 and to electrically isolate the large electrode 20 from the transducer housing 2. Ultrasound is received and emitted on the side of the central electrode 19 (FIG. 4) through the printed circuit board 3 and the membrane 14.

Die Zentrierung der Piëzoscheibe 1 auf die Symmetrieachse 33 des Wandlergehäuses 2 kann mittels Laschen 11 (Figur 2) oder mittels der Stiften 35 (Figur 6) und Oesen 25 (Figur 5) oder einer Kombination beider Massnahmen erfolgen.The centering of the Piëzo disc 1 on the axis of symmetry 33 of the converter housing 2 can be carried out by means of tabs 11 (FIG. 2) or by means of the pins 35 (FIG. 6) and eyelets 25 (FIG. 5) or a combination of both measures.

Die Ultraschallwandler weisen den Vorteil auf, dass sich die Piëzoscheibe 1 mit der ganzen Fläche der hinteren Stirnseite über die Auflage 13 (Figur 5) bzw. das Kissen 38 gegen den Boden 12 der Ausnehmung 5 bzw. gegen die Abschlussplatte 30 (Figur 6) abstützt, so dass die Druckfestigkeit der Ultraschallwandler bei minimaler Bauhöhe erhöht wird.The ultrasound transducers have the advantage that the entire area of the rear end face of the pezzo disk 1 is supported by the support 13 (FIG. 5) or the cushion 38 against the bottom 12 of the recess 5 or against the end plate 30 (FIG. 6) , so that the pressure resistance of the ultrasonic transducers is increased with a minimal overall height.

Die Ultraschallwandler sind mittels der in der Figur 6 gezeigten Zentrierung des Wandlergehäuses 2 mittels der Stiften 35 und der Zentrierlöcher 36 reproduzierbar aufsetzbar, so dass auch nach Unterhaltsarbeiten eine genaue Ausrichtung gewährleistet ist.The ultrasonic transducers can be placed reproducibly by means of the centering of the transducer housing 2 shown in FIG. 6 by means of the pins 35 and the centering holes 36, so that an exact alignment is ensured even after maintenance work.

Die in den Figuren gezeigten Ausführungen der Ultraschallwandler weisen eine Rotationssymmetrie zur Symmetrieachse 33 auf. Solche Ultraschallwandler eignen sich für die optimale Durchschallung von Messrohren 34 mit einem kreisförmigen Querschnitt. Anstelle der kreisförmiger Berandungen sind auch Teile mit andern Berandungsformen verwendbar. Bei einem quadratischen Querschnitt des Messrohrs 34 weist der Ultraschallwandler vorzugsweise quadratische Formen für die Piëzoscheibe 1, die Auflage 13, die Elektroden 19, 20, 23, 24 usw. auf.The designs of the ultrasonic transducers shown in the figures have rotational symmetry with respect to the axis of symmetry 33. Such ultrasonic transducers are suitable for the optimal transmission of measuring tubes 34 with a circular cross section. Instead of the circular borders, parts with other border shapes can also be used. With a square cross section of the measuring tube 34, the ultrasound transducer preferably has square shapes for the Piëzo disc 1, the support 13, the Electrodes 19, 20, 23, 24, etc.

Die Berandung 10 des Wandlergehäuses 2, der Ausnehmung 5 usw. ist unabhängig von der Querschnittsform des Messrohres 34 wählbar.The boundary 10 of the transducer housing 2, the recess 5, etc. can be selected independently of the cross-sectional shape of the measuring tube 34.

Der beschriebene Wandler kann auch zur Messung physikalischer Grössen wie Kraft, Temperatur, Druck, Schwingungsfrequenz und dergleichen verwendet werden, wenn die Piëzoscheibe durch einen entsprechenden Sensor ersetzt wird.The transducer described can also be used to measure physical quantities such as force, temperature, pressure, oscillation frequency and the like if the Piëzo disk is replaced by an appropriate sensor.

Claims (10)

Ultraschallwandler mit einer in einem Wandlergehäuse (2) angeordneten, zwei Elektroden (19; 20; 23; 24) aufweisenden Piëzoscheibe (1) zum Abstrahlen und Empfangen von Ultraschallwellen durch eine Membran (14) hindurch, die die Piëzoscheibe (1) von einem strömenden Medium (15) trennt,
dadurch gekennzeichnet,
dass beide Elektroden (19; 20, 23, 24) der Piëzoscheibe (1) fest mit Leiterbahnen (8; 9) einer Leiterplatte (3) verbunden sind und dass die Leiterplatte (3) Mittel (11; 25; 26) zum gemeinsamen Ausrichten der Leiterplatte (3) und der Piëzoscheibe (1) in einer Ausnehmung (5) des Wandlergehäuses (2) aufweist.Ultrasonic transducer with a Piëzo disc (1) arranged in a transducer housing (2) and having two electrodes (19; 20; 23; 24) for radiating and receiving ultrasonic waves through a membrane (14) which separates the Piëzo disc (1) from a flowing one Separates medium (15),
characterized,
that both electrodes (19; 20, 23, 24) of the Piëzo disc (1) are firmly connected to conductor tracks (8; 9) of a circuit board (3) and that the circuit board (3) has means (11; 25; 26) for aligning them together the circuit board (3) and the Piëzo disc (1) in a recess (5) of the converter housing (2). Ultraschallwandler nach Anspruch 1, dadurch gekennzeichnet, dass die Leiterplatte (3) flexibel ist, dass zwischen der Piëzoscheibe (1) und dem Boden (12) der Ausnehmung (5) eine Auflage (13; 38) angeordnet ist und dass die Tiefe der Ausnehmung (5) so bemessen ist, dass unter Druck der Membran (14) die Piëzoscheibe (1) mit der Auflage (13; 38) auf dem Boden (12) aufliegt.Ultrasonic transducer according to claim 1, characterized in that the circuit board (3) is flexible, that a support (13; 38) is arranged between the Piëzo plate (1) and the bottom (12) of the recess (5) and that the depth of the recess (5) is dimensioned such that, under pressure from the membrane (14), the Piëzo disc (1) rests on the floor (12) with the support (13; 38). Ultraschallwandler nach Anspruch 2, dadurch gekennzeichnet, dass die Mittel zum Ausrichten der mit der Piëzoscheibe (1) bestückten Leiterplatte (3) in der Ausnehmung (5) federnde Laschen (11) der Leiterplatte (3) sind, die sich gegen die Seitenwand der Ausnehmung (5) abstützen.Ultrasonic transducer according to claim 2, characterized in that the means for aligning the printed circuit board (3) equipped with the Piëzo disc (1) in the recess (5) are resilient tabs (11) of the printed circuit board (3) which are against the side wall of the recess (5) support. Ultraschallwandler nach Anspruch 1, dadurch gekennzeichnet, dass die Piëzoscheibe (1), die Seitenwand der Ausnehmung (5) im Wandlergehäuse (2) und die Elektroden (19; 20, 23, 24) Rotationssymmetrie mit einer gemeinsamen Symmetrieachse (33) aufweisen.Ultrasonic transducer according to claim 1, characterized in that the Piëzo disc (1), the side wall of the recess (5) in the transducer housing (2) and the electrodes (19; 20, 23, 24) have rotational symmetry with a common axis of symmetry (33). Ultraschallwandler nach Anspruch 1, dadurch gekennzeichnet, dass die Membran (14) vollflächig mittels einer beidseitig haftenden Klebfolie (16) mit der einen Stirnfläche der Piëzoscheibe (1) verbunden ist.Ultrasonic transducer according to claim 1, characterized in that the membrane (14) over the entire surface by means of an adhesive film (16) adhering to both sides with one end face of the Piëzo disc (1) is connected. Ultraschallwandler nach Anspruch 1 oder 5, dadurch gekennzeichnet, dass die Membran (14) eine dünne Stahlfolie ist.Ultrasonic transducer according to claim 1 or 5, characterized in that the membrane (14) is a thin steel foil. Ultraschallwandler nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Leiterplatte (3) einen ausserhalb des Wandlergehäuses (2) liegenden Anschlussteil mit Anschlüssen (4, 4') aufweist und dass die Anschlüsse (4, 4') über die Leiterbahnen (8; 9) mit den Elektroden (19; 20, 23, 24) elektrisch verbunden sind.Ultrasonic transducer according to claim 1 or 2, characterized in that the printed circuit board (3) has a connection part with connections (4, 4 ') lying outside the converter housing (2) and that the connections (4, 4') via the conductor tracks (8; 9) are electrically connected to the electrodes (19; 20, 23, 24). Ultraschallwandler nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Mittel zum Ausrichten der mit der Piëzoscheibe (1) bestückten Leiterplatte (3) in der Ausnehmung (5) in die Leiterplatte (3) gestanzte Oesen (25; 26) und senkrecht im Wandlergehäuse (2) angeordnete Stifte (35) umfassen, die in die Oesen (25; 26) eingreifen.Ultrasonic transducer according to claim 1 or 2, characterized in that the means for aligning the printed circuit board (3) equipped with the Piëzo disc (1) in the recess (5) in the printed circuit board (3) punched eyelets (25; 26) and vertically in the transducer housing (2) arranged pins (35) which engage in the eyelets (25; 26). Ultraschallwandler nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Piëzoscheibe (1) mittels Löten direkt mit den Leiterbahnen (8; 9) der Leiterplatte (3) verbunden ist.Ultrasonic transducer according to claim 1 or 2, characterized in that the Piëzo disc (1) is connected directly to the conductor tracks (8; 9) of the printed circuit board (3) by means of soldering. Messwandler mit einem in einem Wandlergehäuse (2) angeordneten, Elektroden (19; 20; 23; 24) aufweisenden Sensor (1) zum Messen physikalischer Grössen durch eine Membran (14) hindurch, dadurch gekennzeichnet, dass die Elektroden (19; 20, 23, 24) des Sensors (1) fest mit Leiterbahnen (8; 9) einer Leiterplatte (3) verbunden sind und dass die Leiterplatte (3) Mittel (11; 25; 26) zum gemeinsamen Ausrichten der Leiterplatte (3) und des Sensors (1) in einer Ausnehmung (5) des Wandlergehäuses (2) aufweist.Measuring transducer with a sensor (1) arranged in a transducer housing (2) and having electrodes (19; 20; 23; 24) for measuring physical quantities through a membrane (14), characterized in that the electrodes (19; 20, 23 , 24) of the sensor (1) are firmly connected to conductor tracks (8; 9) of a circuit board (3) and that the circuit board (3) has means (11; 25; 26) for aligning the circuit board (3) and the sensor ( 1) in a recess (5) of the converter housing (2).
EP19930120935 1993-02-04 1993-12-27 Transducer Expired - Lifetime EP0609561B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH33593 1993-02-04
CH335/93 1993-02-04

Publications (2)

Publication Number Publication Date
EP0609561A1 true EP0609561A1 (en) 1994-08-10
EP0609561B1 EP0609561B1 (en) 1996-09-04

Family

ID=4184675

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19930120935 Expired - Lifetime EP0609561B1 (en) 1993-02-04 1993-12-27 Transducer

Country Status (3)

Country Link
EP (1) EP0609561B1 (en)
DE (1) DE59303655D1 (en)
DK (1) DK0609561T3 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009019667A1 (en) * 2009-04-30 2010-11-04 Valeo Schalter Und Sensoren Gmbh Process for bonding piezoceramic components and adhesives for carrying out the method
CN107785479A (en) * 2016-08-31 2018-03-09 成都汇通西电电子有限公司 Ceramic chips electrically connected method and sensor manufacturing process
TWI680232B (en) * 2018-08-13 2019-12-21 科際精密股份有限公司 Fluid driving device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10026568C2 (en) * 2000-05-30 2002-11-21 Siemens Ag Connector for an ultrasonic transducer housing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2138036A (en) * 1932-12-24 1938-11-29 Submarine Signal Co Compressional wave sender or receiver
DE2934031B1 (en) * 1979-08-02 1980-10-09 Landis & Gyr Ag Ultrasonic transducer
US4417170A (en) * 1981-11-23 1983-11-22 Imperial Clevite Inc. Flexible circuit interconnect for piezoelectric element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2138036A (en) * 1932-12-24 1938-11-29 Submarine Signal Co Compressional wave sender or receiver
DE2934031B1 (en) * 1979-08-02 1980-10-09 Landis & Gyr Ag Ultrasonic transducer
US4417170A (en) * 1981-11-23 1983-11-22 Imperial Clevite Inc. Flexible circuit interconnect for piezoelectric element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009019667A1 (en) * 2009-04-30 2010-11-04 Valeo Schalter Und Sensoren Gmbh Process for bonding piezoceramic components and adhesives for carrying out the method
CN107785479A (en) * 2016-08-31 2018-03-09 成都汇通西电电子有限公司 Ceramic chips electrically connected method and sensor manufacturing process
TWI680232B (en) * 2018-08-13 2019-12-21 科際精密股份有限公司 Fluid driving device
US11248597B2 (en) 2018-08-13 2022-02-15 Koge Micro Tech Co., Ltd. Fluid driving device
US11585337B2 (en) 2018-08-13 2023-02-21 Koge Micro Tech Co., Ltd. Fluid driving device

Also Published As

Publication number Publication date
DK0609561T3 (en) 1997-02-24
DE59303655D1 (en) 1996-10-10
EP0609561B1 (en) 1996-09-04

Similar Documents

Publication Publication Date Title
EP1744837B1 (en) Ultrasound transducer and method for producing the same
JP3939652B2 (en) Multidimensional ultrasonic transducer array
JP2545861B2 (en) Ultrasonic probe manufacturing method
DE69838473T2 (en) Device for transmitting biological signals
EP0069824B1 (en) Method of making contact with the adhesive side of an electrode of an electric device
DE102007049033A1 (en) Modular sensor assembly and method of manufacture
EP0189492B1 (en) Method for manufacturing a measuring transducer for measuring mechanical quantities
US20040048470A1 (en) Interconnection devices for ultrasonic matrix array transducers
DE102009000379A1 (en) Ultrasonic transducer for a proximity sensor
DE4303049C2 (en) Strain gauge and method for its attachment to a cylindrical component
EP2072150B1 (en) Ultrasonic transducer
EP0609561B1 (en) Transducer
EP0166180B1 (en) Hydrophone
JP3883823B2 (en) Matrix-type ultrasonic probe and manufacturing method thereof
DE10356737A1 (en) Electronic array and method of making the same
DE3149732C2 (en)
DE3019410A1 (en) Ultrasound transducer for medical diagnostics or material testing - has numerous transducing elements and contacting simplified by using metal coated plastics foil for contacting
DE2838288C3 (en) Piezoelectric transducer
DE102021118300A1 (en) Direct chip-to-array for multidimensional transducer array
EP3101441B1 (en) Ultrasound converter
EP0465878A2 (en) Piezoceramic ultrasonic transducer
DE3818191C2 (en)
DE102005001899B4 (en) ultrasound probe
DE102015223490A1 (en) An assembly comprising an electrical component mounted on a substrate and assembly methods
EP1238444A1 (en) Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): CH DE DK FR GB LI

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LANDIS & GYR TECHNOLOGY INNOVATION AG

17P Request for examination filed

Effective date: 19941026

17Q First examination report despatched

Effective date: 19950411

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE DK FR GB LI

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19960904

REF Corresponds to:

Ref document number: 59303655

Country of ref document: DE

Date of ref document: 19961010

ET Fr: translation filed
REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: PUE

Owner name: LANDIS & GYR TECHNOLOGY INNOVATION AG TRANSFER- SI

Ref country code: CH

Ref legal event code: NV

Representative=s name: SIEMENS SCHWEIZ AG

REG Reference to a national code

Ref country code: FR

Ref legal event code: TP

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20041228

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20051212

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20051219

Year of fee payment: 13

Ref country code: DK

Payment date: 20051219

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20051222

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051231

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070703

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20061227

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20070831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20061227

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070102

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070102